Aqueous stripping solution, process for its preparation and use thereof

Abstract

The application provides a water-based stripping solution, a preparation method and application thereof, and particularly relates to the field of photoetching technology. The water-based stripping solution comprises a polar solvent, a penetrant, a surfactant, a corrosion inhibitor, a solubilizer and pure water. In the water-based stripping solution, the polar solvent can penetrate into the photoresist, destroy the intermolecular force and make the photoresist structure loose; the penetrant accelerates the diffusion of the solvent into the photoresist, enhances the stripping effect; the surfactant reduces the surface tension between the stripping solution and the photoresist, so that the stripping solution can better contact the photoresist and disperse the photoresist particles; the corrosion inhibitor protects the substrate from corrosion and ensures the integrity of the substrate during the stripping process; and the solubilizer improves the compatibility of the components in the stripping solution, so that the system is more stable. The components jointly act on the stripping solution, so that the stripping solution can quickly dissolve the photoresist under mild conditions, and completely remove the photoresist from the surface of the substrate, while reducing the residue and damage to the substrate.

Description

Technical Field

[0001] This invention relates to the field of photolithography, and in particular to an aqueous stripping solution, its preparation method, and its application. Background Technology

[0002] In the development of stripping solutions, the core requirement is the removal of photoresist. Through the synergistic optimization of formulation design and production line processes, stripping solutions can meet process requirements. The formulation design of stripping solutions is mainly based on four key characteristics: solubility, penetration, dispersibility, and corrosion resistance. Through the interaction between the stripping solution and photoresist molecules, the swelling, dissolution, and detachment of the photoresist from the substrate surface are achieved.

[0003] Aqueous stripping solutions offer advantages such as environmental friendliness, safety, and high compatibility, but their water-based nature also introduces some inherent limitations. For example, insufficient dissolving power, low solution utilization, significant post-stripping residue, and poor stability can easily lead to photoresist residue. Therefore, when developing the initial formulation, it is necessary to design it specifically based on the client's needs and pain points.

[0004] Compared to organic stripping solutions, aqueous stripping solutions can achieve lower stripping temperatures, but their solvents are more volatile, and the activity of their components is difficult to maintain consistently, resulting in poorer stability. These issues can lead to stability changes in the stripping solution during the stripping process, potentially causing abnormalities such as photoresist residue. In client testing, photoresist residue is a major concern. Therefore, it is necessary to comprehensively consider the performance requirements of the stripping solution and optimize the formulation to address this issue while ensuring that other performance characteristics are not affected.

[0005] In view of this, the present invention is hereby proposed. Summary of the Invention

[0006] The purpose of this invention is to provide an aqueous stripping fluid, its preparation method, and its application, aiming to solve at least one of the above-mentioned technical problems in the prior art.

[0007] In order to achieve the above-mentioned objectives of the present invention, the following technical solution is adopted:

[0008] A first aspect of the present invention provides an aqueous stripping fluid comprising a polar solvent, a penetrant, a surfactant, a corrosion inhibitor, a solubilizer, and pure water.

[0009] Furthermore, the aqueous stripping solution comprises 45-55 wt% polar solvent, 0.5-1 wt% penetrant, 1-5 wt% surfactant, 0.5-1 wt% corrosion inhibitor, 1-3 wt% solubilizer, and the balance being pure water.

[0010] Furthermore, the polar solvent includes at least one of ethylene carbonate, tetraethylene glycol, and N,N-dimethyl lactamide, preferably tetraethylene glycol.

[0011] Preferably, the penetrant comprises at least one of triethyl citrate, triacetin, and propylene glycol methyl ether, and is preferably triethyl citrate.

[0012] Furthermore, the surfactant includes at least one of polyethylene glycol nonylphenyl ether, polyethylene glycol octylphenyl ether, octylphenol polyoxyethylene ether, decylphenol polyoxyethylene ether, and sucrose fatty acid ester, preferably sucrose fatty acid ester.

[0013] Preferably, the corrosion inhibitor includes at least one of dicyclohexylamine, dilauryl phosphate, and tannic acid, with dilauryl phosphate being the most preferred.

[0014] Furthermore, the solubilizer includes hydroxypropyl chitosan, polyoxyethylene castor oil, and maleic anhydride-grafted polyethylene glycol, preferably hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol.

[0015] Furthermore, the corrosion inhibitor is dilauryl phosphate, and the solubilizer is hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol.

[0016] Preferably, the mass ratio of dilauryl phosphate to maleic anhydride-grafted polyethylene glycol is (1.8~2.2):1.

[0017] A second aspect of the present invention provides a method for preparing the aforementioned aqueous stripping fluid, comprising the following steps:

[0018] A. Mix a portion of the polar solvent, penetrant, and surfactant evenly to obtain the first mixture;

[0019] B. Mix the remaining polar solvent with pure water until homogeneous, then add corrosion inhibitor and solubilizer and mix until homogeneous to obtain the second mixture;

[0020] C. Mix the first mixture and the second mixture evenly to obtain the aqueous stripping solution.

[0021] Furthermore, in step A, the polar solvent accounts for 45-55% of the total weight of the polar solvent.

[0022] A third aspect of the present invention provides the application of the aqueous stripping solution in photoresist stripping.

[0023] Furthermore, the photoresist includes positive photoresist.

[0024] Compared with the prior art, the present invention has at least the following beneficial effects:

[0025] In the aqueous stripping solution provided by this invention, the polar solvent can penetrate into the photoresist, disrupting its intermolecular forces and loosening the photoresist structure; the penetrant further accelerates the diffusion of the solvent into the photoresist, enhancing the stripping effect; the surfactant reduces the surface tension between the stripping solution and the photoresist, allowing the stripping solution to better contact the photoresist and disperse the photoresist particles; the corrosion inhibitor protects the substrate from corrosion, ensuring the integrity of the substrate during the stripping process; and the solubilizer improves the compatibility of the components in the stripping solution, making the system more stable. These components work together to enable the stripping solution to quickly dissolve the photoresist under mild conditions and completely remove it from the substrate surface, while reducing residue and damage to the substrate.

[0026] The preparation method provided by this invention is simple, has a large batch processing capacity, and a high degree of mechanization, making it suitable for industrial production.

[0027] The application of the aqueous stripping solution provided by this invention, given the advantages of the aforementioned aqueous stripping solution, makes this water-washing stripping solution exhibit wide applicability and excellent performance. It can thoroughly remove photoresist residue, ensure the cleanliness and uniformity of the substrate surface, thereby providing a more reliable guarantee for subsequent process steps and improving the overall quality and efficiency of the photolithography process. Attached Figure Description

[0028] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 A scanning electron microscope image of the substrate after being peeled off with the stripping solution provided in Example 1;

[0030] Figure 2 The image is a scanning electron microscope (SEM) image of the substrate after being peeled off with the stripping solution provided in Comparative Example 5.

[0031] Figure 3 The image shows a scanning electron microscope (SEM) image of the substrate after being peeled off with the stripping solution provided in Comparative Example 5. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0033] In the following, the terms “comprising,” “having,” and their cognates, which may be used in various embodiments of the invention, are intended only to indicate a particular feature, number, step, operation, element, component, or combination thereof, and should not be construed as excluding, firstly, the presence of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, or adding the possibility of one or more features, numbers, steps, operations, elements, components, or combinations thereof.

[0034] A first aspect of the present invention provides an aqueous stripping fluid comprising a polar solvent, a penetrant, a surfactant, a corrosion inhibitor, a solubilizer, and pure water.

[0035] In the aqueous stripping solution provided by this invention, the polar solvent can penetrate into the photoresist, disrupting its intermolecular forces and loosening the photoresist structure; the penetrant further accelerates the diffusion of the solvent into the photoresist, enhancing the stripping effect; the surfactant reduces the surface tension between the stripping solution and the photoresist, allowing the stripping solution to better contact the photoresist and disperse the photoresist particles; the corrosion inhibitor protects the substrate from corrosion, ensuring the integrity of the substrate during the stripping process; and the solubilizer improves the compatibility of the components in the stripping solution, making the system more stable. These components work together to enable the stripping solution to quickly dissolve the photoresist under mild conditions and completely remove it from the substrate surface, while reducing residue and damage to the substrate.

[0036] Furthermore, the aqueous stripping solution comprises 45-55 wt% polar solvent, 0.5-1 wt% penetrant, 1-5 wt% surfactant, 0.5-1 wt% corrosion inhibitor, 1-3 wt% solubilizer, and the balance being pure water.

[0037] Typical, but not limiting, the content of polar solvent in the aqueous stripping solution can be, for example, 45 wt%, 48 wt%, 50 wt%, 52 wt%, 55 wt%, or any value within the range of 45 wt% to 55 wt%; the content of penetrant can be, for example, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, or any value within the range of 0.5 wt% to 1 wt%; the content of surfactant can be, for example, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, or any value within the range of 1 wt% to 5 wt%; the content of corrosion inhibitor can be, for example, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1 wt%, or any value within the range of 0.5 wt% to 1 wt%; the content of solubilizer can be, for example, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%. wt%, or any value within the range of 1 wt% to 3 wt%, with the balance being pure water.

[0038] It should be noted that "the balance is pure water" means that the amount of pure water is used to make up the amount of water-based stripping fluid to 100wt.

[0039] Furthermore, the polar solvent includes at least one of ethylene carbonate, tetraethylene glycol, and N,N-dimethyl lactamide, preferably tetraethylene glycol.

[0040] Preferably, the penetrant comprises at least one of triethyl citrate, triacetin, and propylene glycol methyl ether, and is preferably triethyl citrate.

[0041] Furthermore, the surfactant includes at least one of polyethylene glycol nonylphenyl ether, polyethylene glycol octylphenyl ether, octylphenol polyoxyethylene ether, decylphenol polyoxyethylene ether, and sucrose fatty acid ester, preferably sucrose fatty acid ester.

[0042] Preferably, the corrosion inhibitor includes at least one of dicyclohexylamine, dilauryl phosphate, and tannic acid, with dilauryl phosphate being the most preferred.

[0043] Furthermore, the solubilizer includes hydroxypropyl chitosan, polyoxyethylene castor oil, and maleic anhydride-grafted polyethylene glycol, preferably hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol.

[0044] Furthermore, the corrosion inhibitor is dilauryl phosphate, and the solubilizer is hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol.

[0045] Preferably, the mass ratio of dilauryl phosphate to maleic anhydride-grafted polyethylene glycol is (1.8~2.2):1. Sucrose fatty acid ester molecules contain multiple hydroxyl groups and fatty acid ester groups. The hydroxyl groups can serve as hydrogen bond donors or sites for nucleophilic reactions. Maleic anhydride-grafted polyethylene glycol contains anhydride groups, which can react with hydroxyl groups. By controlling the reaction ratio of anhydride groups to hydroxyl groups as described above, the activity of the substance can be significantly improved. However, unreacted anhydride groups may undergo hydrolysis in the system, leading to a decrease in the pH stability of the system. Therefore, by stabilizing the reaction ratio of anhydride groups to hydroxyl groups, the pH stability of the system can be effectively maintained.

[0046] A second aspect of the present invention provides a method for preparing the aforementioned aqueous stripping fluid, comprising the following steps:

[0047] A. Mix a portion of the polar solvent, penetrant, and surfactant evenly to obtain the first mixture;

[0048] B. Mix the remaining polar solvent with pure water until homogeneous, then add corrosion inhibitor and solubilizer and mix until homogeneous to obtain the second mixture;

[0049] C. Mix the first mixture and the second mixture evenly to obtain the aqueous stripping solution.

[0050] The preparation method provided by this invention is simple, has a large batch processing capacity, and a high degree of mechanization, making it suitable for industrial production.

[0051] Furthermore, in step A, the polar solvent accounts for 45-55% of the total weight of the polar solvent.

[0052] Typically, but not limitingly, in step A, the weight of a portion of the polar solvent is a percentage of the total weight of the polar solvent, for example, 45%, 47%, 49%, 50%, 52%, 54%, 55%, or any percentage value in the range of 45% to 55%.

[0053] The third aspect of this invention provides the application of the aqueous stripping solution in photoresist stripping.

[0054] Furthermore, the photoresist includes positive photoresist or negative photoresist.

[0055] Furthermore, the temperature for photoresist stripping is 32~55℃, preferably 40℃.

[0056] Typical, but not limiting, photoresist stripping temperatures can be, for example, 32°C, 35°C, 38°C, 40°C, 42°C, 45°C, 48°C, 50°C, 52°C, or 55°C, or any value within the range of 32°C to 55°C, with 40°C being preferred.

[0057] Furthermore, the photoresist stripping time is 30~90s.

[0058] Typical, but not limiting, photoresist stripping times can be, for example, 30s, 35s, 40s, 45s, 50s, 55s, 60s, 65s, 70s, 75s, 80s, 85s, 90s, or any value within the range of 30s to 90s.

[0059] The application of the aqueous stripping solution provided by this invention, given the advantages of the aforementioned aqueous stripping solution, makes this water-washing stripping solution exhibit wide applicability and excellent performance. It can thoroughly remove photoresist residue, ensure the cleanliness and uniformity of the substrate surface, thereby providing a more reliable guarantee for subsequent process steps and improving the overall quality and efficiency of the photolithography process.

[0060] The present invention is further illustrated below with specific embodiments and comparative examples. However, it should be understood that these embodiments are merely for illustrative purposes and should not be construed as limiting the invention in any way. Unless otherwise specified, the raw materials used in the embodiments and comparative examples of the present invention were carried out under conventional conditions or conditions recommended by the manufacturer. Reagents or instruments used, unless otherwise specified, are all commercially available conventional products.

[0061] Example 1

[0062] This embodiment provides an aqueous stripping solution composed of the following components: 4.56 kg of pure water, 4.72 kg of tetraethylene glycol, 0.06 kg of triethyl citrate, 0.22 kg of sucrose fatty acid ester, 0.22 kg of dilauryl phosphate, 0.11 kg of hydroxypropyl chitosan, and 0.11 kg of maleic anhydride-grafted polyethylene glycol.

[0063] The specific preparation process is as follows:

[0064] 1. Add 2.36 kg of tetraethylene glycol, triethyl citrate and sucrose fatty acid ester to a mixing container and mix thoroughly at 200 rpm to obtain the first mixture.

[0065] 2. Mix the remaining tetraethylene glycol with pure water until homogeneous, then add dilauryl phosphate, hydroxypropyl chitosan, and maleic anhydride-grafted polyethylene glycol and stir at 200 rpm until homogeneous to obtain the second mixture.

[0066] 3. Continue to stir and mix the first mixture and the second mixture at 200 rpm until homogeneous to obtain the aqueous stripping solution.

[0067] Example 2

[0068] This embodiment provides an aqueous stripping solution composed of the following components: 4.59 kg of pure water, 4.5 kg of N,N-dimethyl lactamide, 0.08 kg of propylene glycol methyl ether, 0.5 kg of sucrose fatty acid ester, 0.1 kg of dicyclohexylamine, 0.18 kg of polyoxyethylene castor oil, and 0.05 kg of maleic anhydride-grafted polyethylene glycol.

[0069] The specific preparation method is the same as in Example 1, with only the corresponding substances needing to be adjusted accordingly, and will not be repeated here.

[0070] Example 3

[0071] This embodiment provides an aqueous stripping solution composed of the following components: 4.02 kg of pure water, 5.5 kg of ethylene carbonate, 0.04 kg of triethyl citrate, 0.04 kg of triacetin, 0.25 kg of polyethylene glycol octylphenyl ether, 0.05 kg of tannic acid, and 0.1 kg of hydroxypropyl chitosan.

[0072] The specific preparation method is the same as in Example 1, with only the corresponding substances needing to be adjusted accordingly, and will not be repeated here.

[0073] Example 4

[0074] This embodiment provides an aqueous stripping solution composed of the following components: 4.36 kg of pure water, 2.5 kg of tetraethylene glycol, 2.5 kg of N,N-dimethyl lactamide, 0.03 kg of triacetin, 0.04 kg of propylene glycol methyl ether, 0.3 kg of octylphenol polyoxyethylene ether, 0.07 kg of dicyclohexylamine, and 0.2 kg of polyoxyethylene castor oil.

[0075] The specific preparation method is the same as in Example 1, with only the corresponding substances needing to be adjusted accordingly, and will not be repeated here.

[0076] Example 5

[0077] This embodiment provides an aqueous stripping solution. Unlike Example 1, the amount of tetraethylene glycol is increased to 5.5 kg, and the amount of pure water is adjusted accordingly. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0078] Example 6

[0079] This embodiment provides an aqueous stripping solution. Unlike Example 1, the amount of tetraethylene glycol is increased to 4.5 kg, and the amount of pure water is adjusted accordingly. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0080] Example 7

[0081] This embodiment provides an aqueous stripping solution. Unlike Example 1, the mass ratio of dilauryl phosphate to maleic anhydride-grafted polyethylene glycol is 1:1. The other raw materials and preparation methods are the same as in Example 1, and will not be repeated here.

[0082] Example 8

[0083] This embodiment provides an aqueous stripping solution. Unlike Example 1, the mass ratio of dilauryl phosphate to maleic anhydride-grafted polyethylene glycol is 1:2. The remaining raw materials and preparation methods are the same as in Example 1, and will not be repeated here.

[0084] Comparative Example 1

[0085] This comparative example provides an aqueous stripping solution. Unlike Example 1, it does not contain hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol. It is made up to 10 kg with pure water. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0086] Comparative Example 2

[0087] This comparative example provides an aqueous stripping solution. Unlike Example 1, dilauryl phosphate is not added, and pure water is used to make up to 10 kg. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0088] Comparative Example 3

[0089] This comparative example provides an aqueous stripping solution. Unlike Example 1, sucrose fatty acid esters are not added, and pure water is used to make up to 10 kg. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0090] Comparative Example 4

[0091] This comparative example provides an aqueous stripping solution. Unlike Example 1, it does not contain triethyl citrate and is made up to 10 kg with pure water. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0092] Comparative Example 5

[0093] This comparative example provides an aqueous stripping solution. Unlike Example 1, tetraethylene glycol is not added, and pure water is used to make up to 10 kg. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0094] Comparative Example 6

[0095] This comparative example provides an aqueous stripping solution. Unlike Example 1, it does not contain dilauryl phosphate, hydroxypropyl chitosan, or maleic anhydride-grafted polyethylene glycol. It is made up to 10 kg with pure water. The amounts of other raw materials and the preparation method are the same as in Example 1, and will not be repeated here.

[0096] Test Example 1

[0097] The stripping solution used in the examples and comparative examples was used to remove the color photoresist from the TFT-LCD. The stripping solution was sprayed onto the same batch of TFT-LCD substrates treated under the same conditions. The spraying temperature was 40°C and the time was 60 seconds to complete the removal of the photoresist.

[0098] The residual abnormalities in the photoresist were confirmed by scanning electron microscopy and water contact angle testing. The total number of abnormalities on the entire substrate was estimated by sampling the number density of abnormalities in multiple areas (such as edges, center, and different locations).

[0099] Water contact angle tests were performed on abnormal photoresist residue points. A contact angle meter equipped with a high-resolution camera was used to capture images of water droplets, and the average contact angle of each photoresist residue point was analyzed by software.

[0100] The principle behind observing water contact angle: Photoresist residue may exist on the substrate surface in the form of thin films, particles, or chemisorbed layers, altering the surface's chemical composition and roughness. When photoresist residue is present, hydrophobic groups are exposed, increasing the contact angle; the greater the residue, the larger the contact angle. The results are summarized in Table 1.

[0101] Table 1

[0102]

[0103] As can be seen from Table 1, the stripping fluid formulation of this application has good performance, removes residues cleanly, and leaves no residue.

[0104] Test Example 2

[0105] After the stripping solutions of the examples and comparative examples were stored as is for 1 year, test example 1 was repeated, and the data obtained are recorded in Table 2.

[0106] Table 2

[0107]

[0108] As can be seen from Table 2, the stripping solution formulation of the present invention still maintains excellent stripping performance after long-term storage under appropriate conditions; the stripping solution not prepared according to the complete ratio shows a significant increase in abnormal photoresist residues.

[0109] Characterization Example 1

[0110] Scanning electron microscope (SEM) images were taken of the substrates after being peeled using the peeling solutions of Example 1 and Comparative Example 5, as shown below. Figure 1 and Figure 2 As shown.

[0111] like Figure 1As shown, no abnormalities in photoresist residue were found within the area of ​​the scanning electron microscope image. Figure 2 As shown in the image, areas of photoresist that were not completely removed are clearly visible within the photograph's area, and there are numerous abnormal photoresist residues on the substrate.

[0112] Test Example 3

[0113] The substrates peeled off using the stripping solutions of Example 1 and Comparative Example 5 were used to calculate the average contact angle using the contact angle measurement method described in Test Example 1. The data obtained are recorded in Table 3. A scanning electron microscope (SEM) was performed on the substrate obtained in Comparative Example 5, and the resulting SEM images are shown below. Figure 3 As shown.

[0114] Table 3

[0115]

[0116] Table 3 shows that a water contact angle of 10° indicates no defects on the substrate surface, allowing the water droplet to spread completely, indicating high chemical homogeneity and no physical damage to the substrate surface; while a water contact angle of 95° and... Figure 3 The porous structure shows that water droplets cannot completely penetrate the depressions, but only come into contact with the protrusions, forming a composite solid-gas interface that significantly increases the contact angle.

[0117] exist Figure 3 In the SEM images, unevenly distributed depressions and holes are visible on the substrate surface, with some areas exhibiting a honeycomb-like corrosion morphology. The formation of these defects is mainly due to the chemical corrosion effect of the stripping fluid. The stripping fluid attacks the defective areas on the surface, leading to local dissolution and the formation of holes.

[0118] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and not to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of protection of the claims.

Claims

1. A water-based stripping solution, characterized in that, It includes 45-55 wt% polar solvent, 0.5-1 wt% penetrant, 1-5 wt% surfactant, 0.5-1 wt% corrosion inhibitor, 1-3 wt% solubilizer, and the balance is pure water; The polar solvent includes at least one of ethylene carbonate, tetraethylene glycol, and N,N-dimethyl lactamide; The penetrant includes at least one of triethyl citrate, triacetin, and propylene glycol methyl ether; The surfactant includes at least one of polyethylene glycol nonylphenyl ether, polyethylene glycol octylphenyl ether, octylphenol polyoxyethylene ether, decylphenol polyoxyethylene ether, and sucrose fatty acid ester; The corrosion inhibitor includes at least one of dicyclohexylamine, dilauryl phosphate, and tannic acid; The solubilizer includes hydroxypropyl chitosan, polyoxyethylene castor oil, and maleic anhydride-grafted polyethylene glycol.

2. The aqueous stripping solution according to claim 1, characterized in that, The polar solvent is tetraethylene glycol.

3. The aqueous stripping solution according to claim 1, characterized in that, The penetrant is triethyl citrate.

4. The aqueous stripping solution according to claim 1, characterized in that, The surfactant is a sucrose fatty acid ester.

5. The aqueous stripping solution according to claim 1, characterized in that, The corrosion inhibitor is dilauryl phosphate.

6. The aqueous stripping solution according to claim 1, characterized in that, The solubilizer is hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol.

7. The aqueous stripping solution according to claim 1, characterized in that, The corrosion inhibitor is dilauryl phosphate, and the solubilizer is hydroxypropyl chitosan and maleic anhydride-grafted polyethylene glycol.

8. The aqueous stripping solution according to claim 7, characterized in that, The mass ratio of dilauryl phosphate to maleic anhydride-grafted polyethylene glycol is (1.8~2.2):

1.

9. A method for preparing the aqueous stripping solution according to any one of claims 1 to 8, characterized in that, Includes the following steps: A. Mix a portion of the polar solvent, penetrant, and surfactant evenly to obtain the first mixture; B. Mix the remaining polar solvent with pure water until homogeneous, then add corrosion inhibitor and solubilizer and mix until homogeneous to obtain the second mixture; C. Mix the first mixture and the second mixture evenly to obtain the aqueous stripping solution.

10. The preparation method according to claim 9, characterized in that, In step A, the polar solvent accounts for 45-55% of the total weight of the polar solvent.

11. The application of the aqueous stripping solution according to any one of claims 1 to 8 in photoresist stripping.

12. The application according to claim 11, characterized in that, The photoresist is a positive photoresist.

13. The application according to claim 11, characterized in that, The temperature for photoresist stripping is 32~55℃.

14. The application according to claim 11, characterized in that, The temperature for photoresist stripping is 40℃.

15. The application according to claim 11, characterized in that, The photoresist stripping time is 30~90s.

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