Exhaust gas treatment device and exhaust gas treatment method

By heating the liquid through the torch part and forming a liquid film in the gas treatment reactor, the problems of circulating water corrosion and low reaction efficiency of new water are solved, and the effects of preventing corrosion and improving reaction efficiency are achieved.

CN120662091APending Publication Date: 2025-09-19EBARA CORP
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Patent Information

Application Number
CN202510311017.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-03-19
Filing Date
2025-03-17
Publication Date
2025-09-19

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Abstract

Provided are an exhaust gas treatment device and an exhaust gas treatment method capable of preventing corrosion of a gas treatment reactor and improving reaction efficiency with a treated gas. The exhaust gas treatment device is provided with a liquid supply line that supplies the liquid to the torch unit and then supplies the liquid heated by the torch unit to the gas treatment reactor.
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Description

Technical Field

[0001] The invention relates to a waste gas treatment device and a waste gas treatment method. Background Art

[0002] There is a harmless treatment device (an example of an exhaust gas treatment device) for treating gases. Known methods for treating gases include wet treatment, which removes foreign matter and water-soluble components by contacting the treated gas with a liquid, and combustion treatment, which burns the treated gas.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2008-161861

[0006] Technical problem to be solved by the invention

[0007] When the process gas undergoes thermal decomposition at high temperatures, it is necessary to react the decomposed process gas with a substance to prevent recombination. Water decomposes to produce hydrogen and oxygen atoms, and the decomposed process gas reacts with these atoms. Therefore, water is a suitable substance for reacting with the decomposed process gas. In particular, vaporized water (i.e., water vapor) can react with the process gas using less energy than liquid water.

[0008] As water for reacting with the thermally decomposed treated gas, a method of using water that circulates between a water tank and a gas treatment reactor can be considered. However, if such circulating water is used, the reaction products of the treated gas contained in the circulating water gradually concentrate, and as a result, there is a concern that the acid in the reaction products may cause corrosion in the gas treatment reactor.

[0009] On the other hand, a method of using new water (ie, water supplied from a water supply source) instead of circulating water can be considered. However, if new water with a low temperature is used, there is a concern that the reaction efficiency with the treatment gas may be reduced. Summary of the Invention

[0010] Therefore, an object of the present invention is to provide an exhaust gas treatment device and an exhaust gas treatment method that can prevent corrosion of a gas treatment reactor and improve the reaction efficiency with a treatment gas.

[0011] Technical means for solving technical problems

[0012] In one embodiment, a waste gas treatment device is provided. The waste gas treatment device comprises: a torch portion that generates a high-temperature jet; a gas treatment reactor having a gas flow path through which a treated gas, thermally decomposed by the jet, flows; a liquid supply line that supplies liquid to the torch portion and then supplies the liquid heated by the torch portion to the gas treatment reactor; and a liquid supply source connected to the liquid supply line.

[0013] In one embodiment, the torch portion comprises: a cathode chamber in which a cathode is arranged; and an anode chamber in which an anode is arranged, and the liquid supply line comprises: a cathode side supply line in which the liquid is supplied to the cathode chamber; and an anode side supply line in which the liquid is supplied to the anode chamber.

[0014] In one embodiment, the liquid supply line includes a merging line connected to the cathode-side supply line and the anode-side supply line.

[0015] In one embodiment, at least one of the cathode-side supply line and the anode-side supply line is connected to the gas treatment reactor.

[0016] In one embodiment, the torch unit includes: a cathode chamber having a cathode disposed therein; and an anode chamber having an anode disposed therein, and the liquid supply line supplies the liquid to one of the cathode chamber and the anode chamber, and then supplies the liquid to the other of the cathode chamber and the anode chamber.

[0017] In one embodiment, the liquid supply line is configured to supply the liquid to an upper portion of the gas treatment reactor.

[0018] In one embodiment, the gas treatment reactor includes an inner cylindrical portion forming the gas flow path and an outer cylindrical portion surrounding the inner cylindrical portion, the inner cylindrical portion having an upper end serving as an overflow weir for the liquid supplied from the liquid supply line.

[0019] In one embodiment, the exhaust gas treatment device includes a gas-liquid separation tank connected to the liquid supply line, and the gas-liquid separation tank is arranged downstream of the torch portion in the flow direction of the liquid.

[0020] In one embodiment, the gas-liquid separation tank includes a gas introduction line connected to the outer cylinder at a position higher than the upper end, and a liquid introduction line connected to the outer cylinder at a position lower than the upper end.

[0021] In one embodiment, the inner cylinder has a flow path throttling portion that narrows the gas flow path.

[0022] In one embodiment, the exhaust gas treatment device includes a spray nozzle that sprays the liquid toward the gas flow path.

[0023] In one embodiment, the exhaust gas treatment device is an atmospheric pressure plasma exhaust gas treatment device, and the torch portion has a non-transferred plasma torch structure.

[0024] In one embodiment, a method for treating waste gas is provided. The method comprises supplying a liquid supplied from a liquid supply source to a torch portion that generates a high-temperature jet, and then supplying the liquid heated by the torch portion to a gas treatment reactor having a gas flow path through which a treated gas, thermally decomposed by the jet, flows.

[0025] In one embodiment, the liquid is supplied to a cathode chamber in which a cathode is arranged and an anode chamber in which an anode is arranged in the torch portion.

[0026] In one embodiment, the liquid is supplied to one of the cathode chamber and the anode chamber, and then the liquid is supplied to the other of the cathode chamber and the anode chamber.

[0027] In one embodiment, gas contained in the liquid after passing through the torch is separated and supplied to a position higher than the upper end of the inner cylinder forming the gas flow path of the gas treatment reactor, while the liquid is supplied to a position lower than the upper end.

[0028] Effects of the Invention

[0029] The liquid supply line is configured to supply liquid from a liquid supply source to the torch, and then supply the liquid heated by the torch to the gas treatment reactor. Therefore, the exhaust gas treatment device can prevent corrosion of the gas treatment reactor and improve the reaction efficiency with the treated gas.

[0030] The exhaust gas treatment device can particularly prevent the acid produced after the reaction of the treated gas from corroding the gas treatment reactor. In addition, the high reactivity of the heated liquid can improve the reaction efficiency with the treated gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a diagram showing one embodiment of an exhaust gas treatment device.

[0032] Figure 2 It is a diagram showing another embodiment of the liquid supply line.

[0033] Figure 3 It is a diagram showing another embodiment of the liquid supply line.

[0034] Figure 4 It is a diagram showing another embodiment of the liquid supply line.

[0035] Figure 5 It is a diagram showing another embodiment of the liquid supply line.

[0036] Figure 6 This is a diagram showing one embodiment of a gas-liquid separation tank.

[0037] Figure 7 Yes Figure 6 Diagram of the gas-liquid separation tank shown.

[0038] Figure 8 It is a diagram showing another embodiment of the gas treatment reactor.

[0039] Figure 9 This figure shows a spray nozzle that sprays liquid into a gas flow path.

[0040] Explanation of symbols

[0041] 1. Waste gas treatment device

[0042] 2 Torch Department

[0043] 3 Gas processing reactor

[0044] 4Liquid supply lines

[0045] 10 cathode

[0046] 11 Anode

[0047] 12 Plasma generation chamber

[0048] Next to 13A and 13B

[0049] 14 cathode chamber

[0050] 15 anode chamber

[0051] 20A cathode side supply line

[0052] 20B anode side supply line

[0053] 20C confluence line

[0054] 30 outer cylinder part

[0055] 30a communication port

[0056] 30a-1, 30a-2 communication ports

[0057] 30b connecting port

[0058] 31 inner cylinder part

[0059] 31a communication port

[0060] 32 Processing gas inlet

[0061] 35 Flow path throttling part

[0062] 40 Torch main body

[0063] 40a cathode housing portion

[0064] 40b anode receiving portion

[0065] 50 gas-liquid separation tank

[0066] 51 Box Department

[0067] 52A gas inlet line

[0068] 52B liquid introduction line

[0069] F liquid film

[0070] P plasma flow

[0071] GF gas flow path

[0072] GL gas-liquid interface

[0073] SP Gap

[0074] WS liquid supply source

[0075] TP upper end

[0076] SN spray nozzle. DETAILED DESCRIPTION

[0077] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the accompanying drawings described below, identical or equivalent components are denoted by the same reference numerals, and repeated descriptions thereof will be omitted. In the multiple embodiments described below, if the structure of one embodiment is identical to that of other embodiments, the repeated descriptions thereof will be omitted.

[0078] Figure 1 This figure shows one embodiment of an exhaust gas treatment device. For example, the exhaust gas treatment device 1 is configured to render the gas (treatment gas) from a vacuum pump harmless. In this case, a vacuum pump (not shown) is connected to the primary side (upstream side) of the exhaust gas treatment device 1.

[0079] In this embodiment, the exhaust gas treatment device 1 is an atmospheric pressure plasma type exhaust gas treatment device. Figure 1As shown, the exhaust gas treatment device 1 includes: a torch unit 2 that generates a high-temperature jet (more specifically, a plasma jet P); and a gas treatment reactor 3 that has a gas flow path GF for allowing the treatment gas thermally decomposed by the plasma jet P to flow.

[0080] The torch portion 2 includes a cathode 10 and an anode 11 facing each other, and a torch body 40 accommodating the cathode 10 and the anode 11. The torch portion 2 has a non-transferred plasma torch structure.

[0081] More specifically, the torch unit 2 has a structure for spraying plasma generated between the cathode 10 and the anode 11. Although not shown in the drawings, the exhaust gas treatment device 1 includes a power supply for applying a voltage between the cathode 10 and the anode 11.

[0082] The torch body 40 includes a cathode housing 40a for housing the cathode 10 and an anode housing 40b for housing the anode 11. The cathode housing 40a includes a space (cathode chamber) 14 for cooling the cathode 10. The cathode 10 is located in the cathode chamber 14. The anode housing 40b includes a space (anode chamber) 15 for cooling the anode 11. The anode 11 is located in the anode chamber 15.

[0083] The cathode housing portion 40a and the anode housing portion 40b are divided by partition walls 13A and 13B disposed between the cathode housing portion 40a and the anode housing portion 40b. The torch body 40 has a space (plasma generation chamber 12) surrounded by the partition walls 13A and 13B.

[0084] When plasma gas is supplied to the plasma generating chamber 12 (refer to Figure 1 ), when a predetermined discharge voltage is applied to the cathode 10 and the anode 11, a plasma arc is generated, and a plasma stream P is ejected from the torch portion 2 toward the gas treatment reactor 3.

[0085] The gas treatment reactor 3 includes an inner cylinder 31 forming a gas flow path GF, an outer cylinder 30 surrounding the inner cylinder 31, and a treatment gas inlet 32 ​​connected to the upper portion of the outer cylinder 30. The inner cylinder 31 and the outer cylinder 30 are concentrically arranged.

[0086] The inner cylinder 31 and the outer cylinder 30 both have cylindrical shapes. Therefore, an annular gap SP is formed between the outer wall surface of the inner cylinder 31 and the inner wall surface of the outer cylinder 30. The gap SP is arranged radially outward of the gas flow path GF.

[0087] The processing gas is introduced into the interior of the gas treatment reactor 3 through the processing gas inlet 32. The processing gas introduced through the processing gas inlet 32 ​​is thermally decomposed by contact with the high-temperature plasma jet P ejected from the torch unit 2. The thermally decomposed processing gas passes through the gas flow path GF, is processed by the liquid tank box (not shown) and the processing box (not shown), and is then discharged to the outside.

[0088] As mentioned above, to prevent recombination of the thermally decomposed process gas, vaporized water (i.e., water vapor) is preferably used as the substance reacting with the thermally decomposed process gas. However, if water stored in a liquid tank is used, there is a concern that the acid contained in the reaction products may corrode the gas treatment reactor 3. On the other hand, if water at a lower temperature (fresh water) is used, a relatively large amount of energy is required to react with the process gas, which may reduce the reaction efficiency with the process gas.

[0089] Therefore, in this embodiment, the exhaust gas treatment device 1 has a structure that prevents corrosion of the gas treatment reactor 3 and improves the reaction efficiency with the treated gas. This structure is described below. In this specification, "liquid" is a concept that includes water.

[0090] The exhaust gas treatment device 1 includes: a liquid supply line 4 that supplies liquid (more specifically, fresh water) to the torch part 2, and then supplies the liquid heated by the torch part 2 to the gas treatment reactor 3; and a liquid supply source WS that is connected to the liquid supply line 4.

[0091] Liquid supply line 4 is connected to torch 2 and gas treatment reactor 3 and is configured to supply liquid passing through torch 2 to gas treatment reactor 3. Torch 2 is located upstream of gas treatment reactor 3 in the flow direction of liquid supplied from liquid supply source WS.

[0092] exist Figure 1 In the illustrated embodiment, the liquid supply line 4 includes a cathode-side supply line 20A for supplying liquid supplied from a liquid supply source WS to the cathode chamber 14, and an anode-side supply line 20B for supplying liquid supplied from the liquid supply source WS to the anode chamber 15. The cathode-side supply line 20A and the anode-side supply line 20B are connected to separate liquid supply sources WS, but may alternatively be connected to a single liquid supply source WS.

[0093] The liquid supply line 4 further includes a merging line 20C connected to the cathode-side supply line 20A and the anode-side supply line 20B. The merging line 20C is connected to the outer cylinder 30 of the gas treatment reactor 3 .

[0094] Liquid supplied from liquid supply source WS is supplied to cathode chamber 14 and anode chamber 15 via cathode-side supply line 20A and anode-side supply line 20B. Cathode chamber 14 and anode chamber 15 are filled with liquid. Cathode 10 and anode 11 become hot due to the application of voltage. Therefore, the liquid supplied to cathode chamber 14 and anode chamber 15 cools cathode 10 and anode 11.

[0095] The liquid heated by heat exchange with the cathode 10 and the anode 11 is supplied to the outer cylinder 30 through the merging line 20C. More specifically, the merging line 20C is connected to the communication port 30a formed in the upper portion of the outer cylinder 30. Therefore, the liquid flowing through the merging line 20C is supplied to the upper portion of the outer cylinder 30.

[0096] The inner cylinder 31 has an upper end TP serving as an overflow weir for the liquid supplied from the liquid supply line 4. Therefore, the liquid supplied to the gas treatment reactor 3 gradually rises in the gap SP between the inner cylinder 31 and the outer cylinder 30 and overflows at the upper end TP.

[0097] The liquid overflowing at the top end TP forms a liquid film F on the inner wall surface of the inner cylinder 31. The liquid film F prevents foreign matter such as reaction by-products formed by the processing gas from accumulating in the inner cylinder 31. The entire inner wall surface of the inner cylinder 31 is covered with the liquid film F.

[0098] like Figure 1 As shown, a gas-liquid interface GL is formed at the upper end of the liquid film F (i.e., radially outward of the upper end TP of the inner cylindrical portion 31). The gas-liquid interface GL is the boundary where a portion of the liquid overflowing from the upper end TP vaporizes. The space above the gas-liquid interface GL is filled with vaporized liquid (i.e., water vapor).

[0099] The processing gas inlet 32 ​​is positioned higher than the top end TP. Therefore, the processing gas introduced through the processing gas inlet 32 ​​and thermally decomposed by the plasma jet P actively reacts with the water vapor present above the gas-liquid interface GL. This improves the reaction efficiency between the processing gas and the water vapor.

[0100] In particular, the communication port 30a of the outer cylinder 30 is positioned adjacent to the top end TP of the inner cylinder 31 (i.e., the gas-liquid interface GL). Therefore, by supplying heated liquid to the gas treatment reactor 3 through the communication port 30a, the space above the gas-liquid interface GL can be stably filled with water vapor. In this embodiment, the communication port 30a is positioned lower than the top end TP of the inner cylinder 31.

[0101] According to this embodiment, by supplying liquid heated by the torch unit 2 to the gas treatment reactor 3, the space above the gas-liquid interface GL can be effectively filled with water vapor, thereby improving the reaction efficiency with the treatment gas. Furthermore, by causing the liquid (fresh water) supplied from the liquid supply source WS to react with the thermally decomposed treatment gas, corrosion of the gas treatment reactor 3 can be prevented.

[0102] Figure 2 FIG. 1 is a diagram showing another embodiment of a liquid supply line. Figure 1 In the embodiment shown, the liquid supply line 4 has a structure for cooling the cathode 10 and the anode 11 in parallel, but Figure 2 In the illustrated embodiment, the liquid supply line 4 has a structure for cooling the cathode 10 and the anode 11 in series.

[0103] More specifically, the liquid supply line 4 is configured to supply the liquid to one of the cathode chamber 14 and the anode chamber 15 , and then supply the liquid to the other of the cathode chamber 14 and the anode chamber 15 .

[0104] exist Figure 2 In the embodiment shown, the liquid supply line 4 is configured to first supply liquid to the cathode chamber 14 and then to the anode chamber 15. In one embodiment, the liquid supply line 4 may also be configured to first supply liquid to the anode chamber 15 and then to the cathode chamber 14.

[0105] Figure 3 FIG. 1 is a diagram showing another embodiment of a liquid supply line. Figure 1 In the embodiment shown, the liquid supply line 4 has a converging line 20C connected to the cathode side supply line 20A and the anode side supply line 20B, but as shown in FIG. Figure 3 As shown, the liquid supply line 4 does not necessarily need to have the converging line 20C.

[0106] exist Figure 3 In the illustrated embodiment, the liquid supply line 4 does not include the merging line 20C, but includes the cathode-side supply line 20A and the anode-side supply line 20B connected to the upper portion of the outer cylindrical portion 30 .

[0107] The cathode supply line 20A is connected to a communication port 30a-2 formed in the upper portion of the outer cylinder 30, and the anode supply line 20B is connected to a communication port 30a-1 formed in the upper portion of the outer cylinder 30. In this embodiment, both the communication ports 30a-1 and 30a-2 are arranged at a position lower than the top end TP of the inner cylinder 31.

[0108] Figure 4 FIG. 1 is a diagram showing another embodiment of a liquid supply line. Figure 3In the illustrated embodiment, both the cathode supply line 20A and the anode supply line 20B are connected to the outer cylinder 30 . However, at least one of the cathode supply line 20A and the anode supply line 20B may be connected to the outer cylinder 30 .

[0109] exist Figure 4 In the illustrated embodiment, the cathode supply line 20A is not connected to the outer cylinder 30. On the other hand, the anode supply line 20B is connected to the communication port 30a formed in the upper portion of the outer cylinder 30. The liquid flowing through the cathode supply line 20A may be discharged or recovered after cooling the cathode 10 in the cathode chamber 14. In one embodiment, the cathode supply line 20A may be connected to the communication port 30a of the outer cylinder 30, while the anode supply line 20B may not be connected to the outer cylinder 30.

[0110] Figure 5 FIG. 1 is a diagram showing another embodiment of a liquid supply line. Figures 1 to 4 In the embodiment shown, the liquid supply line 4 is connected to the upper portion of the outer cylinder 30, but as shown in FIG. Figure 5 As shown, the liquid supply line 4 may be connected to a communication port 30 b formed in the lower portion of the outer cylinder portion 30 .

[0111] exist Figure 5 In the embodiment shown, the liquid supply line 4 has the same Figure 1 The liquid supply line 4 has the same structure as that described above (ie, the cathode side supply line 20A, the anode side supply line 20B and the converging line 20C). In one embodiment, the liquid supply line 4 may also have the same structure as that of the reference Figures 2 to 4 The liquid supply line 4 described above has the same structure.

[0112] Figure 6 : is a diagram showing one embodiment of a gas-liquid separation tank. Figure 6 In the illustrated embodiment, the exhaust gas treatment device 1 includes a gas-liquid separation tank 50 connected to the liquid supply line 4 (more specifically, the merging line 20C).

[0113] The gas-liquid separation tank 50 is arranged on the downstream side of the torch portion 2 in the flow direction of the liquid flowing through the liquid supply line 4. The gas-liquid separation tank 50 is configured to separate gas contained in the liquid introduced therein.

[0114] When the gas-liquid separation tank 50 is applied to the reference Figure 3 In the case of the liquid supply line 4 according to the embodiment described above, the gas-liquid separation tank 50 may be connected to at least one of the cathode-side supply line 20A and the anode-side supply line 20B.

[0115] Depending on conditions such as the temperature of the torch section 2 and the flow rate of the liquid supplied from the liquid supply source WS, some of the liquid cooling the torch section 2 may boil (evaporate), causing water vapor to be contained in the liquid (hot water). In this case, if the liquid containing water vapor is supplied to the gap SP between the inner cylindrical section 31 and the outer cylindrical section 30, there is a risk that the liquid film F will not be properly formed on the inner circumferential surface of the inner cylindrical section 31 due to the large amount of water vapor. The gas-liquid separation tank 50 can separate gas from the liquid that has passed through the torch section 2, thus resolving this problem.

[0116] Figure 7 Yes Figure 6 The gas-liquid separation tank is shown in FIG. Figure 7 As shown, the gas-liquid separation tank 50 has: Figure 6 and Figure 7 In the illustrated embodiment, a tank portion 51 is connected to a converging line 20C; and a gas introduction line 52A and a liquid introduction line 52B are connected to the tank portion 51. In this embodiment, the gas introduction line 52A and the liquid introduction line 52B are components of the gas-liquid separation tank 50, but may also be components of the liquid supply line 4.

[0117] The gas introduction line 52A is connected to the outer cylinder 30 at a position higher than the top end TP of the inner cylinder 31 (i.e., above the gas-liquid interface GL). The liquid introduction line 52B is connected to the outer cylinder 30 at a position lower than the top end TP of the inner cylinder 31 (i.e., below the gas-liquid interface GL).

[0118] The converging line 20C is connected to the lower portion of the tank 51. Therefore, when the liquid that has passed through the torch unit 2 is introduced into the tank 51, the liquid and gas are separated in the tank 51. The gas contained in the liquid is introduced into the gas treatment reactor 3 through the gas introduction line 52A connected to the upper portion of the tank 51. The tank 51 has a sufficient volume to separate the gas from the liquid.

[0119] The processing gas thermally decomposed by the plasma jet P actively reacts with the gas introduced into the gas processing reactor 3 through the gas introduction line 52A. Therefore, the reaction efficiency between the processing gas and the water vapor can be further improved.

[0120] Liquid introduced into the gas treatment reactor 3 via the liquid introduction line 52B connected to the lower portion of the tank 51 gradually rises in the gap SP between the inner and outer tubular portions 31, 30, and overflows at the top end TP. The liquid overflowing at the top end TP forms a liquid film F on the inner wall surface of the inner tubular portion 31.

[0121] The temperature (boiling point) at which a liquid boils depends on the pressure of the liquid. Therefore, by supplying a liquid pressurized to a predetermined target pressure (eg, a few tenths of MPa), an arbitrary amount of water vapor can be introduced into the gas treatment reactor 3 .

[0122] Although not shown, the exhaust gas treatment device 1 may also include: a flow control valve disposed upstream and / or downstream of the torch portion 2; and a temperature sensor disposed downstream of the torch portion 2. With this configuration, the exhaust gas treatment device 1 can control the flow rate of liquid flowing through the liquid supply line 4 based on the temperature of the torch portion 2. In this way, the exhaust gas treatment device 1 can control the amount of gas (water vapor) introduced into the gas treatment reactor 3.

[0123] Figure 8 : is a diagram showing another embodiment of a gas treatment reactor. Figure 8 As shown, the inner cylinder 31 may also have a flow path throttling portion 35 that narrows the gas flow path GF. The flow path throttling portion 35 is formed at the lower portion of the inner cylinder 31 to reduce the inner diameter of the lower portion of the inner cylinder 31. The liquid film F formed on the inner wall surface of the inner cylinder 31 flows down the flow path throttling portion 35. Figure 8 In the illustrated embodiment, the flow path throttling portion 35 has a tapered shape that gradually reduces the inner diameter of the inner cylinder 31 , but may also have a stepped shape that protrudes from the inner wall surface of the inner cylinder 31 .

[0124] When nitrogen present in the gas flow path GF (for example, nitrogen contained in the process gas or plasma jet P) combines with oxygen, nitrogen oxides (NO X ).like Figure 8 As shown, by forming the flow path throttle portion 35, the process gas (or plasma jet P) flowing through the gas flow path GF is rapidly cooled by the liquid film F flowing down the flow path throttle portion 35. Rapid cooling of the process gas can suppress the generation of nitrogen oxides.

[0125] exist Figure 8 In the embodiment shown, the liquid supply line 4 has the same Figure 1 The liquid supply line 4 of the embodiment described above has the same structure, but may also have the same structure as that of the reference Figures 2 to 7 The liquid supply line 4 described above has the same structure.

[0126] Figure 9 FIG is a diagram showing a spray nozzle that sprays liquid into a gas flow path. Figure 9 As shown in FIG. 1 , the exhaust gas treatment device 1 may also include a spray nozzle SN for spraying liquid toward the gas flow path GF. Figure 9In the embodiment shown, the liquid supply line 4 has: an anode side supply line 20B, which is connected to the gap SP between the outer cylinder 30 and the inner cylinder 31; and a cathode side supply line 20A, which is connected to the gas flow path GF formed inside the inner cylinder 31.

[0127] More specifically, the anode supply line 20B is connected to a communication port 30a formed in the upper portion of the outer cylinder 30. The cathode supply line 20A extends through a communication port 30b formed in the lower portion of the outer cylinder 30 and is connected to a communication port 31a formed in the lower portion of the inner cylinder 31.

[0128] The spray nozzle SN is connected to the top end of the cathode-side supply line 20A, in other words, to the communication port 31a, and is positioned toward the gas flow path GF. Thus, the spray nozzle SN sprays the liquid flowing through the cathode-side supply line 20A toward the process gas (or plasma jet P) flowing through the gas flow path GF. The sprayed liquid rapidly cools the process gas flowing through the gas flow path GF. This rapid cooling of the process gas can suppress the formation of nitrogen oxides.

[0129] exist Figure 9 In the illustrated embodiment, the cathode supply line 20A extends to the gas flow path GF, and the anode supply line 20B extends to the gap SP. However, the anode supply line 20B may extend to the gas flow path GF, and the cathode supply line 20A may extend to the gap SP. In this case, the spray nozzle SN may be connected to the tip of the anode supply line 20B.

[0130] Reference Figures 1 to 9 The components of the embodiment described above can be combined as appropriate. For example, the components such as the gas-liquid separation tank 50, the flow path throttling unit 35, and the spray nozzle SN can be applied to the embodiment described above. Figures 1 to 9 The described embodiments.

[0131] The above-described embodiments are described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention pertains to the implementation of the present invention. Various modifications of the above-described embodiments are readily achievable by those skilled in the art, and the technical concepts of the present invention are also applicable to other embodiments. Therefore, the present invention is not limited to the described embodiments but should be applied within the broadest scope of the technical concepts defined by the scope of the invention to be protected.

Claims

1. An exhaust gas treatment device, characterized in that: have: a torch portion that generates a high-temperature jet; a gas processing reactor having a gas flow path for the flow of a processed gas thermally decomposed by the jet; a liquid supply line for supplying liquid to the torch section and then supplying the liquid heated by the torch section to the gas treatment reactor; as well as A liquid supply source is connected to the liquid supply line.

2. The exhaust gas treatment device according to claim 1, characterized in that The torch portion comprises: a cathode chamber, the cathode chamber being provided with a cathode; and an anode chamber, the anode chamber being provided with an anode, The liquid supply line has: a cathode-side supply line that supplies the liquid to the cathode chamber; and An anode-side supply line supplies the liquid to the anode chamber.

3. The exhaust gas treatment device according to claim 2, characterized in that: The liquid supply line includes a merging line connected to the cathode-side supply line and the anode-side supply line.

4. The exhaust gas treatment device according to claim 2, characterized in that: At least one of the cathode-side supply line and the anode-side supply line is connected to the gas processing reactor.

5. The exhaust gas treatment device according to claim 1, characterized in that: The torch portion comprises: a cathode chamber, the cathode chamber being provided with a cathode; and an anode chamber, the anode chamber being provided with an anode, The liquid supply line supplies the liquid to one of the cathode chamber and the anode chamber, and then supplies the liquid to the other of the cathode chamber and the anode chamber.

6. The exhaust gas treatment device according to claim 1, characterized in that: The liquid supply line is configured to supply the liquid to an upper portion of the gas processing reactor.

7. The exhaust gas treatment device according to claim 1, characterized in that: The gas treatment reactor comprises: an inner cylinder portion forming the gas flow path; and an outer cylinder portion, the outer cylinder portion surrounding the inner cylinder portion, The inner cylindrical portion has an upper end serving as an overflow weir for the liquid supplied from the liquid supply line.

8. The exhaust gas treatment device according to claim 7, characterized in that: The exhaust gas treatment device includes a gas-liquid separation tank connected to the liquid supply line. The gas-liquid separation tank is arranged on the downstream side of the torch portion in the flow direction of the liquid.

9. The exhaust gas treatment device according to claim 8, characterized in that: The gas-liquid separation tank comprises: a gas introduction line connected to the outer cylinder at a position higher than the upper end; and A liquid introduction line is connected to the outer cylinder at a position lower than the upper end.

10. The exhaust gas treatment device according to claim 7, characterized in that: The inner cylinder has a flow path throttling portion that narrows the gas flow path.

11. The exhaust gas treatment device according to claim 1, characterized in that: The exhaust gas treatment device includes a spray nozzle that sprays the liquid toward the gas flow path.

12. The exhaust gas treatment device according to claim 1, characterized in that: The exhaust gas treatment device is an atmospheric pressure plasma exhaust gas treatment device, The torch portion has a non-transferred plasma torch structure.

13. A method for treating waste gas, characterized in that: The liquid supplied from the liquid supply source is supplied to the torch portion that generates a high-temperature jet. Subsequently, the liquid heated by the torch portion is supplied to a gas treatment reactor having a gas flow path through which a treatment gas thermally decomposed by the jet flows.

14. The waste gas treatment method according to claim 13, characterized in that: The liquid is supplied to a cathode chamber in which a cathode is arranged and an anode chamber in which an anode is arranged in the torch portion.

15. The waste gas treatment method according to claim 14, characterized in that: The liquid is supplied to one of the cathode chamber and the anode chamber, and then the liquid is supplied to the other of the cathode chamber and the anode chamber.

16. The waste gas treatment method according to claim 13, characterized in that: Separate the gas contained in the liquid after passing through the torch section, supplying the gas to a position of the gas treatment reactor that is higher than the upper end of the inner cylinder portion forming the gas flow path, The liquid is supplied to a position lower than the upper end.

Citation Information

Patent Citations

  • Combustion-type exhaust gas treatment apparatus

    JP2008161861A