Ultrasonic transducer

Abstract

The invention provides an ultrasonic transducer. The ultrasonic transducer comprises a transduction layer, a conductive layer, a conducting layer and a circuit board, the transduction layer is used for transmitting and receiving ultrasonic waves. The conductive layer is disposed on the upper surface of the transduction layer or on a side of the transduction layer adjacent to the object to be tested. The conducting layer and the circuit board are sequentially arranged on the conducting layer. The circuit board comprises a plurality of array elements and a plurality of wires. The array elements are arranged in an array along a first direction and a second direction. The wires are electrically connected to the corresponding array elements in the array elements respectively, the wires comprise first wires, the extending direction of the first wires is at least partially parallel to the first direction, the first wires are overlapped with at least one corresponding array element in the array elements in the third direction, and the first direction, the second direction and the third direction are perpendicular to one another.

Description

TECHNICAL FIELD

[0001] The present invention relates to an ultrasonic transducer, and more particularly, to an ultrasonic transducer including a transducing layer. BACKGROUND

[0002] Ultrasonic transducers are currently important medical examination tools. Among them, the ultrasonic transducer includes a plurality of array elements for receiving signals and signal leads electrically connected to the array elements. Since the array elements are usually cut by a cutting machine, the array elements are usually linear in shape, so that there are limitations for special arrangements. Moreover, as the demand for small-pitch two-dimensional array elements gradually rises, the production of signal leads faces challenges. According to a conventional production method, the signal leads can be formed by a semiconductor process thin film stacking method (for example, including a thin film photolithography process); according to another conventional production method, a three-dimensional lead frame can be designed to lead the signal leads, however, both of the two conventional methods of producing signal leads currently require a relatively high cost.

[0003] Therefore, it is necessary to design a new type of ultrasonic transducer to overcome the above-mentioned defects. SUMMARY

[0004] The purpose of the present invention is to provide an ultrasonic transducer, which can save time and production cost, and can save volume, since the leads of the ultrasonic transducer do not need to be formed by a complex semiconductor process, nor need to be designed as a three-dimensional lead frame.

[0005] To achieve the above-mentioned purpose, the present invention provides an ultrasonic transducer, comprising: a transducing layer for transmitting and receiving ultrasonic waves; a conductive layer disposed on an upper surface of the transducing layer or disposed on a side of the transducing layer adjacent to a to-be-measured object; a conductive layer and a circuit board (120) disposed on the conductive layer in sequence; wherein the circuit board comprises: a plurality of array elements arranged in an array along a first direction and a second direction; and a plurality of leads electrically connected to corresponding array elements in the plurality of array elements, respectively, wherein the plurality of leads comprises a first lead, an extension direction of the first lead is at least partially parallel to the first direction, and the first lead overlaps at least one corresponding array element in the plurality of array elements in a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0006] Preferably, the first lead comprises a first portion connected to the array element and a second portion connected to the first portion, wherein an extension direction of the first portion is parallel to the third direction, and an extension direction of the second portion is parallel to the first direction.

[0007] Preferably, the first wire comprises a first portion connected to the array element, a second portion connected to the first portion, and a third portion connected to the second portion, wherein the first portion extends in parallel to the first direction, the second portion extends in parallel to the third direction, and the third portion extends in parallel to the first direction.

[0008] Preferably, the plurality of wires further comprises a second wire adjacent to the first wire, the second wire extends at least partially in parallel to the first direction, and the first wire and the second wire have an offset distance in the second direction.

[0009] Preferably, the first wire electrically contacts an upper surface or a side surface of the array element, the normal direction of the upper surface is parallel to the third direction, and the side surface is connected to the upper surface.

[0010] Preferably, the plurality of wires further comprises a second wire adjacent to the first wire, the second wire extends at least partially in parallel to the first direction, and the first wire and the second wire overlap each other in the first direction and are separated from each other in the third direction.

[0011] Preferably, the plurality of arrays forms a region having a center point and a symmetry axis passing through the center point, the symmetry axis extends in parallel to the second direction, and the layout pattern of the plurality of wires is mirror-symmetric with respect to the symmetry axis.

[0012] Preferably, the plurality of wires further comprises a second wire, a third wire, and a fourth wire, the second wire is adjacent to the first wire, and the third wire is adjacent to the fourth wire.

[0013] Preferably, the plurality of array elements connected by the first wire and the second wire are farther away from the symmetry axis than the plurality of array elements connected by the third wire and the fourth wire.

[0014] Preferably, the second wire extends at least partially in parallel to the first direction, and the third wire and the fourth wire extend at least partially in parallel to the second direction.

[0015] Preferably, the third wire and the fourth wire overlap each other in the third direction.

[0016] Preferably, a plurality of dummy wires are connected to the corresponding plurality of array elements, wherein the plurality of array elements include a first array element and a second array element adjacent to each other, the first array element has a first overlapping area with the plurality of wires and the plurality of dummy wires in the third direction, and the second array element has a second overlapping area with the plurality of wires and the plurality of dummy wires in the third direction, the first overlapping area is substantially equal to the second overlapping area.

[0017] Compared with the prior art, the ultrasonic transducer provided by the embodiment of the present application comprises a transducing layer, a conductive layer, a conducting layer and a circuit board, the transducing layer is used to transmit and receive ultrasonic waves; the conductive layer is arranged on the upper surface of the transducing layer or on the side of the transducing layer adjacent to the object to be measured; the conducting layer and the circuit board are sequentially arranged on the conductive layer; the circuit board comprises a plurality of array elements and a plurality of wires, the plurality of array elements are arranged in an array along a first direction and a second direction; the plurality of wires are electrically connected to the corresponding array elements in the plurality of array elements, respectively, wherein the plurality of wires comprise a first wire, the extension direction of the first wire is at least partially parallel to the first direction, and the first wire overlaps at least one array element in the plurality of array elements in a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other, so that the wires of the ultrasonic transducer do not need to be formed by a complex semiconductor process, and do not need to be designed as a three-dimensional lead frame, thereby saving time and manufacturing cost, and saving volume. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A partial cross-sectional view of an ultrasonic transducer according to an embodiment of the present application is shown;

[0019] Figure 2A A top view of the ultrasonic transducer of Figure 1 is shown;

[0020] Figure 2B A partial cross-sectional view of the circuit board of the ultrasonic transducer along the 2B-2B' line of Figure 2A is shown;

[0021] Figure 2C A partial cross-sectional view of the circuit board of the ultrasonic transducer along the 2C-2C' line of Figure 2A is shown;

[0022] Figure 2D A partial cross-sectional view of the circuit board 120 of the ultrasonic transducer along the 2D-2D' line of Figure 2A is shown;

[0023] Figure 2E A partial cross-sectional view of the circuit board of the ultrasonic transducer according to another embodiment of the present application is shown;

[0024] Figure 3A A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;

[0025] Figure 3B Draw along Figure 3A A partial cross-sectional view of the circuit board of the ultrasonic transducer connected along line 3B-3B';

[0026] Figure 3C Draw along Figure 3A A partial cross-sectional view of a circuit board of an ultrasonic transducer with a 3C-3C' connection;

[0027] Figure 4A A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;

[0028] Figure 4B Draw along Figure 4A A partial cross-sectional view of the circuit board of the ultrasonic transducer connected along line 4B-4B';

[0029] Figure 4C Draw along Figure 4A A partial cross-sectional view of a circuit board of an ultrasonic transducer with a 4C-4C' connection;

[0030] Figure 5 A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;

[0031] Figure 6A A top view of an ultrasonic transducer according to another embodiment of the present invention is shown;

[0032] Figure 6B FIG. 1 is a top view of an ultrasonic transducer according to another embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to provide a further understanding of the purpose, structure, features and functions of the present invention, the following detailed description is given in conjunction with the embodiments.

[0034] Figure 1 A partial cross-sectional view of an ultrasonic transducer 10 according to an embodiment of the present invention is shown, for example, corresponding to Figure 2A 1-1' hatching. Figure 2A Draw Figure 1 FIG. 1 is a top view of the ultrasonic transducer 10 . Figure 2B Draw along Figure 2A FIG. 2 is a partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 10 along the line 2B- 2B′. Figure 2C Draw along Figure 2A FIG. 1 is a partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 10 along the 2C-2C′ line. Figure 2D Draw alongFigure 2A FIG. 1 is a partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 10 with 2D-2D′ connection lines.

[0035] Please also refer to Figure 1 and Figure 2A The ultrasonic transducer 10 includes a transducer layer 114, a conductive layer 116, a conducting layer 118, and a circuit board 120. The transducer layer 114 is used to transmit and receive ultrasonic waves. The conductive layer 116 is disposed on the other side of the transducer layer 114 relative to the object under test OB. The conducting layer 118 and the circuit board 120 are sequentially disposed on the conductive layer 116. The circuit board 120 includes a plurality of array elements 122 and a plurality of conductive lines 124. The plurality of array elements 122 are arranged in an array along a first direction D1 and a second direction D2. The plurality of conductive lines 124 are electrically connected to at least one corresponding array element in the plurality of array elements 122. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other. As such, the conductive lines of the ultrasonic transducer 10 of the present invention do not require complex semiconductor manufacturing processes or a three-dimensional lead frame, thereby saving time, cost, and volume.

[0036] Please also refer to Figure 1 and Figure 2A The ultrasonic transducer 10 includes a transducer layer 114 and a conductive layer 116, a conducting layer 118, and a circuit board 120 sequentially disposed on the transducer layer 114. The conductive layer 116 is disposed on the side of the transducer layer 114 opposite the object under test OB. The conducting layer 118 and the circuit board 120 are sequentially disposed on the transducer layer 114 and the conductive layer 116. For example, the transducer layer 114 has an upper surface 114a, and the conductive layer 116 is disposed on the upper surface 114a of the transducer layer 114. It should be understood that the present invention is not limited to this embodiment. In other embodiments, the conductive layer 116 may be disposed on the side of the transducer layer 114 adjacent to the object under test OB. Furthermore, the circuit board 120 is disposed on the conducting layer 118. That is, the circuit board 120 is further away from the conductive layer 116 than the conducting layer 118. The circuit board 120 may be, for example, a flexible printed circuit board, a rigid printed circuit board, or other suitable circuit board. The circuit board 120 may include a plurality of array elements 122, a plurality of wires 124 electrically connected to the array elements 122, and an insulating material 126 electrically isolating the array elements 122 from each other. Figure 1 In the embodiment, the object under test OB is, for example, a human body, a probe, or other suitable object under test. Furthermore, the ultrasonic transducer 10 may further include a ground electrode layer 112. The ground electrode layer 112 is disposed on the side of the transducer layer 114 opposite the conductive layer 116, i.e., the side facing the object under test OB. The ground electrode layer 112 corresponds to the lowest potential level (GND) of the system and provides an anti-interference effect.

[0037] According to some embodiments, the transducer layer 114 can be used to transmit and receive ultrasonic waves and convert between "electrical energy" and "acoustic energy". In some embodiments, the transducer layer 114 may include a piezoelectric material. The piezoelectric material may include, for example, lead zirconate titanate (PZT), single crystal material (PMNPT, LiNBO3), quartz, polyvinylidene fluoride (PVDF), aluminum nitride (AlN) and / or zinc oxide, but the present invention is not limited thereto. Figure 1 In the embodiment, the transducer layer 114 includes a plurality of transceiver portions 1141, and the transceiver portions 1141 are completely separated by an insulating material 1142 and do not electrically contact each other. For example, the transceiver portions 1141 are divided into a grid shape by the insulating material 1142, such as squares of equal size, but the present invention is not limited thereto. In other embodiments, the transceiver portions 1141 are not squares, but may be diamonds, circles, triangles, or other geometric shapes. In other embodiments, the sizes of the transceiver portions 1141 may not be exactly the same. In other embodiments, some of the transceiver portions 1141 may be connected to each other without being separated by the insulating material 1142. In other embodiments, all of the transceiver portions 1141 are connected to each other without being separated by the insulating material 1142.

[0038] like Figure 1 As shown, the conductive layer 116 includes a plurality of conductive portions 1161, and the conductive portions 1161 are separated from each other by an isolation material 1162. Since the conductive portions 1161 and the transceiver portion 1141 can be simultaneously defined in shape during cutting by a cutting machine, the conductive portions 1161 and the transceiver portion 1141 can have corresponding shapes. Similarly, the conductive portions 1161 are divided into a grid shape by the isolation material 1162, for example, squares of the same size, but the present invention is not limited to this. In other embodiments, the conductive portions 1161 are not squares, but can be diamonds, circles, triangles, or other geometric shapes. In other embodiments, the sizes of the conductive portions 1161 may not be exactly the same.

[0039] According to some embodiments, the material of the conductive layer 118 may include anisotropic conductive adhesive (ACA); anisotropic conductive paste (ACP); or anisotropic conductive film (ACF), for example including a plurality of conductive particles 118P.

[0040] Please refer to Figure 2AThe array elements 122 are arranged in a 6x6 array along the first direction D1 and the second direction D2, but the present application is not limited thereto, and the array elements 122 can be arranged in an 8x8 array, a 10x10 array, or other suitable array. The conductive lines 124 are respectively electrically connected to the corresponding array elements 122. In the present embodiment, the array elements 122 are arranged in a symmetrical array, and the array formed by the array elements 122 has a center point CP and a symmetry axis CL passing through the center point CP, the extension direction of the symmetry axis CL is parallel to the second direction D2, and the layout pattern of the conductive lines 124 is mirror-symmetrical with respect to the symmetry axis CL, but the present application is not limited thereto, and in other embodiments, the array elements 122 can be arranged in an asymmetrical array (e.g., a sparse matrix), and the layout pattern of the conductive lines is not mirror-symmetrical (not shown). As shown in FIG. 1B, the conductive lines 124 include first conductive lines 1241, second conductive lines 1242, and outer conductive lines 1243, and the extension directions of the first conductive lines 1241, the second conductive lines 1242, and the outer conductive lines 1243 are at least partially parallel to the first direction D1. That is, the extension directions of the first conductive lines 1241, the second conductive lines 1242, and the outer conductive lines 1243 can be parallel to each other (but the present application is not limited thereto). The second conductive lines 1242 are adjacent to the first conductive lines 1241, and the outer conductive lines 1243 are adjacent to the second conductive lines 1242. That is, the second conductive lines 1242 are disposed between the first conductive lines 1241 and the outer conductive lines 1243. Figure 2A

[0041] According to some embodiments, the first conductive lines 1241 and the second conductive lines 1242 have an offset distance S1 in the second direction D2, and the second conductive lines 1242 and the outer conductive lines 1243 have an offset distance S2 in the second direction D2. In the present embodiment, the offset distance S1 is equal to the offset distance S2, but the present application is not limited thereto. In other embodiments, the offset distance S1 is not equal to the offset distance S2, or the first conductive lines 1241, the second conductive lines 1242, and the outer conductive lines 1243 are staggered with respect to each other without an offset distance.

[0042] ​In the present embodiment, three conductive lines (the first conductive line 1241, the second conductive line 1242, and the outer conductive line 1243) are designed as one group, and a total of 12 groups of conductive lines are formed on the 36 array elements 122, but the present application is not limited thereto. The first conductive line 1241 overlaps a plurality of array elements 122 (for example, 3) corresponding to the array element 122 in the third direction D3, the second conductive line 1242 overlaps a plurality of array elements 122 (for example, 2) corresponding to the array element 122 in the third direction D3, and the outer conductive line 1243 overlaps the array element 122 corresponding to the array element 122 in the third direction D3. The first direction D1, the second direction D2, and the third direction D3 can be perpendicular to each other. The length of the first conductive line 1241 in the first direction D1 is greater than the length of the second conductive line 1242 in the first direction D1, and the length of the second conductive line 1242 in the first direction D1 is greater than the length of the outer conductive line 1243 in the first direction D1.

[0043] Please refer to Figures 2A-2D , the first conductive line 1241 includes a first portion 1241a connected to the array element 122 and a second portion 1241b connected to the first portion 1241a, wherein the extension direction of the first portion 1241a is parallel to the third direction D3, and the extension direction of the second portion 1241b is parallel to the first direction D1. In the present embodiment, the conductive lines 124 are respectively electrically connected to the upper surfaces 122a of the array elements 122, but the present application is not limited thereto. As shown in Figure 2A , the contact position of the first conductive line 1241 with the corresponding upper surface 122a is closer to the symmetry axis CL than the contact position of the second conductive line 1242 with the corresponding upper surface 122a. The contact position of the second conductive line 1242 with the corresponding upper surface 122a is closer to the symmetry axis CL than the contact position of the outer conductive line 1243 with the corresponding upper surface 122a. As shown in Figure 2D , the maximum height H1 of the first conductive line 1241 in the third direction D3 (i.e., the distance between the first conductive line 1241 and the bottom surface 120m of the circuit board 120 in the third direction D3) is equal to the maximum height H2 of the second conductive line 1242 in the third direction D3 (i.e., the distance between the second conductive line 1242 and the bottom surface 120m of the circuit board 120 in the third direction D3), but the present application is not limited thereto, in other embodiments, the heights of the first conductive line 1241 and the second conductive line 1242 in the third direction D3 can be different from each other.

[0044] According to the present embodiment, since the conductive wire 124 of the ultrasonic transducer 10 is formed in the circuit board 120 without the need of complicated semiconductor manufacturing process, and the conductive wire 124 includes a horizontally extending direction (i.e. the extending direction of the first direction D1) without the need of being designed as a vertically extending (i.e. the extending direction of the third direction D3) three-dimensional lead frame, time and manufacturing cost can be saved, and the volume of the ultrasonic transducer 10 can be saved as well.

[0045] Figure 2E A partial cross-sectional view of the circuit board 120 of the ultrasonic transducer 20 according to another embodiment of the present application is shown (which can correspond to a cross-section along the 2B-2B' line of Figure 2A . The circuit board 220 of the ultrasonic transducer 20 differs from the circuit board 120 of the ultrasonic transducer 10 in one aspect that the extending direction of the conductive wire 224 is different, and other same or similar aspects will not be repeatedly described.

[0046] Please refer to Figure 2E . The first conductive wire 2241 includes a first portion 2241a, a second portion 2241b and a third portion 2241c, the first portion 2241a is connected to the array element 122, the second portion 2241b is connected to the first portion 2241a, and the third portion 2241c is connected to the second portion 2241b, wherein the extending direction of the first portion 2241a is parallel to the first direction D1, the extending direction of the second portion 2241b is parallel to the third direction D3, and the extending direction of the third portion 2241c is parallel to the first direction D1. The contact area between the first portion 2241a (as shown in Figure 2E ) and the corresponding array element 122 can be greater than the contact area between the first portion 1241a (as shown in Figure 2B ) and the corresponding array element 122.

[0047] Figure 3A A top view of the ultrasonic transducer 30 according to yet another embodiment of the present application is shown. Figure 3B A partial cross-sectional view of the circuit board 320 of the ultrasonic transducer 30 along the 3B-3B' line of Figure 3A is shown. Figure 3C A partial cross-sectional view of the circuit board 320 of the ultrasonic transducer 30 along the 3C-3C' line of Figure 3A is shown. The circuit board 320 of the ultrasonic transducer 30 differs from the circuit board 120 of the ultrasonic transducer 10 in one aspect that the contact position of the conductive wire 324 and the array element 122 is different, and other same or similar aspects will not be repeatedly described.

[0048] Please refer to Figures 3A-3CThe conductive wire 324 includes a first conductive wire 3241 , a second conductive wire 3242 , and an outer conductive wire 3243 . The first conductive wire 3241 , the second conductive wire 3242 , and the outer conductive wire 3243 are respectively electrically in contact with the side surface 122 s of the corresponding array element 122 .

[0049] Figure 4A FIG. 1 is a top view of an ultrasonic transducer 40 according to another embodiment of the present invention. Figure 4B Draw along Figure 4A FIG. 4B-4B′ is a partial cross-sectional view of the circuit board 420 of the ultrasonic transducer 40 . Figure 4C Draw along Figure 4A A partial cross-sectional view of the circuit board 420 of the ultrasonic transducer 40 along the line 4C-4C' is shown. The circuit board 420 of the ultrasonic transducer 40 differs from the circuit board 120 of the ultrasonic transducer 10 in that the design of the wire 424 is different. Other similarities will not be described again.

[0050] Please also refer to Figures 4A-4C The wire 424 includes a first wire 4241, a second wire 4242 and an outer wire 4243. The first wire 4241, the second wire 4242 and the outer wire 4243 are respectively in electrical contact with the upper surface 122a of the corresponding array element 122. Figure 4A As shown, the first wire 4241, the second wire 4242 and the outer wire 4243 are designed to extend coaxially. They can overlap with each other in the first direction D1 (for example, the areas projected along the first direction D1 onto the side surface (not shown) of the circuit board 420 can overlap with each other), and their vertical projections in the third direction D3 (for example, the areas projected along the third direction D3 onto the bottom surface 420m of the circuit board 420) can overlap with each other. They are separated from each other in the third direction D3 and have different heights. Figure 4B As shown, the maximum height H3 of the first conductor 4241 in the third direction D3 (i.e., the distance between the first conductor 4241 and the bottom surface 420m of the circuit board 420 in the third direction D3) may be greater than the maximum height H4 of the second conductor 4242 in the third direction D3 (i.e., the distance between the second conductor 4242 and the bottom surface 420m of the circuit board 420 in the third direction D3).

[0051] Figure 5 A top view of an ultrasonic transducer 50 according to another embodiment of the present invention is shown. Identical or similar components in the circuit board 520 of the ultrasonic transducer 50 and the circuit board 120 of the ultrasonic transducer 10 are labeled with identical or similar reference numerals, have identical or similar materials, and function. Other identical or similar features will not be described again.

[0052] Please refer to Figure 5The array elements 122 are arranged in an 8x8 array along the first direction D1 and the second direction D2. The conductive lines 524 are electrically connected to the corresponding array elements 122, respectively. The conductive lines 524 include a first conductive line 5241, a second conductive line 5242, a third conductive line 5243, and a fourth conductive line 5244. The second conductive line 5242 is adjacent to the first conductive line 5241, and the fourth conductive line 5244 is adjacent to the third conductive line 5243. In this embodiment, the first conductive line 5241 and the second conductive line 5242 extend at least partially parallel to the first direction D1, the third conductive line 5243 and the fourth conductive line 5244 extend at least partially parallel to the second direction D2, the first conductive line 5241 and the second conductive line 5242 have an offset distance S3 in the second direction D2, and the third conductive line 5243 and the fourth conductive line 5244 have an offset distance S4 in the first direction D1. As shown in FIG. 5B, the third conductive line 5243 includes a first portion 5243a and a second portion 5243b, the first portion 5243a is connected to the corresponding array element 122, and the second portion 5243b is connected to the first portion 5243a. The first portion 5243a extends parallel to the second direction D2, and the second portion 5243b extends parallel to the first direction D1. However, the present application is not limited thereto, and in other embodiments, the first conductive line 5241 and the second conductive line 5242 can not extend parallel to the first direction D1, the third conductive line 5243 and the fourth conductive line 5244 can not extend parallel to the second direction D2, the first conductive line 5241 and the second conductive line 5242 can not have an offset distance in the second direction D2, and the third conductive line 5243 and the fourth conductive line 5244 can not have an offset distance in the first direction D1, in other words, the plurality of conductive lines 524 (including the first conductive line 5241 to the fourth conductive line 5243) can be staggered or overlapped in different layers. For example, the first conductive line 5241 and the second conductive line 5242 can be overlapped with each other in the third direction D3 (not shown), and the third conductive line 5243 and the fourth conductive line 5244 can be overlapped with each other in the third direction D3 (not shown). Figure 5

[0053] Figure 6A FIG. 6B shows a top view of an ultrasonic transducer 60A according to another embodiment of the present application. The circuit board 620A of the ultrasonic transducer 60A differs from the circuit board 520 of the ultrasonic transducer 50 in that the circuit board 620A further includes a plurality of dummy conductive lines 128, and other same or similar parts will not be described repeatedly.

[0054] Please refer to Figure 6A ​The dummy wire 128 is connected to the corresponding array element 122, wherein the array element 122 includes adjacent first and second array elements 1221 and 1222, the first array element 1221 has a first overlapping area Al with the wire 524 and the dummy wire 128 in the third direction D3, and the second array element 1222 has a second overlapping area A2 with the wire 524 and the dummy wire 128 in the third direction D3, the first overlapping area Al is the same as or approximately equal to the second overlapping area A2, for example, Al = A2 or Al is approximately equal to A2.

[0055] According to the present embodiment, the circuit board 620A of the ultrasonic transducer 60A plus the dummy wire 128 used as a counterweight can be used to balance the acoustic load, so as to overcome the problem derived from the inconsistent path length of each array element 122 to the peripheral pad, and to maintain the acoustic characteristics from the piezoelectric element.

[0056] Figure 6B An upper view of an ultrasonic transducer 60B according to another embodiment of the present application is shown. The circuit board 620B of the ultrasonic transducer 60B is different from the circuit board 620A of the ultrasonic transducer 60A in that the shape of the array element 122' of the circuit board 620B is different, and other same or similar parts will not be described repeatedly.

[0057] Please refer to Figure 6B The array element 122' is rectangular in the upper view. It should be understood that the shape of the array element of the present application is not limited to circular (as shown in Figures 2A-6A ) and rectangular (as shown in Figure 6B ), but can be other suitable shapes.

[0058] As shown in Figure 6B , the dummy wire 128' is connected to the corresponding array element 122', wherein the array element 122' includes adjacent first and second array elements 1221' and 1222', the first array element 1221' has a first overlapping area A3 with the wire 524' and the dummy wire 128' in the third direction D3, and the second array element 1222' has a second overlapping area A4 with the wire 524' and the dummy wire 128' in the third direction D3, the first overlapping area A3 is the same as or approximately equal to the second overlapping area A4, for example, A3 = A4 or A3 is approximately equal to A4.

[0059] In summary, the present application provides an ultrasonic transducer. The ultrasonic transducer includes a transducing layer, a conductive layer, a conductive layer, and a circuit board. The transducing layer is used to transmit and receive ultrasonic waves. The conductive layer is disposed on the upper surface of the transducing layer or on the side of the transducing layer adjacent to the object to be measured. The conductive layer and the circuit board are sequentially disposed on the conductive layer. The circuit board includes a plurality of array elements and a plurality of conductive wires. The array elements are arranged in an array along a first direction and a second direction. The conductive wires are electrically connected to the corresponding array elements, respectively, wherein the conductive wires include a first conductive wire, the extension direction of the first conductive wire is at least partially parallel to the first direction, and the first conductive wire overlaps at least one of the corresponding array elements in the third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other. Since the conductive wires of the ultrasonic transducer of the present application are formed in the circuit board, they do not need to be formed by complex semiconductor processes, and the conductive wires include a horizontal extension direction (i.e. the extension direction of the first direction D1), which does not need to be designed as a vertical extension (i.e. the extension direction of the third direction D3) of the vertical conductive frame, so as to save time and manufacturing cost, and to save the volume of the ultrasonic transducer.

[0060] Although the present application has been described in connection with the preferred embodiments thereof with reference to the drawings, it is to be noted that the disclosed embodiments are intended to be illustrative only and not limiting to the scope of the application. The dimensions of the components in the schematic drawings are not necessarily to scale.

[0061] The present application has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples of implementing the present application. It must be pointed out that the disclosed embodiments do not limit the scope of the present application. On the contrary, modifications and improvements made without departing from the spirit and scope of the present application are within the scope of the patent protection of the present application.

Claims

1. An ultrasonic transducer, characterized in that: include: A transducer layer for transmitting and receiving ultrasonic waves; a conductive layer disposed on the upper surface of the transducer layer or on a side of the transducer layer adjacent to the object to be measured; A conductive layer and a circuit board (120) are sequentially arranged on the conductive layer; The circuit board includes: A plurality of array elements are arranged in an array along a first direction and a second direction; as well as A plurality of conductive lines are electrically connected to corresponding array elements among the plurality of array elements, wherein the plurality of conductive lines include a first conductive line, wherein an extension direction of the first conductive line is at least partially parallel to the first direction, and the first conductive line overlaps with at least one corresponding array element among the plurality of array elements in a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

2. The ultrasonic transducer according to claim 1, wherein The first conductive line includes a first portion and a second portion. The first portion is connected to the array element, and the second portion is connected to the first portion. An extending direction of the first portion is parallel to the third direction, and an extending direction of the second portion is parallel to the first direction.

3. The ultrasonic transducer according to claim 1, wherein The first conductive line includes a first portion, a second portion (2241b) and a third portion, wherein the first portion is connected to the array element, the second portion is connected to the first portion, and the third portion is connected to the second portion, wherein an extension direction of the first portion is parallel to the first direction, an extension direction of the second portion is parallel to the third direction, and an extension direction of the third portion is parallel to the first direction.

4. The ultrasonic transducer according to claim 1, wherein The plurality of conductive lines further include a second conductive line adjacent to the first conductive line. An extension direction of the second conductive line is at least partially parallel to the first direction, and an offset distance exists between the first conductive line and the second conductive line in the second direction.

5. The ultrasonic transducer according to claim 1, wherein: The first conductive line is in electrical contact with the upper surface or the side surface of the array element. The normal direction of the upper surface is parallel to the third direction, and the side surface is connected to the upper surface.

6. The ultrasonic transducer according to claim 5, wherein: The plurality of wires further include a second wire adjacent to the first wire. An extension direction of the second wire is at least partially parallel to the first direction. The first wire and the second wire overlap in the first direction and are separated from each other in the third direction.

7. The ultrasonic transducer according to claim 1, wherein: The area formed by the multiple arrays has a center point and a symmetry axis passing through the center point. The extension direction of the symmetry axis is parallel to the second direction. The layout patterns of the multiple conductive lines are mirror-symmetrical about the symmetry axis.

8. The ultrasonic transducer according to claim 7, wherein: The plurality of wires further include a second wire, a third wire, and a fourth wire, wherein the second wire is adjacent to the first wire, and the third wire is adjacent to the fourth wire; The plurality of array elements connected to the first conductive line and the second conductive line are farther away from the symmetry axis than the plurality of array elements connected to the third conductive line and the fourth conductive line.

9. The ultrasonic transducer according to claim 8, wherein: An extending direction of the second conductive line is at least partially parallel to the first direction, and an extending direction of the third conductive line and an extending direction of the fourth conductive line are at least partially parallel to the second direction.

10. The ultrasonic transducer according to claim 8, wherein The third conductive line and the fourth conductive line overlap each other in the third direction.

11. The ultrasonic transducer according to claim 8, wherein The system further includes a plurality of dummy conductive lines connected to the corresponding plurality of array elements, wherein the plurality of array elements include a first array element and a second array element that are adjacent to each other, the first array element having a first overlapping area with the plurality of conductive lines and the plurality of dummy conductive lines in the third direction, the second array element having a second overlapping area with the plurality of conductive lines and the plurality of dummy conductive lines in the third direction, and the first overlapping area being equivalent to the second overlapping area.

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