Alternate use and recovery cooling high-pressure gas system of differential pressure coating machine and control method of alternate use and recovery cooling high-pressure gas system

Abstract

The invention relates to a system for alternately using, recycling and cooling high-pressure gas of a differential pressure coating machine and a control method, which comprise the following two aspects: firstly, the system for alternately using, recycling and cooling high-pressure gas of the differential pressure coating machine comprises the differential pressure coating machine which comprises a reaction bin device and a workbench device arranged opposite to the reaction bin device, the reaction bin device comprises an upper reaction cavity and a lower reaction cavity opposite to the upper reaction cavity; the gas treatment system comprises an upper vacuum gas pump, a lower vacuum gas pump, a gas source, a first gas inlet valve piece, a first gas storage tank, a second gas inlet valve piece, a second gas storage tank, a first switch valve piece, a second switch valve piece and a high-pressure conveying and recycling pipeline, and the high-pressure conveying and recycling pipeline is communicated with a high-pressure recycling switch valve piece; the upper reaction cavity is communicated with a first inflation and deflation valve, the lower reaction cavity is communicated with a second inflation and deflation valve, and a gas cooling system is also arranged; the invention further discloses a control method of the system for alternately using, recycling and cooling the high-pressure gas of the differential pressure coating machine.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of differential pressure coating machines, in particular to an alternating use and recovery cooling high pressure gas system of a differential pressure coating machine and a control method BACKGROUND

[0002] A differential pressure coating machine is a device that coats a film on a product through a pressure difference. That is, the differential pressure coating machine includes a reaction chamber device and a workbench device. The reaction chamber device includes an upper reaction chamber and a lower reaction chamber. The workbench device includes a film jig and a product jig located below the film jig. The film jig is placed at the interface between the upper reaction chamber and the lower reaction chamber to isolate the two chambers. Then, the upper reaction chamber and the lower reaction chamber are vacuumized to be in a vacuum state. The film jig is then radiantly heated. The product jig is then sent to the bottom of the high-temperature film jig. A high-pressure gas tank is connected to the upper reaction chamber, and high-pressure gas is introduced into the upper reaction chamber to create a large pressure difference between the upper reaction chamber and the lower reaction chamber. Finally, the high-pressure gas coats the high-temperature film on the product surface. After the product is coated, the high-pressure gas is directly discharged to the outside atmosphere.

[0003] The structure of the differential pressure coating machine can refer to the Chinese patent application for invention with the patent document number CN115339090A and the patent name Differential Pressure Coating Machine.

[0004] In the gas treatment system of the differential pressure coating machine, there are the following technical defects: after the product is coated, the high-pressure gas is directly discharged to the outside atmosphere, which causes resource waste. SUMMARY

[0005] The present application aims to overcome the above-mentioned defects in the prior art and provide an alternating use and recovery cooling high pressure gas system of a differential pressure coating machine, which recovers part of the high-pressure gas in the upper reaction chamber to reduce resource waste and energy consumption.

[0006] In addition, the recovered part of the high-pressure gas is at a high temperature. After the gas source is supplemented with high-pressure gas and the cooled high-pressure gas of the gas source is mixed with the recovered high-temperature high-pressure gas, the temperature of the mixed high-pressure gas is higher than that of the cooled high-pressure gas. The temperature of the mixed high-pressure gas is more suitable for coating the high-temperature film on the product surface in the upper reaction chamber (the temperature difference between the temperature of the mixed high-pressure gas and the temperature of the high-temperature film is smaller), which can effectively improve the product coating effect and increase the product qualified capacity.

[0007] To achieve the above-mentioned purposes, the present application is realized through the following two aspects:

[0008] In a first aspect, the present application provides an alternating use and recovery cooling high pressure gas system of a differential pressure coating machine, which comprises:

[0009] The differential pressure coating machine comprises a reaction chamber device and a workbench device arranged opposite to the reaction chamber device, the reaction chamber device comprises an upper reaction chamber and a lower reaction chamber arranged opposite to the upper reaction chamber;

[0010] The gas treatment system comprises an upper vacuum air pump connected to the vacuum port of the upper reaction chamber, a lower vacuum air pump connected to the vacuum port of the lower reaction chamber, a gas source, a first air inlet valve connected to the gas source, a first gas storage tank connected to the first air inlet valve, a second air inlet valve connected to the gas source, a second gas storage tank connected to the second air inlet valve, a first switch valve connected to the first gas storage tank, a second switch valve connected to the second gas storage tank, and a high-pressure conveying and recycling pipeline connected to the connection between the first switch valve and the second switch valve and the high-pressure port of the upper reaction chamber, wherein a high-pressure recycling switch valve is connected to the high-pressure conveying and recycling pipeline, a first gas charging and discharging valve is connected to the upper reaction chamber, and a second gas charging and discharging valve is connected to the lower reaction chamber, and a gas cooling system is arranged between the differential pressure coating machine and the first gas storage tank and between the differential pressure coating machine and the second gas storage tank.

[0011] Preferably, the first gas charging and discharging valve is connected to the high-pressure conveying and recycling pipeline.

[0012] Preferably, the gas source is connected to a gas source triplex, and the first air inlet valve and the second air inlet valve are respectively connected to the gas source triplex.

[0013] Preferably, the gas cooling system comprises a vacuum stage upper reaction chamber cooling system, a non-contact reaction chamber cooling system, and a workbench cooling system.

[0014] Preferably, the vacuum stage upper reaction chamber cooling system comprises a plurality of upper reaction chamber cooling ports arranged on the top of the upper reaction chamber and connected to the top of the upper reaction chamber, an upper reaction chamber cooling pipeline connected to the upper reaction chamber cooling ports, and two first gas supply pipelines connected to the upper reaction chamber cooling pipeline, wherein a first adjustable one-way throttle valve and a first cooling switch valve are respectively connected to the upper reaction chamber cooling pipeline, a first gas source switch valve is connected to the first gas supply pipeline, one end of the first gas supply pipeline is connected to the gas source, a first gas storage tank switch valve is connected to the second gas supply pipeline, and one end of the second gas supply pipeline is connected to the connection between the first switch valve and the second switch valve.

[0015] As preferred, the non-contact reaction chamber cooling system comprises an inner circulation cooling pipe arranged in the interior of the top plate of the reaction chamber device and / or the interior of the side plate of the reaction chamber device, a non-contact reaction chamber cooling pipe connected at one end of the inner circulation cooling pipe, two second gas supply pipes connected with the non-contact reaction chamber cooling pipe, and an exhaust pipe connected at the other end of the inner circulation cooling pipe, wherein the non-contact reaction chamber cooling pipe is respectively connected with a second adjustable one-way throttle valve and a second cooling switch valve, the first second gas supply pipe is connected with a second gas source switch valve, one end of the first second gas supply pipe is connected with a gas source, the second second gas supply pipe is connected with a second gas tank switch valve, and one end of the second second gas supply pipe is connected with the connection between the first switch valve and the second switch valve.

[0016] As preferred, the workbench cooling system comprises a plurality of stop plate cooling ports penetrating through the stop plate of the workbench cooling system, a stop plate cooling pipe connected with the stop plate cooling ports, and two third gas supply pipes connected with the stop plate cooling pipe, wherein the stop plate cooling pipe is respectively connected with a third adjustable one-way throttle valve and a third cooling switch valve, the first third gas supply pipe is connected with a third gas source switch valve, one end of the first third gas supply pipe is connected with a gas source, the first gas tank is connected with the third switch valve, the second gas tank is connected with a fourth switch valve, and one end of the second third gas supply pipe is respectively connected with the third switch valve and the fourth switch valve.

[0017] As preferred, the first gas tank is connected with a first recycled gas state switching switch, and the second gas tank is connected with a second recycled gas state switching switch.

[0018] In the second aspect, the present application provides a control method of an alternating use recycled cooling high-pressure gas system of a differential pressure coating machine, which is realized by the alternating use recycled cooling high-pressure gas system of a differential pressure coating machine as described in the first aspect, and comprises the following steps:

[0019] S1: the reaction chamber device is driven downward, so that the reaction chamber device is combined with the workbench device, the diaphragm jig of the workbench device is located between the upper reaction chamber and the lower reaction chamber, the stop plate of the workbench device is located in the interior of the lower reaction chamber, and the product jig is arranged on the stop plate;

[0020] The upper reaction chamber is vacuum pumped by the upper vacuum pump, so that the upper reaction chamber is in a vacuum state, and the lower reaction chamber is vacuum pumped by the lower vacuum pump, so that the lower reaction chamber is in a vacuum state;

[0021] The first recovery intake state switch is switched to an intake state, so that the first gas tank is in a gas supply mode, and the second recovery intake state switch is switched to a recovery state, so that the second gas tank is in a recovery mode;

[0022] At this time, the first intake valve is opened, so that the first gas tank is in communication with the gas source, and the first gas tank is in a preset high pressure value state Pa, and then the first intake valve is closed;

[0023] At this time, the second gas tank is in a preset gas pressure value state Pb;

[0024] S2: respectively close the upper vacuum air pump and the lower vacuum air pump;

[0025] The workbench device lifts the product fixture to the bottom of the diaphragm fixture;

[0026] The first switch valve and the high pressure recovery switch valve are opened respectively, so that the first gas tank, the high pressure delivery recovery pipeline, the high pressure port and the upper reaction cavity are sequentially in communication, so that the first gas tank pressure value = the upper reaction cavity pressure value = Pa / 2, and then the first switch valve and the high pressure recovery switch valve are closed;

[0027] The gas pressure of the upper reaction cavity pushes the diaphragm on the diaphragm fixture to press against the product on the product fixture, realizing product film covering;

[0028] At this time, the lower reaction cavity is in a vacuum state;

[0029] At this time, the second gas tank is in a preset gas pressure value state Pb;

[0030] At this time, the product film covering is kept for a period of time;

[0031] S3: respectively open the second switch valve and the high pressure recovery switch valve, so that the upper reaction cavity, the high pressure port, the high pressure delivery recovery pipeline and the second gas tank are sequentially in communication, so that Pb< the upper reaction cavity pressure value = the second gas tank pressure value < Pa / 2, and then the second switch valve and the high pressure recovery switch valve are closed;

[0032] At this time, the lower reaction cavity is in a vacuum state;

[0033] At this time, the first gas tank pressure value = Pa / 2;

[0034] S4: respectively open the first switch valve, the second gas tank switch valve and the second cooling switch valve, so that the first gas tank, the second second gas supply pipeline, the non-contact reaction bin cooling pipeline, the inner circulation cooling pipeline of the reaction bin device top plate and / or the inner circulation cooling pipeline of the reaction bin device side plate, and the exhaust pipeline are sequentially in communication, for cooling the upper reaction cavity top plate and / or side plate;

[0035] At this time, Pb≤the first gas tank pressure value<Pa / 2;

[0036] When the first gas tank pressure value=Pb, the first switch valve, the second gas tank switch valve are closed, and the second gas source switch valve is started, so that the gas source, the first second gas pipeline, the non-contact reaction chamber cooling pipeline are sequentially connected;

[0037] When the cooling of the top plate and / or the side plate of the upper reaction chamber is completed, the first switch valve, the second gas tank switch valve, the second cooling switch valve, and the second gas source switch valve are closed;

[0038] At this time, the lower reaction chamber is in a vacuum state;

[0039] At this time, Pb<the upper reaction chamber pressure value=the second gas tank pressure value<Pa / 2;

[0040] S5: The first charge and discharge valve is a discharge valve, the first charge and discharge valve is opened, so that the upper reaction chamber is in an atmospheric pressure state, and then the first charge and discharge valve is closed;

[0041] The second charge and discharge valve is a charge valve, the second charge and discharge valve is opened, so that the lower reaction chamber is in an atmospheric pressure state, and then the second charge and discharge valve is closed;

[0042] At this time, Pb≤the first gas tank pressure value<Pa / 2;

[0043] At this time, Pb<the second gas tank pressure value<Pa / 2;

[0044] S6: The reaction chamber device is driven upwards, so that the reaction chamber device is separated from the workbench device, the workbench device is lowered and reset, and the product is taken out;

[0045] The third switch valve and the third cooling switch valve are opened, so that the first gas tank, the second third gas pipeline, the stop plate cooling pipeline, and the stop plate cooling port are sequentially connected, and the stop plate is cooled;

[0046] At this time, Pb≤the first gas tank pressure value<Pa / 2;

[0047] When the first gas tank pressure value=Pb, the third switch valve is closed, and the third gas source switch valve is started, so that the gas source, the first third gas pipeline, and the stop plate cooling pipeline are sequentially connected;

[0048] When the cooling of the stop plate is completed, the third switch valve, the third cooling switch valve, and the third gas source switch valve are closed;

[0049] At this time, the lower reaction chamber is in an atmospheric pressure state;

[0050] At this time, Pb < the second gas tank gas pressure value < Pa / 2;

[0051] S7: Put the film on the film fixture and the product on the product fixture;

[0052] The reaction chamber device is driven downward so as to be combined with the workbench device;

[0053] The upper reaction chamber is vacuum pumped by the upper vacuum air pump so as to be in a vacuum state, and the lower reaction chamber is vacuum pumped by the lower vacuum air pump so as to be in a vacuum state;

[0054] And the first switch valve, the first gas tank switch valve and the first cooling switch valve are opened respectively, so that the first gas tank, the second first gas pipeline, the upper reaction chamber cooling pipeline, the upper reaction chamber cooling port, the upper reaction chamber and the vacuum port are sequentially connected in communication for cooling the upper reaction chamber;

[0055] At this time, Pb < the first gas tank gas pressure value < Pa / 2;

[0056] When Pb < the first gas tank gas pressure value, the cooling of the upper reaction chamber is continued until the first gas tank gas pressure value = Pb;

[0057] When the first gas tank gas pressure value = Pb, the first switch valve and the first gas tank switch valve are closed, and the first gas source switch valve is started, so that the gas source, the first first gas pipeline and the upper reaction chamber cooling pipeline are sequentially connected in communication;

[0058] When the cooling of the upper reaction chamber is completed, the first switch valve, the first gas tank switch valve, the first cooling switch valve and the first gas source switch valve are closed;

[0059] The first recovery inlet state switch is switched to the recovery state, so that the first gas tank is in the recovery mode, and the second recovery inlet state switch is switched to the inlet state, so that the second gas tank is in the gas supply mode;

[0060] At this time, the step S7 realizes the switching of the working modes of the first gas tank and the second gas tank;

[0061] At this time, the second inlet valve is opened, so that the second gas tank is connected in communication with the gas source, and the gas pressure state of Pb < the second gas tank gas pressure value < Pa / 2 is changed to a certain preset high pressure value state Pa, and then the second inlet valve is closed. At this time, the gas source temperature < the second gas tank temperature in the certain preset high pressure value state Pa;

[0062] S8: The working modes of the first gas tank and the second gas tank in the steps S2-S7 are switched, and the switched steps S2-S7 are sequentially executed;

[0063] S9: cyclically execute the above steps S2-S8, thereby completing the differential pressure coating machine first gas tank and second gas tank recycling mode and gas mode of alternating use.

[0064] Compared with the prior art, the beneficial effects of the present application are:

[0065] 1、 the present application is provided with differential pressure coating machine, differential pressure coating machine is used for normally completing the work of covering the film to the product.

[0066] 2、 the present application is provided with gas treatment system, gas treatment system has first gas tank and second gas tank, the two gas tanks correspond to two working modes respectively: recycling mode and gas supply mode, the working mode of the two gas tanks is alternately switched, wherein, the gas supply mode is to transport high pressure gas to the upper reaction cavity for covering the film on the product, and to transport gas to the gas cooling system for cooling the differential pressure coating machine, the recycling mode is to recycle part of the high pressure gas of the upper reaction cavity;

[0067] Among them, the present application recycles part of the high pressure gas of the upper reaction cavity, which has the advantages of reducing resource waste, reducing energy consumption of filling compressed high pressure gas, improving product film covering effect and improving product qualified capacity;

[0068] Specifically, the reasons for improving product film covering effect and improving product qualified capacity are:

[0069] One of the gas tanks recycles part of the high pressure gas of the upper reaction cavity (the high pressure gas becomes high temperature and high pressure gas after heat preservation and pressure preservation), and then needs to supplement the high pressure gas through the gas source during the film covering process of the next product, and mix the cooled high pressure gas of the gas source with the recycled high temperature and high pressure gas, so as to reach the predetermined high pressure value for use. The temperature of the mixed high pressure gas is higher than that of the cooled high pressure gas of the gas source, which is more suitable for covering the high temperature film on the product surface in the upper reaction cavity (the temperature difference between the mixed high pressure gas and the high temperature film is smaller, which can greatly reduce the influence of film covering), thereby effectively improving the product film covering effect and improving the product qualified capacity;

[0070] Furthermore, the mixed high pressure gas temperature is more suitable for heat preservation and pressure preservation in the upper reaction cavity, and the mixed high pressure gas temperature is higher, which can easily heat and dry the glue on the bottom of the film by contacting the upper surface of the film, further improving the product film covering effect, improving the product qualified capacity and reducing the heat preservation and pressure preservation time.

[0071] 3. In addition, the gas cooling system cools the pressure differential coating machine through the first gas tank or the second gas tank, avoiding waste of resources and ensuring that in the next product coating work of the pressure differential coating machine, the pressure differential coating machine as a whole can ensure that the product coating operation is carried out in a suitable temperature range to avoid heat accumulation, thereby ensuring the quality of the next product coating.

[0072] 4. In summary, the advantages of the alternate use recovery cooling high-pressure gas system and control method of the pressure differential coating machine provided by the present invention are:

[0073] A. During the product coating process of the pressure differential coating machine, the high-pressure gas in the upper reaction chamber is recycled and reused, which has the advantages of energy saving and environmental protection, reducing energy consumption, improving product coating effect and ensuring product qualified production capacity;

[0074] B. The gas cooling system cools the pressure differential coating machine, ensuring that the entire pressure differential coating machine can perform product coating operations within the appropriate temperature range, thereby ensuring the coating quality of the next product;

[0075] C. The structural design of the pressure differential coating machine and the gas treatment system of the present invention is as close as possible to the current pressure differential coating machine production line structure, has a wider range of applications, and is more cost-effective to upgrade and transform. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0077] Figure 1 Schematic diagram of the structure of the pressure differential coating machine provided by Examples 1-3 of the present invention;

[0078] Figure 2 Schematic diagram of the exploded structure of the pressure differential coating machine provided by Examples 1-3 of the present invention;

[0079] Figure 3 This is an oblique side view and partial cross-sectional schematic diagram of the reaction chamber device provided in Examples 1-3 of the present invention;

[0080] Figure 4 Schematic diagram of the structure of the internal circulation cooling pipeline provided by Examples 1-3 of the present invention;

[0081] Figure 5 is a schematic structural diagram of a gas treatment system provided by Examples 1-3 of the present invention;

[0082] Figure 6is a structure schematic view of the gas source, the first gas inlet valve, the second gas inlet valve, the first gas storage tank, the second gas storage tank, the first switch valve, the second switch valve, the high-pressure delivery and recovery pipeline, the high-pressure recovery switch valve, and the upper reaction cavity provided by embodiments 1-3 of the present application;

[0083] Figure 7 is a structure schematic view of the gas cooling system provided by embodiments 1-3 of the present application;

[0084] Figure 8 is a structure schematic view of the vacuum stage upper reaction cavity cooling system and the non-contact reaction chamber cooling system provided by embodiments 1-3 of the present application;

[0085] Figure 9 is a structure schematic view of the workbench cooling system provided by embodiments 1-3 of the present application.

[0086] In the figure, there are:

[0087] 1, pressure differential coating machine; 11, reaction chamber device; 111, upper reaction chamber; 112, lower reaction chamber; 113, vacuum port; 114, high pressure port; 115, heating tube; 116, temperature sensor; 12, workbench device; 121, stop plate; 122, product fixture; 123, diaphragm fixture; 2, gas processing system; 200, gas source; 2000, gas source triple; 201, first gas inlet valve; 202, second gas inlet valve; 203, first gas storage tank; 204, second gas storage tank; 205, first switch valve; 206, second switch valve; 207, high pressure delivery and recovery pipeline; 208, high pressure recovery switch valve; 209, first gas charging and discharging valve; 21, upper vacuum pump; 210, second gas charging and discharging valve; 22, lower vacuum pump; 23, first recovery gas inlet state switching switch; 24, second recovery gas inlet state switching switch; 3, gas cooling system; 31, upper reaction chamber cooling system in vacuum stage; 311, upper reaction chamber cooling port; 312, upper reaction chamber cooling pipeline; 3120, first cooling switch valve; 3121, first adjustable one-way throttle valve; 313, first first gas supply pipeline; 3130, first gas source switch valve; 314, second first gas supply pipeline; 3140, first gas storage tank switch valve; 32, non-contact reaction chamber cooling system; 321, internal circulation cooling pipeline; 322, non-contact reaction chamber cooling pipeline; 3220, second cooling switch valve; 3221, second adjustable one-way throttle valve; 323, first second gas supply pipeline; 3230, second gas source switch valve; 324, second second gas supply pipeline; 3240, second gas storage tank switch valve; 325, exhaust pipeline; 33, workbench cooling system; 331, stop plate cooling port; 332, stop plate cooling pipeline; 3320, third cooling switch valve; 3321, third adjustable one-way throttle valve; 333, first third gas supply pipeline; 3330, third gas source switch valve; 334, second third gas supply pipeline; 3341, third switch valve; 3342, fourth switch valve. DETAILED DESCRIPTION

[0088] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are one of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0089] Embodiment one:

[0090] Please refer to Figures 1 to 9 Embodiment one of the present application provides an alternating use recovery cooling high pressure gas system of a pressure differential coating machine, which comprises:

[0091] The differential pressure coating machine 1 comprises a reaction bin device 11 and a workbench device 12 arranged opposite to the reaction bin device 11, the reaction bin device 11 comprises an upper reaction cavity 111 and a lower reaction cavity 112 arranged opposite to the upper reaction cavity 111;

[0092] The differential pressure coating machine 1 further comprises the following prior art features: the reaction bin device 11 is provided with a lifting driving device for driving the reaction bin device 11 to reciprocatingly lift and lower, the upper reaction cavity 111 and the lower reaction cavity 112 are respectively provided with a vacuum port 113 for vacuum suction, the upper reaction cavity 111 is provided with a high-pressure port 114 for high-pressure gas to be pressed into; the top of the inside of the upper reaction cavity 111 is provided with a heating pipe 115; the upper reaction cavity 111 is further provided with a temperature sensor 116 for aligning a diaphragm jig 123 and temperature detection of diaphragms in the diaphragm jig 123; the workbench device 12 is provided with a stop plate 121, the stop plate 121 is provided with a product jig 122, the stop plate 121 is provided with the diaphragm jig 123 above, and the workbench device 12 is further provided with a lifting driving device for driving the stop plate 121 and the product jig 122 to move upward to approach the bottom of the diaphragm jig 123;

[0093] The gas treatment system 2 comprises an upper vacuum gas pump 21 connected in communication with the vacuum port 113 of the upper reaction cavity 111, a lower vacuum gas pump 22 connected in communication with the vacuum port 113 of the lower reaction cavity 112, a gas source 200, a first gas inlet valve 201 connected in communication with the gas source 200, a first gas storage tank 203 connected in communication with the first gas inlet valve 201, a second gas inlet valve 202 connected in communication with the gas source 200, a second gas storage tank 204 connected in communication with the second gas inlet valve 202, a first switch valve 205 connected in communication with the first gas storage tank 203, a second switch valve 206 connected in communication with the second gas storage tank 204, and a high-pressure conveying and recycling pipeline 207 connected in communication with the connection between the first switch valve 205 and the second switch valve 206 and the high-pressure port 114 of the upper reaction cavity 111, the high-pressure conveying and recycling pipeline 207 is connected in communication with a high-pressure recycling switch valve 208, the upper reaction cavity 111 is connected in communication with a first gas charging and discharging valve 209, the lower reaction cavity 112 is connected in communication with a second gas charging and discharging valve 210, and the differential pressure coating machine 1 and the first gas storage tank 203 and the differential pressure coating machine 1 and the second gas storage tank 204 are provided with a gas cooling system 3.

[0094] The first gas charging and discharging valve 209 is connected to the high-pressure conveying and recycling pipeline 207.

[0095] The gas source 200 is connected in communication with a gas source triad 2000, the first gas inlet valve 201 and the second gas inlet valve 202 are respectively connected in communication with the gas source triad 2000.

[0096] The gas cooling system 3 comprises a vacuum stage upper reaction cavity cooling system 31, a non-contact reaction bin cooling system 32 and a worktable cooling system 33.

[0097] The vacuum stage upper reaction cavity cooling system 31 comprises a plurality of upper reaction cavity cooling ports 311 arranged on the top of the upper reaction cavity 111 and communicated with the top of the upper reaction cavity 111, an upper reaction cavity cooling pipeline 312 communicated with the upper reaction cavity cooling ports 311, and two first gas supply pipelines communicated with the upper reaction cavity cooling pipeline 312. The upper reaction cavity cooling pipeline 312 is respectively communicated with a first adjustable one-way throttle valve 3121 and a first cooling switch valve 3120. The first gas supply pipeline 313 is communicated with a first gas source switch valve 3130, and one end of the first gas supply pipeline 313 is communicated with the gas source 200. The second gas supply pipeline 314 is communicated with a second gas tank switch valve 3140, and one end of the second gas supply pipeline 314 is communicated with the connection between the first switch valve 205 and the second switch valve 206.

[0098] The working principle and advantages of the vacuum stage upper reaction cavity cooling system 31 are described in the following embodiment two.

[0099] The non-contact reaction bin cooling system 32 comprises an internal circulation cooling pipeline 321 arranged in the interior of the top plate of the reaction bin device 11 and / or the interior of the side plate of the reaction bin device 11, a non-contact reaction bin cooling pipeline 322 communicated with one end of the internal circulation cooling pipeline 321, two second gas supply pipelines communicated with the non-contact reaction bin cooling pipeline 322, and an exhaust pipeline 325 communicated with the other end of the internal circulation cooling pipeline 321. The non-contact reaction bin cooling pipeline 322 is respectively communicated with a second adjustable one-way throttle valve 3221 and a second cooling switch valve 3220. The first gas supply pipeline 323 is communicated with a second gas source switch valve 3230, and one end of the first gas supply pipeline 323 is communicated with the gas source 200. The second gas supply pipeline 324 is communicated with a second gas tank switch valve 3240, and one end of the second gas supply pipeline 324 is communicated with the connection between the first switch valve 205 and the second switch valve 206.

[0100] In this embodiment, the first gas supply pipeline 323 and the first gas supply pipeline 313 are the same part, the second gas source switch valve 3230 and the first gas source switch valve 3130 are the same part, the second gas supply pipeline 324 and the second gas supply pipeline 314 are the same part, and the second gas tank switch valve 3240 and the second gas tank switch valve 3140 are the same part.

[0101] The working principle and advantages of the non-contact reaction chamber cooling system 32 are described below in Embodiment Two.

[0102] The workbench cooling system 33 comprises a plurality of stop plate cooling ports 331 penetrating through the stop plate 121 of the workbench cooling system 33 (and also penetrating through the product fixture 122), a stop plate cooling pipeline 332 connected with the stop plate cooling ports 331, and two third gas supply pipelines connected with the stop plate cooling pipeline 332. The stop plate cooling pipeline 332 is respectively connected with a third adjustable one-way throttle valve 3321 and a third cooling switch valve 3320. The first third gas supply pipeline 333 is connected with a third gas source switch valve 3330. One end of the first third gas supply pipeline 333 is connected with the gas source 200. The first gas storage tank 203 is connected with a third switch valve 3341. The second gas storage tank 204 is connected with a fourth switch valve 3342. One end of the second third gas supply pipeline 334 is respectively connected with the third switch valve 3341 and the fourth switch valve 3342.

[0103] The working principle and advantages of the workbench cooling system 33 are described below in Embodiment Two.

[0104] The first gas storage tank 203 is connected with a first recovery inlet gas state switch 23. The second gas storage tank 204 is connected with a second recovery inlet gas state switch 24.

[0105] In this embodiment 1, the first switch valve 205, the second switch valve 206, the high-pressure recovery switch valve 208, and the first charge and discharge valve 209 are preferably bidirectional air control valves. The first inlet valve 201, the second inlet valve 202, the second charge and discharge valve 210, the first cooling switch valve 3120, the first gas source switch valve 3130, the first gas storage tank switch valve 3140, the second cooling switch valve 3220, the second gas source switch valve 3230, the second gas storage tank switch valve 3240, the third cooling switch valve 3320, the third gas source switch valve 3330, the third switch valve 3341, and the fourth switch valve 3342 are pilot-operated solenoid valves. In other embodiments, the above-mentioned valves can be other types of valves.

[0106] The working principle of the product film coating machine 1 for coating the product is as follows:

[0107] S1: The reaction chamber device 11 is driven downward by the lifting driving device, so that the reaction chamber device 11 is combined with the workbench device 12.

[0108] S2: After the reaction chamber device 11 and the workbench device 12 are combined to set, the diaphragm jig 123 is located between the upper reaction chamber 111 and the lower reaction chamber 112, and the diaphragm jig 123 separates the upper reaction chamber 111 and the lower reaction chamber 112 (so that the air between the upper reaction chamber 111 and the lower reaction chamber 112 is not communicated), and the product jig 122 is located inside the lower reaction chamber 112;

[0109] S3: The vacuum ports 113 of the upper reaction chamber 111 and the lower reaction chamber 112 are respectively vacuum adsorbed, so that the upper reaction chamber 111 is in a vacuum state, and the lower reaction chamber 112 is in a vacuum state;

[0110] At the same time, the upper reaction chamber 111 is heated by the heating pipe 115, and the diaphragm is baked;

[0111] S4: When the temperature sensor 116 detects that the diaphragm reaches the specified baking temperature,

[0112] The product jig 122 is lifted upward to the top of the diaphragm jig 123 by the lifting driving device;

[0113] S5: The high-pressure gas is introduced into the high-pressure port 114 of the upper reaction chamber 111, so that the upper reaction chamber 111 is high pressure, and the lower reaction chamber 112 is vacuum, so that the diaphragm on the diaphragm jig 123 is coated on the product of the product jig 122 through the air pressure difference;

[0114] S6: After a certain time of heat preservation and pressure preservation, the reaction chamber device 11 and the workbench device 12 are separated from the setting, and the coated product is taken out.

[0115] The working principle and advantages of the gas treatment system 2 are described in the following embodiment two.

[0116] Embodiment two:

[0117] The embodiment two of the application provides a control method of an alternating use recovery cooling high-pressure gas system of a differential pressure coating machine, which is realized by the alternating use recovery cooling high-pressure gas system of the differential pressure coating machine described in embodiment one. The control method of the alternating use recovery cooling high-pressure gas system of the differential pressure coating machine in the embodiment two of the application is one of the control methods of the alternating use recovery cooling high-pressure gas system of the differential pressure coating machine described in embodiment one, and comprises the following steps:

[0118] S1: The reaction chamber device 11 is driven downward, so that the reaction chamber device 11 and the workbench device 12 are combined to set, the diaphragm jig 123 of the workbench device 12 is located between the upper reaction chamber 111 and the lower reaction chamber 112, the stop plate 121 of the workbench device 12 is located inside the lower reaction chamber 112, and the product jig 122 is arranged on the stop plate 121;

[0119] The upper reaction cavity 111 is vacuum pumped by the upper vacuum air pump 21, so that the upper reaction cavity 111 is in a vacuum state, and the lower reaction cavity 112 is vacuum pumped by the lower vacuum air pump 22, so that the lower reaction cavity 112 is in a vacuum state;

[0120] The first recovery inlet state switching switch 23 is switched to an inlet state, so that the first gas storage tank 203 is in a gas supply mode, and the second recovery inlet state switching switch 24 is switched to a recovery state, so that the second gas storage tank 204 is in a recovery mode;

[0121] At this time, the first inlet valve 201 is opened, so that the first gas storage tank 203 is in communication with the gas source 200, and the first gas storage tank 203 is in a certain preset high pressure value state Pa, and then the first inlet valve 201 is closed;

[0122] At this time, the second gas storage tank 204 is in a certain preset gas pressure value state Pb;

[0123] S2: The upper vacuum air pump 21 and the lower vacuum air pump 22 are closed respectively;

[0124] The workbench device 12 lifts the product jig 122 to the bottom of the diaphragm jig 123;

[0125] The first switch valve 205 and the high pressure recovery switch valve 208 are opened respectively, so that the first gas storage tank 203, the high pressure conveying recovery pipeline 207, the high pressure port 114 and the upper reaction cavity 111 are sequentially in communication, so that the gas pressure value of the first gas storage tank 203 = the gas pressure value of the upper reaction cavity 111 = Pa / 2, and then the first switch valve 205 and the high pressure recovery switch valve 208 are closed;

[0126] The gas pressure of the upper reaction cavity 111 pushes the diaphragm on the diaphragm jig 123 to press the product on the product jig 122, so as to realize product film covering;

[0127] At this time, the lower reaction cavity 112 is in a vacuum state;

[0128] At this time, the second gas storage tank 204 is in a certain preset gas pressure value state Pb;

[0129] At this time, the product film covering is kept for a period of time;

[0130] S3: The second switch valve 206 and the high pressure recovery switch valve 208 are opened respectively, so that the upper reaction cavity 111, the high pressure port 114, the high pressure conveying recovery pipeline 207 and the second gas storage tank 204 are sequentially in communication, so that Pb< the gas pressure value of the upper reaction cavity 111 = the gas pressure value of the second gas storage tank 204 < Pa / 2, and then the second switch valve 206 and the high pressure recovery switch valve 208 are closed;

[0131] At this time, the lower reaction cavity 112 is in a vacuum state;

[0132] At this time, the first gas tank 203 has a pressure value of Pa / 2;

[0133] S4: The first switch valve 205, the second gas tank switch valve 3240, and the second cooling switch valve 3220 are opened, so that the first gas tank 203, the second gas supply pipeline 324, the non-contact reaction cavity cooling pipeline 322, the internal circulation cooling pipeline 321 of the top plate of the reaction cavity device 11, and / or the internal circulation cooling pipeline 321 of the side plate of the reaction cavity device 11, and the exhaust pipeline 325 are sequentially connected in communication, for cooling the top plate and / or the side plate of the upper reaction cavity 111;

[0134] At this time, Pb≤ the pressure value of the first gas tank 203 < Pa / 2;

[0135] When the pressure value of the first gas tank 203 is Pb, the first switch valve 205 and the second gas tank switch valve 3240 are closed, and the second gas source switch valve 3230 is started, so that the gas source 200, the first second gas supply pipeline 323, and the non-contact reaction cavity cooling pipeline 322 are sequentially connected in communication;

[0136] When the cooling of the top plate and / or the side plate of the upper reaction cavity 111 is completed, the first switch valve 205, the second gas tank switch valve 3240, the second cooling switch valve 3220, and the second gas source switch valve 3230 are closed;

[0137] At this time, the lower reaction cavity 112 is in a vacuum state;

[0138] At this time, Pb < the pressure value of the upper reaction cavity 111 = the pressure value of the second gas tank 204 < Pa / 2;

[0139] S5: The first charge and discharge valve 209 is a (connected to the outside) discharge valve, and the first charge and discharge valve 209 is opened, so that the upper reaction cavity 111 is in an atmospheric pressure state, and then the first charge and discharge valve 209 is closed;

[0140] The second charge and discharge valve 210 is a (connected to the outside) charge valve, and the second charge and discharge valve 210 is opened, so that the lower reaction cavity 112 is in an atmospheric pressure state, and then the second charge and discharge valve 210 is closed;

[0141] At this time, Pb≤ the pressure value of the first gas tank 203 < Pa / 2;

[0142] At this time, Pb < the pressure value of the second gas tank 204 < Pa / 2;

[0143] S6: The reaction chamber device 11 is driven upward, so that the reaction chamber device 11 is separated from the workbench device 12, the workbench device 12 is lowered to reset the product fixture 122, and the product is taken out;

[0144] The third switch valve 3341 and the third cooling switch valve 3320 are opened, so that the first gas tank 203, the third gas pipeline 334, the stop plate cooling pipeline 332, and the stop plate cooling port 331 are sequentially connected in communication for cooling the stop plate 121.

[0145] At this time, Pb≤ the first gas tank 203 gas pressure value < Pa / 2;

[0146] When the first gas tank 203 gas pressure value = Pb, the third switch valve 3341 is closed, and the third gas source switch valve 3330 is started, so that the gas source 200, the first third gas pipeline 333, and the stop plate cooling pipeline 332 are sequentially connected in communication.

[0147] When the cooling of the stop plate 121 is completed, the third switch valve 3341, the third cooling switch valve 3320, and the third gas source switch valve 3330 are closed.

[0148] At this time, the lower reaction chamber 112 is in an atmospheric pressure state.

[0149] At this time, Pb < the second gas tank 204 gas pressure value < Pa / 2;

[0150] S7: The diaphragm is placed on the diaphragm fixture 123, and the product is placed on the product fixture 122.

[0151] The reaction chamber device 11 is driven downward, so that the reaction chamber device 11 is combined with the workbench device 12.

[0152] The upper reaction chamber 111 is vacuum pumped by the upper vacuum air pump 21, so that the upper reaction chamber 111 is in a vacuum state, and the lower reaction chamber 112 is vacuum pumped by the lower vacuum air pump 22, so that the lower reaction chamber 112 is in a vacuum state.

[0153] And the first switch valve 205, the first gas tank switch valve 3140, and the first cooling switch valve 3120 are opened, so that the first gas tank 203, the first gas pipeline 314, the upper reaction chamber cooling pipeline 312, the upper reaction chamber cooling port 311, the upper reaction chamber 111, and the vacuum port 113 are sequentially connected in communication for cooling the upper reaction chamber 111.

[0154] At this time, Pb≤ the first gas tank 203 gas pressure value < Pa / 2;

[0155] When Pb≤ the first gas tank 203 pressure value, continue to cool the upper reaction cavity 111 until the first gas tank 203 pressure value = Pb;

[0156] When the first gas tank 203 pressure value = Pb, close the first switch valve 205, the first gas tank switch valve 3140, start the first gas source switch valve 3130, so that the gas source 200, the first first gas supply pipeline 313, the upper reaction cavity cooling pipeline 312 are sequentially connected;

[0157] When the cooling of the upper reaction cavity 111 is completed, the first switch valve 205, the first gas tank switch valve 3140, the first cooling switch valve 3120, and the first gas source switch valve 3130 are closed;

[0158] The first recovery inlet state switch 23 is switched to the recovery state, so that the first gas tank 203 is in the recovery mode, and the second recovery inlet state switch 24 is switched to the inlet state, so that the second gas tank 204 is in the gas supply mode;

[0159] At this time, the step S7 realizes the switching of the working modes of the first gas tank 203 and the second gas tank 204;

[0160] At this time, the second inlet valve 202 is opened, so that the second gas tank 204 is connected with the gas source 200, and the gas pressure state of Pb< the second gas tank 204 pressure value < Pa / 2 is changed to a certain preset high pressure value state Pa, and then the second inlet valve 202 is closed. At this time, the temperature of the gas source 200 < the temperature of the second gas tank 204 in the certain preset high pressure value state Pa;

[0161] S8: Switch the working modes of the first gas tank 203 and the second gas tank 204 in the above steps S2-S7, and execute the switched steps S2-S7 in sequence. The switched steps S2-S7 are as follows:

[0162] In the above step S7, the vacuum stage upper reaction cavity cooling system 31 is used to quickly cool the heating pipe 115 in the upper reaction cavity 111 which still has residual heat. The cooling time is relatively short, and the cooling gas is directly sucked away by the upper vacuum pump 21 of the upper reaction cavity 111, so as to realize the direct cooling of the upper reaction cavity 111. The reason for using the vacuum stage upper reaction cavity cooling system 31 to directly cool the heating pipe 115 and the inside of the upper reaction cavity 111 is to avoid the accumulation of heat in the heating pipe 115, to avoid the initial temperature of the inside of the upper reaction cavity 111 being too high, to avoid the diaphragm not reaching the required baking temperature rise curve and baking temperature rise time, and to avoid poor product film forming effect;

[0163] When the cooling of the upper reaction cavity 111 is completed, the first switch valve 205, the first gas tank switch valve 3140, the first cooling switch valve 3120, and the first gas source switch valve 3130 are closed;

[0164] At this time, the upper reaction cavity 111 still needs to be vacuum pumped by the upper vacuum air pump 21, so that the upper reaction cavity 111 is in a vacuum state, and the lower reaction cavity 112 is vacuum pumped by the lower vacuum air pump 22, so that the lower reaction cavity 112 is in a vacuum state;

[0165] At the same time, the heating pipe 115 in the upper reaction cavity 111 is started to heat radiate the diaphragm in the diaphragm jig 123, and when the diaphragm experiences a certain baking temperature rising curve and baking temperature rising time, the surface of the diaphragm reaches a specified heating temperature, which is monitored by the temperature sensor 116.

[0166] The temperature sensor 116 feeds back to the upper vacuum air pump 21 and the lower vacuum air pump 22.

[0167] The upper vacuum air pump 21 and the lower vacuum air pump 22 are closed respectively.

[0168] The workbench device 12 lifts the product jig 122 to the bottom of the diaphragm jig 123.

[0169] The second switch valve 206 and the high-pressure recovery switch valve 208 are opened respectively, so that the second gas tank 204, the high-pressure conveying recovery pipeline 207, the high-pressure port 114, and the upper reaction cavity 111 are sequentially connected in communication, so that the gas pressure value of the second gas tank 204 = the gas pressure value of the upper reaction cavity 111 = Pa / 2, and then the second switch valve 206 and the high-pressure recovery switch valve 208 are closed. (In this process, the temperature of the gas source 200 < the temperature of the second gas tank 204, and the second gas tank 204 provides higher high-pressure gas than the temperature of the gas source 200 for the upper reaction cavity 111, which greatly reduces the temperature difference inside the upper reaction cavity 111, thereby ensuring the film covering quality of the high-temperature diaphragm on the product) (to avoid the direct introduction of the cooling high-pressure gas source 200 in the prior art causing the surface of the high-temperature diaphragm to shrink due to the large temperature difference, and the instantaneous adhesion of the glue of the high-temperature diaphragm to the product surface has a greater impact)

[0170] The gas pressure of the upper reaction cavity 111 pushes the diaphragm on the diaphragm jig 123 to press against the product on the product jig 122, realizing product film covering.

[0171] At this time, the lower reaction cavity 112 is in a vacuum state.

[0172] At this time, the second gas tank 204 is in a certain preset gas pressure value state Pb.

[0173] At this time, the product film is kept for a period of time. Due to the high-temperature high-pressure gas, the temperature difference inside the upper reaction cavity 111 is greatly reduced, so that the high-pressure gas temperature is more suitable for keeping in the upper reaction cavity 111, the high-pressure gas temperature is higher, and the film upper surface is more easily heated and dried to the film bottom glue, further improving the product film effect and reducing the keeping time.

[0174] Step S3 after switching: open the first switch valve 205 and the high-pressure recovery switch valve 208, so that the upper reaction cavity 111, the high-pressure port 114, the high-pressure conveying recovery pipeline 207 and the first gas tank 203 are sequentially connected in communication, so that Pb<upper reaction cavity 111 gas pressure value=first gas tank 203 gas pressure value<Pa / 2, and then close the first switch valve 205 and the high-pressure recovery switch valve 208.

[0175] At this time, the lower reaction cavity 112 is in a vacuum state.

[0176] At this time, the second gas tank 204 gas pressure value=Pa / 2.

[0177] Step S4 after switching: open the second switch valve 206, the second gas tank switch valve 3240 and the second cooling switch valve 3220, so that the second gas tank 204, the second second gas supply pipeline 324, the non-contact reaction chamber cooling pipeline 322, the inner circulation cooling pipeline 321 of the top plate of the reaction chamber device 11 and / or the inner circulation cooling pipeline 321 of the side plate of the reaction chamber device 11 and the exhaust pipeline 325 are sequentially connected in communication for cooling the top plate and / or side plate of the upper reaction cavity 111.

[0178] At this time, Pb≤second gas tank 204 gas pressure value<Pa / 2.

[0179] When the second gas tank 204 gas pressure value=Pb, close the second switch valve 206 and the second gas tank switch valve 3240, and start the second gas source switch valve 3230, so that the gas source 200, the first second gas supply pipeline 323 and the non-contact reaction chamber cooling pipeline 322 are sequentially connected in communication.

[0180] When the cooling of the top plate and / or side plate of the upper reaction cavity 111 is completed, the second switch valve 206, the second gas tank switch valve 3240, the second cooling switch valve 3220 and the second gas source switch valve 3230 are closed.

[0181] At this time, the lower reaction cavity 112 is in a vacuum state.

[0182] At this time, Pb<upper reaction cavity 111 gas pressure value=first gas tank 203 gas pressure value<Pa / 2.

[0183] Step S5 after switching: the first charge and discharge valve 209 is a (outdoor-connected) discharge valve, the first charge and discharge valve 209 is opened, so that the upper reaction cavity 111 is in an atmospheric pressure state, and then the first charge and discharge valve 209 is closed;

[0184] The second charge and discharge valve 210 is a (outdoor-connected) charge valve, the second charge and discharge valve 210 is opened, so that the lower reaction cavity 112 is in an atmospheric pressure state, and then the second charge and discharge valve 210 is closed;

[0185] At this time, Pb < the second gas storage tank 204 gas pressure value < Pa / 2;

[0186] At this time, Pb < the first gas storage tank 203 gas pressure value < Pa / 2;

[0187] Step S6 after switching: the reaction bin device 11 is driven upwards, so that the reaction bin device 11 is separated from the workbench device 12, the workbench device 12 is lowered to reset, and the product is taken out;

[0188] The fourth switch valve 3342 and the third cooling switch valve 3320 are opened respectively, so that the second gas storage tank 204, the second third gas supply pipeline 334, the stop plate cooling pipeline 332 and the stop plate cooling port 331 are sequentially connected in communication, and the stop plate 121 is cooled;

[0189] At this time, Pb < the second gas storage tank 204 gas pressure value < Pa / 2;

[0190] When the second gas storage tank 204 gas pressure value = Pb, the fourth switch valve 3342 is closed, and the third gas source switch valve 3330 is started, so that the gas source 200, the first third gas supply pipeline 333 and the stop plate cooling pipeline 332 are sequentially connected in communication;

[0191] When the cooling of the stop plate 121 is completed, the fourth switch valve 3342, the third cooling switch valve 3320 and the third gas source switch valve 3330 are closed;

[0192] At this time, the lower reaction cavity 112 is in an atmospheric pressure state;

[0193] At this time, Pb < the first gas storage tank 203 gas pressure value < Pa / 2;

[0194] Step S7 after switching: the diaphragm is placed on the diaphragm jig 123, and the product is placed on the product jig 122;

[0195] The reaction bin device 11 is driven downwards, so that the reaction bin device 11 is combined with the workbench device 12;

[0196] The upper reaction chamber 111 is vacuumed by the upper vacuum air pump 21, so that the upper reaction chamber 111 is in a vacuum state, and the lower reaction chamber 112 is vacuumed by the lower vacuum air pump 22, so that the lower reaction chamber 112 is in a vacuum state;

[0197] Furthermore, the first on-off valve 205, the first gas tank on-off valve 3140, and the first cooling on-off valve 3120 are opened respectively, so that the first gas tank 203, the second first gas supply pipe 314, the upper reaction chamber cooling pipe 312, the upper reaction chamber cooling port 311, the upper reaction chamber 111, and the vacuum port 113 are connected in sequence, so as to cool the upper reaction chamber 111.

[0198] At this time, Pb≤the pressure value of the second gas storage tank 204 <Pa / 2;

[0199] When Pb≤the pressure value of the second gas storage tank 204, the upper reaction chamber 111 is continuously cooled until the pressure value of the second gas storage tank 204 equals Pb;

[0200] When the gas pressure value of the second gas storage tank 204 is equal to Pb, the second on-off valve 206 and the first gas storage tank on-off valve 3140 are closed, and the first gas source on-off valve 3130 is opened, so that the gas source 200, the first first gas supply pipeline 313, and the upper reaction chamber cooling pipeline 312 are connected in sequence;

[0201] When the cooling of the upper reaction chamber 111 is completed, the second on-off valve 206, the first gas storage tank on-off valve 3140, the first cooling on-off valve 3120, and the first gas source on-off valve 3130 are closed;

[0202] The first recycling air intake state switching switch 23 is switched to the intake state, so that the first air storage tank 203 is in the air supply mode, and the second recycling air intake state switching switch 24 is switched to the recycling state, so that the second air storage tank 204 is in the recycling mode;

[0203] At this time, the first air inlet valve 201 is opened, so that the first air tank 203 is connected to the air source 200, and Pb < the air pressure value of the first air tank 203 <Pa / 2的气压状态变更为呈一定预设高压值状态Pa,之后关闭第一进气阀件201,此时,气源200温度<呈一定预设高压值状态Pa的第一储气罐203温度;

[0204] S9: The above steps S2-S8 are repeatedly performed to complete the alternating use of the recovery mode and the gas supply mode of the first gas storage tank 203 and the second gas storage tank 204 of the pressure differential coating machine 1.

[0205] The non-contact reaction chamber cooling system 32 is located behind the step S4 of coating the product and the step S4 of keeping the product at a constant temperature and pressure after the step S2 of heating the upper reaction chamber 111, and the function of the non-contact reaction chamber cooling system 32 is to cool the top plate of the reaction chamber device 11 and / or the side plate of the reaction chamber device 11 after the coating of the product is completed, so as to avoid the influence of the molding effect of the next product coating due to the high initial temperature of the top plate of the reaction chamber device 11 and / or the side plate of the reaction chamber device 11.

[0206] The technical advantage of the non-contact reaction chamber cooling system 32 is that the internal circulation cooling pipeline 321 is used to cool the inside of the top plate of the reaction chamber device 11 and / or the inside of the side plate of the reaction chamber device 11, which not only has a high cooling efficiency, but also avoids the destruction of the dust-free clean environment required by the reaction chamber device 11 caused by the blowing of the cooling gas to the reaction chamber device 11, and avoids the situation that the film on the bottom of the film jig 123 is contaminated by dust caused by the large air volume of the cooling gas.

[0207] The implementation principle of the non-contact reaction chamber cooling system 32 is that a plurality of linearly arranged through holes are drilled on the top and bottom of the top plate of the reaction chamber device 11 and / or the left and right sides of the side plate of the reaction chamber device 11, so that the through holes on the top and bottom and the through holes on the left and right sides are staggered to form a cross-shaped hole. Next, only two holes at the end of the through holes on the top and bottom and the end of the through holes on the left and right sides are kept as one-in and one-out holes, and the remaining holes at the end are plugged with a plug or a pin and coated with an anti-leakage glue. Next, some pins and anti-leakage glue are punched on the top plate of the reaction chamber device 11 and / or the side plate of the reaction chamber device 11, so that the cross-shaped hole inside the top plate of the reaction chamber device 11 and / or the side plate of the reaction chamber device 11 becomes a meandering internal circulation cooling pipeline 321. The two one-in and one-out holes are respectively an air inlet hole at one end of the internal circulation cooling pipeline 321 and an air outlet hole at the other end of the internal circulation cooling pipeline 321. The air inlet hole at one end of the internal circulation cooling pipeline 321 is connected to the non-contact reaction chamber cooling pipeline 322, and the air outlet hole at the other end is connected to the air outlet pipeline 325. The working principle of the non-contact reaction chamber cooling system 32 has been described in detail in the step S4, and will not be repeated here.

[0208] The workbench cooling system 33 is started after the product is coated and taken out, and the purpose is to actively cool the stop plate 121 and the product jig 122 through the workbench cooling system 33 after the current product is taken out, and then the temperature sensor 116 is used to keep the stop plate 121 and the product jig 122 within a certain reasonable temperature range. The purpose of such processing is to effectively avoid the initial temperature of the product jig 122 being too high, thereby avoiding affecting the quality of the next product coating. (The product jig 122 is in a reasonable temperature range after the product is placed and before the product is coated. Therefore, the workbench cooling system 33 ensures that the initial temperature of the product jig 122 does not exceed the reasonable temperature range when the next coating process starts, thereby avoiding affecting the quality of the next product coating. If the initial temperature of the product jig 122 is too high, it will easily cause the product to soften and deform after being placed, thereby affecting the quality of the next product coating.)

[0209] The technical advantages of the workbench cooling system 33 are that the stop plate 121 and the product jig 122 are cooled through the stop plate cooling port 331, which not only allows the product jig 122 to cool quickly to a certain reasonable temperature range, but also requires less cooling air (because the surface area of the product jig 122 is small, and the cooling purpose is only to cool to a certain reasonable temperature range, so the cooling air required is less). Therefore, the small amount of cooling air does not affect the dust-free and clean environment required by the reaction chamber device 11.

[0210] The implementation principle of the workbench cooling system 33 has been described in detail in step S6.

[0211] The vacuum phase reaction chamber cooling system 31 is located in the above step S7, that is, the vacuum phase reaction chamber cooling system 31 is started in the vacuum phase of the second product coating process, and works in the vacuum phase of each product coating process after the second product,

[0212] Therefore, the role of the upper reaction chamber cooling system 31 in the vacuum stage is to pass cooling gas into the upper reaction chamber cooling port 311 on the top of the upper reaction chamber 111 to directly cool the heating pipe 115 in the upper reaction chamber 111 and the inside of the upper reaction chamber 111 during the vacuum adsorption stage in the film coating process of the second product and each product after the second product, which can effectively reduce the starting temperature of the heating pipe 115 and the inside of the upper reaction chamber 111 in the starting stage of the product film coating process, so that the starting temperature does not exceed a certain reasonable temperature range, avoids the accumulation of heat in the heating pipe 115, avoids the starting temperature of the heating pipe 115 and the inside of the upper reaction chamber 111 being too high, causes the film to reach the baking temperature too early (the baking temperature of the film refers to the baking temperature of the film surface, which is detected by the temperature sensor 116, but the baking temperature of the film surface and the baking temperature of the film inside are not necessarily consistent, and the baking temperature of the film inside needs a certain baking temperature rise curve and a certain baking temperature rise time to reach the same as the baking temperature of the film surface, and the baking temperature of the film inside is related to the product film forming effect), thereby avoiding the film from reaching the required baking temperature rise curve and a certain baking temperature rise time, thereby avoiding poor product film forming effect.

[0213] The technical advantages of the upper reaction chamber cooling system 31 in the vacuum stage are:

[0214] First, the heating pipe 115 and the inside of the upper reaction chamber 111 are directly cooled in the vacuum stage of the product film coating process, which avoids the film surface temperature reaching the baking temperature too early in the beginning, thereby causing poor film coating quality, and gives the film a wider heating range and a certain heating time.

[0215] Second, the upper reaction chamber cooling system 31 passes cooling gas into the upper reaction chamber cooling port 311, and the upper vacuum air pump 21 of the upper reaction chamber 111 recovers the cooling gas in the vacuum stage, thereby realizing the cooling circulation in the closed space of the upper reaction chamber 111 of the differential pressure coating machine 1 in the vacuum stage, avoiding the occurrence of air movement causing dust to be raised and affecting the film coating quality.

[0216] Third, the differential pressure coating machine 1 simultaneously completes the vacuum suction and cooling gas circulation functions in the closed space of the upper reaction chamber 111 in the vacuum stage, without the need to set a cooling gas source 200 recovery structure on the structure of the differential pressure coating machine 1, which is convenient to manufacture, effectively saves manufacturing cost, and effectively saves manufacturing space.

[0217] The implementation principle of the reaction cavity cooling system 31 in the vacuum stage has been described in detail in step S7. The upper reaction cavity cooling port 311 of the reaction cavity cooling system 31 in the vacuum stage penetrates through the top plate of the reaction chamber device 11. It should be noted that the position of the upper reaction cavity cooling port 311 avoids the inner circulation cooling pipeline 321 of the non-contact reaction chamber cooling system 32, preventing the upper reaction cavity cooling port 311 from being connected to the inner circulation cooling pipeline 321.

[0218] The technical purposes of the vacuum stage upper reaction cavity cooling system 31, the non-contact reaction chamber cooling system 32, and the workbench cooling system 33 described above are to design them according to the structural characteristics of the differential pressure coating machine 1. In different reaction stages of the differential pressure coating machine 1, different parts of the differential pressure coating machine 1 are cooled, so that the differential pressure coating machine 1 can start the product coating operation in the appropriate temperature range in the next product coating operation of the differential pressure coating machine 1, thereby ensuring the quality of the next product coating.

[0219] The technical advantages of the differential pressure coating machine alternating use of the recovered and cooled high-pressure gas system of the embodiment one and the control method of the differential pressure coating machine alternating use of the recovered and cooled high-pressure gas system of the embodiment two are:

[0220] A. During the product coating process of the differential pressure coating machine 1, the high-pressure gas in the upper reaction cavity 111 is recycled, which has the advantages of energy saving, environmental protection, energy saving, improving product coating effect, and ensuring product qualified capacity;

[0221] B. The vacuum stage upper reaction cavity cooling system 31, the non-contact reaction chamber cooling system 32, and the workbench cooling system 33 of the gas cooling system 3 cool the differential pressure coating machine 1, which can ensure that the differential pressure coating machine 1 can perform product coating operation in the appropriate temperature range, thereby ensuring the quality of the next product coating;

[0222] C. The differential pressure coating machine 1 and the gas treatment system 2 of the present application are designed as much as possible to fit the current differential pressure coating machine 1 production line structure, which has a wider application range and saves cost in upgrading and modification.

[0223] Embodiment three:

[0224] The embodiment three of the present application provides a control method for alternating use of a recovered and cooled high-pressure gas system of a differential pressure coating machine. The control method of the embodiment three is a theoretical and specific application explanation of the control method of the differential pressure coating machine alternating use of the recovered and cooled high-pressure gas system of the embodiment two. It should be noted that:

[0225] 1. The following specific values are for the purpose of explaining the principle and do not represent the actual machine values.

[0226] 2. To facilitate understanding of the pressure changes of various components, the following pressure values ​​are absolute pressure values: vacuum pressure 0 kgf / cm2, atmospheric pressure 1 kgf / cm2;

[0227] 3. Assume that the volumes of the two gas tanks are equal, equal to the volume of the upper chamber of the reactor, and ignore the volume of the pipeline;

[0228] 4. The final values ​​of volume and pressure changes are based on Boyle's law and ignore the theoretical values ​​of factors that have little effect on air pressure, such as temperature changes.

[0229] A control method for alternately using a recovery cooling high-pressure gas system of a pressure differential coating machine according to a third embodiment of the present invention includes the following specific steps:

[0230] S1: The reaction chamber device 11 is driven downward, so that the reaction chamber device 11 and the workbench device 12 are molded together. The diaphragm fixture 123 of the workbench device 12 is located between the upper reaction chamber 111 and the lower reaction chamber 112. The stop plate 121 of the workbench device 12 is located inside the lower reaction chamber 112. The product fixture 122 is installed on the stop plate 121;

[0231] The upper reaction chamber 111 is vacuumed by the upper vacuum air pump 21, so that the upper reaction chamber 111 is in a vacuum state, and the lower reaction chamber 112 is vacuumed by the lower vacuum air pump 22, so that the lower reaction chamber 112 is in a vacuum state;

[0232] The first recycling air intake state switching switch 23 is switched to the intake state, so that the first air storage tank 203 is in the air supply mode, and the second recycling air intake state switching switch 24 is switched to the recycling state, so that the second air storage tank 204 is in the recycling mode;

[0233] At this time, the first air inlet valve 201 is opened, so that the first air storage tank 203 is connected to the air source 200, and the first air storage tank 203 is in a certain preset high pressure state Pa, and then the first air inlet valve 201 is closed;

[0234] At this time, the second gas storage tank 204 is in a state of a certain preset gas pressure value Pb;

[0235] In summary, step S1:

[0236] The pressure value of the upper reaction chamber 111 is: 0 kgf / cm2;

[0237] The pressure value of the lower reaction chamber 112 is: 0 kgf / cm2;

[0238] The air pressure of the first gas tank is: Pa=7kgf / cm2;

[0239] The air pressure of the second gas tank is: Pb=1kgf / cm2=atmospheric pressure value;

[0240] S2: respectively close the upper vacuum air pump 21 and the lower vacuum air pump 22;

[0241] The workbench device 12 lifts the product fixture 122 to the bottom of the film fixture 123;

[0242] The first switch valve 205 and the high-pressure recovery switch valve 208 are opened, so that the first gas tank 203, the high-pressure conveying recovery pipeline 207, the high-pressure port 114, and the upper reaction cavity 111 are sequentially connected in communication, so that the gas pressure value of the first gas tank 203 = the gas pressure value of the upper reaction cavity 111 = Pa / 2, and then the first switch valve 205 and the high-pressure recovery switch valve 208 are closed;

[0243] The gas pressure of the upper reaction cavity 111 pushes the film on the film fixture 123 to press against the product on the product fixture 122, realizing product film covering;

[0244] At this time, the lower reaction cavity 112 is in a vacuum state;

[0245] At this time, the second gas tank 204 is in a certain preset gas pressure value state Pb;

[0246] At this time, the product film covering is kept for a period of time;

[0247] According to the above step S2:

[0248] The gas pressure value of the upper reaction cavity 111 is 3.5 kgf / cm2;

[0249] The gas pressure value of the lower reaction cavity 112 is 0 kgf / cm2;

[0250] The gas pressure value of the first gas tank is 3.5 kgf / cm2;

[0251] The gas pressure value of the second gas tank is 1 kgf / cm2;

[0252] S3: respectively open the second switch valve 206 and the high-pressure recovery switch valve 208, so that the upper reaction cavity 111, the high-pressure port 114, the high-pressure conveying recovery pipeline 207, and the second gas tank 204 are sequentially connected in communication, so that Pb < the gas pressure value of the upper reaction cavity 111 = the gas pressure value of the second gas tank 204 < Pa / 2, and then close the second switch valve 206 and the high-pressure recovery switch valve 208;

[0253] At this time, the lower reaction cavity 112 is in a vacuum state;

[0254] At this time, the gas pressure value of the first gas tank 203 = Pa / 2;

[0255] According to the above step S3:

[0256] The gas pressure value of the upper reaction cavity 111 is 2.25 kgf / cm2.

[0257] The gas pressure value of the lower reaction cavity 112 is 0 kgf / cm2.

[0258] The gas pressure value of the first gas tank is 3.5 kgf / cm2.

[0259] The gas pressure value of the second gas tank is 2.25 kgf / cm2.

[0260] S4: Open the first switch valve 205, the second gas tank switch valve 3240, and the second cooling switch valve 3220, so that the first gas tank 203, the second second gas pipeline 324, the non-contact reaction cavity cooling pipeline 322, the inner circulation cooling pipeline 321 of the top plate of the reaction cavity device 11, and / or the inner circulation cooling pipeline 321 of the side plate of the reaction cavity device 11, and the exhaust pipeline 325 are sequentially connected in communication, for cooling the top plate and / or the side plate of the upper reaction cavity 111.

[0261] At this time, Pb < the gas pressure value of the first gas tank 203 < Pa / 2.

[0262] When the gas pressure value of the first gas tank 203 is Pb, the first switch valve 205 and the second gas tank switch valve 3240 are closed, and the second gas source switch valve 3230 is started, so that the gas source 200, the first second gas pipeline 323, and the non-contact reaction cavity cooling pipeline 322 are sequentially connected in communication.

[0263] When the cooling of the top plate and / or the side plate of the upper reaction cavity 111 is completed, the first switch valve 205, the second gas tank switch valve 3240, the second cooling switch valve 3220, and the second gas source switch valve 3230 are closed.

[0264] At this time, the lower reaction cavity 112 is in a vacuum state.

[0265] At this time, Pb < the gas pressure value of the upper reaction cavity 111 = the gas pressure value of the second gas tank 204 < Pa / 2.

[0266] Based on the above steps S4:

[0267] The gas pressure value of the upper reaction cavity 111 is 2.25 kgf / cm2.

[0268] The gas pressure value of the lower reaction cavity 112 is 0 kgf / cm2.

[0269] The gas pressure value of the first gas tank is 1-3.5 kgf / cm2.

[0270] The gas pressure value of the second gas tank is 2.25 kgf / cm2.

[0271] S5: The first charge and discharge valve 209 is a (continuous outdoor) discharge valve. The first charge and discharge valve 209 is opened, so that the upper reaction cavity 111 is in an atmospheric pressure state, and then the first charge and discharge valve 209 is closed;

[0272] The second charge and discharge valve 210 is a (continuous outdoor) charge valve. The second charge and discharge valve 210 is opened, so that the lower reaction cavity 112 is in an atmospheric pressure state, and then the second charge and discharge valve 210 is closed;

[0273] At this time, Pb≤ the first gas tank 203 pressure value < Pa / 2;

[0274] At this time, Pb< the second gas tank 204 pressure value < Pa / 2;

[0275] Based on the above step S5:

[0276] The upper reaction cavity 111 pressure value is: 1 kgf / cm2;

[0277] The lower reaction cavity 112 pressure value is: 1 kgf / cm2;

[0278] The first gas tank pressure value is: 1-3.5 kgf / cm2;

[0279] The second gas tank pressure value is: 2.25 kgf / cm2;

[0280] S6: The reaction bin device 11 is driven upward, so that the reaction bin device 11 is separated from the workbench device 12, the workbench device 12 is lowered to reset, and the product is taken out;

[0281] The third switch valve 3341 and the third cooling switch valve 3320 are opened, so that the first gas tank 203, the second third gas supply pipeline 334, the stop plate cooling pipeline 332, and the stop plate cooling port 331 are sequentially connected, and the stop plate 121 is cooled;

[0282] At this time, Pb≤ the first gas tank 203 pressure value < Pa / 2;

[0283] When the first gas tank 203 pressure value=Pb, the third switch valve 3341 is closed, and the third gas source switch valve 3330 is started, so that the gas source 200, the first third gas supply pipeline 333, and the stop plate cooling pipeline 332 are sequentially connected;

[0284] When the cooling of the stop plate 121 is completed, the third switch valve 3341, the third cooling switch valve 3320, and the third gas source switch valve 3330 are closed;

[0285] At this time, the lower reaction cavity 112 is in an atmospheric pressure state;

[0286] At this time, Pb < second gas tank 204 gas pressure value < Pa / 2;

[0287] After step S6:

[0288] The upper reaction cavity 111 gas pressure value is: 1 kgf / cm2;

[0289] The lower reaction cavity 112 gas pressure value is: 1 kgf / cm2;

[0290] The first gas tank gas pressure value is: 1-3.5 kgf / cm2;

[0291] (Generally, after being cooled by the non-contact reaction chamber cooling system 32 and the workbench cooling system 33, the first gas tank gas pressure value will reach 1 kgf / cm2)

[0292] The second gas tank gas pressure value is: 2.25 kgf / cm2;

[0293] S7: Put the diaphragm on the diaphragm fixture 123 and put the product on the product fixture 122;

[0294] The reaction chamber device 11 is driven downward, so that the reaction chamber device 11 is set in a mold with the workbench device 12;

[0295] The upper reaction cavity 111 is vacuum pumped by the upper vacuum air pump 21, so that the upper reaction cavity 111 is in a vacuum state, and the lower reaction cavity 112 is vacuum pumped by the lower vacuum air pump 22, so that the lower reaction cavity 112 is in a vacuum state;

[0296] And the first switch valve 205, the first gas tank switch valve 3140, and the first cooling switch valve 3120 are opened respectively, so that the first gas tank 203, the second first gas pipeline 314, the upper reaction cavity cooling pipeline 312, the upper reaction cavity cooling port 311, the upper reaction cavity 111, and the vacuum port 113 are sequentially connected in communication, for cooling the upper reaction cavity 111;

[0297] At this time, Pb ≤ first gas tank 203 gas pressure value < Pa / 2;

[0298] When Pb ≤ first gas tank 203 gas pressure value, the upper reaction cavity 111 is continuously cooled until the first gas tank 203 gas pressure value = Pb;

[0299] When the first gas tank 203 gas pressure value = Pb, the first switch valve 205 and the first gas tank switch valve 3140 are closed, and the first gas source switch valve 3130 is started, so that the gas source 200, the first first gas pipeline 313, and the upper reaction cavity cooling pipeline 312 are sequentially connected in communication;

[0300] When the cooling of the upper reaction chamber 111 is completed, the first on-off valve 205, the first gas storage tank on-off valve 3140, the first cooling on-off valve 3120, and the first gas source on-off valve 3130 are closed;

[0301] The first recycling air intake state switching switch 23 is switched to the recycling state, so that the first air storage tank 203 is in the recycling mode, and the second recycling air intake state switching switch 24 is switched to the intake state, so that the second air storage tank 204 is in the supply mode;

[0302] At this time, this step S7 realizes switching the working modes of the first gas storage tank 203 and the second gas storage tank 204;

[0303] At this time, the second air inlet valve 202 is opened, so that the second air storage tank 204 is connected to the air source 200, and Pb < the air pressure value of the second air storage tank 204 <Pa / 2的气压状态变更为呈一定预设高压值状态Pa,之后关闭第二进气阀件202,此时,气源200温度<呈一定预设高压值状态Pa的第二储气罐204温度;

[0304] In summary, step S7:

[0305] The pressure value of the upper reaction chamber 111 is: 0 kgf / cm2;

[0306] The pressure value of the lower reaction chamber 112 is: 0 kgf / cm2;

[0307] The air pressure of the first gas tank is: 1kgf / cm2;

[0308] The gas pressure of the second gas tank is: 2.25 + 4.75 = 7 kgf / cm². (The temperature of the gas source 200 is less than the temperature of the second gas tank 204. The temperature of the second gas tank 204 is more suitable for laminating the high-temperature membrane on the product surface in the upper reaction chamber 111, which can effectively improve the product lamination effect.)

[0309] S8: Switching the working modes of the first gas storage tank 203 and the second gas storage tank 204 in the above steps S2-S7, and executing the switched steps S2-S7 in sequence;

[0310] S9: The above steps S2-S8 are repeatedly performed to complete the alternating use of the recovery mode and the gas supply mode of the first gas storage tank 203 and the second gas storage tank 204 of the pressure differential coating machine 1.

[0311] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine, characterized in that: It includes: A pressure differential coating machine (1) comprises a reaction chamber device (11) and a workbench device (12) arranged opposite to the reaction chamber device (11); the reaction chamber device (11) comprises an upper reaction chamber (111) and a lower reaction chamber (112) arranged opposite to the upper reaction chamber (111); A gas processing system (2) comprising an upper vacuum air pump (21) connected to a vacuum port (113) of an upper reaction chamber (111), a lower vacuum air pump (22) connected to a vacuum port (113) of a lower reaction chamber (112), a gas source (200), a first gas inlet valve component (201) connected to the gas source (200), a first gas storage tank (203) connected to the first gas inlet valve component (201), a second gas inlet valve component (202) connected to the gas source (200), a second gas storage tank (204) connected to the second gas inlet valve component (202), a first on / off valve component (205) connected to the first gas storage tank (203), and a second on / off valve component (206) connected to the second gas storage tank (204). The invention relates to a second switch valve component (206) and a high-pressure delivery and recovery pipeline (207) respectively connected to the connection between the first switch valve component (205) and the second switch valve component (206) and the high-pressure port (114) of the upper reaction chamber (111); the high-pressure delivery and recovery pipeline (207) is connected to a high-pressure recovery switch valve component (208); the upper reaction chamber (111) is connected to a first gas charging and discharging valve component (209); the lower reaction chamber (112) is connected to a second gas charging and discharging valve component (210); and a gas cooling system (3) is installed between the pressure differential coating machine (1) and the first gas storage tank (203), and between the pressure differential coating machine (1) and the second gas storage tank (204).

2. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 1, characterized in that: The first gas filling and discharging valve component (209) is externally connected to the high-pressure delivery and recovery pipeline (207).

3. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 1, characterized in that: The gas source (200) is connected to a gas source triplex (2000), and the first gas inlet valve component (201) and the second gas inlet valve component (202) are respectively connected to the gas source triplex (2000).

4. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 1, characterized in that: The gas cooling system (3) comprises a vacuum stage upper reaction chamber cooling system (31), a non-contact reaction chamber cooling system (32) and a workbench cooling system (33).

5. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 4, characterized in that: The vacuum stage upper reaction chamber cooling system (31) comprises a plurality of upper reaction chamber cooling ports (311) opened at the top of the upper reaction chamber (111) and connected to the top of the upper reaction chamber (111), an upper reaction chamber cooling pipe (312) connected to the upper reaction chamber cooling port (311), and two first air supply pipes connected to the upper reaction chamber cooling pipe (312), wherein the upper reaction chamber cooling pipe (312) is respectively connected to a first adjustable one-way throttle valve (3121), a first A cooling switch valve component (3120) is provided. The first first gas supply pipeline (313) is connected to a first gas source switch valve component (3130). One end of the first first gas supply pipeline (313) is connected to a gas source (200). The second first gas supply pipeline (314) is connected to a first gas storage tank switch valve component (3140). One end of the second first gas supply pipeline (314) is connected to a connection between the first switch valve component (205) and the second switch valve component (206).

6. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 4, characterized in that: The non-contact reaction chamber cooling system (32) comprises an internal circulation cooling pipe (321) provided inside the top plate of the reaction chamber device (11) and / or inside the side plate of the reaction chamber device (11), a non-contact reaction chamber cooling pipe (322) connected to one end of the internal circulation cooling pipe (321), two second air supply pipes connected to the non-contact reaction chamber cooling pipe (322), and an exhaust pipe (325) connected to the other end of the internal circulation cooling pipe (321), wherein the non-contact reaction chamber cooling pipe (322) is respectively connected to A second adjustable one-way throttle valve (3221) and a second cooling switch valve component (3220) are provided. The first second air supply pipeline (323) is connected to a second air source switch valve component (3230). One end of the first second air supply pipeline (323) is connected to an air source (200). The second second air supply pipeline (324) is connected to a second air storage tank switch valve component (3240). One end of the second second air supply pipeline (324) is connected to a connection between the first switch valve component (205) and the second switch valve component (206).

7. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 4, characterized in that: The workbench cooling system (33) comprises a plurality of stop plate cooling ports (331) penetrating the stop plate (121) of the workbench cooling system (33), a stop plate cooling pipe (332) connected to the stop plate cooling port (331), and two third air supply pipes connected to the stop plate cooling pipe (332), wherein the stop plate cooling pipe (332) is respectively connected to a third adjustable one-way throttle valve (3321) and a third cooling switch valve member (3320), wherein the first of the stop plate cooling pipes (332) is connected to the stop plate cooling pipe (332). The third gas supply pipeline (333) is connected to a third gas source switch valve component (3330), one end of the first third gas supply pipeline (333) is connected to the gas source (200), the first gas storage tank (203) is connected to a third switch valve component (3341), the second gas storage tank (204) is connected to a fourth switch valve component (3342), and one end of the second third gas supply pipeline (334) is respectively connected to the third switch valve component (3341) and the fourth switch valve component (3342).

8. A system for alternately using and recovering high-pressure gas for cooling a pressure differential coating machine according to claim 1, characterized in that: The first air storage tank (203) is connected to a first air recovery state switching switch (23), and the second air storage tank (204) is connected to a second air recovery state switching switch (24).

9. A control method for the alternate use recovery cooling high pressure gas system of a pressure differential coating machine, characterized in that: The method is achieved by alternately using a recovery cooling high-pressure gas system of a pressure differential coating machine according to any one of claims 1 to 8, and comprises the following steps: S1: The reaction chamber device (11) is driven downward, so that the reaction chamber device (11) and the workbench device (12) are molded together, the diaphragm fixture (123) of the workbench device (12) is located between the upper reaction chamber (111) and the lower reaction chamber (112), and the stop plate (121) of the workbench device (12) is located inside the lower reaction chamber (112), and the product fixture (122) is installed on the stop plate (121); The upper reaction chamber (111) is vacuum-pumped by the upper vacuum air pump (21), so that the upper reaction chamber (111) is in a vacuum state; and the lower reaction chamber (112) is vacuum-pumped by the lower vacuum air pump (22), so that the lower reaction chamber (112) is in a vacuum state; The first recycling air intake state switching switch (23) is switched to the intake state, so that the first air storage tank (203) is in the air supply mode, and the second recycling air intake state switching switch (24) is switched to the recycling state, so that the second air storage tank (204) is in the recycling mode; At this time, the first air inlet valve (201) is opened, so that the first air storage tank (203) is connected to the air source (200), and the first air storage tank (203) is in a certain preset high pressure state Pa, and then the first air inlet valve (201) is closed; At this time, the second gas storage tank (204) is in a state of a certain preset gas pressure value Pb; S2: Turn off the upper vacuum air pump (21) and the lower vacuum air pump (22) respectively; The workbench device (12) lifts the product fixture (122) to the bottom of the diaphragm fixture (123); Open the first switching valve member (205) and the high-pressure recovery switching valve member (208) respectively, so that the first gas storage tank (203), the high-pressure delivery and recovery pipeline (207), the high-pressure port (114), and the upper reaction chamber (111) are connected in sequence, and make the air pressure value of the first gas storage tank (203) = the air pressure value of the upper reaction chamber (111) = Pa / 2. Then close the first switching valve member (205) and the high-pressure recovery switching valve member (208); The air pressure in the upper reaction chamber (111) pushes the diaphragm on the diaphragm jig (123) against the product on the product jig (122) to achieve product film coating; At this time, the lower reaction chamber (112) is in a vacuum state; At this time, the second gas storage tank (204) is in a state of a certain preset air pressure value Pb; At this time, the product film coating is kept warm and under pressure for a period of time; S3: Open the second switching valve member (206) and the high-pressure recovery switching valve member (208) respectively, so that the upper reaction chamber (111), the high-pressure port (114), the high-pressure delivery and recovery pipeline (207), and the second gas storage tank (204) are connected in sequence, and make Pb < the air pressure value of the upper reaction chamber (111) = the air pressure value of the second gas storage tank (204) < Pa / 2. Then close the second switching valve member (206) and the high-pressure recovery switching valve member (208); At this time, the lower reaction chamber (112) is in a vacuum state; At this time, the air pressure value of the first gas storage tank (203) = Pa / 2; S4: Open the first switching valve member (205), the second gas storage tank switching valve member (3240), and the second cooling switching valve member (3220) respectively, so that the first gas storage tank (203), the second second gas supply pipeline (324), the non-contact reaction chamber cooling pipeline (322), the internal circulation cooling pipeline (321) of the top plate of the reaction chamber device (11) and / or the internal circulation cooling pipeline (321) of the side plate of the reaction chamber device (11), and the exhaust pipeline (s325) are connected in sequence to cool the top plate and / or side plate of the upper reaction chamber (111); At this time, Pb ≤ the air pressure value of the first gas storage tank (203) < Pa / 2; When the air pressure value of the first gas storage tank (203) = Pb, close the first switching valve member (205) and the second gas storage tank switching valve member (3240), and start the second gas source switching valve member (3230) to connect the gas source (200), the first second gas supply pipeline (323), and the non-contact reaction chamber cooling pipeline (322) in sequence; When the cooling of the top plate and / or side plate of the upper reaction chamber (111) is completed, close the first switching valve member (205), the second gas storage tank switching valve member (3240), the second cooling switching valve member (3220), and the second gas source switching valve member (3230); At this time, the lower reaction chamber (112) is in a vacuum state; At this time, Pb < the air pressure value of the upper reaction chamber (111) = the air pressure value of the second gas storage tank (204) < Pa / 2; S5: The first charging and discharging valve member (209) is a discharging valve member. Open the first charging and discharging valve member (209) to make the upper reaction chamber (111) in an atmospheric pressure state. Then close the first charging and discharging valve member (209); The second gas charging and discharging valve component (210) is a gas charging valve component. When the second gas charging and discharging valve component (210) is opened, the lower reaction chamber (112) is in an atmospheric pressure state, and then the second gas charging and discharging valve component (210) is closed. At this time, Pb≤the pressure value of the first gas storage tank (203) <Pa / 2; At this time, Pb<the pressure value of the second gas storage tank (204) <Pa / 2; S6: the reaction chamber device (11) is driven upward, so that the reaction chamber device (11) and the workbench device (12) are separated from the mold, and the workbench device (12) lowers and resets the product fixture (122) to take out the product; Opening the third on-off valve (3341) and the third cooling on-off valve (3320) respectively, so that the first gas storage tank (203), the second third gas supply pipe (334), the stop plate cooling pipe (332), and the stop plate cooling port (331) are connected in sequence, so as to cool the stop plate (121); At this time, Pb≤the pressure value of the first gas storage tank (203) <Pa / 2; When the air pressure value of the first air storage tank (203) equals Pb, the third on-off valve (3341) is closed, and the third air source on-off valve (3330) is activated, so that the air source (200), the first third air supply pipeline (333), and the stop plate cooling pipeline (332) are connected in sequence; When the cooling of the stop plate (121) is completed, the third on-off valve component (3341), the third cooling on-off valve component (3320), and the third gas source on-off valve component (3330) are closed; At this time, the lower reaction chamber (112) is at atmospheric pressure; At this time, Pb<the pressure value of the second gas storage tank (204) <Pa / 2; S7: Place the diaphragm onto the diaphragm jig (123), and place the product onto the product jig (122); The reaction chamber device (11) is driven downward, so that the reaction chamber device (11) and the workbench device (12) are molded together; The upper reaction chamber (111) is vacuum-pumped by the upper vacuum air pump (21), so that the upper reaction chamber (111) is in a vacuum state; and the lower reaction chamber (112) is vacuum-pumped by the lower vacuum air pump (22), so that the lower reaction chamber (112) is in a vacuum state; Furthermore, the first on-off valve (205), the first gas storage tank on-off valve (3140), and the first cooling on-off valve (3120) are opened respectively, so that the first gas storage tank (203), the second first gas supply pipe (314), the upper reaction chamber cooling pipe (312), the upper reaction chamber cooling port (311), the upper reaction chamber (111), and the vacuum port (113) are connected in sequence, so as to cool the upper reaction chamber (111); At this time, Pb≤the pressure value of the first gas storage tank (203) <Pa / 2; When Pb≤the pressure value of the first gas storage tank (203), the upper reaction chamber (111) is continuously cooled until the pressure value of the first gas storage tank (203) equals Pb; When the air pressure value of the first gas storage tank (203) = Pb, close the first switching valve (205) and the first gas storage tank switching valve (3140), and start the first gas source switching valve (3130) so that the gas source (200), the first first gas supply pipeline (313), and the upper reaction chamber cooling pipeline (312) are connected in sequence; When the cooling of the upper reaction chamber (111) is completed, close the first switching valve (205), the first gas storage tank switching valve (3140), the first cooling switching valve (3120), and the first gas source switching valve (3130); Switch the first recovery intake state switching switch (23) to the recovery state so that the first gas storage tank (203) is in the recovery mode, and switch the second recovery intake state switching switch (24) to the intake state so that the second gas storage tank (204) is in the gas supply mode; At this time, in this step S7, the working modes of the first gas storage tank (203) and the second gas storage tank (204) are switched; At this time, open the second intake valve (202) so that the second gas storage tank (204) is connected to the gas source (200), and change the air pressure state where Pb < the air pressure value of the second gas storage tank (204) < Pa / 2 to a certain preset high pressure value state Pa. Then close the second intake valve (202). At this time, the temperature of the gas source (200) < the temperature of the second gas storage tank (204) in a certain preset high pressure value state Pa; S8: Switch the working modes of the first gas storage tank (203) and the second gas storage tank (204) in the above steps S2 - S7, and sequentially execute the switched steps S2 - S7; S9: Repeatedly execute the above steps S2 - S8 to complete the alternate use of the recovery mode and the gas supply mode of the first gas storage tank (203) and the second gas storage tank (204) of the differential pressure coating machine (1).

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