Chip frame punching device with suction mechanism

By designing a chip frame punching device with a suction mechanism, and utilizing a combination of a rotating arm and a receiving platform, the automated transfer and collection of chips is achieved. This solves the problems of increased costs and unstable quality caused by manual transfer in existing technologies, thereby improving production efficiency and product quality.

CN120790754BActive Publication Date: 2025-11-25XINXIANG MICROELECTRONICS (NANTONG) CO LTD
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Patent Information

Application Number
CN202511312148.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-15
Publication Date
2025-11-25
Estimated Expiration
2045-09-15

AI Technical Summary

Technical Problem

Existing chip frame punching equipment requires manual transfer after chip punching, which increases labor costs and results in unstable product quality.

Method used

Design a chip frame punching device with a suction mechanism. Utilize a combination of a rotating arm, receiving platform, suction pump, and gear rack to achieve automated chip transfer and collection. The device includes worm gear drive, gear meshing, and the use of suction holes to ensure that the chips are not damaged during the flipping process.

Benefits of technology

It enables automated transfer after chip punching, reduces labor costs, improves production efficiency and product quality stability, and reduces the impact of human factors on product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the application provides a chip frame punching device with a material suction mechanism, and relates to the technical field of punching device.The chip frame punching device with the material suction mechanism is provided with a rotating arm capable of rotating with a rotating frame as an axis in the region between a bottom die and an upper die, one end of the rotating frame is fixedly connected with the front surface of a punching table, the end of the rotating arm away from the rotating frame is coaxially connected with a material receiving table, a plurality of suction holes are formed in the upper surface of the material receiving table, a gear one provided on the outer circumferential surface of a rotating pipe is meshingly connected with a tooth ring fixed on the surface of the punching table, after chip punching is completed, the motor drives the rotating arm to rotate through a worm and a worm wheel, so that the material receiving table is moved to below a pressing piece.Subsequently, the motor is reversely rotated to drive the rotating arm and the material receiving table to rotate, and the material receiving table is turned over through the action of the gear one and the tooth ring.Finally, the suction pump two stops working, the chip falls into the material receiving table, and automatic chip transfer is completed.
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Description

Technical Field

[0001] This invention belongs to the field of punching device technology, and particularly relates to a chip frame punching device with a material suction mechanism. Background Technology

[0002] As the carrier of integrated circuit chips, the chip frame forms an electrical circuit by connecting the internal circuit leads of the chip with the external leads, thus acting as a bridge to connect with external wires. As the foundation for mounting the chip, the chip frame is generally transported by a tape and reel machine during the production process, and then punched away by a punching machine.

[0003] The existing technology (publication number CN115971326B, patent application titled "A punching device for producing copper clips") includes a lifting mechanism, a suction mechanism, and a synchronous clamping mechanism. The suction mechanism includes a piston tube, a piston plate, a connecting plate, a stroke adjusting seat, and a tapered connecting tube. In implementing this technical solution, at least the following problems were found in the existing technology.

[0004] Although the above-mentioned punching device meets the production needs to a certain extent, it still has some shortcomings in practical applications. When the chip needs to be punched, the chip in the chip frame is punched by the mutual movement of the upper and lower dies. After the punching is completed, the chip will stay on the die for the operator to take it out. This method not only increases labor costs, but may also lead to unstable product quality due to human factors. Summary of the Invention

[0005] This application aims to at least solve one of the technical problems of chip punching and blanking transfer in the prior art. To this end, this application proposes a chip frame punching device with a suction mechanism.

[0006] To achieve the above objectives, the specific technical solution of the present invention is as follows: A chip frame punching device with a suction mechanism includes a base, and a bottom mold and an upper mold on the base for punching chips. A rotating arm is provided in the area between the bottom mold and the upper mold, which can rotate around a rotating frame. One end of the rotating frame is fixedly connected to the front of the punching table. A receiving platform is coaxially connected to one end of the rotating arm away from the rotating frame. At the same time, a plurality of suction holes are opened on the upper surface of the receiving platform. A rotating tube extends from the surface of the receiving platform to one end of the rotating arm. A gear provided on the outer circumference of the rotating tube meshes with a gear ring fixed on the surface of the punching table.

[0007] Preferably, the upper surface of the bottom mold is provided with a lower pressure plate that is vertically displaced relative to the lower pressure plate. At the same time, the guide posts at the four corners of the bottom surface of the lower pressure plate are placed inside the bottom mold, and a spring for rebound is sleeved on the outer periphery of the guide posts. A guide platform is fixed along the transverse area through which the material strip of the lower pressure plate passes.

[0008] Preferably, a worm gear is fixed on the outer circumferential surface of the rotating arm with the axis as the rotation point, and a worm is meshed and connected to one side of the outer circumferential surface of the worm gear. The rotation of the worm is driven by a motor connected to one end, and the motor is fixed by a bracket fixedly connected to the base. An air pump is also fixed on the surface of the base. The suction end of the air pump is connected to the bottom surface of the rotating arm through an air pipe. A feeding platform is provided in the area where the rotating arm rotates and feeds materials. The feeding platform is fixedly connected to the surface of the base.

[0009] Preferably, two racks are fixed to the bottom surface of the receiving platform. As the rotating arm rotates, the racks drive the second gear on the upper surface of the guide platform. At the same time, a rotatable threaded rod extends from the bottom surface of the second gear into the inside of the guide platform.

[0010] Preferably, the surface of the guide table is connected to a lower pressure bar by a threaded drive. A protrusion extends from one side of the surface of the lower pressure bar toward the threaded rod, and a threaded hole is opened through the surface of the protrusion to form a threaded connection with the threaded rod.

[0011] Preferably, the lifting blocks at both ends of the lower pressure strip are arranged on the same side as the protrusions, and the lifting blocks are slidably placed inside the guide platform, and the lower pressure blocks for pressing the material strip are evenly distributed from one end of the bottom surface of the lower pressure strip.

[0012] Preferably, one end of the unloading platform is hinged to a flipping platform that can be rotated, and a gear three is fixed on one side of the flipping platform where it is hinged. A rotating shaft frame is fixed on one side of the bottom surface of the unloading platform. An opening is made through one end of the rotating shaft frame and a rotating shaft passes through it. A gear four is fixed on one end of the rotating shaft on the same side as the gear three. The gear four and the gear three form a meshing connection.

[0013] Preferably, gear five is fixed on both sides of the outer peripheral surface of the rotating shaft, and a rack two for driving its rotation is meshed above the gear five. A push plate is fixed to the other end of the rack two.

[0014] Preferably, the push plate surface is coaxially provided with a piston rod that drives it to move together, and one end of the piston rod is coaxially sleeved with a pressure tube, and a fixed connection is formed between the pressure tube surface and the base surface.

[0015] Preferably, a push block is fixed on the bottom surface of the worm gear on the side offset from the center, and the push block and the piston rod transmit power through a push rod.

[0016] The chip frame punching device with a suction mechanism of the present invention has the following advantages:

[0017] 1. This chip frame punching device with a suction mechanism, after the chip punching is completed, the motor drives the rotating arm to rotate via a worm gear and worm wheel, moving the receiving platform below the pressing part. At this time, suction pump two starts to pick up the chip, while suction pump one stops working. Subsequently, the motor rotates in the opposite direction, driving the rotating arm and receiving platform to rotate, and through the action of gear one and the gear ring, the receiving platform is flipped. Finally, suction pump two stops working, and the chip falls into the unloading platform, completing the automated chip transfer.

[0018] 2. This chip frame punching device with a feeding mechanism, after the chip punching is completed, the upper die moves upward, and the rotating arm rotates around its axis. During this process, the rack and pinion drive gear two at the bottom of the receiving platform rotates, which in turn drives the threaded rod connected to it to rotate synchronously. Since the threaded rod is threadedly connected to the lower pressure bar, the rotation of the threaded rod causes the lower pressure bar to move upward. This step provides space for the material strip to be wound and fed. After the material strip has been wound and fed, the rotating arm rotates in the opposite direction, causing the lower pressure bar to move downward again, thereby applying pressure to the material strip again, fixing the material strip, and preparing for the next round of punching operation.

[0019] 3. This chip frame punching device with a feeding mechanism, when the receiving platform is located between the upper and lower dies, the flipping platform is tilted to allow the chips on it to slide onto the unloading platform, which then guides them to the next processing area. Once the receiving platform has finished picking up the chip and begins to rotate towards the unloading platform below, the pusher block below the worm gear pushes the push rod. The movement of the push rod drives gear five via rack two, which in turn meshes with gear four, further driving gear three. This series of actions ultimately brings the originally tilted flipping platform to a horizontal position, facilitating the reception of chips falling from the receiving platform. Subsequently, the flipping platform flips again, allowing the chips to slide smoothly onto the unloading platform, completing the automatic chip transfer process. This mechanism effectively improves the automation and efficiency of chip processing.

[0020] 4. This chip frame punching device with a suction mechanism, when the rotating arm moves from between the upper and lower dies towards the lower unloading platform, the piston rod compresses the space inside the pressure tube, causing the gas in the pressure tube to enter the expansion membrane through the air pipe three, causing it to expand. The expanded membrane acts as a buffer, effectively reducing the impact force when the chip adsorbed on the receiving platform falls onto the flipping platform, protecting the chip from damage. Simultaneously, as the flipping platform flips upward, the rotation of gear four causes the eccentric block on its surface to vibrate. This vibration helps accelerate the chip's sliding from the flipping platform to the lower unloading platform and promotes rapid chip transfer on the surface of the unloading platform. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the upper mold structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the bottom mold structure of the present invention;

[0025] Figure 4 This is a top view of the punching mechanism of the present invention;

[0026] Figure 5 For the purposes of this invention Figure 4 Schematic diagram of the cross-sectional structure at point AA;

[0027] Figure 6 This is a schematic diagram of the unloading platform structure of the present invention;

[0028] Figure 7 This is a schematic diagram of the rotating arm structure of the present invention;

[0029] Figure 8 This is a top view of the rotating arm structure of the present invention;

[0030] Figure 9 For the purposes of this invention Figure 8 Schematic diagram of the cross-sectional structure of the middle BB section;

[0031] Figure 10 This is a bottom view of the rotating arm structure of the present invention;

[0032] Figure 11 This is a schematic diagram of the guide platform structure of the present invention;

[0033] Figure 12 This is a schematic diagram of the material turning table structure of the present invention;

[0034] Figure 13 This is a bottom view of the tilting table structure of the present invention;

[0035] Figure 14 This is a top view of the material turning table structure of the present invention;

[0036] Figure 15 For the purposes of this invention Figure 14 Schematic diagram of the cross-sectional structure of the middle CC section;

[0037] Figure 16 For the present invention Figure 15 Enlarged structural diagram at point B.

[0038] Explanation of markings in the diagram: 1. Base; 11. Punching mechanism; 12. Punching table; 13. Upper die; 131. Lower pressing part; 14. Bottom die; 141. Lower pressure plate; 142. Spring 1; 143. Guide table; 15. Air pipe 1; 151. Suction pump 1; 16. Suction head; 161. Pneumatic telescopic part; 17. Lower pressure bar; 171. Lower pressure block; 172. Protrusion; 173. Lifting block; 18. Threaded rod; 181. Gear 2; 19. Gear ring; 2. Unloading table; 21. Tilting table; 211. Gear 3; 212. Expansion plate; 1. Expanding film; 2.13. Rotating shaft frame; 3. Rotating frame; 3.1. Rotating arm; 3.11. Receiving platform; 3.12. Gear one; 3.13. Rotating tube; 3.14. Limiting block; 3.15. Rack; 3.16. Adsorption hole; 3.2. Motor; 3.21. Worm; 3.22. Push block; 3.3. Worm wheel; 3.4. Air pipe two; 3.41. Suction pump two; 4. Push rod; 4.1. Pressurizing pipe; 4.11. Air pipe three; 4.2. Piston rod; 4.3. Push plate; 4.31. Rack two; 5. Rotating shaft; 5.1. Gear four; 5.11. Eccentric block; 5.2. Gear five. Detailed Implementation

[0039] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0040] like Figures 1-2 As shown, a chip frame punching device with a feeding mechanism according to the present invention is composed of a base 1, a punching mechanism 11, a punching table 12 and a feeding table 2. The punching mechanism 11 for punching chips is fixed from one side of the top of the base 1. The punching mechanism 11 can be a hydraulic punching machine. The punching table 12 is formed on the upper surface of the base 1 below the punching mechanism 11. The punching table 12 can provide an operating plane for punching chips. The receiving machines on both sides of the base 1 feed and receive the chips in strip shape.

[0041] like Figures 3-5 As shown, a bottom mold 14 is fixed on the upper surface of the base 1 located directly below the punching mechanism 11. At the same time, a punching tool is also provided on the bottom mold 14. An upper mold 13 is fixed on the end of the punching mechanism 11 that is used for extension and retraction. After the upper mold 13 moves downward with the punching mechanism 11, the chip on the strip can be punched by the tool.

[0042] A lower pressure plate 141 is provided along the longitudinal vertical displacement of the upper surface of the bottom mold 14. At the same time, the guide posts at the four corners of the bottom surface of the lower pressure plate 141 are placed inside the bottom mold 14, thereby enabling the lower pressure plate 141 to move up and down. A spring 142 for rebound is sleeved on the outer circumference of the guide posts.

[0043] A guide platform 143 is fixed along the transverse area through which the material strip passes by the lower pressure plate 141. The width of the guide platform 143 is adapted to the width of the material strip. One end of the lower pressure member 131 used for lower pressure positioning is fixed to the bottom of the upper mold 13. The bottom of the lower pressure member 131 is set with an open structure so that the cutter can punch the chip. The suction head 16 for sucking up the punched chip is placed inside the lower pressure member 131, and the bottom of the suction head 16 is flush with the bottom of the lower pressure member 131. At the same time, the vertical movement of the suction head 16 is achieved by the pneumatic telescopic members 161 on both sides. An air pipe 15 extends from the top of the suction head 16 toward the base 1, and one end of the air pipe 15 is connected to the suction end of the suction pump 151 on the surface of the base 1. That is, when the chip frame strip needs to be punched, one end of the strip passes through the guide table 143 and is wound up by the take-up machine on one side of the guide table 143. As the punching mechanism 11 moves downward, the lower pressure member 131 presses the strip downward. As the punching mechanism 11 moves downward continuously, the cutter on the bottom die 14 pushes up, and at the same time, the suction head 16 moves upward, and the chip can be punched down. Then the suction pump 151 runs to pick up the chip. As the upper die 13 moves upward, the chip can also follow synchronously.

[0044] like Figures 5-9 As shown, a rotating arm 31 is provided in the area between the bottom mold 14 and the upper mold 13, which can rotate around the rotating frame 3. One end of the rotating frame 3 is fixedly connected to the front of the punching table 12. As the rotating arm 31 rotates, it can receive the chip after being sucked up by the suction head 16.

[0045] A hole is opened at one end of the rotating arm 31, which is located away from the rotating frame 3. A rotatable receiving platform 311 is coaxially arranged through this hole. One end of a rotating tube 313 extending from the receiving platform 311 toward the rotating arm 31 is inserted into the hole. The rotating arm 31 and the receiving platform 311 are connected to the interior of the rotating arm 31. At the same time, several suction holes 316 are opened on the upper surface of the receiving platform 311, through which chips falling from the suction head 16 are adsorbed.

[0046] A worm gear 33 is fixed on the outer circumferential surface of the rotating arm 31 with the axis of rotation as the pivot. At the same time, a worm 321 is meshed and connected to one side of the outer circumferential surface of the worm gear 33. The rotation of the worm 321 is driven by a motor 32 connected to one end. The motor 32 is fixed by a bracket that is fixedly connected to the base 1.

[0047] An air pump 2 341 is also fixed on the surface of the base 1. The suction end of the air pump 2 341 is connected to the bottom surface of the rotating arm 31 through an air pipe 2 34.

[0048] A limiting block 314 extends upward from the outer circumference of the rotating tube 313, which rotates through the hole. One end of the limiting block 314 is located inside a semi-circular guide groove on the inner annular wall surface of the hole. This allows the receiving platform 311 to rotate only 180 degrees. Meanwhile, a gear 312 on the outer circumference of the rotating tube 313 meshes with a gear ring 19 fixed on the surface of the punching table 12. A feeding platform 2 is provided in the area where the rotating arm 31 rotates and feeds material. The feeding platform 2 is fixedly connected to the surface of the base 1. Therefore, after the chip is punched, the motor 32 starts running. Then, the worm gear 321 at the output end of the motor 32 drives the worm wheel 33 to rotate. As the worm wheel 33 rotates, its rotating arm 31 rotates 90 degrees, so that the upper surface of the receiving platform 311 can move to below the pressing member 131. As the suction pump 2 341 runs and adsorbs, after the suction pump 1 151 stops running, the chip adsorbed below its suction head 16 can be adsorbed by the receiving platform 311. Then the motor 32 rotates in the opposite direction, so that the rotating arm 31 can rotate in the opposite direction by 90 degrees. During the 90-degree reverse rotation of the rotating arm 31, the gear 1 312 is driven by the gear ring 19. Then the receiving platform 311 rotates 180 degrees. After the rotating arm 31 stops rotating and the suction pump 2 341 stops adsorbing, the chip adsorbed by the receiving platform 311 can fall to the unloading platform 2 for unloading.

[0049] like Figures 10-11 As shown, two racks 315 are fixed on the bottom surface of the receiving platform 311. After the rotating arm 31 rotates, the racks 315 drive the gear 181 on the upper surface of the guide platform 143. At the same time, a rotatable threaded rod 18 extends from the bottom surface of the gear 181 into the guide platform 143. Therefore, when the rotating arm 31 rotates around the axis, the racks 315 can mesh with the gear 181 and drive it. After the gear 181 rotates, the threaded rod 18 below the gear 181 can rotate.

[0050] Meanwhile, two opposing guide platforms 143 are connected to lower pressure strips 17 by threaded drive. A protrusion 172 extends from one side of the lower pressure strip 17 towards the threaded rod 18. A threaded hole through the protrusion 172 forms a threaded connection with the threaded rod 18. Therefore, when the threaded rod 18 rotates forward or backward, the lower pressure strip 17 connected to it can move up and down. Lifting blocks 173, located near the ends of the lower pressure strip 17, are positioned on the same side as the protrusion 172. The lifting blocks 173 are slidably placed inside the guide platform 143, allowing the lower pressure strip 17 to move up and down. Lower pressure blocks 171, for pressing the material strip, are evenly distributed from one end of the bottom surface of the lower pressure strip 17. Therefore, after the chip is punched and the upper die 13 moves upward, the rotating arm 31 rotates around the axis, and the rack 315 on the bottom surface of the receiving platform 311 drives the gear 181 to rotate. As the gear 181 rotates, the threaded rod 18 below rotates as well. After the threaded rod 18 rotates, the lower pressure bar 17 threaded to it moves upward. Then the strip is wound up for feeding. After feeding is completed, the rotating arm 31 rotates in the opposite direction, which allows the lower pressure bar 17 to press down again to punch and limit the strip.

[0051] like Figure 9 and Figures 12-16 As shown, a tilting platform 21 that can be flipped is hinged to one end of the unloading platform 2. A gear 3 211 is fixed on one side of the tilting platform 21 at the hinge point. As the tilting platform 21 flips, the gear 3 211 can also flip. A rotating shaft frame 213 is fixed on one side of the bottom surface of the unloading platform 2. One end of a rotating shaft 5 passes through the rotating shaft frame 213, and a gear 4 51 is fixed to one end of the rotating shaft 5 on the same side as the gear 3 211. The gear 4 51 and the gear 3 211 form a meshing connection.

[0052] Gear 52 is fixed on both sides of the outer circumference of the rotating shaft 5. A rack 431 for driving its rotation is also meshed above the gear 52. A push plate 43 is fixed to the other end of the rack 431. A piston rod 42 is coaxially provided on the surface of the push plate 43 to drive it to move together. At the same time, a pressure tube 41 is coaxially sleeved on one end of the piston rod 42, and a fixed connection is formed between the surface of the pressure tube 41 and the surface of the base 1, so that the piston rod 42 can move and extend along the inside of the pressure tube 41.

[0053] A push block 322 is fixed on the side of the bottom surface of the worm gear 33 that is off-center. The push block 322 and the piston rod 42 are connected by a push rod 4. Therefore, when the receiving platform 311 is located between the upper mold 13 and the bottom mold 14, the flipping platform 21 is tilted and flipped, which allows the chip above the flipping platform 21 to slide down to the unloading platform 2. Then, the chip slides down to the next processing area through the unloading platform 2. When the receiving platform 311 rotates towards the unloading platform 2 after receiving the chip, the push block 322 below the worm gear 33 pushes the push rod 4. As the push rod 4 moves, the rack 2 431 on the push rod 4 drives the gear 52. Then, the gear 4 51 meshes and drives the gear 3 211 above. The tilted flipping platform 21 can then be horizontal to facilitate receiving the chip that falls from the receiving platform 311. Then, the chip slides down as the flipping platform 21 flips.

[0054] like Figure 16 As shown, after the chip is adsorbed and transferred by the receiving platform 311, it falls onto the flipping platform 21. Due to the height difference, the chip is prone to damage after falling onto the flipping platform 21. The receiving surface of the flipping platform 21 is covered with an expansion film 212, and an air pipe 411 connects one end of the pressurization pipe 41 to the bottom surface of the flipping platform 21. At the same time, an eccentric block 511 is fixed on the surface of the gear 51, and the eccentric block 511 is located away from the center of the gear 51. Therefore, after the rotating arm 31 moves from between the upper mold 13 and the bottom mold 14 towards the lower material platform 2, the piston rod 42 squeezes the internal space of the pressure tube 41. Then, the gas inside the pressure tube 41 can expand the expansion film 212 through the air pipe 3 411, so that the chip adsorbed by the receiving platform 311 can be buffered by the expansion film 212. At the same time, when the flipping platform 21 flips upward, as the gear 4 51 rotates, the eccentric block 511 on the surface of the gear 4 51 vibrates, which in turn allows the chip to slide from the flipping platform 21 towards the lower material platform 2 and accelerates the sliding transfer of the chip on the surface of the unloading platform 2.

[0055] Working principle of a chip frame punching device with a material suction mechanism:

[0056] After the chip is punched, the motor 32 starts running. Then, the worm gear 321 at the output end of the motor 32 drives the worm wheel 33 to rotate. As the worm wheel 33 rotates, its rotating arm 31 rotates 90 degrees, so that the upper surface of the receiving platform 311 can move to below the pressing part 131. As the suction pump 2 341 runs and suctions, after the suction pump 1 151 stops running, the chip suctioned below its suction head 16 can be suctioned by the receiving platform 311. Then the motor 32 rotates in the opposite direction, so that the rotating arm 31 can rotate in the opposite direction 90 degrees. During the 90-degree reverse rotation of the rotating arm 31, the gear 1 312 is driven by the gear ring 19. Then the receiving platform 311 rotates 180 degrees. After the rotating arm 31 stops rotating and the suction pump 2 341 stops suctioning, the chip suctioned by the receiving platform 311 can fall to the unloading platform 2 for unloading.

[0057] After the chip is punched and the upper die 13 moves upward, the rotating arm 31 rotates around the axis, and the rack 315 on the bottom surface of the receiving platform 311 drives the gear 181 to rotate. As the gear 181 rotates, the threaded rod 18 below rotates as well. After the threaded rod 18 rotates, the lower pressure bar 17 connected to it moves upward. Then the strip is wound up for feeding. After feeding is completed, the rotating arm 31 rotates in the opposite direction, so that the lower pressure bar 17 can press down again to punch and limit the strip.

[0058] When the receiving platform 311 is located between the upper mold 13 and the bottom mold 14, the flipping platform 21 is in a flipped and tilted state, which allows the chip above the flipping platform 21 to slide down to the unloading platform 2. Then, the chip slides down to the next processing area through the unloading platform 2. When the receiving platform 311 rotates towards the unloading platform 2 after receiving the chip, the push block 322 below the worm gear 33 pushes the push rod 4. After the push rod 4 moves, the rack 2 431 on the push rod 4 can drive the gear 52. Then, the gear 4 51 meshes and drives the gear 3 211 above. Then, the tilted flipping platform 21 can be in a horizontal state to facilitate receiving the chip falling from the receiving platform 311. Then, the chip can slide down as the flipping platform 21 flips.

[0059] After the rotating arm 31 moves from between the upper mold 13 and the bottom mold 14 towards the lower material platform 2, the piston rod 42 squeezes the internal space of the pressure tube 41. Then, the gas inside the pressure tube 41 can expand the expansion film 212 through the air pipe 3 411, so that the chip adsorbed by the receiving platform 311 can be buffered by the expansion film 212. At the same time, when the flipping platform 21 flips upward, as the gear 4 51 rotates, the eccentric block 511 on the surface of the gear 4 51 vibrates, which in turn allows the chip to slide from the flipping platform 21 towards the lower material platform 2 and accelerates the sliding transfer of the chip on the surface of the unloading platform 2.

[0060] It should be noted that the specific models and specifications of suction pump 151, motor 32 and suction pump 2 341 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated in detail.

[0061] The power supply and operating principle of suction pump 151, motor 32 and suction pump 341 are clear to those skilled in the art and will not be described in detail here.

[0062] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.

Claims

1. A chip frame punching device with a feeding mechanism, comprising a base (1), and a bottom die (14) and an upper die (13) on the base (1) for punching chips, characterized in that: A rotating arm (31) capable of rotating around a rotating frame (3) is provided in the area between the bottom mold (14) and the upper mold (13). One end of the rotating frame (3) is fixedly connected to the front of the punching table (12). A receiving platform (311) is coaxially connected to one end of the rotating arm (311) away from the rotating frame (3). Several suction holes (316) are provided on the upper surface of the receiving platform (311). The surface of the receiving platform (311) extends towards one end of the rotating arm (31). A rotating tube (313) extends outward. A gear (312) on the outer circumference of the rotating tube (313) meshes with a gear ring (19) fixed on the surface of the punching table (12). A lower pressure plate (141) is provided on the upper surface of the bottom mold (14) with longitudinal vertical displacement. At the same time, the guide posts at the four corners of the bottom surface of the lower pressure plate (141) are placed inside the bottom mold (14), and a spring (142) for rebound is sleeved on the outer circumference of the guide posts. The transverse area along the material strip of the lower pressure plate (141) is... A guide platform (143) is fixed in the field, and two racks (315) are fixed on the bottom surface of the receiving platform (311). The racks (315) drive the gear two (181) on the upper surface of the guide platform (143) after the rotating arm (31) rotates. At the same time, a rotatable threaded rod (18) extends from the bottom surface of the gear two (181) into the inside of the guide platform (143). The surface of the guide platform (143) is connected to the pressure bar (17) by a threaded drive. 17) A protrusion (172) extends from one side of the surface toward the threaded rod (18). At the same time, the threaded hole through the protrusion (172) forms a threaded connection with the threaded rod (18). The lifting blocks (173) at both ends of the lower pressure strip (17) are set on the same side as the protrusion (172). The lifting blocks (173) are placed inside the guide table (143) in a sliding manner. And the lower pressure blocks (171) for pressing the material strip are distributed at equal intervals from one end of the bottom surface of the lower pressure strip (17).

2. The chip frame punching device with a suction mechanism according to claim 1, characterized in that: The rotating arm (31) has a worm gear (33) fixed on its outer circumferential surface with the axis of rotation as the rotation point. At the same time, a worm (321) is meshed and connected to one side of the outer circumferential surface of the worm gear (33). The rotation of the worm (321) is driven by a motor (32) connected to one end. The motor (32) is fixed by a bracket fixedly connected to the base (1). The surface of the base (1) is also fixed with a second suction pump (341). The suction end of the second suction pump (341) is connected to the bottom surface of the rotating arm (31) through a second air pipe (34). A feeding platform (2) is provided in the area where the rotating arm (31) rotates and feeds materials. The feeding platform (2) is fixedly connected to the surface of the base (1).

3. The chip frame punching device with a suction mechanism according to claim 2, characterized in that: One end of the unloading platform (2) is hinged to a flipping platform (21) that can be flipped. A gear three (211) is fixed on one side of the flipping platform (21) at the hinge. A rotating shaft frame (213) is fixed on one side of the bottom surface of the unloading platform (2). An opening is made through one end of the rotating shaft frame (213) and is penetrated by a rotating shaft (5). A gear four (51) is fixed at one end of the rotating shaft (5) on the same side as the gear three (211). The gear four (51) and the gear three (211) form a meshing connection.

4. The chip frame punching device with a suction mechanism according to claim 3, characterized in that: Gear five (52) is fixed on both sides of the outer peripheral surface of the rotating shaft (5), and a rack two (431) for driving its rotation is also meshed above the gear five (52). A push plate (43) is fixed at the other end of the rack two (431).

5. The chip frame punching device with a suction mechanism according to claim 4, characterized in that: The push plate (43) is coaxially provided with a piston rod (42) that drives it to move together. At the same time, one end of the piston rod (42) is coaxially sleeved with a pressure tube (41), and a fixed connection is formed between the surface of the pressure tube (41) and the surface of the base (1).

6. The chip frame punching device with a suction mechanism according to claim 5, characterized in that: A push block (322) is fixed on the bottom surface of the worm gear (33) on the side away from the center, and the push block (322) and the piston rod (42) transmit power through the push rod (4).

Citation Information

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