Method for optimizing the composition of a solution for electroless nickel plating on ceramic substrates

Abstract

This invention relates to the field of materials science and technology, and discloses a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates. The method includes: analyzing target ratio combinations of key variables to establish an initial nickel plating solution; plating a preset ceramic substrate using the initial nickel plating solution, and recording the current pH value during the initial nickel plating process; analyzing the pH adjustment parameters of the initial nickel plating solution, marking the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameters to determine the failure point of the initial nickel plating solution; performing nickel plating on the ceramic substrate using the initial nickel plating solution to obtain a nickel-plated ceramic substrate; identifying the critical load for plating peeling off the nickel-plated ceramic substrate to determine the adhesion of the nickel-plated ceramic substrate; analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate; outputting the composition optimization parameters of the initial nickel plating solution; and performing composition optimization of the nickel plating solution based on the composition optimization parameters. This invention can improve the optimization effect of the nickel plating solution composition.

Description

Technical Field

[0001] This invention relates to a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates, belonging to the field of materials science and technology. Background Technology

[0002] Optimization of electroless nickel plating solution composition refers to the process of improving the quality, performance, and production efficiency of the plating layer by adjusting and improving the various components and their concentration ratios in the electroless nickel plating solution. Through scientific and reasonable optimization, a plating layer with better quality, better performance, higher production efficiency, and more environmentally friendly properties can be obtained, thereby bringing significant economic and social benefits.

[0003] Traditional optimization of electroless nickel plating solution composition relies primarily on accumulated experience and single-factor experiments. This involves keeping other components constant and changing the concentration of a single component to observe changes in coating performance, thereby determining the optimal range for that component. This method is cumbersome, time-consuming, and struggles to account for the interactions between multiple factors, resulting in unsatisfactory optimization of the nickel plating solution composition. Summary of the Invention

[0004] This invention provides a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates, the main purpose of which is to improve the optimization effect of the nickel plating solution composition.

[0005] To achieve the above objectives, the present invention provides a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates, comprising:

[0006] Define the basic formulation of the nickel plating solution, determine the key variables of the basic formulation, wherein the key variables include nickel salt concentration, reducing agent concentration, complexing agent concentration and pH value, and establish orthogonal parameters of the key variables to construct the index curve of the nickel plating solution;

[0007] By analyzing the target ratio combination of the key variables through the index curve, the initial nickel plating solution is established. The initial nickel plating solution is then used to plate a preset ceramic substrate, and the current pH value of the initial nickel plating solution during the plating process is recorded.

[0008] Using the current pH value, the pH adjustment parameters of the initial nickel plating solution are analyzed using a preset automatic titration algorithm. The comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameters is marked to determine the failure point of the initial nickel plating solution.

[0009] Based on the failure point and the pH adjustment parameter, the initial nickel plating solution is applied to the ceramic substrate to obtain a nickel-plated ceramic substrate. The critical load for the nickel-plated ceramic substrate to peel off the coating is identified to determine the adhesion of the nickel-plated ceramic substrate. The conductivity and corrosion resistance of the nickel-plated ceramic substrate are analyzed.

[0010] Based on the bonding strength, conductivity, and corrosion resistance, the composition optimization parameters of the initial nickel plating solution are output using the trained nickel plating solution composition optimization model, and the composition optimization of the nickel plating solution is performed based on the composition optimization parameters.

[0011] Optionally, constructing the index curve of the nickel plating solution includes:

[0012] Determine the orthogonal test data corresponding to the orthogonal parameters of the nickel plating solution;

[0013] Define the performance indicators of the nickel plating solution;

[0014] Based on the orthogonal test data, analyze the sequence values ​​of the performance index;

[0015] Define the sequence nodes of the nickel plating solution;

[0016] Based on the sequence nodes and the sequence values, an index curve for the nickel plating solution is constructed.

[0017] Optionally, the step of analyzing the target ratio combination of the key variables through the indicator curve includes:

[0018] Construct the interaction response surface of the index curve;

[0019] Mark the extreme points of the interaction response surface;

[0020] Define the performance index weights corresponding to the performance indexes of the aforementioned index curves;

[0021] Based on the extreme points and the performance index weights, analyze the multi-objective compromise solution of the performance index;

[0022] The target ratio combination of the key variables is determined through the multi-objective compromise solution.

[0023] Optionally, the step of analyzing the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm based on the current pH value includes:

[0024] Based on the pH value corresponding to the initial nickel plating solution and the current pH value, calculate the pH error value of the initial nickel plating solution during the plating process;

[0025] Analyze the positive and negative values ​​of the pH error to determine the pH adjuster for the initial nickel plating solution;

[0026] Based on the pH error value, the titration flow rate of the pH adjuster is calculated using the automatic titration algorithm;

[0027] The pH adjustment parameters of the initial nickel plating solution are determined by using the pH adjuster and the titration flow rate.

[0028] Optionally, the step of calculating the titration flow rate of the pH adjuster using the automatic titration algorithm based on the pH error value includes:

[0029] Determine the gain parameters of the automatic titration algorithm, wherein the gain parameters include proportional gain, integral gain, and derivative gain;

[0030] Based on the gain parameter and the pH error value, the titration flow rate of the pH adjuster is calculated using the automatic titration algorithm, wherein the automatic titration algorithm is:

[0031]

[0032] Where u(t) represents the titration flow rate of the pH adjuster at time t, and R p Represents the proportional gain, e(t) represents the pH error value at time t, and R i R represents the integral gain. d Represents differential gain. This represents the accumulated error value. Let dt represent the error transformation rate, dt represent the time differential component, and d represent the differential operator.

[0033] Optionally, the marking of the overall lifetime score of the initial nickel plating solution under the pH adjustment parameter includes:

[0034] Obtain the plating rate data and solution transmittance data of the initial nickel plating solution under the pH adjustment parameters;

[0035] Based on the plating rate data, calculate the plating rate decay rate of the initial nickel plating solution;

[0036] Based on the solution transmittance data, the transmittance of the initial nickel plating solution was analyzed;

[0037] The conversion turbidity of the initial nickel plating solution is determined by the transmittance.

[0038] Based on the plating rate decay rate and the conversion turbidity, the overall lifetime score of the initial nickel plating solution under the pH adjustment parameter is analyzed.

[0039] Optionally, the step of combining the plating rate decay rate and the conversion turbidity to analyze the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameter includes:

[0040] Define the attenuation rate weight and the conversion turbidity weight of the plating rate attenuation rate and the conversion turbidity;

[0041] Mark the failed turbidity and ideal turbidity of the converted turbidity;

[0042] Based on the plating rate decay rate, the conversion turbidity, the decay rate weight, the conversion turbidity weight, the failure turbidity, and the ideal turbidity, the overall lifetime score of the initial nickel plating solution is calculated using the following formula:

[0043]

[0044] Where S represents the overall lifetime score of the initial nickel plating solution, V represents the plating rate decay rate, ω1 represents the decay rate weight, and D represents the conversion turbidity. min D represents ideal turbidity. max ω1 represents the failure turbidity, and ω2 represents the conversion turbidity weight.

[0045] Optionally, identifying the critical load at which the nickel-plated ceramic substrate peels off the plating includes:

[0046] Construct the plating peel load conditions for the nickel-plated ceramic substrate;

[0047] Construct the load-displacement curve under the coating peeling load condition;

[0048] Mark the abrupt change points of the load-displacement curve;

[0049] The load at the point of abrupt change is recorded as the critical load for the nickel-plated ceramic substrate to peel off the coating.

[0050] Optionally, the analysis of the conductivity and corrosion resistance of the nickel-plated ceramic substrate includes:

[0051] A four-probe tester is configured for the nickel-plated ceramic substrate;

[0052] The four probes of the four probes are pressed vertically and gently against the surface of the nickel-plated ceramic substrate to analyze the contact uniformity coefficient between the four probes and the nickel-plated ceramic substrate.

[0053] Based on the contact uniformity coefficient, a constant current is applied to the nickel-plated ceramic substrate using the four-probe tester, and the voltage of the nickel-plated ceramic substrate is recorded.

[0054] The conductivity of the nickel-plated ceramic substrate is calculated based on the constant current and the voltage.

[0055] Identify the surface condition of the plating layer on the nickel-plated ceramic substrate;

[0056] The nickel-plated ceramic substrate is placed in a pre-set salt spray chamber to record the percentage of rusted area on the nickel-plated ceramic substrate.

[0057] The corrosion resistance of the nickel-plated ceramic substrate is determined based on the percentage of rusted area.

[0058] Optionally, determining the corrosion resistance of the nickel-plated ceramic substrate based on the percentage of rusted area includes:

[0059] Determine the corrosion resistance level based on the percentage of rusted area;

[0060] Identify the etched areas on the nickel-plated ceramic substrate;

[0061] Define the corrosion weight of the corrosion region;

[0062] The corrosion coefficient of the nickel-plated ceramic substrate is calculated based on the corrosion weight and the rust area ratio.

[0063] The corrosion resistance of the nickel-plated ceramic substrate is determined based on the corrosion coefficient.

[0064] To address the above problems, the present invention also provides an electronic device, the electronic device comprising:

[0065] At least one processor; and,

[0066] A memory communicatively connected to the at least one processor; wherein,

[0067] The memory stores instructions that can be executed by the at least one processor to implement the above-described method for optimizing the composition of a chemical nickel plating solution on a ceramic substrate.

[0068] To address the aforementioned problems, the present invention also provides a computer-readable storage medium storing at least one instruction, which is executed by a processor in an electronic device to implement the above-described method for optimizing the composition of a chemical nickel plating solution on a ceramic substrate.

[0069] Compared to the problems described in the background technology, firstly, by systematically defining the basic formula and determining key variables such as the concentrations of nickel salts, reducing agents, complexing agents, and pH values, and then using orthogonal experimental design to construct index curves, this method can efficiently and scientifically explore the influence of various factors on coating performance. This approach avoids the blindness and inefficiency of traditional trial-and-error methods, significantly shortens the experimental cycle, and ensures the comprehensiveness and representativeness of experimental data, laying a solid foundation for subsequent optimization. Secondly, this method introduces online pH monitoring and automatic titration algorithms, achieving precise control over the dynamic changes in the pH value of the plating solution. This not only ensures the stability of the chemical environment of the plating solution during the plating process, thereby improving the uniformity and consistency of the coating quality, but also accurately predicts the failure point of the plating solution by analyzing the relationship between pH adjustment parameters and comprehensive lifetime score, making the production process more efficient. This method is controllable and effectively avoids plating defects caused by plating solution aging, improving production efficiency and product qualification rate. More importantly, it combines the evaluation of plating performance (adhesion, conductivity, corrosion resistance) with an advanced machine learning optimization model. Through precise measurement of the actual performance of nickel-plated ceramic substrates, it not only obtains performance data reflecting real application requirements but also uses the trained model to deduce component optimization parameters that can further improve performance. This data-driven optimization approach comprehensively considers multiple performance indicators, finding the optimal balance between performance and cost, avoiding potential performance sacrifices caused by optimizing a single indicator. Ultimately, by implementing component optimization, the overall quality of nickel-plated ceramic substrates can be significantly improved, enhancing their reliability and competitiveness in applications such as electronics and power, and enabling continuous process improvement and product upgrades. Therefore, this invention can improve the optimization effect of nickel plating solution composition. Attached Figure Description

[0070] Figure 1 This is a schematic flowchart of a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to an embodiment of the present invention.

[0071] Figure 2 This is a schematic diagram illustrating the failure node analysis of a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to an embodiment of the present invention.

[0072] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0073] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0074] This application provides a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates. The execution entity of this method includes, but is not limited to, at least one of the following electronic devices that can be configured to execute the method provided in this application: a server, a terminal, etc. In other words, the method for optimizing the composition of a chemical nickel plating solution for ceramic substrates can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0075] Example 1:

[0076] Reference Figure 1 The diagram shown is a flowchart illustrating a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to an embodiment of the present invention. In this embodiment, the method for optimizing the composition of a chemical nickel plating solution for ceramic substrates includes:

[0077] S1. Define the basic formulation of the nickel plating solution, determine the key variables of the basic formulation, wherein the key variables include nickel salt concentration, reducing agent concentration, complexing agent concentration and pH value, and establish orthogonal parameters of the key variables to construct the index curve of the nickel plating solution.

[0078] It should be explained that the nickel plating solution refers to a chemical solution used to deposit a nickel plating layer on the surface of a ceramic substrate. This solution reduces nickel ions to metallic nickel through a chemical reduction reaction without external current, and the reduced nickel is deposited on the substrate. The basic formulation refers to the initial composition of the nickel plating solution. For example, the basic formulation includes: nickel salt: nickel sulfate 10–30 g / L, as a source of nickel ions; reducing agent: sodium hypophosphite 15–40 g / L, for reducing nickel ions; complexing agent: lactic acid 10–30 mL / L or sodium citrate 10–25 g / L, for stabilizing nickel ions and adjusting the deposition rate; buffer: sodium acetate 5–20 g / L, to maintain the solution pH at 4.5–6.0; accelerator: succinic acid 1–5 g / L or sodium fluoride 0.1–1 g / L, to increase the plating rate; and stabilizer: thiourea 0.1–10 mg / L or lead ions 0.1–5 mg / L, to inhibit spontaneous decomposition of the solution.

[0079] This invention identifies key variables in the basic formulation, precisely pinpointing these variables and their optimization range, providing reliable input for subsequent machine learning models. Specifically, the nickel salt concentration refers to the content of nickel ions in the solution, the reducing agent concentration refers to the content of reducing agent in the solution, the complexing agent concentration refers to the content of complexing agent in the solution, and the pH value is an indicator measuring the acidity or alkalinity of the solution.

[0080] This invention establishes orthogonal parameters for the key variables to construct the index curves of the nickel plating solution. It systematically establishes orthogonal parameters and index curves for the key variables of the nickel plating solution, laying a data foundation for intelligent optimization. The orthogonal parameters refer to the value range of each key variable, and the index curves are curves drawn from experimental data that reflect the relationship between the key variables and the performance indicators of the plating layer.

[0081] Specifically, the construction of the index curve for the nickel plating solution includes:

[0082] Determine the orthogonal test data corresponding to the orthogonal parameters of the nickel plating solution;

[0083] Define the performance indicators of the nickel plating solution;

[0084] Based on the orthogonal test data, analyze the sequence values ​​of the performance index;

[0085] Define the sequence nodes of the nickel plating solution;

[0086] Based on the sequence nodes and the sequence values, an index curve for the nickel plating solution is constructed.

[0087] The orthogonal test data refers to the data obtained after conducting experiments through orthogonal experimental design. This data includes the specific values ​​of key variables (such as nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value) in each experimental group, as well as the measurement results of corresponding coating performance indicators (such as coating thickness, hardness, adhesion, and corrosion resistance). These performance indicators are quantitative parameters used to evaluate the performance of the nickel plating solution. In the optimization of the composition of electroless nickel plating solutions, performance indicators typically include, but are not limited to, coating thickness, coating hardness, and adhesion. The sequence values ​​refer to the specific numerical values ​​corresponding to each performance indicator in the orthogonal test data. For example, the values ​​of coating thickness, hardness, and adhesion measured in each experimental group. The sequence nodes refer to the specific value points of each key variable in the orthogonal test data. The indicator curves are curves drawn using the orthogonal test data that reflect the relationship between key variables and coating performance indicators.

[0088] Optionally, the construction of the index curve of the nickel plating solution based on the sequence nodes and the sequence values ​​can be achieved using curve fitting techniques.

[0089] S2. Analyze the target ratio combination of the key variables through the index curve to establish the initial nickel plating solution. Use the initial nickel plating solution to plate a preset ceramic substrate and record the current pH value of the initial nickel plating solution during the plating process.

[0090] This invention uses the index curve to analyze the target ratio combination of the key variables to determine the target ratio of the key variables, taking into account both efficiency and reliability.

[0091] In detail, the analysis of the target ratio combination of the key variables through the indicator curve includes:

[0092] Construct the interaction response surface of the index curve;

[0093] Mark the extreme points of the interaction response surface;

[0094] Define the performance index weights corresponding to the performance indexes of the aforementioned index curves;

[0095] Based on the extreme points and the performance index weights, analyze the multi-objective compromise solution of the performance index;

[0096] The target ratio combination of the key variables is determined through the multi-objective compromise solution.

[0097] The interaction response surface refers to the surface relating performance indicators (such as coating thickness, hardness, adhesion, corrosion resistance, etc.) to two or more key variables (such as nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value) in orthogonal experiments or response surface methodology experiments. The extreme point refers to the point on the interaction response surface where the performance indicator reaches its maximum or minimum value. The performance indicator weight refers to the importance of different performance indicators to the final product performance. The multi-objective compromise solution refers to the solution that satisfies all performance indicator requirements by weighing and compromising multiple performance indicators in a multi-objective optimization problem. The objective ratio combination refers to the optimal combination of key variables determined based on the multi-objective compromise solution.

[0098] Optionally, the analysis of the multi-objective compromise solution of the performance index based on the extreme point and the performance index weight can be calculated by defining the ideal solution and inferior solution of the performance index using the TOPSIS method formula.

[0099] It should be explained that the initial nickel plating solution mentioned in "establishing the initial nickel plating solution" refers to the component combination of the nickel plating solution constructed according to the target ratio combination of key variables.

[0100] This invention utilizes an initial nickel plating solution to plate a preset ceramic substrate. By recording the current pH value during the initial nickel plating process, pH data of the plating process can be obtained to determine the pH stability of the initial nickel plating solution during the plating process. The current pH value refers to the real-time pH value during the initial nickel plating process.

[0101] S3. Using the current pH value, analyze the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm, and mark the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameters to determine the failure point of the initial nickel plating solution.

[0102] This invention uses the current pH value and a preset automatic titration algorithm to analyze the pH adjustment parameters of the initial nickel plating solution. It can intelligently deduce the type of regulator and addition parameters required to maintain or adjust the pH, thereby achieving self-regulation of the pH value of the initial nickel plating solution.

[0103] Specifically, the step of analyzing the pH adjustment parameters of the initial nickel plating solution using a preset automatic titration algorithm based on the current pH value includes:

[0104] Based on the pH value corresponding to the initial nickel plating solution and the current pH value, calculate the pH error value of the initial nickel plating solution during the plating process;

[0105] Analyze the positive and negative values ​​of the pH error to determine the pH adjuster for the initial nickel plating solution;

[0106] Based on the pH error value, the titration flow rate of the pH adjuster is calculated using the automatic titration algorithm;

[0107] The pH adjustment parameters of the initial nickel plating solution are determined by using the pH adjuster and the titration flow rate.

[0108] The pH error value refers to a quantitative indicator that measures the degree to which the current pH value of the nickel plating solution deviates from the target (ideal) pH value. The pH adjuster refers to a chemical substance used to change the pH value of the nickel plating solution. The titration flow rate refers to the rate at which the pH adjuster is added to the nickel plating solution. The pH adjustment parameters refer to a series of specific settings or instructions required to adjust the initial pH value of the nickel plating solution to the target value (or maintain stability), including the titration flow rate and the pH adjuster.

[0109] Further, the step of calculating the titration flow rate of the pH adjuster using the automatic titration algorithm based on the pH error value includes:

[0110] Determine the gain parameters of the automatic titration algorithm, wherein the gain parameters include proportional gain, integral gain, and derivative gain;

[0111] Based on the gain parameter and the pH error value, the titration flow rate of the pH adjuster is calculated using the automatic titration algorithm, wherein the automatic titration algorithm is:

[0112]

[0113] Where u(t) represents the titration flow rate of the pH adjuster at time t, and R p Represents the proportional gain, e(t) represents the pH error value at time t, and R i R represents the integral gain. d Represents differential gain. This represents the accumulated error value. Let dt represent the error transformation rate, dt represent the time differential component, and d represent the differential operator.

[0114] Wherein, the proportional gain refers to the response strength of the controller output to the current error, the integral gain refers to the response strength of the controller output to the cumulative amount of error over time, the derivative gain refers to the response strength of the controller output to the rate of change of error, the automatic titration algorithm calculates a control signal based on the gain parameter and the pH error value, that is, the algorithm for the titration flow rate of the pH adjuster, the error accumulation value represents the cumulative sum of the pH error value over time t from the start of the control process to the current time t, and the error transformation rate refers to the rate at which the pH error value changes over time.

[0115] The present invention uses the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameter to determine whether the initial nickel plating solution has failed, thereby improving the plating effect.

[0116] Specifically, the label represents the overall lifetime score of the initial nickel plating solution under the pH adjustment parameters, including:

[0117] Obtain the plating rate data and solution transmittance data of the initial nickel plating solution under the pH adjustment parameters;

[0118] Based on the plating rate data, calculate the plating rate decay rate of the initial nickel plating solution;

[0119] Based on the solution transmittance data, the transmittance of the initial nickel plating solution was analyzed;

[0120] The conversion turbidity of the initial nickel plating solution is determined by the transmittance.

[0121] Based on the plating rate decay rate and the conversion turbidity, the overall lifetime score of the initial nickel plating solution under the pH adjustment parameter is analyzed.

[0122] The plating rate data refers to the thickness of the nickel layer deposited on the substrate per unit time when plating with the initial nickel plating solution controlled by the pH adjustment parameter; the solution transmittance data refers to the percentage of light of a specific wavelength (usually the visible light range, such as 436nm, 546nm, 577nm, etc.) allowed to pass through the nickel plating solution; the plating rate decay rate refers to the rate at which the plating rate decreases over time; the transmittance refers to the degree to which the solution allows light to pass through; the conversion turbidity refers to the degree of turbidity of the solution; and the comprehensive lifetime score refers to the length of time that the nickel plating solution can maintain its process performance (such as plating quality, plating rate, stability, etc.) to an acceptable standard.

[0123] Optionally, the process of obtaining the plating rate data and solution transmittance data of the initial nickel plating solution under the pH adjustment parameter can be described as follows: the plating rate data can be obtained by periodically interrupting the electroplating process and measuring the thickness of the nickel layer deposited at different time points (e.g., using a thickness gauge) or calculating the mass of the deposited nickel (e.g., by calculating the amount of electroplating charge or by weighing after stripping); and the solution transmittance data can be analyzed by measuring the absorbance of the solution at a specific wavelength using a spectrophotometer.

[0124] Furthermore, the analysis of the overall lifetime score of the initial nickel plating solution under the pH adjustment parameter, combining the plating rate decay rate and the conversion turbidity, includes:

[0125] Define the attenuation rate weight and the conversion turbidity weight of the plating rate attenuation rate and the conversion turbidity;

[0126] Mark the failed turbidity and ideal turbidity of the converted turbidity;

[0127] Based on the plating rate decay rate, the conversion turbidity, the decay rate weight, the conversion turbidity weight, the failure turbidity, and the ideal turbidity, the overall lifetime score of the initial nickel plating solution is calculated using the following formula:

[0128]

[0129] Where S represents the overall lifetime score of the initial nickel plating solution, V represents the plating rate decay rate, ω1 represents the decay rate weight, and D represents the conversion turbidity. min D represents ideal turbidity. max ω1 represents the failure turbidity, and ω2 represents the conversion turbidity weight.

[0130] The attenuation rate weight refers to the relative importance of the plating rate attenuation rate in determining the overall lifespan score; the conversion turbidity weight refers to the relative importance of conversion turbidity in determining the overall lifespan score; the failure turbidity is the maximum permissible turbidity value at which the nickel plating solution is considered to have failed or can no longer be used when the turbidity reaches an unacceptable level; and the ideal turbidity refers to the turbidity value of the nickel plating solution in its optimal working state or initial state.

[0131] Figure 2 This is a schematic diagram illustrating the failure point analysis of a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates according to an embodiment of the present invention. The present invention determines that the failure point of the initial nickel plating solution refers to the critical state where the solution fails to meet process requirements due to performance degradation and needs to be replaced or regenerated. Specifically, the failure point is defined as when the overall lifetime score of the initial nickel plating solution is less than a preset effective solution lifetime.

[0132] S4. Based on the failure node and the pH adjustment parameter, the initial nickel plating solution is applied to the ceramic substrate to obtain a nickel-plated ceramic substrate. The critical load for the nickel-plated ceramic substrate to peel off the coating is identified to determine the adhesion of the nickel-plated ceramic substrate. The conductivity and corrosion resistance of the nickel-plated ceramic substrate are analyzed.

[0133] It should be explained that the nickel-plated ceramic substrate refers to a composite material on which a layer of nickel metal is deposited on the surface of a substrate made of ceramic material through processes such as electroplating.

[0134] The present invention identifies the critical load at which the nickel-plated ceramic substrate peels off, which can be used as a basis for subsequent analysis of the adhesion of the nickel-plated ceramic substrate.

[0135] Specifically, identifying the critical load at which the nickel-plated ceramic substrate peels off the plating includes:

[0136] Construct the plating peel load conditions for the nickel-plated ceramic substrate;

[0137] Construct the load-displacement curve under the coating peeling load condition;

[0138] Mark the abrupt change points of the load-displacement curve;

[0139] The load at the point of abrupt change is recorded as the critical load for the nickel-plated ceramic substrate to peel off the coating.

[0140] The coating peeling load condition refers to the specific loading method and parameters set to induce or test the peeling of the nickel plating layer from the ceramic substrate. The load-displacement curve refers to a graph that records the relationship between the load acting on the sample and the overall displacement of the sample in real time during the application of the coating peeling load condition. The abrupt change point refers to the point on the load-displacement curve where the load value or the slope of the curve changes significantly and suddenly. The critical load refers to the load value on the load-displacement curve corresponding to the abrupt change point.

[0141] Optionally, the load-displacement curve under the plating peeling load condition is automatically recorded using equipment such as a universal testing machine. The horizontal axis typically represents displacement (usually the elongation, compression, or distance the loading point moves on the nickel-plated ceramic substrate), and the vertical axis represents the corresponding load value.

[0142] It should be explained that the bonding force refers to the strength of the interfacial bond between the nickel plating layer and the ceramic substrate. Specifically, the bonding force can be calculated by dividing the critical load by the effective contact interface between the nickel plating layer and the ceramic substrate.

[0143] The analysis of the conductivity and corrosion resistance of the nickel-plated ceramic substrate in this invention can provide a basis for further analysis of the performance of the nickel-plated ceramic substrate without subsequent formula optimization.

[0144] In detail, the analysis of the conductivity and corrosion resistance of the nickel-plated ceramic substrate includes:

[0145] A four-probe tester is configured for the nickel-plated ceramic substrate;

[0146] The four probes of the four probes are pressed vertically and gently against the surface of the nickel-plated ceramic substrate to analyze the contact uniformity coefficient between the four probes and the nickel-plated ceramic substrate.

[0147] Based on the contact uniformity coefficient, a constant current is applied to the nickel-plated ceramic substrate using the four-probe tester, and the voltage of the nickel-plated ceramic substrate is recorded.

[0148] The conductivity of the nickel-plated ceramic substrate is calculated based on the constant current and the voltage.

[0149] Identify the surface condition of the plating layer on the nickel-plated ceramic substrate;

[0150] The nickel-plated ceramic substrate is placed in a pre-set salt spray chamber to record the percentage of rusted area on the nickel-plated ceramic substrate.

[0151] The corrosion resistance of the nickel-plated ceramic substrate is determined based on the percentage of rusted area.

[0152] The four-probe tester is an instrument used to measure the resistivity of conductive thin films, thin layers, or semiconductor materials. The contact uniformity coefficient is an index describing the contact condition between the four probes and the surface of the nickel-plated ceramic substrate. The constant current is a current value that is stably output by the four-probe tester and remains constant in magnitude. The voltage is the potential difference between two points on the sample surface measured by the two probes (voltage probes) inside the four-probe tester after a constant current is applied. The conductivity is the material's ability to conduct current. The coating surface condition refers to the macroscopic and microscopic appearance characteristics of the nickel-plated layer surface. The salt spray chamber is used to simulate a corrosive atmospheric environment containing salt (usually sodium chloride). The rust area ratio is the percentage of the sample surface area with rust (or corrosion) after the salt spray test, relative to the total sample surface area. The corrosion resistance is the material's ability to resist corrosion.

[0153] Optionally, the identification of the coating surface state of the nickel-plated ceramic substrate can be obtained by taking pictures with a 200× microscope.

[0154] Optionally, the conductivity of the nickel-plated ceramic substrate can be calculated based on the constant current and the voltage by calculating the resistance of the nickel-plated ceramic substrate using the constant current and the voltage. The lower the calculated resistance, the better the conductivity.

[0155] Further, determining the corrosion resistance of the nickel-plated ceramic substrate based on the percentage of rusted area includes:

[0156] Determine the corrosion resistance level based on the percentage of rusted area;

[0157] Identify the etched areas on the nickel-plated ceramic substrate;

[0158] Define the corrosion weight of the corrosion region;

[0159] The corrosion coefficient of the nickel-plated ceramic substrate is calculated based on the corrosion weight and the rust area ratio.

[0160] The corrosion resistance of the nickel-plated ceramic substrate is determined based on the corrosion coefficient.

[0161] The corrosion resistance grade refers to the grade classified according to the proportion of rusted area and a predetermined standard or specification. The corrosion area refers to the specific location and range of actual rust (or corrosion) on the surface of the nickel-plated ceramic substrate after salt spray testing. The corrosion weight refers to the importance of different corrosion areas. The corrosion coefficient is a coefficient that combines the proportion of corrosion area (rusted area proportion) and the location importance of these corrosion areas (corrosion weight) to more comprehensively quantify the corrosion resistance performance of the coating.

[0162] S5. Based on the bonding force, conductivity, and corrosion resistance, the composition optimization parameters of the initial nickel plating solution are output using the trained nickel plating solution composition optimization model, and the composition optimization of the nickel plating solution is performed based on the composition optimization parameters.

[0163] This invention, based on the aforementioned bonding strength, conductivity, and corrosion resistance, utilizes a trained nickel plating solution composition optimization model to output optimized composition parameters for the initial nickel plating solution. This systematically leverages the trained model, based on performance indicators such as bonding strength, conductivity, and corrosion resistance, to output optimized composition parameters for the initial nickel plating solution, thereby guiding solution preparation and process optimization in actual production. The optimized composition parameters refer to the optimized values ​​for nickel salt concentration, reducing agent concentration, complexing agent concentration, and pH value. The nickel plating solution composition optimization model is a model that optimizes the composition of the initial nickel plating solution through the aforementioned bonding strength, conductivity, and corrosion resistance. Specifically, the nickel plating solution composition optimization model can be trained using a neural network based on the input features (composition, parameters) and output labels (performance indicators) of the nickel plating solution.

[0164] First, by systematically defining the basic formulation and determining key variables such as the concentrations of nickel salts, reducing agents, complexing agents, and pH values, and then using orthogonal experimental design to construct index curves, the influence of various factors on coating performance can be explored efficiently and scientifically. This method avoids the blindness and inefficiency of traditional trial-and-error methods, greatly shortens the experimental cycle, and ensures the comprehensiveness and representativeness of experimental data, laying a solid foundation for subsequent optimization. Second, this method introduces online pH monitoring and automatic titration algorithms, achieving precise control over the dynamic changes in the pH value of the plating solution. This not only ensures the stability of the chemical environment of the plating solution during the plating process, thereby improving the uniformity and consistency of the coating quality, but also accurately predicts the failure point of the plating solution by analyzing the relationship between pH adjustment parameters and comprehensive lifetime score. This makes the production process more controllable and effectively avoids... This method eliminates plating defects caused by plating solution aging, improving production efficiency and product yield. More importantly, it combines plating performance evaluation (adhesion, conductivity, corrosion resistance) with advanced machine learning optimization models. Through precise measurement of the actual performance of nickel-plated ceramic substrates, it not only obtains performance data reflecting real application requirements but also uses the trained model to deduce composition optimization parameters that can further improve performance. This data-driven optimization approach comprehensively considers multiple performance indicators, finding the optimal balance between performance and cost, avoiding potential performance sacrifices caused by optimizing a single indicator. Ultimately, by implementing composition optimization, the overall quality of nickel-plated ceramic substrates can be significantly improved, enhancing their reliability and competitiveness in applications such as electronics and power, enabling continuous process improvement and product upgrades. Therefore, this invention can improve the optimization effect of nickel plating solution composition.

Claims

1. A method for optimizing the composition of a solution for electroless nickel plating on ceramic substrates, characterized in that, The method comprises: defining a basic formula of a nickel plating solution, determining key variables of the basic formula, wherein the key variables comprise a nickel salt concentration, a reducing agent concentration, a complexing agent concentration, and a pH value, establishing orthogonal parameters of the key variables to construct an index curve of the nickel plating solution; analyzing a target ratio combination of the key variables through the index curve to establish an initial nickel plating solution of the nickel plating solution, using the initial nickel plating solution to perform plating on a preset ceramic substrate, and recording a current PH value of the initial nickel plating solution in the plating process; using a preset automatic titration algorithm to analyze a PH value adjustment parameter of the initial nickel plating solution through the current PH value, marking a comprehensive life score of the initial nickel plating solution under the PH value adjustment parameter, and determining a failure node of the initial nickel plating solution; based on the failure node and the PH value adjustment parameter, achieving plating of the initial nickel plating solution on the ceramic substrate to obtain a nickel-plated ceramic substrate, identifying a critical load of the nickel-plated ceramic substrate in layer peeling to determine a bonding force of the nickel-plated ceramic substrate, and analyzing conductivity and corrosion resistance of the nickel-plated ceramic substrate; based on the bonding force, the conductivity, and the corrosion resistance, using a trained nickel plating solution component optimization model to output a component optimization parameter of the initial nickel plating solution, and performing component optimization of the nickel plating solution based on the component optimization parameter.

2. The method for optimizing the solution composition of electroless nickel plating on ceramic substrates according to claim 1, wherein, The method comprises: determining orthogonal test data of the corresponding orthogonal parameters of the nickel plating solution; defining a performance index of the nickel plating solution; analyzing sequence values of the performance index according to the orthogonal test data; defining sequence nodes of the nickel plating solution; constructing an index curve of the nickel plating solution according to the sequence nodes and the sequence values.

3. The method for optimizing the solution composition of electroless nickel plating on ceramic substrates according to claim 2, wherein, The method comprises: constructing an interaction response surface of the index curve; marking extreme points of the interaction response surface; defining performance index weights of the corresponding performance index of the index curve; analyzing multi-objective compromise solutions of the performance index according to the extreme points and the performance index weights; determining the target ratio combination of the key variables through the multi-objective compromise solutions.

4. The method for optimizing the solution composition of electroless nickel plating on ceramic substrates according to claim 3, wherein, The method comprises: based on the corresponding pH value of the initial nickel plating solution and the current PH value, calculating a PH error value of the initial nickel plating solution in the plating process; analyzing positive and negative values of the PH error value to determine a PH value adjustment agent of the initial nickel plating solution; using the automatic titration algorithm to calculate a titration flow rate of the PH value adjustment agent according to the PH error value; determining a PH value adjustment parameter of the initial nickel plating solution through the PH value adjustment agent and the titration flow rate.

5. The method for optimizing the composition of a ceramic substrate electroless nickel plating solution according to claim 4, wherein The method comprises: determining a gain parameter of the automatic titration algorithm, wherein the gain parameter comprises a proportional gain, an integral gain, and a differential gain; calculating a titration flow rate of the PH value adjusting agent based on the gain parameter and the PH error value by using the automatic titration algorithm, wherein the automatic titration algorithm: wherein u(t) represents the titration flow rate of the PH adjuster at t, R p represents the proportional gain, e(t) represents the PH error value at t, R i represents the integral gain, R d represents the differential gain, represents the error accumulation value, represents the error change rate, dt represents the time differential, and d represents the differential operator.

6. The method for optimizing the solution composition of electroless nickel on ceramic substrate according to claim 5, wherein, marking a comprehensive life score of the initial nickel plating solution under the PH value adjusting parameter, comprising: acquiring plating speed data and solution transmittance data of the initial nickel plating solution under the PH value adjusting parameter; calculating a plating speed attenuation rate of the initial nickel plating solution according to the plating speed data; analyzing the transmittance of the initial nickel plating solution based on the solution transmittance data; determining a conversion turbidity of the initial nickel plating solution through the transmittance; analyzing a comprehensive life score of the initial nickel plating solution under the PH value adjusting parameter in combination with the plating speed attenuation rate and the conversion turbidity.

7. The method for optimizing the solution composition of electroless nickel on ceramic substrate according to claim 6, wherein, The analyzing a comprehensive life score of the initial nickel plating solution under the PH value adjusting parameter in combination with the plating speed attenuation rate and the conversion turbidity, comprising: defining an attenuation rate weight and a conversion turbidity weight of the plating speed attenuation rate and the conversion turbidity; marking a failure turbidity and an ideal turbidity of the conversion turbidity; calculating a comprehensive life score of the initial nickel plating solution based on the plating speed attenuation rate, the conversion turbidity, the attenuation rate weight, the conversion turbidity weight, the failure turbidity, and the ideal turbidity by using the following formula: wherein S represents a comprehensive life score of an initial nickel plating solution, V represents a plating speed attenuation rate, ω1 represents an attenuation rate weight, D represents a converted turbidity, D min represents an ideal turbidity, D max represents a failure turbidity, and ω2 represents a converted turbidity weight.

8. The method for optimizing the solution composition of electroless nickel plating on ceramic substrates according to claim 7, wherein, The identifying a critical load of the nickel plated ceramic substrate at which the plating layer peels off, comprising: constructing a plating layer peeling load condition of the nickel plated ceramic substrate; constructing a load-displacement curve under the plating layer peeling load condition; marking a mutation point of the load-displacement curve; recording a load of the mutation point as a critical load of the nickel plated ceramic substrate at which the plating layer peels off.

9. The method for optimizing the composition of a ceramic substrate electroless nickel plating solution according to claim 8, wherein, The analyzing the electrical conductivity and corrosion resistance of the nickel plated ceramic substrate, comprising: configuring a four-probe tester of the nickel plated ceramic substrate; vertically and lightly pressing a surface of the nickel plated ceramic substrate by using four probes of the four-probe tester to analyze a contact uniformity coefficient of the four probes and the nickel plated ceramic substrate; applying a constant current to the nickel plated ceramic substrate by using the four-probe tester according to the contact uniformity coefficient and recording a voltage of the nickel plated ceramic substrate; calculating the electrical conductivity of the nickel plated ceramic substrate based on the constant current and the voltage; identifying a plating layer surface state of the nickel plated ceramic substrate; placing the nickel plated ceramic substrate in a preset salt spray chamber to record a rust area proportion of the nickel plated ceramic substrate; determining the corrosion resistance of the nickel plated ceramic substrate based on the rust area proportion.

10. The method for optimizing the composition of a ceramic substrate electroless nickel plating solution according to claim 9, wherein, The determining the corrosion resistance of the nickel plated ceramic substrate based on the rust area proportion, comprising: determining a corrosion resistance level of the rust area proportion; identifying a corrosion area of the nickel plated ceramic substrate; defining a corrosion weight of the corrosion area; calculating a corrosion coefficient of the nickel plated ceramic substrate based on the corrosion weight and the rust area proportion; determining the corrosion resistance of the nickel plated ceramic substrate based on the corrosion coefficient.

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