Method and system for generating chip fuse information chain, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses a method and a system for generating a chip fuse information chain, electronic equipment and a storage medium, relates to the technical field of semiconductor testing, and aims to dynamically create an adaptive structure array by being adaptive to a product specification file without specially developing corresponding methods and programs for different product specification files. The method comprises the following steps: acquiring a product specification file; based on the product specification file, dynamically creating a structural body array matched with the product specification file and initializing the structural body array; and obtaining a measured value of an actual chip, updating the initialized structural body array according to the measured value, and generating a chip fuse wire information chain. The method is suitable for test scenes of semiconductors such as chips and the like.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing technology, and in particular to a method, system, electronic device and storage medium for generating a chip fuse information chain adaptively to product specifications. Background Art

[0002] With the development of ultra-large-scale integrated circuits (VLSIs), the design of large and ultra-large chips has become increasingly complex. To ensure high-quality chip production, a rigorous chip testing process is essential. Programming the fuse information chain is a crucial step in the chip testing process. The fuse information chain contains key information such as the chip model and electrical signal parameters. Some values ​​are derived from test measurements, while others are fixed. The definition of these fields varies across product specification documents. The definition of each field in the fuse information chain for each die may vary across product series and even between different versions of the same product series.

[0003] The existing method for assembling fuse information chains is based on product-defined specification files. A dedicated program method is developed for each product. Each die's fuse information chain field definitions are preconfigured into the code to form a fixed structure array, which then outputs the final fuse information chain. However, changes to the product specification file, such as changes to field naming, require redevelopment of the method and program, increasing development costs. Summary of the Invention

[0004] In view of this, the embodiments of the present application provide a method, system, electronic device and storage medium for generating a chip fuse information chain, which can dynamically create an adaptive structure array based on the adaptive product specification file, without the need to specifically develop corresponding methods and programs for different product specification files, thereby reducing development costs to a certain extent.

[0005] In order to achieve the above-mentioned purpose of the invention, the following technical solutions are adopted: In a first aspect, an embodiment of the present application provides a method for generating a chip fuse information chain, comprising: Obtain a product specification file; based on the product specification file, dynamically create and initialize a structure array adapted to the product specification file; obtain measurement values ​​of an actual chip, update the initialized structure array according to the measurement values, and generate a chip fuse information chain.

[0006] In combination with the first aspect, in a first embodiment of the first aspect, obtaining the product specification file includes: receiving a product specification file name identifier input by a user through a test graphical user interface; downloading the product specification file corresponding to the name identifier according to the name identifier; the product specification file includes the number of grains included in each product, the length of the fuse information chain of each grain, the definition of each field in the fuse information chain, and value location information, and the value location information is used to indicate whether the value source of each field is a measured value or a fixed value.

[0007] In combination with the first aspect and the first implementation method of the first aspect, in the second implementation method of the first aspect, the method dynamically creates and initializes a structure array that is compatible with the product specification file based on the product specification file, including: parsing the product specification file to identify the differences in the field definitions of the fuse information chain of each grain under each product series and version; constructing a corresponding structure array framework based on the parsed field definition differences, and synchronously initializing the fixed value of the fuse information chain according to the fixed value indicated in the value position information to obtain an initialized structure array.

[0008] In combination with the first aspect and the first or second implementation manner of the first aspect, in the third implementation manner of the first aspect, the initialized structure array is updated according to the measurement value to generate a chip fuse information chain, including: according to the value indicated by the value location information as the measurement value, the measurement value of the actual chip is located at the corresponding element in the structure array; and the measurement value is used to replace the original value of the corresponding element in the structure array to generate a chip fuse information chain.

[0009] In combination with the first aspect and the first, second or third implementation of the first aspect, in the fourth implementation of the first aspect, after generating the chip fuse information chain, it also includes: verifying the generated fuse information chain; if the verification fails, re-obtaining the measurement value of the actual chip and updating the structure array until the fuse information chain verification is successfully passed.

[0010] In combination with the first aspect and the first, second, third or fourth implementation of the first aspect, in the fifth implementation of the first aspect, the method is applied to the system-level test process, and is used to soft-write the generated fuse information chain into the chip for power-on testing during the SLT test, and / or burn the fuse information chain into the chip after the SLT test is passed to complete the finalization of the chip.

[0011] In combination with the first aspect and one of the first to fifth embodiments of the first aspect, in the sixth embodiment of the first aspect, the measurement value of the actual chip is the electrical parameter value obtained by actual measurement of the chip through wafer testing and post-packaging testing sites in the chip production test process, and the measurement value is used to characterize the actual performance of each chip.

[0012] In a second aspect, an embodiment of the present invention provides a system for generating a chip fuse information chain, comprising: a file acquisition unit for acquiring a product specification file; a structure creation unit for dynamically creating and initializing a structure array adapted to the product specification file based on the product specification file; a generation unit for acquiring the measurement value of the actual chip, updating the initialized structure array according to the measurement value, and generating a chip fuse information chain.

[0013] In combination with the second aspect, in a first embodiment of the second aspect, the file acquisition unit is specifically used to receive a product specification file name identifier input by a user through a test graphical user interface; download the product specification file corresponding to the name identifier according to the name identifier; the product specification file includes the number of grains included in each product, the length of the fuse information chain of each grain, the definition of each field in the fuse information chain, and value location information, and the value location information is used to indicate whether the value source of each field is a measured value or a fixed value.

[0014] In combination with the second aspect and the first implementation method of the second aspect, in the second implementation method of the second aspect, the structure creation unit includes: a parsing module, used to parse the product specification file and identify the differences in the field definitions of the fuse information chain of each grain under each product series and version; a structure construction module, used to construct a corresponding structure array framework according to the parsed field definition differences, and synchronously initialize the fuse information chain fixed value according to the fixed value indicated in the value position information to obtain an initialized structure array.

[0015] In combination with the second aspect and the first or second implementation of the second aspect, in the third implementation of the second aspect, the generation unit is specifically used to: locate the measurement value of the actual chip to the corresponding element in the structure array according to the value position specified in the product specification document; and replace the original value of the corresponding element in the structure array with the measurement value.

[0016] In a third aspect, an embodiment of the present invention provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement any method of generating a chip fuse information chain as described in the first aspect.

[0017] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, which stores one or more computer programs. When the one or more computer programs are executed by one or more processors, the method for generating a chip fuse information chain as described in any one of the first aspects is implemented.

[0018] The method, system, electronic device, and storage medium for generating a chip fuse information chain provided in the embodiments of the present application obtain product specification files during testing and dynamically create a structure array based on the product specification files. When the product specifications change, only the corresponding product specification files need to be input, and the new specifications can be automatically adapted according to the product specification files, and the adapted structure array can be quickly constructed, thereby updating the fuse information chain. This can better support compatibility with products of multiple specifications, eliminating the need to develop corresponding methods and programs specifically for different product specification files. In this way, when different product series or different versions of the same product series are replaced, there is no need to develop corresponding methods and programs specifically for different product specification files, which can reduce development costs to a certain extent. Moreover, it can significantly shorten the development cycle and improve the overall development efficiency from product specification determination to completion of fuse information chain generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of the flow chart for generating a Fuse information chain in the prior art; Figure 2 This is a flow chart of an embodiment of a method for generating a chip fuse information chain in this application; Figure 3 This is a flow chart of another embodiment of the method for generating a chip fuse information chain in this application; Figure 4 A flowchart of a general API execution task flow for generating a chip fuse information chain provided in the method for generating a chip fuse information chain in this application; Figure 5 For this application, there are Figure 4 Schematic diagram of the application of the general API interface; Figure 6 This is a flow chart of another embodiment of the method for generating a chip fuse information chain in this application; Figure 7 This is a schematic block diagram of an embodiment of the apparatus for generating a chip fuse information chain in the present application; Figure 8 This is a schematic structural diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] It should be understood that the embodiments described are only a portion of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work are within the scope of protection of the present invention.

[0023] With the development of ultra-large-scale integrated circuits (VLSI), large chip designs are becoming increasingly complex, placing stricter demands on testing processes. The current mainstream large chip production test process includes key steps such as wafer ATE testing, post-packaging ATE testing, SLT testing, and fuse information chain programming. The fuse information chain for a target product model contains numerous parameter values, including the chip model, frequency, and voltage. These values ​​are derived partially from measurements at the test site and partially from fixed values ​​configured for the product model. They are crucial for determining chip quality.

[0024] However, existing methods for creating Fuse information chains have significant drawbacks. Figure 1 Each product requires a separate method developed based on the product specification document to pre-configure the information chain structure array, develop a corresponding test program, and then assemble and generate the fuse information chain based on the specially developed test program. Any changes to the product specification document, such as changes in the field naming method between different versions of the same product specification, require the development of new methods and programs. This approach has limited flexibility and compatibility, and the same program cannot support the testing of multiple product specifications, greatly limiting chip testing efficiency and program versatility.

[0025] For this purpose, see Figure 2 The present invention provides a method for generating a chip fuse information chain, which is applicable to semiconductor testing scenarios such as chips, including: S110. Obtain product specification documents.

[0026] Chip manufacturers typically build a product specification file management system, using database technology to store specification files for various chips. These files are categorized by product model, batch, and other dimensions for quick retrieval. When the production test process for a specific chip is initiated, the production test system initiates a query request to the management system based on the chip's unique identifier, such as the product serial number or model code. Upon receiving the request, the management system uses a pre-set search algorithm to download the corresponding product specification file from the database.

[0027] S120 . Based on the product specification file, dynamically create and initialize a structure array adapted to the product specification file.

[0028] After obtaining the product specification file, the data structure of the product specification file is parsed to identify various types of information in the file, including key parameters such as the number of dies contained in each product, the length of the fuse information chain of each die, and the definition of each field in the fuse information chain. Based on the differences in the fuse information chain length and field definitions of different dies, the corresponding structure array framework is constructed.

[0029] For example, assume that the product specification document specifies that a chip contains four dies, Die0 through Die3. The fuse chain length for Die0 is 32 bits, Die1 is 48 bits, Die2 is 36 bits, and Die3 is 24 bits. The core frequency field in the fuse chain is defined as a 16-bit binary representation of the chip's operating frequency, and the voltage level field is defined as an 8-bit binary representation of different operating voltage levels.

[0030] When constructing the structure array framework, appropriate memory space is allocated for each structure element, and the storage order and data type of each field in the structure are determined. For example, the chip ID field is defined as a string type, occupying 16 bytes of memory space; the core frequency field is defined as an unsigned integer type, occupying 2 bytes of memory space; the voltage level field is defined as an 8-bit unsigned integer type, occupying 1 byte of memory space, etc. At the same time, according to the fixed values ​​indicated in the product specification file, the fixed values ​​of the fuse information chain are initialized synchronously. Assuming that the product specification file stipulates that the chip manufacturing process version field of Die1 is a fixed value of V2.1, when constructing the structure array, the program will automatically write this fixed value into the chip manufacturing process version field of the corresponding Die1 structure element, completing the initialization of the structure array and building a structure array of a preliminary data storage framework.

[0031] S130 , obtaining measurement values ​​of an actual chip, updating the initialized structure array according to the measurement values, and generating a chip fuse information chain.

[0032] After the chip undergoes rigorous wafer ATE testing and post-package ATE testing, the test equipment will generate a series of actual measurement data, including electrical parameters such as chip frequency, voltage, current, and impedance. These data can be transmitted to the production test system through a standardized data transmission interface in accordance with specific data transmission protocols such as SPI (Serial Peripheral Interface) or USB (Universal Serial Bus) protocols.

[0033] After receiving the measurement value, the production test system locates the actual chip's measurement value to the corresponding element in the structure array. The location rule is determined based on the value location information defined in the product specification document. For example, if the product specification document specifies that the measurement value of the core frequency field comes from the frequency measurement module in the wafer ATE test, then based on this information, combined with the die number and the order of the fields in the fuse information chain, it quickly determines that the measurement value should be updated to the core frequency field of the corresponding die in the structure array. The measured value then replaces the original value of the corresponding element in the structure array.

[0034] Assume that during initialization, the default value of the core frequency field is 0. When the actual measured frequency value, such as 2.5GHz, is obtained and converted to a 16-bit binary code, the system replaces the default value with the measured value. By replacing all the measured value fields that need to be updated in the structure array, a fuse information chain that accurately reflects the actual performance parameters of the chip is gradually generated.

[0035] In some embodiments, the actual chip measurement values ​​are electrical parameter values ​​obtained by actual measurement of the chip through wafer testing and post-packaging testing sites during the chip production test process, and the measurement values ​​are used to characterize the actual performance of each chip.

[0036] See Figure 3 In some embodiments, obtaining the product specification file (step S110) includes: receiving a product specification file name identifier input by a user through a test graphical user interface; downloading the product specification file corresponding to the name identifier according to the name identifier; the product specification file includes the number of grains included in each product, the length of the fuse information chain of each grain, the definition of each field in the fuse information chain, and value location information, wherein the value location information is used to indicate whether the value source of each field is a measured value or a fixed value.

[0037] Continue to read Figure 3 In practice, testers use the test system's graphical user interface (GUI), which typically includes a dedicated input box for receiving the product specification file name. Testers enter a unique name, such as CHIP-2024-Q3-001, into the input box. This name can be a product model, batch number, or other custom unique identifier. Once completed, the GUI sends the entered name to a backend processing program.

[0038] After receiving the name identifier, the background processing program can retrieve the product specification file in two specific ways: The background program checks the local cache for the product specification file corresponding to the name identifier. The local cache can be a hash-based data structure that allows for fast data lookup. If the file exists in the local cache, it directly retrieves the file from the local cache. If the file does not exist in the local cache, or if it exists but the file version does not meet the requirements, it connects to the server storing the product specification file via the network.

[0039] Second, the backend program queries the server-side database based on the input name identifier to obtain the file's storage path. It then downloads the corresponding product specification file from the server's storage device via a network transfer protocol, such as HTTP (Hyper Text Transfer Protocol) or FTP (File Transfer Protocol).

[0040] Among them, the value location information is used to indicate whether the value source of each field is a measured value or a fixed value. For example, the value of the "cache size" field comes from the "cache capacity measurement item" in the wafer ATE test, while the "chip version number" field is a fixed value and is directly obtained from a specific area of ​​the file.

[0041] In the related existing technology, before generating the fuse information chain, a fixed template generation method is used for different products based on a specific product, which cannot flexibly respond to changes in product specifications. Once the product specifications are adjusted, a large amount of code needs to be redeveloped and modified, which is costly and inefficient.

[0042] See Figure 4 and Figure 5 In the embodiment of the present application, a general method is developed based on the product specification file format, and the general method includes a general method for parsing product specification files. Figure 5 The general method can be presented in the form of a test program. In one example, the test program can include three parts: a general graphical user interface GUI, other test-related functional modules, and an information chain general API. In specific implementation, the information chain general API is integrated into the test program. When it is necessary to generate the fuse information chain of the corresponding product based on the product specification file, it is only necessary to call the information chain general API to execute. Figure 4 The process in the example is to parse the product specification file, then build the corresponding structure array framework, and update the measured value during the test to output the corresponding fuse information chain.

[0043] Therefore, in some embodiments, dynamically creating and initializing a structure array adapted to the product specification file based on the product specification file (step S120) includes: parsing the product specification file to identify the differences in the definition of each field of the fuse information chain of each die under each product series and version; constructing a corresponding structure array framework based on the parsed field definition differences, and synchronously initializing the fixed value of the fuse information chain according to the fixed value indicated in the value location information to obtain an initialized structure array.

[0044] For example, assuming that the secure boot key field of the Die2 fuse information chain indicated by the value location information in the product specification file is a fixed value of 0x324156, when constructing the structure array, the program will automatically write the fixed value into the corresponding field of the corresponding Die2 structure element to complete the initialization of the structure array.

[0045] This embodiment dynamically creates and initializes a structure array based on the product specification file, enabling rapid adaptation to changes in different product series and versions. Compared to developing a single method for each product, this significantly improves development efficiency, reduces development costs, and enhances system flexibility and compatibility.

[0046] In some embodiments, the updating of the initialized structure array according to the measurement value to generate a chip fuse information chain (step S130) includes: locating the measurement value of the actual chip to the corresponding element in the structure array according to the value indicated by the value location information being the measurement value; replacing the original value of the corresponding element in the structure array with the measurement value to generate a chip fuse information chain.

[0047] For example, the value location information indicates that the "actual operating current" field value in the fuse information chain comes from the current measurement during post-package ATE testing. Based on the die number and the order of the fields in the fuse information chain, the structure array element corresponding to this measured value is quickly determined. This measured value is then used to replace the default value, generating a fuse information chain that accurately reflects the actual chip performance.

[0048] See Figure 6 In some embodiments, after generating the chip fuse information chain, it also includes: verifying the generated fuse information chain; if the verification fails, re-obtaining the measurement value of the actual chip and updating the structure array until the fuse information chain verification is successful.

[0049] In this embodiment, after the chip fuse information chain is generated, a verification program is initiated as needed to perform checks based on pre-set multi-dimensional rules. These checks include data integrity checks to ensure that each field in the fuse information chain has a value; value range checks to verify that each field value is within the reasonable range specified in the product specification document; and logical relationship checks to ensure that the logical relationships between different fields conform to physical laws. For example, the relationship between the chip's power consumption, voltage, and current is checked to see if it conforms to the theoretical design value. For example, if the operating voltage field value in a certain chip's fuse information chain exceeds the range specified in the product specification document, or if the calculated relationship between the power consumption field and the voltage and current fields does not conform to the theoretical design value, the verification will be deemed to have failed.

[0050] If the verification fails, the process of re-obtaining the measurement value and updating the structure array is triggered; the actual measurement value of the chip is obtained from the test equipment again, the previous positioning and replacement operations are repeated to update the structure array, and then the verification is performed again, and this cycle is repeated until the fuse information chain verification is successful.

[0051] In this embodiment, in practical applications, by introducing the fuse information chain check mechanism, chip quality problems caused by fuse information errors can be effectively reduced, production costs can be reduced, and the quality and efficiency of the entire chip production can be improved.

[0052] In some embodiments, the method is applied to the system-level test process, and is used to soft-write the generated fuse information chain into the chip for power-on testing during the SLT test, and / or burn the fuse information chain into the chip after the SLT test is passed to complete the finalization of the chip.

[0053] During the system-level test (SLT) process, when testing is required, specialized soft-write equipment and supporting software are used to accurately write the fuse information chain into a temporary storage area within the chip, following the chip's programming protocol, such as the JTAG (Joint Test Action Group) protocol or a custom protocol customized by the specific chip manufacturer. The chip then undergoes a power-on test, where testers monitor the chip's startup process and various operating indicators, such as boot time, initial frequency, and key register values, to determine whether the chip is functioning properly.

[0054] Therefore, the method for generating a chip fuse information chain provided in an embodiment of the present application does not preset a product specification structure array. During testing, the specification structure array is dynamically created and initialized based on the product specification file, and then a fuse information chain is created based on the information of the actual chip. This method can flexibly respond to changes in product series and versions without repeating development methods and procedures, significantly improving development efficiency and reducing development costs.

[0055] Furthermore, since there is no need to repeatedly develop methods and procedures, it can adapt to different product specifications. There is no need to develop methods separately for each product. One set of procedures can support multiple product tests, greatly improving product development efficiency and program compatibility.

[0056] It should be noted that the method for generating chip fuse information chain provided in the embodiment of the present application can be solidified in a certain manufactured physical product in the form of software, for example, in the SLT test platform. When the user uses the product, the method flow of the present application can be reproduced.

[0057] Next, the system and electronic device for generating a chip fuse information chain provided by the embodiments of the present application are described in detail.

[0058] See Figure 7 , showing a schematic block diagram of the structure of a system for generating a chip fuse information chain. The system for generating a chip fuse information chain provided in this application includes: a file acquisition unit 210, used to obtain a product specification file; a structure creation unit 220, used to dynamically create and initialize a structure array adapted to the product specification file based on the product specification file; and a generation unit 230, used to obtain measurement values ​​of an actual chip, update the initialized structure array based on the measurement values, and generate a chip fuse information chain.

[0059] In some embodiments, the file acquisition unit 210 is specifically used to receive a product specification file name identifier input by a user through a test graphical user interface; download the product specification file corresponding to the name identifier according to the name identifier; the product specification file includes the number of grains included in each product, the length of the fuse information chain of each grain, the definition of each field in the fuse information chain, and value location information, and the value location information is used to indicate whether the value source of each field is a measured value or a fixed value.

[0060] In some embodiments, the structure creation unit 220 includes: a parsing module for parsing the product specification file and identifying the differences in the definition of each field of the fuse information chain of each grain under each product series and version; a structure construction module for constructing a corresponding structure array framework according to the parsed field definition differences, and synchronously initializing the fixed value of the fuse information chain according to the fixed value indicated in the value location information to obtain an initialized structure array.

[0061] In some embodiments, the generating unit 230 is specifically configured to: locate the actual chip's measured value to the corresponding element in the structure array according to the value location specified in the product specification document; and replace the original value of the corresponding element in the structure array with the measured value.

[0062] In some embodiments, the system further includes: a verification unit for verifying the generated fuse information chain after generating the chip fuse information chain; if the verification fails, re-obtaining the measurement value of the actual chip and updating the structure array until the fuse information chain verification is successfully passed.

[0063] In some embodiments, the system is integrated into an SLT test platform and is used to soft-write the generated fuse information chain into the chip for power-on testing during the SLT test, and / or burn the fuse information chain into the chip after the SLT test is passed to complete the finalization of the chip.

[0064] The implementation principle and technical effects of the system for generating a chip fuse information chain in this embodiment are similar to those of the aforementioned method embodiment, and will not be described in detail here. You can refer to each other.

[0065] Figure 8 FIG. 1 is a structural diagram of an embodiment of an electronic device for operation processing according to the present invention, which can implement any of the methods for generating a chip fuse information chain according to the embodiments of the present invention. Figure 8 As an optional embodiment, the above-mentioned electronic device may include: a housing 41, a processor 42, a memory 43, a circuit board 44 and a power supply circuit 45, wherein the circuit board 44 is placed inside the space enclosed by the housing 41, and the processor 42 and the memory 43 are arranged on the circuit board 44; the power supply circuit 45 is used to supply power to various circuits or devices of the above-mentioned electronic device; the memory 43 is used to store executable program code; the processor 42 runs the program corresponding to the executable program code by reading the executable program code stored in the memory 43, so as to execute the method for generating a chip fuse information chain described in any of the above-mentioned embodiments.

[0066] The specific execution process of the above steps by the processor 42 and the steps further executed by the processor 42 by running the executable program code can be found in the description of the first embodiment of the method for generating a chip fuse information link of the present invention, and will not be repeated here.

[0067] The electronic device exists in various forms, including but not limited to: (1) Mobile communication devices: These devices are characterized by having mobile communication functions and are mainly aimed at providing voice and data communications. Such terminals include: smart phones (such as iPhones), multimedia phones, feature phones, and low-end phones. (2) Ultra-mobile personal computer devices: These devices belong to the category of personal computers, have computing and processing functions, and generally also have mobile Internet access features. Such terminals include: PDAs, MIDs and UMPC devices, such as iPads. (3) Portable entertainment devices: These devices can display and play multimedia content. Such devices include: audio and video playback modules (such as iPods), handheld game consoles, e-books, as well as smart toys and portable car navigation devices. (4) Servers: Devices that provide computing services. The server's composition includes processors, hard disks, memory, system buses, etc. The server is similar to the general computer architecture, but because it needs to provide highly reliable services, it has higher requirements in terms of processing power, stability, reliability, security, scalability, and manageability. (5) Other electronic devices with data interaction functions.

[0068] An embodiment of the present invention also provides a computer-readable storage medium, which stores one or more computer programs. The one or more computer programs can be executed by one or more processors to implement the method of generating a chip fuse information chain as described in any of the aforementioned embodiments.

[0069] In summary, according to the descriptions of the above embodiments, the method and system for generating a chip fuse information chain disclosed in this embodiment do not require a preset product specification structure array. During testing, the specification structure array is dynamically created and initialized based on the product specification file, and then the fuse information chain is created based on the information of the actual chip. This can flexibly respond to changes in product series and versions without the need to repeat development methods and procedures, significantly improving development efficiency and reducing development costs. Since there is no need to repeat development methods and procedures, it can adapt to different product specifications. There is no need to develop methods separately for each product. One set of programs can support multiple product tests, greatly improving product development efficiency and program compatibility.

[0070] It should be noted that, in this document, except for the first and second priority qualifiers such as first and second priority, which represent the queue priorities, the remaining relational terms such as first and second are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0071] Each embodiment in this specification is described in a related manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0072] For the convenience of description, the above device is described as being divided into various units / modules based on their functions. Of course, when implementing the present invention, the functions of each unit / module can be implemented in the same or multiple software and / or hardware.

[0073] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing the relevant hardware through a computer program. The program can be stored in a computer-readable storage medium, and when executed, the program can include the processes in the above-described method embodiments. The storage medium can also be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0074] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for generating a chip fuse information chain, characterized in that: include: Obtain product specification documents; Based on the product specification file, dynamically create and initialize a structure array adapted to the product specification file; The measured values ​​of the actual chip are obtained, and the initialized structure array is updated according to the measured values ​​to generate a chip fuse information chain.

2. The method for generating a chip fuse information chain according to claim 1, wherein: The obtaining of product specification files includes: receiving a product specification file name identifier input by a user through a test graphical user interface; Download the product specification file corresponding to the name identifier according to the name identifier; the product specification file includes the number of grains included in each product, the length of the fuse information chain of each grain, the definition of each field in the fuse information chain, and value location information, and the value location information is used to indicate whether the value source of each field is a measured value or a fixed value.

3. The method for generating a chip fuse information chain according to claim 2, wherein: The dynamically creating and initializing a structure array adapted to the product specification file based on the product specification file includes: parsing the product specification file to identify the definition differences of each field of the fuse information chain of each die under each product series and version; According to the parsed field definition differences, a corresponding structure array framework is constructed, and according to the fixed values ​​indicated in the value position information, the fixed values ​​of the fuse information chain are synchronously initialized to obtain an initialized structure array.

4. The method for generating a chip fuse information chain according to claim 2 or 3, characterized in that: The updating of the initialized structure array according to the measurement value to generate a chip fuse information chain includes: locating the actual chip measurement value to a corresponding element in the structure array according to the value indicated by the value location information being the measurement value; The measured value replaces the original value of the corresponding element in the structure array to generate a chip fuse information chain.

5. The method for generating a chip fuse information chain according to claim 1, wherein: After generating the chip fuse information chain, the method further includes: verifying the generated fuse information chain; if the verification fails, reacquiring the actual chip measurement value and updating the structure array until the fuse information chain verification passes successfully.

6. The method for generating a chip fuse information chain according to claim 1, wherein: The method is applied to the system-level SLT test process, and is used to soft-write the generated fuse information chain into the chip for power-on test during the SLT test, and / or burn the fuse information chain into the chip after the SLT test is passed to complete the finalization of the chip.

7. The method for generating a chip fuse information chain according to claim 1, wherein: The actual chip measurement values ​​are electrical parameter values ​​obtained by actual measurement of the chip through wafer testing and post-packaging testing sites during the chip production test process. The measurement values ​​are used to characterize the actual performance of each chip.

8. A system for generating a chip fuse information chain, characterized in that: include: A file acquisition unit, used to acquire product specification files; A structure creation unit, configured to dynamically create and initialize a structure array adapted to the product specification file based on the product specification file; The generating unit is used to obtain the actual chip measurement value, update the initialized structure array according to the measurement value, and generate the chip fuse information chain.

9. The system for generating chip fuse information chain according to claim 8, characterized in that: The file acquisition unit is specifically used to receive a product specification file name identifier input by a user through a test graphical user interface; download the product specification file corresponding to the name identifier according to the name identifier; the product specification file includes the number of grains included in each product, the length of the fuse information chain of each grain, the definition of each field in the fuse information chain, and value location information, wherein the value location information is used to indicate whether the value source of each field is a measured value or a fixed value.

10. The system for generating chip fuse information chain according to claim 9, characterized in that: The structure creation unit includes: a parsing module for parsing the product specification file and identifying the definition differences of each field of the fuse information chain of each die under each product series and version; The structure construction module is used to construct a corresponding structure array framework according to the parsed field definition differences, and synchronously initialize the fuse information chain fixed value according to the fixed value indicated in the value location information to obtain an initialized structure array.

11. The system for generating chip fuse information chain according to claim 8, characterized in that: The generating unit is specifically configured to: According to the value location specified in the product specification file, the actual chip measurement value is located in the corresponding element of the structure array; Replace the original value of the corresponding element in the structure array with the measured value.

12. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: The processor executes the computer program to implement the method for generating a chip fuse information link according to any one of claims 1 to 7.

13. A computer-readable storage medium, characterized in that The computer-readable storage medium stores one or more computer programs, and when the one or more computer programs are executed by one or more processors, the method for generating a chip fuse information link according to any one of claims 1 to 7 is implemented.

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