Aging test method of power module, electronic equipment and storage medium

Abstract

The application relates to the technical field of device aging, and particularly discloses an aging test method of a power module, electronic equipment and a storage medium, wherein the method comprises the following steps: acquiring real-time environmental temperature and real-time environmental humidity of the power module in an aging test process; determining a humidity operation condition of the power module according to the real-time environmental humidity, and determining real-time junction temperature of the power module based on the real-time environmental temperature and the humidity operation condition; and evaluating the life health state of the power module according to the real-time junction temperature. In the application, the influence of environmental temperature on the life of the power module under application conditions is considered, and the influence of environmental humidity is also considered. In particular, for an outdoor application scenario, the accuracy of the obtained real-time junction temperature of the power module is higher, and the evaluation of the life health state of the power module based on the real-time junction temperature is more reliable, so that the accuracy of the life health evaluation of the power module is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of device aging, and particularly relates to a power module aging test method, an electronic device and a storage medium. BACKGROUND

[0002] In functional conversion devices such as converters and inverters, a power module, as a kind of semiconductor chip, can realize key functions such as power configuration and conversion, thereby providing good protection for keeping the overall system in a stable working state, so the importance of the power module is self-evident. For the power modules on the market, the service life health condition becomes a more concerned actual problem. At present, the service life evaluation of the power modules on the market can be realized through aging test, and the main means is to perform simulation analysis on a single parameter associated with the power module. Although the aging test result can be obtained to evaluate the service life to some extent, the evaluation basis is relatively one-sided, which leads to a decrease in the accuracy of the evaluation result, and especially considering the complexity of the outdoor application environment, this defect will be more obvious. SUMMARY

[0003] The present application aims to at least solve one of the technical problems in the related art. To this end, the present application provides a power module aging test method, an electronic device and a storage medium, which can improve the accuracy of power module service life health evaluation.

[0004] In a first aspect, an embodiment of the present application provides a power module aging test method, comprising the following steps:

[0005] Step S1, acquiring a real-time environment temperature and a real-time environment humidity of the power module in an aging test process;

[0006] Step S2, determining a humidity operation condition of the power module according to the real-time environment humidity, and determining a real-time junction temperature of the power module based on the real-time environment temperature and the humidity operation condition;

[0007] Step S3, evaluating a service life health state of the power module according to the real-time junction temperature.

[0008] Optionally, in an embodiment of the present application, the step S2 comprises the following steps:

[0009] Step S21, when the real-time environment humidity is less than or equal to a preset first humidity threshold, determining that the power module is in a humidity good operation condition;

[0010] Step S22, under the humidity good operation condition, calculating a product of a real-time operation power of the power module acquired and a predetermined thermal resistance value of the power module to obtain a temperature influence value;

[0011] Step S23, obtaining the sum of the real-time ambient temperature and the temperature influence value to obtain the real-time junction temperature of the power module.

[0012] Optionally, in an embodiment of the present application, the step S2 comprises the following steps:

[0013] Step S24, when the real-time ambient humidity is greater than a preset first humidity threshold and less than a preset second humidity threshold, determining that the power module is in a humidity stable operation condition, wherein the second humidity threshold is greater than the first humidity threshold;

[0014] Step S25, in the humidity stable operation condition, judging whether the real-time ambient temperature is greater than a preset first temperature threshold, if yes, determining the real-time junction temperature of the power module according to the real-time ambient humidity, the real-time ambient temperature, the first humidity threshold, a predetermined thermal resistance value of the power module and the obtained real-time operating power of the power module, otherwise executing step S26;

[0015] Step S26, calculating the product of the real-time operating power of the power module and the thermal resistance value of the power module to obtain a temperature influence value, and obtaining the sum of the real-time ambient temperature and the temperature influence value to obtain the real-time junction temperature of the power module.

[0016] Optionally, in an embodiment of the present application, the step in the step S25 of determining the real-time junction temperature of the power module according to the real-time ambient humidity, the real-time ambient temperature, the first humidity threshold, a predetermined thermal resistance value of the power module and the obtained real-time operating power of the power module is realized by using the following calculation formula:

[0017] ;

[0018] wherein, is the real-time junction temperature of the power module, and the unit is ; is the real-time ambient temperature, and the unit is ; is a first humidity-thermal resistance correlation parameter, and is dimensionless; is the real-time ambient humidity, and is dimensionless; is the first humidity threshold, and is dimensionless; is the thermal resistance value of the power module, and the unit is ; is the real-time operating power of the power module, and the unit is .

[0019] Optionally, in an embodiment of the present application, the step S2 comprises the following steps:

[0020] Step S27, when the real-time ambient humidity is greater than or equal to the preset second humidity threshold, determining that the power module is in a humidity fluctuation operating condition;

[0021] Step S28, in the humidity fluctuation operating condition, obtaining a difference between the real-time ambient humidity and the second humidity threshold to obtain a humidity fluctuation amount;

[0022] Step S29, determining a real-time junction temperature of the power module according to the real-time ambient temperature, the humidity fluctuation amount and a predetermined maximum humidity change amount.

[0023] Optionally, in an embodiment of the present application, the step S29 comprises the following steps:

[0024] Step S291, judging whether the humidity fluctuation amount exceeds the maximum humidity change amount, if yes, determining the real-time junction temperature of the power module according to the maximum humidity change amount, the real-time ambient temperature, a predetermined thermal resistance value of the power module and an obtained real-time operating power of the power module, otherwise, executing step S292;

[0025] Step S292, determining the real-time junction temperature of the power module according to the humidity fluctuation amount, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the obtained real-time operating power of the power module.

[0026] Optionally, in an embodiment of the present application, the step S292 is implemented by using the following calculation formula:

[0027] ;

[0028] wherein, is the real-time junction temperature of the power module, unit is ; is the real-time ambient temperature, unit is ; is a second humidity-thermal resistance correlation parameter, dimensionless; is the humidity fluctuation amount, dimensionless; is the thermal resistance value of the power module, unit is ; is the real-time operating power of the power module, unit is .

[0029] Optionally, in an embodiment of the present application, the step S3 comprises the following steps:

[0030] Step S31, obtaining a standard junction temperature of the power module in an optimal operating state, and determining a normal service life of the power module according to the standard junction temperature.

[0031] In step S32, a difference junction temperature value of the real-time junction temperature and the standard junction temperature is obtained, and according to the difference junction temperature value and a normal service life cycle of the power module, a real-time service life cycle of the power module is determined.

[0032] In a second aspect, an embodiment of the present application provides an electronic device, comprising:

[0033] at least one processor;

[0034] at least one memory for storing at least one program;

[0035] When the at least one program is executed by the at least one processor, the method for testing the aging of the power module is implemented.

[0036] In a third aspect, an embodiment of the present application provides a computer readable storage medium, wherein the computer readable storage medium stores a program executable by a processor, and when the program executable by the processor is executed by the processor, the method for testing the aging of the power module is implemented.

[0037] The method for testing the aging of the power module, the electronic device and the storage medium provided by the present application obtain the real-time environmental temperature and the real-time environmental humidity of the power module in the aging test process, and then determine the humidity operation condition of the power module according to the real-time environmental humidity, and determine the real-time junction temperature of the power module based on the real-time environmental temperature and the humidity operation condition. Compared with the related prior art, not only the influence of the environmental temperature on the service life of the power module under the application condition is considered, but also the influence of the environmental humidity is considered. Especially for outdoor application scenarios, the influence of the environmental humidity will be more obvious. That is, the real-time junction temperature of the power module obtained in the above manner is more accurate, and the further evaluation of the service life health status of the power module is more reliable, which is beneficial to improve the accuracy of the service life health evaluation of the power module. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 is a flowchart of the method for testing the aging of the power module provided by an embodiment of the present application;

[0039] Figure 2 is a flowchart of step S2 in Figure 1

[0040] Figure 3 is an execution flow diagram of the method for testing the aging of the power module provided by an embodiment of the present application;

[0041] Figure 4 is another flowchart of step S2 in Figure 1 ​​

[0042] Figure 5 is Figure 1 another flowchart of step S2 in

[0043] Figure 6 is Figure 5 a flowchart of step S29 in

[0044] Figure 7 is Figure 1 a flowchart of step S3 in

[0045] Figure 8 is a structural schematic diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0046] As Figure 1 shown, an embodiment of the present application provides an aging test method for a power module, which can but is not limited to specifically include steps S1 to S3.

[0047] Step S1, acquiring real-time ambient temperature and real-time ambient humidity of the power module during the aging test process. Understandably, the power module can but is not limited to be applied to a corresponding type, parameter, and the like configured inverter, inverter, and the like, which can be determined according to the actual scene, which is not limited here, for example, it can but is not limited to be applied to an indoor energy storage inverter, an outdoor photovoltaic inverter, and the like; the "aging test environment" here can be any kind of test environment in actual situation, which involves parameters, internal architecture, and the like determined according to the actual scene, for example, it can but is not limited to adopt a test bench as the main body, and configure multiple related working condition units such as electrical control unit, data analysis unit, and environment simulation unit, which is not limited here; the above-mentioned various device architectures are used to build at least one test environment, which can be used as an aging test environment, that is, for the test device architecture, it can but is not limited to correspond to multiple test environments, and the embodiment is still applicable;

[0048] Among them, the real-time ambient temperature can but is not limited to be measured by a temperature sensor, a thermocouple, and the like, which can sample the ambient temperature around the power module shell; the real-time ambient humidity can but is not limited to be measured by a hygrometer, a temperature and humidity detector, and the like; the "real-time ambient temperature" and "real-time ambient humidity" shown in the above embodiment correspond to the same sampling node (time);

[0049] Step S2, determining the humidity operating condition of the power module according to the real-time ambient humidity, and determining the real-time junction temperature of the power module based on the real-time ambient temperature and the humidity operating condition;

[0050] Step S3, evaluating the life health status of the power module according to the real-time junction temperature.

[0051] In this step, the real-time ambient temperature and humidity of the power module during the aging test are obtained. Then, the humidity operating condition of the power module is determined based on the real-time ambient humidity. Based on the real-time ambient temperature and humidity operating condition, the real-time junction temperature of the power module is determined. Compared with related existing technologies, this method not only considers the impact of ambient temperature on the lifespan of the power module under application conditions, but also the impact of ambient humidity. Especially for outdoor application scenarios, the impact of ambient humidity will be more significant. In other words, the real-time junction temperature of the power module obtained by the above method is more accurate. Based on this, the further evaluation of the lifespan health status of the power module is more reliable and helps to improve the accuracy of power module lifespan health assessment.

[0052] In one embodiment, the specific operating conditions involved in the "aging state test" in step S1 can be various, such as charging test, discharging test, protection function test, grid connection test, etc. It should be noted that this embodiment does not focus on the specific operating conditions, but rather on the influence of test environment temperature and humidity under any specific operating condition.

[0053] like Figure 2 As shown, in one embodiment of the present invention, step S2 may include, but is not limited to, the following steps:

[0054] Step S21: When the real-time ambient humidity is less than or equal to the preset first humidity threshold, it is determined that the power module is in a good humidity operating condition.

[0055] Step S22: Under good humidity operating conditions, calculate the product of the real-time operating power of the power module and the predetermined thermal resistance value of the power module to obtain the temperature influence value.

[0056] Step S23: Obtain the sum of the real-time ambient temperature and the temperature influence value to get the real-time junction temperature of the power module.

[0057] In this step, the first humidity threshold is an important parameter for measuring whether the power module is in its optimal operating state. Its specific value can be set by those skilled in the art based on the power module's own configuration, historical operating data, etc., and there is no restriction here. When the real-time ambient humidity is less than or equal to the preset first humidity threshold, it indicates that the power module is in a good humidity operating condition. Under this condition, the ambient humidity is at a normal level, and its impact on the thermal resistance of the power module is relatively small and can be ignored. Therefore, in this case, the product of the obtained real-time operating power of the power module and the predetermined thermal resistance of the power module is directly calculated to obtain the temperature influence value. Then, the sum of the real-time ambient temperature and the temperature influence value is obtained to obtain the real-time junction temperature of the power module under this condition.

[0058] Specifically, with Figure 3For example, first, determine whether the real-time ambient humidity during the aging test does not exceed 30%RH. If the sampled real-time ambient humidity is 25%RH, it can be determined that the power module is operating under good humidity conditions. Then, based on the relevant parameters obtained from the sampling, the real-time junction temperature is calculated. For example, taking the power module of a photovoltaic inverter under test as an example, the sampled real-time ambient temperature is 27℃. The real-time operating power of the power module is 15. Furthermore, by checking the product specifications of the power module, we learned that its thermal resistance is 0.2. Then, the real-time junction temperature of the power module under this operating condition can be calculated to be 30°C. .

[0059] like Figure 4 As shown, in one embodiment of the present invention, step S2 may include, but is not limited to, the following steps:

[0060] Step S24: When the real-time ambient humidity is greater than the preset first humidity threshold and less than the preset second humidity threshold, it is determined that the power module is in a stable humidity operating condition, wherein the second humidity threshold is greater than the first humidity threshold.

[0061] Step S25: Under stable humidity operating conditions, determine whether the real-time ambient temperature is greater than the preset first temperature threshold. If so, determine the real-time junction temperature of the power module based on the real-time ambient humidity, real-time ambient temperature, first humidity threshold, predetermined thermal resistance value of the power module, and the obtained real-time power consumption of the power module. Otherwise, proceed to step S26.

[0062] Step S26: Calculate the product of the real-time power consumption of the power module and the thermal resistance of the power module to obtain the temperature influence value, and obtain the sum of the real-time ambient temperature and the temperature influence value to obtain the real-time junction temperature of the power module.

[0063] In this step, the second humidity threshold value is an important parameter for measuring whether the power module is in a stable running state, which is only second to the optimal running state. The specific value can also be set by a person skilled in the art according to the self-configuration of the power module, historical running data, etc. This is not limited here. When the real-time environmental humidity is greater than the preset first humidity threshold value and less than the preset second humidity threshold value, it is indicated that the power module is not in the optimal running state, but is still in a relatively stable running condition. In this condition, the real-time environmental temperature value needs to be combined for further judgment. That is, if it is determined that the real-time environmental temperature is greater than the preset first temperature threshold value, it is indicated that the degree of correlation between the environmental temperature and the environmental humidity in this condition is relatively obvious, and the environmental temperature presents an upward trend. In this case, the influence of the environmental humidity on the thermal resistance value needs to be considered, so as to determine the real-time junction temperature of the power module according to the real-time environmental humidity, the real-time environmental temperature, the first humidity threshold value, the predetermined thermal resistance value of the power module, and the obtained real-time power consumption of the power module. On the contrary, it is indicated that the degree of correlation between the environmental temperature and the environmental humidity in this condition is not high, and the environmental humidity presents a stable trend. In this case, the influence of the environmental humidity on the thermal resistance value does not need to be considered, and the product of the real-time power consumption of the power module and the thermal resistance value of the power module can still be calculated to obtain the temperature influence value, and the sum of the real-time environmental temperature and the temperature influence value can be obtained to determine the real-time junction temperature of the power module.

[0064] In an embodiment, the step of determining the real-time junction temperature of the power module according to the real-time environmental humidity, the real-time environmental temperature, the first humidity threshold value, the predetermined thermal resistance value of the power module, and the obtained real-time power consumption of the power module in step S25 can be but not limited to realized by using the following calculation formula:

[0065] ;

[0066] wherein, is the real-time junction temperature of the power module, and the unit is ; is the real-time environmental temperature, and the unit is ; is the first humidity-thermal resistance correlation parameter, which is dimensionless, and can be set according to the actual scene. This is not limited here; is the real-time environmental humidity, which is dimensionless; is the first humidity threshold value, which is dimensionless, and can be set according to the actual scene. This is not limited here; is the thermal resistance value of the power module, and the unit is ; is the real-time power consumption of the power module, and the unit is .

[0067] It can be understood that, This indicates the value by which the real-time ambient humidity exceeds the first humidity threshold. This characterizes the extent to which the real-time ambient humidity exceeds the first humidity threshold, thus affecting the thermal resistance value.

[0068] Specifically, with Figure 3 For example, further determine whether the real-time ambient humidity during the aging test is greater than 30%RH and less than 40%RH. If the real-time ambient humidity is 36%RH, it can be determined that the power module is in a stable humidity operating condition. Further determine whether the ambient temperature is greater than 35°C. If the real-time ambient humidity obtained from the sampling is 38 The junction temperature is then calculated in real time based on the relevant parameters obtained from the sampling. For example, taking the power module of a photovoltaic inverter under test as an example, the sampled real-time ambient temperature is 38°C. The real-time ambient humidity is 36%RH, the set first humidity threshold is 30%RH, the first humidity-thermal resistance correlation parameter is 2.5, and the real-time operating power of the power module is 15. Furthermore, by checking the product specifications of the power module, we learned that its thermal resistance is 0.2. Therefore, the real-time junction temperature of the power module under this operating condition can be calculated to be 41.45°C. Conversely, if the ambient temperature obtained from the sampling is 27... Based on the same calculation method as in the above embodiments, the real-time junction temperature of the power module under this operating condition can be calculated to be 30°C. .

[0069] It is understood that the units of the various dimensions in the above embodiments and subsequent embodiments are not uniquely limited, and can be converted to corresponding units based on equivalent transformations. The above formulas still apply, for example, by... Transform into , Transform into There are no restrictions here.

[0070] like Figure 5 As shown, in one embodiment of the present invention, step S2 may include, but is not limited to, the following steps:

[0071] Step S27: When the real-time ambient humidity is greater than or equal to the preset second humidity threshold, it is determined that the power module is in a humidity fluctuation operation condition.

[0072] Step S28: Under the condition of humidity fluctuation, obtain the difference between the real-time ambient humidity and the second humidity threshold to obtain the humidity fluctuation amount;

[0073] Step S29, determining the real junction temperature of the power module according to the real-time ambient temperature, the humidity fluctuation and the predetermined maximum humidity change amount.

[0074] In this step, it is determined that the real-time ambient humidity of the power module is at a high level by judging that the real-time ambient humidity is greater than or equal to the preset second humidity threshold value. The real-time junction temperature of the power module needs to be determined in combination with the ambient humidity and the ambient temperature, especially for the real-time ambient humidity. In the specific humidity fluctuation operating condition, the humidity fluctuation is obtained by obtaining the difference between the real-time ambient humidity and the second humidity threshold value. The humidity fluctuation represents the rising trend of the real-time ambient humidity relative to the second humidity threshold value, and can better represent the fluctuation of the real-time ambient humidity. Therefore, the real-time junction temperature of the power module can be determined according to the real-time ambient temperature, the humidity fluctuation and the predetermined maximum humidity change amount.

[0075] As shown in FIG. 8, in one embodiment of the present application, step S29 can but not limited to include the following steps: Figure 6

[0076] Step S291, judging whether the humidity fluctuation exceeds the maximum humidity change amount. If yes, the real junction temperature of the power module is determined according to the maximum humidity change amount, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the obtained real-time power consumption of the power module. Otherwise, step S292 is performed.

[0077] Step S292, determining the real junction temperature of the power module according to the humidity fluctuation, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the obtained real-time power consumption of the power module.

[0078] In this step, when it is determined that the humidity fluctuation exceeds the maximum humidity change amount, it is indicated that the deviation of the ambient humidity at this time exceeds the humidity change threshold value range that the power module can withstand. In this case, the influence of the maximum humidity change amount on the thermal resistance value is considered, so that the real junction temperature of the power module is determined according to the maximum humidity change amount, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the obtained real-time power consumption of the power module. Otherwise, it is indicated that the deviation of the ambient humidity at this time is within the humidity change threshold value range that the power module can withstand. In this case, the influence of the humidity fluctuation on the thermal resistance value can be considered, that is, the real junction temperature of the power module is determined according to the humidity fluctuation, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the obtained real-time power consumption of the power module.

[0079] In one embodiment, step S292 can but not limited to be realized by using the following calculation formula:

[0080] ;

[0081] In the formula, Tj represents the real junction temperature of the power module, R represents the thermal resistance value of the power module, T represents the real-time ambient temperature, P represents the real-time power consumption of the power module, and ΔH represents the humidity fluctuation. ​is the real-time junction temperature of the power module, unit is ; is the real-time ambient temperature, unit is ; is the second humidity-thermal resistance correlation parameter, dimensionless, generally, the second humidity-thermal resistance correlation parameter should be set to be larger than the first humidity-thermal resistance correlation parameter, i.e. ; is the humidity fluctuation amount, dimensionless, , is the second humidity threshold value; is the thermal resistance value of the power module, unit is ; is the real-time power consumption of the power module, unit is .

[0082] Understandably, i.e. represents the influence degree of the humidity fluctuation amount relative to the thermal resistance value.

[0083] Similarly, if the humidity fluctuation amount exceeds the maximum humidity change amount, the real-time junction temperature of the power module can be determined by using the following calculation formula, but not limited to:

[0084] ;

[0085] wherein, is the maximum humidity change amount, i.e. represents the influence degree of the maximum humidity change amount relative to the thermal resistance value.

[0086] Specifically, taking Figure 3 for example, it is further judged whether the real-time ambient humidity in the aging test process sampled is greater than 40%RH, if the real-time ambient humidity sampled is 50%RH, it is determined that the power module is in a humidity fluctuation operating condition, so as to obtain the difference between the real-time ambient humidity and the second humidity threshold value (40%RH), and the humidity fluctuation amount is 10%RH, and then it is judged whether the humidity fluctuation amount 10%RH is less than the maximum humidity change amount (set to 15%RH here), and the real-time junction temperature of the power module is determined according to the maximum humidity change amount, the real-time ambient temperature, the pre-determined thermal resistance value of the power module and the real-time power consumption of the power module obtained, for example, taking the power module of a photovoltaic inverter to be tested as an example, the real-time ambient temperature sampled is 41 , the real-time ambient humidity is 50%RH, the second humidity threshold value set is 40%RH, the second humidity-thermal resistance correlation parameter is 4, and the real-time operating power of the power module is 15 , and it is known from the product parameters of the power module that the thermal resistance value is 0.2 , then the real-time junction temperature of the power module under this condition can be calculated as 45.2 Similarly, if the real-time ambient humidity in the aging test process obtained by sampling is 57% RH, the humidity fluctuation is 17% RH, which is greater than 15% RH, so according to the humidity fluctuation, the real-time ambient temperature, the predetermined thermal resistance value of the power module, and the obtained real-time power consumption of the power module, the real-time junction temperature of the power module is determined, and according to the above-mentioned related parameters, the real-time junction temperature of the power module in this case can be calculated as 45.8 .

[0087] It should be noted that the above examples are only for illustrative purposes and should not be understood as any limitation of the present embodiment. In actual application, the temperature and humidity inside the power module can be higher or lower, which is not limited herein.

[0088] It can be seen that the corresponding humidity operating condition is determined according to the corresponding ambient humidity under different environments, and then the life health status of the power module is further evaluated based on the ambient temperature and the specific condition, which is more reliable, and is beneficial to improve the accuracy of the life health evaluation of the power module.

[0089] As shown in FIG. 3, in one embodiment of the present application, step S3 can include but is not limited to the following steps: Figure 7

[0090] Step S31, obtaining the standard junction temperature of the power module under the best operating state, and determining the normal service life of the power module according to the standard junction temperature;

[0091] Step S32, obtaining the difference junction temperature value between the real-time junction temperature and the standard junction temperature, and determining the real-time service life of the power module according to the difference junction temperature value and the normal service life of the power module.

[0092] ​In this step, first, the standard junction temperature of the power module in the best operating state is determined, and the specific determination method can be various, for example, referring to the factory setting parameters of the power module to obtain the standard junction temperature, or, statistics of the junction temperature change of the power module in a period of history, select the required junction temperature value from it, and statistics of the average value of this part of the junction temperature value or through the fitting simulation method, the standard junction temperature is obtained, etc. Here is not limited; Further, according to the standard junction temperature, the normal service life of the power module is determined, usually, the normal service life corresponding to the standard junction temperature can be determined by the factory setting, further, by obtaining the difference junction temperature value between the real-time junction temperature and the standard junction temperature, the real-time service life of the power module can be determined according to the difference junction temperature value and the normal service life of the power module, for example, on the basis of the normal service life, the standard junction temperature is further corrected by the proportion of the difference junction temperature value to the standard junction temperature, that is, the real-time service life of the power module can be obtained, it can be seen that, since the real-time junction temperature of the power module under different conditions can be obtained in real time, the real-time service life of the power module can be determined in real time, which is more timely and is beneficial to improve the accuracy of the power module life health evaluation.

[0093] Figure 8 is a structural schematic diagram of an electronic device 1000 provided by an embodiment of the application. As shown in the figure, the electronic device 1000 includes a memory 1100 and a processor 1200. The number of memories 1100 and processors 1200 can be one or more, Figure 8 for example, one memory 1100 and one processor 1200; the memory 1100 and the processor 1200 in the device can be connected through a bus or other means, Figure 8 for example, connected through a bus. Figure 8

[0094] The memory 1100 is a kind of computer readable storage medium, can be used to store software program, computer executable program and module, such as the program instruction / module corresponding to the power module aging test method provided by any embodiment of the application. The processor 1200 realizes the above-mentioned power module aging test method by running the software program, instruction and module stored in the memory 1100.

[0095] ​The memory 1100 can include a program storage area and a data storage area, where the program storage area can store an operating system, application programs required by at least one function. In addition, the memory 1100 can include a high-speed random access memory, and can also include a nonvolatile memory such as at least one disk storage device, a flash memory device, or other nonvolatile solid-state memory device. In some examples, the memory 1100 can further include a memory disposed remotely from the processor 1200, which can be connected to the device through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0096] An embodiment of the present application further provides a computer readable storage medium, which stores computer executable instructions, and the computer executable instructions are used to execute the aging test method of the power module provided by any embodiment of the present application.

[0097] An embodiment of the present application further provides a computer program product, which includes a computer program or computer instructions, and the computer program or computer instructions are stored in a computer readable storage medium, and a processor of a computer device reads the computer program or computer instructions from the computer readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes the aging test method of the power module provided by any embodiment of the present application.

[0098] Those skilled in the art can understand that all or some steps in the method disclosed above, and the function modules / units in the system and the device can be implemented as software, firmware, hardware, and appropriate combinations thereof.

[0099] In hardware implementations, the division of functionality between the functional modules / units referred to in the above description does not necessarily correspond to a division of physical components; for example, one physical component can have multiple functionalities, or one functionality or step can be performed by several physical components in cooperation. Certain physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software can be distributed on computer readable media, which can comprise computer storage media (or non-transitory media) and communication media (or transitory media). As is well known to those of ordinary skill in the art, the term computer storage media includes both volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Further, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.

[0100] As used in this description, the terms "component," "module," "system," and the like are intended to refer to a computer-related entity, either hardware, firmware, a combination of hardware and software, software, or software in execution. For example, a component can be, but is not limited to being, a process running on a processor, a processor, an object, an executable, a thread of execution, a program, or a computer. By way of illustration, both an application running on a computing device and the computing device can be a component. One or more components can reside within a process or thread of execution and a component can be localized, either in whole or in part, in a single computer or distributed among multiple computers. In addition, these components can execute from various computer readable media having various data structures stored thereon. The components can communicate by way of local or remote processes such as in accordance with a signal having one or more data packets (e.g., data from one component interacting with another component in a local system, distributed system, or across a network such as the Internet with other systems via the signal), software, and other means.

Claims

1. A method of burn-in testing a power module, the method comprising: The method comprises the following steps: Step S1, acquiring real-time ambient temperature and real-time ambient humidity of the power module during the aging test process; Step S2, determining a humidity operation condition of the power module according to the real-time ambient humidity, and determining real-time junction temperature of the power module based on the real-time ambient temperature and the humidity operation condition; Step S3, evaluating the life health status of the power module according to the real-time junction temperature; The step S2 comprises the following steps: Step S24, when the real-time ambient humidity is greater than a preset first humidity threshold and less than a preset second humidity threshold, determining that the power module is in a humidity stable operation condition, wherein the second humidity threshold is greater than the first humidity threshold; Step S25, under the humidity stable operation condition, judging whether the real-time ambient temperature is greater than a preset first temperature threshold, if yes, determining the real-time junction temperature of the power module according to the real-time ambient humidity, the real-time ambient temperature, the first humidity threshold, a predetermined thermal resistance value of the power module and an acquired real-time operating power of the power module, otherwise, executing step S26; Step S26, calculating a product of the real-time operating power of the power module and the thermal resistance value of the power module to obtain a temperature influence value, and acquiring a sum of the real-time ambient temperature and the temperature influence value to obtain the real-time junction temperature of the power module; In the step S25, the real-time junction temperature of the power module is determined according to the real-time ambient humidity, the real-time ambient temperature, the first humidity threshold, the predetermined thermal resistance value of the power module and the acquired real-time operating power of the power module, which is realized by using the following calculation formula: T0 = T1 + [1 + (RH1 - RH0) a] R x P; wherein T0 is a real-time junction temperature of the power module, in unit of ℃; T1 is the real-time ambient temperature, in unit of ℃; a is a first humidity-thermal resistance correlation parameter, dimensionless; RH1 is the real-time ambient humidity, dimensionless; RH0 is the first humidity threshold, dimensionless; R x is a thermal resistance value of the power module, in unit of ℃ / W; P is a real-time operating power of the power module, in unit of W.

2. The power module burn-in test method of claim 1, wherein, The step S2 further comprises the following steps: Step S21, when the real-time ambient humidity is less than or equal to the preset first humidity threshold, determining that the power module is in a humidity good operation condition; Step S22, under the humidity good operation condition, calculating a product of the acquired real-time operating power of the power module and the predetermined thermal resistance value of the power module to obtain a temperature influence value; Step S23, acquiring a sum of the real-time ambient temperature and the temperature influence value to obtain the real-time junction temperature of the power module.

3. The power module burn-in test method of claim 1, wherein, The step S2 further comprises the following steps: Step S27, when the real-time ambient humidity is greater than or equal to the preset second humidity threshold, determining that the power module is in a humidity fluctuation operation condition; Step S28, under the humidity fluctuation operation condition, acquiring a difference between the real-time ambient humidity and the second humidity threshold to obtain a humidity fluctuation amount; Step S29, determining the real-time junction temperature of the power module according to the real-time ambient temperature, the humidity fluctuation amount and a predetermined maximum humidity change amount.

4. The power module burn-in test method of claim 3, wherein, The step S29 comprises the following steps: Step S291, judging whether the humidity fluctuation exceeds the maximum humidity variation, if yes, determining the real-time junction temperature of the power module according to the maximum humidity variation, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the acquired real-time operating power of the power module, otherwise executing step S292; Step S292, determining the real-time junction temperature of the power module according to the humidity fluctuation, the real-time ambient temperature, the predetermined thermal resistance value of the power module and the acquired real-time operating power of the power module.

5. The power module burn-in test method of claim 4, wherein, The step S292 is realized by the following calculation formula: T0 = T1 + [1 + RH B *β]R x P; wherein, T0 is the real-time junction temperature of the power module, in unit of ℃; T1 is the real-time ambient temperature, in unit of ℃; β is the second humidity-thermal resistance correlation parameter, dimensionless; RH B is the humidity fluctuation amount, dimensionless; R x is the thermal resistance value of the power module, in unit of ℃ / W; P is the real-time operating power of the power module, in unit of W.

6. The power module burn-in test method of claim 1, wherein, The step S3 comprises the following steps: Step S31, acquiring the standard junction temperature of the power module under the optimal operating state, and determining the normal service life of the power module according to the standard junction temperature; Step S32, acquiring the difference junction temperature value between the real-time junction temperature and the standard junction temperature, and determining the real-time service life of the power module according to the difference junction temperature value and the normal service life of the power module.

7. An electronic device, comprising: comprise: at least one processor; at least one memory for storing at least one program; when at least one of the programs is executed by the at least one processor, the power module aging test method as claimed in any one of claims 1 to 6 is realized.

8. A computer-readable storage medium, characterized in that, wherein the processor-executable program is stored, and the processor-executable program is executed by the processor to realize the power module aging test method as claimed in any one of claims 1 to 6.

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