Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate, an isolation structure, a light-emitting layer and a first packaging layer. The isolation structure is arranged on the substrate and forms a plurality of isolation openings in a surrounding mode so that the light-emitting layer can be separated to form light-emitting units which are disconnected with one another. The first packaging layer comprises packaging parts which are mutually spaced, and at least part of the packaging parts are located in the isolation openings so as to package the light-emitting units. The packaging part comprises a first segment and a second segment which are connected with each other, the orthographic projection of the top surface of the isolation structure on the substrate has a first width D1, the orthographic projection of the second segment on the substrate has a second width D2, and the first width D1 and the second width D2 meet the condition that the width of the second packaging part is further increased relative to the width of the second packaging part in the related technology; the contact area of the second packaging layer and the second segment is increased, so that the adhesive force between the second packaging layer and the second segment is increased.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body, and wide range of applications, becoming the mainstream display device.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the performance of OLED display products.

[0005] In a first aspect, an embodiment of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening and having a top surface facing away from the substrate; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising light-emitting units located in the isolation opening; and a first encapsulation layer comprising an encapsulation portion for encapsulating each light-emitting unit, the encapsulation portion comprising a first segment and a second segment connected to each other, at least a portion of the first segment being located in the isolation opening, and the second segment being located on a side of the isolation structure facing away from the substrate, wherein, in a direction from the isolation opening to the adjacent isolation opening, an orthographic projection of the top surface on the substrate has a first width D1, and an orthographic projection of the second segment on the substrate has a second width D2, and the first width D1 and the second width D2 satisfy the following conditions:

[0006] According to the implementation of the first aspect of the present application, the second segments of the packaging parts corresponding to two adjacent light-emitting units are spaced apart from each other; or, the orthographic projections of the second segments of the packaging parts corresponding to adjacent light-emitting units on the substrate at least partially overlap.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the first segment includes a first main body and a first side wall, the first side wall is connected to the first main body and the second segment, and the first side wall is inclined near the isolation opening in the direction from the second segment toward the first main body.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the second segments of the packaging parts corresponding to adjacent light-emitting units at least partially overlap in the orthographic projection of the substrate, and the second segments include a second main body, a second side wall and an extension part, the second side wall is connected to the second main body and the extension part, and the extension part is located on the side of the second main body facing away from the substrate.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the extension portion on the substrate at least partially overlaps with the orthographic projection of the second segment of the packaging portion corresponding to the adjacent light-emitting unit on the substrate.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of the second main body portion on the substrate is spaced apart from the orthographic projection of the second segment of the packaging portion corresponding to the adjacent light-emitting unit on the substrate.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the second main body is connected to the first side wall and the second side wall.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the second segments on the circumferential side of the light-emitting units with the same luminous color have the same second width.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit with different colors, and the second segments around the first light-emitting unit have the same second width.

[0014] According to any of the foregoing embodiments of the first aspect of the present application, the second width of the second segment on the circumferential side of the first light-emitting unit is the first sub-width d1, and the second width of the second segment located in the packaging portion of the second light-emitting unit on the side facing away from the substrate, close to the first light-emitting unit, is the second sub-width d2, wherein the first sub-width and the second sub-width satisfy: d1≤d2.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the first sub-width d1 and the first width D1 satisfy:

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the second sub-width d2 and the first width D1 satisfy: or,

[0017] According to any of the foregoing embodiments of the first aspect of the present application, the second width of the second segment on the circumferential side of the first light-emitting unit is the first sub-width d1, and the second width of the second segment located in the packaging portion of the third light-emitting unit away from the substrate is the third sub-width d3, wherein the first sub-width d1 and the third sub-width d3 satisfy: d1≤d3.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the third sub-width d3 and the first width D1 satisfy: or,

[0019] According to any of the foregoing embodiments of the first aspect of the present application, in the packaging portion located on the side of the second light-emitting unit facing away from the substrate, the second width of the second segment close to the third light-emitting unit is the fourth sub-width d4, and in the packaging portion located on the side of the third light-emitting unit facing away from the substrate, the second width of the second segment close to the second light-emitting unit is the fifth sub-width d5, wherein the fourth sub-width d4 and the fifth sub-width d5 ​​satisfy: d4≤d5.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, the fourth sub-width d4 and the first width D1 satisfy:

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the fifth sub-width d5 ​​and the first width D1 satisfy: or,

[0022] According to any of the aforementioned embodiments of the first aspect of the present application, there is a gap between the second segment and the isolation structure, and the light-emitting layer further includes redundant units, which are located on the side of the isolation structure away from the substrate, and at least part of the redundant units are located in the gap.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the redundant units enclose a hollow portion, and the orthographic projection of the hollow portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a first electrode layer, including a first electrode located in the isolation opening, the first electrode being located between the light-emitting unit and the packaging portion and electrically connected to the isolation structure.

[0025] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of each light-emitting unit on the substrate is located within the orthographic projection of each first electrode on the substrate.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit and the isolation structure are spaced apart.

[0027] According to any of the aforementioned embodiments of the first aspect of the present application, the first electrode layer further includes a redundant electrode, which is located on a side of the isolation structure facing away from the substrate, and at least part of the redundant electrode is located in the gap.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer, the second layer is located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, along a direction from an isolation opening to an adjacent isolation opening, an orthographic projection of the second layer on the substrate has a first width D1.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the first layer includes a conductive material.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the second layer includes a conductive material or an insulating material.

[0032] According to any of the aforementioned embodiments of the first aspect of the present application, the first layer and the second layer both include metal materials, and the materials of the first layer and the second layer are different.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the first encapsulation layer includes an inorganic material.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a second encapsulation layer, located on the side of the first encapsulation layer facing away from the substrate, the second encapsulation layer is in contact with the isolation structure; and a third encapsulation layer, located on the side of the second encapsulation layer facing away from the substrate.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the second encapsulation layer includes an organic material.

[0037] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the third encapsulation layer includes an inorganic material.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes: a pixel definition layer located on the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, and the pixel opening and the isolation opening are connected.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel further includes a second electrode, and the second electrode is exposed by the pixel opening.

[0040] Another embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening; the isolation structure comprising a first layer and a second layer, the second layer located on a side of the first layer facing away from the substrate, an orthographic projection of the first layer on the substrate located within an orthographic projection of the second layer on the substrate, and an orthographic projection of the second layer on the substrate having a first width D1 in a direction pointing from the isolation opening to an adjacent isolation opening; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising light-emitting units located in the isolation opening; a first encapsulation layer comprising an encapsulation portion spaced apart from each other and used to encapsulate each light-emitting unit, the encapsulation portion comprising a first segment and a second segment, at least a portion of the first segment located in the isolation opening, the second segment located on a side of the isolation structure facing away from the substrate, and an orthographic projection of the second segment on the substrate having a second width D2 in a direction pointing from the isolation opening to an adjacent isolation opening, wherein the second width D2 and the first width D1 satisfy the following conditions:

[0041] An embodiment of the second aspect of the present application provides a display device, which includes the display panel of any of the above embodiments.

[0042] An embodiment of a third aspect of the present application provides a method for manufacturing a display panel, the method comprising:

[0043] An isolation structure is prepared on the substrate, wherein the isolation structure encloses an isolation opening and has a top surface facing away from the substrate, and an orthographic projection of the top surface on the substrate in a direction from the isolation opening to the adjacent isolation opening has a first width D1;

[0044] A light-emitting layer is prepared on a substrate, wherein the light-emitting layer includes light-emitting units located in the isolation openings;

[0045] A first encapsulation layer is prepared on the substrate. The first encapsulation layer includes an encapsulation portion configured and used to encapsulate each light-emitting unit. The encapsulation portion includes a first segment and a second segment. At least a portion of the first segment is located at the isolation opening. The second segment is located on a side of the isolation structure away from the substrate and points along the isolation opening toward the adjacent isolation opening. The orthographic projection of the second segment on the substrate has a second width D2, wherein the second width D2 and the first width D1 satisfy:

[0046]

[0047] According to an embodiment of the third aspect of the present application, the light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit of different colors, and the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening. After the step of preparing the isolation structure on the substrate, the method further includes:

[0048] A first light-emitting material layer and a first encapsulation material layer are prepared on the substrate, and the first light-emitting material layer and the first encapsulation material layer are patterned to obtain a first light-emitting unit and an encapsulation portion located in the first isolation opening, wherein the second segments around the first light-emitting unit have the same second width;

[0049] A second light-emitting material layer and a second encapsulation material layer are prepared on the substrate, and the second light-emitting material layer and the second encapsulation material layer are patterned to obtain a second light-emitting unit and an encapsulation portion located in the second isolation opening. The second width of the second segment on the peripheral side of the first light-emitting unit is a first sub-width d1. The second width of the second segment located in the encapsulation portion on a side of the second light-emitting unit facing away from the substrate and close to the first light-emitting unit is a second sub-width d2. The first sub-width d1 and the second sub-width d2 satisfy the following conditions:

[0050] d1≤d2.

[0051] According to any of the aforementioned embodiments of the third aspect of the present application, after the step of preparing the second light-emitting material layer and the second encapsulation material layer on the substrate, the method further includes:

[0052] A third light-emitting material layer and a third encapsulation material layer are prepared on the substrate, and the third light-emitting material layer and the third encapsulation material layer are patterned to obtain a third light-emitting unit and an encapsulation portion located in the third isolation opening. The second width of the second segment located in the encapsulation portion on a side of the third light-emitting unit facing away from the substrate and close to the first light-emitting unit is a third sub-width d3, wherein the first sub-width d1 and the third sub-width d3 satisfy:

[0053] d1≤d3.

[0054] According to any of the foregoing embodiments of the third aspect of the present application, in the encapsulation portion located on a side of the second light-emitting unit facing away from the substrate, the second width of the second segment near the third light-emitting unit is a fourth sub-width d4, and in the encapsulation portion located on a side of the third light-emitting unit facing away from the substrate, the second width of the second segment near the second light-emitting unit is a fifth sub-width d5, wherein the fourth sub-width d4 and the fifth sub-width d5 ​​satisfy:

[0055] d4≤d5.

[0056] According to the display panel of the embodiment of the present application, the display panel includes a substrate, an isolation structure, a light-emitting layer and a first encapsulation layer. The isolation structure is provided on the substrate and encloses a plurality of isolation openings to separate the light-emitting layer to form mutually disconnected light-emitting units, thereby reducing the crosstalk of carriers in the light-emitting layer and improving the display effect of the display panel. In addition, the light-emitting units do not need to be prepared using a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs. The first encapsulation layer includes encapsulation portions spaced apart from each other, and at least part of the encapsulation portion is located in the isolation opening to encapsulate the light-emitting unit. The encapsulation portion includes a first segment and a second segment that are interconnected, and the top surface of the isolation structure has a first width D1 in the orthographic projection on the substrate, and the second segment has a second width D2 in the orthographic projection on the substrate. The first width D1 and the second width D2 satisfy: The second width D2 of the second segment satisfies this range, so that the second encapsulation part is further lengthened relative to the width in the related art, so that when the second encapsulation layer of the organic material is subsequently prepared, the contact area between the second encapsulation layer and the second segment is increased, thereby increasing the adhesion between the second encapsulation layer and the second segment, improving the problem of the second encapsulation layer easily falling off and causing bubbling in a high temperature and high humidity environment, and improving the performance of the OLED display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0058] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0059] Figure 2 is a partial top view of a display panel provided in an embodiment of the present application;

[0060] Figure 3 is a partial cross-sectional view of a display panel in another embodiment;

[0061] Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment;

[0062] Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment;

[0063] Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment;

[0064] Figure 7 is a partial cross-sectional view of a display panel in yet another embodiment;

[0065] Figure 8 is a partial cross-sectional view of a display panel in yet another embodiment;

[0066] Figure 9 is a partial cross-sectional view of a display panel in yet another embodiment;

[0067] Figure 10 is a partial cross-sectional view of a display panel in yet another embodiment;

[0068] Figure 11 is a partial cross-sectional view of a display panel in yet another embodiment;

[0069] Figure 12 is a partial cross-sectional view of a display panel in yet another embodiment;

[0070] Figure 13 This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application.

[0071] Description of reference numerals:

[0072] 10. Display panel;

[0073] 100. Substrate;

[0074] 200, isolation structure; 201, top surface; 210, first layer; 220, second layer; 230, third layer; 240, isolation opening;

[0075] 300, light-emitting layer; 310, light-emitting unit; 311, first light-emitting unit; 312, second light-emitting unit; 313, third light-emitting unit; 320, redundant unit;

[0076] 400, first encapsulation layer; 410, encapsulation portion; 411, first segment; 412, second segment; 413, first sidewall; 414, first main body; 415, second sidewall; 416, second main body; 417, extension portion; 418, gap;

[0077] 420, second encapsulation layer; 430, third encapsulation layer;

[0078] 500, first electrode layer; 510, first electrode; 520, redundant electrode;

[0079] 600, pixel definition layer; 610, pixel defining portion; 620, pixel opening; 630, second electrode;

[0080] D1, first width; D2, second width; d1, first sub-width; d2, second sub-width; d3, third sub-width; d4, fourth sub-width; d5, fifth sub-width. DETAILED DESCRIPTION

[0081] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0082] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" the other layer or region.

[0083] Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. Hereinafter, various embodiments of the display panel, the display device, and the method for manufacturing a display panel will be described with reference to the accompanying drawings.

[0084] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0085] Please also refer to Figure 1 and Figure 2 , Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application; Figure 2 This is a partial top view of a display panel provided in an embodiment of the present application.

[0086] like Figure 1 and Figure 2In a first aspect of the present application, an embodiment provides a display panel 10, comprising: a substrate 100; an isolation structure 200, located on one side of the substrate 100, the isolation structure 200 enclosing an isolation opening 240 and having a top surface 201 facing away from the substrate 100; a light-emitting layer 300, located on one side of the substrate 100, the light-emitting layer 300 comprising light-emitting units 310 located in the isolation opening 240; a first encapsulation layer 400, comprising an encapsulation portion 410 for encapsulating each light-emitting unit 310, and an encapsulation layer 410 for encapsulating each light-emitting unit 310. Portion 410 includes a first segment 411 and a second segment 412 connected to each other. At least a portion of the first segment 411 is located on the isolation opening 240, and the second segment 412 is located on a side of the isolation structure 200 facing away from the substrate 100. In a direction from the isolation opening 240 to the adjacent isolation opening 240, the orthographic projection of the top surface 201 on the substrate 100 has a first width D1, and the orthographic projection of the second segment 412 on the substrate 100 has a second width D2. The first width D1 and the second width D2 satisfy the following conditions:

[0087] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, and a first encapsulation layer 400. The isolation structure 200 is arranged on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting units 310 do not need to be prepared using a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs. The first encapsulation layer 400 includes mutually spaced encapsulation portions 410, at least part of which is located within the isolation opening 240 to encapsulate the light-emitting units 310. The encapsulation portion 410 includes a first segment 411 and a second segment 412 connected to each other. The orthographic projection of the top surface 201 of the isolation structure 200 on the substrate 100 has a first width D1, and the orthographic projection of the second segment 412 on the substrate 100 has a second width D2. The first width D1 and the second width D2 satisfy: The second width D2 of the second segment 412 satisfies this range, so that the second encapsulation part 410 is further lengthened relative to the width in the related art. Therefore, when the second encapsulation layer 420 of the organic material is subsequently prepared, the contact area between the second encapsulation layer 420 and the second encapsulation part 410 is increased, thereby increasing the adhesion between the second encapsulation layer 420 and the second encapsulation part 410, improving the problem of the second encapsulation layer 420 being prone to film shedding and bubbling in a high temperature and high humidity environment, and improving the performance of the OLED display panel 10.

[0088] like Figure 2As shown, a plurality of isolation openings 240 are arranged at intervals along the row direction and the column direction, and the direction from an isolation opening 240 to an adjacent isolation opening 240 is the row direction or the column direction.

[0089] There are many ways to configure the substrate 100. For example, the substrate 100 may include a substrate and an array substrate disposed on the substrate. Alternatively, the substrate 100 may be the substrate. Alternatively, the substrate 100 may include a buffer layer and a support plate on a side facing away from the substrate.

[0090] Please also refer to Figures 1 to 3 , Figure 3 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0091] like Figures 1 to 3 As shown, the second segment 412 can be arranged in various ways. For example, in some optional embodiments, the second segments 412 of the packaging parts 410 corresponding to two adjacent light-emitting units 310 are arranged at intervals from each other; or, the second segments 412 of the packaging parts 410 corresponding to adjacent light-emitting units 310 at least partially overlap in their orthographic projections on the substrate 100.

[0092] In these optional embodiments, the second segments 412 of the encapsulation portion 410 corresponding to two adjacent light-emitting units 310 are spaced apart from each other, allowing the etching solution to easily pass between the two adjacent second segments 412, thereby etching the portions of the light-emitting layer 300 and the first electrode layer 500 located on the side of the isolation structure 200 facing away from the substrate 100. The second segments 412 of the encapsulation portion 410 corresponding to two adjacent light-emitting units 310 at least partially overlap in their orthographic projections on the substrate 100, further increasing the width of the second segments 412. This further increases the contact area between the second encapsulation layer 420 and the second segments 412 during the subsequent preparation of the second encapsulation layer 420 of organic material, thereby enhancing the adhesion between the second encapsulation layer 420 and the second segments 412, and improving the problem of film shedding and bubbling of the second encapsulation layer 420 in high temperature and high humidity environments, thereby improving the performance of the OLED display panel 10.

[0093] like Figure 3 As shown, in some optional embodiments, the first segment 411 includes a first main body portion 414 and a first side wall 413, the first side wall 413 is connected to the first main body portion 414 and the second segment 412, and the first side wall 413 is inclined near the isolation opening 240 along the direction of the second segment 412 toward the first main body portion 414.

[0094] The first side wall 413 is tilted near the isolation opening 240 in the direction from the second segment 412 toward the first main body 414, which means that one end of the first side wall 413 is connected to the first main body 414, and the other end is connected to the second segment 412, and the extension direction of the first side wall 413 is the direction from the second segment 412 toward the first main body 414. The tilting of the first side wall 413 near the isolation opening 240 means that in the direction from the second segment 412 toward the first main body 414, the horizontal distance between the first side wall 413 and the isolation opening 240 where the first main body 414 connected to it is located becomes smaller and smaller.

[0095] In these optional embodiments, the first side wall 413 is tilted along the direction of the second segment 412 toward the first main body 414 close to the isolation opening 240, so that the second segment 412 is arranged close to the isolation structure 200, which can improve the stability of the second segment 412 and thereby improve the problem of the second segment 412 being prone to film shedding.

[0096] See also Figure 4 , Figure 4 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0097] like Figure 4 As shown, in some optional embodiments, the second segments 412 of the packaging portions 410 corresponding to adjacent light-emitting units 310 at least partially overlap in their orthographic projections on the substrate 100, and the second segments 412 include a second main body portion 416, a second side wall 415, and an extension portion 417, the second side wall 415 is connected to the second main body portion 416 and the extension portion 417, and the extension portion 417 is located on the side of the second main body portion 416 facing away from the substrate 100.

[0098] In these optional embodiments, a second side wall 415 and an extension portion 417 are further provided on the second main body 416 of the second segment 412, so that when a second encapsulation layer 420 of organic material is subsequently prepared, the second encapsulation layer 420 can be in contact with the second main body 416, the second side wall 415 and the extension portion 417, thereby further increasing the contact area between the second encapsulation layer 420 and the second segment 412, thereby increasing the adhesion between the second encapsulation layer 420 and the second segment 412, and improving the problem of the second encapsulation layer 420 being prone to film shedding and bubbling in a high temperature and high humidity environment.

[0099] In some optional embodiments, an orthographic projection of the extension portion 417 on the substrate 100 at least partially overlaps with an orthographic projection of the second segment 412 of the encapsulation portion 410 corresponding to an adjacent light-emitting unit 310 on the substrate 100 .

[0100] In these optional embodiments, the orthographic projection of the extension portion 417 on the substrate 100 at least partially overlaps with the orthographic projection of the second segment 412 of the packaging portion 410 corresponding to the adjacent light-emitting unit 310 on the substrate 100. On the one hand, the contact area between the second segment 412 and the second packaging layer 420 can be further increased. On the other hand, the extension portion 417 and the adjacent second segment 412 are separated in the thickness direction to form a slit. When an etching liquid is subsequently used to etch the first electrode layer 500 and the light-emitting layer 300 located on the side of the isolation structure 200 away from the substrate 100, the etching liquid's travel path is extended, which can reduce the etching of the first electrode layer 500 and the light-emitting layer 300 located on the side of the isolation structure 200 away from the substrate 100 by the etching liquid, thereby reducing the contact area between the second packaging layer 420 and the isolation structure 200, and reducing the possibility of the second packaging layer 420 falling off the surface of the isolation structure 200.

[0101] Optionally, the orthographic projection of the second main body portion 416 on the substrate 100 and the orthographic projection of the second segment 412 of the packaging portion 410 corresponding to the adjacent light-emitting unit 310 on the substrate 100 are arranged at intervals, so that the second segments 412 of adjacent packaging portions 410 are arranged at intervals, and the second packaging layer 420 can fill the gap between the second segment 412 and the isolation structure 200 and contact the packaging portion 410 in the gap, thereby increasing the contact area between the second packaging layer 420 and the packaging portion 410 and improving the adhesion between the second packaging layer 420 and the packaging portion 410.

[0102] Optionally, the second main body portion 416 is connected to the first side wall 413 and the second side wall 415 .

[0103] See also Figure 5 , Figure 5 FIG. 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0104] like Figure 5 As shown, optionally, the second segments 412 around the light-emitting units 310 with the same luminous color have the same second width, which facilitates the preparation of the first encapsulation layer 400, simplifies the preparation process, and can improve the encapsulation uniformity of the first encapsulation layer 400 for each light-emitting unit 310.

[0105] Optionally, the light-emitting unit 310 includes a first light-emitting unit 311, a second light-emitting unit 312, and a third light-emitting unit 313 of different colors, and the second segments 412 around the first light-emitting unit 311 have the same second width. For example, the first light-emitting unit 311 is a red light-emitting unit 310, the second light-emitting unit 312 is a green light-emitting unit 310, and the third light-emitting unit 313 is a blue light-emitting unit 310.

[0106] like Figure 5As shown, in some optional embodiments, the second width of the second segment 412 on the peripheral side of the first light-emitting unit 311 is a first sub-width d1, and the second width of the second segment 412 located in the packaging portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 and close to the first light-emitting unit 311 is a second sub-width d2, wherein the first sub-width and the second sub-width satisfy: d1≤d2.

[0107] In these optional embodiments, in the packaging portion 410 located on the side of the second light-emitting unit 312 facing away from the substrate 100, the second sub-width d2 of the second segment 412 is greater than or equal to the first sub-width d1 of the second segment 412 on the circumferential side of the first light-emitting unit 311, that is, the second segment 412 of the packaging portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 is further lengthened on the side close to the first light-emitting unit 311, thereby increasing the contact area between the packaging portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 and the second packaging layer 420, thereby increasing the adhesion between the second packaging layer 420 and the second segment 412 corresponding to the second light-emitting unit 312.

[0108] The second segment 412 corresponding to the first light-emitting unit 311 refers to the second segment 412 in the packaging portion 410 located on the side of the first light-emitting unit 311 facing away from the substrate 100; the second segment 412 corresponding to the second light-emitting unit 312 refers to the second segment 412 in the packaging portion 410 located on the side of the second light-emitting unit 312 facing away from the substrate 100; the second segment 412 corresponding to the third light-emitting unit 313 refers to the second segment 412 in the packaging portion 410 located on the side of the third light-emitting unit 313 facing away from the substrate 100;

[0109] In some optional embodiments, the first sub-width d1 and the first width D1 satisfy:

[0110] In these optional embodiments, the first sub-width d1 is greater than or equal to one-third of the first width D1, which can prevent the first sub-width d1 from being too small, resulting in a small contact area between the second segment 412 corresponding to the first light-emitting unit 311 and the second encapsulation layer 420, low adhesion, and the second encapsulation layer 420 being susceptible to film shedding and blistering in high temperature and high humidity environments. The first sub-width d1 is less than or equal to one-half of the first width D1, which can prevent the first sub-width d1 from being too large. If the first sub-width d1 is too large, when the encapsulation portion 410 corresponding to the second light-emitting unit 312 and the third light-emitting unit 313 is subsequently prepared, the second segments 412 corresponding to the second light-emitting unit 312 or the third light-emitting unit 313 will be more likely to be located on the side of the second segment 412 corresponding to the first light-emitting unit 311 facing away from the substrate 100. The larger number of second segments 412 will be farther away from the isolation structure 200, making the second segments 412 more susceptible to film shedding when subjected to external impact.

[0111] In addition, the second light emitting unit 312 may be located between the first light emitting unit 311 and the third light emitting unit 313 .

[0112] Please also refer to Figure 5 and Figure 6 , Figure 6 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0113] like Figure 5 and Figure 6 As shown, in some optional embodiments, the second sub-width d2 and the first width D1 satisfy: or,

[0114] In these optional embodiments, the second sub-width d2 is greater than or equal to one-third of the first width D1, which can prevent the second sub-width d2 from being too small, resulting in an excessively small contact area between the second segment 412 corresponding to the second light-emitting unit 312 and the second encapsulation layer 420, and low adhesion, which can cause the second encapsulation layer 420 to easily peel off and cause bubbling in a high temperature and high humidity environment. The second sub-width d2 is greater than or equal to one-half of the first width D1, that is, the second segment 412 of the encapsulation portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 is further lengthened on the side closer to the first light-emitting unit 311, thereby increasing the contact area between the encapsulation portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 and the second encapsulation layer 420, thereby increasing the adhesion between the second encapsulation layer 420 and the second segment 412 corresponding to the second light-emitting unit 312.

[0115] Please refer to the figure Figure 7 and Figure 8 , Figure 7is a partial cross-sectional view of a display panel in yet another embodiment; Figure 8 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0116] like Figure 7 and Figure 8 As shown, in some optional embodiments, the second width of the second segment 412 on the peripheral side of the first light-emitting unit 311 is the first sub-width d1, and the second width of the second segment 412 located in the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100, close to the first light-emitting unit 311, is the third sub-width d3, wherein the first sub-width d1 and the third sub-width d3 satisfy: d1≤d3.

[0117] In these optional embodiments, in the packaging portion 410 located on the side of the third light-emitting unit 313 facing away from the substrate 100, the third sub-width d3 of the second segment 412 is greater than or equal to the first sub-width d1 of the second segment 412 on the circumferential side of the first light-emitting unit 311, that is, the second segment 412 of the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 is further lengthened on the side close to the first light-emitting unit 311, thereby increasing the contact area between the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 and the second packaging layer 420, thereby increasing the adhesion between the second packaging layer 420 and the second segment 412 corresponding to the third light-emitting unit 313.

[0118] like Figure 7 and Figure 8 As shown, in some optional embodiments, the third sub-width d3 and the first width D1 satisfy: or,

[0119] In these optional embodiments, the third sub-width d3 is greater than or equal to one-third of the first width D1, which can prevent the second sub-width d2 from being too small, resulting in an excessively small contact area between the second segment 412 corresponding to the third light-emitting unit 313 and the second encapsulation layer 420, and low adhesion, which can cause the second encapsulation layer 420 to easily peel off and cause bubbling in a high temperature and high humidity environment. The third sub-width d3 is greater than or equal to one-half of the first width D1, that is, the second segment 412 of the encapsulation portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 is further extended on the side closer to the first light-emitting unit 311, thereby increasing the contact area between the encapsulation portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 and the second encapsulation layer 420, thereby increasing the adhesion between the second encapsulation layer 420 and the second segment 412 corresponding to the third light-emitting unit 313.

[0120] Please also refer to Figure 9 and Figure 10 , Figure 9is a partial cross-sectional view of a display panel in yet another embodiment; Figure 10 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0121] like Figure 9 and Figure 10 As shown, in some optional embodiments, in the packaging portion 410 located on the side of the second light-emitting unit 312 facing away from the substrate 100, the second width of the second segment 412 close to the third light-emitting unit 313 is a fourth sub-width d4, and in the packaging portion 410 located on the side of the third light-emitting unit 313 facing away from the substrate 100, the second width of the second segment 412 close to the second light-emitting unit 312 is a fifth sub-width d5, wherein the fourth sub-width d4 and the fifth sub-width d5 ​​satisfy: d4≤d5.

[0122] In these optional embodiments, the fifth sub-width d5 ​​is greater than or equal to the fourth sub-width d4, that is, the second segment 412 of the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 is further lengthened on the side close to the second light-emitting unit 312, thereby increasing the contact area between the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 and the second packaging layer 420, thereby increasing the adhesion between the second packaging layer 420 and the second segment 412 corresponding to the third light-emitting unit 313.

[0123] In some optional embodiments, the fourth sub-width d4 and the first width D1 satisfy:

[0124]

[0125] In these optional embodiments, the fourth sub-width d4 is greater than or equal to one-third of the first width D1, which can prevent the fourth sub-width d4 from being too small, resulting in an excessively small contact area between the second segment 412 corresponding to the second light-emitting unit 312 and the second encapsulation layer 420, and low adhesion, which can cause the second encapsulation layer 420 to easily peel off and cause bubbling in a high temperature and high humidity environment. The fourth sub-width d4 is less than or equal to one-half of the first width D1, which can prevent the fourth sub-width d4 from being too large, resulting in the subsequent preparation of the encapsulation portion 410 corresponding to the third light-emitting unit 313. The second segment 412 corresponding to the third light-emitting unit 313 will be more located on the side of the second segment 412 corresponding to the second light-emitting unit 312 facing away from the substrate 100. The larger number of second segments 412 is farther away from the isolation structure 200, making the second segments 412 more likely to peel off when subjected to external impact.

[0126] like Figure 9 and Figure 10 As shown, in some optional embodiments, the fifth sub-width d5 ​​and the first width D1 satisfy: or,

[0127] In these optional embodiments, the fifth sub-width d5 ​​is greater than or equal to one-third of the first width D1, which can prevent the fifth sub-width d5 ​​from being too small, resulting in an excessively small contact area between the second segment 412 corresponding to the third light-emitting unit 313 and the second encapsulation layer 420, and low adhesion, which can cause the second encapsulation layer 420 to easily peel off and cause bubbling in high temperature and high humidity environments. The fifth sub-width d5 ​​is greater than or equal to one-half of the first width D1, that is, the second segment 412 of the encapsulation portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 is further extended on the side closer to the first light-emitting unit 311, thereby increasing the contact area between the encapsulation portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 and the second encapsulation layer 420, thereby increasing the adhesion between the second encapsulation layer 420 and the second segment 412 corresponding to the third light-emitting unit 313.

[0128] See also Figure 11 , Figure 11 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0129] like Figure 11 As shown, optionally, there is a gap 418 between the second segment 412 and the isolation structure 200, and the light-emitting layer 300 also includes a redundant unit 320, which is located on the side of the isolation structure 200 away from the substrate 100, and at least part of the redundant unit 320 is located in the gap 418. The redundant unit 320 is arranged in the gap 418, and the redundant unit 320 forms a support for the second segment 412, which can improve the problem of dark spots appearing on the display panel 10 due to the breakage of the second segment 412.

[0130] Optionally, the redundant unit 320 is enclosed to form a hollow portion, and the orthographic projection of the hollow portion on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100. When preparing the second encapsulation layer 420, the second encapsulation layer 420 will be deposited into the hollow portion, so that the second encapsulation layer 420 is in contact with the isolation structure 200, thereby improving the encapsulation effect of the isolation structure 200.

[0131] In some optional embodiments, the display panel 10 further includes a first electrode layer 500 , which includes a first electrode 510 located in the isolation opening 240 . The first electrode 510 is located between the light emitting unit 310 and the encapsulation portion 410 and is electrically connected to the isolation structure 200 .

[0132] In these optional embodiments, the isolation structure 200 separates the first electrode layer 500 to form mutually spaced first electrodes 510 , and the mutually spaced first electrodes 510 are electrically connected through the isolation structure 200 to form a full-surface electrode, ensuring normal light emission of the light-emitting unit 310 .

[0133] In some optional embodiments, the orthographic projection of each light-emitting unit 310 on the substrate 100 is located within the orthographic projection of each first electrode 510 on the substrate 100 .

[0134] In these optional embodiments, the orthographic projection of the light-emitting unit 310 on the substrate 100 is located within the orthographic projection of the first electrode 510 on the substrate 100, that is, the first electrode 510 is arranged to cover the light-emitting unit 310 to serve as the electrode of the light-emitting unit 310, thereby ensuring the normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10.

[0135] Optionally, the light-emitting units 310 and the isolation structure 200 are spaced apart, that is, the light-emitting units 310 are spaced apart from each other, thereby reducing the crosstalk of carriers between the light-emitting units 310 and improving the cross-color problem of the light-emitting units 310.

[0136] Optionally, the first electrode layer 500 also includes a redundant electrode 520, which is located on the side of the isolation structure 200 facing away from the substrate 100, and at least part of the redundant electrode 520 is located in the gap 418. The redundant electrode 520 is arranged in the gap 418, and the redundant electrode 520 forms a support for the second segment 412, further improving the support for the second segment 412, and can improve the problem of dark spots appearing on the display panel 10 due to the breakage of the second segment 412.

[0137] In some optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 , wherein the second layer 220 is located on the side of the first layer 210 facing away from the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100 .

[0138] In these optional embodiments, the first layer 210 and the second layer 220 are arranged to form the isolation structure 200. The orthographic projection of the first layer 210, which is arranged near the substrate 100, is located within the orthographic projection of the second layer 220 on the substrate 100. The area of ​​the second layer 220 is larger than that of the first layer 210. The second layer 220 covers the surface of the first layer 210 near the second layer 220. In this case, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, a large drop in height is generated at the edge of the isolation structure 200, and the first layer 210 is recessed relative to the second layer 220. This makes it difficult for the light-emitting layer 300 to connect at the edge of the isolation structure 200, resulting in breakage. The breakage of the light-emitting layer 300 forms disconnected light-emitting units 310.

[0139] Optionally, along a direction from an isolation opening 240 to an adjacent isolation opening 240 , an orthographic projection of the second layer 220 on the substrate 100 has a first width D1 .

[0140] Optionally, the first layer 210 includes a conductive material, and the first layer 210 is connected to the first electrode 510 to achieve electrical connection between the isolation structure 200 and the first electrode 510 .

[0141] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material.

[0142] In these optional embodiments, the second layer 220 includes a conductive material, for example, a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to etch during wet etching of the first layer 210 using an etching solution, thereby making it easier for the first layer 210 to be concave relative to the second layer 220.

[0143] In some optional embodiments, both the first layer 210 and the second layer 220 include metal materials, and the materials of the first layer 210 and the second layer 220 are different.

[0144] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, an etchant can be used to wet-etch the first layer 210. By configuring the etchant, the etching rate of the second layer 220 can be lower than the etching rate of the first layer 210. Since the etching rate of the first layer 210 is higher, even though the second layer 220 will be etched to some extent during wet etching with the etchant, the first layer 210 will be etched faster, thereby causing the first layer 210 to be recessed relative to the second layer 220.

[0145] See also Figure 12 , Figure 12 FIG. 4 is a partial cross-sectional view of a display panel in another embodiment.

[0146] like Figure 12 As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100, and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100. Patent application numbers PCT / CN2023 / 134518, 202310771124.9, 202311499823.9, and 202311616249.0 describe relevant details of the isolation structure 200 for reference.

[0147] In these optional embodiments, to obtain the concave first layer 210, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thereby forming the concave first layer 210. Due to the faster etching rate of the first layer 210, the etching waste generated is more likely to enter other locations of the display panel 10, thereby causing adverse effects. After the third layer 230 is provided, the first layer 210 can be well adhered to the third layer 230, and the generated etching waste falls on the third layer 230, making it easier to clean.

[0148] In some optional embodiments, the material of the first encapsulation layer 400 includes an inorganic material.

[0149] In these optional embodiments, the first encapsulation layer 400 includes an inorganic material, which has good density and good barrier properties against water vapor and oxygen.

[0150] Optionally, the display panel 10 further includes: a second encapsulation layer 420, located on a side of the first encapsulation layer 400 facing away from the substrate 100, the second encapsulation layer 420 being in contact with the isolation structure 200; and a third encapsulation layer 430, located on a side of the second encapsulation layer 420 facing away from the substrate 100. The display panel 10 employs a three-layer encapsulation method, which provides improved encapsulation performance and reduces the possibility of water and oxygen intrusion.

[0151] Optionally, the material of the second encapsulation layer 420 includes an organic material.

[0152] Optionally, the material of the third encapsulation layer 430 includes an inorganic material. The first encapsulation layer 400, the second encapsulation layer 420 and the third encapsulation layer 430 are encapsulated with inorganic materials, organic materials and inorganic materials respectively to form a TFE (Thin Film Encapsulation, TFE) thin film encapsulation structure to further improve the encapsulation performance.

[0153] In some optional embodiments, the display panel 10 further includes: a pixel definition layer 600 located on the substrate 100 , the pixel definition layer 600 including a pixel defining portion 610 and a pixel opening 620 enclosed by the pixel defining portion 610 , the pixel opening 620 being connected to the isolation opening 240 .

[0154] In these optional embodiments, the pixel defining portion 610 of the pixel definition layer 600 encloses a pixel opening 620 to accommodate the light-emitting unit 310 and ensure normal light emission of the light-emitting unit 310. Furthermore, the pixel defining portion 610 defines the placement area of ​​each light-emitting unit 310, thereby reducing color crosstalk between the light-emitting units 310.

[0155] Optionally, the display panel 10 further includes a second electrode 630, which is exposed by the pixel opening 620. One of the second electrode 630 and the first electrode 510 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. This embodiment of the present application uses the second electrode 630 as the anode of the light-emitting unit 310 and the first electrode 510 as the cathode of the light-emitting unit 310 as an example. Patent application numbers 202310707209.0 and 202311346196.5 describe cathode-related content for reference.

[0156] Optionally, the light emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light emitting material layer, a hole injection layer (HIL) and a hole transport layer (HTL).

[0157] like Figure 1 As shown, another embodiment of the first aspect of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 200, which is located on one side of the substrate 100, and the isolation structure 200 encloses an isolation opening 240. The isolation structure 200 includes a first layer 210 and a second layer 220, and the second layer 220 is located on the side of the first layer 210 away from the substrate 100. The orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100, and the orthographic projection of the second layer 220 on the substrate 100 has a first width D1 along the direction of the isolation opening 240 pointing to the adjacent isolation opening 240; and a light-emitting layer 30. 0, located on one side of the substrate 100, the light-emitting layer 300 includes a light-emitting unit 310 located in the isolation opening 240; the first encapsulation layer 400 includes an encapsulation portion 410 arranged at intervals and used to encapsulate each light-emitting unit 310, the encapsulation portion 410 includes a first segment 411 and a second segment 412, at least a portion of the first segment 411 is located in the isolation opening 240, the second segment 412 is located on a side of the isolation structure 200 away from the substrate 100, and points along the isolation opening 240 toward the adjacent isolation opening 240. The orthographic projection of the second segment 412 on the substrate 100 has a second width D2, wherein the second width D2 and the first width D1 satisfy:

[0158] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, and a first encapsulation layer 400. The isolation structure 200 is arranged on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting units 310 do not need to be prepared using a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs. The first encapsulation layer 400 includes mutually spaced encapsulation portions 410, at least part of which is located within the isolation opening 240 to encapsulate the light-emitting units 310. The encapsulation portion 410 includes a first segment 411 and a second segment 412 connected to each other. The orthographic projection of the second layer 220 on the substrate 100 has a first width D1, and the orthographic projection of the second segment 412 on the substrate 100 has a second width D2. The first width D1 and the second width D2 satisfy: The second width D2 of the second segment 412 satisfies this range, so that the second encapsulation portion 410 is further lengthened relative to the width in the related art. Therefore, when the second encapsulation layer 420 of the organic material is subsequently prepared, the contact area between the second encapsulation layer 420 and the second segment 412 is increased, thereby increasing the adhesion between the second encapsulation layer 420 and the second segment 412, improving the problem of the second encapsulation layer 420 being prone to film shedding and bubbling in a high temperature and high humidity environment, and improving the performance of the OLED display panel 10.

[0159] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made based on actual conditions. This application does not impose any specific restrictions on it.

[0160] The embodiment of the second aspect of the present application further provides a display device, comprising the display panel 10 of any of the above-mentioned embodiments of the first aspect. Since the display device provided by the embodiment of the second aspect of the present application comprises the display panel 10 of any of the above-mentioned embodiments of the first aspect, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned embodiments of the first aspect, which will not be further elaborated here.

[0161] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0162] The third embodiment of the present application further provides a method for preparing a display panel 10. The display panel 10 may be any of the display panels 10 provided in the first embodiment. Figures 1 to 12 , and see Figure 13 , Figure 13 : This is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application. The manufacturing method includes:

[0163] Step S01: preparing an isolation structure on a substrate. The isolation structure encloses an isolation opening and has a top surface facing away from the substrate. The orthographic projection of the top surface on the substrate in a direction from the isolation opening to the adjacent isolation opening has a first width D1.

[0164] Step S02: preparing a light-emitting layer on a substrate, wherein the light-emitting layer includes light-emitting units located in the isolation openings.

[0165] Step S03: Preparing a first encapsulation layer on the substrate, the first encapsulation layer includes an encapsulation portion configured and used to encapsulate each light-emitting unit, the encapsulation portion includes a first segment and a second segment, at least a portion of the first segment is located at the isolation opening, the second segment is located on a side of the isolation structure away from the substrate, and points along the isolation opening toward the adjacent isolation opening. The orthographic projection of the second segment on the substrate has a second width D2, wherein the second width D2 and the first width D1 satisfy:

[0166]

[0167] According to the preparation method of the embodiment of the third aspect of the present application, the isolation structure 200 is prepared by step S01. The light-emitting layer 300 is prepared by step S02. The isolation structure 200 is arranged on the substrate 100 and encloses a plurality of isolation openings 240 to separate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing the crosstalk of carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and preparing the light-emitting unit 310 without the need for a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs. The first encapsulation layer 400 is prepared by step S03. The first encapsulation layer 400 includes encapsulation portions 410 spaced apart from each other, and at least part of the encapsulation portion 410 is located in the isolation opening 240 to encapsulate the light-emitting unit 310. The encapsulation portion 410 includes a first segment 411 and a second segment 412 connected to each other. The orthographic projection of the top surface 201 of the isolation structure 200 on the substrate 100 has a first width D1, and the orthographic projection of the second segment 412 on the substrate 100 has a second width D2. The first width D1 and the second width D2 satisfy: The second width D2 of the second segment 412 satisfies this range, so that the second encapsulation portion 410 is further lengthened relative to the width in the related art. Therefore, when the second encapsulation layer 420 of the organic material is subsequently prepared, the contact area between the second encapsulation layer 420 and the second segment 412 is increased, thereby increasing the adhesion between the second encapsulation layer 420 and the second segment 412, improving the problem of the second encapsulation layer 420 being prone to film shedding and bubbling in a high temperature and high humidity environment, and improving the performance of the OLED display panel 10.

[0168] In some optional embodiments, the light-emitting unit 310 includes a first light-emitting unit 311, a second light-emitting unit 312, and a third light-emitting unit 313 of different colors, and the isolation opening 240 includes a first isolation opening, a second isolation opening, and a third isolation opening. After the step of preparing the isolation structure 200 on the substrate 100, the method further includes:

[0169] A first light-emitting material layer and a first encapsulation material layer are prepared on the substrate 100, and the first light-emitting material layer and the first encapsulation material layer are patterned to obtain a first light-emitting unit 311 and an encapsulation portion 410 located in the first isolation opening, wherein the second segments 412 around the first light-emitting unit 311 have the same second width;

[0170] A second light-emitting material layer and a second encapsulation material layer are prepared on the substrate 100 and patterned to obtain a second light-emitting unit 312 and an encapsulation portion 410 located in the second isolation opening. The second width of the second segment 412 on the peripheral side of the first light-emitting unit 311 is a first sub-width d1. The second width of the second segment 412 located in the encapsulation portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 and close to the first light-emitting unit 311 is a second sub-width d2. The first sub-width d1 and the second sub-width d2 satisfy the following conditions:

[0171] d1≤d2.

[0172] In these optional embodiments, in the packaging portion 410 located on the side of the second light-emitting unit 312 facing away from the substrate 100, the second sub-width d2 of the second segment 412 is greater than or equal to the first sub-width d1 of the second segment 412 on the circumferential side of the first light-emitting unit 311, that is, the second segment 412 of the packaging portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 is further lengthened on the side close to the first light-emitting unit 311, thereby increasing the contact area between the packaging portion 410 on the side of the second light-emitting unit 312 facing away from the substrate 100 and the second packaging layer 420, thereby increasing the adhesion between the second packaging layer 420 and the second segment 412 corresponding to the second light-emitting unit 312.

[0173] In some optional embodiments, after the step of preparing the second light-emitting material layer and the second encapsulation material layer on the substrate 100, the method further includes:

[0174] A third light-emitting material layer and a third encapsulation material layer are prepared on the substrate 100 and patterned to obtain a third light-emitting unit 313 and an encapsulation portion 410 located in the third isolation opening. In the encapsulation portion 410 located on a side of the third light-emitting unit 313 facing away from the substrate 100, a second width of the second segment 412 near the first light-emitting unit 311 is a third sub-width d3, wherein the first sub-width d1 and the third sub-width d3 satisfy the following conditions:

[0175] d1≤d3.

[0176] In these optional embodiments, in the packaging portion 410 located on the side of the third light-emitting unit 313 facing away from the substrate 100, the third sub-width d3 of the second segment 412 is greater than or equal to the first sub-width d1 of the second segment 412 on the circumferential side of the first light-emitting unit 311, that is, the second segment 412 of the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 is further lengthened on the side close to the first light-emitting unit 311, thereby increasing the contact area between the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 and the second packaging layer 420, thereby increasing the adhesion between the second packaging layer 420 and the second segment 412 corresponding to the third light-emitting unit 313.

[0177] In some optional embodiments, in the packaging portion 410 located on a side of the second light-emitting unit 312 facing away from the substrate 100, the second width of the second segment 412 near the third light-emitting unit 313 is a fourth sub-width d4, and in the packaging portion 410 located on a side of the third light-emitting unit 313 facing away from the substrate 100, the second width of the second segment 412 near the second light-emitting unit 312 is a fifth sub-width d5, where the fourth sub-width d4 and the fifth sub-width d5 ​​satisfy the following conditions:

[0178] d4≤d5.

[0179] In these optional embodiments, the fifth sub-width d5 ​​is greater than or equal to the fourth sub-width d4, that is, the second segment 412 of the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 is further lengthened on the side close to the second light-emitting unit 312, thereby increasing the contact area between the packaging portion 410 on the side of the third light-emitting unit 313 facing away from the substrate 100 and the second packaging layer 420, thereby increasing the adhesion between the second packaging layer 420 and the second segment 412 corresponding to the third light-emitting unit 313.

[0180] While the embodiments described above are not exhaustive, they do not limit the invention to the specific embodiments described. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening and having a top surface facing away from the substrate; a light-emitting layer, located on one side of the substrate, the light-emitting layer comprising light-emitting units located in the isolation opening; a first encapsulation layer, comprising an encapsulation portion for encapsulating each of the light-emitting units, the encapsulation portion comprising a first segment and a second segment connected to each other, at least a portion of the first segment being located in the isolation opening, and the second segment being located on a side of the isolation structure facing away from the substrate; In the direction from the isolation opening to the adjacent isolation opening, the orthographic projection of the top surface on the substrate has a first width D1, and the orthographic projection of the second segment on the substrate has a second width D2, and the first width D1 and the second width D2 satisfy:

2. The display panel according to claim 1, wherein: The second segments of the packaging portion corresponding to two adjacent light-emitting units are spaced apart from each other; Alternatively, the orthographic projections of the second segments of the encapsulation portion corresponding to adjacent light-emitting units on the substrate at least partially overlap; Preferably, the first segment includes a first main body and a first side wall, the first side wall is connected to the first main body and the second segment, and the first side wall is inclined close to the isolation opening in a direction from the second segment toward the first main body.

3. The display panel according to claim 2, wherein: The second segments of the packaging parts corresponding to the adjacent light-emitting units at least partially overlap in their orthographic projections on the substrate, and the second segments include a second main body, a second side wall and an extension portion, the second side wall is connected to the second main body and the extension portion, and the extension portion is located on the side of the second main body facing away from the substrate.

4. The display panel according to claim 3, wherein: The orthographic projection of the extending portion on the substrate at least partially overlaps with the orthographic projection of the second segment of the encapsulation portion corresponding to the adjacent light-emitting unit on the substrate; Preferably, the orthographic projection of the second main body portion on the substrate is spaced apart from the orthographic projection of the second segment of the packaging portion corresponding to the adjacent light-emitting unit on the substrate; Preferably, the second main body is connected to the first side wall and the second side wall.

5. The display panel according to claim 1, wherein: The second segments on the circumference of the light-emitting units with the same luminous color have the same second width.

6. The display panel according to claim 5, wherein: The light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit having different colors. The second segments around the first light-emitting units have the same second width.

7. The display panel according to claim 6, wherein: The second width of the second segment on the circumference of the first light-emitting unit is a first sub-width d1. The second width of the second segment located in the packaging portion of the second light-emitting unit on a side facing away from the substrate is a second sub-width d2. The first sub-width and the second sub-width satisfy: d1≤d2; Preferably, the first sub-width d1 and the first width D1 satisfy: Preferably, the second sub-width d2 and the first width D1 satisfy: or, 8. The display panel according to claim 6, wherein: The second width of the second segment on the circumferential side of the first light-emitting unit is a first sub-width d1. The second width of the second segment located in the packaging portion of the third light-emitting unit on a side facing away from the substrate is a third sub-width d3 near the first light-emitting unit. The first sub-width d1 and the third sub-width d3 satisfy the following conditions: d1≤d3; Preferably, the third sub-width d3 and the first width D1 satisfy: or, 9. The display panel according to claim 6, wherein: The second width of the second segment located in the packaging portion on the side of the second light-emitting unit facing away from the substrate and close to the third light-emitting unit is a fourth sub-width d4, and the second width of the second segment located in the packaging portion on the side of the third light-emitting unit facing away from the substrate and close to the second light-emitting unit is a fifth sub-width d5, wherein the fourth sub-width d4 and the fifth sub-width d5 ​​satisfy: d4≤d5; Preferably, the fourth sub-width d4 and the first width D1 satisfy: Preferably, the fifth sub-width d5 ​​and the first width D1 satisfy: or, 10. The display panel according to claim 1, wherein There is a gap between the second segment and the isolation structure, the light-emitting layer further includes a redundant unit, the redundant unit is located on a side of the isolation structure away from the substrate, and at least part of the redundant unit is located in the gap; Preferably, the redundant units are enclosed to form a hollow portion, and the orthographic projection of the hollow portion on the substrate is located within the orthographic projection of the isolation structure on the substrate.

11. The display panel according to claim 10, wherein: The display panel further includes: a first electrode layer, comprising a first electrode located in the isolation opening, the first electrode being located between the light-emitting unit and the packaging portion and electrically connected to the isolation structure; Preferably, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate; Preferably, the light emitting unit and the isolation structure are spaced apart.

12. The display panel according to claim 11, wherein: The first electrode layer further includes a redundant electrode. The redundant electrode is located on a side of the isolation structure facing away from the substrate, and at least a portion of the redundant electrode is located in the gap.

13. The display panel according to claim 1, wherein The isolation structure includes a first layer and a second layer, wherein the second layer is located on a side of the first layer facing away from the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the second layer on the substrate; Preferably, along the direction from the isolation opening to the adjacent isolation opening, the orthographic projection of the second layer on the substrate has the first width D1; Preferably, the first layer comprises a conductive material; Preferably, the second layer comprises a conductive material or an insulating material; Preferably, the first layer and the second layer both comprise metal materials, and the materials of the first layer and the second layer are different; Preferably, the isolation structure further includes a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

14. The display panel according to claim 1, wherein The material of the first encapsulation layer includes an inorganic material; Preferably, the display panel further includes: a second encapsulation layer, located on a side of the first encapsulation layer facing away from the substrate, the second encapsulation layer being in contact with the isolation structure; a third encapsulation layer, located on a side of the second encapsulation layer facing away from the substrate; Preferably, the material of the second encapsulation layer includes organic material; Preferably, the material of the third encapsulation layer includes an inorganic material; Preferably, the display panel further includes: a pixel definition layer located on the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening being in communication with the isolation opening; Preferably, the display panel further includes a second electrode, and the second electrode is exposed from the pixel opening.

15. A display panel, characterized in that: The display panel includes: substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure comprising a first layer and a second layer, the second layer being located on a side of the first layer facing away from the substrate, the orthographic projection of the first layer on the substrate being located within the orthographic projection of the second layer on the substrate, and the orthographic projection of the second layer on the substrate having a first width D1 in a direction pointing from the isolation opening to the adjacent isolation opening; a light-emitting layer, located on one side of the substrate, the light-emitting layer comprising light-emitting units located in the isolation opening; The first encapsulation layer includes encapsulation portions that are spaced apart from each other and are used to encapsulate each of the light-emitting units. The encapsulation portion includes a first segment and a second segment. At least a portion of the first segment is located in the isolation opening. The second segment is located on a side of the isolation structure away from the substrate. The second segment is directed along the isolation opening toward an adjacent isolation opening. The orthographic projection of the second segment on the substrate has a second width D2. The second width D2 and the first width D1 satisfy:

16. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 15.

17. A method for preparing a display panel, characterized in that: The method comprises: An isolation structure is prepared on a substrate, wherein the isolation structure encloses an isolation opening and has a top surface facing away from the substrate, and an orthographic projection of the top surface on the substrate in a direction from the isolation opening to an adjacent isolation opening has a first width D1; preparing a light-emitting layer on the substrate, wherein the light-emitting layer includes light-emitting units located in the isolation opening; A first encapsulation layer is prepared on the substrate, the first encapsulation layer includes an encapsulation portion configured and used to encapsulate each of the light-emitting units, the encapsulation portion includes a first segment and a second segment, at least a portion of the first segment is located in the isolation opening, the second segment is located on a side of the isolation structure away from the substrate, and points along the isolation opening in a direction adjacent to the isolation opening. The orthographic projection of the second segment on the substrate has a second width D2, wherein the second width D2 and the first width D1 satisfy:

18. The preparation method according to claim 17, characterized in that: The light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit having different colors; the isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening; and after the step of preparing the isolation structure on the substrate, the method further includes: Preparing a first light-emitting material layer and a first encapsulation material layer on the substrate, and patterning the first light-emitting material layer and the first encapsulation material layer to obtain the first light-emitting unit and the encapsulation portion located in the first isolation opening, wherein the second segments around the first light-emitting unit have the same second width; A second light-emitting material layer and a second encapsulation material layer are prepared on the substrate, and the second light-emitting material layer and the second encapsulation material layer are patterned to obtain the second light-emitting unit and the encapsulation portion located at the second isolation opening, wherein the second width of the second segment on the peripheral side of the first light-emitting unit is a first sub-width d1, and the second width of the second segment located on the side of the second light-emitting unit facing away from the substrate and close to the first light-emitting unit is a second sub-width d2, wherein the first sub-width d1 and the second sub-width d2 satisfy the following: d1≤d2.

19. The preparation method according to claim 18, characterized in that After the step of preparing a second light-emitting material layer and a second encapsulation material layer on the substrate, the method further comprises: A third light-emitting material layer and a third encapsulation material layer are prepared on the substrate, and the third light-emitting material layer and the third encapsulation material layer are patterned to obtain the third light-emitting unit and the encapsulation portion located in the third isolation opening. In the encapsulation portion located on a side of the third light-emitting unit facing away from the substrate, the second width of the second segment close to the first light-emitting unit is a third sub-width d3, wherein the first sub-width d1 and the third sub-width d3 satisfy the following: d1≤d3.

20. The preparation method according to claim 18, characterized in that The second width of the second segment located in the packaging portion on the side of the second light-emitting unit facing away from the substrate and close to the third light-emitting unit is a fourth sub-width d4, and the second width of the second segment located in the packaging portion on the side of the third light-emitting unit facing away from the substrate and close to the second light-emitting unit is a fifth sub-width d5, wherein the fourth sub-width d4 and the fifth sub-width d5 ​​satisfy: d4≤d5.

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