Electronic circuit device and electronic equipment

Abstract

The embodiment of the invention discloses an electronic circuit device and electronic equipment. The electronic circuit device comprises a body structure and an interface welding spot, the body structure comprises an organic material, and the interface welding spot is electrically connected with the body structure; the peripheral surface of the body structure is coated with a moisture-proof layer, the moisture-proof layer comprises an inorganic film layer, and the interface welding spots are exposed out of the moisture-proof layer so as to construct corresponding electric connection. Through the arrangement, good moisture-proof capability can be obtained based on the inorganic film layer with relatively low water vapor transmittance, and compared with an implementation scheme of forming a moisture-proof layer by adopting an organic material, the body structure of the electronic circuit device can be effectively prevented from absorbing moisture through the relatively thin laminated structure, and the moisture-proof period of a product is prolonged. In addition, based on the structural characteristic that the moisture-proof layer is relatively thin, the thermal resistance is low, heat dissipation can be conveniently and rapidly achieved, and the body structure has the good heat dissipation capacity.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic circuit device packaging, and in particular to an electronic circuit device and an electronic device. Background Art

[0002] Generally, electronic circuit devices need to adopt good performance reliability. For example, the substrate used for chip packaging mainly provides support, heat dissipation and protection for the chip. However, in an open environment, organic substrates are usually prone to moisture absorption, which leads to increased dielectric loss. Especially for high-frequency data transmission links, the higher the data transmission frequency, the higher the dielectric loss caused by moisture absorption of the substrate. For another example, for a system-level package formed by integrating devices into a substrate, taking the power system in package (PSiP) as an example, long-term placement will cause the passivation layer of the package and the polyimide (PI) film to delaminate. After the organic material absorbs moisture, a water film path will be formed, which may cause the chip to short-circuit. Therefore, there is an urgent need to improve the moisture resistance of electronic circuit devices to improve the impact of moisture absorption on performance reliability. Summary of the Invention

[0003] The embodiments of the present application provide electronic circuit devices and electronic equipment, which effectively improve the moisture resistance of the electronic circuit devices through structural optimization.

[0004] The first aspect of the embodiment of the present application provides an electronic circuit device, which includes a main body structure and an interface solder joint, wherein the main body structure includes an organic material, and the interface solder joint is electrically connected to the main body structure; a moisture-proof layer is coated on the outer peripheral surface of the main body structure, the moisture-proof layer includes an inorganic film layer, and the interface solder joint is exposed to the moisture-proof layer to establish a corresponding electrical connection. With such an arrangement, based on the inorganic film layer with a low water vapor permeability, a good moisture-proof ability can be obtained. Compared with the implementation scheme of using organic materials to form a moisture-proof layer, the embodiment of the present application can effectively avoid the main body structure of the electronic circuit device from absorbing moisture through a thinner laminated structure, thereby improving the moisture-proof period of the product. In addition, based on the relatively thin structural characteristics of the moisture-proof layer, the thermal resistance is low, which facilitates rapid heat dissipation, so that the main body structure has good heat dissipation capabilities.

[0005] For example, the inorganic film layer can be made of inorganic materials such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, hafnium oxide, etc. In practical applications, the inorganic film layer can be formed at low temperature using atomic layer deposition, chemical vapor deposition, and other process technologies.

[0006] Based on the first aspect, the present application also provides a first implementation of the first aspect: the moisture-proof layer further includes an organic film layer, which is stacked with the inorganic film layer. Thus, while achieving excellent moisture-proof and heat-dissipating capabilities, the moisture-proof laminated structure formed by the organic and inorganic film layers possesses a certain degree of flexibility based on the ductility of the organic film layer. This adapts to stress changes during device operation due to heat generation and expansion, effectively reducing the effects of stress in different operating scenarios, preventing mechanical damage to the structure, and improving the reliability and stability of the electronic circuit device.

[0007] For example, the organic film layer can be made of polymer materials such as parylene, metal organic framework, resin, etc. In practical applications, the organic film layer can be formed at low temperature using process technologies such as molecular layer deposition and spin coating.

[0008] Alternatively, the organic and inorganic film layers can be made of materials with coefficients of thermal expansion that match those of the underlying structure. This allows the deformation of the organic and inorganic film layers to be consistent with that of the underlying structure, preventing stress-induced delamination. Alternatively, the organic and inorganic film layers can be made of materials with high thermal conductivity to further enhance heat dissipation.

[0009] Based on the first embodiment of the first aspect, the present application also provides a second embodiment of the first aspect: the organic film layer and the inorganic film layer are both multi-layered, and the multiple organic film layers and the multiple inorganic film layers are stacked sequentially from the inside out. That is, one organic film layer and one inorganic film layer are stacked sequentially. In practical applications, the number of organic film layers and inorganic film layers can be the same or different.

[0010] For example, the total number of layers of the moisture-proof layer of the laminated structure may be 2 to 10 layers.

[0011] Based on the first embodiment of the first aspect or the second embodiment of the first aspect, the present application also provides a third embodiment of the first aspect: the inner layer of the moisture-proof layer is an organic film layer. In other words, the moisture-proof layer is adhered and fixed to the outer peripheral surface of the main structure via the organic film layer, thereby preventing dust from affecting the growth of the film layer on the surface of the main structure, thereby ensuring reliable adhesion and fixation between the moisture-proof layer and the main structure.

[0012] In other practical applications, the inner layer of the moisture-proof layer may also be an inorganic film layer. The moisture-proof layer is fixed to the outer peripheral surface of the main body structure through the inorganic film layer to form a more stable moisture-proof effect around the main body structure.

[0013] Based on the first embodiment of the first aspect, the second embodiment of the first aspect, or the third embodiment of the first aspect, the present application also provides a fourth embodiment of the first aspect: the outer layer of the moisture-proof layer is an organic film layer. With this configuration, the organic film layer can protect the inorganic film layer, preventing damage to the inorganic film layer under high temperature and high humidity conditions, thereby further extending the moisture-proof period.

[0014] Based on the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, the embodiment of the present application also provides a fifth embodiment of the first aspect: the thickness of the organic film layer is 0.1um to 100um.

[0015] Based on the first aspect, the present application also provides a sixth embodiment of the first aspect: the moisture-proof layer comprises a single inorganic film layer. This embodiment, while achieving excellent moisture-proofing and heat dissipation capabilities, further reduces manufacturing costs and provides high process reliability. It has promising application prospects.

[0016] Based on the first aspect, the present application also provides a seventh embodiment of the first aspect: the moisture-proof layer includes a first inorganic film layer and a second inorganic film layer stacked together, wherein the first inorganic film layer and the second inorganic film layer are made of different inorganic materials. This configuration further reduces the water vapor transmission rate of the moisture-proof layer, improving its moisture-proof capability; it also strengthens the bonding strength between adjacent film layers, resulting in more stable application reliability.

[0017] Based on the seventh embodiment of the first aspect, the present application also provides an eighth embodiment of the first aspect: the first inorganic film layer and the second inorganic film layer are both multi-layered, and the multi-layered first inorganic film layer and the multi-layered second inorganic film layer are stacked sequentially from the inside out. In this way, while improving the moisture-proof effect, the thickness of the moisture-proof layer can be reasonably controlled, facilitating heat dissipation.

[0018] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, or the eighth embodiment of the first aspect, the embodiment of the present application further provides a ninth embodiment of the first aspect: the thickness of the inorganic film layer is 1nm to 200nm. In this way, on the basis of improving the moisture-proof ability, by reasonably controlling the thickness of the thin moisture-proof layer, the heat dissipation requirements of different scenarios can be met.

[0019] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, or the eighth embodiment of the first aspect, or the ninth embodiment of the first aspect, the embodiment of the present application also provides a tenth embodiment of the first aspect: the electronic circuit device is a substrate for packaging chips, the substrate body of the substrate is a body structure, and the substrate body includes a first surface and a second surface that are relatively arranged. In practical applications, the good moisture-proof ability of the moisture-proof layer formed based on inorganic materials can avoid the influence of increased dielectric loss caused by moisture absorption of the substrate when the substrate is placed for a long time; in particular, for packaging devices used in high-frequency data transmission or ultra-high-frequency data transmission links, this technical advantage is particularly significant.

[0020] Furthermore, during the use of the packaged device, the excellent heat dissipation provided by the thinner moisture barrier meets the heat dissipation requirements within the substrate, preventing overheating that could affect device performance. This also provides technical support for high-density layouts of wiring density and line width within the substrate, while also reducing the stress caused by operating heat.

[0021] Exemplarily, the interface solder joints include external interface solder joints and internal interface solder joints, and the external interface solder joints and the internal interface solder joints are located on the first surface of the substrate body.

[0022] In other exemplary embodiments, the external interface solder joints of the substrate are located on the second surface of the substrate body, and the internal interface solder joints are located on the first surface of the substrate body.

[0023] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, or the eighth embodiment of the first aspect, or the ninth embodiment of the first aspect, the embodiment of the present application further provides an eleventh embodiment of the first aspect: the electronic circuit device is a system-level package, the chip and electronic components of the system-level package are assembled on a packaging substrate, the chip, electronic components and packaging substrate are encapsulated in the package, and the package is a main body structure. In practical applications, the good moisture-proof ability of the moisture-proof layer formed based on inorganic materials can avoid the impact of moisture absorption of organic packaging materials on the reliability of system performance when the system-level package is placed for a long time.

[0024] In addition, during the use of the system-level package, the excellent heat dissipation capability provided by the thinner moisture-proof layer can meet the heat dissipation needs of the components inside the package and avoid overheating that affects device performance. At the same time, it can effectively reduce the stress caused by working heat, providing technical support for the high-density layout of the system-level package architecture.

[0025] For example, the system-in-package (PSiP) can be used to power a motherboard and its power devices. In practical applications, its excellent moisture resistance prevents moisture absorption, which can form a water film path and cause chip short circuits, leading to power failures in servers and network systems.

[0026] A second aspect of an embodiment of the present application provides an electronic device, which includes a housing and a mainboard disposed in the housing. Functional devices are disposed on the mainboard, and the functional devices include the electronic circuit devices described above.

[0027] Exemplarily, the electronic circuit device may be an electronic device used in different scenarios such as communications, servers, industry, rail transportation, automation, etc.

[0028] A third aspect of an embodiment of the present application provides another electronic device, which includes a housing and a mainboard disposed in the housing. Functional devices are disposed on the mainboard, and the functional devices are formed by using the substrate packaging as described above.

[0029] In practical applications, the functional device may be of different types. For example, it may be a CPU (Central Processing Unit), a GPU (Graphic Processing Unit), an ASIC (Application Specific Integrated Circuit), or a SOC (System on Chip) configured in an electronic device.

[0030] A fourth aspect of an embodiment of the present application provides another electronic device, which includes a housing and a mainboard disposed in the housing. Functional devices are disposed on the mainboard, and the functional devices are the system-level package as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of the assembly relationship between a chip packaging device and a PCB provided in an embodiment of the present application;

[0032] Figure 2 A schematic diagram of the overall structure of a substrate provided in an embodiment of the present application;

[0033] Figure 3 for Figure 2AA section view in;

[0034] Figure 4 for Figure 2 BB cross-sectional view in;

[0035] Figure 5 A structural cross-sectional view of another substrate provided in an embodiment of the present application;

[0036] Figure 6 A structural cross-sectional view of another substrate provided in an embodiment of the present application;

[0037] Figure 7 A structural cross-sectional view of another substrate provided in an embodiment of the present application;

[0038] Figure 8 A schematic diagram of the assembly relationship between another chip packaging device and a PCB provided in an embodiment of the present application;

[0039] Figure 9 A structural cross-sectional view of another substrate provided in an embodiment of the present application;

[0040] Figure 10 A schematic structural diagram of a system-level package provided in an embodiment of the present application;

[0041] Figure 11 A cross-sectional view of the structure of another system-level package provided in an embodiment of the present application;

[0042] Figure 12 A cross-sectional view of the structure of another system-level package provided in an embodiment of the present application;

[0043] Figure 13 A cross-sectional view of the structure of another system-level package provided in an embodiment of the present application;

[0044] Figure 14 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0045] The embodiment of the present application provides an implementation solution for an electronic circuit device, which effectively improves moisture resistance while also having good heat dissipation capabilities.

[0046] Electronic circuit devices often contain organic materials and are susceptible to moisture absorption when placed in an open environment. Due to the polar molecular properties of water, electronic circuit devices cannot maintain their performance reliability after absorbing moisture. In some scenarios, this can lead to device failure.

[0047] In a packaging substrate application scenario, the chip is coupled and fixed on the substrate, and the substrate provides support, heat dissipation and protection for the chip. Figure 1, this figure is a schematic diagram of the assembly relationship between a chip packaging device and a PCB provided in an embodiment of the present application.

[0048] The substrate 10 includes internal and external electrical interfaces that are mated and connected, serving as both a package and a transitional electrical connection. The terms "internal" and "external" are defined in relation to the packaged device. The internal electrical interface connects to the chip 20 for electrical signal communication, while the external electrical interface connects to the PCB (Printed Circuit Board) 30 for electrical signal communication. The chip 20 and PCB 30 are electrically connected via the substrate 10. Figure 1 As shown in the figure, the chip 20 is electrically connected to the internal electrical interface on the substrate 10 through the ball grid array (BGA) a, and the external electrical interface on the substrate 10 is electrically connected to the PCB 30 through the lead b formed by the gold wire bonding (WB) process.

[0049] As a form of electronic circuit device, the substrate 10 realizes the transitional electrical connection function through the conductor inside the board, including but not limited to organic substrates such as BT (Bismaleimide Triazine resins) substrates, ABF (Ajinomoto Build-up Film) substrates, PI (Polyimide) substrates and PE (Polyethylene) substrates. After the organic material of the substrate 10 absorbs moisture, the dielectric loss will increase and affect the performance of the device. The higher the data signal transmission frequency, the higher the dielectric loss caused by the substrate absorbing moisture. For example, but not limited to, high-frequency signals with a signal transmission frequency of 500MHz-40GHz, or ultra-high frequency signals with a signal transmission frequency of more than 40GHz, for ultra-high frequency data transmission links, the high dielectric loss caused by the substrate 10 absorbing moisture will cause the device to fail and fail to meet the link signal transmission requirements.

[0050] Based on this, the embodiments of the present application propose a moisture-proof solution for electronic circuit devices. Figure 2 、 Figure 3 and Figure 4 ,in, Figure 2 This is a schematic diagram of the overall structure of a substrate provided in an embodiment of the present application. Figure 3 for Figure 2 In the AA section view, Figure 4 for Figure 2 To simplify the illustration, the cross-sectional view does not show the internal conductors located inside the substrate for achieving the transitional electrical connection function.

[0051] like Figure 3 and Figure 4 As shown, the substrate 10 includes a substrate body 101, interface solder joints 102, and a moisture barrier 103. The substrate body 101 is a main structure composed of organic materials. For ease of description, the two sides of the substrate body 101 are defined as the "first side" and the "second side." The first side faces the chip side and is used for chip mounting. The second side faces the PCB side and is used for mounting the packaged device on the board.

[0052] Among them, each interface solder point 102 is located on the first side of the substrate body 101, wherein the first interface solder point 102a is an external electrical interface, that is, an external interface solder point, for electrically connecting to the PCB side; the second interface solder point 102b is an internal electrical interface, that is, an internal interface solder point, for electrically connecting to the chip side. It is understandable that the arrangement density and specific layout position of each interface solder point 102 are not limited to the exemplary expression in the figure, and can be determined according to the overall design requirements of the corresponding packaged device. In the specific implementation, as long as the corresponding welding process requirements and reliable electrical connection relationship can be met, the embodiment of this application is not limited.

[0053] The moisture-proof layer 103 covers the outer surface of the substrate body 101, and the interface solder joints 102 are exposed on the moisture-proof layer 103 to establish the corresponding electrical connection. In other words, the moisture-proof layer 103 is attached to the two side surfaces of the substrate body 101 and the outer side surface of the substrate body 101, forming a moisture-proof protection on the outer surface of the substrate body 101.

[0054] In this embodiment, the moisture-proof layer 103 comprises an organic film layer 103a and an inorganic film layer 103b, arranged sequentially from the inside out, forming a laminated structure. The organic film layer 103a is bonded to the outer surface of the substrate 101, preventing dust from affecting the growth of the film layer on the surface of the substrate 101. This ensures a secure bond between the moisture-proof layer 103 and the substrate 101.

[0055] In a specific implementation, the organic film layer 103a can be a polymer material such as parylene, a metal-organic framework, or a resin, and can be made of a macromolecular organic compound that forms a chain or ring and includes organic components, that is, an organic material composed of macromolecules containing carbon atoms; for example, but not limited to, it can be achieved at low temperature through process technologies such as molecular layer deposition and spin coating. The inorganic film layer 103b can be an inorganic material such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, or hafnium oxide, and can be achieved at low temperature through process technologies such as atomic layer deposition and chemical vapor deposition. Optionally, the thickness of the organic film layer 103a can be 0.1 μm to 100 μm, and the thickness of the inorganic film layer 103b can be 1 nm to 200 nm. The specific thickness can be determined based on the actual application scenario and is not limited in the present embodiment.

[0056] Based on the inorganic film layer 103b with a low water vapor permeability, good moisture-proof ability can be obtained. Compared with the implementation scheme of using organic materials to form a moisture-proof layer, the embodiment of the present application can effectively prevent the substrate from absorbing moisture through a thinner laminated structure, thereby improving the product's moisture-proof cycle. In addition, based on the relatively thin structural characteristics of the moisture-proof layer, the thermal resistance is low, which facilitates rapid heat dissipation, allowing the substrate to have good heat dissipation capabilities. In addition, based on the ductility of the organic film layer, the moisture-proof layer 103 of the laminated structure has a certain flexibility and can adapt to the stress changes during the heat and expansion process of the packaged device during operation, effectively reducing the stress impact in different working scenarios and avoiding mechanical damage to the structure.

[0057] Overall, the excellent moisture-proofing capabilities of the inorganic material-based moisture barrier prevent increased dielectric loss caused by moisture absorption when the substrate is stored for extended periods. This technological advantage is particularly significant for packaged devices used in high-frequency or ultra-high-frequency data transmission links. Furthermore, during the use of the packaged device, the excellent heat dissipation provided by the thinner moisture barrier meets the internal heat dissipation requirements of the substrate, preventing overheating that could affect device performance. Furthermore, it provides technical support for high-density layouts of wiring density and line width within the substrate, and reduces the stress caused by operating heat.

[0058] Figure 3 and Figure 4 As shown, two organic film layers 103a and two inorganic film layers 103b are stacked sequentially to form a moisture-proof layer 103. In other implementations, the sequentially stacked organic film layers 103a and inorganic film layers 103b can be arranged in a plurality of layers, and the number of organic film layers 103a and inorganic film layers 103b can be the same or different, and is not limited to the number shown in the figure. For the stacked moisture-proof layer 103, the total number of layers can be determined based on actual moisture-proofing requirements, for example, but not limited to, 2 to 10 layers.

[0059] Specifically, the number of layers of the organic film layer 103a and the inorganic film layer 103b can be the same, and the outermost layer of the moisture-proof layer 103 formed is the inorganic film layer 103b; the number of layers of the organic film layer 103a and the inorganic film layer 103b can also be different, and the outermost layer of the moisture-proof layer 103 formed is the organic film layer 103a, so as to protect the inorganic film layer 103b and avoid damage such as microscopic agglomeration of the inorganic film layer 103b in a high temperature and high humidity environment, which can further increase the moisture-proof period (not shown in the figure).

[0060] To effectively manage the effects of stress, the organic film layer 103a and the inorganic film layer 103b can be made of materials with a thermal expansion coefficient that matches that of the substrate 101. During operation, the organic and inorganic film layers 103a, 103b, and the substrate 101 deform in a manner consistent with each other, preventing stress-induced delamination. Furthermore, the organic and inorganic film layers 103a, 103b can be made of materials with high thermal conductivity, which not only provides good moisture resistance but also enhances heat dissipation.

[0061] In the aforementioned embodiment, the moisture-proof layer 103 is fixed to the outer peripheral surface of the substrate body 101 by the organic film layer 103a, that is, the inner layer of the moisture-proof layer 103 is the organic film layer 103a. In other specific implementations, an inorganic film layer with a laminated structure can also be fixed to the outer peripheral surface of the substrate body 101. Figure 5 , which is a cross-sectional view of another substrate structure provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated in the figure with the same reference numerals.

[0062] like Figure 5 As shown, the moisture-proof layer 103 covering the outer peripheral surface of the substrate body 101 is formed by an inorganic film layer 103b and an organic film layer 103a arranged in sequence from the inside to the outside, and is also a laminated structure of the moisture-proof layer 103. Among them, the inorganic film layer 103b is attached to the outer peripheral surface of the substrate body 101 to form a more stable moisture-proof effect around the substrate body 101, and the organic film layer 103a covering the inorganic film layer 103b provides further protection.

[0063] Likewise, Figure 5 The moisture-proof layer 103 shown is formed by stacking two inorganic film layers 103b and two organic film layers 103a in sequence. In other implementations, the total number of layers in the stacked structure can be determined based on actual moisture-proof requirements, for example, but not limited to, 2 to 10 layers. This is not limited in the present embodiment.

[0064] Specifically, the number of layers of the inorganic film layer 103b and the organic film layer 103a can be the same, and the outermost layer of the moisture-proof layer 103 formed is the organic film layer 103a, so as to protect the inorganic film layer 103b and prevent the inorganic film layer 103b from being damaged under high temperature and high humidity, thereby further increasing the moisture-proof period; the number of layers of the inorganic film layer 103b and the organic film layer 103a can also be different, and the outermost layer of the moisture-proof layer 103 formed is the inorganic film layer 103b (not shown in the figure).

[0065] Figure 5 Other compositions and implementations of the described substrate can be Figures 2 to 4 The substrate is the same as described above and will not be described here in detail.

[0066] The moisture-proof layer in the aforementioned embodiment is formed by stacking an organic film layer 103a and an inorganic film layer 103b in sequence. In other specific implementations, inorganic film layers of different materials may be stacked in sequence. Figure 6 , which is a cross-sectional view of another substrate structure provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated in the figure with the same reference numerals.

[0067] like Figure 6 As shown, the moisture-proof layer 103 coated on the outer surface of the substrate body 101 is formed from a first inorganic film layer 103b1 and a second inorganic film layer 103b2, arranged sequentially from the inside out. This moisture-proof layer 103 also has a laminated structure. Compared to the aforementioned moisture-proof layer formed by using organic and inorganic film layers, this embodiment uses different inorganic film layers stacked in sequence to form this laminated structure, which can further reduce the moisture vapor transmission rate of the moisture-proof layer and improve its moisture-proof capability. At the same time, based on the relatively stable covalent bonds formed between inorganic materials, the bonding strength between adjacent film layers can be strengthened, resulting in more stable application reliability. In addition, while providing the same moisture-proof capability, the thickness of the moisture-proof layer can be further reduced, which is beneficial for heat dissipation.

[0068] In a specific implementation, the first inorganic film layer 103b1 and the second inorganic film layer 103b2 are made of inorganic materials such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, or hafnium oxide, and the two are made of different inorganic materials. For example, but not limited to, they can be deposited at low temperatures using techniques such as atomic layer deposition and chemical vapor deposition. Optionally, the thickness of the first inorganic film layer 103b1 and the second inorganic film layer 103b2 can be 1nm to 200nm, and the thickness of the two can be the same or different, which can be determined based on the actual application scenario. This embodiment of the present application is not limited thereto.

[0069] For example Figure 6 As shown, the moisture-proof layer 103 is formed by sequentially stacking two first inorganic film layers 103b1 and two second inorganic film layers 103b2. In other implementations, the sequentially stacked first inorganic film layers 103b1 and second inorganic film layers 103b2 can be configured as other multiple layers, and the number of layers can be the same or different, and is not limited to the number shown in the figure. For the laminated moisture-proof layer 103, the total number of layers can be determined based on actual moisture-proofing requirements, for example, but not limited to, 2 to 10 layers.

[0070] In addition, the thickness of the inorganic film layer is relatively thin, and its thermal conductivity is much higher than the thermal conductivity of the substrate material. For example, the thermal conductivity of aluminum oxide is 10 to 30 W / (mK), and the thermal conductivity of organic resin is 1 W / (mK). The moisture-proof layer formed by the inorganic film layer has little effect on the heat dissipation of the packaged device and can meet the heat dissipation requirements of the substrate in different working scenarios.

[0071] Figure 6 Other structures and implementations of the described substrate may be consistent with those described in the previous embodiment and will not be described in detail here.

[0072] The moisture-proof layer in each of the above embodiments is formed by stacking multiple layers of film layers in sequence. In other specific implementations, a single inorganic film layer can also be used to form the moisture-proof layer. Figure 7 , which is a cross-sectional view of another substrate structure provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated in the figure with the same reference numerals.

[0073] like Figure 7 As shown, moisture-proof layer 103 is formed by a single inorganic film layer 103b, which covers the outer peripheral surface of substrate body 101. Each interface solder joint 102 is exposed through moisture-proof layer 103 to establish corresponding electrical connections. This embodiment achieves excellent moisture-proof performance while further reducing manufacturing costs and achieving high process reliability.

[0074] In a specific implementation, the inorganic film layer 103b can be made of an inorganic material such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, or hafnium oxide, and can be deposited at low temperatures using, for example, but not limited to, atomic layer deposition or chemical vapor deposition. Optionally, the thickness of the inorganic film layer 103b can be 1 nm to 200 nm, which can be determined based on the actual application scenario and is not limited in this embodiment.

[0075] The following is a comparative example of the solution of using parylene to form a moisture-proof layer. Figure 7 The described implementation scheme of using aluminum oxide to form a moisture-proof layer is compared and calculated for the moisture absorption period.

[0076] The substrate described in this embodiment has the same size and material as the comparative example substrate, and the moisture-proof layer is coated on the outer surface of the substrate. Specifically, the thickness of the substrate is H = 0.1 cm, the density is ρ = 1.2 g / cm 3 , total moisture absorption rate r = 0.5%. Moisture absorption per unit area M = H × ρ × r = 0.1 cm × 1.2 g / cm 3 × 0.5% = 6 g / m 2 .

[0077] Typically, the formula for calculating the 100% moisture absorption period T is: T = M / 2WVTR, and the formula for calculating the 20% moisture absorption period T1 is: T1 = 0.2M / 2WVTR. WVTR stands for water vapor transmission rate. It should be noted that due to the relatively thin thickness of substrate 10 and the relatively small area of ​​the moisture barrier layer covering the outer peripheral side of substrate body 101, the denominator in the aforementioned moisture absorption period calculation formula is based on twice the WVTR. This does not materially affect the moisture absorption period comparison results between this embodiment and the comparative example.

[0078] The moisture-proof layer formed by the inorganic film layer using the ALD process in this embodiment has a thickness of 100 nm and a WVTR of 1×10 -4 g / m 2 / day, 100% moisture absorption period T = 3 × 10 4 Days; 20% moisture absorption period T1 = 6 × 10 3 sky.

[0079] The comparative solution uses a moisture-proof layer made of parylene with a thickness of 200 μm. The WVTR of the moisture-proof layer is 0.4 g / m 2 / day, moisture absorption period T = 7 days, 20% moisture absorption period T1 = 1.5 days.

[0080] In practical applications, the 20% moisture absorption period T1 is the maximum allowable moisture absorption during product design and is used as the main evaluation data for moisture resistance. From the above calculation data, it can be seen that the 20% moisture absorption period T1 of this embodiment is 6×10 3 days, while the 20% moisture absorption period T1 of the comparative example is 1.5 days. Compared with the comparative example, the substrate formed by applying the present embodiment can increase its service life by more than 16 years.

[0081] It should be noted that the substrates described in the above embodiments can be applied to Figure 1 In the package scenario shown, all interface solder joints on the substrate are located on the first side of the substrate. In another package substrate application scenario, the interface solder joints can be located on the first and second sides of the substrate. Figure 8 , this figure is a schematic diagram of the assembly relationship between another chip packaging device and PCB provided in an embodiment of the present application.

[0082] like Figure 8 As shown, the chip 20 is electrically connected to the internal electrical interface on the substrate 10 via leads b, and the external electrical interface on the substrate 10 is electrically connected to the PCB 30 side via a ball grid array (BGA) a. The interface solder joints on the substrate 10 are respectively located on the first and second surfaces of the substrate body.

[0083] Please also see Figure 9 , which is a cross-sectional view of another substrate structure provided in an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated in the figure with the same reference numerals.

[0084] like Figure 9 As shown, the first interface solder point 102a serving as the external electrical interface, that is, the external interface solder point, is located on the second side of the substrate body 101 opposite to the PCB, and is used for electrical connection with the PCB side; the second interface solder point 102b serving as the internal electrical interface, that is, the internal interface solder point, is located on the second side of the substrate body 101 opposite to the chip, and is used for electrical connection with the chip side.

[0085] In this embodiment, the outer surface of the substrate body 101 is covered with a moisture-proof layer 103, and each interface solder joint 102 is exposed to the moisture-proof layer 103. The first interface solder joint 102a is exposed to the moisture-proof layer 103 attached and fixed to the second side of the substrate body 101, and the second interface solder joint 102b is exposed to the moisture-proof layer 103 attached and fixed to the first side of the substrate body 101 to establish corresponding electrical connections.

[0086] Figure 9 The moisture barrier 103 shown in FIG. Figures 2 to 4 In other possible implementations, the substrate based on the interface solder joint configuration may also be used. Figures 5 to 8 The moisture barrier described. Similarly, Figure 9 Other structures and implementations of the substrate shown in the figure may be consistent with those described in the above embodiments, and will not be described in detail here.

[0087] In addition to being used for substrates for chip packaging, the aforementioned moisture-proof implementation solution can also be applied to moisture-proof processing of system-level packages.

[0088] In a system-level package application scenario, multiple devices are integrated and packaged on a substrate to form a system-level package. This also has the problem of moisture absorption affecting performance and reliability. Figure 10 , which is a schematic diagram of the structure of a system-level package provided by an embodiment of the present application. Taking the PSiP package as an example, the system-level package 100 includes a chip 110, an inductor 120, a capacitor (not shown) and other electronic components, which are integrated and assembled on a packaging substrate 130. Figure 10 As shown, each component can be mounted on both sides of the package substrate 130 and encapsulated in a package body 140 formed of an encapsulation material. Overall, power management is achieved with a smaller board area.

[0089] In a specific implementation, the packaging material may be an organic polymer, such as, but not limited to, resin, polyimide, or silicone grease. In other possible implementations, the internal architecture of the system-in-package 100 is not limited to that shown in the figure and may be determined based on the overall product design requirements. This is not limited in the present embodiment.

[0090] As a form of electronic circuit device, if a system-in-package (SIP) is left unpacked for a long time, delamination between the top passivation layer and the PI film within the package and the organic material absorbs moisture, a moisture film can form at the delamination point, causing a chip short circuit. In the case of PSiP, this can lead to power-on failure of the board, and subsequently to failure of servers or network communication devices.

[0091] In this embodiment, the package body 140 is a main body structure including organic materials. The outer peripheral surface of the package body 140 is covered with a moisture-proof layer 150. Specifically, the moisture-proof layer 150 is attached and fixed to the two side panels of the package body 140 and the outer peripheral side surface of the package body 140, forming a moisture-proof protection on the outer peripheral surface of the package body 140. Figure 10 As shown, the interface solder joints 160 of the system-level package 100 are exposed outside the moisture-proof layer 150 to achieve corresponding electrical connection with the single board side.

[0092] The moisture-proof layer 150 includes an organic film layer 150a and an inorganic film layer 150b, arranged sequentially from the inside out, forming a laminated structure. The organic film layer 150a is bonded to the outer surface of the moisture-proof layer 150, preventing dust from affecting the growth of the film layer on the surface of the package body 140, and ensuring a secure bond between the moisture-proof layer 150 and the package body 140.

[0093] Here, the selection of materials and forming processes of the organic film layer 150a and the inorganic film layer 150b can be Figures 2 to 4 The organic film layer and the inorganic film layer described in the same. At the same time, the thickness of the organic film layer 150a and the inorganic film layer 150b, as well as the specific number of layers can be determined according to the actual application scenario. This embodiment of the application is not limited.

[0094] The inorganic film layer 150b, with its low water vapor permeability, achieves excellent moisture resistance. Compared to solutions using organic materials to form a moisture-proof layer, the present embodiment, through its thinner laminated structure, effectively prevents moisture absorption by the package, thereby increasing the product's moisture-proof lifespan. Furthermore, due to the relatively thin structure of the moisture-proof layer, the thermal resistance is low, facilitating rapid heat dissipation and ensuring the heat dissipation capacity of the package. Furthermore, due to the ductility of the organic film layer 150a, the laminated moisture-proof layer 150 has a certain degree of flexibility, adapting to the stress changes caused by the heat and expansion of the device within the package. This effectively reduces the stress impact in different operating scenarios and prevents mechanical damage to the structure.

[0095] In general, on the one hand, the good moisture-proof ability of the moisture-proof layer formed based on inorganic materials can prevent the organic packaging material from absorbing moisture and affecting the reliability of system performance when the system-level package 100 is placed for a long time; on the other hand, during the use of the system-level package 100, the good heat dissipation ability provided by the thinner moisture-proof layer can meet the heat dissipation requirements of the components inside the package and avoid overheating that affects the performance of the components; at the same time, it can effectively reduce the stress caused by working heat, providing technical support for the high-density layout of the system-level package architecture.

[0096] To effectively manage the effects of stress, the organic and inorganic film layers 150a, 150b can be constructed from materials with a thermal expansion coefficient that matches that of the packaging material. During operation, the organic and inorganic film layers 150a, 150b deform in a manner consistent with that of the package body 140, preventing stress-induced delamination. Furthermore, the organic and inorganic film layers 150a, 150b can be constructed from materials with high thermal conductivity, which not only provides excellent moisture resistance but also enhances heat dissipation.

[0097] In the above embodiment, the moisture-proof layer 150 is fixed to the outer surface of the package body 140 by the organic film layer 150a. In other specific implementations, the moisture-proof layer 150 can also be fixed to the outer surface of the package body 140 by the inorganic film layer of the laminated structure. Figure 11 , which is a cross-sectional view of another system-level package provided by an embodiment of the present application. In order to clearly illustrate the differences and connections between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated in the figure with the same reference numerals.

[0098] like Figure 11 As shown, the moisture-proof layer 150 covering the outer surface of the package body 140 is formed by an inorganic film layer 150b and an organic film layer 150a arranged in sequence from the inside out, and is also a laminated structure of the moisture-proof layer 150. The inorganic film layer 150b is attached to and fixed to the outer surface of the package body 140, forming a more stable moisture-proof effect around the package body 140, and the organic film layer 150a covering the inorganic film layer 150b provides further protection.

[0099] Likewise, Figure 11The total number of layers of the stacked structure shown can be determined according to the actual moisture-proof requirements, for example but not limited to 2 to 10 layers. This is not limited in the embodiments of the present application. Specifically, the number of layers of the inorganic film layer 150b and the organic film layer 150a can be the same, and the outermost layer of the moisture-proof layer 150 formed is the organic film layer 150a, so as to protect the inorganic film layer 150b and prevent the inorganic film layer 150b from being damaged at high temperature and high humidity, thereby further increasing the moisture-proof period; the number of layers of the inorganic film layer 150b and the organic film layer 150a can also be different, and the outermost layer of the moisture-proof layer 150 formed is the inorganic film layer 150b (not shown in the figure).

[0100] Figure 11 Other configurations and implementations of the described system-level package can be combined with Figure 10 The system-level package described above is the same and will not be described here.

[0101] The moisture-proof layer in the aforementioned embodiment is formed by stacking an organic film layer 150a and an inorganic film layer 150b in sequence. In other specific implementations, inorganic film layers of different materials may be stacked in sequence. Figure 12 , which is a cross-sectional view of the structure of another system-level package provided by an embodiment of the present application. In order to clearly illustrate the difference and connection between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated with the same reference numerals in the figure.

[0102] like Figure 12 As shown, the moisture-proof layer 150 covering the outer surface of the package body 140 is formed from the inside out by a first inorganic film layer 150b1 and a second inorganic film layer 150b2, also forming a laminated structure. Compared to the previously described moisture-proof layer formed using organic and inorganic film layers, this embodiment further reduces the moisture vapor transmission rate of the moisture-proof layer, improving its moisture-proofing capabilities. Furthermore, due to the relatively stable covalent bonds formed between the inorganic materials, the bonding between adjacent film layers is strengthened, resulting in more stable and reliable applications. Furthermore, the thickness of the moisture-proof layer can be further reduced, facilitating heat dissipation.

[0103] In a specific implementation, the first inorganic film layer 150b1 and the second inorganic film layer 150b2 are made of inorganic materials such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, or hafnium oxide, and the two are made of different inorganic materials. For example, but not limited to, they can be deposited at low temperatures through techniques such as atomic layer deposition and chemical vapor deposition. Optionally, the thickness of the first inorganic film layer 150b1 and the second inorganic film layer 150b2 can be 1nm to 200nm, and the thickness of the two can be the same or different, which can be determined based on the actual application scenario. This embodiment of the present application is not limited thereto.

[0104] In other implementations, the first inorganic film layer 150b1 and the second inorganic film layer 150b2 stacked sequentially can be configured as other multiple layers, and the number of layers can be the same or different, and is not limited to the number of layers shown in the figure. For the laminated moisture-proof layer 150, the total number of layers can be determined based on actual moisture-proof requirements, for example, but not limited to, 2 to 10 layers.

[0105] Figure 12 The other structures and implementations of the described system-in-package can be consistent with those of the system-in-package described in the above embodiments, and will not be described in detail here.

[0106] The moisture-proof layer in each of the above embodiments is formed by stacking multiple layers of film layers in sequence. In other specific implementations, a single inorganic film layer can also be used to form the moisture-proof layer. Figure 13 , which is a cross-sectional view of another system-level package provided by an embodiment of the present application. In order to clearly illustrate the differences and connections between this embodiment and the aforementioned embodiments, components or structures with the same functions are indicated in the figure with the same reference numerals.

[0107] like Figure 13 As shown, moisture barrier 150 is formed by an inorganic film layer 150b, which covers the outer surface of package body 140. Interface solder joints 160 are exposed on moisture barrier 150 to establish corresponding electrical connections. This embodiment achieves excellent moisture resistance while further reducing manufacturing costs and providing high process reliability.

[0108] In a specific implementation, the inorganic film layer 150b can be made of an inorganic material such as aluminum oxide, silicon oxide, titanium oxide, zirconium oxide, or hafnium oxide, and can be deposited at low temperatures using, for example, but not limited to, atomic layer deposition or chemical vapor deposition. Optionally, the thickness of the inorganic film layer 150b can be 1 nm to 200 nm, which can be determined based on the actual application scenario and is not limited in this embodiment.

[0109] Figure 13 The other structures and implementations of the described system-in-package can be consistent with those of the system-in-package described in the above embodiments, and will not be described in detail here.

[0110] The substrate and system-level package described in the above embodiments can be widely used in different application scenarios. For example, electronic devices in various scenarios such as communications, servers, industry, rail transportation, and automation. Figure 14 , which is a structural diagram of an electronic device provided in an embodiment of the present application.

[0111] like Figure 14As shown, the electronic device 1000 includes a housing 1001 and a mainboard 1002 disposed in the housing 1001 . Functional components 1003 are disposed on the mainboard 1002 . The functional components 1003 include the electronic circuit components described above.

[0112] In a specific implementation, the functional device 1003 may be a device that uses the aforementioned Figures 2 to 7 and Figure 9 The device formed by the described substrate package may be, for example but not limited to, a functional device such as a CPU, a GPU, an ASIC or a SOC configured in an electronic device.

[0113] In another specific implementation, the functional device 1003 may also be as described above. Figures 10 to 13 The described system-level package, for example but not limited to, the functional device 1003 may be a power supply package module (PSiP) for supplying power to a mainboard and power devices on the mainboard.

[0114] It should be understood that other functions of the electronic device are not the core invention of this application, and those skilled in the art can implement them according to existing technologies, so they will not be described in detail herein.

[0115] In addition, the ordinal numbers "first" and "second" used herein are only used to describe components or structures with the same function in the technical solution. It is understood that the use of the above ordinal numbers does not constitute an understanding of the technical solution claimed in this application.

[0116] The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An electronic circuit device, characterized in that The electronic circuit device comprises a main body structure and an interface solder joint, wherein the main body structure comprises an organic material, and the interface solder joint is electrically connected to the main body structure; The outer peripheral surface of the main body structure is covered with a moisture-proof layer, the moisture-proof layer includes an inorganic film layer, and the interface welding point is exposed on the moisture-proof layer.

2. The electronic circuit device according to claim 1, wherein: The moisture-proof layer further includes an organic film layer, and the organic film layer and the inorganic film layer are stacked.

3. The electronic circuit device according to claim 2, wherein: The organic film layer and the inorganic film layer are both multi-layered, and the multi-layered organic film layer and the multi-layered inorganic film layer are sequentially stacked from the inside to the outside.

4. The electronic circuit device according to claim 2 or 3, characterized in that: The inner layer of the moisture-proof layer is an organic film layer.

5. The electronic circuit device according to claim 2 or 3, characterized in that: The inner layer of the moisture-proof layer is an inorganic film layer.

6. The electronic circuit device according to any one of claims 2 to 5, characterized in that The outer layer of the moisture-proof layer is an organic film layer.

7. The electronic circuit device according to any one of claims 2 to 6, characterized in that The thickness of the organic film layer is 0.1um to 100um.

8. The electronic circuit device according to claim 1, wherein: The moisture-proof layer includes a single inorganic film layer.

9. The electronic circuit device according to claim 1, wherein: The moisture-proof layer includes a first inorganic film layer and a second inorganic film layer that are stacked, and the first inorganic film layer and the second inorganic film layer are made of different inorganic materials.

10. The electronic circuit device according to claim 9, wherein: The first inorganic film layer and the second inorganic film layer are both multi-layered, and the multi-layered first inorganic film layer and the multi-layered second inorganic film layer are sequentially stacked from the inside to the outside.

11. The electronic circuit device according to any one of claims 1 to 10, characterized in that The thickness of the inorganic film layer is 1 nm to 200 nm.

12. The electronic circuit device according to any one of claims 1 to 11, characterized in that The electronic circuit device is a substrate for packaging chips, a substrate body of the substrate is the body structure, and the substrate body includes a first surface and a second surface that are oppositely arranged.

13. The electronic circuit device according to claim 12, wherein: The interface solder joints include external interface solder joints and internal interface solder joints, and the external interface solder joints and the internal interface solder joints are located on the first surface of the substrate body.

14. The electronic circuit device according to claim 12, wherein: The interface solder joints include external interface solder joints and internal interface solder joints. The external interface solder joints are located on the second surface of the substrate body, and the internal interface solder joints are located on the first surface of the substrate body.

15. The electronic circuit device according to any one of claims 1 to 11, characterized in that The electronic circuit device is a system-level package, in which the chip and electronic components of the system-level package are assembled on a package substrate. The chip, the electronic components and the package substrate are packaged in a package, which is the main body structure.

16. The electronic circuit device according to claim 15, wherein: The system-level package is a power supply package module.

17. An electronic device, characterized in that: The electronic device includes a housing and a mainboard arranged in the housing, and a functional device is arranged on the mainboard. The functional device includes the electronic circuit device according to any one of claims 1 to 11, or the functional device is formed by using the substrate package according to any one of claims 12 to 14, or the functional device is a system-level package according to claim 15 or 16.

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