A semiconductor welding fixture

Abstract

This invention discloses a semiconductor welding fixture, relating to the field of semiconductor welding technology. The semiconductor welding fixture includes a substrate loading assembly, an inner solder coating mechanism, and a chip loading assembly on the side of the solder coating mechanism away from the substrate loading assembly. A chip compaction assembly is located on the side of the chip loading assembly closer to the reflow oven. A rotating tray is mounted on a rotary motor, which is fixed to a frame. Multiple rectangular grooves are formed around the rotating tray to facilitate substrate placement. A progressive loading assembly is installed below the reflow oven. The fixture can automatically load the substrate, coat the solder joints with solder, place the chip, and finally compact it before automatically feeding it into the reflow oven for reflow soldering. This process enables automatic substrate and chip loading without manual intervention, greatly improving semiconductor welding efficiency.

Description

Technical Field

[0001] This invention relates specifically to the field of semiconductor welding technology, and more specifically to a welding fixture for semiconductors. Background Technology

[0002] Semiconductor soldering is an indispensable and crucial step in the production and packaging of semiconductor devices. It is primarily used to connect components such as semiconductor chips, lead frames, and substrates together to ensure good electrical performance and mechanical strength. Common semiconductor soldering methods include:

[0003] Reflow soldering: Solder is pre-applied to the soldering area, and then heated to melt the solder and form a bond. This is widely used, for example, in surface mount technology (SMT).

[0004] Wave soldering: The process of passing a circuit board through a wave of molten solder to complete the soldering process.

[0005] Laser welding: Achieving precise welding using the high energy density of a laser beam. Commonly used in applications requiring high welding precision.

[0006] Taking reflow soldering as an example, traditional reflow soldering material loading methods include the following:

[0007] Manual loading involves operators placing circuit boards one by one onto a conveyor belt. However, this method is inefficient, prone to human error, and physically demanding.

[0008] Semi-automatic feeding uses simple auxiliary tools, such as trays or clamps, to arrange circuit boards before placing them on a conveyor belt. However, when chips and substrates need to be bonded together, linear assembly is not possible. Summary of the Invention

[0009] The purpose of this invention is to provide a semiconductor welding fixture capable of automatically feeding a substrate, applying solder to the solder joints, placing the chip, and finally automatically feeding it into a reflow oven for reflow soldering after compaction. This process enables automated bonding between the substrate and the chip without manual intervention, greatly improving the welding efficiency of semiconductors. This addresses the technical problems mentioned in the background section.

[0010] To achieve the above objectives, the present invention provides the following technical solution:

[0011] A semiconductor welding fixture includes a substrate loading assembly for loading a substrate, a solder coating mechanism is provided on the inner side of the substrate loading assembly, and a chip loading assembly is provided on the side of the solder coating mechanism away from the substrate loading assembly; a chip compaction assembly is provided on the side of the chip loading assembly closer to the reflow oven.

[0012] The substrate loading assembly, solder coating mechanism, chip loading assembly, and chip compaction assembly are arranged in a circular array along the rotating material tray; the rotating material tray is mounted on a rotating motor, and the rotating motor is fixed on the frame; multiple rectangular grooves are provided around the rotating material tray to facilitate substrate placement.

[0013] The reflow oven is fitted with a progressive feeding assembly at its bottom; the progressive feeding assembly includes two pillars fixed to both ends of a swing arm; each pillar has multiple feed rods fixed to its top; the two ends of the swing arm are movably connected to a swing arm via a rotating shaft; the lower end of the swing arm is fitted with a bearing seat via a rotating shaft; four bearing seats are fixed to the frame, and a motor is fitted to the outside of the rotating shaft in one of the bearing seats;

[0014] The swing rod is movably connected to a connecting rod at one end near the rotating material tray via a rotating shaft. The other end of the connecting rod is movably connected to a transfer frame via a rotating shaft. The middle position of the transfer frame is movably connected to a vertical rod via a rotating shaft. The vertical rod is fixed to the machine frame.

[0015] As a further technical solution of the present invention, the substrate loading assembly includes a fixing plate fixed to the frame body, a sliding cylinder fixed to the rear side of the fixing plate, and the end of the cylinder rod of the sliding cylinder fixed to the lifting assembly via a connecting rod; a first sliding seat fixed to the rear side of the lifting assembly; the first sliding seat slidably connected to a first slide rail installed on the inner side of the fixing plate; an L-shaped support fixed to one side of the lifting assembly, a lifting cylinder fixed to the L-shaped support, and a negative pressure suction nozzle fixed to the end of the cylinder rod of the lifting cylinder; the negative pressure suction nozzle is connected to a negative pressure generator via an air pipe, and the negative pressure generator is connected to an air source.

[0016] As a further technical solution of the present invention, the lifting assembly includes a mounting plate, on one side of the upper end of the mounting plate a first drive motor is fixed, the output shaft of the first drive motor extends through to the other side of the mounting plate, and two first rollers and a belt are provided on the other side of the mounting plate, and the first drive motor is connected in cooperation with them; wherein the belt is fixed to the clamping block; the clamping block is fixed to one side of the sliding table; the sliding table is slidably connected to the vertical slide rail through a slide seat on the inner side of the sliding table; the sliding table is used for fixing the L-shaped support.

[0017] As a further technical solution of the present invention, the solder coating mechanism includes a support base fixed to the frame body; a pushing cylinder is fixed on the support base, and the end of the cylinder rod of the pushing cylinder is fixed to a sliding plate; the inner side of the sliding plate is slidably connected to the pushing slide rail through a pushing slide seat; a lifting cylinder is fixed on the sliding plate, and an end plate is fixed on the top of the lifting cylinder; a solder hopper is fixed on the outer side of the end plate; and a coating nozzle is provided at the bottom of the solder hopper.

[0018] As a further technical solution of the present invention, the chip loading assembly includes a mounting bracket, on the rear side of the upper end of the mounting bracket, a horizontal cylinder is fixed; the cylinder rod end of the horizontal cylinder is connected to a vertical plate through a connecting frame, a vertical slide rail is fixed to the outside of the vertical plate, and the vertical slide rail is slidably connected to the vertical slide block; a mechanical gripper is also provided on the vertical slide table fixed to the vertical slide block.

[0019] A second drive motor is fixed to the rear side of the upright plate; a pulley and a belt are fitted onto the output shaft of the second drive motor; the belt is fixed to the clamping seat, and the clamping seat is fixed to the vertical slide.

[0020] As a further technical solution of the present invention, the inner side of the chip feeding assembly is also provided with a chip vibration feeding plate; the chip vibration feeding plate is fixedly connected to the frame body.

[0021] As a further technical solution of the present invention, a CCD camera is also provided above the rotating tray. The CCD camera is fixed on the bracket, and the bracket is fixedly connected to the machine frame. The CCD camera is electrically connected to the display.

[0022] As a further technical solution of the present invention, the chip compaction component is mounted on the linear drive module; wherein the linear drive module is fixed on the frame; the chip compaction component and the substrate loading component adopt the same driving method.

[0023] As a further technical solution of the present invention, a substrate material box is provided on one side of the substrate feeding assembly; the substrate material box is disposed on a bracket; the bracket is disposed on one side of the frame body; and an industrial control computer is disposed inside the frame body.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] 1. In this invention, the cylinder rod of the lifting cylinder extends, placing the negative pressure suction nozzle above the substrate. After compressed gas is introduced, a negative pressure is generated by the negative pressure generator, and the substrate is adsorbed by the negative pressure suction nozzle. Subsequently, the cylinder rod of the lifting cylinder retracts, lifting the substrate. The cylinder rod of the sliding cylinder retracts, causing the lifting assembly to move the L support to one side through the cooperation of the first slide rail and the first slide block, so that the substrate is placed on the rotating material tray, thereby realizing the feeding of the substrate.

[0026] 2. In this invention, as the substrates are continuously removed, the number of substrates decreases. In order to ensure that the bottommost substrate can be picked up, the first drive motor rotates counterclockwise, and the belt also rotates counterclockwise. Then the clamping block drives the L support to move downward along the vertical slide rail through the sliding table, so that the negative pressure suction nozzle can move downward better to pick up the substrate.

[0027] 3. In this invention, during chip loading, a chip vibrating loading tray vibrates and arranges the chips for loading; then, a mechanical gripper clamps the chip, followed by a second drive motor rotating clockwise, which drives the belt to rotate clockwise via a pulley, causing the gripper to slide upward along the vertical slide table via the vertical slide block; subsequently, the cylinder rod of the transverse cylinder retracts, causing the transverse slide table to move along the transverse slide rail via the rear transverse slide block, so that the mechanical gripper places the chip onto the substrate, thereby realizing chip mounting;

[0028] 4. In this invention, the motor drives one of the four bearing seats to rotate the shaft. During rotation, the swing arm begins to swing. When the swing arm swings to the right, the connecting rod pushes the transfer frame to flip. During the flip, the transfer frame lifts the substrate on the rotating tray. After the swing arm rotates one revolution, the substrate falls onto the feed rod. With the continuous operation of the progressive feeding component, the progressive feeding of the substrate is realized, which facilitates the reflow soldering of the substrate and the chip in the reflow oven. Attached Figure Description

[0029] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0030] Figure 2 In this invention Figure 1 The diagram on the right side shows the structure.

[0031] Figure 3 In this invention Figure 1 A schematic diagram of the rear structure.

[0032] Figure 4 This is a schematic diagram of the substrate loading assembly in this invention.

[0033] Figure 5 In this invention Figure 4 A schematic diagram of the rear structure.

[0034] Figure 6 This is a schematic diagram of the solder coating mechanism in this invention.

[0035] Figure 7 This is a schematic diagram of the chip loading assembly in this invention.

[0036] Figure 8 In this invention Figure 7 A schematic diagram of the rear structure.

[0037] Figure 9 In this invention Figure 8 Another perspective illustration.

[0038] Figure 10 In this invention Figure 1 A magnified view of a portion of the image.

[0039] Figure 11 In this invention Figure 3 A magnified view of a portion of the image.

[0040] Figure 12 This is a schematic diagram of the progressive feeding component in this invention.

[0041] Figure 13 This is a three-dimensional structural diagram of the progressive feeding component in this invention.

[0042] In the diagram: 1. Bracket; 2. Substrate container; 3. Frame; 4. Substrate loading assembly; 5. Solder coating mechanism; 6. Display; 7. Chip vibrating loading tray; 8. CCD camera; 9. Chip loading assembly; 10. Chip compaction assembly; 11. Linear drive module; 12. Reflow oven; 13. Rotary tray; 14. Step-by-step loading assembly; 15. Industrial computer.

[0043] Fixed plate 41, sliding cylinder 42, first slide rail 43, first slide block 44, lifting assembly 45, L-bracket 46, lifting cylinder 47, negative pressure suction nozzle 48, negative pressure generator 49.

[0044] Mounting plate 451, first drive motor 452, first rotating wheel 453, clamping block 454, vertical slide rail 455, sliding table 456;

[0045] Support base 51, push cylinder 52, push slide rail 53, push slide block 54, slide plate 55, lifting cylinder 56, end plate 57, welding hopper 58, coating nozzle 59;

[0046] Mounting bracket 91, vertical slide rail 92, vertical slide block 93, vertical slide table 94, mechanical gripper 95, second drive motor 96, belt 97, clamping seat 98, horizontal cylinder 99, horizontal slide rail 910, horizontal slide block 911, horizontal slide table 912.

[0047] Support column 141, swing rod 142, swing arm 143, bearing with seat 144, advance rod 145, connecting rod 146, support frame 147, vertical rod 148. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] Please see Figure 1-3In this embodiment of the invention, a semiconductor welding fixture includes a substrate loading assembly 4 for loading substrates. The substrate loading assembly 4 has a solder coating mechanism 5 on its inner side and a chip loading assembly 9 on the side of the solder coating mechanism 5 away from the substrate loading assembly 4. The chip loading assembly 9 has a chip compaction assembly 10 on the side of the chip loading assembly 9 close to the reflow oven 12.

[0050] The substrate loading assembly 4, solder coating mechanism 5, chip loading assembly 9 and chip compaction assembly 10 are arranged in a circular array along the rotating material tray 13; the rotating material tray 13 is mounted on a rotating motor, and the rotating motor is fixed on the frame body 3; the rotating material tray 13 has multiple rectangular grooves around its perimeter to facilitate substrate placement.

[0051] More specifically, the substrate loading assembly 4 has a substrate box 2 on one side; the substrate box 2 is mounted on the bracket 1; the bracket 1 is mounted on one side of the frame body 3; and the frame body 3 is equipped with an industrial control computer 15.

[0052] By adopting the above technical solution, during use, several substrates are first stacked in the substrate box 2. The substrate loading assembly 4 places the substrates onto the rotating tray 13. The rotating motor drives the rotating tray 13 to rotate, so that the substrates rotate to below the solder coating mechanism 5. The solder coating mechanism 5 coats the solder joints with solder. Then the rotating tray 13 continues to rotate, and the coated solder is detected by the CCD camera 8, and the detection information is transmitted to the display 6 for easy observation by the operator. When the solder coating is insufficient or uneven, the tray can be rotated in the opposite direction to recoat the solder.

[0053] The chip loading assembly 9 removes the chip discharged from the chip vibrating loading tray 7 and places it above the solder for subsequent reflow soldering.

[0054] After the chip is placed and stabilized, the chip compaction component 10 compacts the chip to ensure that the chip and the substrate are fully welded and that the welding is stable.

[0055] Finally, the chip is transferred to the reflow oven 12 via the step-by-step feeding assembly 14 for reflow soldering, thereby completing the soldering of the chip and the substrate.

[0056] Please see the appendix Figure 4-5In this embodiment, the substrate loading assembly 4 includes a fixing plate 41 fixed to the frame body 3. A sliding cylinder 42 is fixed to the rear side of the fixing plate 41. The end of the cylinder rod of the sliding cylinder 42 is fixed to the lifting assembly 45 through a connecting rod. A first slide block 44 is fixed to the rear side of the lifting assembly 45. The first slide block 44 is slidably connected to a first slide rail 43 installed inside the fixing plate 41. An L-shaped support 46 is also fixed to one side of the lifting assembly 45. A lifting cylinder 47 is fixed to the L-shaped support 46. A negative pressure suction nozzle 48 is fixed to the end of the cylinder rod of the lifting cylinder 47. The negative pressure suction nozzle 48 is connected to a negative pressure generator 49 through an air pipe. The negative pressure generator 49 is connected to an air source.

[0057] By adopting the above technical solution, when the substrate is adsorbed and picked up, the cylinder rod of the lifting cylinder 47 extends, so that the negative pressure suction nozzle 48 is placed above the substrate. After compressed gas is introduced, negative pressure is generated by the negative pressure generator 49, and the substrate is adsorbed by the negative pressure suction nozzle 48. Then the cylinder rod of the lifting cylinder 47 retracts, lifting the substrate. The cylinder rod of the sliding cylinder 42 retracts, so that the lifting assembly 45 drives the L support 46 to move to one side through the cooperation of the first slide rail 43 and the first slide block 44, so that the substrate is placed on the rotating material tray 13, thereby realizing the feeding of the substrate.

[0058] For more details, please refer to the appendix. Figure 4 The lifting assembly 45 includes a mounting plate 451. A first drive motor 452 is fixed on one side of the upper end of the mounting plate 451. The output shaft of the first drive motor 452 extends through to the other side of the mounting plate 451. Two first rotating wheels 453 and a belt are provided on the other side of the mounting plate 451, and the first drive motor 452 is connected to them. The belt is fixed to a clamping block 454. The clamping block 454 is fixed to one side of a sliding table 456. The sliding table 456 is slidably connected to a vertical slide rail 455 via a sliding seat on its inner side. The sliding table 456 is used to fix the L-shaped support 46.

[0059] By adopting the above technical solution, as the substrates are continuously removed, the number of substrates decreases. In order to ensure that the bottom substrate can be picked up, the first drive motor 452 rotates counterclockwise, and the belt also rotates counterclockwise. Then the clamping block 454 drives the L support 46 to move downward along the vertical slide rail 455 via the sliding table 456, so that the negative pressure suction nozzle 48 can move downward better to pick up the substrate.

[0060] Please see the appendix Figure 6In this embodiment, the solder coating mechanism 5 includes a support base 51 fixed to the frame body 3; a push cylinder 52 is fixed on the support base 51, and the end of the cylinder rod of the push cylinder 52 is fixed to the sliding plate 55; the inner side of the sliding plate 55 is slidably connected to the push slide rail 53 through a push slide seat 54; a lifting cylinder 56 is fixed on the sliding plate 55, and an end plate 57 is fixed to the top of the lifting cylinder 56; a solder hopper 58 is fixed to the outer side of the end plate 57; and a coating nozzle 59 is provided at the bottom of the solder hopper 58.

[0061] By adopting the above technical solution, when coating the substrate with solder, the cylinder rod of the push cylinder 52 extends and pushes the sliding plate 55 to slide outward along the push slide rail 53 through the push slide block 54, so that the coating nozzle 59 is above the substrate to be coated with solder; then the cylinder rod of the lifting cylinder 56 retracts, so that the end plate 57 drives the solder hopper 58 and the coating nozzle 59 to move down. After the coating nozzle 59 opens, the coating material is applied to the substrate, thereby realizing the solder coating of the substrate.

[0062] Please see the appendix Figure 7-9 In this embodiment, the chip loading assembly 9 includes a mounting bracket 91, on the rear side of the upper end of the mounting bracket 91, a horizontal cylinder 99 is fixed; the cylinder rod end of the horizontal cylinder 99 is connected to a vertical plate through a connecting frame, a vertical slide rail 92 is fixed to the outside of the vertical plate, and the vertical slide rail 92 is slidably connected to a vertical slide block 93; a mechanical gripper 95 is also provided on the vertical slide table 94 fixed to the vertical slide block 93.

[0063] A second drive motor 96 is fixed to the rear side of the upright plate; a wheel and a belt 97 are fitted on the output shaft of the second drive motor 96; the belt 97 is fixed to the clamping seat 98, and the clamping seat 98 is fixed to the vertical slide table 94.

[0064] More specifically, the inner side of the chip feeding assembly 9 is also provided with a chip vibration feeding plate 7; the chip vibration feeding plate 7 is fixedly connected to the frame body 3.

[0065] By adopting the above technical solution, when feeding the chip, the chip vibrating feeding tray 7 vibrates and arranges the chip for feeding; then the mechanical gripper 95 clamps the chip, and then the second drive motor 96 rotates clockwise, driving the belt 97 to rotate clockwise through the pulley, causing the clamping seat 98 to slide upward along the vertical slide table 94 through the vertical slide block 93; then the cylinder rod of the transverse cylinder 99 retracts, causing the transverse slide table 912 to move along the transverse slide rail 910 through the rear transverse slide block 911, so that the mechanical gripper 95 places the chip on the substrate, thereby realizing the chip mounting.

[0066] In this embodiment, a CCD camera 8 is also provided above the rotating tray 13. The CCD camera 8 is fixed on the bracket, and the bracket is fixedly connected to the frame body 3. The CCD camera 8 is electrically connected to the display 6.

[0067] Please see the appendix Figure 1-3 In this embodiment, the chip compaction component 10 is mounted on the linear drive module 11; wherein the linear drive module 11 is fixed on the frame 3.

[0068] As a further explanation of this embodiment, the chip compaction assembly 10 and the substrate loading assembly 4 adopt the same driving method. The substrate loading assembly 4 uses a negative pressure suction nozzle 48 to adsorb the substrate. We replace the negative pressure suction nozzle 48 with a pressing rod to realize the pressing process of the chip by the chip compaction assembly 10.

[0069] Please see the appendix Figure 10-13 In this embodiment, a progressive feeding assembly 14 is installed below the reflow oven 12; the progressive feeding assembly 14 includes two support columns 141 fixed at both ends of a swing rod 142; each support column 141 has multiple feed rods 145 fixed to its top; the two ends of the swing rod 142 are movably connected to a swing arm 143 via a rotating shaft; the lower end of the swing arm 143 is installed in conjunction with a bearing 144 via a rotating shaft; four bearings 144 are fixed to the frame body 3, and a motor is installed on the outside of the rotating shaft in one of the bearings 144;

[0070] The swing rod 142 is movably connected to a connecting rod 146 at one end near the rotating material tray 13 via a rotating shaft. The other end of the connecting rod 146 is movably connected to a transfer frame 147 via a rotating shaft. The middle position of the transfer frame 147 is movably connected to a vertical rod 148 via a rotating shaft. The vertical rod 148 is fixed on the frame body 3.

[0071] By adopting the above technical solution, during the feeding process, the motor drives one of the four bearing seats to rotate. During the rotation, the swing arm 143 begins to swing. When the swing arm 143 swings to the right, the connecting rod 146 pushes the transfer frame 147 to flip. During the flip, the transfer frame 147 lifts the substrate on the rotating material tray 13. After the swing arm 143 rotates one revolution, the substrate falls onto the feed rod 145. With the continuous operation of the progressive feeding component 14, the progressive feeding of the substrate is realized, which facilitates the reflow soldering of the substrate and the chip in the reflow soldering furnace 12.

[0072] As a further explanation of this embodiment, the use of the progressive feeding component 14 in conjunction with the reflow oven 12 is prior art, and its specific principle will not be described in detail here.

[0073] Industrial control computers are used to control various components, thereby achieving automated control of equipment.

[0074] The working principle is:

[0075] In use, this invention first places several substrates in the substrate cassette 2. The substrate loading assembly 4 places the substrates onto the rotating tray 13. A rotary motor drives the rotating tray 13 to rotate, so that the substrates rotate to a position below the solder coating mechanism 5. The solder coating mechanism 5 coats the solder joints with solder. Subsequently, the rotating tray 13 continues to rotate, and the coated solder is detected by a CCD camera 8, and the detection information is transmitted to a display 6 for easy observation by the operator. When the solder coating is insufficient or uneven, the tray can be rotated in the opposite direction to recoat the solder.

[0076] The chip loading assembly 9 removes the chip discharged from the chip vibrating loading tray 7 and places it above the solder for subsequent reflow soldering.

[0077] After the chip is placed and stabilized, the chip compaction component 10 compacts the chip to ensure that the chip and the substrate are fully welded and that the welding is stable.

[0078] Finally, the chip is transferred to the reflow oven 12 via the step-by-step feeding assembly 14 for reflow soldering, thereby completing the soldering of the chip and the substrate.

[0079] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0080] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor welding fixture, characterized in that: The system includes a substrate loading assembly (4) for loading substrates, a solder coating mechanism (5) is provided on the inner side of the substrate loading assembly (4), and a chip loading assembly (9) is provided on the side of the solder coating mechanism (5) away from the substrate loading assembly (4); a chip compaction assembly (10) is provided on the side of the chip loading assembly (9) close to the reflow oven (12). The substrate loading assembly (4), solder coating mechanism (5), chip loading assembly (9) and chip compaction assembly (10) are arranged in a ring array along the rotating material tray (13); the rotating material tray (13) is mounted on a rotating motor, and the rotating motor is fixed on the frame body (3); the rotating material tray (13) has multiple rectangular grooves around its perimeter to facilitate substrate placement. A progressive feeding assembly (14) is installed below the reflow oven (12); the progressive feeding assembly (14) includes two support columns (141) fixed at both ends of the swing rod (142); each support column (141) has multiple moving rods (145) fixed at its top; the two ends of the swing rod (142) are movably connected to a swing arm (143) via a rotating shaft; the lower end of the swing arm (143) is installed in conjunction with a bearing (144) via a rotating shaft; four bearings (144) are fixed to the frame body (3), and a motor is installed on the outside of the rotating shaft in one of the bearings (144); The swing rod (142) is movably connected to a connecting rod (146) at one end near the rotating material tray (13) via a rotating shaft. The other end of the connecting rod (146) is movably connected to a transfer frame (147) via a rotating shaft. The middle position of the transfer frame (147) is movably connected to a vertical rod (148) via a rotating shaft. The vertical rod (148) is fixed on the frame body (3).

2. The semiconductor welding fixture according to claim 1, characterized in that: The substrate loading assembly (4) includes a fixing plate (41) fixed to the frame body (3). A sliding cylinder (42) is fixed to the rear side of the fixing plate (41). The cylinder rod end of the sliding cylinder (42) is fixed to the lifting assembly (45) through a connecting rod. A first slide block (44) is fixed to the rear side of the lifting assembly (45). The first slide block (44) is slidably connected to a first slide rail (43) installed inside the fixing plate (41). An L-shaped support (46) is also fixed to one side of the lifting assembly (45). A lifting cylinder (47) is fixed to the L-shaped support (46). A negative pressure suction nozzle (48) is fixed to the cylinder rod end of the lifting cylinder (47). The negative pressure suction nozzle (48) is connected to a negative pressure generator (49) through an air pipe. The negative pressure generator (49) is connected to an air source.

3. The semiconductor welding fixture according to claim 2, characterized in that: The lifting assembly (45) includes a mounting plate (451), on one side of the upper end of the mounting plate (451) a first drive motor (452) is fixed, the output shaft of the first drive motor (452) extends through to the other side of the mounting plate (451), and two first rollers (453) and a belt are provided on the other side of the mounting plate (451), and the first drive motor (452) is connected to them; wherein the belt is fixed to the clamping block (454); the clamping block (454) is fixed to one side of the sliding table (456); the sliding table (456) is slidably connected to the vertical slide rail (455) through a sliding seat on the inner side of the sliding table (456); the sliding table (456) is used to fix the L support (46).

4. The semiconductor welding fixture according to claim 3, characterized in that: The solder coating mechanism (5) includes a support base (51) fixed to the frame body (3); a push cylinder (52) is fixed on the support base (51), and the end of the cylinder rod of the push cylinder (52) is fixed to the sliding plate (55); the inner side of the sliding plate (55) is slidably connected to the push slide rail (53) through the push slide seat (54); a lifting cylinder (56) is fixed on the sliding plate (55), and an end plate (57) is fixed on the top of the lifting cylinder (56); a solder hopper (58) is fixed on the outer side of the end plate (57); and a coating nozzle (59) is provided at the bottom of the solder hopper (58).

5. The semiconductor welding fixture according to claim 1, characterized in that: The chip loading assembly (9) includes a mounting bracket (91), on the rear side of the upper end of the mounting bracket (91) a horizontal cylinder (99); the cylinder rod end of the horizontal cylinder (99) is connected to a vertical plate through a connecting frame, a vertical slide rail (92) is fixed to the outside of the vertical plate, and the vertical slide rail (92) is slidably connected to a vertical slide block (93); a mechanical gripper (95) is also provided on the vertical slide table (94) fixed to the vertical slide block (93); A second drive motor (96) is fixed to the rear side of the upright plate; a wheel and a belt (97) are fitted on the output shaft of the second drive motor (96); the belt (97) is fixed to the clamping seat (98), which is fixed to the vertical slide (94).

6. The semiconductor welding fixture according to claim 1, characterized in that: The chip feeding assembly (9) is also provided with a chip vibration feeding plate (7) on its inner side; the chip vibration feeding plate (7) is fixedly connected to the frame body (3).

7. The semiconductor welding fixture according to claim 1, characterized in that: A CCD camera (8) is also provided above the rotating tray (13). The CCD camera (8) is fixed on the bracket, and the bracket is fixedly connected to the frame body (3). The CCD camera (8) is electrically connected to the display (6).

8. The semiconductor welding fixture according to claim 1, characterized in that: The chip compaction assembly (10) is mounted on the linear drive module (11); the linear drive module (11) is fixed on the frame body (3); the chip compaction assembly (10) and the substrate loading assembly (4) adopt the same driving method.

9. The semiconductor welding fixture according to claim 1, characterized in that: The substrate loading assembly (4) has a substrate box (2) on one side; the substrate box (2) is mounted on a bracket (1); the bracket (1) is mounted on one side of the frame body (3); and the frame body (3) is equipped with an industrial control computer (15).

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