Wafer carrier and wafer transfer device

Abstract

This invention provides a wafer stage and a wafer transfer device, belonging to the field of semiconductor wafer processing equipment technology. The wafer stage includes a tray base, a tray-side air-bearing guide module, a support module, a lifting and leveling module, a rotation drive module, a gravity balance module, and an air-suction tray. The bottom air-bearing support of the tray base includes an inner lateral drive support area and an outer tray area. Two sets of tray-side air-bearing guide modules with lateral air-bearing pads are installed in the lateral drive support area for supporting and air-bearing the wafer stage relative to the X-axis drive beam. The support module and the air-suction tray are arranged in the tray area. The wafer stage of this application can be lifted, leveled, and rotated. The center of mass of the stage does not coincide with the X-axis drive axis, resulting in high positioning accuracy and stable wafer transfer, facilitating its application in semiconductor testing, manufacturing, and high-precision instrument drive fields.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor wafer equipment technology, specifically relating to a wafer stage and a wafer transfer device. Background Technology

[0002] In semiconductor wafer inspection and processing equipment, wafers typically need to be supported and positioned by a stage. However, existing stages generally only allow for height adjustment and rotation around the Z-axis, and cannot adjust the flatness of the XY plane. Therefore, to improve the high-precision adjustability of wafer support, it is necessary to design a wafer stage with lifting, Z-axis rotation, XY leveling, and Z-axis separation lifting capabilities, while ensuring that the stage's center of mass does not coincide with the X-axis drive axis to guarantee stable lateral position detection. This would adapt to high-precision wafer support and support scenarios such as overlay, defect, CD (critical dimension) quantity inspection, and processing. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a wafer stage and a wafer transfer device, which can solve the above-mentioned problems.

[0004] A wafer stage includes a tray base, a tray-side air-bearing guide module, a support module, a lifting and leveling module, a rotation drive module, a gravity balance module, and an air-suction tray. The tray base with bottom air-bearing support includes an inner lateral drive support area and an outer tray area. Two sets of tray-side air-bearing guide modules with lateral air-bearing pads are installed in the lateral drive support area for supporting and air-bearing the wafer stage relative to the X-axis drive beam. The support module and the air-suction tray are arranged in the tray area, and the lifting and leveling module, the rotation drive module, and the gravity balance module are arranged between the tray base and the support module.

[0005] Furthermore, the carrier base includes a base plate, a base lower air flotation assembly, and a base translation braking assembly. Multiple base lower air flotation assemblies are disposed on the bottom surface of the base plate, and the base translation braking assembly is disposed on the bottom surface of the base plate corresponding to the centroid of the wafer stage.

[0006] Furthermore, the carrier base also includes a transverse stator adapter plate, which is installed on the base plate corresponding to the carrier area via base columns.

[0007] Furthermore, the carrier plate side air flotation guide module includes a transverse air flotation guide frame and a side air flotation pad assembly. Four transverse air flotation guide frames are arranged on the base plate corresponding to the transverse drive support area of ​​the carrier plate base, and four sets of side air flotation pad assemblies are arranged in pairs on the corresponding transverse air flotation guide frames.

[0008] Furthermore, the support module includes a support plate and a lower leaf spring; the lower leaf spring has a central opening and grooves along the radial portion forming different leaf spring damping zones. The leaf spring damping zones are connected to the upper surface of the base plate / transverse stator adapter plate near the central opening via a lower leaf spring transition adapter or to the lower surface of the support plate via an upper leaf spring adapter plate.

[0009] Furthermore, the lifting and leveling module includes a lifting voice coil motor, a lifting grating ruler assembly, a lifting subdivision box, and a lifting limit assembly; the bottoms of multiple lifting voice coil motors are connected to the corresponding lifting mounting countersunk holes in the base plate / transverse stator adapter plate, and the tops of the lifting voice coil motors are connected to the support plate; the lifting grating ruler assembly is connected to the support plate through a grating frame; the lifting grating ruler assembly is electrically connected to the lifting subdivision box; the lifting limit assembly monitors the Z-axis position and limit of the lifting voice coil motor through both mechanical and photoelectric dual-mode monitoring.

[0010] Furthermore, the rotary drive module includes an air-float base plate, an air-float cylinder shaft assembly, two sets of arc-shaped voice coil motors, and a rotary leaf spring. The air-float base plate is located on the upper surface of the middle part of the lower leaf spring. The bottom of the air-float cylinder shaft assembly is connected to the upper surface of the air-float base plate, and the top of the air-float cylinder shaft assembly is connected to the middle part of the bottom surface of the rotary leaf spring. The outer periphery of the rotary leaf spring is connected to the top surface of the support plate. The bottom surface of the transition plate on the leaf spring is connected to the air-float base plate. The stators of the two sets of arc-shaped voice coil motors are installed on the transition plate on the leaf spring, and the movers are connected to the outer periphery of the air-float cylinder shaft assembly, thereby driving the support plate to rotate around the axis of the air-float cylinder shaft assembly.

[0011] Furthermore, the rotary drive module also includes an air float head and a rotary magnet. The outer periphery of the rotary leaf spring, which is triangular in shape and has concave sides, is connected to the air float locking mounting hole opened on the top surface of the support plate through the air float head and the rotary magnet. The blowing and sucking air of the air float head drives the rotary magnet to engage and disengage with the top surface of the support plate.

[0012] Furthermore, the gravity balance module includes a magnetic spring transition sleeve, a magnetic spring mover, and a magnetic spring stator; the top of the magnetic spring transition sleeve is connected to the bottom surface of the support plate or the suction base plate, the bottom of the magnetic spring mover is connected to the lower part of the magnetic spring transition sleeve, the lower part of the magnetic spring mover is non-contactly embedded in the receiving cavity of the magnetic spring stator, and the bottom of the magnetic spring stator is connected to the gravity balance mounting countersunk hole opened in the base plate or the transverse stator adapter plate.

[0013] The present invention also provides a wafer transfer device, which includes two sets of Y-axis drive modules, an X-axis drive module, and a wafer carrier module disposed on a vibration damping stage. The wafer carrier module adopts the aforementioned wafer stage. The X-axis drive module is longitudinally driven at both ends and disposed between the two sets of Y-axis drive modules. The wafer carrier module is laterally driven and connected to the X-axis drive module, and the centroid of the wafer carrier module is offset from the lateral movement centerline of the X-axis drive module. A lateral grating assembly is connected to the outer ends of the two sets of Y-axis drive modules and is located outside the wafer carrier module.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the wafer stage of this application can be raised, lowered, leveled, and rotated. The stage is driven to translate and support the wafer in sections. The center of mass of the stage does not coincide with the X-drive axis, resulting in high positioning accuracy and stable wafer transfer. It provides a stable vibration reduction support solution for overlay alignment and inspection, wafer quantity inspection, wafer processing, chip packaging and inspection, high-precision instruments, etc., which is convenient for promotion and application in the fields of semiconductor inspection, manufacturing and high-precision instrument driving. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the wafer stage of the present invention;

[0016] Figure 2 and Figure 3 Schematic diagrams of the carrier base and the air-bearing guide module on the carrier side from different perspectives;

[0017] Figure 4 This is a schematic diagram of a partial structure of the wafer stage;

[0018] Figure 5 for Figure 4 A sectional view;

[0019] Figure 6 This is a schematic diagram of a gas suction carrier plate;

[0020] Figure 7 This is a schematic diagram of a wafer transfer device;

[0021] Figure 8 This is a schematic diagram of a semiconductor device.

[0022] In the picture,

[0023] 10. Carrier base; 11. Base plate; 12. Lower air flotation assembly; 13. Base translation brake assembly; 14. Transverse stator adapter plate; 15. Base column;

[0024] 20. Carrier side air flotation guide module; 21. Lateral air flotation guide frame; 22. Side air flotation pad assembly; 23. Lateral upper cover plate assembly;

[0025] 30. Support module; 31. Support plate; 32. Lower leaf spring; 33. Lower transition adapter for leaf spring; 34. Upper adapter plate for leaf spring;

[0026] 40. Lifting and leveling module; 41. Lifting voice coil motor; 42. Lifting grating ruler assembly; 43. Lifting subdivision box; 44. Lifting limit assembly;

[0027] 50. Rotary drive module; 51. Air-floating base plate; 52. Air-floating cylinder shaft assembly; 53. Two sets of arc-shaped voice coil motors; 54. Rotary leaf spring; 55. Air-floating head; 56. Rotary magnet; 57. Adhesive base plate; 58. Rotary grating assembly;

[0028] 60. Gravity balance module; 61. Magnetic spring transition sleeve; 62. Magnetic spring mover; 63. Magnetic spring stator;

[0029] 70. Air suction carrier; 71. Carrier body; 72. Carrier suction lug; 73. Wafer suction block; 74. Wafer fork slot;

[0030] 100. Vibration damping platform;

[0031] 200, Y-axis drive module;

[0032] 300, X-axis drive module;

[0033] 400. Wafer carrier module;

[0034] 500. Lateral grating assembly;

[0035] 600. Transfer frame;

[0036] 1000. Transfer device;

[0037] 2000, Optical head;

[0038] 3000, Controller. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] A wafer carrier, see Figures 1-6 The wafer stage includes a carrier base 10, a carrier side air-bearing guide module 20, a support module 30, a lifting and leveling module 40, a rotation drive module 50, a gravity balance module 60, and an air suction carrier 70.

[0041] Arrangement: The bottom air-bearing support tray base 10 includes an inner lateral drive support area and an outer tray area; two sets of tray-side air-bearing guide modules 20 with lateral air-bearing pads are installed in the lateral drive support area for supporting and air-bearing the wafer stage relative to the X-axis drive beam; a support module 30 and an air-suction tray 70 are set in the tray area, and a lifting and leveling module 40, a rotation drive module 50, and a gravity balance module 60 are set between the tray base 10 and the support module 30.

[0042] Among them, see Figure 2 and Figure 3 The carrier base 10 includes a base plate 11, a base lower air flotation assembly 12, and a base translation brake assembly 13. Multiple base lower air flotation assemblies 12 are disposed on the bottom surface of the base plate 11, and the base translation brake assembly 13 is disposed on the bottom surface of the base plate 11 corresponding to the centroid of the wafer stage.

[0043] The carrier base 10 also includes a transverse stator adapter plate 14, which is mounted on the base plate 11 corresponding to the carrier area via a base column 15.

[0044] Specifically, the inner end of the transverse stator adapter plate 14 is connected to the drive actuator end of the X-axis, and the bottom of the lifting and leveling module 40, the rotation drive module 50, and the gravity balance module 60 are supported on the upper part of the transverse stator adapter plate 14.

[0045] The air flotation assembly 12 under the base of the tray base 10 blows air away from the top surface of the shock-absorbing platform, thus providing floating support for the wafer stage. The base translation brake assembly 13 draws air away from the top surface of the shock-absorbing platform, thus acting as a brake for the translation of the wafer stage.

[0046] The carrier plate side air flotation guide module 20 includes a transverse air flotation guide frame 21 and a side air flotation pad assembly 22. The four transverse air flotation guide frames 21 are arranged on the base plate 11 corresponding to the transverse drive support area of ​​the carrier plate base 10, and the four sets of side air flotation pad assemblies 22 are arranged in pairs on the corresponding transverse air flotation guide frames 21.

[0047] The four sets of side air cushion assemblies 22 arranged in pairs face each other and form the crossbeam of the X-axis drive module. The side air cushion assemblies 22 arranged in pairs non-contactly clamp the two sides of the crossbeam, playing a role in air buoyancy guidance and support.

[0048] Furthermore, a transverse upper cover plate assembly 23 is also provided on top of the four transverse air-bearing guide frames 21. The transverse upper cover plate 23 has a partially multi-layered plate structure, including a top and bottom rigid plate and a middle damping plate. The transverse upper cover plate assembly 23 serves to connect the four transverse air-bearing guide frames 21 and enhance stability.

[0049] A lifting subdivision box 43 can be installed on the transverse upper cover plate assembly 23 to improve the control accuracy of lifting, leveling, and rotation around Z angle.

[0050] The support module 30 includes a support plate 31 and a lower leaf spring 32. The lower leaf spring 32 has a central opening and grooves along the radial portion to form different leaf damping zones. The leaf damping zones are connected to the upper surface of the base plate 11 / transverse stator adapter plate 14 via a lower leaf spring transition adapter 33 near the central opening, or connected to the lower surface of the support plate 31 via an upper leaf spring adapter plate 34.

[0051] The lifting and leveling module 40 includes a lifting voice coil motor 41, a lifting grating ruler assembly 42, a lifting subdivision box 43, and a lifting limit assembly 44. The bottoms of the multiple lifting voice coil motors 41 are connected to the corresponding lifting mounting countersunk holes of the base plate 11 / transverse stator adapter plate 14, and the tops of the lifting voice coil motors 41 are connected to the support plate 31. The lifting grating ruler assembly 42 is connected to the support plate 31 through a grating frame. The lifting grating ruler assembly 42 is electrically connected to the lifting subdivision box 43. The lifting limit assembly 44 monitors the Z-axis position and limit of the lifting voice coil motor 41 through both mechanical and photoelectric dual-mode monitoring.

[0052] The rotary drive module 50 includes an air-float base plate 51, an air-float cylinder shaft assembly 52, two sets of arc-shaped voice coil motors 53, and a rotary leaf spring 54.

[0053] Specifically, the air-float base plate 51 is located on the upper surface of the middle part of the lower leaf spring 32, the bottom of the air-float cylinder shaft assembly 52 is connected to the upper surface of the air-float base plate 51, the top of the air-float cylinder shaft assembly 52 is connected to the middle part of the bottom surface of the rotating leaf spring 54, and the outer periphery of the rotating leaf spring 54 is connected to the top surface of the support plate 31; the bottom surface of the upper transition plate 34 of the leaf spring is connected to the air-float base plate 51, the stators of the two sets of arc-shaped voice coil motors 53 are installed on the upper transition plate 34 of the leaf spring, and the movers are connected to the outer periphery of the air-float cylinder shaft assembly 52, thereby driving the support plate 31 to rotate around the axis of the air-float cylinder shaft assembly 52.

[0054] The air float and air float shaft of the air float shaft assembly 52 are configured such that the air float shaft is inserted into the cavity of the air float from below, the bottom of the air float shaft is connected to the upper surface of the air float base plate 51, and the top of the air float is connected to the middle of the bottom surface of the rotating leaf spring 54.

[0055] The rotary drive module 50 also includes an air float head 55 and a rotary magnet 56. The outer periphery of the rotary leaf spring 54, which is triangular in shape and has concave sides, is connected to the air float locking mounting hole opened on the top surface of the support plate 31 through the air float head 55 and the rotary magnet 56. The blowing and sucking air of the air float head 55 drives the rotary magnet 56 to engage and disengage with the top surface of the support plate 31.

[0056] Furthermore, the rotary drive module 50 also includes a suction base plate 57. The air float locking mounting hole of the support plate 31 is a through hole. The suction base plate 57 is located below the support plate 31 and blocks the air float locking mounting hole. The bottom of the rotating magnet 56 is magnetically attracted to the suction base plate 57 and is controlled by the air float head 55 to engage or disengage.

[0057] In the specific example, the air buoy 55 is a cylindrical structure with an opening at the bottom, and the rotating magnet 56 is a columnar structure, with the rotating magnet 56 embedded in the cylindrical cavity of the air buoy 55. Furthermore, a porous graphite pad is also provided on the bottom surface of the air buoy 55 around the outer periphery of the rotating magnet 56.

[0058] Furthermore, the rotary drive module 50 also includes a rotary grating assembly 58, which is disposed on a support disk 31 on the outside of an air bearing head 55.

[0059] The gravity balance module 60 includes a magnetic spring transition sleeve 61, a magnetic spring mover 62, and a magnetic spring stator 63. The top of the magnetic spring transition sleeve 61 is connected to the bottom surface of the support plate 31 or the suction base plate 57. The bottom of the magnetic spring mover 62 is connected to the lower part of the magnetic spring transition sleeve 61. The lower part of the magnetic spring mover 62 is non-contactly embedded in the receiving cavity of the magnetic spring stator 63. The bottom of the magnetic spring stator 63 is connected to the gravity balance mounting countersunk hole opened in the base plate 11 or the transverse stator adapter plate 14.

[0060] See Figure 6 The air suction carrier 70 includes a carrier body 71, with multiple carrier suction lugs 72 radially extended on the outer periphery of the carrier body 71, wafer suction blocks 73 on the carrier suction lugs 72, and two wafer fork slots 74 formed on the upper surface of the carrier body 71.

[0061] The bottom of the carrier plate 71 is connected to the adapter bolt at the air float head 55 of the rotary drive module 50.

[0062] A wafer transfer device, see Figure 7 The wafer transfer device includes two sets of Y-axis drive modules 200, X-axis drive modules 300 and wafer carrier modules 400 mounted on a vibration damping platform 100. The wafer carrier module 400 adopts the aforementioned wafer carrier platform.

[0063] The X-axis drive module 300 is longitudinally driven at both ends and positioned between two sets of Y-axis drive modules 200. The wafer carrier module 400 is laterally driven and connected to the X-axis drive module 300. The centroid of the wafer carrier module 400 is offset from the transverse center line of the X-axis drive module 300. A transverse grating assembly 500 is connected to the outer ends of the two sets of Y-axis drive modules 200 and positioned outside the wafer carrier module 400.

[0064] The vibration damping mechanism of the vibration damping test bench 100 adopts a dual mode of active vibration damping and passive vibration isolation. The vibration damping mechanism includes a vibration isolation airbag unit and a vibration damping driver; multiple vibration damping drivers are set on the outer periphery of the vibration isolation airbag unit through vibration damping uprights.

[0065] The adjustable stiffness of the vibration isolation airbag unit supports the longitudinal beam of the Y-axis drive module 200 above, achieving passive vibration reduction.

[0066] The driver actuator of the vibration damping actuator is connected to the side end face of the longitudinal beam, and active vibration reduction is achieved by controlling the lifting and lowering.

[0067] The transverse grating assembly 500 includes a longitudinal grating frame, a grating air-bearing adapter block, a transverse end air-bearing pad, a grating crossbeam, a transverse grating reading head, and a transverse grating ruler. The inner end of the longitudinal grating frame is connected to the outer side of the crossbeam end of the X-axis drive module 300, and the outer end of the longitudinal grating frame is connected to the grating air-bearing adapter block. One end of the grating air-bearing adapter block is connected to the transverse end air-bearing pad facing the longitudinal beam, and the other end of the grating air-bearing adapter block is connected to the end of the grating crossbeam. The transverse grating ruler is mounted on the grating crossbeam, and the transverse grating reading head is mounted on the disk base 10 of the wafer disk module 400. A transfer rack 600 is provided below the vibration damping platform 100. The transfer rack 600 includes a rack body and rack feet and casters located below the rack body, wherein the rack feet are wedge-shaped adjustable feet.

[0068] A semiconductor device, see Figure 8 The semiconductor equipment includes a transfer device 1000, an optical head 2000, and a controller 3000. The transfer device 1000 adopts the aforementioned wafer transfer device. The optical head 2000 is configured as one of a dot matrix measurement optical system, a bright field wafer measurement optical system, a dark field wafer measurement optical system, or a lithography optical system according to different scenario requirements. The controller 3000 is electrically connected to the transfer device 1000 and the optical head 2000 for driving and optical control, as well as optical image processing.

[0069] This solution has been used in wafer nanoscale overlay inspection systems and wafer quantity inspection systems with and without images (including bright field and dark field). It is expected to be extended to processing scenarios such as photolithography, PCB, and IC substrate in the future.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer carrier, characterized in that, The wafer stage includes a tray base (10), a tray-side air-bearing guide module (20), a support module (30), a lifting and leveling module (40), a rotation drive module (50), a gravity balance module (60), and an air-suction tray (70). The bottom air-bearing support tray base (10) includes an inner lateral drive support area and an outer tray area; two sets of tray-side air-bearing guide modules (20) with lateral air-bearing pads are installed in the lateral drive support area for supporting and air-bearing the wafer stage relative to the X-axis drive beam. A support module (30) and an air suction tray (70) are set in the tray area. A lifting and leveling module (40), a rotation drive module (50), and a gravity balance module (60) are set between the tray base (10) and the support module (30).

2. The wafer stage according to claim 1, characterized in that: The tray base (10) includes a base plate (11), a base lower air flotation assembly (12), and a base translation brake assembly (13). Multiple base lower air flotation assemblies (12) are disposed on the bottom surface of the base plate (11), and the base translation brake assembly (13) is disposed on the bottom surface of the base plate (11) corresponding to the centroid of the wafer stage.

3. The wafer stage according to claim 2, characterized in that: The carrier base (10) also includes a transverse stator transition plate (14), which is installed on the base plate (11) corresponding to the carrier area via a base column (15).

4. The wafer stage according to claim 2, characterized in that: The carrier plate side air flotation guide module (20) includes a transverse air flotation guide frame (21) and a side air flotation pad assembly (22). Four transverse air flotation guide frames (21) are arranged on the base plate (11) corresponding to the transverse drive support area of ​​the carrier plate base (10). Four sets of side air flotation pad assemblies (22) are arranged in pairs on the corresponding transverse air flotation guide frames (21).

5. The wafer stage according to claim 3, characterized in that: The support module (30) includes a support plate (31) and a lower leaf spring (32); the lower leaf spring (32) has a central opening and grooves along the radial portion to form different leaf damping zones. The leaf damping zones are connected to the upper surface of the base plate (11) / transverse stator transition plate (14) near the central opening end through the lower transition adapter (33) of the leaf spring or to the lower surface of the support plate (31) through the upper transition plate (34) of the leaf spring.

6. The wafer stage according to claim 5, characterized in that: The lifting and leveling module (40) includes a lifting voice coil motor (41), a lifting grating ruler assembly (42), a lifting subdivision box (43), and a lifting limit assembly (44). The bottoms of multiple lifting voice coil motors (41) are connected to the corresponding lifting mounting countersunk holes of the base plate (11) / transverse stator adapter plate (14), and the tops of the lifting voice coil motors (41) are connected to the support plate (31). The lifting grating ruler assembly (42) is connected to the support plate (31) through the grating frame. The lifting grating ruler assembly (42) is electrically connected to the lifting subdivision box (43). The lifting limit assembly (44) monitors the Z-axis position and limit of the lifting voice coil motor (41) through mechanical and photoelectric dual modes.

7. The wafer stage according to claim 5, characterized in that: The rotary drive module (50) includes an air-floating base plate (51), an air-floating cylinder shaft assembly (52), two sets of arc-shaped voice coil motors (53) and a rotary leaf spring (54). The air-float base plate (51) is set on the upper surface of the middle part of the lower leaf spring (32). The bottom of the air-float cylinder shaft assembly (52) is connected to the upper surface of the air-float base plate (51). The top of the air-float cylinder shaft assembly (52) is connected to the middle part of the bottom surface of the rotating leaf spring (54). The outer periphery of the rotating leaf spring (54) is connected to the top surface of the support plate (31). The bottom surface of the upper transition plate (34) of the leaf spring is connected to the air-float base plate (51). The stators of the two sets of arc voice coil motors (53) are installed on the upper transition plate (34) of the leaf spring, and the movers are connected to the outer periphery of the air-float cylinder shaft assembly (52), thereby driving the support plate (31) to rotate around the axis of the air-float cylinder shaft assembly (52).

8. The wafer stage according to claim 7, characterized in that: The rotary drive module (50) also includes an air float head (55) and a rotary magnet (56). The outer periphery of the rotary leaf spring (54), which is triangular in shape and has concave sides, is connected to the air float locking mounting hole opened on the top surface of the support plate (31) through the air float head (55) and the rotary magnet (56). The blowing and sucking air of the air float head (55) drives the rotary magnet (56) to engage and disengage with the top surface of the support plate (31).

9. The wafer stage according to claim 5, characterized in that: The gravity balance module (60) includes a magnetic spring transition sleeve (61), a magnetic spring mover (62), and a magnetic spring stator (63). The top of the magnetic spring transition sleeve (61) is connected to the bottom surface of the support plate (31) or the suction base plate (57). The bottom of the magnetic spring mover (62) is connected to the lower part of the magnetic spring transition sleeve (61). The lower part of the magnetic spring mover (62) is non-contactly embedded in the receiving cavity of the magnetic spring stator (63). The bottom of the magnetic spring stator (63) is connected to the gravity balance mounting countersunk hole opened in the base plate (11) or the transverse stator adapter plate (14).

10. A wafer transfer device, comprising two sets of Y-axis drive modules (200), X-axis drive modules (300), and wafer carrier modules (400) disposed on a vibration damping platform (100), characterized in that: The wafer carrier module (400) adopts the wafer stage as described in any one of claims 1-9; The X-axis drive module (300) is longitudinally driven at both ends and positioned between two sets of Y-axis drive modules (200). The wafer carrier module (400) is laterally driven and connected to the X-axis drive module (300). The centroid of the wafer carrier module (400) is offset from the transverse center line of the X-axis drive module (300). A transverse grating assembly (500) is connected to the outer ends of the two sets of Y-axis drive modules (200) and positioned outside the wafer carrier module (400).

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