Display driving integrated chip and display panel assembly

Abstract

The invention provides a display driving integrated chip and a display panel assembly, and relates to the technical field of display. The display driving integrated chip comprises a substrate, a display driving circuit module, a functional circuit module, a first pin connecting module and a second pin connecting module, the substrate is connected with and supports the first pin connecting module, the display driving circuit module, the functional circuit module and the second pin connecting module; the first side of the first pin connection module is connected with the display driving circuit module, and the second side of the first pin connection module is configured to be connected with a first external device; the third side of the second pin connection module is connected with the display driving circuit module and the functional circuit module, and the fourth side of the second pin connection module is configured to be connected with a second external device. According to the invention, a plurality of functional bare chips are packaged on one substrate to form an integrated display driving integrated chip, and the integrated display driving integrated chip is configured to be connected with other external devices, so that the purposes of high integration, power consumption reduction and stability improvement are achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display driver integrated chip and a display panel assembly. Background Art

[0002] In the field of display technology, active-matrix organic light-emitting diodes (AMOLEDs) are widely used in high-end smartphones and watches. As costs decrease, they are gradually penetrating into mid-range and low-end devices, and are also finding applications in emerging fields such as automotive and transparent displays.

[0003] In traditional AMOLED displays, the display driver integrated circuit (DDIC) is typically connected to the display panel using packaging technologies such as COG (Chip on Glass), COF (Chip on Film), or COP (Chip on Plastic). COG directly bonds the DDIC to a glass substrate, offering a simple structure but occupying a large space, making it difficult to achieve a narrow bezel design. COF transfers the DDIC to a flexible circuit film, which is then bent to conceal the circuitry behind the display, reducing the width of the lower bezel and increasing the screen-to-body ratio. COP, on the other hand, utilizes a flexible panel substrate, making it suitable for foldable display devices.

[0004] However, whether it is COF or COP packaging technology, the assembly components required are independent of each other and are arranged in a dispersed manner, resulting in complex signal connections between components and increased circuit board area, making it difficult to meet the display device's requirements for high integration, low power consumption and high reliability. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a display driver integrated chip and a display panel assembly, which are used to encapsulate multiple functional chip bare chips on a substrate to form an integrated display driver integrated chip. A pin connection module is provided on the display driver integrated chip, which is configured to connect with other external devices to achieve high integration, reduce power consumption, and increase stability.

[0006] In a first aspect, an embodiment of the present application provides a display driver integrated chip, which includes a substrate, a display driver circuit module, a functional circuit module, a first pin connection module and a second pin connection module; the substrate connects and supports the first pin connection module, the display driver circuit module, the functional circuit module and the second pin connection module; the first side of the first pin connection module is connected to the display driver circuit module, and the second side of the first pin connection module is configured to be connected to a first external device; wherein the first side and the second side are different sides of the first pin connection module; the third side of the second pin connection module is connected to the display driver circuit module and the functional circuit module, and the fourth side of the second pin connection module is configured to be connected to a second external device; wherein the third side and the fourth side are different sides of the second pin connection module.

[0007] In an embodiment of the present application, a display driver circuit module, a functional circuit module, a first pin connection module, a second pin connection module, and other components are connected together through a substrate to form an integrated display driver integrated chip. In this display driver integrated chip, internal interconnection is achieved between the components, reducing the complexity of the connection between the components while also reducing the circuit board area. In addition, the first pin connection module and the second pin connection module are respectively connected to external components. Since there is no need to worry about the connection relationship between each component and the external component, the connection relationship between the display driver integrated chip and the external component is simplified, achieving high integration, reducing power consumption, and increasing stability.

[0008] In some embodiments, the first pin connection module, the display driving circuit module, the functional circuit module, and the second pin connection module are all disposed on a surface of the substrate including circuit wiring.

[0009] In the embodiment of the present application, by arranging each device on the surface of the substrate including the circuit wiring, single-sided mounting reduces the number of process steps and shortens the interconnection path.

[0010] In some embodiments, the extension direction of the pins of the display driving circuit module is close to the surface of the substrate containing circuit wiring; wherein, the display driving circuit module is connected to the substrate through the pins; the extension direction of the pins of the functional circuit module is away from the surface of the substrate containing circuit wiring; wherein, the pins of the functional circuit module are connected to the substrate by metal bonding.

[0011] In the embodiment of the present application, the display driving circuit module is directly connected to the substrate, and the functional circuit module is connected to the substrate through metal bonding, thereby improving the space utilization of the substrate.

[0012] In some embodiments, the display driving circuit module and the functional circuit module are arranged on a surface of the substrate including circuit wiring; the first pin connection module and the second pin connection module are arranged on a surface of the substrate not including circuit wiring.

[0013] The embodiment of the present application arranges the first pin connection module and the second pin connection module on the non-circuit wiring surface of the substrate, so that the non-circuit wiring surface is dedicated to external connection, realizing a modular plug-in design, and the connection module is physically isolated from the functional circuit module, reducing the impact between them.

[0014] In some embodiments, the extension direction of the pins of the display driving circuit module and the functional circuit module are close to the surface of the substrate containing circuit wiring, wherein the display driving circuit module and the functional circuit module are respectively connected to the substrate through corresponding pins.

[0015] In the embodiment of the present application, the display driving circuit module and the functional circuit module are both directly connected to the substrate, which simplifies the assembly process.

[0016] In some embodiments, the display driver integrated chip has a first length direction and a first width direction, wherein the length of the display driver integrated chip in the first length direction is greater than the length of the display driver integrated chip in the first width direction; the display driver circuit module has a second length direction and a second width direction, wherein the length of the display driver circuit module in the second length direction is greater than the length of the display driver circuit module in the second width direction; the second length direction of the display driver circuit module is consistent with the first length direction of the display driver integrated chip.

[0017] In the embodiment of the present application, the second length direction of the display driver circuit module is consistent with the first length direction of the display driver integrated chip. Since the length of the display driver integrated chip in the first length direction is greater than the length of the display driver integrated chip in the first width direction, the length of the display driver circuit module in the second length direction is greater than the length of the display driver integrated chip in the second width direction. Therefore, the space in the first length direction of the display driver integrated chip is fully utilized, the width of the display driver integrated chip is reduced, thereby reducing the area and volume of the display driver integrated chip and reducing the production cost.

[0018] In some embodiments, the functional circuit module includes a power supply circuit module and a touch circuit module; the power supply circuit module and the touch circuit module are arranged along the first length direction.

[0019] In the embodiment of the present application, the power supply circuit module and the touch circuit module are arranged along the first length direction. Since the length in the first length direction is greater than the length in the first width direction, the space in the first length direction of the display driver integrated chip can be fully utilized, thereby improving the space utilization of the display driver integrated chip, further improving the integration level, and reducing the production cost.

[0020] In some embodiments, the display driver integrated chip further includes a plastic encapsulation layer; the plastic encapsulation layer covers and encapsulates the display driver circuit module and the functional circuit module, and forms a sealed interface with the substrate.

[0021] The embodiment of the present application protects the circuit module on the substrate through the plastic packaging layer, thereby reducing the damage rate of the display driver integrated chip and improving stability.

[0022] In some embodiments, the plastic packaging layer includes heat dissipation channels; the heat dissipation channels are distributed along the circumference of the display driving circuit module and the functional circuit module, and extend to the outer surface of the plastic packaging layer.

[0023] In the embodiment of the present application, taking into account the high layout density of the display driver integrated chip, in order to solve the heating problem of each circuit module in the display driver integrated chip, a heat dissipation channel is provided in the plastic packaging layer to improve the heat dissipation effect of the display driver integrated chip.

[0024] In some embodiments, the heat dissipation channel includes at least one topological structure selected from the group consisting of a straight line, a tree-like structure, and a spiral gradient structure.

[0025] The embodiment of the present application provides various types of heat dissipation channels, so that they can be adaptively configured according to the actual conditions of the circuit module, thereby further improving the heat dissipation effect of the display driver integrated chip.

[0026] In a second aspect, an embodiment of the present application provides a display panel assembly, which includes a display panel, a flexible circuit film, a flexible printed circuit board, and a display driver integrated chip of the second embodiment or the third embodiment in the first aspect; wherein, the flexible circuit film is connected to the display panel; one side of the display driver integrated chip is attached and connected to the flexible circuit film, and the other side of the display driver integrated chip is connected to the flexible printed circuit board.

[0027] In an embodiment of the present application, the display panel assembly includes four components, namely, a display panel, a flexible circuit film, a flexible printed circuit board, and a display driver integrated chip. For display panel manufacturers, material preparation is reduced, the assembly process is streamlined, and the yield and reliability of the display panel assembly are improved.

[0028] In a third aspect, an embodiment of the present application provides a display panel assembly, which includes a flexible display panel, a flexible printed circuit board, and a display driver integrated chip of the fourth embodiment or the fifth embodiment in the first aspect; wherein one side of the display driver integrated chip is attached and connected to the flexible display panel, and the other side of the display driver integrated chip is connected to the flexible printed circuit board.

[0029] In an embodiment of the present application, when the display panel is a flexible display panel, the display panel assembly includes three devices, namely, a flexible display panel, a flexible printed circuit board and a display driver integrated chip. For display panel manufacturers, material preparation is reduced, the assembly process is streamlined, and the yield and reliability of the display panel assembly are improved.

[0030] Other features and advantages of the present application will be described in the subsequent description, and in part will become apparent from the description, or will be understood by practicing the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 A schematic structural diagram of a traditional display panel assembly based on COF connection provided in an embodiment of the present application; Figure 2 A schematic structural diagram of a traditional display panel assembly based on COP connection provided in an embodiment of the present application; Figure 3 A schematic structural diagram of the first display driver integrated chip provided in an embodiment of the present application; Figure 4 A schematic diagram of the positions of the modules on the substrate of the first embodiment of the present application; Figure 5 A schematic structural diagram of a second display driver integrated chip provided in an embodiment of the present application; Figure 6 A schematic diagram of the positions of the second modules on the substrate provided in an embodiment of the present application; Figure 7 A schematic structural diagram of a third display driver integrated chip provided in an embodiment of the present application; Figure 8 A schematic diagram of a heat dissipation channel provided in an embodiment of the present application; Figure 9 A schematic structural diagram of a first display panel assembly provided in an embodiment of the present application; Figure 10 This is a schematic structural diagram of the second display panel assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0034] It should be noted that all technical and scientific terms used herein have the same meanings as those commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0036] In the field of display technology, active-matrix organic light-emitting diodes (AMOLEDs) are widely used in high-end smartphones and watches. As costs decrease, they are gradually penetrating into mid-range and low-end devices, and are also finding applications in emerging fields such as automotive and transparent displays.

[0037] In traditional AMOLEDs, the display driver integrated circuit (DDIC) is typically connected to the display panel using packaging technologies such as COG (Chip on Glass), COF (Chip on Film), or COP (Chip on Plastic). COG directly bonds the DDIC to the glass substrate, resulting in a simple structure but a large footprint, making it difficult to achieve a narrow-bezel design.

[0038] To achieve a narrow bezel design, packaging technologies such as COF and COP have been proposed. COF transfers the DDIC onto a flexible circuit film, which is then bent to conceal the circuitry behind the display, reducing the width of the bottom bezel and increasing the screen-to-body ratio. COP, on the other hand, utilizes a flexible panel substrate, directly bonding the DDIC to a flexible polyimide substrate. This eliminates the need for additional film bending, allowing the bottom bezel to be compressed to a near-constant width on all four sides, making it suitable for foldable display devices.

[0039] Using COF packaging technology, the components in the display panel assembly are connected via the following scheme: display panel - flexible circuit film (COF) - flexible printed circuit (FPC), or panel-COF-FPC. The COF acts as a bridge to distribute the signal pins of the display driver integrated circuit (DDIC), achieving micron-level lamination of the numerous source and gate electrodes to the display panel, and connecting the high-speed interface and power supply to the FPC. The power management integrated circuit (PMIC), touch panel integrated circuit (TPIC), and passive components are also typically placed on the FPC.

[0040] Figure 1 A schematic diagram of the structure of a conventional display panel assembly based on COF connection provided in an embodiment of the present application is shown in FIG. Figure 1 As shown in the figure, in the COF connection method, the display panel is connected to the flexible circuit film, which is connected to one side of the flexible printed circuit board (FPCB), and the other side of the FPCB is connected to the terminal. The display driver integrated circuit is attached to the FPCB, while passive components such as inductors, resistors, and capacitors, as well as the power management integrated circuit and touch control integrated circuit, are attached to the FPCB.

[0041] according to Figure 1 As can be seen, the components are installed separately and independently. Assembly of the display panel assembly requires a large number of materials and a complex process. For example, the display driver integrated circuit, power management integrated circuit, and touch control integrated circuit all need to be prepared and assembled separately. Furthermore, the flexible printed circuit board requires a large area for layout of the components, increasing costs and limiting its application. Furthermore, the independent operation of the components increases the defect rate and damage rate.

[0042] Using COP packaging technology, the components in the display panel assembly are connected via a display panel-flexible printed circuit (FPC) architecture, or panel-FPC. A flexible substrate extending from the display panel substrate acts as a bridge to distribute the signal pins of the display driver integrated circuit (DDIC), achieving micron-level lamination of numerous source and gate electrodes to the display panel, and connecting high-speed interfaces and power supplies to the FPC. Power management integrated circuits (PMICs), touch panel integrated circuits (TPICs), and passive components are also typically placed on the FPC.

[0043] Figure 2 A schematic diagram of the structure of a traditional display panel assembly based on COP connection provided in an embodiment of the present application is shown in FIG. Figure 2 As shown in the figure, in the COP connection method, the display panel itself is a flexible polyimide substrate that extends a certain length from the display panel area and can be bent. The bendable area is connected to one side of the flexible printed circuit board, and the other side of the flexible printed circuit board is connected to the terminal. The display driver integrated circuit is attached to the extended substrate, and passive components such as inductors, resistors and capacitors, as well as the power management integrated circuit and touch control integrated circuit are attached to the flexible printed circuit board.

[0044] according to Figure 2 As can be seen, the components are installed separately and independently. Assembly of the display panel assembly requires a large number of materials and a complex process. For example, the display driver integrated circuit, power management integrated circuit, and touch control integrated circuit all need to be prepared and assembled separately. Furthermore, the flexible printed circuit board requires a large area for layout of the components, increasing costs and limiting its application. Furthermore, the independent operation of the components increases the defect rate and damage rate.

[0045] Based on the above content, it can be seen that whether it is COF packaging technology or COP packaging technology, the assembly components required are independent of each other and are arranged in a dispersed manner, resulting in complex signal connections between each component and increased circuit board area, which makes it difficult to meet the display device's requirements for high integration, low power consumption and high reliability.

[0046] In response to the above problems, the present application provides a display driver integrated chip, which is used to package multiple functional chip dies and different circuits on a substrate to form an integrated display driver integrated chip. A pin connection module is provided on the display driver integrated chip, which is configured to connect with other external devices to achieve high integration, reduce power consumption and increase stability.

[0047] Figure 3 A schematic diagram of the structure of a display driver integrated chip provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, the display driver integrated chip 10 includes a substrate 11, a display driver circuit module 12, a functional circuit module 13, a first pin connection module 14 and a second pin connection module 15; the substrate 11 connects and supports the first pin connection module 14, the display driver circuit module 12, the functional circuit module 13 and the second pin connection module 15; a first side of the first pin connection module 14 is connected to the display driver circuit module 12, and a second side of the first pin connection module 14 is configured to be connected to a first external device; wherein the first side and the second side are different sides of the first pin connection module 14; a third side of the second pin connection module 15 is connected to the display driver circuit module 12 and the functional circuit module 13, and a fourth side of the second pin connection module 15 is configured to be connected to a second external device; wherein the third side and the fourth side are different sides of the second pin connection module 15.

[0048] The substrate 11 is the core carrier of the display driver integrated chip, used to carry and interconnect the display driver circuit module 12, the functional circuit module 13, the first pin connection module 14 and the second pin connection module 15, and provide mechanical support and electrical connection functions.

[0049] The display driving circuit module 12 is responsible for receiving the image signal from the host computer and converting it into the analog voltage / current signal required to drive the display panel, so as to control the brightness, color and timing of each pixel to realize image display.

[0050] The functional circuit module 13 refers to a collection of integrated circuits that provide auxiliary functions for the display system, and implements key supporting functions such as power management and touch interaction through modular design.

[0051] The functional circuit module 13 may include a power supply circuit module and a touch circuit module. The power supply circuit module is responsible for converting the input voltage into the various supply voltages required for display driving. The touch circuit module is used to acquire and process touch signals, supporting multi-touch and gesture recognition functions.

[0052] It should be noted that the functional circuit module 13 may further include at least one of a brightness compensation module, an ambient light adjustment module, a biometric recognition module, a temperature compensation module, and a frame buffer module, etc. Specific configurations may be made adaptively according to actual conditions.

[0053] The first pin connection module 14 and the second pin connection module 15 are high-speed signal interface units located at the edge of the substrate and are responsible for signal transmission.

[0054] It should be noted that each circuit module also includes other passive components, such as capacitors, inductors, resistors, etc. For example, the display driver circuit module includes a display driver integrated circuit and a pump capacitor, wherein the pump capacitor is used to display the built-in voltage of the driver circuit module. The power supply circuit module includes a power management integrated circuit and related resistors and capacitors. The touch control circuit module includes a touch control integrated circuit and related inductors.

[0055] During the specific implementation process, since the substrate carries and interconnects various modules, the substrate 11 has a length direction and a width direction. Therefore, it can be obtained that the display driver integrated chip has a first length direction and a first width direction, wherein the length of the display driver integrated chip in the first length direction is greater than the length of the display driver integrated chip in the first width direction.

[0056] The display driver circuit module is typically in an elongated shape, having a second length direction and a second width direction. The length of the display driver circuit module in the second length direction is greater than the length of the display driver circuit module in the second width direction. The second length direction of the display driver circuit module coincides with the first length direction of the display driver integrated chip. Therefore, the length of the display driver integrated chip in the first length direction is determined based on the length of the display driver circuit module in the second length direction.

[0057] Therefore, in order to reduce the length of the display driver integrated chip in the first length direction and reduce the probability of the display driver integrated chip breaking, when designing the module distribution, the first pin connection module 14, the display driver circuit module 12, the functional circuit module 13 and the second pin connection module 15 can be arranged in sequence along the width direction of the substrate, so that the length of the display driver integrated chip in the first length direction is roughly equal to the length of the display driver circuit module in the second length direction, and the space in the width direction of the substrate is fully utilized.

[0058] Since the functional circuit module may include multiple circuit modules providing different functions, and the functional circuit module only provides auxiliary functions, its occupied area is smaller than the area of ​​the display driver circuit module. Therefore, when laying out the multiple different functional circuit modules, the multiple different functional circuit modules are arranged below the display driver circuit module, and the multiple different functional circuit modules are arranged sequentially along the length direction of the substrate to minimize the length of the display driver integrated chip in the first width direction, thereby making the wide side of the display driver integrated chip as narrow as possible and the total area of ​​the display driver integrated chip as small as possible, thereby facilitating assembly with other external devices (such as a flexible circuit film or a flexible substrate, etc.).

[0059] However, it should be noted that the total length of the multiple functional circuit modules after being arranged in sequence is no greater than the length of the display driver circuit module 12 in the second length direction. Therefore, if the multiple functional circuit modules cannot be placed in the first row below the display driver circuit module along the length direction of the substrate, they will be placed in the second row, and so on, until all functional circuit modules are laid out.

[0060] The specific positions of each functional circuit module on the substrate can be adaptively set according to actual conditions, as long as the following connection relationship is met: the first side of the first pin connection module 14 is connected to the display driving circuit module 12, and the second side of the first pin connection module 14 is configured to be connected to a first external device; wherein, the first side and the second side are different sides of the first pin connection module 14; the third side of the second pin connection module 15 is connected to the display driving circuit module 12 and the functional circuit module 13, and the fourth side of the second pin connection module 15 is configured to be connected to a second external device; wherein, the third side and the fourth side are different sides of the second pin connection module 15.

[0061] The first side and the second side are different sides of the first pin connection module 14. The first side and the second side may be opposite to each other or not.

[0062] In an embodiment of the present application, a display driver circuit module, a functional circuit module, a first pin connection module, a second pin connection module, and other components are connected together through a substrate to form an integrated display driver integrated chip. In this display driver integrated chip, internal interconnection is achieved between the components, reducing the complexity of the connection between the components while also reducing the circuit board area. In addition, the first pin connection module and the second pin connection module are respectively connected to external components. Since there is no need to worry about the connection relationship between each component and the external component, the connection relationship between the display driver integrated chip and the external component is simplified, achieving high integration, reducing power consumption, and increasing stability.

[0063] Figure 4 The first embodiment of the present application provides a schematic diagram of the positions of the modules on the substrate, as shown in FIG. Figure 4 As shown, the first pin connection module 14 , the display driving circuit module 12 , the functional circuit module 13 and the second pin connection module 5 are all arranged on the surface of the substrate 11 including the circuit wiring.

[0064] In the specific implementation process, if the display driver integrated chip is packaged using COF packaging technology, since the COF packaging technology binds the display driver integrated circuit to an independent flexible circuit film, the flexible circuit film serves as a signal transfer layer and only needs to realize the interconnection between the display driver integrated circuit and the display panel.

[0065] For the display driver integrated chip provided in the embodiment of the present application, a single layer of circuit wiring is provided on the substrate to meet the signal routing requirements.

[0066] Therefore, the first pin connection module 14, the display driving circuit module 12, the functional circuit module 13, and the second pin connection module 15 are all disposed on the surface of the substrate 11 that includes the circuit wiring. In other words, the first pin connection module 14, the display driving circuit module 12, the functional circuit module 13, and the second pin connection module 15 are all disposed above the substrate 11.

[0067] Based on the above embodiments, it can be seen that when packaging is performed using COF packaging technology, the substrate only includes a single layer of circuit wiring, which is mainly used for signal routing of the display driver circuit module. Therefore, in some embodiments, the extension direction of the pins of the display driver circuit module 12 is close to the surface of the substrate 11 containing the circuit wiring; wherein, the display driver circuit module 12 is connected to the substrate 11 through the pins; the extension direction of the pins of the functional circuit module 13 is away from the surface of the substrate 11 containing the circuit wiring; wherein, the pins of the functional circuit module 13 are connected to the substrate 11 by metal bonding.

[0068] Figure 5 This is a schematic diagram of the structure of a second display driver integrated chip provided in an embodiment of the present application, wherein the functional circuit module 13 includes a power supply circuit module and a touch circuit module. The display driver integrated chip is used for COF packaging.

[0069] like Figure 5 As shown, the first side (bottom) of the first pin connection module 14 is connected to the display driver circuit module 12, and the second side (top) of the first pin connection module 14 is connected to the flexible circuit film (the first external component). The power supply circuit module and the touch circuit module are arranged along the first length direction of the display driver integrated chip, located to the lower left and lower right of the display driver circuit module 14, respectively. The second pin connection module 15 is located below the power supply circuit module and the touch circuit module. The third side (top) of the second pin connection module 15 is connected to the power supply circuit module, the display driver circuit module 12, and the touch circuit module, respectively. The fourth side (bottom) of the second pin connection module 15 is connected to the flexible printed circuit board (the second external component).

[0070] To improve the binding stability between the display driver integrated chip and the flexible circuit film, the length of the second side of the first pin connection module 14 may be 2 to 3 times the length of the first side.

[0071] It should be understood that the length of the second side of the first pin connection module 14 may also be equal to the length of the first side, or may be set to a longer length to adapt to different assembly environments.

[0072] In the specific implementation process, the pins in the first pin connection module 14 are of the micrometer level. The second side of the first pin connection module 14 is heat-pressed and bonded to the flexible circuit film using anisotropic conductive adhesive. The fourth side of the second pin connection module 15 is connected to the flexible printed circuit board by welding.

[0073] Figure 6 The second schematic diagram of the position of each module on the substrate provided in the embodiment of the present application is as follows: Figure 6 As shown, the display driving circuit module and the functional circuit module are arranged on the surface of the substrate containing circuit wiring; the first pin connection module and the second pin connection module are arranged on the surface of the substrate without circuit wiring.

[0074] In the specific implementation process, if the display driver integrated chip is packaged using COP packaging technology, since the COP packaging technology directly binds the display driver integrated circuit to the display panel flexible substrate, it is necessary to integrate high-density signals such as the display driver signal, touch signal power distribution network, etc. on the panel flexible substrate.

[0075] For the display driver integrated chip provided in the embodiments of the present application, multiple layers of circuit wiring are required on the substrate to prevent signal crosstalk. The number of layers of circuit wiring is determined based on the number of signals between each circuit module. For example, two layers of circuit wiring can be provided to ensure that all signals are interconnected.

[0076] Therefore, the display driver circuit module 12 and the functional circuit module 13 are disposed on the surface of the substrate containing circuit wiring, while the first pin connection module 14 and the second pin connection module 15 are disposed on the surface of the substrate without circuit wiring. That is, the display driver circuit module 12 and the functional circuit module 13 are disposed above the substrate, while the first pin connection module 14 and the second pin connection module 15 are disposed below the substrate. The first pin connection module 14 and the second pin connection module 15 are connected to the display driver circuit module 12, the functional circuit module 13, and the first and second external devices, respectively, through upper and lower layer conduction.

[0077] Based on the above embodiments, it can be seen that when packaging is performed using COP packaging technology, the substrate includes multiple layers of circuit wiring. Therefore, in some embodiments, the pins of the display driver circuit module 12 and the functional circuit module 13 extend in a direction close to the surface of the substrate 11 containing the circuit wiring, wherein the display driver circuit module 12 and the functional circuit module 13 are connected to the substrate 11 via corresponding pins. The interconnection between the signals of each circuit module is achieved through the multiple layers of circuit wiring on the substrate 11, without the need for connection through metal bonding.

[0078] The advantage of the pins in the first pin connection module 14 and the second pin connection module 15 being located at the bottom of the substrate 11 is that the length of the display driver integrated chip in the first width direction can be further compressed, so that the length of the display driver integrated chip in the first width direction can be reduced to within 3 mm.

[0079] For example, the length of an AMOLED DDIC is 30000um×900um, and the volume of the display driver integrated chip can be realized as 32mm×3mm×1mm in length, width and height.

[0080] Figure 7 This is a schematic diagram of the structure of a third display driver integrated chip provided in an embodiment of the present application, wherein the functional circuit module 13 includes a power supply circuit module and a touch circuit module. The display driver integrated chip is used for COP packaging.

[0081] like Figure 7 As shown, the first side (bottom) of the first pin connection module 14 is connected to the display driver circuit module 12, and the second side (top) of the first pin connection module 14 is connected to the flexible circuit film (the first external component). The power supply circuit module and the touch control circuit module are arranged along the first length direction of the display driver integrated chip, located to the lower left and lower right of the display driver circuit module 12, respectively. The second pin connection module 15 is located below the power supply circuit module and the touch control circuit module. The third side (top) of the second pin connection module 15 is connected to the power supply circuit module, the display driver circuit module 12, and the touch control circuit module, respectively. The fourth side (bottom) of the second pin connection module 15 is connected to the flexible printed circuit board (the second external component).

[0082] It should be understood that the length of the second side of the first pin connection module 14 may be equal to the length of the first side, or may be set to a longer length to adapt to different assembly environments.

[0083] In the specific implementation process, the pins in the first pin connection module 14 are of the micrometer level. The second side of the first pin connection module 14 is heat-pressed and bonded to the flexible circuit film using anisotropic conductive adhesive. The fourth side of the second pin connection module 15 is connected to the flexible printed circuit board by welding.

[0084] In some embodiments, the functional circuit module includes a power supply circuit module and a touch circuit module; the power supply circuit module and the touch circuit module are arranged along the first length direction.

[0085] Based on the above embodiment, it can be seen that the functional circuit module may include multiple circuit modules that implement different functions. In this embodiment, the functional circuit module includes a power supply circuit module and a touch circuit module. When the modules are distributed on the substrate, the power supply circuit module and the touch circuit module are arranged along the first length direction. The power supply circuit module can be to the left of the touch circuit module or to the right of the touch circuit module.

[0086] In the embodiment of the present application, the power supply circuit module and the touch circuit module are arranged along the first length direction. Since the length in the first length direction is greater than the length in the first width direction, the space in the first length direction of the display driver integrated chip can be fully utilized, thereby improving the space utilization of the display driver integrated chip, further improving the integration level, and reducing the production cost.

[0087] It should be noted that the power supply circuit module and the touch circuit module can also be arranged along the first width direction, wherein the power supply circuit module can be above the touch circuit module or below the touch circuit module.

[0088] like Figure 4 As shown or Figure 6 As shown, the display driver integrated chip further includes a plastic packaging layer; the plastic packaging layer covers and encapsulates the display driver circuit module 12 and the functional circuit module 13 , and forms a sealed interface with the substrate 11 .

[0089] The embodiment of the present application protects the circuit module on the substrate through the plastic packaging layer, thereby reducing the damage rate of the display driver integrated chip and improving stability.

[0090] Figure 8 A schematic diagram of a heat dissipation channel provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the plastic packaging layer includes heat dissipation channels. The heat dissipation channels are distributed along the circumference of the display driving circuit module and the functional circuit module and extend to the outer surface of the plastic packaging layer.

[0091] The heat dissipation channel includes at least one topological structure of a straight line type, a tree type and a spiral gradient type.

[0092] In practice, given the limited overall thickness of the display driver integrated circuit, the hydraulic diameter of linear heat dissipation channels is typically set within 0.2mm. Tree-shaped heat dissipation channels have three to five branching stages, with the diameter of the final channel 1 / 5 to 1 / 3 that of the first. Spiral-shaped heat dissipation channels have an initial pitch of 0.1mm, with a pitch increment of 0.05 per revolution, but no more than 0.2mm.

[0093] In order to further improve the heat dissipation effect of the display driver integrated chip, in addition to setting a heat dissipation channel in the plastic packaging layer, a thermal conductive material (such as Figure 8 As shown in the figure), for example, adding thermal conductive materials such as boron nitride and boron silicide to the plastic packaging material to improve the heat dissipation effect of the plastic packaging layer surface.

[0094] The substrate may also be configured as a substrate having thermal conductivity, such as an aluminum substrate, an aluminum oxide substrate, a beryllium oxide substrate, a diamond substrate, and a carbon fiber composite material substrate, to improve the heat dissipation effect at the bottom of the substrate.

[0095] It is also possible to reasonably utilize the space in the first length direction of the display driver integrated chip, disperse the various circuit modules as much as possible, and fill passive components such as capacitors and inductors between the circuit modules to reduce the mutual influence between the circuit modules, thereby improving the heat dissipation effect.

[0096] In this embodiment of the present application, taking into account the high layout density of the display driver integrated chip, heat dissipation channels are provided in the plastic encapsulation layer to address the heat generation problem of each circuit module in the display driver integrated chip. Furthermore, by providing multiple types of heat dissipation channels, adaptive configuration can be made based on the actual situation of the circuit modules, further improving the heat dissipation effect of the display driver integrated chip.

[0097] In some embodiments, Figure 9 This is a schematic diagram of the structure of the first display panel assembly provided in the embodiment of the present application, as shown in FIG. Figure 9 As shown, the display panel assembly includes a display panel, a flexible circuit film, a flexible printed circuit board and a display driver integrated chip; wherein, the flexible circuit film is connected to the display panel; one side of the display driver integrated chip is attached and connected to the flexible circuit film, and the other side of the display driver integrated chip is connected to the flexible printed circuit board.

[0098] according to Figure 9As can be seen, the display panel assembly structurally consists of only four components: a display panel, a flexible circuit film, a flexible printed circuit board (FPCB), and a display driver integrated circuit (IC). Components such as the display driver integrated circuit (IC), power management integrated circuit (CMIC), touch control IC, first pin connection module, second pin connection module, and capacitors are all integrated into the IC and used as a single unit. For display panel manufacturers, when producing the display panel assembly, they only need to procure the display panel, flexible circuit film, FPCB, and display driver integrated circuit. Since there is no need to separately purchase individual circuit modules such as the DIC and PMC, material preparation is reduced, the assembly process is streamlined, and the yield and reliability of the display panel assembly are improved. Furthermore, since the FPCB is free of components, its area can be reduced while increasing its flexibility. Furthermore, the single component design improves maintainability and reduces maintenance costs.

[0099] Figure 10 A schematic diagram of the structure of the second display panel assembly provided in the embodiment of the present application is shown in FIG. Figure 10 As shown, the display panel assembly includes a flexible display panel, a flexible printed circuit board and a display driver integrated chip; wherein one side of the display driver integrated chip is attached and connected to the flexible display panel, and the other side of the display driver integrated chip is connected to the flexible printed circuit board.

[0100] according to Figure 10 As can be seen, the display panel assembly structurally consists of only three components: a flexible display panel, a flexible printed circuit board (FPC), and a display driver integrated chip. As can be seen from the above embodiments, for display panel manufacturers, material preparation is reduced, the assembly process is streamlined, and the yield and reliability of the display panel assembly are improved. Furthermore, the FPC lacks components, allowing for a smaller area and increased flexibility. Furthermore, the single component design improves maintainability and reduces maintenance costs.

[0101] In the embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interface, the indirect coupling or communication connection of the device or unit can be electrical, mechanical or other forms.

[0102] In addition, the units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0103] Furthermore, the functional modules in each embodiment of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0104] The above description is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display driver integrated chip, characterized in that: The display driver integrated chip includes a substrate, a display driver circuit module, a functional circuit module, a first pin connection module and a second pin connection module; The substrate connects and supports the first pin connection module, the display driving circuit module, the functional circuit module and the second pin connection module; A first side of the first pin connection module is connected to the display driving circuit module, and a second side of the first pin connection module is configured to be connected to a first external device; wherein the first side and the second side are different sides of the first pin connection module; The third side of the second pin connection module is connected to the display driving circuit module and the functional circuit module, and the fourth side of the second pin connection module is configured to be connected to a second external device; wherein the third side and the fourth side are different sides of the second pin connection module.

2. The display driver integrated chip according to claim 1, characterized in that: The first pin connection module, the display driving circuit module, the functional circuit module and the second pin connection module are all arranged on a surface of the substrate including circuit wiring.

3. The display driver integrated chip according to claim 2, characterized in that: The pins of the display driving circuit module extend in a direction close to the surface of the substrate containing the circuit wiring; wherein the display driving circuit module is connected to the substrate via the pins; The extension direction of the pins of the functional circuit module is away from the surface of the substrate including the circuit wiring; wherein the pins of the functional circuit module are connected to the substrate by metal bonding.

4. The display driver integrated chip according to claim 1, wherein: The display driving circuit module and the functional circuit module are arranged on a surface of the substrate including circuit wiring; the first pin connection module and the second pin connection module are arranged on a surface of the substrate not including circuit wiring.

5. The display driver integrated chip according to claim 4, characterized in that: The extension directions of the pins of the display driving circuit module and the functional circuit module are both close to the surface of the substrate containing circuit wiring, wherein the display driving circuit module and the functional circuit module are respectively connected to the substrate through corresponding pins.

6. The display driver integrated chip according to any one of claims 1 to 5, characterized in that: The display driver integrated chip has a first length direction and a first width direction, wherein the length of the display driver integrated chip in the first length direction is greater than the length of the display driver integrated chip in the first width direction; The display driving circuit module has a second length direction and a second width direction, wherein the length of the display driving circuit module in the second length direction is greater than the length of the display driving circuit module in the second width direction; The second length direction of the display driver circuit module is consistent with the first length direction of the display driver integrated chip.

7. The display driver integrated chip according to claim 6, characterized in that: in, The functional circuit module includes a power supply circuit module and a touch circuit module; The power supply circuit module and the touch control circuit module are arranged along the first length direction.

8. The display driver integrated chip according to any one of claims 1 to 5, characterized in that: in, The display driver integrated chip further includes a plastic packaging layer; The plastic packaging layer covers and encapsulates the display driving circuit module and the functional circuit module, and forms a sealed interface with the substrate.

9. The display driver integrated chip according to claim 8, characterized in that: in, The plastic sealing layer includes a heat dissipation channel; The heat dissipation channels are distributed along the circumference of the display driving circuit module and the functional circuit module, and extend to the outer surface of the plastic packaging layer.

10. The display driver integrated chip according to claim 9, characterized in that: in, The heat dissipation channel includes at least one topological structure of a straight line type, a tree type and a spiral gradient type.

11. A display panel assembly, characterized in that: The display panel assembly comprises a display panel, a flexible circuit film, a flexible printed circuit board, and the display driver integrated chip according to any one of claims 2-3; Wherein, the flexible circuit film is connected to the display panel; One side of the display driver integrated chip is attached and connected to the flexible circuit film, and the other side of the display driver integrated chip is connected to the flexible printed circuit board.

12. A display panel assembly, characterized in that: The display panel assembly comprises a flexible display panel, a flexible printed circuit board and the display driver integrated chip according to any one of claims 4-5; One side of the display driver integrated chip is attached and connected to the flexible display panel, and the other side of the display driver integrated chip is connected to the flexible printed circuit board.

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