A cold-closing spindle clamp based on semiconductor multi-stage cooling

Abstract

The application relates to the technical field of hydrate resource development and carbon dioxide storage equipment, and particularly provides a cold-joining rotary core holder based on semiconductor multistage refrigeration, which comprises a rotating seat, a core detection piece, an irradiation section, an upper temperature control section and a lower temperature control section, the irradiation section being arranged between the upper temperature control section and the lower temperature control section, the lower temperature control section being arranged on the rotating seat, a phase change temperature control assembly, the phase change temperature control assembly comprising an upper heat conduction cylinder, a lower heat conduction cylinder and a heat conduction brush, the heat conduction brush being fixedly connected with the left sides of the upper heat conduction cylinder and the lower heat conduction cylinder, the heat conduction brush being fixedly connected with the right sides of the upper heat conduction cylinder and the lower heat conduction cylinder, and a multistage semiconductor refrigeration assembly, the multistage semiconductor refrigeration assembly being attached to the outer surfaces of the upper temperature control section and the lower temperature control section, so that X rays can penetrate the irradiation section where the core sample is located without obstruction, and the X ray penetration rate is fundamentally improved.

Description

Technical Field

[0001] This application relates to the technical field of hydrate resource development and carbon dioxide storage equipment, and in particular to a cold-binding spool holder based on semiconductor multi-stage refrigeration. Background Technology

[0002] With the deepening of unconventional energy development such as hydrate resource development and carbon dioxide sequestration, as well as geological process simulation research, CT imaging, due to its advantages of non-destructive and high-resolution imaging, is widely used in core structure analysis and multi-field coupling process research. Core holders, as key devices for sample fixation, temperature control, pressure loading, and compatibility with CT imaging, directly affect experimental results and imaging quality through their structure and performance.

[0003] Currently, most commonly used core holders employ a temperature-controlled jacket installed outside the core tube, with temperature controlled by circulating cooling media. However, the temperature-controlled jacket and its internal cooling media can obstruct X-ray penetration, resulting in low X-ray penetration and severely impacting CT imaging quality.

[0004] Therefore, existing technologies have defects and shortcomings, and need further improvement and development. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a cold-closing spinneret based on semiconductor multi-stage cooling, which aims to solve the problem that the temperature control jacket of the existing core holder will hinder the passage of X-rays, resulting in low X-ray penetration and seriously affecting the quality of CT imaging.

[0006] The technical solution adopted by this application to solve the technical problem is as follows: a cold-binding spindle holder based on semiconductor multi-stage cooling, used for imaging scanning of hydrate resource development and carbon dioxide sequestration, comprising:

[0007] Rotary seat;

[0008] A core testing component, comprising an upper temperature control section, an irradiation section, and a lower temperature control section; the irradiation section, made of polyetheretherketone (PEEK) material, is disposed between the upper and lower temperature control sections; the lower temperature control section is disposed on the rotating base.

[0009] The core testing piece is equipped with a sample support protrusion located below the irradiation section to fix the core sample, so that the sample is completely within the irradiation section;

[0010] A phase change temperature control assembly includes an upper heat-conducting cylinder, a lower heat-conducting cylinder, and a pair of heat-conducting brushes symmetrically fixed on the rotating base. The upper heat-conducting cylinder and the lower heat-conducting cylinder are connected in parallel through the heat-conducting brushes. Each heat-conducting brush is fixedly connected to the side wall of the upper heat-conducting cylinder and the lower heat-conducting cylinder.

[0011] A multi-stage thermoelectric cooling assembly includes at least four upper thermoelectric cooling chips and at least four lower thermoelectric cooling chips; the cold end of the upper thermoelectric cooling chip is attached to the outer surface of the upper temperature control section, and the hot end is in contact with the upper heat conduction cylinder; the cold end of the lower thermoelectric cooling chip is attached to the outer surface of the lower temperature control section, and the hot end is in contact with the lower heat conduction cylinder.

[0012] Each of the heat-conducting brushes includes a heat storage rod, a heat dissipation groove, and an auxiliary semiconductor cooling chip; the heat storage rod is provided with "roll-type" heat-conducting fibers. When the rotating seat drives the core detection piece to rotate, the heat-conducting fibers are released from the heat storage rod and wrapped around the surfaces of the upper and lower heat-conducting cylinders to achieve dynamic heat conduction adjustment.

[0013] Optionally, each of the heat storage rods is provided with a hollow copper tube and a heat-conducting fiber storage interlayer located on its outer periphery. The hollow copper tube is filled with a phase change medium. One end of the heat-conducting fiber is fixed to the hollow copper tube, and the other end of the heat-conducting fiber extends out through the opening of the heat storage rod and is fixedly connected to the upper heat-conducting cylinder and the lower heat-conducting cylinder.

[0014] Each of the heat storage rods is equipped with a rotary motor at its bottom, which drives the hollow copper tube to rotate, thereby enabling the recovery or release of the heat-conducting fibers.

[0015] Optionally, the heat dissipation groove has a recessed end and a flat end that are disposed opposite to each other. The recessed end is fitted with the end of the heat storage rod that is away from the core detection piece; the flat end is fitted with the cold end of the auxiliary semiconductor refrigeration chip.

[0016] The heat from the upper and lower heat-conducting cylinders is transferred to the heat storage rod through the heat-conducting fibers, and the heat dissipation grooves are used to dissipate heat from the heat storage rod.

[0017] Optionally, the upper housing has one end detachably connected to the upper temperature control section; the other end of the upper housing is provided with a pressure injection port.

[0018] The lower casing has one end detachably connected to the lower temperature control section; the other end of the lower casing is provided with a water injection hole for injecting pure water into the core testing piece.

[0019] Optionally, the outer surfaces of both the upper and lower temperature control sections are provided with square protrusions, and the multi-stage semiconductor cooling components are attached to the four sides of the square protrusions.

[0020] Optionally, the semiconductor multi-stage cooling-based cold-locking spindle clamp further includes:

[0021] A clamping base, wherein the rotating seat is fixedly mounted on the clamping base;

[0022] A pressure sensor is provided for detecting the cavity pressure of the core sample; the pressure sensor is mounted on the clamping base.

[0023] A temperature sensor is provided to measure the temperature inside the core sample; the temperature sensor is mounted on the clamping base; the probes of both the temperature sensor and the pressure sensor are inserted into the core sample through the water injection hole.

[0024] A pressurizing device is used to pressurize the cavity of the core sample; the pressurizing device is disposed on the clamping base; the interface of the pressurizing device is disposed inside the core sample through the injection port;

[0025] An X-ray source is disposed on the clamping base and positioned directly in front of the core sample; the X-ray source is used to scan the irradiation section.

[0026] A flat panel detector is disposed on the clamping base and directly behind the core sample, for receiving irradiation signals from an X-ray source.

[0027] Optionally, the rotating seat includes:

[0028] A base rotor, which is sleeved on the lower temperature control section;

[0029] A base stator, wherein the base rotor is rotatably connected to the base stator;

[0030] Ball bearings are provided between the base stator and the base rotor, and the ball bearings are fixed by a retainer; the base rotor is fixed to the turntable of the X-ray source; the heat-conducting brushes are all fixed on the base stator.

[0031] Optionally, the semiconductor multi-stage cooling-based cold-locking spindle clamp further includes:

[0032] The control device is electrically connected to the pressure sensor, temperature sensor, pressurization device, X-ray source, flat panel detector, auxiliary semiconductor refrigeration chip, rotary motor and multi-stage semiconductor refrigeration assembly.

[0033] Optionally, the thermally conductive fiber is graphite fiber to improve thermal conductivity and reduce wear during the winding process.

[0034] Compared with existing technologies, this application provides a cold-binding spinneret based on semiconductor multi-stage cooling. This cold-binding spinneret, through the arrangement of a rotating base, a core sample, a phase-change temperature control assembly, and a multi-stage semiconductor cooling assembly, achieves core sample fixation, rotational scanning, and efficient temperature control. Specifically, the core sample includes an upper temperature control section, a lower temperature control section, and an irradiation section located in the middle. The irradiation section is unobstructed, allowing X-rays to penetrate the core sample area without obstruction, avoiding interference with the imaging path caused by traditional temperature control jackets. Furthermore, heat exchange is achieved by directly attaching the multi-stage semiconductor cooling assembly to the outer surface of the temperature control section. Combined with the phase-change temperature control assembly consisting of an upper heat-conducting cylinder, a lower heat-conducting cylinder, and a heat-conducting brush, heat is effectively dissipated, achieving temperature control while maintaining X-ray penetration. Attached Figure Description

[0035] Figure 1 This is a three-dimensional structural diagram of the cold-closing spindle clamp based on semiconductor multi-stage cooling provided in this application;

[0036] Figure 2 This is a left view of the cold-closing spindle clamp based on semiconductor multi-stage cooling provided in this application;

[0037] Figure 3 It is provided in this application Figure 2 A sectional view along the I-I direction;

[0038] Figure 4 It is provided in this application Figure 3 Enlarged structural diagram at point A;

[0039] Figure 5 This is a cross-sectional view of the thermally conductive fiber wound in the lower thermally conductive cylinder of the semiconductor multi-stage cooling-based cold-binding spindle clamp provided in this application;

[0040] Figure 6 This is a three-dimensional exploded view of the cold-closing spindle clamp based on semiconductor multi-stage refrigeration provided in this application;

[0041] Figure 7 This is another three-dimensional exploded structure diagram of the cold-closing spindle clamp based on semiconductor multi-stage refrigeration provided in this application;

[0042] Figure 8 This is a front view of the cold-closing spindle holder based on semiconductor multi-stage cooling provided in this application;

[0043] Figure 9 It is provided in this application Figure 8 A sectional view along the II-II direction;

[0044] Figure 10This is a three-dimensional structural schematic diagram of the cold-closing spindle clamp based on semiconductor multi-stage cooling provided in this application from another perspective;

[0045] Figure 11 This is a top view of the cold-closing spindle clamp based on semiconductor multi-stage cooling provided in this application;

[0046] Figure 12 This is a schematic block diagram illustrating the functional principle of the cold-closing spindle clamp based on semiconductor multi-stage cooling provided in this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 10. Cold-binding spindle clamp based on semiconductor multi-stage refrigeration; 11. Rotary seat; 12. Core testing component; 13. Phase change temperature control assembly; 14. Multi-stage semiconductor refrigeration assembly; 141. Upper semiconductor refrigeration chip; 142. Lower semiconductor refrigeration chip; 15. Clamping base; 16. Pressure sensor; 17. Temperature sensor; 18. Pressurization device; 19. X-ray source; 20. Flat panel detector; 21. Control device; 111. Base stator; 112. Base rotor; 113. Ball bearings; 114. Cage; 21. Irradiation section; 122. Upper temperature control section; 123. Lower temperature control section; 124. Square protrusion; 125. Sample support ring; 126. Upper shell; 127. Lower shell; 132. Upper heat conduction cylinder; 133. Lower heat conduction cylinder; 134. Heat conduction brush; 135. Heat conduction fiber; 1211. Injection port; 1212. Water injection hole; 1311. Heat storage rod; 1312. Heat dissipation groove; 1313. Auxiliary semiconductor cooling chip; 1344. Hollow copper tube; 1345. Heat conduction fiber storage interlayer; 1346. Rotary motor. Detailed Implementation

[0049] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0050] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0052] Please refer to the following: Figures 1 to 12 The first embodiment of this application provides a semiconductor multi-stage cooling-based cold-binding spool holder 10 for imaging scanning in hydrate resource development and carbon dioxide sequestration. The cold-binding spool holder includes a rotating base 11, a core detection element 12, a phase change temperature control assembly 13, and a control device 21. The rotating base 11 achieves rotation through the cooperation of a base rotor 112 and a base stator 111. The base rotor 112 is mounted on the lower temperature control section 123 of the core detection element 12. The base rotor 112 is fixedly connected to the turntable of the X-ray source 19. The base stator 111 remains stationary and ensures smooth rotation through ball bearings. This allows the semiconductor multi-stage cooling-based cold-binding spool holder 10 to remain stable during X-ray CT scanning and achieve low-friction rotation, ensuring that the image is free from artifacts from other devices. The core detection element 12 adopts a three-section structure, including an upper temperature control section 122, an irradiation section 121, and a lower temperature control section 123. The irradiation section 121 is located between the upper temperature control section 122 and the lower temperature control section 123. It is made of polyetheretherketone material, which has small artifacts in CT scans and ensures that X-rays can penetrate. The sample support ring 125 inside the core detection piece 12 is used to fix the core sample.

[0053] The phase change temperature control assembly 13 includes components such as a thermally conductive brush 134, an upper thermally conductive cylinder 132, and a lower thermally conductive cylinder 133. The thermally conductive brush 134 includes a heat storage rod 1311, a heat dissipation groove 1312, and an auxiliary semiconductor cooling chip 1313; specifically, the heat dissipation groove 1312 is made of hard silicone grease or copper material; the heat storage rod 1311 includes a hollow copper tube 1344 filled with a phase change medium and a "roll-type" thermally conductive fiber 135; "roll-type" specifically means that the thermally conductive fiber 135 is wound in the hollow copper tube 1344 and connected to the upper thermally conductive cylinder 132 and the lower thermally conductive cylinder 133 through the thermally conductive fiber 135; specifically, the thermally conductive fiber 135 can be set as graphite fiber, which has excellent thermal conductivity. The multi-stage semiconductor cooling assembly 14 includes an upper semiconductor cooling chip 141 and a lower semiconductor cooling chip 142. The upper semiconductor cooling chip 141 is tightly attached to the outer surface of the upper temperature control section 122, and the lower semiconductor cooling chip 142 is attached to the outer surface of the lower temperature control section 123. The cold end of the multi-stage semiconductor cooling assembly 14 directly acts on the square protrusion 124 in the core detection piece 12. The temperature of the sample in the irradiation section 121 is controlled by the upper temperature control section 122 and the lower temperature control section 123. Specifically, the multi-stage semiconductor cooling assembly 14 can be configured with eight chips, with four chips each for the upper semiconductor cooling chip 141 and the lower semiconductor cooling chip 142. The entire device is mounted on a stable clamping base 15 and is equipped with a pressure sensor 16, a temperature sensor 17, a pressurization device 18, an X-ray source 19, a flat panel detector 20, and a control device 21. The control device 21 can be configured as a control terminal such as a computer, a mobile laptop, or a computer workstation. The X-ray source 19, the flat panel detector 20, the clamping base 15, and the turntable of the X-ray source 19 together constitute a CT scanning device.

[0054] During operation, the semiconductor multi-stage cooling-based core clamp 10 first performs a comprehensive system self-check of the entire CT scanning system to ensure that key components, including the X-ray source and flat panel detector 20, are functioning normally and are ready for subsequent work. Then, the core sample to be tested is precisely placed within the irradiation section 121 of the core testing component 12 and securely fixed by the sample support ring 125 to prevent displacement during rotation or pressurization. The core testing component 12 is sealed to the upper shell 126 via a lower shell 127. The pressure injection port 1211 of the upper shell 126 and the water injection hole 1212 of the lower shell 127 are used for pressure and pure water input, respectively, and also function as sensor probe channels. Next, reactive gases such as carbon dioxide or methane are injected through the injection port 1211, and pure water or underground formation water is injected through the water injection hole 1212. Specifically, in the carbon dioxide hydrate formation experiment, pure water is injected, and in the carbon dioxide mineralization and storage experiment, underground formation water is injected to create an experimental atmosphere that simulates the formation of natural gas hydrates.

[0055] After installation, the clamping base 15 is fixedly connected to the turntable of the X-ray source 19, ensuring that the base rotor 112 rotates synchronously with the turntable, while the base stator 111 remains stationary, providing stable support for the heat-conducting brush 134. Subsequently, the multi-stage semiconductor cooling assembly 14 is activated. The cold end of the multi-stage semiconductor cooling assembly 14 is connected to the upper temperature control section 122 and the lower temperature control section 123, respectively, to rapidly cool the interior of the core sample 12 to the low-temperature environment required for hydrate synthesis through efficient cooling. During this period, the hot end of the multi-stage semiconductor cooling assembly 14 continuously releases heat, which is conducted through the upper and lower heat-conducting cylinders 132 and 133 to the heat-conducting fibers made of graphite fibers, and then transported via the heat-conducting fibers to the heat storage rods on the left and right sides. The heat storage rods are filled with phase change material, which can undergo a phase change by absorbing heat, thereby efficiently storing energy in the form of latent heat.

[0056] When the base rotor 112 drives the core detection component 12 to rotate, the thermally conductive fiber 135 gradually wraps around the surfaces of the upper thermally conductive cylinder 132 and the lower thermally conductive cylinder 133 due to the motion, forming a dynamic heat conduction path. The thermally conductive fiber 135 is precisely adjusted in tension and winding amount by the hollow copper tube 1344 controlled by the rotary motor 1346, achieving stable heat conduction efficiency in the rotating state and solving the problem of unsustainable heat conduction in the rotating system. In order to further maintain the thermal stability of the system, the auxiliary semiconductor refrigeration chip 1313 actively cools the heat sink; specifically, the hot end of the auxiliary semiconductor refrigeration chip 1313 can be cooled by the cooling fan of the CT scanning device; so that the phase change material in the heat storage rod solidifies and releases heat in time after completing heat storage, thereby maintaining the cold end cooling effect of the multi-stage semiconductor refrigeration assembly 14.

[0057] Once the internal temperature of the core sample 12 drops to the target value and stabilizes, pressure is applied to the core sample 12 through the pressure injection port 1211 of the upper casing 126 via the pressurization device 18, simulating the high-pressure environment required for hydrate synthesis. Temperature sensor 17 and pressure sensor 16 collect the internal temperature and pressure parameters of the system in real time. The control system dynamically monitors and analyzes the collected data to ensure that both temperature and pressure fluctuations remain within set values, thus determining that the system has reached a stable state and meets the prerequisites for CT scan imaging.

[0058] Subsequently, the SQ scanning mode, i.e., the standard scanning mode, of the X-ray source 19 is activated. In SQ scanning mode, the base stator 111 remains stationary, while the base rotor 112, driven by the turntable of the X-ray source 19, carries the core sample 12 and rotates 360°. During rotation, ball bearings provide precise and stable mechanical support, keeping the rotation speed within the range of 1 rpm to 3 rpm, meeting the requirements of high-resolution CT imaging. The irradiation section 121 is completely exposed, with no structure obstructing the path of the X-rays, ensuring that the X-rays can directly penetrate the core sample, and the high-sensitivity flat panel detector 20 accurately acquires the projection data.

[0059] During the scanning process, the semiconductor cooling system operates continuously to ensure the stability of the low-temperature environment; simultaneously, the phase change thermal storage system and the active heat dissipation module work together to achieve efficient heat transfer and recycling. The entire experimental process is managed in a closed loop by the control device 21, which dynamically adjusts the operating power of the semiconductor cooling chip, the output pressure of the pressurization device 18, and the rotation speed of the rotary motor 1346 to adapt to the real-time changes in system requirements, thereby ensuring the consistency of imaging quality and synthesis conditions.

[0060] After the CT scan is completed, the acquired projection data will be reconstructed using specialized reconstruction software to generate a three-dimensional structural image of the core sample. With the help of processing software, key parameters such as hydrate saturation and distribution characteristics can be quantitatively analyzed, providing reliable experimental data support for the exploration and research of unconventional energy sources such as hydrate resource development and carbon dioxide sequestration. Finally, after confirming the completion of the experiment, the phase change temperature control component 13, the pressurization device 18, and the X-ray source 19 are sequentially turned off, and the sample is removed.

[0061] Please refer to the following: Figures 1 to 5In some embodiments, the semiconductor multi-stage cooling-based core clamp 10 includes a rotating base 11, a core sample 12, a multi-stage semiconductor cooling assembly 14, and a phase change temperature control assembly 13. The core sample 12 includes an upper temperature control section 122, an irradiation section 121, and a lower temperature control section 123. The irradiation section 121 is made of polyetheretherketone (PEEK) material and is located between the upper temperature control section 122 and the lower temperature control section 123. The lower temperature control section 123 is located on the rotating base 11. The core sample 12 has a sample support ring 125 located below the irradiation section 121 to fix the heat-conducting brush of the core sample. The phase change temperature control assembly 13 includes an upper heat-conducting cylinder 132, a lower heat-conducting cylinder 133, and a pair of symmetrically fixed heat-conducting brushes 134 on the rotating base 11. The upper heat-conducting cylinder 132 and the lower heat-conducting cylinder 133 are connected in parallel through the heat-conducting brushes 134. Each heat-conducting brush 134 is connected to the upper heat-conducting cylinder 132. The side walls of the heat cylinder 132 and the lower heat-conducting cylinder 133 are fixedly connected; the multi-stage semiconductor refrigeration assembly 14 includes at least four upper semiconductor refrigeration chips 141 and at least four lower semiconductor refrigeration chips 142; the cold end of the upper semiconductor refrigeration chip 141 is attached to the outer surface of the upper temperature control section 122, and the hot end of the upper semiconductor refrigeration chip 141 is in contact with the upper heat-conducting cylinder 132; the cold end of the lower semiconductor refrigeration chip 142 is attached to the outer surface of the lower temperature control section 123, and the hot end is in contact with the lower heat-conducting cylinder 133; each of the heat-conducting brushes 134 includes a heat storage rod 1311, a heat dissipation groove 1312, and an auxiliary semiconductor refrigeration chip 1313; the heat storage rod 1311 is provided with a "roll-type" heat-conducting fiber 135. When the rotating seat 11 drives the core detection component 12 to rotate, the heat-conducting fiber 135 is released from the heat storage rod 1311 and wound around the surface of the upper heat-conducting cylinder 132 and the lower heat-conducting cylinder 133 to achieve dynamic heat conduction adjustment. Furthermore, by setting up a rotating base 11, a core detection component 12, a phase change temperature control component 13, and a multi-stage semiconductor cooling component 14, the core sample can be fixed, rotated for scanning, and efficiently temperature-controlled. Specifically, the core detection component 12 includes an upper temperature control section 122, a lower temperature control section 123, and an irradiation section 121 located between the upper and lower temperature control sections 122 and 123. The irradiation section 121 is unobstructed, allowing X-rays to penetrate the core sample area without obstruction, avoiding interference from traditional temperature control jackets on the imaging path. In addition, heat exchange is achieved by directly attaching the multi-stage semiconductor cooling component 14 to the outer surface of the temperature control section. Combined with the phase change temperature control component 13, which consists of an upper heat-conducting cylinder 132, a lower heat-conducting cylinder 133, and a heat-conducting brush 134, heat is effectively dissipated, achieving temperature control while maintaining X-ray penetration.

[0062] Please refer to the following: Figures 6 to 7In some embodiments, the heat dissipation groove 1312 has a recessed end and a flat end disposed opposite to each other. The recessed end is fitted to the end of the heat storage rod 1311 away from the core detection piece 12; the flat end is fitted to the cold end of the auxiliary semiconductor refrigeration chip 1313. Heat from the upper heat-conducting cylinder 132 and the lower heat-conducting cylinder 133 is transferred to the heat storage rod 1311 through the thermally conductive fiber 135, and the heat dissipation groove 1312 is used to dissipate heat from the heat storage rod 1311. Furthermore, by setting up the heat storage rod 1311, the heat dissipation groove 1312, and the auxiliary semiconductor refrigeration chip 1313, and filling the interior of the heat storage rod 1311 with a phase change medium, and with the heat dissipation groove 1312 fitted to the auxiliary semiconductor refrigeration chip 1313, the heat can be quickly transferred and dispersed after the heat storage rod 1311 absorbs heat, improving heat dissipation efficiency and ensuring the stable operation of the temperature control system. Because the upper temperature control section 122, the irradiation section 121, and the lower temperature control section 123 have good thermal conductivity, the temperature distribution in the irradiation section 121 can be ensured to be uniform. The dual-sided design improves the overall thermal conductivity and temperature control capabilities, which helps to achieve consistent temperature control of the core sample.

[0063] Please refer to the following: Figures 3 to 5 In some embodiments, each heat storage rod 1311 is provided with a hollow copper tube 1344 and a heat-conducting fiber storage interlayer 1345 located on its outer periphery. The hollow copper tube 1344 is filled with a phase change medium. One end of the heat-conducting fiber 135 is fixed to the hollow copper tube 1344, and the other end of the heat-conducting fiber 135 extends through the opening of the heat storage rod 1311 and is fixedly connected to the upper heat-conducting cylinder 132 or the lower heat-conducting cylinder 133. A rotary motor 1346 is provided at the bottom of each heat storage rod 1311. The rotary motor 1346 is used to drive the hollow copper tube 1344 to rotate, thereby realizing the recovery or release of the heat-conducting fiber 135. Furthermore, by filling the hollow copper tube 1344 with a phase change medium and providing a heat-conducting fiber storage interlayer 1345 between it and the inner wall, with the heat-conducting fiber 135 wound around the hollow copper tube 1344, the length of the heat conduction path and the heat storage capacity are enhanced. Simultaneously, a rotary motor 1346 drives the hollow copper tube 1344 to rotate, thereby enabling the recovery or release of the heat-conducting fiber 135 to meet the heat conduction requirements under different operating conditions. The length of the heat conduction path can be dynamically adjusted, further improving temperature control response efficiency and accuracy.

[0064] Please refer to the following: Figure 8 and Figure 9In some embodiments, the core testing component 12 further includes an upper shell 126 and a lower shell 127; one end of the upper shell 126 is detachably connected to the upper temperature control section 122; the other end of the upper shell 126 is provided with a pressure injection port 1211; one end of the lower shell 127 is detachably connected to the lower temperature control section 123, specifically, the detachable connection can be a screw connection or a sleeve connection; the other end of the lower shell 127 is provided with a water injection hole 1212, which is used to inject pure water into the core testing component 12. Therefore, by setting the upper shell 126 and the lower shell 127 in the core testing component 12, and providing the pressure injection port 1211 and the water injection hole 1212, not only is modular assembly of the upper temperature control section 122 and the lower temperature control section 123 achieved, but it also facilitates the injection of pure water or pressurization during experiments, which helps to simulate complex experimental environments such as hydrate resource development and carbon dioxide sequestration formation.

[0065] Please refer to the following: Figure 7 In some embodiments, both the upper temperature control section 122 and the lower temperature control section 123 are provided with square protrusions 124, and the multi-stage semiconductor cooling component 14 is attached to each of the four sides of the square protrusions 124. Furthermore, by providing the square protrusions 124 on the surfaces of the upper and lower temperature control sections 122 and 123, the cooling element can be attached to eight surfaces, expanding the heat exchange area, thereby improving temperature control efficiency and accelerating thermal response. This helps to form a more uniform temperature distribution and avoids excessive temperature gradients in the core sample.

[0066] Please refer to the following: Figure 11In some embodiments, the semiconductor multi-stage cooling-based cold-clamping spindle holder 10 further includes a clamping base 15, a pressure sensor 16, a temperature sensor 17, a pressurization device 18, an X-ray source 19, and a flat panel detector 20. The X-ray source 19 and the flat panel detector 20, along with the turntable of the clamping base 15 and the X-ray source 19, collectively form a CT scanning device. The rotating seat 11 is fixedly mounted on the clamping base 15. The pressure sensor 16 is used to detect the pressure inside the core sample 12. The pressure sensor 16 is mounted on the clamping base 15. The temperature sensor 17 is used to detect the temperature inside the core sample 12. The temperature sensor 17 is mounted on the clamping base 15. The probes of both the temperature sensor 17 and the pressure sensor 16 are located inside the core sample 12 through the water injection hole 1212. Specifically, in other embodiments, the temperature sensor 17 and the pressure sensor 16 can be coupled into an integrated temperature and pressure sensor. The pressurizing device 18 is used to pressurize the cavity inside the core sample 12; the pressurizing device 18 is mounted on the clamping base 15; the pressurizing pipe of the pressurizing device 18 is installed inside the core sample 12 through the injection port 1211; the pressurizing device 18 is equipped with an additional pressure sensing component to control the pressurization of the cavity inside the core sample 12; the X-ray source 19 is located in front of the core sample 12 to scan the irradiation section 121; the X-ray source 19 is mounted on the clamping base 15; the flat panel detector 20 is located behind the core sample 12 to receive the irradiation signal from the X-ray source 19; the flat panel detector 20 is mounted on the clamping base 15. Furthermore, by setting the clamping base 15, the rotating seat 11, X-ray source 19, flat panel detector 20, pressure sensor 16, temperature sensor 17, and pressurizing device 18 are integrated into one unit. The X-ray source 19 and the flat panel detector 20 are respectively set on both sides of the irradiation section 121. With the unobstructed design of the irradiation section 121, high-throughput and high-precision CT scanning can be achieved. At the same time, the temperature and pressure sensor 16 can monitor the experimental status inside the core in real time, and the pressurization device 18 provides the ability to adjust the pressure of the experimental chamber. This makes the device suitable not only for static imaging, but also for in-situ dynamic process research in complex experimental environments.

[0067] Please refer to the following: Figure 10In some embodiments, the rotating base 11 includes a base rotor 112, ball bearings 113, a retainer 114, and a base stator 111. The base rotor 112 is sleeved on the lower temperature control section 123. The base rotor 112 is rotatably connected to the base stator 111. The ball bearings 113 are disposed between the base stator 111 and the base rotor 112, and are fixed by the retainer 114. The base rotor 112 is fixed to the turntable of the X-ray source 19. The heat-conducting brush 134 is also fixed to the base stator 111. Thus, by setting the base rotor 112 and the base stator 111, the core sample 12 can rotate smoothly. Simultaneously, by fixing the heat-conducting brush 134 to the base stator 111 and linking the base rotor 112 with the turntable of the X-ray source 19, synchronous rotation of the core sample during scanning can be achieved, avoiding imaging errors caused by friction or offset.

[0068] Please refer to the following: Figure 12 In some embodiments, the multi-stage semiconductor cooling-based cooling spindle clamp 10 further includes a control device 21. The control device 21 is electrically connected to the pressure sensor 16, temperature sensor 17, pressurizing device 18, X-ray source 19, flat panel detector 20, auxiliary semiconductor cooling chip 1313, rotary motor 1346, and multi-stage semiconductor cooling assembly 14. By setting the control device 21 and electrically connecting it to the rotary motor 1346, pressure sensor 16, temperature sensor 17, pressurizing device 18, and X-ray source 19, intelligent control and coordinated operation of the entire system can be achieved. The control device 21 can set and adjust temperature and pressure parameters in real time according to experimental requirements, realizing coordinated control of temperature, pressure, rotation, and image acquisition, effectively improving detection efficiency.

[0069] In some embodiments, the thermally conductive fiber is graphite fiber to improve thermal conductivity and reduce wear during the winding process.

[0070] In some embodiments, the semiconductor multi-stage cooling-based cold-binding spool holder 10 can also be used to load different reactants or porous media for low-temperature in-situ experiments, and can also simulate the image characterization of low-temperature mineralization reactions under different strata, further improving the practicality of the semiconductor multi-stage cooling-based cold-binding spool holder 10.

[0071] In summary, this application provides a cold-binding spinneret holder based on semiconductor multi-stage refrigeration. The cold-binding spinneret holder includes: a rotating base; a core sample, comprising an upper temperature control section, an irradiation section, and a lower temperature control section; the irradiation section, made of polyetheretherketone (PEEK) material, is disposed between the upper and lower temperature control sections; the lower temperature control section is disposed on the rotating base; the core sample sample is provided with a sample-supporting protrusion ring located below the irradiation section to fix the core sample; and a phase change temperature control assembly, comprising an upper heat-conducting cylinder, a lower heat-conducting cylinder, and a pair of symmetrically fixed heat-conducting brushes on the rotating base, wherein the upper and lower heat-conducting cylinders are connected in parallel via heat-conducting fibers. Each of the aforementioned thermal brushes is fixedly connected to the sidewalls of the upper and lower thermal conductive cylinders. The multi-stage semiconductor refrigeration assembly includes at least four upper semiconductor refrigeration chips and at least four lower semiconductor refrigeration chips. The cold end of each upper semiconductor refrigeration chip is attached to the outer surface of the upper temperature control section, and the hot end is in contact with the upper thermal conductive cylinder. The cold end of each lower semiconductor refrigeration chip is attached to the outer surface of the lower temperature control section, and the hot end is in contact with the lower thermal conductive cylinder. Each thermal brush includes a heat storage rod, a heat dissipation groove, and an auxiliary semiconductor refrigeration chip. The heat storage rod contains "roll-type" thermally conductive fibers. When the rotating seat drives the core sample to rotate, the thermally conductive fibers are released from the heat storage rod and wound around the surfaces of the upper and lower thermal conductive cylinders to achieve dynamic heat conduction adjustment. Therefore, by setting up the rotating seat, core sample, phase change temperature control assembly, and multi-stage semiconductor refrigeration assembly, the fixation, rotational scanning, and efficient temperature control of the core sample are achieved. Specifically, the core sample includes an upper temperature control section, a lower temperature control section, and an irradiation section located in between. The irradiation section is completely unobstructed, allowing X-rays to penetrate the core sample area without hindrance, avoiding interference with the imaging path caused by traditional temperature control jackets. Furthermore, heat exchange is achieved through multi-stage semiconductor cooling components directly attached to the outer surface of the temperature control section. Combined with a phase-change temperature control component consisting of an upper heat-conducting cylinder, a lower heat-conducting cylinder, and a heat-conducting brush, heat is effectively dissipated, achieving temperature control while maintaining X-ray penetration. This multi-stage thermal control design achieves a closed-loop temperature control scheme of "localized precise cooling—rotational thermal coupling—interference-free thermal buffering," significantly improving temperature control accuracy and system stability, solving the semiconductor heat dissipation problem in a closed scanning environment, balancing the rotational adaptability of the device structure with the interference-free imaging area, avoiding liquid cooling artifacts, and ensuring the clarity and consistency of X-ray CT scan images. Overall, it achieved low-temperature, steady-state, high-definition, and artifact-free operating conditions for core samples in X-ray CT scanning, improving the experimental reliability and imaging accuracy of hydrate resource development and carbon dioxide sequestration research.

[0072] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A cold-seal core holder based on semiconductor multistage refrigeration for imaging scanning of hydrate resource development and carbon dioxide sequestration, characterized in that, The cold-rolling core clamping device based on semiconductor multi-stage refrigeration comprises: a rotating seat; a core detection piece, which comprises an upper temperature control section, an irradiation section and a lower temperature control section; the irradiation section is made of polyether ether ketone material and is arranged between the upper temperature control section and the lower temperature control section; the lower temperature control section is arranged on the rotating seat; a sample holding protruding ring is arranged in the core detection piece and is located below the irradiation section to fix the core sample so that the sample is completely in the irradiation section; a phase change temperature control assembly, which comprises an upper heat conduction cylinder, a lower heat conduction cylinder and a pair of symmetrical heat conduction brushes fixed on the rotating seat; the upper heat conduction cylinder and the lower heat conduction cylinder are connected in parallel through the heat conduction brushes; each heat conduction brush is fixedly connected with the side wall of the upper heat conduction cylinder and the lower heat conduction cylinder; a multi-stage semiconductor refrigeration assembly, which comprises at least four upper semiconductor refrigeration pieces and at least four lower semiconductor refrigeration pieces; the cold end of the upper semiconductor refrigeration piece is attached to the outer surface of the upper temperature control section, and the hot end is in contact with the upper heat conduction cylinder; the cold end of the lower semiconductor refrigeration piece is attached to the outer surface of the lower temperature control section, and the hot end is in contact with the lower heat conduction cylinder; each heat conduction brush comprises a heat storage rod, a heat dissipation groove and an auxiliary semiconductor refrigeration piece; the heat storage rod is provided with "spool type" heat conduction fibers; when the rotating seat drives the core detection piece to rotate, the heat conduction fibers are released from the heat storage rod and wound on the surface of the upper heat conduction cylinder and the lower heat conduction cylinder to realize dynamic heat conduction adjustment.

2. The cold-seal plunger holder based on semiconductor multistage refrigeration according to claim 1, characterized in that, the heat storage rod is provided with a hollow copper pipe and a heat conduction fiber storage layer around the outer periphery; the hollow copper pipe is filled with a phase change medium; one end of the heat conduction fiber is fixed on the hollow copper pipe, and the other end of the heat conduction fiber extends out of the opening of the heat storage rod and is fixedly connected with the upper heat conduction cylinder and the lower heat conduction cylinder; wherein, the bottom of the heat storage rod is provided with a rotating motor, which is used to drive the hollow copper pipe to rotate and realize the recovery or release of the heat conduction fibers.

3. The cold-rolling core clamping device based on semiconductor multi-stage refrigeration according to claim 2, wherein the heat dissipation groove has a recessed end and a flat end arranged oppositely; the recessed end is arranged in close contact with one end of the heat storage rod away from the core detection piece; the flat end is in close contact with the cold end of the auxiliary semiconductor refrigeration piece; wherein, the heat of the upper heat conduction cylinder and the lower heat conduction cylinder is transmitted to the heat storage rod through the heat conduction fibers, and the heat dissipation groove is used for heat dissipation of the heat storage rod.

4. The cold-rolling core clamping device based on semiconductor multi-stage refrigeration according to claim 3, wherein an upper sleeve is detachably connected with the upper temperature control section at one end; the other end of the upper sleeve is provided with a pressure injection port; a lower sleeve is detachably connected with the lower temperature control section at one end; the other end of the lower sleeve is provided with a water injection hole, which is used for injecting pure water into the core detection piece.

5. The cold-rolling core clamping device based on semiconductor multi-stage refrigeration according to claim 4, wherein the outer surfaces of the upper temperature control section and the lower temperature control section are provided with square protrusions, and the square protrusions are in close contact with the multi-stage semiconductor refrigeration assembly on four sides.

6. The cold-seal plunger holder based on semiconductor multistage refrigeration according to claim 5, characterized in that The cold-joining rotary core holder based on semiconductor multistage refrigeration further comprises: A clamping base, wherein the rotating seat is fixedly arranged on the clamping base; A pressure sensor for detecting the cavity pressure of the core detection piece, wherein the pressure sensor is arranged on the clamping base; A temperature sensor for the temperature inside the core detection piece, wherein the temperature sensor is arranged on the clamping base; the probes of the temperature sensor and the pressure sensor both penetrate into the core detection piece through the water injection hole; A pressure boosting device for pressurizing the cavity of the core detection piece, wherein the pressure boosting device is arranged on the clamping base; the interface of the pressure boosting device is arranged in the core detection piece through the pressure injection port; An X-ray source arranged on the clamping base and arranged in front of the core detection piece, wherein the X-ray source is used for scanning the irradiation section; A flat panel detector arranged on the clamping base and arranged behind the core detection piece, wherein the flat panel detector is used for receiving the irradiation signal of the X-ray source.

7. The cold-seal core holder based on semiconductor multistage refrigeration of claim 6, wherein, The rotating seat comprises: A base rotor sleeved on the lower temperature control section; A base stator rotationally connected with the base rotor; A plurality of balls arranged between the base stator and the base rotor, wherein the balls are fixed by a retainer; the base rotor is fixed with a turntable of the X-ray source; and the heat-conducting brushes are all fixed on the base stator.

8. The cold-joining rotary core holder based on semiconductor multistage refrigeration according to claim 7, wherein the cold-joining rotary core holder further comprises: A control device electrically connected with the pressure sensor, the temperature sensor, the pressure boosting device, the X-ray source, the flat panel detector, the auxiliary semiconductor refrigeration piece, the rotary motor and the multistage semiconductor refrigeration assembly. The heat-conducting fibers are graphite fibers, so as to improve the heat-conducting efficiency and reduce the abrasion in the winding process.

9. The cold-seal plunger holder based on semiconductor multistage refrigeration according to any one of claims 1 to 8, characterized in that ​

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