Automobile wheel speed sensor framework and machining method

Abstract

The invention discloses an automobile wheel speed sensor framework and a processing method, the automobile wheel speed sensor framework comprises a shell, a mounting cavity is formed in the shell, the mounting cavity comprises a U-shaped wire cavity, a wire harness mounting cavity and a chip mounting cavity, the U-shaped wire cavity, the wire harness mounting cavity and the chip mounting cavity are communicated in sequence, a positioning clamping block is arranged in the chip mounting cavity, and the U-shaped wire cavity, the wire harness mounting cavity and the chip mounting cavity are communicated in sequence. The positioning block is fixed to the shell, a fixing gap is formed between the positioning block and the shell, positioning cones are arranged in the wire harness installation cavity, the positioning cones and the shell are integrally formed, the positioning cones are located on the two sides of the wire harness installation cavity respectively, a first isolation block is arranged on the wire harness installation groove, and a second isolation block is arranged on the first isolation block. The first isolation block is located at the end, close to the chip installation cavity, of the wire harness installation cavity. The invention has the following advantage and effect: later installation and clamping are carried out by utilizing the injection molding column left by injection molding.

Description

Technical Field

[0001] The present invention relates to the field of automobile sensors, and more particularly to an automobile wheel speed sensor skeleton and a processing method thereof. Background Art

[0002] A wheel speed sensor, also known as a wheel rotational speed sensor, is a device used to measure the rotational speed of a vehicle's tires. It is widely used in vehicles such as automobiles and motorcycles to monitor the vehicle's motion and safety performance. Wheel speed information is essential for modern vehicles, playing a vital role in vehicle dynamic control systems, electronic stability programs, anti-lock braking systems, and automatic transmission control systems. Therefore, the wheel speed sensor is one of the most critical sensors in modern vehicles.

[0003] Existing automotive sensor assemblies usually include a plug and a sensing head, which are connected by a cable. The sensing head consists of a bushing, a Hall element that generates a signal source, and a Hall bracket. The Hall bracket is fixed to the bushing and serves to fix and install the Hall element. When installing the Hall element, the Hall bracket requires adhesive to fix it and the Hall element wires need to be separated, which makes it complicated to install. In addition, since the Hall bracket is relatively thin, it is difficult to remove and easily damaged during production, resulting in a low yield. Therefore, a simple production process and easy operation of an automotive wheel speed sensor skeleton and processing method are needed. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the present invention aims to provide a vehicle wheel speed sensor frame and a processing method that can be easily disassembled and installed by utilizing the injection molding columns left over from the mold.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a vehicle wheel speed sensor skeleton and processing method, including a shell, characterized in that: an installation cavity is formed in the shell, the installation cavity includes a U-shaped wire cavity, a wire harness installation cavity and a chip installation cavity, the U-shaped wire cavity, the wire harness installation cavity and the chip installation cavity are connected in sequence, a positioning block is provided in the chip installation cavity, the positioning block is fixed to the shell and a fixed gap is formed between the housing, a positioning cone is provided in the wire harness installation cavity, the positioning cone is integrally formed with the shell, and the positioning cone is respectively located on both sides of the wire harness installation cavity, a first isolation block is provided on the wire harness installation groove, and the first isolation block is located at one end of the wire harness installation cavity close to the chip installation cavity.

[0006] The present invention is further configured as follows: a side of the shell away from the chip mounting cavity is a guide portion and the guide portion is bent, one of the positioning cones is located at the connection between the guide portion and the shell, and the guide portion is detachably fixed to the shell.

[0007] The present invention is further configured such that: the wiring harness installation cavity is provided with a locking groove.

[0008] The present invention is further configured as follows: a first locking block is provided on the housing, two first locking blocks are provided and are located on both sides of the wiring harness installation cavity, and a first inclined surface is formed on the first locking block.

[0009] The present invention is further configured as follows: it includes a mold, the mold includes an upper mold and a lower mold, the upper mold forms an upper cavity, the lower mold forms a lower cavity, the upper mold is also provided with an injection hole connected to the upper mold, the injection holes are provided with two, and the upper mold is also formed with a card slot that cooperates with the positioning card block.

[0010] The present invention is further configured as follows: a fourth locking block is provided on the lower die, and a second locking block cooperating therewith is also provided on the upper die; when the upper die and the lower die are fixed, the first locking block and the second locking block are tightly pressed against each other.

[0011] The present invention is further configured as follows: an injection tube communicating with the injection hole is provided on the upper mold; and a second injection port corresponding to the first isolation block and the second isolation block is provided on the upper mold.

[0012] The present invention is further configured as follows: a guide groove is recessed on the lower mold, a guide protrusion cooperating with the guide groove is protruded on the upper mold, and a first injection molding gap is formed between the guide groove and the guide protrusion.

[0013] The present invention is further configured as follows: the lower mold is recessed with two first positioning grooves, the lower mold is also provided with a second positioning groove, and the upper mold is provided with a third positioning groove that cooperates therewith. When the upper mold and the lower mold are fixed, a positioning gap is formed between the second positioning groove and the third positioning groove.

[0014] The present invention is further configured as follows: S1, merging and fixing the upper and lower molds, and performing injection molding from four holes simultaneously; S2. After the injection molding is completed, the upper mold is removed, and the housing is taken out by relying on the first locking block; S3, performing pre-processing on the shell, processing the first isolation block and the second isolation block respectively, and then processing the first separation block to complete the processing of the shell; S4, clamp the Hall element to the first partition block, and use the first partition block to The wires of the components are separated, and the reserved positioning cone near the second isolation block is interference fit for the wires.

[0015] S5. Insert the housing into the bushing, and the first locking block on the housing and the bushing cooperate with each other to fix.

[0016] By adopting the above technical solution, the material column left by the mold after injection molding is used to be installed on the sensor, which is convenient and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional diagram of the skeleton of the automobile wheel speed sensor according to an embodiment of the present invention; Figure 2 is a cross-sectional view of a mold according to an embodiment of the present invention; Figure 3 The frame of the automobile wheel speed sensor according to the embodiment of the present invention is a three-dimensional Figure 2 ; Figure 4 A three-dimensional diagram of a product according to an embodiment of the present invention; Figure 5 This is an enlarged view of part A. In the figure: 1. Housing; 12. U-shaped wire cavity; 13. Wiring harness mounting cavity; 14. Chip mounting cavity; 2. Positioning block; 22. Positioning cone; 23. First isolation block; 24. Guide portion; 25. First locking block; 3. Upper mold; 31. Lower mold; 33. Injection hole; 35. Second locking block; 36. Second injection port; 5. Injection tube; 6. Guide groove; 9. Vehicle wheel speed sensor. DETAILED DESCRIPTION

[0018] Reference Figures 1 to 5 The embodiments of the present invention are further described.

[0019] A vehicle wheel speed sensor skeleton and processing method include a mold, the mold including an upper mold 3 and a lower mold 31, the upper mold 3 forming an upper cavity, the lower mold 31 forming a lower cavity, the upper mold 3 is further provided with an injection hole 33 connected to the upper mold 3, two injection holes 33 are provided, and the upper mold 3 is further formed with a slot that cooperates with a positioning block 2.

[0020] The lower die 31 is provided with a fourth locking block, and the upper die 3 is also provided with a second locking block 35 matched therewith. When the upper die 3 and the lower die 31 are fixed, the fourth locking block and the second locking block 35 are tightly pressed against each other.

[0021] The upper mold 3 is provided with an injection tube 5 connected to the injection hole 33 , and the upper mold 3 is provided with a second injection port 36 corresponding to the first isolation block 23 and the second isolation block.

[0022] The lower mold 31 has a recessed guide groove 6 , and the upper mold 3 has a protruding guide protrusion that matches the guide groove 6 . A first injection molding gap is formed between the guide groove 6 and the guide protrusion.

[0023] There are two first positioning grooves recessed on the lower mold 31, and a second positioning groove is also provided on the lower mold 31. The upper mold 3 is provided with a third positioning groove that cooperates with the second positioning groove. When the upper mold 3 and the lower mold 31 are fixed, a positioning gap is formed between the second positioning groove and the third positioning groove.

[0024] It includes a shell 1, in which an installation cavity is formed, and the installation cavity includes a U-shaped wire cavity 12, a wire harness installation cavity 13 and a chip installation cavity 14. The U-shaped wire cavity 12, the wire harness installation cavity 13 and the chip installation cavity 14 are connected in sequence. A positioning card block 2 is provided in the chip installation cavity 14, and the positioning card block 2 is fixed to the shell 1 and a fixed gap is formed between the shell 1. A positioning cone 22 is provided in the wire harness installation cavity 13, and the positioning cone 22 is integrally formed with the shell 1, and the positioning cone 22 is respectively located on both sides of the wire harness installation cavity 13, and a first isolation block 23 is provided on the wire harness installation groove, and the first isolation block 23 is located at one end of the wire harness installation cavity 13 close to the chip installation cavity 14.

[0025] The side of the housing 1 away from the chip mounting cavity 14 is a guide portion 24 and the guide portion 24 is bent. One of the positioning cones 22 is located at the connection between the guide portion 24 and the housing 1 , and the guide portion 24 is detachably fixed to the housing 1 .

[0026] The wiring harness installation cavity 13 is provided with a locking groove.

[0027] The housing 1 is provided with a first locking block 25 . Two first locking blocks 25 are provided and are located on both sides of the wiring harness installation cavity 13 . A first inclined surface is formed on the first locking block 25 .

[0028] S1, merge and fix the upper mold 3 and the lower mold 31, and perform injection molding from four holes simultaneously; S2. After the injection molding is completed, the upper mold 3 is removed, and the housing 1 is taken out by relying on the first locking block 25; S3, pre-processing the shell 1, processing the first isolation block 23 and the second isolation block respectively, and then processing the first separation block to complete the processing of the shell 1; S4, clamp the Hall element to the first partition block, and use the first partition block to The wires of the components are separated, and the reserved positioning cone 22 near the second isolation block performs interference fit on the wires.

[0029] S5. Insert the housing 1 into the bushing. The first locking block 25 on the housing 1 and the bushing are fixed together.

[0030] This specific embodiment is merely an explanation of the present invention and is not intended to limit the present invention. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed. However, as long as such modifications are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A vehicle wheel speed sensor frame and processing method, including a housing, characterized by: An installation cavity is formed in the shell, and the installation cavity includes a U-shaped wire cavity, a wire harness installation cavity and a chip installation cavity. The U-shaped wire cavity, the wire harness installation cavity and the chip installation cavity are connected in sequence. A positioning card block is provided in the chip installation cavity, and the positioning card block is fixed to the shell and a fixed gap is formed between the shell and the chip installation cavity. A positioning cone is provided in the wire harness installation cavity, and the positioning cone is integrally formed with the shell, and the positioning cone is respectively located on both sides of the wire harness installation cavity. A first isolation block is provided on the wire harness installation groove, and the first isolation block is located at one end of the wire harness installation cavity close to the chip installation cavity.

2. The automotive wheel speed sensor frame and processing method according to claim 1, characterized in that: A side of the shell away from the chip mounting cavity is a guide portion, and the guide portion is bent, one of the positioning cones is located at the connection between the guide portion and the shell, and the guide portion is detachably fixed to the shell.

3. The automotive wheel speed sensor frame and processing method according to claim 2, characterized in that: The wiring harness installation cavity is provided with a locking groove.

4. The automotive wheel speed sensor frame and processing method according to claim 3, characterized in that: The housing is provided with a first locking block, two of which are provided and located on both sides of the wiring harness installation cavity, and a first inclined surface is formed on the first locking block.

5. The automotive wheel speed sensor frame and processing method according to claim 4, characterized in that: The mold includes an upper mold and a lower mold. The upper mold forms an upper cavity, the lower mold forms a lower cavity, the upper mold is also provided with an injection hole connected to the upper mold, two injection holes are provided, and the upper mold is also formed with a slot that cooperates with a positioning block.

6. The automobile wheel speed sensor frame and processing method according to claim 5, characterized in that The lower die is provided with a fourth locking block, and the upper die is also provided with a second locking block matched therewith. When the upper die and the lower die are fixed, the fourth locking block and the second locking block are tightly pressed against each other.

7. The automotive wheel speed sensor frame and processing method according to claim 6, characterized in that: The upper mold is provided with an injection tube connected with the injection hole, and the upper mold is provided with a second injection port corresponding to the first isolation block and the second isolation block.

8. The automotive wheel speed sensor frame and processing method according to claim 7, characterized in that: The lower mold is recessed with a guide groove, and the upper mold is protruded with a guide protrusion matched with the guide groove, and a first injection molding gap is formed between the guide groove and the guide protrusion.

9. The automotive wheel speed sensor frame and processing method according to claim 8, characterized in that: The lower mold is recessed with two first positioning grooves, the lower mold is also provided with a second positioning groove, and the upper mold is provided with a third positioning groove that cooperates with the second positioning groove. When the upper mold and the lower mold are fixed, a positioning gap is formed between the second positioning groove and the third positioning groove.

10. The automotive wheel speed sensor skeleton mold according to any one of claims 1 to 9, characterized in that: S1, merge and fix the upper mold and lower mold, and perform injection molding from four holes simultaneously; S2. After the injection molding is completed, the upper mold is removed, and the housing is taken out by relying on the first locking block; S3, performing pre-processing on the shell, processing the first isolation block and the second isolation block respectively, and then processing the first separation block to complete the processing of the shell; S4, clamp the Hall element to the first partition block, and use the first partition block to The wires of the components are separated, and the reserved positioning cone near the second isolation block is interference fit for the wires. 11.S5. Insert the housing into the bushing. The first locking block on the housing and the bushing fit together to secure them.

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