AiP packaging structure based on cavity tube shell

Abstract

The invention provides an AiP packaging structure based on a cavity tube shell, which belongs to the technical field of electronic packaging and comprises a substrate with a plurality of metalized through holes, a chip bonded on the substrate, the cavity tube shell packaged on the chip and antenna radiation units integrated on the inner surface and the outer surface of the cavity tube shell. The cavity tube shell is provided with a packaging cavity for packaging the chip, and the periphery of the cavity tube shell is packaged on the substrate; the antenna radiation unit is connected with the chip through a metal line. The antenna radio frequency units are integrated on the inner surface and the outer surface of the cavity tube shell, double-layer surface-mounted packaging is formed, the transmission efficiency can be improved, and the requirement for high-frequency and high-speed transmission is met; the antenna radio frequency unit is directly integrated on the cavity tube shell, the cavity structure can reduce dielectric loss in signal transmission, and the high-frequency transmission performance of the antenna is improved; and moreover, the number of parts is reduced, the structure is simplified, the packaging size can be reduced, and the requirements of increasingly miniaturization and high integration level of the antenna can be met.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic packaging, and particularly relates to an AiP packaging structure based on a cavity tube shell. BACKGROUND

[0002] With the increasing development of miniaturization and high performance in the communication field, a more compact connection form and lower transmission loss are required between the transceiver module and the antenna, and the AIP (packaged antenna) integration mode shows more and more advantages. The AiP packaging (Antenna-in-Package) greatly reduces the loss of the connection between the antenna and the front-end integrated circuit, reduces the design difficulty and connection cost, greatly facilitates the development and process assembly process of the front-end system, reduces the packaging size, and meets the demand for miniaturization of equipment.

[0003] However, the existing AiP packaging is mostly a single-layer surface-mounted packaging structure, the antenna signal transmission efficiency of which is low, and the structure is complex, the size after packaging is large, and the demand for miniaturization of the antenna cannot be met, so the existing AiP packaging is limited in use performance and installation, and cannot meet the development of the communication field. SUMMARY

[0004] The embodiment of the application provides an AiP packaging structure based on a cavity tube shell, and aims to solve the problems of low signal transmission efficiency, complex structure and large size after packaging of the existing AiP packaging.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the application is as follows: an AiP packaging structure based on a cavity tube shell is provided, comprising: a substrate having a plurality of metalized through holes; a chip bonded on the substrate; a cavity tube shell having a packaging cavity for packaging the chip, the cavity tube shell being packaged on the substrate around; and an antenna radiation unit integrated on the inner surface and the outer surface of the cavity tube shell and connected with the chip through a metal line.

[0006] In an implementable manner, the antenna radiation unit comprises two groups of first antenna radiation sub-units surface-mounted on the outer surface of the cavity tube shell and two groups of second antenna radiation sub-units surface-mounted on the inner surface of the cavity tube shell; the first antenna radiation sub-units and the second antenna radiation sub-units are symmetrically arranged, and the first antenna radiation sub-units and the second antenna radiation sub-units are respectively connected with the chip through the metal line.

[0007] In an implementable manner, the first antenna radiation subunit and the second antenna radiation subunit each include two antenna radiation elements, the two antenna radiation elements in the same subunit are connected through a metal interconnection line, and the metal line is connected in the middle of the metal interconnection line, forming a T-shaped connection line.

[0008] In an implementable manner, the antenna radiation elements are in a rectangular shape, and the metal interconnection line is connected at the vertex of the two antenna radiation elements.

[0009] In an implementable manner, the metal interconnection line of the two antenna radiation elements in the same group is parallel to a side of the antenna radiation element, so that the metal line has the shortest wiring to the substrate.

[0010] In an implementable manner, the substrate is a direct copper clad ceramic substrate.

[0011] In an implementable manner, the metal line is connected to the substrate through a second conductive adhesive.

[0012] In an implementable manner, the chip is attached to the substrate through a conductive adhesive.

[0013] In an implementable manner, the cavity shell is an LCP material.

[0014] The cavity shell-based AiP packaging structure provided by the application has the beneficial effects that: the antenna radio frequency units are integrated on the inner and outer surfaces of the cavity shell, forming a double-layer surface-mounted package, that is, more antenna radio frequency units are integrated on the same component (i.e., the cavity shell), which can improve transmission efficiency and meet the demand for high-frequency and high-speed transmission compared with a single-layer surface-mounted packaging structure; the antenna radio frequency units are directly integrated on the cavity shell, and the cavity structure can reduce medium loss in signal transmission and improve the high-frequency transmission performance of the antenna; moreover, since multiple antenna radio frequency units are integrated on the same component, the number of parts is reduced, the structure is simplified, and the packaging size can be reduced, so the demand for small and high-integration of antennas can also be met. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A front view structural schematic diagram (internal cross-sectional view) of the cavity shell-based AiP packaging structure provided by the embodiment of the application is shown; Figure 2 A three-dimensional structural schematic diagram of the cavity shell integrated antenna radiation unit provided by the embodiment of the application is shown; MARKED FOR EXPLANATION: 1, substrate; 2, second conductive glue; 3, bonding wire; 4, chip; 5, first conductive glue; 6, antenna radiation element; 7, cavity shell; 8, metal line; 9, BGA solder ball; 10, metal interconnection line. DETAILED DESCRIPTION

[0016] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects clearer, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and not used to limit the present application.

[0017] Please refer to Figure 1 and Figure 2 , the AiP packaging structure based on the cavity shell provided by the present application will be described. The AiP packaging structure based on the cavity shell comprises a substrate 1 having a plurality of metalized through holes, a chip 4 bonded on the substrate 1, a cavity shell 7 packaged on the chip 4, and an antenna radiation unit integrated on the inner and outer surfaces of the cavity shell 7; the cavity shell 7 has a packaging cavity for packaging the chip 4, and the cavity shell 7 is packaged on the substrate 1 around; the antenna radiation unit is connected with the chip 4 through the metal line 8.

[0018] The AiP packaging structure based on the cavity shell 7 provided by the present application has the beneficial effects compared with the prior art, that is, the antenna radio frequency units are integrated on the inner and outer surfaces of the cavity shell 7, forming a double-layer surface-mounted package, that is, more antenna radio frequency units are integrated on the same component (i.e. the cavity shell 7), which can improve the transmission efficiency and meet the demand of high-frequency and high-speed transmission compared with the single-layer surface-mounted packaging structure; the antenna radio frequency units are directly integrated on the cavity shell 7, and the cavity structure can reduce the medium loss in signal transmission and improve the high-frequency transmission performance of the antenna; and since the plurality of antenna radio frequency units are integrated on the same component, the number of parts is reduced, the structure is simplified, and the packaging size can be reduced, so the demand of small size and high integration of the antenna can also be met.

[0019] For example, in the prior art, an AiP packaging structure based on a DPC substrate packaging shell integrated surface-mounted antenna and an AiP packaging structure of a multi-layer wiring LTCC shell integrated surface-mounted antenna, the antenna is surface-mounted on the upper surface of the shell; compared with the two prior arts, the antenna radiation unit is surface-mounted on the inner and outer surfaces of the cavity shell 7, and the cavity shell 7 has a packaging cavity for packaging the chip 4, directly serving as a cover plate of the packaging structure, and utilizing the cavity and the plurality of antenna radiation units to meet the demand of high-frequency and high-speed transmission; and the number of parts is small, the structure is simple, and it is beneficial to the miniaturization of the packaging structure.

[0020] The chip 4 is adhered to the substrate 1 by the first conductive adhesive 5 and connected to the circuit on the substrate 1 by the bonding wire 3. The chip 4 can be bonded to multiple functions. The cavity shell 7 has a packaging cavity for packaging the chip 4. The cavity shell 7 is fixed to the substrate 1 around the side surface and the chip 4 is packaged in the packaging cavity. The antenna radiation unit is interconnected with the chip 4 on the substrate 1 by the metal circuit 8 and the bonding wire 3, so as to transmit the signal on the chip 4. The substrate 1 is provided with a plurality of metalized through holes and a BGA solder ball 9 is arranged on the back surface of the substrate 1.

[0021] The AiP (Antenna in Package) is a technology for integrating the antenna and the chip 4 in the same package based on the packaging material and process. The AiP breaks the traditional way of installing the antenna and the radio frequency transceiver system on the PCB board, reduces the system space occupied by the antenna, and can significantly improve the integration of the system, so as to realize the goals of miniaturization, low profile and light weight of the system.

[0022] In some embodiments, referring to Figure 1 The antenna radiation unit includes two groups of first antenna radiation subunits arranged on the outer surface of the cavity shell 7 and two groups of second antenna radiation subunits arranged on the inner surface of the cavity shell 7. The first antenna radiation subunits and the second antenna radiation subunits are symmetrically arranged, and the first antenna radiation subunits and the second antenna radiation subunits are connected to the chip 4 by the metal circuit 8.

[0023] Through this design, the antenna radiation unit has good radiation performance. The symmetric arrangement of the first antenna radiation subunits and the second antenna radiation subunits makes the radiation of the antenna more uniform in all directions, which can effectively improve the omnidirectionality of the antenna. Moreover, the two groups of first antenna radiation subunits are arranged on the outer surface of the cavity shell 7 and the two groups of second antenna radiation subunits are arranged on the inner surface of the cavity shell 7. This combination of inner and outer surfaces makes full use of the space of the cavity shell 7 and realizes a more efficient antenna layout in a limited space. At the same time, the first antenna radiation subunits and the second antenna radiation subunits are connected to the chip 4 by the metal circuit 8, which ensures the stability and efficiency of signal transmission and reduces the loss in the signal transmission process, thereby improving the transmission performance of the entire antenna and better meeting various signal transmission requirements in actual applications.

[0024] In some embodiments, referring to Figure 2 The first antenna radiation subunit and the second antenna radiation subunit each include two antenna radiation elements 6. The two antenna radiation elements 6 in the same subunit are connected by a metal interconnection line 10, and the metal circuit 8 is connected to the middle of the metal interconnection line 10, forming a T-shaped connection circuit.

[0025] Each antenna radiation subunit of the application includes two antenna radiation elements 6, so four antenna radiation elements 6 can be integrated on one cavity tube shell 7. With the cavity and multiple antenna radiation units, the demand for high frequency and high speed transmission is met; the number of parts is small, the structure is simple, and the miniaturization of the packaging structure is beneficial.

[0026] This T-shaped connection line can effectively reduce the interference in the signal transmission process and improve the stability and efficiency of antenna radiation. On the one hand, the setting of the metal interconnection line 10 provides a stable path for signal transmission within the subunit, reducing the possibility of signal scattering and reflection, thereby ensuring the accuracy of antenna radiation. On the other hand, the metal line 8 is connected in the middle of the metal interconnection line 10 to form a T shape, so that the signal can be more evenly distributed in different directions, enhancing the coverage and strength of the antenna radiation. Through this connection method, the entire antenna system has been significantly optimized in terms of signal transmission and radiation performance, and can better meet the various needs in actual application scenarios.

[0027] In some embodiments, referring to Figure 2 , the antenna radiation element 6 is rectangular in shape, and the metal interconnection line 10 is connected to the top of the two antenna radiation elements 6. This connection structure can effectively improve the radiation performance of the antenna and enhance the transmission and reception capability of the signal. By connecting the metal interconnection line 10 to the top of the two rectangular antenna radiation elements 6, it helps to optimize the current distribution of the antenna and reduce the loss in the signal transmission process.

[0028] In some embodiments, referring to Figure 2 , the metal interconnection line 10 of the two antenna radiation elements 6 in the same group is parallel to one side of the antenna radiation element 6, so that the metal line 8 has the shortest wiring to the substrate 1.

[0029] The metal line 8 has the shortest wiring to the substrate 1, which can significantly reduce the line loss in the signal transmission process and improve the efficiency and stability of signal transmission. At the same time, since the wiring is the shortest, the possibility of signal reflection and interference can be reduced, further ensuring the reliability of the operation of the antenna radiation element 6.

[0030] In some embodiments, referring to Figure 1 , the substrate 1 is a DPC direct plated copper ceramic substrate 1. DPC (Direct Plated Copper Substrate) is a ceramic-based metallization technology that deposits copper lines directly on the surface of ceramics (such as Al2O3, AlN) through thin film technology, forming high-precision circuits, mainly used for high-power, high-heat dissipation, high-frequency electronic packaging, such as LEDs, power modules, RF devices, etc.

[0031] The DPC (Direct Copper Plated) ceramic substrate 1 offers numerous advantages. First, it possesses excellent thermal conductivity, efficiently dissipating heat and effectively preventing performance degradation or even damage due to overheating. Second, its high-precision circuit manufacturing process enables more precise circuit layout, meeting the stringent signal transmission stability requirements of high-frequency electronic packaging.

[0032] For example, in the new generation of 5G communication equipment, the performance requirements for radio frequency devices are extremely high. The DPC direct copper-plated ceramic substrate 1, with its excellent properties, can provide a strong guarantee for achieving high-speed and stable signal transmission. At the same time, in the manufacture of high-end power modules, it can also effectively improve power conversion efficiency, reduce energy consumption, and promote the development of related industries in a more efficient and energy-saving direction. Please continue to write the beneficial effects: In some embodiments, see Figure 1 Metal trace 8 is connected to substrate 1 via second conductive adhesive 2. Second conductive adhesive 2 is anisotropic conductive adhesive / paste (ACA / ACP), also known as second conductive adhesive 2. This is a specialized conductive adhesive specifically designed for electronic component packaging. Its core function is to achieve vertical conductivity and parallel insulation, while also providing bonding and fixing. It is primarily used in precision electronic packaging applications such as COG, TCP / COF, COB, and FPC.

[0033] The vertical conductive property of the second conductive adhesive 2 ensures a reliable electrical connection between the metal line 8 and the substrate 1, which can effectively reduce resistance and energy loss during signal transmission, thereby improving the signal transmission stability and speed of the electronic device.

[0034] In some embodiments, see Figure 1 , the chip 4 is mounted on the substrate 1 through conductive adhesive.

[0035] This mounting method has many beneficial effects. First, the conductive adhesive provides a good electrical connection, ensuring efficient and stable transmission of electrical signals between chip 4 and substrate 1, reducing losses and interference during signal transmission, thereby improving the performance of the entire circuit system. Second, the conductive adhesive provides a certain degree of cushioning and shock absorption, forming a flexible connection between chip 4 and substrate 1, effectively reducing damage to chip 4 caused by mechanical vibration or impact, and enhancing the stability and reliability of chip 4.

[0036] In some embodiments, the cavity shell 7 is made of LCP material. LCP (short for Liquid Crystal Polymer) is a high molecular material composed of rigid molecular chains, whose molecules exhibit liquid crystal state under certain conditions, combining the flowability of liquid and the anisotropy of crystal. It has characteristics such as high strength, high heat resistance, low dielectric loss, etc., and is widely used in electronic appliances, 5G communication, aerospace, etc.

[0037] Using LCP material as the cavity shell 7 has many beneficial effects. Its high strength characteristics enable the shell to withstand greater external force impact without being easily damaged, effectively protecting the internal components from external physical damage, ensuring the stability and reliability of the product in various complex environments. The high heat resistance allows the shell to maintain good performance in high temperature environments, without deformation or performance degradation due to temperature rise, providing a stable working environment for internal electronic components, especially suitable for some temperature-sensitive electronic devices. The low dielectric loss characteristic greatly reduces the energy loss during signal transmission, helping to improve the efficiency and quality of signal transmission, and performs well in high-speed signal transmission fields such as 5G communication, ensuring fast and accurate data transmission and improving the performance of the entire system. These beneficial effects enable products based on LCP material cavity shell 7 to exhibit outstanding performance advantages in electronic appliances, 5G communication, aerospace, etc., meeting the strict requirements of high-end application scenarios for high-performance and high-stability materials.

[0038] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An AiP packaging structure based on a cavity tube shell, characterized in that: include: A substrate (1) having a plurality of metallized through holes; A chip (4) bonded to the substrate (1); A cavity tube shell (7) has a packaging cavity for packaging the chip (4), and the four sides of the cavity tube shell (7) are packaged on the substrate (1); as well as The antenna radiation unit is integrated on the inner surface and the outer surface of the cavity tube shell (7), and is connected to the chip (4) via a metal line (8).

2. The AiP packaging structure based on a cavity shell and tube according to claim 1, characterized in that: The antenna radiation unit comprises two groups of first antenna radiation sub-units attached to the outer surface of the cavity tube shell (7), and two groups of second antenna radiation sub-units attached to the inner surface of the cavity tube shell (7); The first antenna radiation subunit and the second antenna radiation subunit are arranged symmetrically, and the first antenna radiation subunit and the second antenna radiation subunit are respectively connected to the chip (4) through the metal line (8).

3. The AiP packaging structure based on a cavity shell and tube according to claim 2, characterized in that: The first antenna radiation subunit and the second antenna radiation subunit respectively include two antenna radiation elements (6); the two antenna radiation elements (6) in the same subunit are connected via a metal interconnection line (10); the metal line (8) is connected in the middle of the metal interconnection line (10) to form a T-shaped connection line.

4. The AiP packaging structure based on a cavity shell and tube according to claim 3, characterized in that: The antenna radiation element (6) is rectangular in shape, and the metal interconnection line (10) is connected at the vertices of two antenna radiation elements (6).

5. The AiP packaging structure based on a cavity shell and tube according to claim 4, characterized in that: The metal interconnection lines (10) of the two antenna radiating elements (6) in the same group are parallel to one side of the antenna radiating element (6) so as to make the routing from the metal line (8) to the substrate (1) as short as possible.

6. The AiP packaging structure based on a cavity shell and tube according to claim 1, characterized in that: The substrate (1) is a directly copper-plated ceramic substrate (1).

7. The AiP packaging structure based on a cavity shell and tube according to claim 1, characterized in that: The metal circuit (8) is connected to the substrate (1) via a second conductive adhesive (2).

8. The AiP packaging structure based on a cavity shell and tube according to claim 1, characterized in that: The chip (4) is mounted on the substrate (1) via conductive adhesive.

9. The AiP packaging structure based on a cavity shell and tube according to claim 1, characterized in that: The cavity tube shell (7) is made of LCP material.

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