Substrate transfer apparatus and substrate processing apparatus

Abstract

The invention relates to a substrate conveying apparatus and a substrate processing apparatus. The substrate transport device (IR) transports a substrate (W). The substrate conveying device comprises a hand part (11), a hand part supporting part (12) and a lifting part (9). The hand supports the substrate. The hand support part supports a hand. The hand part is provided with a base part (11B), a hand part main body (11A), and supporting parts (17a) and (17b). The base part is connected with the hand supporting part. The hand body extends in a horizontal direction from the base. The supporting part is arranged on the front end side of the hand main body and supports the substrate. The raising and lowering unit raises and lowers at least a portion of each of the support units.

Description

Technical Field

[0001] The present invention relates to a substrate conveying device and a substrate processing device. Background Art

[0002] Various substrate processing devices for processing substrates are equipped with substrate transport devices equipped with hands. For example, Patent Document 1 discloses a horizontal transfer robot installed in a batch-type substrate processing device. The horizontal transfer robot transports substrates between a carrier and a posture conversion mechanism. The horizontal transfer robot has the same number of hand elements (hand element groups) as the number of substrates that can be accommodated in the carrier. In the carrier, multiple substrates in a horizontal posture are stacked at predetermined intervals in the vertical direction. The horizontal transfer robot causes the hand element group to enter the carrier, takes the multiple substrates accommodated in the carrier out of the carrier at once, and transports them to the posture conversion mechanism. In addition, the horizontal transfer robot receives the multiple substrates after substrate processing from the posture conversion mechanism through the hand element group, transports them to an empty carrier, and stores the multiple substrates after substrate processing in the carrier.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 11-214470 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] However, if sufficient clearance between substrates stored in the carrier cannot be ensured, the hand may come into contact with a substrate when entering the carrier. The clearance between substrates decreases due to factors such as substrate warpage, substrate thickness, tolerances of carrier components, and hand droop. Furthermore, if the substrate transport device operates at high speed, the hand is susceptible to vibration during movement. Therefore, if the substrate transport device operates at high speed, the hand may enter the carrier while vibrating. Therefore, if sufficient clearance between substrates cannot be ensured, and the substrate transport device operates at high speed, the hand may come into contact with a substrate when entering the carrier.

[0008] The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a substrate transport apparatus and a substrate processing apparatus that can reduce the possibility of a moving hand coming into contact with a substrate arranged in a predetermined area.

[0009] Means for solving problems

[0010] According to one aspect of the present invention, a substrate transport device is a device for transporting substrates. The substrate transport device includes a hand, a hand support portion, and a lifting portion. The hand supports the substrate. The hand support portion supports the hand. The hand includes a base, a hand body, and a support portion. The base is connected to the hand support portion. The hand body extends horizontally from the base. The support portion is provided at the front end of the hand body to support the substrate. The lifting portion raises and lowers at least a portion of the support portion.

[0011] In one embodiment, the lifting portion includes a flow path and a lifting member. The flow path is provided inside the hand body. The lifting member lifts or lowers at least a portion of the support portion in response to pressure changes in the flow path.

[0012] In one embodiment, the support portion includes a support member protruding upward from the hand body. The support member includes a support body and a wall. The support body supports the substrate. The wall faces an end surface of the substrate supported by the support body. The lifting portion includes a wall lifting portion for lifting the wall.

[0013] In one embodiment, the support selectively supports one of a first substrate and a second substrate different from the first substrate. The support includes a first supporting surface, a wall surface, and a second supporting surface. The first supporting surface supports the first substrate. The wall surface faces the end surface of the first substrate supported by the first supporting surface. The second supporting surface supports the second substrate at a higher position than the first supporting surface. The wall body faces the end surface of the second substrate supported by the second supporting surface.

[0014] In one embodiment, the lifting unit includes the wall lifting unit and a support lifting unit. The support lifting unit lifts and lowers the support.

[0015] In one embodiment, the support portion includes two support members protruding upward from the hand body. Each of the two support members has a support surface and a wall surface. The support surface supports the substrate. The wall surface faces the end surface of the substrate supported by the support surface. The lifting portion includes two lifting parts for lifting and lowering the two support members, respectively.

[0016] According to another aspect of the present invention, a substrate processing apparatus is an apparatus for processing substrates. The substrate processing apparatus includes a substrate processing unit and a transport unit. The substrate processing unit processes the substrate. The transport unit transports the substrate between a substrate storage container capable of accommodating the substrate and the substrate processing unit. The transport unit includes the aforementioned substrate transport device.

[0017] In a certain embodiment, the substrate processing apparatus further includes a control unit for controlling the lifting unit included in the substrate conveying device. The lifting unit causes at least a portion of the support portion to rise and fall between an upper position and a lower position below the upper position. The substrate conveying device conveys the substrate located in a prescribed area to the outside of the prescribed area. The control unit causes at least a portion of the support portion to be located in the lower position before the hand enters the gap between the substrate located in the prescribed area and the opposing element opposing the lower surface of the substrate in the prescribed area. In addition, the control unit causes at least a portion of the support portion to rise from the lower position to the upper position when the substrate is supported by the hand entering the gap.

[0018] In one embodiment, the predetermined area includes an inner space of the substrate storage container. The substrate transfer device transfers a specific substrate stored in the inner space of the substrate storage container to the outside of the substrate storage container. The opposing element includes another substrate stored in the inner space of the substrate storage container.

[0019] In one embodiment, the substrate processing apparatus further includes a control unit that controls the lifting unit included in the substrate transport device. The lifting unit raises and lowers at least a portion of the support unit between an upper position and a lower position below the upper position. The substrate transport device transports the substrate from outside the predetermined area to the predetermined area, thereby placing the substrate in the predetermined area. The control unit positions at least a portion of the support unit in the lower position when the hand retracts from the predetermined area after placing the substrate in the predetermined area.

[0020] In one embodiment, the predetermined area includes the inner space of the substrate storage container. The substrate transport device transports the specific substrate into the inner space of the substrate storage container, thereby placing the specific substrate in the inner space of the substrate storage container. The control unit positions at least a portion of the support portion in the lower position when the hand, after placing the specific substrate in the inner space of the substrate storage container, passes through a gap between the specific substrate and other substrates facing the lower surface of the specific substrate and retracts from the substrate storage container.

[0021] According to the substrate transfer apparatus and substrate processing apparatus according to the present invention, the possibility of a moving hand coming into contact with a substrate arranged in a predetermined area can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a plan view schematically showing the configuration of the substrate processing apparatus according to the first embodiment of the present invention.

[0023] Figure 2 It is a cross-sectional view of a substrate storage container.

[0024] Figure 3 It is a side view schematically showing the configuration of the substrate processing apparatus according to the first embodiment of the present invention.

[0025] Figure 4 This is a block diagram showing a part of the configuration of the substrate processing apparatus according to the first embodiment of the present invention.

[0026] Figure 5 This is a diagram showing a part of the configuration of the substrate processing apparatus according to the first embodiment of the present invention.

[0027] Figure 6 (a) is a top view showing the hand of the indexer robot according to the first embodiment of the present invention; Figure 6 (b) is a cross-sectional view showing the hand of the indexer robot according to the first embodiment of the present invention; Figure 6 (c) is another plan view showing the hand of the indexer robot according to the first embodiment of the present invention.

[0028] Figure 7 (a) is a cross-sectional view schematically showing a first state of a hand included in the indexer robot according to the first embodiment of the present invention; Figure 7 (b) is a cross-sectional view schematically showing a second state of the hand included in the indexer robot according to the first embodiment of the present invention; Figure 7 (c) is another cross-sectional view schematically showing the hand of the indexer robot according to the first embodiment of the present invention.

[0029] Figure 8 This is a diagram showing the configuration of an indexer robot according to Embodiment 1 of the present invention.

[0030] Figure 9 This is a flowchart showing the flow of a first process executed by the control unit included in the substrate processing apparatus according to the first embodiment of the present invention.

[0031] Figure 10 These are diagrams illustrating the motion of a hand included in the indexer robot according to the first embodiment of the present invention.

[0032] Figure 11 This is a flowchart showing the flow of the second process executed by the control unit included in the substrate processing apparatus according to the first embodiment of the present invention.

[0033] Figure 12 (a) is a top view showing the hand of the indexer robot according to the second embodiment of the present invention; Figure 12(b) is another plan view showing the hand of the indexer robot according to the second embodiment of the present invention.

[0034] Figure 13 (a) is a cross-sectional view schematically showing a first state of a hand included in the indexer robot according to the second embodiment of the present invention; Figure 13 (b) is a cross-sectional view schematically showing a second state of the hand included in the indexer robot according to the second embodiment of the present invention.

[0035] Figure 14 (a) is a cross-sectional view of the second supporting member included in the third supporting portion; Figure 14 (b) is a cross-sectional view of the fourth supporting member included in the fifth supporting portion; Figure 14 (c) is a cross-sectional view showing a modified example of the fourth support member included in the fifth support portion.

[0036] Figure 15 (a) is a cross-sectional view schematically showing a first state of a hand included in a modified example of the indexer robot according to the second embodiment of the present invention; Figure 15 (b) is a cross-sectional view schematically showing a second state of the hand included in a modified example of the indexer robot according to the second embodiment of the present invention.

[0037] Figure 16 This is a plan view showing the hand 11 of the indexer robot according to the third embodiment of the present invention.

[0038] Figure 17 (a) is a cross-sectional view schematically showing a first state of a hand included in the indexer robot IR according to the third embodiment of the present invention; Figure 17 (b) is a cross-sectional view schematically showing a second state of the hand included in the indexer robot according to the third embodiment of the present invention; Figure 17 (c) is a cross-sectional view schematically showing a third state of the hand included in the indexer robot according to the third embodiment of the present invention. DETAILED DESCRIPTION

[0039] Hereinafter, referring to the accompanying drawings ( Figures 1 to 17 (c)) of the present invention describes embodiments of a substrate transport device and a substrate processing device. However, the present invention is not limited to the following embodiments and can be implemented in various ways without departing from the scope of the present invention. It should be noted that for parts where the description is repeated, the description may be omitted as appropriate. In addition, in the figures, the same reference numerals are given to the same or corresponding parts, and the description is not repeated.

[0040] In this specification, the front-to-back direction and the left-to-right direction are defined for ease of understanding. In this embodiment, in the substrate processing apparatus 100, the side where the multiple load ports LP are located is the front side, and the side where the second tower TW2 and the fourth tower TW4 are located is the rear side. Furthermore, the right side when viewing the front side from the rear side is the right side, and the left side when viewing the front side from the rear side is the left side. It should be noted that the up-down direction refers to the vertical direction. However, the front-to-back direction and the left-to-right direction are defined only for ease of explanation, and these definitions of directions are not intended to limit the orientation of the substrate transport apparatus and substrate processing apparatus of the present invention during use.

[0041] In the substrate transport apparatus and substrate processing apparatus according to the present invention, various substrates, such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FEDs (field emission displays), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks, can be applied as "substrates" to be processed. While the following describes the embodiments of the present invention primarily using a disc-shaped semiconductor wafer as the substrate to be processed as an example, the substrate transport apparatus and substrate processing apparatus according to the present invention are also applicable to various substrates other than the aforementioned semiconductor wafers. Furthermore, the shape of the substrate is not limited to a disc; the substrate transport apparatus and substrate processing apparatus according to the present invention are applicable to substrates of various shapes.

[0042] [Implementation Method 1]

[0043] Figure 1 1 is a top view schematically showing the structure of the substrate processing apparatus 100 of this embodiment. The substrate processing apparatus 100 of this embodiment supplies a processing liquid to the substrate W to process the substrate W. More specifically, the substrate processing apparatus 100 is a single-wafer apparatus that processes the substrate W piece by piece. Figure 1 As shown, the substrate processing apparatus 100 includes a plurality of load ports LP, a transport unit TR, a plurality of substrate processing units 2, and a control unit 101. It should be noted that in the following description, unprocessed substrates W before substrate processing by the substrate processing apparatus 100 may be referred to as "pre-processed substrates Wa." Furthermore, processed substrates W after substrate processing by the substrate processing apparatus 100 may be referred to as "post-processed substrates Wb."

[0044] A substrate storage container CA is placed in each of the load ports LP. By placing the substrate storage container CA in the load port LP, the substrate storage container CA docks with the substrate processing apparatus 100. The substrate storage container CA can accommodate multiple substrates W. The substrate storage container CA supports the substrates W in a horizontal position. More specifically, the substrate storage container CA supports multiple substrates W in a stacked state, with gaps GA1 between adjacent substrates W in the vertical direction. The substrate storage container CA can be, for example, a front-opening wafer transport pod (FOUP), a SMIF (standard mechanical interface) container, or an OC (open cassette).

[0045] The transport unit TR can transport substrates W between multiple substrate processing units 2 and multiple substrate storage containers CA. In this embodiment, the transport unit TR includes an indexer robot IR, an interface PA, and a central robot CR. The indexer robot IR and the central robot CR are each an example of a "substrate transport device."

[0046] The indexer robot IR transports substrates W. In this embodiment, the indexer robot IR removes a pre-processed substrate Wa from the substrate storage container CA and then moves the pre-processed substrate Wa into the delivery interface PA. Consequently, the pre-processed substrate Wa is stored in the delivery interface PA. Furthermore, the indexer robot IR removes a processed substrate Wb from the delivery interface PA and then moves the processed substrate Wb into the substrate storage container CA. Consequently, the processed substrate Wb is stored in the substrate storage container CA.

[0047] In detail, the indexer robot IR is capable of moving along a moving path that is roughly parallel to the direction in which the multiple load ports LP are arranged. In the present embodiment, the indexer robot IR moves in the left-right direction. When the indexer robot IR transports the pre-processed substrate Wa from the substrate storage container CA to the delivery part PA, it moves to a position opposite to a specific load port LP among the multiple load ports LP, and then takes out the pre-processed substrate Wa from the substrate storage container CA placed on the specific load port LP. Then, the indexer robot IR moves along the moving path to a position opposite to the delivery part PA, and then delivers the pre-processed substrate Wa to the delivery part PA. The indexer robot IR also operates in the same manner when transporting the processed substrate Wb from the delivery part PA to the substrate storage container CA.

[0048] The central robot CR transports substrates W. In this embodiment, the central robot CR removes a pre-processed substrate Wa from the delivery interface PA and then carries the pre-processed substrate Wa into a specific substrate processing unit 2 among the multiple substrate processing units 2. The central robot CR removes a processed substrate Wb from a specific substrate processing unit 2 among the multiple substrate processing units 2 and then carries the processed substrate Wb into the delivery interface PA. As a result, the processed substrate Wb is stored in the delivery interface PA.

[0049] Specifically, the central robot CR can move in the front-back direction and the up-down direction. In addition, the central robot CR can rotate. When the central robot CR takes out the pre-processed substrate Wa from the transfer part PA, it approaches the transfer part PA. Similarly, when the central robot CR carries the processed substrate Wb into the transfer part PA, it approaches the transfer part PA. In addition, the central robot CR rotates to make the reference Figure 3 The hand 21 is opposite to the transfer unit PA. The central robot CR moves closer to the specific substrate processing unit 2 when carrying the unprocessed substrate Wa into the specific substrate processing unit 2 among the multiple substrate processing units 2. Similarly, the central robot CR moves closer to the specific substrate processing unit 2 when carrying the processed substrate Wb out of the specific substrate processing unit 2 among the multiple substrate processing units 2. In addition, the central robot CR rotates so that the reference Figure 3 The hand 21 described above faces the specific substrate processing unit 2 .

[0050] Similar to the substrate storage container CA, the interface PA supports substrates W in a horizontal position. More specifically, the interface PA holds multiple substrates W in a stacked state, with gaps between vertically adjacent substrates W. Specifically, the interface PA includes multiple shelves (not shown) that support the substrates W.

[0051] The substrate processing unit 2 processes each substrate W. Specifically, the substrate processing unit 2 supplies a processing liquid to the substrate W to process the substrate W. The processing liquid is not particularly limited as long as it comes into contact with the substrate W. Examples of the processing liquid include chemical solutions and rinse solutions.

[0052] The chemical solution includes, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide, organic acids (e.g., citric acid, oxalic acid), organic bases (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide mixture (SPM), ammonia hydrogen peroxide mixture (SC1), hydrochloric acid hydrogen peroxide mixture (SC2), isopropyl alcohol (IPA), surfactants, or corrosion inhibitors.

[0053] The rinsing liquid includes, for example, pure water (eg, deionized water), carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water of a diluted concentration (eg, about 0.001 wt % to about 0.01 wt %).

[0054] The plurality of substrate processing units 2 form a plurality of towers TW that surround the central robot CR in a plan view. In this embodiment, the plurality of substrate processing units 2 form four towers TW (a first tower TW1, a second tower TW2, a third tower TW3, and a fourth tower TW4). Each tower TW includes a plurality of substrate processing units 2 stacked up and down. In this embodiment, as shown in FIG. Figure 3 As shown, each tower TW includes three substrate processing units 2 .

[0055] The control device 101 controls the operation of each unit of the substrate processing apparatus 100. For example, the control device 101 controls the load port LP, the indexer robot IR, the central robot CR, and the substrate processing unit 2. The control device 101 includes a control unit 102 and a storage unit 103.

[0056] The control unit 102 controls the operation of each unit of the substrate processing apparatus 100 based on various information stored in the storage unit 103. The control unit 102 includes, for example, a processor. The control unit 102 may include a CPU (central processing unit) or an MPU (microprocessor) as a processor. Alternatively, the control unit 102 may include a general-purpose arithmetic unit or a dedicated arithmetic unit in addition to or in place of the processor.

[0057] The storage unit 103 includes a main storage device. The main storage device is, for example, a semiconductor memory. The storage unit 103 may further include an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 103 may also include removable media.

[0058] The storage unit 103 stores various information for controlling the operation of the substrate processing apparatus 100. For example, the storage unit 103 stores data and computer programs. The data includes various process data.

[0059] Process data includes, for example, a process recipe. A process recipe is data that specifies the steps for processing a substrate W using a processing liquid. Specifically, a process recipe specifies the execution order of a series of processes included in substrate processing, the content of each process, and the conditions (parameter settings) for each process.

[0060] The data may include transport plan data. The transport plan data represents, for each substrate W, a plan for removing a substrate W (pre-processed substrate Wa) from a substrate storage container CA, transporting it to a specific substrate processing unit 2 among the plurality of substrate processing units 2, and finally removing the processed substrate W (post-processed substrate Wb) from the specific substrate processing unit 2 and storing it in the substrate storage container CA. The control unit 102 controls the operations of the indexer robot IR and the central robot CR by referring to the transport plan data.

[0061] Next, refer to Figure 2 The substrate storage container CA will be described. Figure 2 : is a cross-sectional view of the substrate storage container CA. Figure 2 FIG. 1 is a cross-section of a substrate storage container CA docked with the substrate processing apparatus 100 as viewed from the rear side.

[0062] like Figure 2 As shown, the substrate storage container CA includes a container body 401. The container body 401 is in the shape of a box with its rear surface open. The container body 401 includes an inner space 401a. The inner space 401a is an example of a "predetermined area."

[0063] The substrate storage container CA also includes a lid (not shown) that closes the rear opening of the container body 401. After the substrate storage container CA is placed on the load port LP, the lid is removed from the container body 401 via the load port LP. After a predetermined number of processed substrates Wb are stored in the container body 401, the lid is attached to the container body 401 via the load port LP. As a result, the interior space 401a of the container body 401 is sealed.

[0064] The container body 401 has a top wall 402, a first side wall 403a, a second side wall 403b, and a bottom wall 403. In this embodiment, the first side wall 403a constitutes the right side surface, and the second side wall 403b constitutes the left side surface. The container body 401 also has a wall constituting the front side surface.

[0065] The container body 401 further includes a plurality of first protrusion support portions 405a and a plurality of second protrusion support portions 405b. The plurality of first protrusion support portions 405a and the plurality of second protrusion support portions 405b form a plurality of shelves within the inner space 401a. Each shelf supports a substrate W in a substantially horizontal position. A gap GA1 is formed between two substrates W supported by vertically adjacent shelves.

[0066] The plurality of first protrusion support portions 405a are provided on the first side wall 403a. Specifically, the plurality of first protrusion support portions 405a protrude horizontally from the inner surface of the first side wall 403a. The plurality of first protrusion support portions 405a are arranged at substantially equal intervals (e.g., approximately 10 mm intervals) in the vertical direction.

[0067] Multiple second protrusion support portions 405b are provided on the second side wall 403b. The multiple second protrusion support portions 405b are configured substantially similarly to the multiple first protrusion support portions 405a. The multiple second protrusion support portions 405b are opposed to the multiple first protrusion support portions 405a. The vertical position of each second protrusion support portion 405b is substantially equal to the vertical position of each first protrusion support portion 405a.

[0068] The substrate W is supported by the first protrusion support portion 405a and the second protrusion support portion 405b facing each other. Specifically, the end portion of the substrate W is supported by the first protrusion support portion 405a and the second protrusion support portion 405b facing each other.

[0069] Next, refer to Figures 1 to 3 A substrate processing apparatus 100 according to this embodiment will be described. Figure 3 It is a side view schematically showing the structure of the substrate processing apparatus 100 according to this embodiment.

[0070] like Figure 3 As shown, the indexer robot IR includes a plurality of hands 11 , a plurality of hand support parts 12 , a first arm 13 , a second arm 14 , a revolving base 15 , and a base lifting part 16 .

[0071] The hands 11 can support substrates W respectively. Specifically, the hands 11 support substrates W in a horizontal position. The hands 11 are connected to corresponding hand support parts 12. The hand support parts 12 support corresponding hands 11. The hands 11 extend horizontally from the corresponding hand support parts 12. In this embodiment, the indexer robot IR has two hands 11 and two hand support parts 12.

[0072] The indexer robot IR can move each hand 11 in the horizontal direction independently. In addition, the indexer robot IR can change the direction of each hand 11 independently.

[0073] Specifically, the indexer robot IR includes multiple first arms 13 and multiple second arms 14. The multiple first arms 13, the multiple second arms 14, and the multiple hand supports 12 form multiple multi-jointed arms. Each multi-jointed arm is retractable and rotatable. Furthermore, each hand support 12 is rotatable.

[0074] More specifically, one end of each second arm 14 is rotatably connected to the swivel base 15. One end of each first arm 13 is rotatably connected to the other end of the corresponding second arm 14. Each hand support 12 is rotatably connected to the other end of the corresponding first arm 13.

[0075] In addition, the indexer robot IR can raise and lower each hand 11. Specifically, the base raising and lowering unit 16 raises and lowers the rotating base 15. The base raising and lowering unit 16 raises and lowers the plurality of hands 11 by raising and lowering the rotating base 15. For example, the base raising and lowering unit 16 has a Z-axis motor 161 (see Figure 4 ), and a ball screw. The Z-axis motor 161 is an electric motor that drives the ball screw and can rotate forward and reverse. The Z-axis motor 161 drives the ball screw, thereby raising and lowering the rotary base 15.

[0076] When a plurality of pre-processed substrates Wa are stored in the substrate storage container CA, the indexer robot IR moves the hand 11 into the reference position when taking out the pre-processed substrates Wa from the substrate storage container CA. Figure 2 After the gap GA1 is formed, the hand 11 is raised. As a result, the pre-processed substrate Wa is supported by the hand 11. After the indexer robot IR supports the pre-processed substrate Wa on the hand 11, the hand 11 is retracted from the inner space 401a of the substrate storage container CA.

[0077] In addition, when storing the processed substrate Wb in the substrate storage container CA, the indexer robot IR moves the hand 11 into the inner space 401a of the substrate storage container CA in such a manner that the end of the processed substrate Wb moves just above a specific shelf among the multiple shelves of the substrate storage container CA, and then lowers the hand 11. As a result, the processed substrate Wb is supported by the specific shelf and separated from the hand 11. In the case where other substrates W are supported on a shelf just below the specific shelf, the indexer robot IR supports the processed substrate Wb on the specific shelf and then moves the processed substrate Wb to the reference shelf. Figure 2 The gap GA1 described above allows the hand 11 to retreat from the inner space 401 a of the substrate storage container CA.

[0078] Next, the central robot CR will be described. Figure 3As shown, the central robot CR has multiple hands 21, multiple hand support parts 22, a first arm 23, a second arm 24, a revolving base 25, and a base lifting unit 26. In this embodiment, the central robot CR has two hands 21 and two hand support parts 22. In addition, the central robot CR has multiple first arms 23 and multiple second arms 24. The multiple first arms 23, the multiple second arms 24, and the multiple hand support parts 22 constitute multiple multi-joint arms. The structure of the central robot CR is roughly the same as that of the indexer robot IR, so its detailed description is omitted.

[0079] Next, the interface PA will be described. Figure 3 As shown, the interface PA has an inner space 501a. The interface PA has a plurality of shelves not shown in the inner space 501a. Figure 2 The structures of the plurality of shelves of the substrate storage container CA described above are substantially the same, so detailed description thereof is omitted. It should be noted that the inner space 501a of the interface PA is an example of a "predetermined area".

[0080] When a plurality of substrates W are stored in the interface PA, when removing a processed substrate Wb from the interface PA, the indexer robot IR moves its hand 11 into a gap between vertically adjacent substrates W, similarly to when removing a pre-processed substrate Wa from the substrate storage container CA. Similarly, when removing a pre-processed substrate Wa from the interface PA, the central robot CR moves its hand 21 into a gap between vertically adjacent substrates W.

[0081] Furthermore, when a pre-processed substrate Wa is placed on a specific shelf among the multiple shelves of the interface PA and the hand 11 is retracted from the interface PA, if the substrate W is supported on a shelf directly below the specific shelf, the indexer robot IR retracts the hand 11 from the inner space 501a of the interface PA via the gap between vertically adjacent substrates W, similar to the case where a processed substrate Wb is stored in a substrate storage container CA. Similarly, when a processed substrate Wb is placed on the interface PA and the hand 21 is retracted from the interface PA, the central robot CR retracts the hand 21 from the inner space 501a of the interface PA via the gap between vertically adjacent substrates W.

[0082] Next, refer to Figures 1 to 4 A substrate processing apparatus 100 according to this embodiment will be described. Figure 4 1 is a block diagram showing a part of the structure of the substrate processing apparatus 100 according to this embodiment. Figure 4 The structure of the indexer robot IR is shown.

[0083] like Figure 4As shown, the indexer robot IR further includes a first rotary motor 131, a first encoder 132, a second rotary motor 141, a second encoder 142, a third rotary motor 151, and a third encoder 152. Specifically, the indexer robot IR includes the first rotary motor 131, the first encoder 132, the second rotary motor 141, the second encoder 142, the third rotary motor 151, and the third encoder 152 for each multi-joint arm. Furthermore, the base lift 16 includes a fourth encoder 162 in addition to the Z-axis motor 161.

[0084] The first rotary motor 131 is an electric motor capable of forward and reverse rotation. The first rotary motor 131 is provided on the corresponding first arm 13. Based on a command from the control unit 102, the first rotary motor 131 generates a driving force for rotating the corresponding hand support unit 12. Specifically, the first rotary motor 131 rotates, causing the corresponding hand support unit 12 to rotate. The first encoder 132 outputs a signal indicating the rotation angle of the corresponding first rotary motor 131.

[0085] The second rotary motor 141 is provided on the corresponding second arm 14 and generates a driving force for rotating the corresponding first arm 13. The third rotary motor 151 is provided on the rotary base 15 and generates a driving force for rotating the corresponding second arm 14. The structures of the second rotary motor 141 and the third rotary motor 151 are substantially the same as those of the first rotary motor 131, and therefore their detailed description is omitted. The second encoder 142 outputs a signal indicating the rotation angle of the corresponding second rotary motor 141. The third encoder 152 outputs a signal indicating the rotation angle of the corresponding third rotary motor 151.

[0086] As described above, the Z-axis motor 161 drives the ball screw to move the swivel base 15 upward and downward. The fourth encoder 162 outputs a signal indicating the rotation angle of the Z-axis motor 161 .

[0087] The control unit 102 detects the current position of the corresponding hand 11 based on the outputs of the first encoder 132, the second encoder 142, the third encoder 152, and the fourth encoder 162. The control unit 102 controls the operation of the indexer robot IR based on the information on the current position of each hand 11.

[0088] It should be noted that, similar to the indexer robot IR, the central robot CR has multiple rotary motors, a Z-axis motor, and multiple encoders. The control unit 102 detects the current position of each hand 21 of the central robot CR based on the outputs of the central robot CR's multiple encoders. The control unit 102 controls the movement of the central robot CR based on information about the current position of each hand 21.

[0089] Next, refer to Figures 1 to 5A substrate processing apparatus 100 according to this embodiment will be described. Figure 5 1 is a diagram showing a part of the structure of the substrate processing apparatus 100 according to this embodiment. Figure 5 The following schematically shows the structure of the substrate processing unit 2. In this embodiment, the substrate processing unit 2 performs a cleaning process or an etching process.

[0090] like Figure 5 As shown, the substrate processing unit 2 includes a processing chamber 201, a substrate holding unit 3, a substrate rotating unit 4, a first nozzle 51, a second nozzle 61, a liquid receiving unit 7, a gate 8, a protective unit lifting mechanism 72, and a gate lifting mechanism 81. Furthermore, the substrate processing apparatus 100 further includes a chemical liquid supply unit 5, a rinse liquid supply unit 6, a chemical liquid supply source 54, and a rinse liquid supply source 64.

[0091] The processing chamber 201 is generally box-shaped. The inner space 201b of the processing chamber 201 houses the substrate W, the substrate holder 3, the substrate rotating unit 4, the first nozzle 51, the second nozzle 61, the liquid receiving unit 7, the protective unit lifting mechanism 72, the gate lifting mechanism 81, a portion of the chemical liquid supply unit 5, and a portion of the rinse liquid supply unit 6. The processing chamber 201 is, for example, a chamber. The inner space 201b is an example of a "predetermined area."

[0092] The processing chamber 201 has an opening 201a. The central robot CR carries pre-processed substrates Wa into the inner space 201b of the processing chamber 201 through the opening 201a. The substrates W are carried into the processing chamber 201 and processed there. In other words, substrate processing is performed within the processing chamber 201. Furthermore, the central robot CR carries processed substrates Wb out of the processing chamber 201 through the opening 201a.

[0093] The substrate holding unit 3 holds the substrate W horizontally in the processing chamber 201. The substrate holding unit 3 is controlled by the control unit 102. Specifically, the substrate holding unit 3 may include a plurality of chuck members 31 and a spin base 32.

[0094] The spin base 32 is generally disk-shaped and supports a plurality of chuck members 31 in a horizontal position. The chuck members 31 are arranged on the periphery of the spin base 32. The chuck members 31 receive pre-processed substrates Wa from the hand 21 of the central robot CR and grip the periphery of the pre-processed substrates Wa. The chuck members 31 hold the pre-processed substrates Wa in a horizontal position. The operation of the chuck members 31 is controlled by the control unit 102.

[0095] The substrate rotating unit 4 rotates the substrate W integrally with the substrate holding unit 3. Specifically, the substrate rotating unit 4 rotates the substrate holding unit 3, which holds the substrate W, about a rotation axis AX extending in the vertical direction. The substrate rotating unit 4 is controlled by the control unit 102. More specifically, the rotation axis AX passes through the center of the rotation base 32. The multiple chuck components 31 are arranged so that the center of the substrate W faces the center of the rotation base 32. Therefore, the substrate W rotates about the center of the substrate W.

[0096] Specifically, the substrate rotating unit 4 may include a shaft 41 and a drive unit 42. The shaft 41 is coupled to the center of the rotating base 32 and extends downward from the rotating base 32. The drive unit 42 generates a driving force that rotates the substrate W integrally with the substrate holding unit 3. Specifically, the drive unit 42 rotates the shaft 41 about the rotation axis AX. As a result, the rotating base 32 rotates. The drive unit 42 is controlled by the control unit 102. The drive unit 42 includes, for example, an electric motor.

[0097] The first nozzle 51 ejects the chemical liquid toward the upper surface of the substrate W held by the substrate holder 3 . As a result, the chemical liquid is supplied from the first nozzle 51 to the upper surface of the substrate W. More specifically, after moving from the first retreat position to the processing position facing the upper surface of the substrate W, the first nozzle 51 ejects the chemical liquid toward the upper surface of the rotating substrate W. As a result, a chemical liquid film is formed on the upper surface of the substrate W. After stopping ejection of the chemical liquid, the first nozzle 51 moves back to the first retreat position.

[0098] The second nozzle 61 sprays the rinse liquid toward the upper surface of the substrate W held by the substrate holder 3. As a result, the rinse liquid is supplied from the second nozzle 61 to the upper surface of the substrate W. More specifically, the second nozzle 61 moves from the second retreat position to the processing position facing the upper surface of the substrate W, where it sprays the rinse liquid toward the upper surface of the rotating substrate W. As a result, a film of the rinse liquid is formed on the upper surface of the substrate W. After stopping the spraying of the rinse liquid, the second nozzle 61 moves to the second retreat position.

[0099] The discharge of the chemical liquid by the first nozzle 51 is controlled by the control unit 102. Specifically, the control unit 102 controls the discharge of the chemical liquid by controlling the chemical liquid supply unit 5.

[0100] The chemical supply unit 5 supplies chemical liquid to the first nozzle 51 . As a result, the chemical liquid is ejected from the first nozzle 51 . Specifically, the chemical supply unit 5 includes a chemical liquid supply pipe 52 and a chemical liquid on-off valve 53 . A portion of the chemical liquid supply pipe 52 is housed in the processing chamber 201 .

[0101] A chemical supply source 54 supplies chemical liquid to the chemical supply pipe 52. For example, the chemical supply source 54 may include a storage tank for storing the chemical liquid, a circulation pipe that circulates the chemical liquid through the storage tank, and a circulation pump attached to the circulation pipe. The circulation pump transports the chemical liquid so that it flows from one end of the circulation pipe to the other. As a result, the chemical liquid circulates through the storage tank and the circulation pipe. The circulation pump is controlled by the control unit 102.

[0102] The chemical liquid supply pipe 52 is a tubular member that allows the chemical liquid to flow to the first nozzle 51. As a result, the chemical liquid is supplied to the first nozzle 51 and ejected from the first nozzle 51.

[0103] The drug liquid on-off valve 53 is attached to the drug liquid supply piping 52. The drug liquid on-off valve 53 can be opened and closed. The opening and closing action of the drug liquid on-off valve 53 is controlled by the control unit 102. The actuator of the drug liquid on-off valve 53 is, for example, a pneumatic actuator or an electric actuator. The control unit 102 opens the drug liquid on-off valve 53, thereby allowing the drug liquid to flow to the first nozzle 51 through the drug liquid supply piping 52. As a result, the drug liquid is ejected from the first nozzle 51. In addition, the control unit 102 stops the flow of the drug liquid through the drug liquid supply piping 52 by closing the drug liquid on-off valve 53. As a result, the ejection of the drug liquid based on the first nozzle 51 is stopped.

[0104] The discharge of the rinse liquid by the second nozzle 61 is controlled by the control unit 102. Specifically, the control unit 102 controls the discharge of the rinse liquid by controlling the rinse liquid supply unit 6.

[0105] The rinse liquid supply unit 6 supplies rinse liquid to the second nozzle 61. As a result, the rinse liquid is ejected from the second nozzle 61. Specifically, the rinse liquid supply unit 6 includes a rinse liquid supply pipe 62 and a rinse liquid on-off valve 63. The structure of the rinse liquid supply unit 6 is substantially the same as that of the chemical liquid supply unit 5, and therefore a detailed description thereof will be omitted.

[0106] A rinse liquid supply source 64 supplies rinse liquid to the rinse liquid supply pipe 62. The structure of the rinse liquid supply source 64 is substantially the same as that of the chemical liquid supply source 54, so a detailed description thereof will be omitted. It should be noted that in this embodiment, the substrate processing apparatus 100 includes the rinse liquid supply source 64, but the substrate processing apparatus 100 may not include the rinse liquid supply source 64. For example, the rinse liquid may be supplied from the factory where the substrate processing apparatus 100 is installed.

[0107] The liquid receiving portion 7 surrounds the substrate W held by the substrate holding portion 3 and receives the chemical solution and the rinse liquid discharged from the substrate W. Specifically, the liquid receiving portion 7 includes a protective portion 71. The protective portion 71 is substantially cylindrical.

[0108] The protection part lifting mechanism 72 raises and lowers the protection part 71 between the liquid receiving position and the third retracted position. The protection part lifting mechanism 72 may include, for example, a ball screw and a forward and reverse rotatable electric motor. The protection part lifting mechanism 72 is controlled by the control unit 102.

[0109] The liquid receiving position is a position above the third retreat position. When the protection portion 71 is at the liquid receiving position, the upper end of the protection portion 71 is located at a position higher than the substrate W held on the substrate holding portion 3. When the protection portion 71 is at the liquid receiving position, it surrounds the substrate W held on the substrate holding portion 3 and receives the chemical solution and rinse liquid discharged from the substrate W. When the protection portion 71 is at the third retreat position, the upper end of the protection portion 71 is located at a position lower than the upper surface of the rotation base 32. When the protection portion 71 is at the third retreat position, the hand 21 of the central robot CR supporting the pre-processed substrate Wa enters the processing chamber 201 and hands over the pre-processed substrate Wa to the substrate holding portion 3. In addition, when the protection portion 71 is at the third retreat position, the hand 21 of the central robot CR enters the processing chamber 201 and receives the processed substrate Wb from the substrate holding portion 3.

[0110] The gate 8 is a sealing member that seals the opening 201a of the processing chamber 201. A gate lifting mechanism 81 raises and lowers the gate 8 between a closed position and a fourth retracted position. The gate lifting mechanism 81 may include, for example, a ball screw and a forward and reverse rotatable electric motor. The gate lifting mechanism 81 is controlled by the control unit 102.

[0111] The closed position is above the fourth retracted position. When the gate 8 is in the closed position, the opening 201a of the processing chamber 201 is sealed by the gate 8. As a result, the inner space 201b of the processing chamber 201 is sealed. When the gate 8 is in the fourth retracted position, the opening 201a of the processing chamber 201 is open. When the gate 8 is in the fourth retracted position, the hand 21 of the central robot CR enters the processing chamber 201.

[0112] Next, refer to Figure 6 (a)~ Figure 6 (c) in the figure explains the indexer robot IR of this embodiment. Figure 6 (a) is a plan view showing the hand 11 of the indexer robot IR according to the present embodiment. Figure 6 (b) is a cross-sectional view showing the hand 11 of the indexer robot IR of this embodiment. Figure 6 (b) shows the Figure 6 Cross section along line BB in (a). Figure 6 (c) in FIG. 1 is another plan view showing the hand 11 of the indexer robot IR according to the present embodiment.

[0113] like Figure 6As shown in (a) of FIG. 1 , the hand 11 includes a hand body 11A and a base 11B. The hand body 11A is a plate-shaped member. The material of the hand body 11A includes, for example, ceramic. The hand body 11A is connected to one end of the base 11B. The hand body 11A extends horizontally from the base 11B. The other end of the base 11B is aligned with the reference Figure 3 The base 11B is a plate-shaped member thicker than the hand body 11A.

[0114] In this embodiment, the hand body 11A includes a first hand element 11a and a second hand element 11b. The first hand element 11a and the second hand element 11b extend substantially parallel to each other from the base 11B. The first hand element 11a and the second hand element 11b face each other in a direction perpendicular to the direction in which the hand body 11A extends. In other words, the hand 11 has a two-pronged fork shape.

[0115] The hand 11 further includes a first support portion 17a to a fourth support portion 17d. The first support portion 17a to the fourth support portion 17d support the substrate W. Specifically, the first support portion 17a and the second support portion 17b are provided on the front end side of the hand body 11A. The third support portion 17c and the fourth support portion 17d are provided on the base end side (base 11B side) of the hand body 11A. The first support portion 17a to the fourth support portion 17d are provided on the upper surface of the hand body 11A to support the peripheral portion of the substrate W. Specifically, the first support portion 17a to the fourth support portion 17d support the peripheral portion of the substrate W from below. The first support portion 17a to the fourth support portion 17d may be a guide.

[0116] In more detail, the first supporting portion 17a is provided on the front end side of the first hand element 11a. The second supporting portion 17b is provided on the front end side of the second hand element 11b. The third supporting portion 17c is provided on the base end side (base 11B side) of the first hand element 11a. The fourth supporting portion 17d is provided on the base end side (base 11B side) of the second hand element 11b. The first supporting portion 17a and the fourth supporting portion 17d are opposite to each other, sandwiching the approximate center of the substrate W supported by the first supporting portion 17a to the fourth supporting portion 17d. Similarly, the second supporting portion 17b and the third supporting portion 17c are opposite to each other, sandwiching the approximate center of the substrate W supported by the first supporting portion 17a to the fourth supporting portion 17d.

[0117] As reference Figure 7 (a)~ Figure 7As described in (c) of FIG. 1 , the first supporting portion 17a and the second supporting portion 17b each have a first supporting surface 35a that supports the substrate W from below, and a wall surface 36a that faces the end surface of the substrate W supported by the first supporting surface 35a. The third supporting portion 17c and the fourth supporting portion 17d each have a supporting surface 37a that supports the substrate W from below, and a wall surface 37b that faces the end surface of the substrate W supported by the supporting surface 37a. Figure 6 As shown in (a) in FIG. 1 , the wall surface 36a of the first supporting portion 17a, the wall surface 36a of the second supporting portion 17b, the wall surface 37b of the third supporting portion 17c, and the wall surface 37b of the fourth supporting portion 17d are arranged on a circumference having a radius slightly larger than the radius of the substrate W. Therefore, as Figure 6 (a) and Figure 6 As shown in (b) in FIG. 1 , the substrate W supported by the first to fourth supporting parts 17 a to 17 d is not held (clamped) by the first to fourth supporting parts 17 a to 17 d.

[0118] In this embodiment, the first supporting portion 17a and the second supporting portion 17b each include a first supporting member 171a. The third supporting portion 17c and the fourth supporting portion 17d each include a second supporting member 171b. The first supporting member 171a supports the substrate W. The second supporting member 171b supports the substrate W. Specifically, the first supporting member 171a supports the peripheral edge of the substrate W from below. The second supporting member 171b supports the peripheral edge of the substrate W from below. For details of the first supporting member 171a and the second supporting member 171b, refer to Figure 7 (a)~ Figure 7 (c) will be discussed later.

[0119] In this embodiment, the hand 11 further includes a pusher 18. Hereinafter, the front end of the hand body 11A may be referred to as the "front end side." The pusher 18 pushes the substrate W from the base 11B side toward the front end. As a result, the substrate W is held (clamped) by the pusher 18, the first support portion 17a (first support member 171a), and the second support portion 17b (first support member 171a).

[0120] Specifically, the pusher 18 may include two pressing support members 18 a , a connecting member 18 b , a rod portion 18 c , and a pusher driving portion 181 .

[0121] The rod portion 18c protrudes from the base portion 11B toward the front end. Specifically, the rod portion 18c protrudes from the base portion 11B between the first hand element 11a and the second hand element 11b. The two pushing support components 18a and the connecting component 18b are arranged between the first hand element 11a and the second hand element 11b. The connecting component 18b connects the two pushing support components 18a and the rod portion 18c. The pusher drive unit 181 is controlled by the control unit 102 to move the rod portion 18c in the direction in which the hand body 11A extends. The pusher drive unit 181 may include, for example, a cylinder mechanism.

[0122] Specifically, after the substrate W is supported by the first support portion 17a to the fourth support portion 17d, the control portion 102 controls the pusher driving portion 181 to move (extend) the rod portion 18c toward the front end. When the rod portion 18c is extended, the two pushing support members 18a abut against the end surface of the base 11B side of the substrate W, pushing the substrate W toward the front end and supporting the peripheral edge of the substrate W by the two pushing support members 18a. As a result, Figure 6 As shown in (c), the substrate W moves toward the front end side, and the end face of the front end side of the substrate W abuts against the two first support parts 171a (the first support part 17a and the second support part 17b), and the substrate W is held (clamped) by the two pushing support parts 18a, the first support part 17a (the first support part 171a), and the second support part 17b (the first support part 171a).

[0123] In addition, when the control unit 102 controls the pusher driving unit 181 to retract (contract) the rod portion 18 c toward the base portion 11B, the holding (clamping) of the substrate W is released.

[0124] Next, refer to Figure 7 (a)~ Figure 7 (c) in the figure explains the indexer robot IR of this embodiment. Figure 7 (a) is a cross-sectional view schematically showing a first state of the hand 11 included in the indexer robot IR of the present embodiment. Figure 7 (b) is a cross-sectional view schematically showing a second state of the hand 11 included in the indexer robot IR of the present embodiment. Figure 7 (c) is another cross-sectional view schematically showing the hand 11 of the indexer robot IR according to the present embodiment.

[0125] First, refer to Figure 7 (a) in FIG. 1 illustrates the first supporting member 171 a. Figure 7 (a) in FIG. 1 shows a cross section of the first supporting member 171a of the first supporting portion 17a. Figure 7As shown in FIG. 1 ( a ), the first support member 171 a protrudes upward from the hand body 11A. The first support member 171 a includes a first support body 351 and a wall body 36 .

[0126] The first support body 351 and the wall body 36 are arranged in a roughly radial direction of the substrate W supported by the first support parts 17a to the fourth support parts 17d. Specifically, the first support body 351 is arranged closer to the wall body 36 relative to the center of the substrate W supported by the first support parts 17a to the fourth support parts 17d. The wall body 36 is arranged farther from the first support body 351 relative to the center of the substrate W supported by the first support parts 17a to the fourth support parts 17d. The first support body 351 extends toward the approximate center of the substrate W supported by the first support parts 17a to the fourth support parts 17d. The shape of the first support body 351 when viewed from the side can be roughly trapezoidal. The shape of the first support body 351 when viewed from above can be roughly rectangular. The shape of the wall body 36 can be, for example, roughly rectangular.

[0127] As reference Figure 6 (a)~ Figure 6 As described in (c) of FIG. , the first support member 171 a supports the peripheral edge of the substrate W. Specifically, the first support body 351 supports the peripheral edge of the substrate W. Specifically, the first support body 351 supports the peripheral edge of the substrate W from below. The first support body 351 can be provided on the upper surface of the hand body 11A.

[0128] More specifically, the first support 351 includes a first support surface 35a that supports the substrate W. Specifically, the first support surface 35a constitutes the upper surface of the first support 351. The first support surface 35a contacts the lower surface of the peripheral portion of the substrate W, supporting the peripheral portion of the substrate W from below. The first support surface 35a may include an inclined surface that decreases in height toward the center of the substrate W supported by the first to fourth support portions 17a to 17d. The inclusion of the inclined surface in the first support surface 35a allows the substrate W to be more reliably supported even when the substrate W is in a downwardly oriented position.

[0129] In addition, one end of the first supporting surface 35a on the opposite side to the wall 36 is separated from the upper surface of the hand body 11A. In other words, one end of the first supporting surface 35a does not contact the upper surface of the hand body 11A. By separating one end of the first supporting surface 35a from the hand body 11A, even if the substrate W is in a downward shape, it is not easy for the substrate W to contact the hand body 11A. Therefore, when the indexer robot IR transports the substrate W, only the peripheral portion of the substrate W is supported by the hand 11, so it is not easy for the substrate W to have a bad condition. For example, the height H3 of one end of the first supporting surface 35a (the lower end of the first supporting surface 35a) from the hand body 11A can be 1 mm.

[0130] The wall 36 faces the end surface of the substrate W supported by the first support 351. Figure 6 (a) and Figure 6 As described in (c) of FIG. 1 , when the pusher 18 pushes the substrate W, the end surface of the substrate W on the front side abuts against the wall 36. Specifically, the wall 36 includes a wall surface 36a that faces the end surface of the substrate W. When the pusher 18 pushes the substrate W, the end surface of the substrate W on the front side abuts against the wall surface 36a. The wall surface 36a constitutes the side surface of the wall 36 on the first support body 351 side.

[0131] Note that the configuration of the first support member 171 a included in the second support portion 17 b is substantially the same as that of the first support member 171 a included in the first support portion 17 a , and therefore detailed description thereof will be omitted.

[0132] Next, refer to Figure 7 (a) and Figure 7 (b) in the figure further illustrates the indexer robot IR of this embodiment. Figure 7 (a) and Figure 7 As shown in (b) in FIG. 1 , the indexer robot IR further includes a lifting unit 9 . Figure 7 (a) and Figure 7 (b) in FIG. 1 shows the lifting unit 9 corresponding to the first support portion 17a. The lifting unit 9 lifts and lowers at least a portion of the first support portion 17a. Corresponding to the lifting unit 9 lifting and lowering at least a portion of the first support portion 17a, the height from the lower surface 11L of the hand body 11A to the upper end of the first support portion 17a changes. In the present embodiment, the lifting unit 9 lifts and lowers the wall body 36. The lifting unit 9 is controlled by the control unit 102. The lifting unit 9 that lifts and lowers the wall body 36 is an example of a "wall lifting unit." The lifting unit 9 includes a flow path 91, a receiving chamber 92, and a lifting component 93.

[0133] The storage chamber 92 is formed within the hand body 11A. Specifically, the storage chamber 92 of the lifting portion 9 corresponding to the first supporting portion 17a is formed within the first hand element 11a. The storage chamber 92 has an opening on the upper surface of the hand body 11A. Hereinafter, the opening of the storage chamber 92 formed on the upper surface of the hand body 11A may be referred to as the "upper surface opening."

[0134] The lifting member 93 is disposed in the storage chamber 92. Specifically, the lifting member 93 is fixed in the storage chamber 92. For example, the lifting member 93 may be fixed to a wall surface that defines the storage chamber 92.

[0135] The receiving chamber 92 is provided below the wall 36. The lifting member 93 is connected to the wall 36 via an opening on the upper surface of the receiving chamber 92. The lifting member 93 can be coupled to the lower surface of the wall 36.

[0136] The flow path 91 is formed inside the hand body 11A. Specifically, the flow path 91 of the lifting part 9 corresponding to the first support part 17a is formed inside the first hand element 11a. One end of the flow path 91 is connected to the storage chamber 92. One end of the flow path 91 is located below the lifting part 93. It should be noted that, as shown in FIG. Figure 8 As described above, the flow path 91 extends from the hand body 11A to the hand support portion 12 via the base portion 11B.

[0137] In this embodiment, the lifting member 93 raises and lowers the wall 36 in response to pressure changes within the flow path 91. More specifically, the lifting member 93 raises and lowers the wall 36 between an upper position and a lower position in response to pressure changes within the storage chamber 92. The lower position is a position below the upper position.

[0138] Figure 7 (a) in FIG. 3 shows the wall 36 in the lower position. Figure 7 As shown in (a) of FIG. 1 , when the gas within the flow path 91 is being drawn, the lifting member 93 lowers the wall 36. The vertical position of the lower surface of the wall 36 in the lower position can be approximately the same as the vertical position of the upper surface of the hand body 11A. However, the vertical position of the lower surface of the wall 36 in the lower position can be higher or lower than the vertical position of the upper surface of the hand body 11A. The drawing of gas from the flow path 91 is controlled by the control unit 102.

[0139] Figure 7 (b) in FIG. 3 shows the wall 36 in the upper position. Figure 7 As shown in FIG. 1 ( b ), when gas is supplied into the flow path 91 , the lifting member 93 places the wall 36 in the upper position. The supply of gas into the flow path 91 is controlled by the control unit 102 .

[0140] Specifically, lifting member 93 is fixed to containment chamber 92 so as to be movable vertically. When gas within flow path 91 is drawn, the pressure within flow path 91 decreases, and gas within containment chamber 92 is drawn into flow path 91. Lifting member 93 is drawn toward one end of flow path 91, causing it to move downward. As a result, wall 36 moves downward.

[0141] When gas is supplied to flow path 91, the pressure in flow path 91 increases due to fluid pressure, and the pressure in storage chamber 92 increases. When the pressure in storage chamber 92 increases, lifting member 93 moves upward. As a result, wall 36 moves upward.

[0142] Specifically, the lifting member 93 can isolate the space outside the hand body 11A from the flow path 91. For example, the lifting member 93 can divide the storage chamber 92 into a lower space connected to the flow path 91 and an upper space connected to the space outside the hand body 11A. The lifting member 93 can include, for example, a diaphragm.

[0143] like Figure 7 (a) and Figure 7 As shown in (b), the height H1 of the front end of the hand 11 when the wall 36 is in the lower position is lower than the height H1 when the wall 36 is in the upper position. Figure 2 ) When the wall 36 is in the lower position, the possibility of the moving hand 11 contacting the substrate W accommodated in the substrate storage container CA (inner space 401a) can be reduced. It should be noted that the height H1 represents the height from the lower surface 11L of the hand body 11A to the upper end of the first support part 17a. In other words, the height H1 represents the thickness of the front end side of the hand 11. In this embodiment, the upper end of the first support part 17a represents the upper surface of the wall 36. Therefore, the height H1 represents the height from the lower surface 11L of the hand body 11A to the upper surface of the wall 36. Hereinafter, the thickness of the front end side of the hand 11 is sometimes described as "the thickness H1 of the front end side of the hand 11".

[0144] It should be noted that the vertical position of the upper surface of the wall 36 when the wall 36 is in the lower position may be lower than the vertical position of the upper end of the first support 351. In this case, the height H1 of the front end of the hand 11 when the wall 36 is in the lower position represents the height from the lower surface 11L of the hand body 11A to the upper end of the first support 351. In other words, the upper end of the first support portion 17a when the wall 36 is in the lower position may be the upper end of the first support 351.

[0145] In addition, the height H2 of the wall surface 36a from the other end (upper end) of the first support surface 35a changes according to the lifting action of the wall body 36. Specifically, Figure 7 (a) and Figure 7 As shown in (b) of FIG. 1 , the height H2 of the wall surface 36a when the wall body 36 is in the upper position is higher than the height H2 of the wall surface 36a when the wall body 36 is in the lower position. Therefore, the possibility of the substrate W supported by the hand 11 passing over the wall surface 36a (first supporting member 171a) during the movement of the hand 11 can be reduced.

[0146] Next, refer to Figure 7 (c) in FIG. 1 illustrates the second supporting member 171 b. Figure 7(c) in FIG. 1 shows a cross section of the second supporting member 171b included in the third supporting portion 17c. Figure 7 As shown in (c) in FIG. 1 , the second support member 171b protrudes upward from the hand body 11A. The second support member 171b can be provided on the upper surface of the hand body 11A. The second support member 171b includes a support surface 37a and a wall surface 37b.

[0147] Similar to the first supporting surface 35a of the first supporting member 171a, the supporting surface 37a supports the periphery of the substrate W. Specifically, the supporting surface 37a constitutes the upper surface of the second supporting member 171b. The supporting surface 37a contacts the lower surface of the periphery of the substrate W, supporting the periphery of the substrate W from below. The structure of the supporting surface 37a is substantially the same as that of the first supporting surface 35a, so its detailed description is omitted. It should be noted that the height H13 of one end of the supporting surface 37a (the lower end of the supporting surface 37a) from the hand body 11A is substantially equal to the height H3 of one end of the first supporting surface 35a (the lower end of the first supporting surface 35a) from the hand body 11A. Furthermore, the height of the other end of the supporting surface 37a (the upper end of the supporting surface 37a) from the hand body 11A is substantially equal to the height of the other end of the first supporting surface 35a (the upper end of the first supporting surface 35a) from the hand body 11A.

[0148] The wall surface 37b protrudes upward from the other end of the support surface 37a (the upper end of the support surface 37a). Like the wall surface 36a of the first support member 171a, the wall surface 37b faces the end surface of the substrate W. The height H12 of the wall surface 37b from the other end of the support surface 37a (the upper end of the support surface 37a) is Figure 7 The height H11 from the lower surface 11L of the hand body 11A to the upper end of the second support member 171b is Figure 7 The height (thickness) of the front end side of the hand 11 in the second state shown in (b) may be greater than or equal to H1.

[0149] Note that the configuration of the second support member 171 b included in the fourth support portion 17 d is substantially the same as the configuration of the second support member 171 b included in the third support portion 17 c , and therefore detailed description thereof will be omitted.

[0150] Next, refer to Figure 8 The lifting unit 9 will be described. Figure 8 This is a diagram showing the configuration of the indexer robot IR according to this embodiment.

[0151] like Figure 8As shown, the lifting unit 9 further includes a first pipe 94, a second pipe 95, a third pipe 96, a first on-off valve 97, a second on-off valve 98, a suction unit 105, and a gas supply source 106. Specifically, the first pipe 94, the second pipe 95, the third pipe 96, the first on-off valve 97, the second on-off valve 98, the suction unit 105, and the gas supply source 106 are provided in each flow path 91. The first pipe 94, the second pipe 95, and the third pipe 96 are tubular components through which gas flows.

[0152] As already described, the flow path 91 extends from the hand body 11A through the base 11B to the hand support 12. The other end of the flow path 91 is connected to one end of the first pipe 94. As a result, the flow path 91 and the first pipe 94 communicate with each other.

[0153] The first pipe 94 is provided on the hand support 12, the first arm 13, the second arm 14, the rotating base 15, and the base lift 16. The second pipe 95 and the third pipe 96 are arranged outside the main body IRA of the indexer robot IR. The main body IRA of the indexer robot IR includes multiple hands 11, multiple hand support parts 12, multiple multi-joint arms, the rotating base 15, and the base lift 16.

[0154] The other end of first pipe 94 is connected to one end of second pipe 95. As a result, first pipe 94 and second pipe 95 are in communication. A first on-off valve 97 is attached to second pipe 95. One end of third pipe 96 is connected to second pipe 95 between first on-off valve 97 and the other end of first pipe 94. As a result, second pipe 95 and third pipe 96 are in communication. A second on-off valve 98 is attached to third pipe 96.

[0155] The suction unit 105 sucks the gas in the second pipe 95 through the other end of the second pipe 95. The suction unit 105 may include, for example, a suction pump. The suction unit 105 may include an ejector. The operation of the suction unit 105 is controlled by the control unit 102.

[0156] The gas supply source 106 supplies gas to the third pipe 96 via the other end of the third pipe 96 . The gas is, for example, an inert gas. The inert gas is, for example, nitrogen. The gas supply source 106 may include, for example, a pump. The operation of the gas supply source 106 is controlled by the control unit 102 .

[0157] The first opening and closing valve 97 and the second opening and closing valve 98 are openable and closable. The opening and closing operations of the first opening and closing valve 97 and the second opening and closing valve 98 are controlled by the control unit 102. The actuators of the first opening and closing valve 97 and the second opening and closing valve 98 are, for example, pneumatic actuators or electric actuators.

[0158] The control unit 102 opens the first on-off valve 97 and closes the second on-off valve 98, so that the gas in the second pipe 95 is sucked by the suction unit 105. As a result, the gas in the flow path 91 is sucked through the first pipe 94, as shown in FIG. Figure 7 As described in (a) of FIG. 1 , the wall 36 moves downward. The control unit 102 closes the first on-off valve 97 and opens the second on-off valve 98, thereby supplying gas from the gas supply source 106 to the second pipe 95 via the third pipe 96. As a result, the gas in the flow path 91 is supplied via the first pipe 94, as shown in FIG. Figure 7 As described in (b) in FIG. 1 , the wall 36 moves upward.

[0159] The indexer robot IR further includes a lifting unit 9 for lifting the wall 36 of the second support portion 17b. The structure of the lifting unit 9 for lifting the wall 36 of the second support portion 17b is substantially the same as that of the lifting unit 9 for lifting the wall 36 of the first support portion 17a, and therefore a detailed description thereof will be omitted.

[0160] Next, refer to Figures 1 to 10 The operation of the indexer robot IR is described. The operation of the indexer robot IR is controlled by the control unit 102 . Figure 9 1 is a flowchart showing the flow of a first process executed by the control unit 102 included in the substrate processing apparatus 100 according to the present embodiment. Figure 10 1 and 2 are diagrams illustrating the operation of the hand 11 included in the indexer robot IR according to the present embodiment.

[0161] The first process is a process executed by the control unit 102 when a specific unprocessed substrate Wa located in the inner space 401a (predetermined area) of the substrate storage container CA is transported to the outside of the substrate storage container CA (inner space 401a). Figure 9 As shown, the first process includes steps S11 to S17.

[0162] In the following description, a target substrate W (transport target) removed from a substrate storage container CA may be referred to as a "first substrate WU." Furthermore, another substrate W supported by a shelf directly below the shelf supporting the first substrate WU (transport target) may be referred to as a "second substrate WL." The second substrate WL is an example of a "facing element that faces the lower surface of a specific substrate W within a predetermined area."

[0163] When to start Figure 9During the process shown, the control unit 102 controls the lifting unit 9 to move the walls 36 of the first support portion 17a and the second support portion 17b downward (step S11). As a result, the thickness H1 of the distal end of the hand 11 decreases. Specifically, the control unit 102 opens the first on-off valve 97. Furthermore, the control unit 102 drives the suction unit 105.

[0164] After the control unit 102 moves the wall 36 downward, it controls the first rotary motor 131, the second rotary motor 141 and the third rotary motor 151. Figure 10 As shown in FIG. 1 , the hand body 11A is caused to enter the gap GA1 (the gap between vertically adjacent substrates W) between the first substrate WU and the second substrate WL (step S12). Specifically, the control unit 102 positions the walls 36 of the first support portion 17a and the second support portion 17b in the lower position before causing the hand body 11A to enter the gap GA1 between the first substrate WU and the second substrate WL.

[0165] When the hand 11 enters the gap GA1 and supports the first substrate WU, the control unit 102 raises the wall 36 of each of the first support portion 17a and the second support portion 17b to an upward position. Specifically, after the wall 36 of each of the first support portion 17a and the second support portion 17b passes through the gap GA1, as shown in FIG. Figure 10 As shown, the control unit 102 controls the lifting unit 9 to raise the wall 36 of each of the first support portion 17a and the second support portion 17b to the upper position (step S13). The control unit 102 determines that the wall 36 of each of the first support portion 17a and the second support portion 17b has passed through the gap GA1 based on the outputs of the first encoder 132, the second encoder 142, and the third encoder 152.

[0166] Specifically, the control unit 102 closes the first on-off valve 97 and opens the second on-off valve 98. The control unit 102 also drives the gas supply source 106. The control unit 102 can stop driving the suction unit 105.

[0167] After the control unit 102 moves the wall 36 upward, it controls the Z-axis motor 161. Figure 10 As shown, the hand 11 is raised by a predetermined amount (predetermined distance). As a result, the first substrate WU is transferred from the shelf of the substrate storage container CA to the hand 11, and the first substrate WU is supported by the hand 11 (step S14). The control unit 102 determines that the hand 11 has risen by the predetermined amount (predetermined distance) based on the output of the fourth encoder 162.

[0168] After the first substrate WU is supported by the hand 11, the control unit 102 controls the first rotary motor 131, the second rotary motor 141, and the third rotary motor 151. Figure 10 As shown, the hand body 11A is moved (retracted) toward the opening of the substrate storage container CA (step S15). As a result, the end surface of the first substrate WU abuts against the wall surface 36a of the first support part 17a and the wall surface 36a of the second support part 17b due to inertial force.

[0169] After the control unit 102 moves the hand body 11A toward the opening of the substrate storage container CA by a predetermined amount (predetermined distance), it drives the pusher 18 to hold (grip) the first substrate WU by the hand 11 (step S16). The control unit 102 determines that the hand body 11A has moved toward the opening of the substrate storage container CA by the predetermined amount (predetermined distance) based on the outputs of the first encoder 132, the second encoder 142, and the third encoder 152.

[0170] Specifically, the control unit 102 drives the pusher driving unit 181 to move the two pushing support members 18a toward the front end side of the hand body 11A. As a result, the first substrate WU is held (clamped) by the first support member 17a, the second support member 17b, and the two pushing support members 18a. Figure 10 As shown, while the pusher 18 is being driven, the control unit 102 also moves the hand body 11A toward the opening of the substrate storage container CA.

[0171] like Figure 10 As shown, after holding (gripping) the first substrate WU by the hand 11, the control unit 102 also moves the hand body 11A toward the opening of the substrate storage container CA and retracts the hand body 11A to the outside of the substrate storage container CA (step S17). As a result, Figure 9 The indicated processing ends.

[0172] It should be noted that in Figure 9 and Figure 10 In the example shown, the indexer robot IR starts to retreat the hand 11 (hand body 11A) before holding (gripping) the substrate W by the first supporting part 17a, the second supporting part 17b, and the pushing member 18, but the indexer robot IR may also start to retreat the hand 11 (hand body 11A) after holding (gripping) the substrate W by the first supporting part 17a, the second supporting part 17b, and the pushing member 18.

[0173] Above, as reference Figures 1 to 10As described, according to this embodiment, the hand body 11A can be positioned within the gap GA1 between substrates W housed in the substrate storage container CA while the thickness H1 of the front end of the hand 11 is reduced (the first state). Therefore, even if the gap GA1 decreases due to factors such as warpage of the substrate W, thickness of the substrate W, component tolerances of the transporter, and sagging of the hand body 11A, the likelihood of the moving hand 11 contacting the substrates W housed in the substrate storage container CA can be reduced. Furthermore, even if the hand 11 (hand body 11A) vibrates during movement, the likelihood of the moving hand 11 contacting the substrates W housed in the substrate storage container CA can be reduced.

[0174] It should be noted that the control unit 102 also performs the same operation as the reference operation when taking out the processed substrate Wb from the interface PA via the indexer robot IR. Figures 1 to 10 The indexer robot IR is controlled in the same manner as described above. Therefore, the possibility that the moving hand 11 comes into contact with the substrate W accommodated in the delivery interface PA can be reduced.

[0175] Next, refer to Figures 1 to 8 and Figure 11 The operation of the indexer robot IR will be described. Figure 11 1 is a flowchart showing the flow of the second process performed by the control unit 102 included in the substrate processing apparatus 100 of this embodiment. The second process is a process performed by the control unit 102 when storing a specific processed substrate Wb in the inner space 401a (predetermined area) of the substrate storage container CA. Figure 11 As shown, the second process includes steps S21 to S26. In the following description, the substrate W accommodated in the substrate accommodation container CA (substrate W to be transferred) may be referred to as a "target substrate W1".

[0176] When to start Figure 11 In the process shown, the control unit 102 controls the first rotary motor 131, the second rotary motor 141, and the third rotary motor 151 to cause the hand body 11A of the hand 11 holding the target substrate W1 to enter the inner space 401a of the substrate storage container CA (step S21).

[0177] After the hand body 11A enters the inner space 401a of the substrate storage container CA, the control unit 102 drives the pusher 18 to release the target substrate W1 (step S22). Specifically, the control unit 102 drives the pusher drive unit 181 to move the two pressing support members 18a toward the base 11B. It should be noted that the control unit 102 determines that the hand body 11A has entered the inner space 401a of the substrate storage container CA based on the outputs of the first encoder 132, the second encoder 142, and the third encoder 152.

[0178] After releasing the target substrate W1, the control unit 102 controls the Z-axis motor 161 to lower the hand 11 by a predetermined amount (predetermined distance). As a result, the target substrate W1 is transferred from the hand 11 to a specific shelf among the multiple shelves included in the substrate storage container CA, and the target substrate W1 is supported by the specific shelf (step S23). The control unit 102 determines that the hand 11 has lowered by the predetermined amount (predetermined distance) based on the output of the fourth encoder 162.

[0179] After lowering the hand 11 by a predetermined amount (predetermined distance), the control unit 102 controls the lifting unit 9 to move the walls 36 of the first support portion 17a and the second support portion 17b downward (step S24). As a result, the thickness H1 of the front end of the hand 11 decreases. Specifically, the control unit 102 opens the first on-off valve 97. Furthermore, the control unit 102 activates the suction unit 105.

[0180] After moving the wall 36 to the downward position, the control unit 102 controls the first rotary motor 131, the second rotary motor 141, and the third rotary motor 151 to move the hand body 11A toward the opening of the substrate storage container CA (retreat). At this time, the hand body 11A moves in the gap GA1 between the other substrates W facing the lower surface of the target substrate W1 and the target substrate W1 (step S25). By making the hand body 11A pass through the gap GA1, the hand body 11A retreats to the outside of the substrate storage container CA (step S26). As a result, Figure 11 The indicated processing ends.

[0181] It should be noted that the other substrates W facing the lower surface of the target substrate W1 are examples of "opposing elements facing the lower surface of the specific substrate W within a predetermined area." The other substrates W facing the lower surface of the target substrate W1 are supported by a shelf directly below the shelf supporting the target substrate W1.

[0182] Above, as reference Figures 1 to 8 and Figure 11 As described, according to this embodiment, the hand body 11A can be retracted from the gap GA1 between the substrates W accommodated in the substrate storage container CA in a state where the thickness H1 of the front end side of the hand 11 is thinned (the first state). Therefore, even if the gap GA1 is reduced due to the effects of warping of the substrate W, thickness of the substrate W, component tolerances of the carrier, and sagging of the hand body 11A, the possibility of the moving hand 11 contacting the substrates W accommodated in the substrate storage container CA can be reduced. In addition, even if the hand 11 (hand body 11A) vibrates during movement, the possibility of the moving hand 11 contacting the substrates W accommodated in the substrate storage container CA can be reduced.

[0183] It should be noted that when the indexer robot IR carries the substrate Wa before processing into the delivery portion PA, the control portion 102 also communicates with the reference Figures 1 to 8 and Figure 11 The indexer robot IR is controlled in the same manner as described above. Therefore, when the hand body 11A is retracted from the inner space 501a of the interface PA, the possibility of the hand 11 coming into contact with the substrate W accommodated in the interface PA can be reduced.

[0184] Above, refer to Figures 1 to 11 Embodiment 1 of the present invention has been described. According to Embodiment 1, the moving hand 11 is less likely to come into contact with the substrate W arranged in a predetermined area.

[0185] It should be noted that in this embodiment, the first support body 351 is provided on the upper surface of the hand body 11A. However, for example, the lower portion of the first support body 351 may be located within a recess provided on the upper surface of the hand body 11A. Alternatively, the first support body 351 may be supported by a column member protruding from the upper surface of the hand body 11A, and the first support body 351 may be separated from the upper surface of the hand body 11A. In other words, the lower surface of the first support body 351 may not contact the upper surface of the hand body 11A. The same applies to the second support member 171b.

[0186] The shape of the first support body 351 is not particularly limited, as long as it has the first support surface 35a. For example, the first support body 351 may be hollow. Similarly, the shape of the second support member 171b is not particularly limited, as long as it has the support surface 37a and the wall surface 37b. For example, the second support member 171b may be hollow.

[0187] The shape of the wall 36 is not particularly limited as long as it has the wall surface 36a. For example, the wall 36 may be hollow. Alternatively, the wall 36 may be substantially L-shaped in cross-section.

[0188] In the present embodiment, the substrate W is held (clamped) by the first supporting portion 17 a , the second supporting portion 17 b , and the pusher 18 . However, the indexer robot IR may transport the substrate W without holding (clamping) the substrate W. Specifically, the indexer robot IR may transport the substrate W while supporting the substrate W by the first supporting portion 17 a to the fourth supporting portion 17 d .

[0189] In addition, in this embodiment, the hand 11 includes the pusher 18 , but the pusher 18 may be omitted.

[0190] In addition, in this embodiment, the wall 36 is raised and lowered by changing the pressure of the fluid. However, the structure for raising and lowering the wall 36 is not limited to the structure using fluid. For example, the indexer robot IR may also include a piezoelectric element for raising and lowering the wall 36. Alternatively, the indexer robot IR may also include a structure for raising and lowering the wall 36 using magnetic force. The structure for raising and lowering the wall 36 using magnetic force may include, for example, a magnet and a movable coil.

[0191] In this embodiment, the lift unit 9 includes the gas supply source 106, but the gas supply source 106 may be omitted from the lift unit 9. For example, gas may be supplied to the third pipe 96 of the lift unit 9 from a factory where the substrate processing apparatus 100 is installed.

[0192] Furthermore, in this embodiment, the central robot CR has substantially the same configuration as the indexer robot IR. Therefore, similar to the hand 11 of the indexer robot IR, the thickness of the front end of the hand 21 of the central robot CR can be varied. Consequently, similar to the indexer robot IR, the likelihood of the moving hand 21 contacting a substrate W positioned in a predetermined area can be reduced.

[0193] Specifically, when receiving a substrate W from the substrate holding unit 3, the hand body included in the hand 21 of the central robot CR enters the gap (gap GA2) between the substrate W and the upper surface of the spin base 32. The control unit 102 reduces the thickness of the front end of the hand 21 of the central robot CR before the hand body included in the hand 21 of the central robot CR enters the gap GA2. The spin base 32 is an example of an "opposing element that opposes the lower surface of the substrate W within a predetermined area."

[0194] Furthermore, after the hand 21 of the central robot CR transfers the substrate W to the substrate holder 3, the hand main body included in the hand 21 of the central robot CR passes through the gap GA2 and retreats from the processing chamber 201. After the hand 21 of the central robot CR transfers the substrate W to the substrate holder 3, the control unit 102 reduces the thickness of the front end side of the hand 21 of the central robot CR.

[0195] Furthermore, similarly to the indexer robot IR, the central robot CR transfers substrates W to and from the delivery interface PA. Similar to the indexer robot IR, the control unit 102 reduces the thickness of the front end side of the hand 21 of the central robot CR when transferring substrates W between the central robot CR and the delivery interface PA.

[0196] [Implementation Method 2]

[0197] Next, refer to Figure 12 (a)~ Figure 15(b) of FIG. 2 illustrates a second embodiment of the present invention. However, matters different from the first embodiment will be described, and descriptions of matters similar to the first embodiment will be omitted. In the second embodiment, the configuration of the hand 11 is different from that of the first embodiment.

[0198] Figure 12 (a) is a plan view showing the hand 11 of the indexer robot IR according to the second embodiment. Figure 12 (b) is another top view showing the hand 11 of the indexer robot IR according to the second embodiment. Figure 12 (a) shows the hand 11 that supports the unprocessed substrate Wa. Figure 12 (b) shows the hand 11 that supports the processed substrate Wb.

[0199] like Figure 12 (a) and Figure 12 As shown in (b) of FIG. , the hand 11 includes a hand body 11A and a base 11B. The hand body 11A includes a first hand element 11a and a second hand element 11b. The hand 11 also includes first to sixth support portions 17a to 17f and a pusher 18.

[0200] The first supporting portion 17a to the sixth supporting portion 17f support the substrate W. Specifically, Figure 12 (a) and Figure 12 As shown in (b) of FIG. 1 , the first support portion 17a and the second support portion 17b selectively support either the pre-processed substrate Wa or the processed substrate Wb. The third support portion 17c and the fourth support portion 17d support the pre-processed substrate Wa. The fifth support portion 17e and the sixth support portion 17f support the processed substrate Wb. Here, the pre-processed substrate Wa is an example of a "first substrate." The processed substrate Wb is an example of a "second substrate."

[0201] As in the first embodiment, the first and second support portions 17a and 17b are provided on the distal end side of the hand body 11A. As in the first embodiment, the third and fourth support portions 17c and 17d are provided on the proximal end side (base 11B side) of the hand body 11A. As in the first embodiment, the first to fourth support portions 17a to 17d are provided on the upper surface of the hand body 11A to support the peripheral edge of the substrate W from below.

[0202] More specifically, in Embodiment 2, each of the first supporting portion 17a and the second supporting portion 17b includes a third supporting member 171c. The third supporting member 171c selectively supports one of the pre-processed substrate Wa and the post-processed substrate Wb. Specifically, the third supporting member 171c selectively supports the peripheral edge of the pre-processed substrate Wa and the post-processed substrate Wb from below. For details of the third supporting member 171c, refer to Figure 13 (a) and Figure 13 (b) will be described later. As in Embodiment 1, the third supporting portion 17c and the fourth supporting portion 17d each include a second supporting member 171b. The second supporting member 171b supports the pre-processed substrate Wa.

[0203] Each of the fifth support portion 17e and the sixth support portion 17f includes a fourth support member 171d. The fourth support member 171d supports the processed substrate Wb. Specifically, the fourth support member 171d supports the peripheral edge of the processed substrate Wb from below. The fourth support member 171d may serve as a guide. Specifically, the fifth support portion 17e includes, in addition to the fourth support member 171d, a rod portion 172a and a support member driving portion 173a. Similarly, the sixth support portion 17f includes, in addition to the fourth support member 171d, a rod portion 172b and a support member driving portion 173b.

[0204] The rod portion 172a protrudes from the base portion 11B toward the front end. Specifically, the rod portion 172a protrudes from the base portion 11B toward between the first hand element 11a and the pusher 18 (the push support member 18a). The fourth support member 171d of the fifth support portion 17e is disposed between the first hand element 11a and the pusher 18 (the push support member 18a). The fourth support member 171d of the fifth support portion 17e is coupled to the rod portion 172a. The support member drive portion 173a is controlled by the control unit 102 so as to move the rod portion 172a in the direction in which the hand body 11A extends. The support member drive portion 173a may include, for example, a cylinder mechanism.

[0205] Similarly, the rod portion 172b protrudes from the base portion 11B toward the front end. Specifically, the rod portion 172b protrudes from the base portion 11B toward between the second hand element 11b and the pusher 18 (the push support member 18a). The fourth support member 171d of the sixth support portion 17f is disposed between the second hand element 11b and the pusher 18 (the push support member 18a). The fourth support member 171d of the sixth support portion 17f is connected to the rod portion 172b. The support member driving portion 173b is controlled by the control unit 102 so as to move the rod portion 172b in the direction in which the hand body 11A extends. The support member driving portion 173b may include, for example, a cylinder mechanism.

[0206] In detail, Figure 12 As shown in (b) in FIG. 1 , when the processed substrate Wb is supported by the hand 11 , the control unit 102 controls the support member driving unit 173 a and the support member driving unit 173 b to move (extend) the rods 172 a and 172 b toward the front end side.

[0207] Next, refer to Figure 13 (a) and Figure 13 (b) in the figure explains the indexer robot IR according to the second embodiment. Figure 13 (a) is a cross-sectional view schematically showing a first state of the hand 11 included in the indexer robot IR according to the second embodiment. Figure 13 (b) is a cross-sectional view schematically showing the second state of the hand 11 included in the indexer robot IR according to the second embodiment.

[0208] like Figure 13 (a) and Figure 13 As shown in FIG. 1 ( b ), the third support member 171 c protrudes upward from the hand body 11A. The third support member 171 c includes a second support body 352 and a wall body 36 .

[0209] The third supporting member 171c selectively supports one of the peripheral portion of the pre-processed substrate Wa and the peripheral portion of the post-processed substrate Wb. Specifically, the second supporting body 352 selectively supports one of the peripheral portion of the pre-processed substrate Wa and the peripheral portion of the post-processed substrate Wb. In detail, the second supporting body 352 selectively contacts one of the lower surface of the peripheral portion of the pre-processed substrate Wa and the lower surface of the peripheral portion of the post-processed substrate Wb, and selectively supports one of the peripheral portion of the pre-processed substrate Wa and the peripheral portion of the post-processed substrate Wb from below. The second supporting body 352 can be provided on the upper surface of the hand body 11A. It should be noted that, in the present embodiment, the second supporting body 352 is provided on the upper surface of the hand body 11A, but, for example, the lower portion of the second supporting body 352 may be located in a recess provided on the upper surface of the hand body 11A. Alternatively, the second support 352 may be supported by a column member protruding from the upper surface of the hand body 11A and separated from the upper surface of the hand body 11A. In other words, the lower surface of the second support 352 may not be in contact with the upper surface of the hand body 11A.

[0210] Specifically, the second support body 352 includes a first support surface 35a, a second support surface 35b, and a wall surface 35c. Figure 7 (a) and Figure 7 As described in (b) of FIG. 3 , the first support surface 35a may include an inclined surface. Also, similarly to the first support surface 35a, the second support surface 35b may also include an inclined surface.

[0211] like Figure 13As shown in (a) in FIG, the first supporting surface 35a supports the peripheral portion of the pre-processed substrate Wa. In detail, the first supporting surface 35a constitutes the upper surface of the second supporting body 352. The first supporting surface 35a contacts the lower surface of the peripheral portion of the pre-processed substrate Wa and supports the peripheral portion of the pre-processed substrate Wa from below. The wall surface 35c protrudes upward from the upper end of the first supporting surface 35a and faces the end face of the pre-processed substrate Wa supported by the first supporting surface 35a. Figure 13 As shown in (b) of FIG. 3 , the second supporting surface 35b supports the peripheral portion of the processed substrate Wb at a position higher than the first supporting surface 35a. Specifically, the second supporting surface 35b constitutes the upper surface of the second support body 352. The second supporting surface 35b contacts the lower surface of the peripheral portion of the processed substrate Wb, supporting the peripheral portion of the processed substrate Wb from below.

[0212] Specifically, the lower end of the wall surface 35c is connected to the upper end of the first support surface 35a. The first support surface 35a extends from the lower end of the wall surface 35c toward the approximate center of the pre-processed substrate Wa. The upper end of the wall surface 35c is connected to the lower end of the second support surface 35b. The second support surface 35b extends from the upper end of the wall surface 35c toward the wall body 36.

[0213] In the second embodiment, similarly to the first embodiment, the lifting unit 9 lifts and lowers the wall body 36 . Figure 13 (a) in FIG. 3 shows the wall body 36 in the lower position. As in the first embodiment, when the gas in the flow path 91 is sucked, the lifting member 93 moves the wall body 36 to the lower position. Figure 13 (b) in the figure shows wall 36 in the upper position. As in the first embodiment, when gas is supplied into flow path 91, lifting member 93 moves wall 36 to the upper position. As in the first embodiment, the suction of gas from flow path 91 and the supply of gas to flow path 91 are controlled by control unit 102.

[0214] like Figure 13 As shown in (a) of FIG. 2 , in Embodiment 2, the vertical position of the upper surface of the wall 36 when in the lower position is substantially equal to the position of the upper end of the second support surface 35b. Therefore, the thickness H1 of the front end of the hand 11 when the wall 36 is in the lower position is substantially equal to the total thickness of the hand body 11A and the thickness of the second support 352.

[0215] In addition, if Figure 13 As shown in (b) in FIG. 2 , in the second embodiment, the end surface of the processed substrate Wb supported by the second supporting surface 35 b faces the wall surface 36 a of the wall body 36 located at the upper position.

[0216] Above, refer to Figure 13 (a) and Figure 13(b) in FIG. 1 illustrates the third support member 171c included in the first support portion 17a. Note that the configuration of the third support member 171c included in the second support portion 17b is substantially the same as that of the third support member 171c included in the first support portion 17a, and therefore detailed description thereof will be omitted.

[0217] Next, refer to Figure 14 (a) in FIG. 1 illustrates the second supporting member 171 b. Figure 14 (a) is a cross-sectional view of the second support member 171b included in the third support portion 17c. Figure 14 As shown in (a) of FIG. 1 , the second supporting member 171b supports the peripheral edge of the substrate Wa before processing. Figure 7 As described in (c) of FIG. 3 , the second support member 171 b includes a support surface 37 a and a wall surface 37 b . Figure 14 The structure of the second support member 171b shown in (a) is similar to that of the reference Figure 7 The configuration of the second support member 171b described in (c) is substantially the same as that of the second support member 171b, and therefore detailed description thereof is omitted.

[0218] It should be noted that the height of the wall surface 37b from the upper end of the support surface 37a is the same as the reference Figure 13 (a) and Figure 13 The height of the wall surface 35c of the second support body 352 described in (b) is substantially equal. In addition, the height H11 from the lower surface 11L of the hand body 11A to the upper end of the second support member 171b is substantially equal to the height from the lower surface 11L of the hand body 11A to the upper end of the second support body 352 (the upper end of the second support surface 35b). In other words, the height H11 is substantially equal to the height H11 from the lower surface 11L of the hand body 11A to the upper end of the second support body 352 (the upper end of the second support surface 35b). Figure 13 In the first state shown in (a), the height H1 of the front end side of the hand 11 is substantially constant.

[0219] Above, refer to Figure 14 (a) in FIG. 1 illustrates the second support member 171b included in the third support portion 17c. Note that the configuration of the second support member 171b included in the fourth support portion 17d is substantially the same as that of the second support member 171b included in the third support portion 17c, and therefore detailed description thereof will be omitted.

[0220] Next, refer to Figure 14 (b) in FIG. 1 illustrates the fourth supporting member 171d. Figure 14 (b) is a cross-sectional view of the fourth supporting member 171d included in the fifth supporting portion 17e. Figure 14 As shown in (b) in FIG. 1 , the fourth support member 171d can be positioned above the hand body 11A. The fourth support member 171d includes a support surface 37c and a wall surface 37d.

[0221] Figure 14 The support surface 37c of the fourth support member 171d shown in (b) is stepped, comprising two inclined surfaces whose height decreases as they approach the center of the processed substrate Wb supported by the hand 11. Of the two inclined surfaces, the inclined surface farther from the center of the processed substrate Wb contacts the lower surface of the peripheral portion of the processed substrate Wb, supporting the peripheral portion of the processed substrate Wb from below. A wall surface 37d protrudes upward from the upper end of the support surface 37c. The wall surface 37d faces the end surface of the processed substrate Wb supported by the support surface 37c.

[0222] It should be noted that the height of the hand body 11A from the upper end of the support surface 37c is the same as the reference Figure 13 (a) and Figure 13 The height of the hand body 11A from the second support body 352 described in (b) is substantially the same. In addition, the height H11 from the lower surface 11L of the hand body 11A to the upper end of the fourth support member 171d is Figure 13 The height (thickness) of the front end side of the hand 11 in the second state shown in (b) may be greater than or equal to H1.

[0223] Next, refer to Figure 14 (c) in FIG. 1 illustrates a modified example of the fourth support member 171 d . Figure 14 (c) is a cross-sectional view showing a modified example of the fourth supporting member 171d included in the fifth supporting portion 17e. Figure 14 As shown in (c) in FIG. 1 , the support surface 37c of the fourth support member 171d may be composed of a single inclined surface.

[0224] Above, refer to Figure 14 (b) and Figure 14 (c) in FIG. 1 illustrates the fourth support member 171d included in the fifth support portion 17e. Note that the configuration of the fourth support member 171d included in the sixth support portion 17f is substantially the same as that of the fourth support member 171d included in the fifth support portion 17e, and therefore detailed description thereof will be omitted.

[0225] Above, refer to Figure 12 (a)~ Figure 14 (c) in the figure illustrates a second embodiment of the present invention. According to the second embodiment, as in the first embodiment, the thickness H1 of the front end side of the hand 11 can be changed. Therefore, as in the first embodiment, the possibility of the moving hand 11 contacting the substrate W arranged in a predetermined area can be reduced. In addition, according to the second embodiment, the pre-processed substrate Wa and the post-processed substrate Wb can be supported by different supporting surfaces. Therefore, the possibility of particles attached to the hand 11 (supporting surface) re-attaching to the post-processed substrate Wb can be reduced.

[0226] It should be noted that the shape of the second support body 352 is not particularly limited, as long as it has a first support surface 35a, a second support surface 35b, and a wall surface 35c. For example, the second support body 352 may be hollow. Similarly, the shape of the fourth support member 171d is not particularly limited, as long as it has a support surface 37c and a wall surface 37d.

[0227] Next, refer to Figure 15 (a) and Figure 15 (b) in the figure explains a modification of the indexer robot IR of the second embodiment. Figure 15 (a) and Figure 15 The modification shown in (b) is different from the reference in that the second support body 352 is raised and lowered in addition to the wall body 36. Figure 12 (a)~ Figure 14 The indexer robot IR shown in (c) is different.

[0228] Figure 15 (a) is a cross-sectional view schematically showing a first state of the hand 11 included in a modification of the indexer robot IR according to the second embodiment. Figure 15 (b) is a cross-sectional view schematically showing a second state of the hand 11 included in a modification of the indexer robot IR according to the second embodiment.

[0229] Figure 15 (a) and Figure 15 The indexer robot IR shown in (b) includes a first lifting unit 9A and a second lifting unit 9B. The first lifting unit 9A and the second lifting unit 9B each include a flow path 91, a storage chamber 92, and a lifting member 93.

[0230] With reference Figure 13 (a) and Figure 13 The first lifting unit 9A is similar to the lifting unit 9 described in (b) of FIG. 3 , and moves the wall 36 up and down. Figure 13 (a) and Figure 13 Since the lifting part 9 described in (b) is the same as that in FIG. 1 , its detailed description is omitted.

[0231] The second lifting section 9B is different from the first lifting section 9A in that it raises and lowers the second support body 352. The second lifting section 9B is an example of a "support body lifting section". Specifically, the storage chamber 92 of the second lifting section 9B is provided below the second support body 352. The lifting component 93 of the second lifting section 9B is connected to the second support body 352. Similar to the first lifting section 9A, the lifting component 93 of the second lifting section 9B raises and lowers the second support body 352 between an upper position and a lower position in response to changes in pressure within the flow path 91 of the second lifting section 9B. Structure and reference of the second lifting section 9B Figure 13 (a) and Figure 13 Since the lifting part 9 described in (b) is the same as that in FIG. 1 , its detailed description is omitted.

[0232] Figure 15 (a) in FIG. 3 shows the second support body 352 located in the upper position. Figure 15 As shown in (a) in the figure, when gas is supplied to the flow path 91 of the second lifting part 9B, the lifting component 93 of the second lifting part 9B causes the second support body 352 to be in the upper position. The vertical position of the lower surface of the second support body 352 in the upper position can be approximately the same as the vertical position of the upper surface of the hand body 11A. However, the vertical position of the lower surface of the second support body 352 in the upper position can be higher or lower than the vertical position of the upper surface of the hand body 11A. Similar to the first lifting part 9A, the supply of gas to the flow path 91 of the second lifting part 9B is controlled by the control unit 102.

[0233] Figure 15 (b) in FIG. 3 shows the second support body 352 located at the lower position. Figure 15 As shown in (b) of FIG. 2 , when the gas within the flow path 91 of the second lifter 9B is sucked, the lifting member 93 of the second lifter 9B positions the second support 352 in the lower position. Similar to the first lifter 9A, the suction of the gas within the flow path 91 of the second lifter 9B is controlled by the control unit 102.

[0234] In detail, Figure 15 (a) and Figure 15 In the modified example shown in (b) of FIG, the hand body 11A has a recess 111 that accommodates the lower portion of the second support 352. When the gas in the flow path 91 of the second lift 9B is sucked, causing the lift member 93 of the second lift 9B to move downward, the lower portion of the second support 352 is accommodated in the recess 111. As a result, the height of the second support 352 from the lower surface 11L of the hand body 11A is reduced.

[0235] like Figure 15As shown in (a) of FIG. 1 , the control unit 102 controls the first lifting unit 9A and the second lifting unit 9B to position the wall 36 at the lower position and the second support 352 at the upper position when the substrate Wa before processing is supported by the hand 11. Figure 15 As shown in (b) of FIG. 1 , the control unit 102 controls the first and second elevators 9A, 9B to position the wall 36 in the upper position and the second support 352 in the lower position when the processed substrate Wb is supported by the hand 11. As a result, when the hand 11 supports the processed substrate Wb, the height of the wall 36a from the upper end of the second support 352 is increased. Therefore, the processed substrate Wb can be supported more reliably.

[0236] In addition, similar to the first embodiment, the central robot CR of the second embodiment also has a configuration substantially similar to that of the indexer robot IR. Therefore, similar to the hand 11 of the indexer robot IR, the thickness of the front end side of the hand 21 of the central robot CR can be changed. Therefore, similar to the indexer robot IR, the possibility of the moving hand 21 contacting the substrate W arranged in a predetermined area can be reduced. In addition, as shown in FIG. Figure 15 (a) and Figure 15 As described in (b) above, the processed substrate Wb can be supported more reliably by the hand 21 .

[0237] It should be noted that in this embodiment, the third supporting part 17c and the fourth supporting part 17d support the pre-processed substrate Wa, and the fifth supporting part 17e and the sixth supporting part 17f support the post-processed substrate Wb, but the third supporting part 17c and the fourth supporting part 17d support the post-processed substrate Wb, and the fifth supporting part 17e and the sixth supporting part 17f support the pre-processed substrate Wa.

[0238] Similarly, in this embodiment, the first supporting surface 35a of the second supporting body 352 supports the substrate Wa before processing, and the second supporting surface 35b of the second supporting body 352 supports the substrate Wb after processing, but it is also possible that the first supporting surface 35a of the second supporting body 352 supports the substrate Wb after processing, and the second supporting surface 35b of the second supporting body 352 supports the substrate Wa before processing.

[0239] [Implementation Method 3]

[0240] Next, refer to Figures 16 and 17 (c) of FIG. 3 illustrates a third embodiment of the present invention. However, matters different from those in the first and second embodiments will be described, and descriptions of matters similar to those in the first and second embodiments will be omitted. In the third embodiment, the configuration of the hand 11 differs from that in the first and second embodiments.

[0241] Figure 161 is a top view showing the hand 11 of the indexer robot IR according to the third embodiment. Figure 16 As shown, the hand 11 includes a hand body 11A and a base 11B. The hand body 11A includes a first hand element 11a and a second hand element 11b. The hand 11 also includes first to fourth support portions 17a to 17d and a pusher 18.

[0242] In Embodiment 3, the first to fourth support sections 17a to 17d each include a fifth support member 171e and a sixth support member 171f. The fifth support member 171e supports the periphery of the unprocessed substrate Wa. The sixth support member 171f supports the periphery of the processed substrate Wb. Specifically, the fifth support member 171e supports the periphery of the unprocessed substrate Wa from below. The sixth support member 171f supports the periphery of the processed substrate Wb from below.

[0243] As reference Figure 17 (a)~ Figure 17 As described in (c) of FIG. 1 , the fifth supporting member 171e and the sixth supporting member 171f each have a wall surface 37b facing the end surface of the substrate W. Figure 16 As shown, the wall surfaces 37 b of the four fifth supporting members 171 e and the wall surfaces 37 b of the four sixth supporting members 171 f are arranged on a circumference having a radius slightly larger than the radius of the substrate W.

[0244] Next, refer to Figure 17 (a)~ Figure 17 (c) in the figure illustrates the indexer robot IR according to the third embodiment. Figure 17 (a) is a cross-sectional view schematically showing a first state of the hand 11 included in the indexer robot IR according to the third embodiment. Figure 17 (b) is a cross-sectional view schematically showing the second state of the hand 11 included in the indexer robot IR according to the third embodiment. Figure 17 (c) is a cross-sectional view schematically showing the third state of the hand 11 included in the indexer robot IR of the third embodiment. Figure 17 (a)~ Figure 17 In (c), for easy understanding, the fifth supporting member 171e and the sixth supporting member 171f are shown in the figure while being arranged in the horizontal direction.

[0245] First, refer to Figure 17 (a) in FIG. 1 illustrates the fifth supporting member 171e and the sixth supporting member 171f. Figure 17As shown in (a) of FIG. 1 , the fifth supporting member 171e and the sixth supporting member 171f protrude upward from the hand body 11A. The fifth supporting member 171e and the sixth supporting member 171f have substantially the same structure. Specifically, Figure 7 Similarly to the second supporting member 171b described in (c) of FIG. 1 , the fifth supporting member 171e and the sixth supporting member 171f each have a supporting surface 37a and a wall surface 37b. Figure 7 The second support member 171b described in (c) is substantially the same as that described above, and therefore detailed description thereof is omitted.

[0246] Next, refer to Figure 17 (a)~ Figure 17 (c) in the figure illustrates the indexer robot IR of embodiment 3. Figure 17 (a)~ Figure 17 As shown in (c) in FIG. 3 , the indexer robot IR of the third embodiment includes a third lifting unit 9C and a fourth lifting unit 9D. The third lifting unit 9C and the fourth lifting unit 9D include a flow path 91 , a storage chamber 92 , and a lifting member 93 , respectively.

[0247] The third lifting unit 9C lifts the fifth support member 171e. Specifically, the storage chamber 92 of the third lifting unit 9C is provided below the fifth support member 171e. The lifting member 93 of the third lifting unit 9C is connected to the fifth support member 171e. Figure 7 (a) and Figure 7 Similarly to the lifting unit 9 described in (b) above, the lifting member 93 of the third lifting unit 9C lifts the fifth supporting member 171e between the upper position and the lower position according to the pressure change in the flow path 91 of the third lifting unit 9C.

[0248] The fourth lifting unit 9D lifts the sixth support member 171f. The storage chamber 92 of the fourth lifting unit 9D is provided below the sixth support member 171f. The lifting member 93 of the fourth lifting unit 9D is connected to the sixth support member 171f. Figure 7 (a) and Figure 7 Similarly to the lifting unit 9 described in (b) above, the lifting member 93 of the fourth lifting unit 9D lifts the sixth supporting member 171f between the upper position and the lower position according to the pressure change in the flow path 91 of the fourth lifting unit 9D.

[0249] Configuration and reference of the third lifting unit 9C and the fourth lifting unit 9D Figure 7 (a) and Figure 7 The lifting portion 9 described in (b) is substantially the same as that described above, and therefore detailed description thereof is omitted.

[0250] Figure 17 (a) in FIG. 1 shows the fifth supporting member 171e and the sixth supporting member 171f located at the lower position. Figure 17 As shown in (a) of FIG. 1 , when the gas in the flow path 91 of the third lift 9C is sucked, the lift member 93 of the third lift 9C positions the fifth support member 171e in the lower position. Similarly, when the gas in the flow path 91 of the fourth lift 9D is sucked, the lift member 93 of the fourth lift 9D positions the sixth support member 171f in the lower position.

[0251] Figure 17 (b) in FIG. 1 shows the fifth supporting member 171e at the upper position and the sixth supporting member 171f at the lower position. Figure 17 As shown in (b) in FIG. 1 , when gas is supplied to the flow path 91 of the third lift section 9C, the lift member 93 of the third lift section 9C positions the fifth support member 171 e in the upper position.

[0252] Figure 17 (c) in FIG. 1 shows the fifth supporting member 171e at the lower position and the sixth supporting member 171f at the upper position. Figure 17 As shown in (c) in FIG. 1 , when gas is supplied to the flow path 91 of the fourth lift unit 9D, the lift member 93 of the fourth lift unit 9D positions the sixth support member 171f in the upper position.

[0253] It should be noted that in this embodiment, the upper end of the first support portion 17a represents the upper end of the fifth support member 171e or the sixth support member 171f. Specifically, when the fifth support member 171e and the sixth support member 171f are both in the upper position, the upper end of the first support portion 17a represents the upper ends of the fifth support member 171e and the sixth support member 171f. When the fifth support member 171e is in the upper position and the sixth support member 171f is in the lower position, the upper end of the first support portion 17a represents the upper end of the fifth support member 171e. When the fifth support member 171e is in the lower position and the sixth support member 171f is in the upper position, the upper end of the first support portion 17a represents the upper end of the sixth support member 171f. When the fifth support member 171e and the sixth support member 171f are both in the lower position, the upper end of the first support portion 17a represents the upper ends of the fifth support member 171e and the sixth support member 171f.

[0254] With reference Figure 7 (a) and Figure 7 Similarly to the lifting unit 9 described in (b) , the suction of gas in the flow paths 91 of the third lifting unit 9C and the fourth lifting unit 9D and the supply of gas to the flow paths 91 of the third lifting unit 9C and the fourth lifting unit 9D are controlled by the control unit 102 .

[0255] For example, when the indexer robot IR takes out the unprocessed substrate Wa from the substrate storage container CA, the control unit 102 controls the third lift 9C and the fourth lift 9D so that the substrate Wa can be removed. Figure 17 As shown in (a) of FIG. , the fifth supporting member 171e and the sixth supporting member 171f are positioned in the lower position. As a result, when the hand body 11A enters the gap GA1 between the pre-processed substrates Wa accommodated in the substrate storage container CA, the thickness H1 of the front end of the hand 11 becomes thinner. Therefore, the hand 11 moving in the horizontal direction is less likely to come into contact with the pre-processed substrates Wa supported in the inner space 401a of the substrate storage container CA.

[0256] When the pre-processed substrate Wa is transported by the hand 11, the control unit 102 controls the third lift 9C and the fourth lift 9D so that Figure 17 As shown in (b) of FIG. 1 , the fifth supporting member 171e is positioned in the upper position and the sixth supporting member 171f is positioned in the lower position. As a result, the vertical position of the supporting surface 37a of the fifth supporting member 171e becomes higher than the vertical position of the supporting surface 37a of the sixth supporting member 171f. Therefore, the pre-processed substrate Wa is supported by the supporting surface 37a of the fifth supporting member 171e.

[0257] Similarly, when the processed substrate Wb is transported by the hand 11, the control unit 102 controls the third lift 9C and the fourth lift 9D so that Figure 17 As shown in (c) in FIG. 5 , the fifth supporting member 171e is positioned in the lower position and the sixth supporting member 171f is positioned in the upper position. As a result, the vertical position of the supporting surface 37a of the sixth supporting member 171f becomes higher than the vertical position of the supporting surface 37a of the fifth supporting member 171e. Therefore, the processed substrate Wb is supported by the supporting surface 37a of the sixth supporting member 171f.

[0258] In addition, in this embodiment, the fifth supporting member 171e and the sixth supporting member 171f are moved up and down, but only one of the fifth supporting member 171e and the sixth supporting member 171f may be moved up and down.

[0259] In this embodiment, the third and fourth supporting portions 17c and 17d include the fifth and sixth supporting members 171e and 171f, similarly to the first and second supporting portions 17a and 17b. However, similarly to Embodiment 2, the indexer robot IR may also include the fifth and sixth supporting portions 17e and 17f. In this case, similarly to Embodiment 2, the third and fourth supporting portions 17c and 17d may also include the second supporting member 171b.

[0260] Above, refer to Figures 16 and 17 (c) in the figure illustrates a third embodiment of the present invention. As in the first and second embodiments, according to the third embodiment, the thickness H1 of the front end side of the hand 11 can be changed. Therefore, as in the first and second embodiments, the possibility of the moving hand 11 contacting the substrate W arranged in a predetermined area can be reduced. In addition, according to the third embodiment, the pre-processed substrate Wa and the post-processed substrate Wb can be supported by different supporting surfaces. Therefore, the possibility of particles attached to the hand 11 (supporting surface) re-attaching to the post-processed substrate Wb can be reduced.

[0261] Furthermore, as in Embodiments 1 and 2, the central robot CR of Embodiment 3 also has substantially the same configuration as the indexer robot IR. Therefore, similar to the hand 11 of the indexer robot IR, the thickness of the front end of the hand 21 of the central robot CR can be varied. Consequently, similar to the indexer robot IR, the likelihood of the moving hand 21 contacting a substrate W positioned in a predetermined area can be reduced.

[0262] Above, with reference to the accompanying drawings ( Figures 1 to 17 (c)) in the foregoing describes an embodiment of the present invention. However, the present invention is not limited to the above-mentioned embodiment and can be implemented in various ways without departing from the scope of the present invention. In addition, the multiple components disclosed in the above-mentioned embodiment can be appropriately changed. For example, a component of all the components shown in a certain embodiment can be added to the components of other embodiments, or some components of all the components shown in a certain embodiment can be deleted from the embodiment.

[0263] To facilitate understanding of the present invention, the accompanying drawings schematically illustrate the various components. The thickness, length, number, and spacing of the components shown in the drawings may differ from the actual configuration due to drawing requirements. Furthermore, the configurations of the components shown in the above embodiments are merely examples and are not particularly limited. Various modifications may be made without departing from the scope of the present invention.

[0264] For example, refer to Figures 1 to 17 In the embodiment described in (c), the indexer robot IR has two hands 11, but the indexer robot IR may have one hand 11 or three or more hands 11. Similarly, the central robot CR has two hands 21, but the central robot CR may have one hand 21 or three or more hands 21.

[0265] In addition, refer to Figures 1 to 17In the embodiment described in (c), the substrate processing apparatus 100 is a cleaning apparatus or an etching apparatus. However, the substrate processing apparatus 100 is not particularly limited as long as it processes a substrate. For example, the substrate processing apparatus 100 may also be a coating apparatus, a developing apparatus, an exposure apparatus, a baking apparatus, or a film forming apparatus.

[0266] In addition, refer to Figures 1 to 17 In the embodiment described in (c), the substrate transfer device applied to a single-wafer type substrate processing apparatus has been described, but the present invention can also be applied to a batch type substrate processing apparatus.

[0267] The present invention is useful for an apparatus for conveying a substrate and an apparatus for processing a substrate.

Claims

1. A substrate transport device for transporting a substrate, comprising: a hand supporting the substrate; a hand support portion that supports the hand; and Lifting unit, The hand has: a base connected to the hand support; a hand body extending horizontally from the base; and a support portion, which is provided at the front end side of the hand body and supports the substrate, The lifting unit lifts and lowers at least a portion of the support unit.

2. The substrate transport device according to claim 1, wherein: The lifting part includes: a flow path disposed inside the hand body; and A lifting member lifts and lowers at least a portion of the support portion in response to a change in pressure within the flow path.

3. The substrate transporting device according to claim 1 or 2, wherein: The support portion includes a support member protruding upward from the hand body, The supporting member has: a support body supporting the substrate; and a wall body facing the end surface of the substrate supported by the support body, The lifting part includes a wall lifting part for lifting the wall.

4. The substrate transporting device according to claim 3, wherein: The support selectively supports one of a first substrate and a second substrate different from the first substrate. The support body has: a first supporting surface supporting the first substrate; a wall surface facing an end surface of the first substrate supported by the first supporting surface; and a second supporting surface supporting the second substrate at a position higher than the first supporting surface, The wall body faces the end surface of the second substrate supported by the second supporting surface.

5. The substrate transporting device according to claim 4, wherein: The lifting part includes: The wall lifting portion; and A support body lifting unit that lifts the support body.

6. The substrate transporting device according to claim 1 or 2, wherein: The support portion includes two support members protruding upward from the hand body. Each of the two supporting members has: a supporting surface for supporting the substrate; and a wall surface facing the end surface of the substrate supported by the supporting surface, The lifting unit includes two lifting units for lifting and lowering the two supporting members, respectively.

7. A substrate processing apparatus for processing a substrate, comprising: a substrate processing unit that processes the substrate; and a transport unit that transports the substrate between a substrate storage container capable of storing the substrate and the substrate processing unit; The conveying unit includes the substrate conveying device according to claim 1 or 2.

8. The substrate processing apparatus according to claim 7, further comprising a control unit for controlling the lifting unit included in the substrate transport device. The lifting portion lifts at least a portion of the support portion between an upper position and a lower position below the upper position. The substrate transport device transports the substrate located in a predetermined area to the outside of the predetermined area. The control unit positions at least a portion of the support unit at the lower position before the hand enters a gap between the substrate located in the predetermined area and an opposing element opposed to the lower surface of the substrate in the predetermined area. The control unit raises at least a portion of the support unit from the lower position to the upper position when the substrate is supported by the hand entering the gap.

9. The substrate processing apparatus according to claim 8, wherein: The predetermined area includes the inner space of the substrate storage container. The substrate transport device transports a specific substrate accommodated in the inner space of the substrate storage container to the outside of the substrate storage container. The opposing element includes another substrate accommodated in the inner space of the substrate accommodation container.

10. The substrate processing apparatus according to claim 7, further comprising a control unit for controlling the lifting unit included in the substrate transport device. The lifting portion lifts at least a portion of the support portion between an upper position and a lower position below the upper position. The substrate transport device transports the substrate from outside the predetermined area to the predetermined area, thereby arranging the substrate in the predetermined area. The control unit positions at least a portion of the support unit at the lower position when the hand, after placing the substrate in the predetermined area, retreats from the predetermined area.

11. The substrate processing apparatus according to claim 10, wherein: The predetermined area includes the inner space of the substrate storage container. The substrate transport device transports a specific substrate to the inner space of the substrate storage container, thereby arranging the specific substrate in the inner space of the substrate storage container. The control unit positions at least a portion of the support unit at the lower position when the hand, after arranging the specific substrate in the inner space of the substrate storage container, passes through a gap between the specific substrate and other substrates facing the lower surface of the specific substrate and retracts from the substrate storage container.

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