A flexible circuit board press device for unmanned use

Abstract

The present application relates to the field of flexible circuit board production, and particularly relates to a flexible circuit board pressing device for unmanned driving, which comprises a main pressing table and an auxiliary pressing table, the main pressing table comprises a base, a flexible layer, an upper pressing plate and a hydraulic cylinder, the base corner is provided with a sliding column, the sliding column surface is slidably connected with the flexible layer and the upper pressing plate, the upper pressing plate is located above the flexible layer, the upper pressing plate top is provided with the hydraulic cylinder, the base and the auxiliary pressing table surface are slidably connected with a connecting strip, a multi-layer separated pressing mode is adopted, so that each layer can be uniformly heated, and the situation that heat cannot be transferred to the middle layer when multiple layers are pressed at the same time is avoided, secondly, the separated pressing of multiple layers is also beneficial to the gas discharge, the flexible circuit board is pressed in the center area of the flexible layer first, and then gradually diffused outward, so that most of the bubbles remaining in the interlayer can be discharged from the circuit board, not only the uniform pressing and heating are realized, but also the exhaust is more convenient.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board manufacturing, and more specifically to a flexible circuit board lamination device for autonomous driving. Background Technology

[0002] Circuit boards serve as mounting and communication components in circuits. They can be divided into two to five layers. The lengths of different lines within the circuit board can control the arrival time of different signals, and they are also responsible for signal transmission between various chips.

[0003] To produce multilayer circuit boards, a lamination process is required. A prepreg is pressed between two circuit boards, and the prepreg is melted by heating to bond the two circuit boards together. During this process, pressure is continuously applied to ensure that the prepreg layer makes full contact with the tiny rough surfaces of the circuit board.

[0004] However, due to the increasing requirements for the number of layers, although it is convenient and quick to complete the lamination of all layers in one go and save production time, the temperature of the outer layer is difficult to transfer to the center area of ​​the laminated circuit board during lamination. This results in a temperature difference between the inside and outside. Although the outside temperature seems to have been reached, the internal semi-cured layer has not fully flowed, which reduces the adhesion between the layers. Furthermore, if bending occurs during use, the layers will separate from each other. In addition, the flexible circuit board will also have air bubble problems due to the temperature difference, resulting in bulging air bubbles in the circuit board after production.

[0005] To address these issues, those skilled in the art have designed a flexible circuit board pressing device for autonomous driving. Summary of the Invention

[0006] To address the aforementioned technical shortcomings, the purpose of this invention is to provide a flexible circuit board pressing device for autonomous driving, which can be adapted to the welding of mesh sheets with different spacings.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: it includes a main pressure platform and a secondary pressure platform. The main pressure platform includes a base, a flexible layer, an upper pressure plate, and a hydraulic cylinder. A sliding column is provided at the corner of the base. The flexible layer and the upper pressure plate are slidably connected to the surface of the sliding column. The upper pressure plate is located above the flexible layer. A hydraulic cylinder is provided at the top of the upper pressure plate. A connecting strip is slidably connected to the surfaces of the base and the secondary pressure platform. A limit ring is provided on the surface of the connecting strip.

[0008] Preferably, the main pressure platform further includes a recessed layer, which is formed on the upper surface of the base. The upper surface of the secondary pressure platform is provided with a connecting groove that has the same width and depth as the recessed layer. The connecting strip forms a sliding connection with the connecting groove and the recessed layer.

[0009] Preferably, the main pressure platform is stacked on top of each other in at least two layers, with the lower hydraulic cylinder connected to the bottom of the upper base, and each layer of the main pressure platform is individually matched with a corresponding connecting strip.

[0010] Preferably, in the three-layer main pressure platform, the diameter of the limiting ring of each layer decreases sequentially from bottom to top, and the limiting rings between adjacent layers can be nested together.

[0011] Preferably, a take-up roller is provided on the side of the secondary pressure table away from the main pressure table, and the take-up roller can take up the connecting strip on each layer of the main pressure table. A positioning post is provided in the connecting groove on the surface of the secondary pressure table, and the height of the positioning post is lower than that of the limiting ring.

[0012] Preferably, the surface of the recessed layer is further provided with a limiting post, and the bottom of the limiting post is provided with a hydraulic lifting structure connected thereto. The outer wall of the limiting post and the limiting ring form a sliding connection. Holes corresponding to the limiting ring and the limiting post are opened on the surface of the flexible layer and the upper pressure plate.

[0013] Preferably, the main pressure table also includes a spring rod located on the upper surface of the upper pressure plate, with the telescopic end of the spring rod penetrating the upper pressure plate and connected to the center of the flexible layer.

[0014] Preferably, the flexible layer includes a straight plate, a hinge, and a limiting ball. The two sides of the hinge are fixedly connected to the limiting ball, and the four sides of the straight plate are slidably connected to the limiting ball through slots.

[0015] The beneficial effects of this invention are as follows: The multi-layer separate pressing method ensures that each layer is heated evenly, avoiding the situation where heat cannot be transferred to the middle layer when multiple layers are pressed at the same time. Secondly, pressing the multiple layers separately also facilitates the discharge of gas. By pressing the flexible circuit board first in the center area of ​​the flexible layer and then gradually pressing outward, most of the air bubbles left in the interlayer can be discharged from the circuit board. This not only achieves uniform pressing and heating but also makes air discharge more convenient.

[0016] Simultaneously, connecting strips and limiting rings are used to limit the flexible circuit board. By winding the connecting strip, the flexible circuit board is quickly slid to the bottom of the auxiliary pressing platform. Since the flexible circuit board is lightweight, this dragging and positioning method results in higher positioning and transportation efficiency. For intelligent equipment such as unmanned driving devices, this pressing method can better adapt to the high-temperature conditions that occur in the field of unmanned driving, ensuring the safety of the overall circuit and meeting the production needs of intelligent integrated circuits. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0018] Figure 1 This is a schematic diagram of the connecting strip of the present invention located on the main pressure platform.

[0019] Figure 2 This is a schematic diagram of the connecting strip of the present invention located on the auxiliary pressure platform.

[0020] Figure 3 This is a schematic diagram of the flexible layer structure of the present invention.

[0021] Figure 4 This is a schematic diagram of the superimposed structure of multiple limiting rings of the present invention.

[0022] Figure 5 This is a schematic diagram of the spring rod in the middle of the flexible layer of the present invention.

[0023] Figure 6 This is a schematic diagram showing that the edge of the circuit board of the present invention can be cut.

[0024] In the picture:

[0025] 1. Main pressure table; 101. Base; 102. Recessed layer; 103. Flexible layer; 1031. Straight plate; 1032. Hinge; 1033. Limit ball; 104. Upper pressure plate; 105. Hydraulic cylinder; 106. Limit post; 107. Spring rod; 2. Connecting strip; 201. Limit ring; 3. Secondary pressure table; 301. Positioning post; 4. Take-up roller. Detailed Implementation

[0026] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0028] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0029] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] Example 1: This invention provides a flexible circuit board lamination device for autonomous driving, such as... Figure 1-6 As shown, the system includes a main pressure platform 1 and a secondary pressure platform 3. The main pressure platform 1 includes a base 101, a flexible layer 103, an upper pressure plate 104, and a hydraulic cylinder 105. A sliding column is provided at the corner of the base 101. The flexible layer 103 and the upper pressure plate 104 are slidably connected to the surface of the sliding column. The upper pressure plate 104 is located above the flexible layer 103. The hydraulic cylinder 105 is provided at the top of the upper pressure plate 104. A connecting strip 2 is slidably connected to the surfaces of the base 101 and the secondary pressure platform 3. A limit ring 201 is provided on the surface of the connecting strip 2. The main pressure platform 1 also includes a recessed layer 102. Layer 102 is formed on the upper surface of base 101. The upper surface of the auxiliary pressure platform 3 is provided with a connecting groove with the same width and depth as the recessed layer 102. The connecting strip 2 forms a sliding connection with the connecting groove and the recessed layer 102. When the main pressure platform 1 presses the flexible circuit board separately, the connecting strip 2 is still in the recessed layer 102 on the base 101. The recessed layer 102 can maintain the plane line of the upper surface of the base 101 when the flexible layer 103 and the upper pressure plate 104 press the circuit board down, and avoid the flexible circuit board from being partially recessed after pressing due to the protrusion of the connecting strip 2.

[0031] The main pressing platform 1 is stacked with at least two layers in sequence. The number of layers of the main pressing platform 1 is designed according to the actual number of layers of the circuit board. Each main pressing platform 1 can press up to three layers. If more than three layers are pressed, the temperature of the outermost layer and the center will be uneven, resulting in the outer layer being hot enough while the center is not heated enough. The lower hydraulic cylinder 105 is connected to the bottom of the upper base 101. Each main pressing platform 1 is individually matched with a corresponding connecting strip 2. The flexible circuit board after each layer is pressed can be pulled individually through the individual connecting strip 2.

[0032] In the three-layer main pressure platform 1, the diameter of the limiting ring 201 of each layer decreases sequentially from bottom to top, and the limiting rings 201 between adjacent layers can be nested together. When the connecting strip 2 pulls multiple flexible circuit boards into the surface of the secondary pressure platform 3 from bottom to top, the limiting rings 201 will also nest sequentially from bottom to top, stacking the multiple flexible circuit boards together.

[0033] A take-up roller 4 is provided on the side of the secondary pressure table 3 away from the main pressure table 1, and the take-up roller 4 can take up the connecting strips 2 on each layer of the main pressure table 1. A positioning post 301 is provided in the connecting groove on the surface of the secondary pressure table 3, and the height of the positioning post 301 is lower than that of the limiting ring 201. The height of the positioning post 301 is also lower than the depth of the connecting groove on the surface of the secondary pressure table 3. When the secondary pressure table 3 performs the final pressing on the three-layer circuit board, the connecting groove can accommodate the three connecting strips 2 and the circuit board between the connecting strips 2. The flexible circuit board on the surface of the secondary pressure table 3 is subjected to heat pressing, and the three layers are formed into a complete flexible circuit board. The circuit board in the connecting groove is cut off, and the part remaining in the center is the final product.

[0034] The surface of the recessed layer 102 is also provided with a limiting post 106, and the bottom of the limiting post 106 is provided with a hydraulic lifting structure connected thereto. The outer wall of the limiting post 106 and the limiting ring 201 form a sliding connection. The limiting post 106 can be raised and lowered freely. By shrinking into the base 101, the restriction on the limiting ring 201 is removed, allowing the connecting strip 2 to be pulled out from the recessed layer 102. The flexible layer 103 and the upper pressure plate 104 are provided with holes corresponding to the limiting ring 201 and the limiting post 106. When the flexible layer 103 and the upper pressure plate 104 are pressed down, the corresponding holes can prevent the two from having a hard collision.

[0035] The main pressure table 1 also includes a spring rod 107 located on the upper surface of the upper pressure plate 104. The telescopic end of the spring rod 107 passes through the upper pressure plate 104 and is connected to the center of the flexible layer 103. The spring rod 107 is retractable. When the upper pressure plate 104 presses the flexible circuit board, the spring rod 107 can retract naturally. At the same time, the main function of the spring rod 107 is to ensure that the middle part of the flexible layer 103 contacts the surface of the circuit board first, squeezing the air in the middle to both sides, thereby expelling the circuit board before pressing.

[0036] The flexible layer 103 includes a straight plate 1031, a hinge 1032, and a limiting ball 1033. The two sides of the hinge 1032 are fixedly connected to the limiting ball 1033. The straight plate 1031 is slidably connected to the limiting ball 1033 through slots around its perimeter. The flexible layer 103 can be composed of multiple straight plates 1031 spliced ​​together and rotatably connected to each other through the hinge 1032. When pressed, the multiple straight plates 1031 will splice together to eliminate gaps, and the hinge 1032 will be hidden in the slots on the side of the straight plate 1031.

[0037] Working principle: In use, when the main pressing platform 1 has three layers, each layer presses the flexible circuit board. Each layer can press up to three layers of the flexible circuit board. The pre-set positioning holes on the circuit board are aligned with the limiting rings 201. The four limiting rings 201 limit the positioning holes at the four corners of the flexible circuit board. The main pressing platform 1 of each layer activates the hydraulic cylinder 105 to press the flexible circuit board through the flexible layer 103 and the upper pressing plate 104.

[0038] During the pressing process, the spring rod 107 applies moderate pressure to the middle of the flexible layer 103, causing the middle part of the flexible layer 103 to contact the flexible circuit board first and squeeze its central area first. As the flexible layer 103 gradually falls, the squeezed area will spread outward from the center. When it spreads outward, it will squeeze the gas in the center outward, causing the gas to be discharged outward.

[0039] When the upper pressure plate 104 presses the flexible circuit board completely, the entire flexible layer 103 will also press the flexible layer completely, and the three flexible circuit boards will be pressed into one sheet by heating.

[0040] After the flexible circuit boards of the three main pressing platforms 1 are all pressed together, the limiting post 106 on the bottom main pressing platform 1 is controlled to shorten into the interior of the main pressing platform 1. The winding roller 4 is controlled to wind up the connecting strip 2 on the bottom main pressing platform 1 separately, so that the bottom layer of flexible circuit board is fed into the upper surface of the auxiliary pressing platform 3 by the connecting strip 2. Then the connecting strip 2 on the middle layer of the main pressing platform 1 is wound up, and the limiting ring 201 on the middle layer of the connecting strip 2 is engaged with the limiting ring 201 of the lower layer, forming a large circle inside a small circle. Similarly, the connecting strip 2 on the top layer is wound up, and the three layers of flexible circuit boards are combined into a new overlapping flexible circuit board. It is then pressed again, and the flexible circuit board on the surface of the auxiliary pressing platform 3 is subjected to heat pressure, forming a complete flexible circuit board layer. The circuit board in the connecting groove is cut off, and the part in the center is the final product.

[0041] It should be stated that the above-described specific embodiments are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art should understand that various modifications, equivalent substitutions, and variations can be made to the present invention. However, such variations, as long as they do not depart from the spirit of the present invention, should be within the scope of protection of the present invention. Furthermore, some terminology used in this specification and claims is not limiting, but merely for ease of description.

Claims

1. A flexible circuit board lamination device for autonomous driving, characterized in that, It includes a main pressure platform (1) and a secondary pressure platform (3). The main pressure platform (1) includes a base (101), a flexible layer (103), an upper pressure plate (104), and a hydraulic cylinder (105). The base (101) has a sliding column at its corner. The flexible layer (103) and the upper pressure plate (104) are slidably connected on the surface of the sliding column. The upper pressure plate (104) is located above the flexible layer (103). The top of the upper pressure plate (104) is equipped with a hydraulic cylinder (105). The base (101) and the secondary pressure platform (3) are slidably connected with a connecting strip (2). The surface of the connecting strip (2) is provided with a limit ring (201). In the three-layer main pressure platform (1), the diameter of the limiting ring (201) of each layer decreases sequentially from bottom to top, and the limiting rings (201) between adjacent layers can be nested together. A take-up roller (4) is provided on the side of the secondary pressure table (3) away from the main pressure table (1), and the take-up roller (4) can take up the connecting strip (2) on each layer of the main pressure table (1). A positioning post (301) is provided in the connecting groove on the surface of the secondary pressure table (3), and the height of the positioning post (301) is lower than that of the limiting ring (201). The flexible layer (103) includes a straight plate (1031), a hinge (1032) and a limiting ball (1033). The hinge (1032) is fixedly connected to the limiting ball (1033) on both sides. The straight plate (1031) is slidably connected to the limiting ball (1033) around its perimeter through slots.

2. The flexible circuit board laminating device for unmanned driving according to claim 1, characterized in that, The main pressure platform (1) also includes a recessed layer (102), which is opened on the upper surface of the base (101). The upper surface of the secondary pressure platform (3) is provided with a connecting groove with the same width and depth as the recessed layer (102). The connecting strip (2) forms a sliding connection with the connecting groove and the recessed layer (102).

3. The flexible circuit board lamination device for unmanned driving according to claim 1, characterized in that, The main pressure platform (1) is stacked on top of each other at least two layers. The lower hydraulic cylinder (105) is connected to the bottom of the upper base (101). Each layer of the main pressure platform (1) is individually matched with a corresponding connecting strip (2).

4. The flexible circuit board pressing device for unmanned driving according to claim 2, characterized in that, The surface of the recessed layer (102) is also provided with a limiting post (106), and the bottom of the limiting post (106) is provided with a hydraulic lifting structure connected thereto. The outer wall of the limiting post (106) and the limiting ring (201) form a sliding connection. The flexible layer (103) and the upper pressure plate (104) are provided with holes corresponding to the limiting ring (201) and the limiting post (106).

5. The flexible circuit board laminating device for unmanned driving according to claim 1, characterized in that, The main pressure table (1) also includes a spring rod (107) located on the upper surface of the upper pressure plate (104). The telescopic end of the spring rod (107) passes through the upper pressure plate (104) and is connected to the center of the flexible layer (103).

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