Electronic device

Abstract

An electronic device comprises a machine shell, a display panel, a metal frame body, a circuit board, a communication antenna and a metal shielding structure. The housing includes a first metal layer. The display panel is arranged on the machine shell and is opposite to the first metal layer. The display panel includes a second metal layer. The metal frame body is arranged in the machine shell and located between the first metal layer and the second metal layer. The circuit board is arranged on the metal frame body. The communication antenna is arranged in the machine shell and comprises an antenna body and a grounding structure electrically connected with the metal frame body. The metal shielding structure is connected between the first metal layer and the second metal layer and separates the antenna body and the circuit board of the communication antenna. The metal shielding structure is a structure formed by extending the edge of the metal frame body or a grounding structure of the communication antenna. The metal shielding structure, the first metal layer and the second metal layer can jointly generate an electromagnetic wave shielding effect, interference of high-frequency signals generated by electronic elements on the circuit board on the communication antenna is reduced, and the wireless communication quality of the electronic device is improved.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly to an electronic device with wireless communication capability. Background Art

[0002] In small electronic devices like tablets, where electronic components are densely packed together, the distance between them is small. In such cases, antennas are susceptible to interference from high-frequency electromagnetic waves generated by high-speed components on the motherboard, resulting in poor communication quality. Summary of the Invention

[0003] In view of this, an object of the present disclosure is to provide an electronic device capable of reducing high-frequency electromagnetic interference, thereby improving the wireless communication quality of the electronic device.

[0004] To achieve the above objectives, according to some embodiments of the present disclosure, an electronic device includes a casing, a display panel, a metal frame, a circuit board, a communication antenna and a metal shielding structure. The casing includes a first metal layer. The display panel is arranged on the casing and is opposite to the first metal layer. The display panel includes a second metal layer. The metal frame is arranged in the casing and is located between the first metal layer and the second metal layer. The circuit board is arranged on the metal frame. The communication antenna is arranged in the casing and includes an antenna body and a grounding structure electrically connected to the metal frame. The metal shielding structure is connected between the first metal layer and the second metal layer and separates the antenna body of the communication antenna and the circuit board. The metal shielding structure is a structure formed by extending the edge of the metal frame or the grounding structure of the communication antenna.

[0005] In one or more embodiments of the present disclosure, the metal frame includes a platform portion and a sidewall portion. The platform portion supports the circuit board and abuts the second metal layer. The sidewall portion connects to the outer edge of the platform portion and bends relative to the platform portion, with the distal end of the sidewall portion abutting the first metal layer. The sidewall portion serves as a metal shielding structure.

[0006] In one or more embodiments of the present disclosure, the ground structure of the communication antenna is connected to a surface of the sidewall portion away from the circuit board.

[0007] In one or more embodiments of the present disclosure, the sidewall portion of the metal frame surrounds the platform portion.

[0008] In one or more embodiments of the present disclosure, the metal frame is disposed on the second metal layer. The grounding structure includes a plate, which is disposed on the inner surface of the antenna body away from the housing, shielding the inner surface of the antenna body and abutting the first metal layer and the metal frame. The plate serves as a metal shielding structure.

[0009] In one or more embodiments of the present disclosure, the metal frame has a first edge facing the communication antenna, and in the direction in which the first edge extends, the width of the metal shielding structure and the width of the first metal layer are greater than or equal to the width of the antenna body of the communication antenna.

[0010] In one or more embodiments of the present disclosure, the display panel has a display area, and the second metal layer is disposed on a side of the display panel away from the display area.

[0011] In one or more embodiments of the present disclosure, the display panel includes a backlight module, and the second metal layer is a reflective sheet of the backlight module.

[0012] In one or more embodiments of the present disclosure, the housing includes a metal shell having an opening, the display panel is disposed in the opening, and the metal shell further includes a back plate portion opposite to the opening, the back plate portion serving as a first metal layer.

[0013] In one or more embodiments of the present disclosure, the housing further includes a non-metallic shell having an opening, wherein the display panel is disposed in the opening, and further includes a back plate portion opposite to the opening, wherein the first metal layer is attached to the back plate portion.

[0014] In summary, in the electronic device disclosed herein, a first metal layer is provided on the back side of the housing, a display panel provided on the front side of the housing includes a second metal layer, and the electronic device further includes a metal shielding structure, which is connected between the first metal layer and the second metal layer and separates the communication antenna and the circuit board of the electronic device. The metal shielding structure, the first metal layer and the second metal layer can jointly produce an electromagnetic wave shielding effect, reduce the interference of high-frequency signals generated by electronic components on the circuit board on the communication antenna, and improve the wireless communication quality of the electronic device. In addition, the metal shielding structure can be a structure formed by extending the edge of a metal frame for supporting the circuit board, or a structure formed by extending the grounding structure of the communication antenna. There is no need to add additional components. In addition to being able to control the production cost of the electronic device, it also has the advantages of simple structure and easy assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To make the above and other objects, features, advantages and embodiments of the present disclosure more apparent and understandable, the accompanying drawings are described as follows:

[0016] Figure 1 It is a schematic perspective view showing an electronic device according to one embodiment of the present disclosure.

[0017] Figure 2 To show Figure 1 The electronic device is shown as a schematic cross-sectional view at line segment 2 - 2 ′.

[0018] Figure 3 To show Figure 2 A schematic exploded view of some components of the electronic device is shown.

[0019] Figure 4 FIG. 1 is a schematic cross-sectional view showing an electronic device according to another embodiment of the present disclosure.

[0020] Figure 5 To show Figure 4 A schematic exploded view of some components of the electronic device is shown.

[0021] Figure 6 FIG. 1 is a schematic cross-sectional view showing an electronic device according to another embodiment of the present disclosure.

[0022] Figure 7 To show Figure 6 A schematic exploded view of some components of the electronic device is shown.

[0023] Figure 8 FIG. 1 is a schematic cross-sectional view showing an electronic device according to another embodiment of the present disclosure.

[0024] Figure 9 FIG. 1 is a schematic cross-sectional view showing an electronic device according to another embodiment of the present disclosure.

[0025] Explanation of symbols

[0026] 12, 12A, 12B, 12C, 12D: Electronic devices

[0027] 13: Display panel

[0028] 14: Display area

[0029] 15: Second metal layer

[0030] 17: Electronic components

[0031] 19: Circuit Board

[0032] 20,20C: Chassis

[0033] 21,21C: Shell

[0034] 23: Opening

[0035] 24: Antenna opening

[0036] 25,25C: back panel

[0037] 26,26C: First metal layer

[0038] 30,30A,30B: Metal frame

[0039] 31: Platform Department

[0040] 32: Bearing surface

[0041] 34: Edge

[0042] 35,35A: Side wall

[0043] 36: The End

[0044] 37: Side

[0045] 50,50B: Communication antenna

[0046] 52: Inner surface

[0047] 53: Antenna body

[0048] 54: Plate body

[0049] 56,56B: Grounding structure

[0050] 57: Side

[0051] 58: First extension

[0052] 59: Second extension

[0053] 60, 60A, 60B: Metal shielding structure

[0054] 65: Conductive connector

[0055] D: Direction

[0056] H1, H4: Height

[0057] W1, W2, W3, W4: width DETAILED DESCRIPTION

[0058] For a more detailed and complete description of the present disclosure, reference is made to the accompanying drawings and the various embodiments described below. The elements in the drawings are not drawn to scale and are provided solely for the purpose of illustrating the present disclosure. Numerous practical details are described below to provide a comprehensive understanding of the present disclosure. However, those skilled in the relevant art will appreciate that the present disclosure may be practiced without one or more of these practical details, and therefore, these details should not be construed as limiting the present disclosure.

[0059] Please refer to Figure 1 . Figure 1The present invention is a schematic three-dimensional diagram of an electronic device 12 according to an embodiment of the present disclosure. The electronic device 12 includes a housing 20 and a display panel 13 provided on the housing 20. The housing 20 includes a shell 21, the shell 21 has an opening 23, the display panel 13 is provided in the opening 23, and is exposed to the outside of the housing 20 through the opening 23. The display panel 13 has a display area 14, and the display area 14 faces the outside of the housing 20. The display panel 13 can be a liquid crystal display panel (LCD) or other types of panels, such as an organic light emitting diode (OLED) display panel. The electronic device 12 is, for example, a tablet computer, but is not limited to a tablet computer, and can also be other types of devices such as a smartphone.

[0060] Please refer to Figure 2 as well as Figure 3 . Figure 2 To show Figure 1 The electronic device 12 is shown as a schematic cross-sectional view at the line segment 2 - 2 ′. Figure 3 To show Figure 2 A schematic exploded view of some components of the electronic device 12 is shown. As shown, the housing 20 further includes a first metal layer 26, which is opposite the display panel 13. In other words, the first metal layer 26 and the display panel 13 are located on opposite sides of the housing 20. In this embodiment, the housing 21 is a non-metallic housing (for example, the housing 21 may include a plastic material) and includes a back panel 25 opposite the opening 23. The first metal layer 26 is located on the inner side of the back panel 25 and is attached to the back panel 25.

[0061] In some embodiments, the first metal layer 26 may include aluminum foil or other metal sheets, which are fixed to the back plate portion 25 by gluing or other suitable means. In some embodiments, the first metal layer 26 may be an electroplated metal layer on the surface of the back plate portion 25.

[0062] like Figure 2 and Figure 3 As shown, the display panel 13 includes a second metal layer 15. The second metal layer 15 is disposed on the back side of the display panel 13, that is, the side of the display panel 13 away from the display area 14. In some embodiments, the display panel 13 includes a backlight module (for example, a liquid crystal display panel), and the second metal layer 15 serves as a reflective sheet for the backlight module. In some embodiments, the second metal layer 15 is a metal sheet attached to the back side of the display panel 13 to serve as a reinforcement structure.

[0063] like Figure 2 and Figure 3As shown, the electronic device 12 further includes a metal frame 30 and a circuit board 19. The metal frame 30 is disposed within the housing 20 and between the first metal layer 26 and the second metal layer 15. The circuit board 19 is disposed within the housing 20 and on the metal frame 30. The metal frame 30 is used to support the circuit board 19. The circuit board 19 is, for example, the mainboard of the electronic device 12. At least one electronic component 17 is disposed on the circuit board 19. In some embodiments, the metal frame 30 may comprise an aluminum alloy, an aluminum-magnesium alloy, or other suitable metal material.

[0064] like Figure 2 and Figure 3 As shown, the electronic device 12 further includes at least one communication antenna 50, which is disposed within the housing 20 and on a side of the metal frame 30. The communication antenna 50 is, for example, a Wi-Fi antenna. The communication antenna 50 includes an antenna body 53 and a grounding structure 56. The antenna body 53 is located on the inner side of the housing 21 and can be positioned against or proximate to the housing 21. The grounding structure 56 electrically connects the antenna body 53 and the metal frame 30. The grounding structure 56 can be made of a metal material.

[0065] like Figure 2 and Figure 3 As shown, the electronic device 12 further includes a metal shielding structure 60, which is connected between the first metal layer 26 and the second metal layer 15 and separates the antenna body 53 of the communication antenna 50 from the circuit board 19. Through this configuration, the metal shielding structure 60, the first metal layer 26, and the second metal layer 15 can jointly produce an electromagnetic wave shielding effect, reducing interference with the communication antenna 50 from high-frequency signals generated by the electronic components 17 on the circuit board 19, thereby improving the wireless communication quality of the electronic device 12.

[0066] like Figure 2 and Figure 3 As shown, in this embodiment, the metal shielding structure 60 is formed by extending the edge of the metal frame 30 and is integrally formed with the metal frame 30. This approach is characterized by forming the shielding structure by modifying the structure of existing components in the electronic device 12 without adding additional components. In addition to reducing the production cost of the electronic device 12, it also has the advantages of simple structure and easy assembly.

[0067] like Figure 2 and Figure 3As shown, in some embodiments, the metal frame 30 includes a platform portion 31 and a sidewall portion 35. The platform portion 31 supports the circuit board 19 and abuts the second metal layer 15. The sidewall portion 35 connects to the outer edge of the platform portion 31 and is bent relative to the platform portion 31 (for example, the sidewall portion 35 may extend substantially perpendicular to the platform portion 31). The end 36 of the sidewall portion 35 abuts the first metal layer 26. In the above embodiment, the sidewall portion 35 serves as a metal shielding structure 60.

[0068] like Figure 2 and Figure 3 As shown, the bottom surface of the metal frame 30 can abut the second metal layer 15 of the display panel 13 in its entirety or partially. In some embodiments, the grounding structure 56 of the communication antenna 50 is connected to the surface of the side wall portion 35 away from the circuit board 19.

[0069] It should be noted that the metal frame 30 (or metal shielding structure 60) can directly contact the first metal layer 26 and the second metal layer 15, or the metal frame 30 (or metal shielding structure 60) can be indirectly electrically coupled to the first metal layer 26 and the second metal layer 15 via a conductive adhesive, a conductive gasket, or other suitable conductive elements. Similarly, the grounding structure 56 of the communication antenna 50 can directly contact the metal frame 30, or can be electrically coupled to the metal frame 30 via a conductive adhesive, a conductive gasket, or other suitable conductive elements.

[0070] like Figure 2 and Figure 3 As shown, in some embodiments, one edge 34 of the metal frame 30 faces the communication antenna 50. In the direction D in which the edge 34 extends, the width W1 of the metal shielding structure 60 (i.e., the width of the sidewall portion 35) and the width W2 of the first metal layer 26 are greater than the width W4 of the antenna body 53 of the communication antenna 50. In some embodiments, the width W3 of the second metal layer 15 is also greater than the width W4 of the antenna body 53 of the communication antenna 50. When the above components are assembled, in the direction D in which the edge 34 extends, the side 37 of the metal shielding structure 60 (i.e., the sidewall portion 35) extends beyond the side 57 of the antenna body 53 (as shown by the dotted line). Similarly, the side edges of the first metal layer 26 and the side edges of the second metal layer 15 also extend beyond the side 57 of the antenna body 53. Through the above configuration, high-frequency signal interference can be effectively reduced.

[0071] In some embodiments, widths W1, W2, and W3 may be equal to width W4. When the above components are assembled, along the direction D in which edge 34 extends, side edges 37 of metal shielding structure 60 (i.e., sidewall portion 35) are aligned with side edges 57 of antenna body 53. Similarly, side edges of first metal layer 26 and second metal layer 15 are also aligned with side edges 57 of antenna body 53.

[0072] Please refer to Figure 4 as well as Figure 5 . Figure 4 FIG. 1 is a schematic cross-sectional view showing an electronic device 12A according to another embodiment of the present disclosure. Figure 5 To show Figure 4 A schematic exploded view of some components of the electronic device 12A is shown. This embodiment differs from the previous embodiment in that the sidewall portion 35A of the metal frame 30A (i.e., the metal shielding structure 60A) surrounds the platform portion 31. The circuit board 19 disposed on the platform portion 31 is thus surrounded by the sidewall portion 35A. The configuration of the annular sidewall portion 35A achieves a better shielding effect, shielding the high-frequency signals generated by the electronic components 17 on the circuit board 19 from all directions, significantly reducing noise interference to the communication antenna 50.

[0073] like Figure 4 and Figure 5 As shown, in some embodiments, the electronic device 12A may include two communication antennas 50, which are disposed on different sides of the electronic device 12A. The annular sidewall portion 35A can separate the two communication antennas 50 from the circuit board 19 (the communication antennas 50 are isolated in the gap between the sidewall portion 35A and the housing 21), while also shielding the two communication antennas 50 from high-frequency signals generated by the electronic components 17 on the circuit board 19. The electronic device 12A may also include more than two communication antennas 50, disposed on two or more different sides of the electronic device 12A.

[0074] Please refer to Figure 6 as well as Figure 7 . Figure 6 FIG1 is a schematic cross-sectional view showing an electronic device 12B according to another embodiment of the present disclosure. Figure 7 To show Figure 6 A schematic exploded view of some components of the electronic device 12B shown. The difference between this embodiment and the aforementioned embodiment is that the metal shielding structure 60B is a structure formed by extending the grounding structure 56B of the communication antenna 50B. Specifically, in this embodiment, the metal frame 30B is arranged on the second metal layer 15 and abuts the second metal layer 15. The metal frame 30B lacks a side wall portion compared to the aforementioned metal frames 30 and 30A. The grounding structure 56B of the communication antenna 50B includes a plate 54, which is arranged on the inner surface 52 of the antenna body 53 away from the housing 20 and shields the inner surface 52 of the antenna body 53. The two sides of the plate 54 abut the first metal layer 26 and the metal frame 30B respectively, thereby separating the antenna body 53 and the circuit board 19 of the communication antenna 50B. In this embodiment, the plate 54 serves as the metal shielding structure 60B.

[0075] Like the aforementioned embodiment, this embodiment also forms a shielding structure by changing the structure of existing components in the electronic device 12B without adding additional components. In addition to controlling the production cost of the electronic device 12B, it also has the advantages of simple structure and easy assembly.

[0076] like Figure 6 and Figure 7 As shown, in some embodiments, the plate 54 abuts the bearing surface 32 of the metal frame 30B (i.e., the surface of the metal frame 30B on which the circuit board 19 is disposed). In other embodiments, the plate 54 may also abut the side surface of the metal frame 30B or the second metal layer 15.

[0077] like Figure 6 and Figure 7 As shown, in some embodiments, the ground structure 56B further includes a first extension portion 58 and a second extension portion 59. The first extension portion 58 and the second extension portion 59 are connected to the plate 54 and extend laterally from the edge of the plate 54. The first extension portion 58 and the second extension portion 59 can abut the first metal layer 26 and the metal frame 30B, respectively. The first extension portion 58 and the second extension portion 59 ensure good electrical conductivity between the ground structure 56B and the first metal layer 26 and the metal frame 30B, and also facilitate securing the ground structure 56B to the first metal layer 26 and the metal frame 30B.

[0078] like Figure 6 and Figure 7 As shown, in some embodiments, in the direction D in which the edge 34 of the metal frame 30B extends, the width W1 of the metal shielding structure 60B and the width W2 of the first metal layer 26 are greater than or equal to the width W4 of the antenna body 53 of the communication antenna 50B. In some embodiments, the width W3 of the second metal layer 15 is also greater than or equal to the width W4 of the antenna body 53 of the communication antenna 50B. In some embodiments, the height H1 of the metal shielding structure 60B is greater than or equal to the height H4 of the antenna body 53. In some embodiments, the metal shielding structure 60B completely covers the inner surface 52 of the antenna body 53.

[0079] Please refer to Figure 8 . Figure 8Schematic cross-sectional view of an electronic device 12C according to another embodiment of the present disclosure is shown. The difference between this embodiment and the aforementioned embodiment is that the shell 21C of the housing 20C is a metal shell, and the housing 21C includes a back panel portion 25C opposite to the opening 23 (i.e., the opening 23 where the display panel 13 is provided), and the back panel portion 25C serves as a first metal layer 26C. In addition, because the housing 21C is a metal shell, the housing 21C also has an antenna opening 24 facing the communication antenna 50, so as to facilitate the communication antenna 50 to transmit and receive signals. In some embodiments, the housing 20C further includes a plastic part 29, and the plastic part 29 covers the antenna opening 24. In some embodiments, the plastic part 29 and the housing 21C can be made by embedded injection molding.

[0080] Please refer to Figure 9 . Figure 9 This is a schematic cross-sectional view showing an electronic device 12D according to another embodiment of the present disclosure. Figure 2 The difference between the illustrated embodiments is that the electronic device 12D further includes a conductive connector 65. The conductive connector 65 can be disposed at a first position and / or a second position, wherein the first position is between the end 36 of the sidewall portion 35 of the metal frame 30 and the first metal layer 26, and the second position is between the metal frame 30 and the second metal layer 15. In addition, a conductive connector (not shown) can also be disposed between the ground structure 56 of the communication antenna 50 and the metal frame 30. The conductive connector 65 can include a conductive adhesive or a conductive gasket. The provision of the conductive connector 65 ensures good conductivity between the various metal components, thereby achieving an ideal shielding effect.

[0081] In summary, in the electronic device disclosed herein, a first metal layer is provided on the back side of the housing, a display panel provided on the front side of the housing includes a second metal layer, and the electronic device further includes a metal shielding structure, which is connected between the first metal layer and the second metal layer and separates the communication antenna and the circuit board of the electronic device. The metal shielding structure, the first metal layer and the second metal layer can jointly produce an electromagnetic wave shielding effect, reduce the interference of high-frequency signals generated by electronic components on the circuit board on the communication antenna, and improve the wireless communication quality of the electronic device. In addition, the metal shielding structure can be a structure formed by extending the edge of a metal frame for supporting the circuit board, or a structure formed by extending the grounding structure of the communication antenna. There is no need to add additional components. In addition to being able to control the production cost of the electronic device, it also has the advantages of simple structure and easy assembly.

[0082] Although the present disclosure has been disclosed in the form of embodiments as described above, it is not intended to limit the present disclosure. Those skilled in the art may make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the claims.

Claims

1. An electronic device, characterized in that: Include: A housing comprising a first metal layer; a display panel disposed on the housing and opposite to the first metal layer, wherein the display panel includes a second metal layer; a metal frame disposed in the housing and located between the first metal layer and the second metal layer; a circuit board, disposed on the metal frame; a communication antenna disposed in the housing and comprising an antenna body and a grounding structure electrically connected to the metal frame; and A metal shielding structure is connected between the first metal layer and the second metal layer and separates the antenna body of the communication antenna and the circuit board, wherein the metal shielding structure is a structure formed by extending the edge of the metal frame or the grounding structure of the communication antenna.

2. The electronic device according to claim 1, wherein The metal frame includes a platform portion and a side wall portion, the platform portion supports the circuit board and abuts the second metal layer, the side wall portion is connected to an outer edge of the platform portion and is bent relative to the platform portion, and an end of the side wall portion abuts the first metal layer, wherein the side wall portion serves as the metal shielding structure.

3. The electronic device according to claim 2, wherein: The grounding structure of the communication antenna is connected to a surface of the side wall portion away from the circuit board.

4. The electronic device according to claim 2, wherein: The side wall portion of the metal frame surrounds the platform portion.

5. The electronic device according to claim 1, wherein: The metal frame is arranged on the second metal layer, and the grounding structure includes a plate, which is arranged on an inner surface of the antenna body away from the casing and shields the inner surface of the antenna body, and the plate abuts the first metal layer and the metal frame, wherein the plate serves as the metal shielding structure.

6. The electronic device according to claim 1, wherein: The metal frame has a first edge facing the communication antenna. In a direction in which the first edge extends, the width of the metal shielding structure and the width of the first metal layer are greater than or equal to the width of the antenna body of the communication antenna.

7. The electronic device according to claim 1, wherein: The display panel has a display area, and the second metal layer is arranged on a side of the display panel away from the display area.

8. The electronic device according to claim 7, wherein: The display panel includes a backlight module, and the second metal layer is a reflective sheet of the backlight module.

9. The electronic device according to claim 1, wherein: The housing includes a metal shell having an opening. The display panel is arranged in the opening. The metal shell further includes a back plate portion opposite to the opening. The back plate portion serves as the first metal layer.

10. The electronic device according to claim 1, wherein: The housing further comprises a non-metallic shell having an opening, wherein the display panel is arranged in the opening, wherein the non-metallic shell further comprises a back plate portion opposite to the opening, and the first metal layer is attached to the back plate portion.

Images