Micro LED display panel applied to naked eye 3D and manufacturing method thereof

Abstract

The application relates to a Micro LED display panel applied to naked-eye 3D and a manufacturing method thereof, and relates to the technical field of semiconductor display. In the manufacturing method of the Micro LED display panel applied to naked-eye 3D, a packaging process is performed on Micro LED chips in advance to form a plurality of Micro LED chip packaging modules, so that each Micro LED chip packaging module comprises a plurality of array-arranged Micro LED chips, and then when a magnetic structure is prepared, only a magnetic structure needs to be prepared on a ring of Micro LED chips at the outermost periphery of the Micro LED chip packaging module, and a corresponding magnetic structure is arranged on a transfer substrate, so that accurate adsorption of the first magnetic structure and the corresponding second magnetic structure can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor light-emitting technology, in particular to a Micro LED display panel applied to naked-eye 3D and a manufacturing method thereof. BACKGROUND

[0002] The naked-eye 3D display technology is a display technology that can obtain a realistic stereoscopic image with space and depth without wearing any auxiliary equipment. This technology utilizes the parallax characteristics of the two eyes of a person, and through specific optical technology and algorithms, different images are seen by the two eyes, thereby synthesizing a stereoscopic visual effect in the brain. The Micro LED display panel is a display technology based on an array of micron-level semiconductor light-emitting units, and the size of a single light-emitting unit is usually below 50 microns, and it can be highly integrated on a chip. This technology combines the advantages of new display technology and light-emitting diode (LED) technology, and has the characteristics of self-emission, high efficiency, low power consumption, high integration, high stability, and all-weather operation. The display screen based on the Micro LED display technology can be well applied to naked-eye 3D, and then the Micro LED display technology can be combined with the lenticular lens technology to divide the image into multiple sub-pixels and project them into the eyes of the audience in different directions. Since the sub-pixels viewed by the two eyes from different angles are slightly different, a stereoscopic effect can be produced. Therefore, how to improve the preparation process of the Micro-LED chip has become a hot topic widely discussed and deeply researched in the industry, aiming to further promote the popularization and application of Micro-LED technology in the field of naked-eye 3D through technological breakthroughs. SUMMARY

[0003] The purpose of the present application is to overcome the shortcomings of the prior art, and to provide a Micro LED display panel applied to naked-eye 3D and a manufacturing method thereof.

[0004] To achieve the above-mentioned purpose, the present application provides a manufacturing method of a Micro LED display panel applied to naked-eye 3D, which comprises the following steps:

[0005] A semiconductor light-emitting wafer is provided, and the light-emitting wafer is subjected to dicing treatment to form a plurality of Micro LED chips, each of which comprises a substrate and a functional layer on the substrate.

[0006] Then, the plurality of Micro LED chips are subjected to wafer expansion treatment.

[0007] A carrier substrate is provided, and the plurality of Micro LED chips after wafer expansion are arranged on the carrier substrate.

[0008] Then, a packaging layer is formed on the carrier substrate, the packaging layer wraps each Micro LED chip, and then the packaging layer is planarized to expose the substrate of each Micro LED chip.

[0009] Then, the packaging layer is cut to form a plurality of Micro LED chip packaging modules, each of which includes an MxM array of Micro LED chips, where M≥10, and each of which includes a peripheral region and a central region.

[0010] Then, the substrate of each Micro LED chip in the peripheral region of the Micro LED chip packaging module is etched to form a groove in the substrate of each Micro LED chip in the peripheral region.

[0011] Then, a first magnetic structure is formed in each of the grooves.

[0012] A transfer substrate is provided, which has a plurality of second magnetic structures and a plurality of positioning columns, and the Micro LED chip packaging module is transferred to the transfer substrate so that each first magnetic structure is magnetically attracted to a corresponding second magnetic structure.

[0013] A driving substrate is provided, which has a plurality of conductive pads and a plurality of positioning cavities, and a plurality of positioning columns and a plurality of positioning cavities are one-to-one corresponding, and then the Micro LED chip packaging module on the transfer substrate is transferred to the driving substrate, so that each Micro LED chip is fixedly electrically connected to the corresponding conductive pad.

[0014] Then, the Micro LED chip packaging module on the driving substrate is etched to remove the first magnetic structure in each groove.

[0015] As a preferred technical solution, the substrate is a sapphire substrate or a gallium nitride substrate, and the functional layer includes a first semiconductor layer, a light-emitting quantum well layer, a second semiconductor layer, a first electrode, and a second electrode.

[0016] As a preferred technical solution, the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer.

[0017] As a preferred technical solution, before the plurality of Micro LED chips after crystal expansion are arranged on the bearing substrate, a temporary protective layer is arranged on the bearing substrate, and the first electrode and the second electrode of each Micro LED chip are embedded into the temporary protective layer.

[0018] As a preferred technical solution, the peripheral region is a ring-shaped region, the ring-shaped region includes a ring of Micro LED chips, and the intermediate region includes (M-2) x (M-2) array-arranged Micro LED chips, wherein M is greater than or equal to 10.

[0019] As a preferred technical solution, the first magnetic structure includes a resin material containing a magnetic filler, the magnetic filler is ferroferric oxide powder, iron-cobalt powder, or iron-nickel powder, and the first magnetic structure is formed by a dispensing process, a slot coating process, or a spraying process.

[0020] As a preferred technical solution, the plurality of positioning columns surround the plurality of second magnetic structures.

[0021] As a preferred technical solution, after the first magnetic structure in each groove is removed, an organic protective layer is formed on the driving substrate.

[0022] The application further provides a Micro LED display panel applied to naked-eye 3D, which is manufactured by the manufacturing method.

[0023] The application has the following beneficial effects:

[0024] In the existing Micro LED chip transfer process, when using a magnetic component for adsorption transfer, a magnetic block needs to be arranged on the back of each Micro LED chip, which makes the Micro LED chip transfer process more complex, thereby easily leading to a decrease in the Micro LED chip transfer yield and greatly increasing the production manufacturing cost. In the manufacturing method of the Micro LED display panel applied to naked eye 3D of the application, the Micro LED chips are pre-packaged to form a plurality of Micro LED chip packaging modules, so that each Micro LED chip packaging module includes a plurality of arrayed Micro LED chips, and then when the magnetic structure is prepared, only the outermost circle of Micro LED chips of the Micro LED chip packaging module needs to be prepared with a magnetic structure, and the corresponding magnetic structure is arranged on the transfer substrate, so as to realize accurate adsorption of the first magnetic structure and the corresponding second magnetic structure. The positioning column is arranged on one hand to assist the accurate arrangement of the Micro LED chip packaging module on the corresponding position of the transfer substrate, and on the other hand, the positioning cavity cooperating with the positioning column is arranged, so as to facilitate the accurate transfer of the Micro LED chip packaging module to the driving substrate. The manufacturing method of the Micro LED display panel is optimized, which greatly improves the transfer accuracy and the yield, greatly reduces the process complexity, and thereby reduces the production manufacturing cost. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The structure diagram showing that the light-emitting wafer is subjected to dicing treatment to form a plurality of Micro LED chips in the embodiment of the application.

[0026] Figure 2 The structure diagram showing that the Micro LED chips are arranged on the carrier substrate and the encapsulation layer is formed in the embodiment of the application.

[0027] Figure 3 The structure diagram showing that a plurality of Micro LED chip packaging modules are formed in the embodiment of the application.

[0028] Figure 4 The structure diagram showing that the grooves and the first magnetic structure are formed in the embodiment of the application.

[0029] Figure 5 The structure diagram showing that the Micro LED chip packaging module is transferred to the transfer substrate in the embodiment of the application.

[0030] Figure 6 The structure diagram showing that the Micro LED chip packaging module on the transfer substrate is transferred to the driving substrate in the embodiment of the application.

[0031] Figure 7 Structure diagram of forming encapsulation layer in the embodiment of the application DETAILED DESCRIPTION

[0032] For the purpose of facilitating the understanding of the present application, a more complete description of the present application will be provided below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0033] As Figures 1-7 shown, the present embodiment provides a manufacturing method of a Micro LED display panel applied to naked-eye 3D, which comprises the following steps:

[0034] As Figure 1 shown, a semiconductor light-emitting wafer is provided, and the light-emitting wafer is subjected to dicing processing to form a plurality of Micro LED chips 100, each of which comprises a substrate 101 and a functional layer 102 on the substrate.

[0035] In a specific embodiment, the substrate 101 is a sapphire substrate or a gallium nitride substrate, and the functional layer 102 comprises a first semiconductor layer, a light-emitting quantum well layer, a second semiconductor layer, a first electrode, and a second electrode (not shown), wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer.

[0036] In a specific embodiment, the first semiconductor layer, the light-emitting quantum well layer, and the second semiconductor layer are prepared by an organic metal chemical vapor deposition method, wherein the first semiconductor layer and the second semiconductor layer are respectively an n-type gallium nitride layer and a p-type gallium nitride layer, and the light-emitting quantum well layer is an InGaN quantum well layer and a GaN quantum barrier layer alternately grown.

[0037] In a specific embodiment, the first electrode and the second electrode are metal electrodes, and the metal electrodes are made of copper, aluminum, silver, titanium, gold, palladium, or any suitable single metal layer or alloy metal layer, and are formed by a thermal evaporation, a magnetron sputtering, an electroplating, or a chemical plating process.

[0038] Then, the plurality of Micro LED chips are subjected to wafer expansion processing to increase the spacing between adjacent Micro LED chips, thereby facilitating the subsequent transfer process.

[0039] As Figure 2As shown, a carrier substrate 200 is provided, on which a plurality of expanded Micro LED chips 100 are disposed.

[0040] In a specific embodiment, an encapsulation layer 300 is then formed on the carrier substrate 200, the encapsulation layer 300 encapsulating each Micro LED chip 100, and then the encapsulation layer is planarized to expose the substrate 101 of each Micro LED chip 100.

[0041] In a specific embodiment, before the multiple Micro LED chips 100 after crystal expansion are placed on the carrier substrate 200, a temporary protective layer 201 is provided on the carrier substrate 200, and the first electrode and the second electrode of each Micro LED chip 100 are embedded in the temporary protective layer 201.

[0042] In a specific embodiment, the carrier substrate 200 can be any suitable rigid substrate such as glass, ceramic, or metal, and the temporary protective layer 201 can be an adhesive layer that loses its adhesiveness under light or heat, thereby facilitating the peeling off of the MicroLED chip 100.

[0043] In a specific embodiment, the encapsulation layer 300 is any suitable polymer material such as epoxy resin, and is formed by any process such as slot coating, molding, hot pressing, etc.

[0044] like Figure 3 As shown, the encapsulation layer 300 is then cut to form multiple Micro LED chip encapsulation modules 400. Each Micro LED chip encapsulation module 400 includes Micro LED chips arranged in an M×M array, where M≥10. Each Micro LED chip encapsulation module 400 includes a peripheral region and a central region. Figure 3 The illustration only shows a portion of the Micro LED chips, and the actual number of Micro LED chips in each Micro LED chip packaging module 400 is subject to the textual description of the specific embodiment.

[0045] In a specific embodiment, multiple Micro LED chip packaging modules 400 are formed by laser cutting process.

[0046] In a specific embodiment, the carrier substrate 200 is removed, and then the encapsulation layer 300 is cut.

[0047] In specific embodiments, each of the Micro LED chip packaging modules 400 comprises an M x M array of Micro LED chips 100, where M≥10 and M≤30, and the number of Micro LED chips 100 in each of the Micro LED chip packaging modules 400 can be adjusted to balance the complexity of manufacturing the Micro LED chip packaging modules 400 and the transfer efficiency.

[0048] In specific embodiments, the peripheral region is an annular region comprising one ring of Micro LED chips, and the intermediate region comprises an (M-2) x (M-2) array of Micro LED chips, where M≥10. In more preferred embodiments, the intermediate region comprises an (M-2) x (M-2) array of Micro LED chips, where M≥10 and M≤30.

[0049] In other embodiments, the annular region can comprise two rings of Micro LED chips, which are the outermost rings of the Micro LED chip packaging module 400.

[0050] As shown in FIG. 4A, the Micro LED chip packaging module 400 comprises a peripheral region and an intermediate region. The peripheral region comprises one ring of Micro LED chips 100, and the intermediate region comprises an (M-2) x (M-2) array of Micro LED chips 100, where M≥10. Figure 4 As shown in FIG. 4A, the Micro LED chip packaging module 400 comprises a peripheral region and an intermediate region. The peripheral region comprises one ring of Micro LED chips 100, and the intermediate region comprises an (M-2) x (M-2) array of Micro LED chips 100, where M≥10. Figure 4 As shown in FIG. 4A, the Micro LED chip packaging module 400 comprises a peripheral region and an intermediate region. The peripheral region comprises one ring of Micro LED chips 100, and the intermediate region comprises an (M-2) x (M-2) array of Micro LED chips 100, where M≥10.

[0051] In specific embodiments, the recesses 1011 are formed by a wet etching process or a dry etching process.

[0052] In specific embodiments, the first magnetic structure 500 comprises a resin material containing magnetic fillers, the magnetic fillers are ferriferrous oxide powder, iron-cobalt powder, or iron-nickel powder, the resin material is any suitable resin material such as polyethylene, polypropylene, EVA, PVB, etc., and the first magnetic structure 500 is formed by a dispensing process, a slot coating process, or a spraying process.

[0053] In specific embodiments, the content of the magnetic fillers in the first magnetic structure 500 is 1-5 wt%.

[0054] As shown in FIG. 4B, the first magnetic structure 500 is formed in each of the recesses 1011 of the Micro LED chips 100 in the peripheral region of the Micro LED chip packaging module 400. Figure 5As shown, a transfer substrate 600 is provided, which has a plurality of second magnetic structures 601 and a plurality of positioning posts 602. The Micro LED chip packaging module 500 is transferred to the transfer substrate 600, such that each first magnetic structure 500 is magnetically attracted to a corresponding second magnetic structure 602.

[0055] In a specific embodiment, a plurality of positioning posts 602 surround a plurality of the second magnetic structures 601.

[0056] In a specific embodiment, multiple trenches need to be formed on the transfer substrate 600, and then a second magnetic structure 601 is formed in the trenches. More specifically, the second magnetic structure 601 includes a resin material containing magnetic filler. The magnetic filler is iron(III) oxide powder, iron-cobalt powder, or iron-nickel powder. The resin material is any suitable resin material such as polyethylene, polypropylene, EVA, or PVB. The second magnetic structure 601 is formed by dispensing, slot coating, or spraying. The content of magnetic filler in the second magnetic structure 601 is 8-15 wt%. By setting it in the above manner, the magnetic adsorption strength of the first magnetic structure 500 and the second magnetic structure 601 can be greatly improved. Moreover, by setting the second magnetic structure 601 to have a large amount of magnetic filler, the reusability of the transfer substrate 600 can be improved.

[0057] like Figure 6 As shown, a driving substrate 700 is provided, which has a plurality of conductive pads (not shown) and a plurality of positioning cavities 702. The plurality of positioning posts 602 correspond one-to-one with the plurality of positioning cavities 702. Then, the Micro LED chip packaging module 400 on the transfer substrate 600 is transferred to the driving substrate 700, so that each Micro LED chip 100 is fixedly electrically connected to the corresponding conductive pad.

[0058] like Figure 7 As shown, the transfer substrate 600 is then removed, and the MicroLED chip packaging module 400 on the driving substrate 700 is then etched to remove the first magnetic structure 500 in each of the recesses 1011. After removing the first magnetic structure 500 in each of the recesses 1011, an organic protective layer 800 is formed on the driving substrate 700.

[0059] In a specific embodiment, the organic protective layer 800 is made of epoxy resin.

[0060] like Figure 7 As shown, the present invention also proposes a Micro LED display panel for naked-eye 3D, which is manufactured using the above-described manufacturing method.

[0061] In other preferred technical solutions, the present application provides a manufacturing method of a Micro LED display panel applied to naked eye 3D, which comprises the following steps:

[0062] A semiconductor light-emitting wafer is provided, and the light-emitting wafer is subjected to scribing treatment to form a plurality of Micro LED chips, each of which comprises a substrate and a functional layer on the substrate.

[0063] Then, the plurality of Micro LED chips are subjected to wafer expansion treatment.

[0064] A carrier substrate is provided, and the plurality of Micro LED chips after wafer expansion are arranged on the carrier substrate.

[0065] Then, a packaging layer is formed on the carrier substrate, the packaging layer wraps each of the Micro LED chips, and then the packaging layer is subjected to planarization treatment to expose the substrate of each of the Micro LED chips.

[0066] Then, the packaging layer is subjected to cutting treatment to form a plurality of Micro LED chip packaging modules, each of which comprises an array of MxM Micro LED chips, wherein M≥10, and each of the Micro LED chip packaging modules comprises a peripheral region and a middle region.

[0067] Then, the substrate of each of the Micro LED chips in the peripheral region of the Micro LED chip packaging module is subjected to etching treatment to form a groove in the substrate of each of the Micro LED chips in the peripheral region.

[0068] Then, a first magnetic structure is formed in each of the grooves.

[0069] A transfer substrate is provided, which has a plurality of second magnetic structures and a plurality of positioning columns, and the Micro LED chip packaging module is transferred to the transfer substrate, so that each of the first magnetic structures and the corresponding one of the second magnetic structures are magnetically adsorbed together.

[0070] A driving substrate is provided, which has a plurality of conductive pads and a plurality of positioning cavities, a plurality of positioning columns corresponding to a plurality of positioning cavities respectively, and then the Micro LED chip packaging module on the transfer substrate is transferred to the driving substrate, so that each Micro LED chip is fixedly connected to the corresponding conductive pad.

[0071] Then, the Micro LED chip packaging module on the driving substrate is subjected to etching treatment to remove the first magnetic structure in each groove.

[0072] In other preferred technical solutions, the substrate is a sapphire substrate or a gallium nitride substrate, and the functional layer includes a first semiconductor layer, a light-emitting quantum well layer, a second semiconductor layer, a first electrode, and a second electrode.

[0073] In other preferred technical solutions, the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer.

[0074] In other preferred technical solutions, before the plurality of Micro LED chips after the expansion are arranged on the bearing substrate, a temporary protective layer is arranged on the bearing substrate, and the first electrode and the second electrode of each Micro LED chip are embedded into the temporary protective layer.

[0075] In other preferred technical solutions, the peripheral region is an annular region, the annular region includes a ring of Micro LED chips, and the intermediate region includes (M-2) x (M-2) arrayed Micro LED chips, where M is greater than or equal to 10.

[0076] In other preferred technical solutions, the first magnetic structure includes a resin material containing a magnetic filler, the magnetic filler is a ferroferric oxide powder, a ferroco powder, or a ferro nickel powder, and the first magnetic structure is formed by a dispensing process, a slot coating process, or a spraying process.

[0077] In other preferred technical solutions, a plurality of positioning columns surround a plurality of second magnetic structures.

[0078] In other preferred technical solutions, after the first magnetic structure in each groove is removed, an organic protective layer is formed on the driving substrate.

[0079] In other preferred technical solutions, the application further provides a Micro LED display panel for naked eye 3D, which is manufactured by the above manufacturing method.

[0080] In the existing Micro LED chip transfer process, when using a magnetic component for adsorption transfer, a magnetic block needs to be arranged on the back surface of each Micro LED chip, which makes the Micro LED chip transfer process more complex, and thus easily leads to a decrease in the Micro LED chip transfer yield and a great increase in the production manufacturing cost. In the manufacturing method of the Micro LED display panel applied to naked-eye 3D of the present application, the Micro LED chips are pre-encapsulated to form a plurality of Micro LED chip encapsulation modules, so that each Micro LED chip encapsulation module includes a plurality of array-arranged Micro LED chips, and then when the magnetic structure is prepared, only the outermost circle of Micro LED chips of the Micro LED chip encapsulation module needs to be prepared with the magnetic structure, and the corresponding magnetic structure is arranged on the transfer substrate, so as to realize the precise adsorption of the first magnetic structure and the corresponding second magnetic structure. The positioning column is arranged on one side to assist the precise arrangement of the Micro LED chip encapsulation module on the corresponding position of the transfer substrate, and on the other side, the positioning cavity cooperating with the positioning column is arranged to facilitate the precise transfer of the Micro LED chip encapsulation module to the driving substrate. The manufacturing method of the Micro LED display panel is optimized, which greatly improves the transfer accuracy and the yield, greatly reduces the process complexity, and thus reduces the production manufacturing cost.

[0081] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. A method for manufacturing a Micro LED display panel for glasses-free 3D, characterized in that: The manufacturing method of the Micro LED display panel for glasses-free 3D includes the following steps: A semiconductor light-emitting wafer is provided, and the light-emitting wafer is diced to form a plurality of Micro LED chips, each of the Micro LED chips including a substrate and a functional layer located on the substrate; Next, the Micro LED chips are subjected to a crystal expansion process; A substrate is provided on which multiple Micro LED chips after crystal expansion are disposed; Next, an encapsulation layer is formed on the carrier substrate, the encapsulation layer encapsulating each Micro LED chip, and then the encapsulation layer is planarized to expose the substrate of each Micro LED chip; Next, the encapsulation layer is cut to form multiple Micro LED chip encapsulation modules. Each Micro LED chip encapsulation module includes Micro LED chips arranged in an M×M array, where M≥10. Each Micro LED chip encapsulation module includes an outer region and a middle region. Next, the substrate of each Micro LED chip located in the peripheral region of the Micro LED chip packaging module is etched to form a groove in the substrate of each Micro LED chip in the peripheral region. Then, a first magnetic structure is formed in each of the grooves; A transfer substrate is provided, the transfer substrate having a plurality of second magnetic structures and a plurality of positioning posts, and a MicroLED chip packaging module is transferred to the transfer substrate such that each first magnetic structure is magnetically attracted to a corresponding second magnetic structure. A driving substrate is provided, the driving substrate having multiple conductive pads and multiple positioning cavities, with multiple positioning posts corresponding to each of the multiple positioning cavities. Then, the Micro LED chip packaging module on the transfer substrate is transferred to the driving substrate, so that each Micro LED chip is fixedly electrically connected to the corresponding conductive pad. Next, the Micro LED chip packaging module on the driving substrate is etched to remove the first magnetic structure in each of the grooves. 2.The manufacturing method of a Micro LED display panel for naked-eye 3D application according to claim 1, wherein: The substrate is a sapphire substrate or a gallium nitride substrate, and the functional layer includes a first semiconductor layer, a light-emitting quantum well layer, a second semiconductor layer, a first electrode, and a second electrode. 3.The manufacturing method of a Micro LED display panel for naked-eye 3D application of claim 2, wherein: The first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer.

4. The method for manufacturing a Micro LED display panel for glasses-free 3D according to claim 2, characterized in that: Before placing the multiple expanded Micro LED chips on the carrier substrate, a temporary protective layer is formed on the carrier substrate, and the first electrode and the second electrode of each Micro LED chip are embedded in the temporary protective layer.

5. The method for manufacturing a Micro LED display panel for glasses-free 3D according to claim 1, characterized in that: The outer region is a ring-shaped region, which includes a ring of Micro LED chips. The middle region includes Micro LED chips arranged in an array of (M-2)×(M-2), where M≥10.

6. The method for manufacturing a Micro LED display panel for glasses-free 3D according to claim 1, characterized in that: The first magnetic structure includes a resin material containing magnetic filler, wherein the magnetic filler is iron oxide powder, iron-cobalt powder, or iron-nickel powder, and the first magnetic structure is formed by dispensing, slot coating, or spraying.

7. The method for manufacturing a Micro LED display panel for glasses-free 3D according to claim 1, characterized in that: The plurality of positioning posts surround the plurality of the second magnetic structures.

8. The method for manufacturing a Micro LED display panel for glasses-free 3D according to claim 1, characterized in that: After removing the first magnetic structure from each of the grooves, an organic protective layer is formed on the drive substrate.

9. A Micro LED display panel for glasses-free 3D, characterized in that, It is manufactured using the manufacturing method of any one of claims 1-8 for a Micro LED display panel applied to naked-eye 3D.

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