An electronic component conductivity detection device and method

Abstract

The application discloses a kind of electronic components and devices electrically conductive performance detection device and detection method, it is related to electrically conductive detection field, including test workbench and six-axis robot, test workbench is provided with detection station, and the both ends of detection station are respectively arranged with six-axis robot and electrically conductive detection mechanism, electrically conductive detection mechanism includes first electrically conductive block and second electrically conductive block sequentially arranged away from detection station, first electrically conductive block and second electrically conductive block staggered arrangement along horizontal direction, the height of second electrically conductive block is higher than the height of first electrically conductive block, by pin mechanism to the pin of component and device is cut, for making electronic components and devices form two different lengths of pin, two different lengths of pin respectively contact first electrically conductive block and second electrically conductive block and carry out electrically conductive detection, completely avoid the short circuit condition of single pin simultaneously touching positive and negative electrode electrically conductive block. Significantly improve the reliability of electrically conductive performance detection result, provide accurate basis for component and device good product determination.

Description

Technical Field

[0001] This invention relates to the field of conductivity testing technology, specifically to a device and method for testing the conductivity performance of electronic components. Background Technology

[0002] With the rapid development of consumer electronics, industrial control, and new energy, the application scale of electronic components (such as diodes, capacitors, and other pin-type components) continues to expand. After production, electronic components require conductivity testing to determine their quality. The industry's current testing needs have shifted from "single pass / fail judgment" to "large-scale, high-precision, and automated" testing. Traditional testing technologies are increasingly revealing their shortcomings and are ill-suited to modern production pace. Traditional conductivity testing of electronic components often employs a "manual loading-manual alignment-single test" model, which is not only inefficient but also prone to errors due to worker fatigue from prolonged operation. While the industry is gradually shifting from traditional manual testing to automated testing to improve efficiency and accuracy, two major pain points remain in automated testing, severely restricting quality control effectiveness and production continuity. On the one hand, in the automated component conveying process, pins are prone to bending, folding, or even breakage. This is mainly because existing automated conveying systems rely on conveyor belts or robotic arms for transport. The vibration of the conveyor belt during operation, the rigid contact of the robotic arm during clamping, and the fit gap between the mold and the conveying mechanism in the conveying path can all lead to uneven stress on the pins. This results in quality problems with exposed pins during the conveying or loading process. Damaged components not only need to be manually screened and removed, but may also cause subsequent components to jam due to residual pin debris contaminating the conveying track, thus interrupting the testing process. On the other hand, most components have the same pin length when they leave the factory (the deviation is usually less than 0.1mm). This can easily cause electrical interference problems in automated conductivity testing. The main reason is that the positive and negative conductive blocks of existing conductivity testing mechanisms are mostly arranged in parallel. If the pin lengths of the components are the same, the pin positions are likely to overlap when they contact the conductive blocks. This can cause one pin to touch both the positive and negative conductive blocks at the same time, forming a short circuit and affecting the test results. Furthermore, bent or folded pins cannot accurately correspond to the positive and negative conductive blocks, thus affecting the accuracy of the test results. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a device and method for testing the conductivity of electronic components, thereby addressing the deficiencies of the prior art.

[0004] The objective of this invention is achieved through the following technical solution: a conductivity testing device for electronic components, comprising a testing workbench, a testing loading mold, and a six-axis robotic arm. The testing workbench has a testing station, and a six-axis robotic arm and a conductivity testing mechanism are respectively arranged at both ends of the testing station. The conductivity testing mechanism includes a first conductive block and a second conductive block arranged sequentially away from the testing station. The first and second conductive blocks are staggered horizontally, with the height of the second conductive block being higher than that of the first conductive block. A mold slot is formed on one side of the testing station on the top surface of the testing workbench, and the testing loading mold slides into the mold slot. The test loading mold includes a cutting mold and an anti-bending mold fixedly connected on the left and right sides. The thickness of the anti-bending mold is greater than that of the cutting mold. The top of the cutting mold has several shallow guide holes extending along its own length. The top of the anti-bending mold also has several guide holes extending along its own length. Each of the guide holes corresponds to one of the shallow guide holes. A lead-cutting mechanism is provided in the mold's strip groove. One pin of the electronic component is completely accommodated in the guide hole, while the other pin extends from the bottom of the shallow guide hole. The lead-cutting mechanism cuts the pin extending from the shallow guide hole, so that the two pins of the electronic component with different lengths can contact the first conductive block and the second conductive block respectively for conductivity detection.

[0005] Furthermore, a foot presser mechanism is provided above the test workbench. The foot presser mechanism includes a bracket, a foot presser cylinder, and a pressure plate. The bracket is installed on the test workbench, and the foot presser cylinder is vertically installed on the bracket. The telescopic shaft of the foot presser cylinder is connected to the pressure plate. Two sets of foot presser assemblies are provided at the bottom of the pressure plate. The foot presser assembly includes a telescopic shaft and an insulating pressure plate. The two ends of the telescopic shaft are respectively connected to the pressure plate and the insulating pressure plate. A spring is sleeved on the telescopic shaft.

[0006] Furthermore, guide sliders are fixed on both the side of the cutting mold away from the anti-bending mold and the side of the anti-bending mold away from the cutting mold. Guide grooves are provided on both sides of the mold strip groove. The two guide sliders are respectively slidably adapted in the two guide grooves to suspend the test feeding mold in the mold strip groove.

[0007] Furthermore, the bottom of the cutting mold is concentrically provided with an annular groove at the shallow guide hole, and a cutting spring is provided in the annular groove. One end of the cutting spring is connected to a sliding tube, which slides to fit the annular groove. When the cutting spring is in its normal state, the bottom of the sliding tube is flush with the bottom of the anti-bending mold.

[0008] Furthermore, the cutting mechanism includes a slide block, a finger-cutting cylinder, and a push rod. The slide block has a degree of freedom to move along the length of the mold groove. A mounting plate is slidably mounted on the top of the slide block, and the mounting plate has a degree of freedom to move along the width of the mold groove. The finger-cutting cylinder is mounted on the mounting plate, and the grippers of the finger-cutting cylinder are positioned close to the cutting mold. A blade and a cutting plate are respectively fixed to the inner sides of the two grippers of the finger-cutting cylinder. The push rod is vertically mounted on the top of the slide block and has a degree of freedom to move along the height of the test workbench. A top plate is fixed to the bottom of the sliding tube near the anti-bending mold, and the top plate is located on the movement path of the push rod.

[0009] Furthermore, a first linear drive module is provided in the mold strip groove, the first linear drive module is installed on the test workbench, the slide is installed on the test workbench, a push cylinder is installed on the slide, and the telescopic shaft of the push cylinder is connected to the mounting plate.

[0010] Furthermore, the slide block has an inner cavity, and the end of the push rod away from the sliding tube extends into the inner cavity. A push rod is installed in the inner cavity. A strip groove communicating with the inner cavity is opened on the top of the slide block. The strip groove extends in the width direction of the mold strip groove. A connecting rod is fixed at the bottom of the mounting plate. The connecting rod passes through the strip groove and connects to the push rod. An inclined surface is provided on the side of the push rod near the push rod. The inclined surface is located on the moving path of the push rod. A spring plate is fixedly sleeved on the push rod. A push rod spring is sleeved on the push rod. The two ends of the push rod spring are respectively connected to the spring plate and the slide block.

[0011] Furthermore, the mold strip groove is opened through the mold in a direction parallel to the testing station. The testing workbench is provided with a continuous feeding mechanism at one end of the mold strip groove. The continuous feeding mechanism includes a feeding track and a pusher plate. The feeding track has a U-shaped cross-section. One end of the feeding track is fixedly connected to the testing workbench. The pusher plate is slidably disposed in the feeding track. The pusher plate is used to push the test feeding mold on the feeding track into the mold strip groove. A positioning mechanism is provided at the end of the mold strip groove away from the feeding track. The positioning mechanism includes a positioning frame, a positioning cylinder, and a positioning plate. The positioning frame is fixed to the top surface of the testing workbench. The positioning cylinder is vertically mounted on the positioning frame. The telescopic shaft of the positioning cylinder is connected to the positioning plate.

[0012] Furthermore, the top surface of the test loading mold is provided with several positioning grooves, each positioning groove is provided with a shallow guide hole and a guide hole, the test loading mold is provided with a negative pressure cavity, the negative pressure cavity is located between the shallow guide hole and the guide hole, the test loading mold is provided with multiple negative pressure holes in the positioning grooves, and the negative pressure holes are connected to the negative pressure cavity.

[0013] A method for testing the conductivity of electronic components, utilizing the conductivity testing device for electronic components as described above, includes the following steps:

[0014] S1. Place the electronic components to be tested sequentially on the test loading mold, so that the two pins of the electronic components are inserted into the shallow guide hole and the guide hole respectively;

[0015] S2. Load the test loading mold into the mold strip groove so that the test loading mold is within the working range of the shearing mechanism and the six-axis robot arm;

[0016] S3. The pins extending from the shallow guide hole are cut by the pin-cutting mechanism so that the electronic component forms two pins of different lengths;

[0017] S4. The head of the electronic component is clamped by a six-axis robotic arm and fed to the testing station, so that the two pins of the electronic component contact the first conductive block and the second conductive block respectively for conductivity testing.

[0018] The beneficial effects of this invention are:

[0019] 1. The component to be tested is placed on the test loading mold. The shallow guide hole and the guide hole respectively accommodate the two pins of the component, which protects the pins during the component transportation process and avoids quality problems such as bending, folding, and breaking of the pins. This not only reduces waste of defective products, but also avoids jamming caused by pin debris contaminating the track, ensuring the continuity of the testing process. The shallow guide hole not only protects the test section of the pin, but also facilitates the cutting mechanism to cut off the protruding part, so that the component has two pins of different lengths, which facilitates subsequent conductivity testing.

[0020] 2. To address the issue of short circuits caused by identical pin lengths in electronic components, the device employs a collaborative design of "differentiated cutting + staggered conductive blocks" to provide an effective solution: the pin-cutting mechanism precisely cuts pins extending from shallow guide holes, resulting in two pins of different lengths for the electronic component; simultaneously, the first and second conductive blocks of the conductivity detection mechanism are staggered horizontally at different heights, perfectly matching the cut, differentiated pins. This ensures that one pin contacts one conductive block, and that the contact conductivity heights of the two pins are different, completely preventing short circuits caused by a single pin simultaneously touching both positive and negative conductive blocks. This significantly improves the reliability of conductivity performance test results, providing a precise basis for determining the quality of components. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a conductivity testing device for electronic components according to the present invention.

[0022] Figure 2This is a schematic diagram of the structure of the test loading mold in the conductivity testing device for electronic components according to the present invention;

[0023] Figure 3 This is a top view of the test bench in the conductivity testing device for electronic components according to the present invention.

[0024] Figure 4 for Figure 3 Sectional view along line AA;

[0025] Figure 5 for Figure 4 Enlarged view at point B in the middle;

[0026] Figure 6 This is a schematic diagram of the structure of the finger-cutting cylinder in the conductivity performance testing device for electronic components of the present invention.

[0027] Figure 7 This is a partial structural diagram of a conductivity testing device for electronic components according to the present invention. Figure 1 ;

[0028] Figure 8 This is a partial structural diagram of a conductivity testing device for electronic components according to the present invention. Figure 2 ;

[0029] Figure 9 This is a schematic diagram of the limiting base in the conductivity testing device for electronic components according to the present invention.

[0030] Figure 10 This is a partial structural diagram of a conductivity testing device for electronic components according to the present invention. Figure 3 ;

[0031] Figure 11 This is a schematic diagram of the cooperation between the test feeding mold and the negative pressure switching pipe in this invention;

[0032] Figure 12 for Figure 11 Enlarged view at point C;

[0033] In the diagram, 1-Test workbench, 2-Test feeding mold, 3-Six-axis robotic arm, 4-First conductive block, 5-Second conductive block, 6-Mold strip groove, 7-Cut mold, 8-Anti-bending mold, 9-Shallow guide hole, 10-Guide hole, 11-Bracket, 12-Pressure foot cylinder, 13-Pressure plate, 14-Telescopic shaft, 15-Insulating pressure plate, 16-Spring, 17-Guide slider, 18-Guide groove, 19-Annular groove, 20-Cut spring, 21-Sliding tube, 22-Slide seat, 23-Cut finger Cylinder, 24-Push rod, 25-Mounting plate, 26-Blade, 27-Blade plate, 28-Top plate, 29-First linear drive module, 30-Push cylinder, 31-Inner cavity, 32-Strip groove, 33-Push rod, 34-Connecting rod, 35-Inclined surface, 36-Spring disc, 37-Push rod spring, 38-Feeding track, 39-Push plate, 40-Positioning frame, 41-Positioning cylinder, 42-Positioning plate, 43-Positioning groove, 44-Negative pressure chamber, 45-Negative pressure hole, 46-Second linear drive module, 47- U-shaped connecting rod, 48-limiting base, 49-downward guide plate, 50-downward limiting plate, 51-moving vertical rod, 52-limiting drive cavity, 53-double-direction threaded screw, 54-screw nut, 55-guide column, 56-rectangular groove, 57-guide spring, 58-guide strip groove, 59-inclined guide groove, 60-bearing, 61-switching base, 62-sliding vertical plate, 63-negative pressure switching pipe, 64-switching cylinder, 65-driven gear, 66-switching motor, 67-drive gear, 68-air inlet, 69-through hole, 70-negative pressure docking hole, 71-switching hole. Detailed Implementation

[0034] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0035] Example 1

[0036] like Figures 1 to 12As shown, a conductivity testing device for electronic components includes a test workbench 1, a test loading mold 2, and a six-axis robotic arm 3. The test workbench 1 has a testing station, with the six-axis robotic arm and a conductivity testing mechanism respectively arranged at both ends of the testing station. The conductivity testing mechanism includes a first conductive block 4 and a second conductive block 5 arranged sequentially away from the testing station. The first conductive block 4 and the second conductive block 5 are connected to a test circuit. The test circuit includes a power supply and a current monitor. The first conductive block 4 and the second conductive block 5 are connected to the positive and negative terminals of the power supply respectively via wires, and the current monitor is connected to the test circuit to measure the current in the circuit. The first conductive block 4 and the second conductive block 5 are arranged alternately in a horizontal direction, with the height of the second conductive block 5 being higher than that of the first conductive block 5. The height of the conductive block 4 is such that a mold strip groove 6 is provided on one side of the test station on the top surface of the test workbench 1. The test loading mold 2 slides and adapts to the mold strip groove 6. The test loading mold 2 includes a cutting mold 7 and an anti-bending mold 8 fixedly connected on the left and right. The thickness of the anti-bending mold 8 is greater than the thickness of the cutting mold 7. Several shallow guide holes 9 are provided through the top of the cutting mold 7 along its own length direction. Several guide holes 10 are provided through the top of the anti-bending mold 8 along its own length direction. Several guide holes 10 correspond one-to-one with several shallow guide holes 9. A lead-cutting mechanism is provided in the mold strip groove 6. One pin of the electronic component is completely accommodated in the guide hole 10, and the other pin extends out from the bottom of the shallow guide hole 9. The lead-cutting mechanism cuts the pin extending out from the shallow guide hole 9. This device is used to allow two pins of different lengths of an electronic component to contact the first conductive block 4 and the second conductive block 5 respectively for conductivity testing. The component to be tested is placed on the test loading mold 2, and the two pins of the component are respectively accommodated through shallow guide holes 9 and guide holes 10, which protect the pins during the component transport process and prevent quality problems such as bending, folding, and breakage of the pins. This not only reduces waste of defective products, but also avoids jamming caused by pin debris contaminating the track, ensuring the continuity of the testing process. Then, the test loading mold 2 is fed into the mold strip groove 6, which positions the test loading mold 2 so that the electronic component on the test loading mold 2 is within the working range of the pin shearing mechanism and the six-axis robotic arm 3. Within the enclosure, a lead-cutting mechanism first cuts off one pin of the component. The shallow guide hole 9 protects the test section of the pin and facilitates the lead-cutting mechanism in cutting off the protruding part, resulting in two pins of different lengths for subsequent conductivity testing. A loading finger cylinder is installed at the execution end of the six-axis robotic arm 3. The six-axis robotic arm 3 uses the loading finger cylinder to hold the component after lead cutting for conductivity testing. The loading finger cylinder holds the head of the electronic component, and the six-axis robotic arm 3 positions the component horizontally, making the two pins of the component contact the first conductive block 4 and the second conductive block 5 respectively. The longer pin of the component corresponds to the second conductive block 5, and the shorter pin corresponds to the first conductive block 4.Both the first conductive block 4 and the second conductive block 5 have a relatively long length, set at 5-10cm. This sufficient length ensures that the pins of the component can still correspond to the first conductive block 4 and the second conductive block 5 even with errors. The staggered arrangement of the first conductive block 4 and the second conductive block 5 prevents the short pins of the component from contacting the second conductive block 5, thus preventing the short pins from simultaneously contacting both the first conductive block 4 and the second conductive block 5. Furthermore, the height of the second conductive block 5 is greater than that of the first conductive block 4, resulting in different contact conductive heights for the two pins. Even if there is an overlapping area in the length direction of the first conductive block 4 and the second conductive block 5, it still ensures that the long pins of the component will not contact the first conductive block 4, and that the long pins of the component will not simultaneously contact both the first conductive block 4 and the second conductive block 5. This significantly improves the reliability of the conductivity performance test results and provides an accurate basis for determining the goodness of components. Two conveyor belts are set on one side of the test workbench 1. Components that pass the test are placed on one conveyor belt, and components that fail the test are placed on the other conveyor belt, so as to classify and transport them according to the test results. In practice, the current monitor used is the INA216 model. For testing LEDs, an industrial camera is installed on test bench 1. The camera visually determines whether the LED is emitting light; if it emits light, it is a qualified product; if it does not, it is a defective product. For capacitor testing, the current monitor detects whether the current in the test circuit changes after the capacitor is connected. The quality of the capacitor is judged based on the change in current; if it is within the acceptable range, it is a good product; if it exceeds or falls below the acceptable range, it is a defective product.

[0037] Example 2

[0038] Because the top surfaces of the first conductive block 4 and the second conductive block 5 are at different heights, when the long pins of the component contact the second conductive block 5, the short pins of the component cannot contact the first conductive block 4. Therefore, based on Embodiment 1, as follows... Figures 1 to 8As shown, a foot presser mechanism is installed above the test workbench 1. The foot presser mechanism includes a bracket 11, a foot presser cylinder 12, and a pressure plate 13. The bracket 11 is installed on the test workbench 1, and the foot presser cylinder 12 is vertically installed on the bracket 11. The telescopic shaft of the foot presser cylinder 12 is connected to the pressure plate 13. Two sets of foot presser assemblies are installed at the bottom of the pressure plate 13. The foot presser assembly includes a telescopic shaft 14 and an insulating pressure plate 15. The two ends of the telescopic shaft 14 are connected to the pressure plate 13 and the insulating pressure plate 15, respectively. A spring 16 is sleeved on the telescopic shaft 14. When the six-axis robotic arm 3 clamps the component at the testing station, the foot presser cylinder 12 drives the pressure plate 13. 3. Moving downwards, the pressure plate 13 simultaneously drives the insulating pressure plates 15 of the two sets of pressure foot assemblies to move downwards. One of the insulating pressure plates 15 presses the long pin of the component onto the second conductive block 5. Then, the pressure foot cylinder 12 continues to drive the pressure plate 13 downwards, so that the other insulating pressure plate 15 presses the short pin of the component onto the first conductive block 4. Through the extension and retraction of the telescopic shaft 14 and the deformation of the spring 16, interference between the insulating pressure plate 15 and the second conductive block 5 is avoided. Thus, the problem that the two pins of the component cannot simultaneously contact the first conductive block 4 and the second conductive block 5 is overcome by using the pressure foot method, making the test results more accurate.

[0039] Example 3

[0040] Based on Example 2, such as Figures 1 to 10As shown, the mold slot 6 is opened through the mold along a direction parallel to the testing station. A continuous feeding mechanism is provided at one end of the mold slot 6 on the testing workbench 1. The continuous feeding mechanism includes a feeding track 38 and a pusher plate 39. The feeding track 38 has a U-shaped cross-section. One end of the feeding track 38 is fixedly connected to the testing workbench 1. The pusher plate 39 is slidably disposed within the feeding track 38 and is used to push the test mold 2 on the feeding track 38 into the mold slot 6. A positioning mechanism is provided at the end of the mold slot 6 away from the feeding track 38. The positioning mechanism includes a positioning frame 40, a positioning cylinder 41, and a positioning plate 42. The positioning frame 40 is fixed to the top surface of the testing workbench 1. The positioning cylinder 41 is vertically mounted on the positioning frame 40. The telescopic shaft of the positioning cylinder 41 is connected to the positioning plate 42. The test loading mold 2 carrying components is placed into the loading track 38 by a loading robot or manually. The test loading molds 2 arranged in the loading track 38 are pushed into the mold strip groove 6 by the pusher plate 39. The positioning plate 42 positions the test loading mold 2 in the mold strip groove 6. During positioning, the positioning cylinder 41 drives the positioning plate 42 to move downward, so that the positioning plate 42 seals the outlet end of the mold strip groove 6. Initially, the position of the test loading mold 2 is manually positioned so that it is within the working range of the shearing mechanism and the six-axis robot arm 3, and then the test loading is changed. The space between mold 2 and positioning plate 42 is filled with an empty test loading mold 2, thereby allowing the loading track 38 and the test loading mold 2 in the mold slot 6 to be pressed together by the pusher plate 39 and positioning plate 42, completing the positioning and debugging, facilitating subsequent automatic positioning. When switching to the next test loading mold 2, positioning cylinder 41 drives positioning plate 42 to move upward, opening the outlet of mold slot 6. A discharge conveyor belt is installed at the outlet of mold slot 6. Pusher plate 39 pushes test loading mold 2 into mold slot 6. Test loading mold 2 pushes the preceding test loading mold 2 in turn, while the first idle test loading mold 2 falls from mold slot 6 onto the discharge conveyor belt. The rear positioning plate 42 moves downward to block the outlet of the mold strip groove 6. The pusher plate 39 continues to push the test loading mold 2 to move until the next test loading mold 2 contacts the positioning plate 42. Then the pusher plate 39 stops moving, thereby moving the next test loading mold 2 carrying components into the working range of the six-axis robot arm 3 and the shearing mechanism. This is repeated to realize the automatic loading of the test loading mold 2. When all the test loading molds 2 in the loading track 38 have moved into the mold strip groove 6, the pusher plate 39 moves in the opposite direction to reset. The test loading mold 2 carrying components is placed into the loading track 38 by the robot arm or manually. The above actions are repeated to complete the automatic loading of the test loading mold 2.

[0041] Furthermore, the continuous feeding mechanism also includes a second linear drive module 46. A U-shaped connecting rod 47 is provided on the module slide of the second linear drive module 46. The U-shaped opening of the U-shaped connecting rod 47 is set downward. One end of the U-shaped connecting rod 47 is fixed on the module slide of the second linear drive module 46, and the other end is fixedly connected to the pusher plate 39. The second linear drive module 46 drives the pusher plate 39 to move along the length direction of the feeding track 38 through the U-shaped connecting rod 47, thereby completing the automatic feeding of the test feeding mold 2.

[0042] Example 4

[0043] To prevent the test loading mold 2 from tilting upwards during the pushing process, which would prevent it from entering the mold slot 6, based on embodiment three, as follows: Figures 1 to 10As shown, it also includes a mold limiting mechanism, which includes a limiting base 48, a pressing guide plate 49, a pressing limiting plate 50, and a moving vertical rod 51. The pressing guide plate 49 is fixed to the top of the limiting base 48 and is located below the feeding track 38. The limiting base 48 has a limiting drive cavity 52, and a bidirectional threaded screw 53 is rotatably installed in the limiting drive cavity 52. ​​Two screw nuts 54 are threaded on the bidirectional threaded screw 53, and the threads of the two screw nuts 54 are opposite. Guide columns 55 are fixed on both screw nuts 54. A rectangular groove 56 is opened on the top of the guide column 55, and a guide spring 57 is installed in the rectangular groove 56. Each guide column 55 is equipped with a moving vertical rod 51. One end of the moving vertical rod 51 slides into the rectangular groove 56 and is connected to the guide spring 57. The top of the limiting base 48 has a guide strip groove 58 that connects to the limiting drive cavity 52. ​​The guide strip groove 58 is perpendicular to the feeding track 38. The other end of the moving vertical rod 51 passes through the guide strip groove 58 and connects to the pressing limiting plate 50. The feeding track 38 is located between the two moving vertical rods 51. When the pressing limiting plate 50 contacts the top surface of the feeding track 38, the pressing limiting plate 50 partially extends into the U-shaped opening of the feeding track 38, covering the length of the feeding track 38. Two inclined guide grooves 59 are symmetrically provided on the pressing guide plate 49. The inclined guide grooves 59 gradually decrease in height along the middle of the feeding track 38. The two moving vertical rods... Each of the 51 columns corresponds to an inclined guide groove 59. A bearing 60 is installed on the side of the moving vertical rod 51 near the downward guide plate 49. The bearing 60 is adapted to the inclined guide groove 59. A servo motor is installed on the limiting base 48. The output shaft of the servo motor is connected to the bidirectional threaded screw 53. Initially, the two downward limiting plates 50 are separated from the loading track 38, and the two downward limiting plates 50 are located outside the U-shaped opening of the loading track 38, so that the test loading mold 2 can be loaded through the top of the loading track 38, thereby loading multiple test loading molds 2 into the U-shaped opening of the loading track 38. Then, the servo motor drives the bidirectional threaded screw 53 to rotate. Since the threads of the two guide columns 55 are turned in opposite directions, the two guide columns 55 rotate in opposite directions. The movement directions of 5 are opposite, causing the guide column 55 to move closer to the feeding track 38. The guide column 55 drives the moving vertical rod 51 to move closer to the feeding track 38. The moving vertical rod 51 drives the bearing 60 to move closer to the lower end of the inclined guide groove 59. With the cooperation of the bearing 60 and the inclined guide groove 59, the moving vertical rod 51 squeezes the guide spring 57 and moves downward, thereby causing the lower pressure limiting plate 50 to move closer to the feeding track 38 and also move downward. After the lower pressure limiting plate 50 contacts the feeding track 38, a part of the lower pressure limiting plate 50 extends into the U-shaped opening of the feeding track 38, thereby giving the lower pressure limiting plate 50 a downward pressing action, which can press the raised test feeding mold 2 into the feeding track 38. Under the action of the two lower pressure limiting plates 50The test loading mold 2 can only move along the length of the loading track 38 into the mold slot 6, achieving precise loading of the test loading mold 2. The bottom surface of the lower limit plate 50 is smoothed to reduce the friction between the lower limit plate 50 and the test loading mold 2, allowing the pusher plate 39 to easily push the test loading mold 2 into the mold slot 6. After the test loading mold 2 in the loading track 38 has finished loading, the servo motor drives the bidirectional threaded screw 53 to rotate in the opposite direction, causing the guide column 55 to move the moving vertical rod 51 away from the loading track 38. At the same time, the moving vertical rod 51 drives the bearing 60 to move closer to the high end of the inclined guide groove 59. Under the reaction force of the guide spring 57, the moving vertical rod 51 moves upward, causing the lower limit plate 50 to move away from the loading track 38 and upward, exposing the U-shaped opening of the loading track 38 for easy loading.

[0044] Example 5

[0045] Based on Example 4, such as Figures 1 to 12 As shown, the top surface of the test loading mold 2 is provided with several positioning grooves 43. Each positioning groove 43 has a shallow guide hole 9 and a guide hole 10. The test loading mold 2 is provided with a negative pressure cavity 44, which is located between the shallow guide hole 9 and the guide hole 10. The test loading mold 2 has multiple negative pressure holes 45 in the positioning grooves 43, which are connected to the negative pressure cavity 44. Since the diameter of the guide hole 10 and the shallow guide hole 9 is larger than the diameter of the pin, it is convenient to insert the two pins of the component into the guide hole 10 and the shallow guide hole 9 respectively. This also results in the pin having a certain range of motion in the guide hole 10 and the shallow guide hole 9, so that the head of the component can move freely within the guide hole 10 and the shallow guide hole 9. The loading mold 2 is tilted in different directions, causing the components to not be vertically positioned when the six-axis robotic arm 3 grips them with the loading finger cylinders and moves them out of the guide hole 10. This results in the components squeezing the pins when moving upwards, which affects the subsequent conductivity test. To address this, the head of the component is positioned using negative pressure. The negative pressure hole 45 generates negative pressure to attract the head of the component, aligning it correctly. After the loading finger cylinders grip the component, the negative pressure is released, and the six-axis robotic arm 3 moves the component upwards out of the loading mold 2. This effectively avoids quality problems with the pins of the components during the loading process, resulting in higher accuracy of the conductivity test results.

[0046] Example 6

[0047] Based on Example 5, such as Figures 1 to 12As shown, a negative pressure switching mechanism is provided on the side of the test workbench 1 near the mold slot 6. The negative pressure switching mechanism includes a switching base 61, a sliding vertical plate 62, a negative pressure switching pipe 63, and a negative pressure pump. The sliding vertical plate 62 is slidably mounted on the top of the switching base 61. A switching cylinder 64 is horizontally mounted on the top of the switching base 61. The telescopic shaft of the switching cylinder 64 is connected to the sliding vertical plate 62. The negative pressure switching pipe 63 is rotatably mounted on the sliding vertical plate 62. The end of the negative pressure switching pipe 63 away from the test workbench 1 is connected to the negative pressure pump through a negative pressure hose. A driven gear 65 is fitted on the negative pressure switching pipe 63. A switching motor 66 is mounted on the sliding vertical plate 62. The output shaft of the switching motor 66 is connected to a driving gear 67. The driving gear 67 meshes with the driven gear 65. 5. The negative pressure switching pipe 63 is tapered at one end near the test workbench 1, and the tapered surface is covered with an elastic layer. An air inlet 68 is provided on the side wall of the negative pressure switching pipe 63. The test workbench 1 has a through hole 69 connecting to the mold slot 6, and the through hole 69 is coaxial with the negative pressure switching pipe 63. A negative pressure docking hole 70 connecting to the negative pressure chamber 44 is provided on one side of the test loading mold 2. A switching hole 71 connecting to the negative pressure docking hole 70 is provided on the top surface of the test loading mold 2. When the test loading mold 2 is confined between the push plate 39 and the positioning plate 42, the negative pressure docking hole 70 of the test loading mold 2 in the test loading state is on the moving path of the negative pressure switching pipe 63. At this time, the switching cylinder 64 drives the sliding vertical plate 62 to move closer to the test workbench 1. The movement allows the negative pressure switching tube 63 to pass through the through hole 69 and enter the negative pressure docking hole 70. The elastic layer and the tapered design of the negative pressure switching tube 63 eliminate error interference, allowing it to smoothly insert into the negative pressure docking hole 70. At this point, the elastic layer seals the negative pressure docking hole 70, and the air inlet 68 and the switching hole 71 are staggered. The negative pressure pump generates negative pressure in the negative pressure chamber 44, which acts on the head of the component through the negative pressure hole 45, completing the component positioning and clamping it vertically for feeding. After the feeding finger cylinder clamps the component, the negative pressure pump stops working, and the switching motor 66 starts. Through the meshing of the drive gear 67 and the driven gear 65, the negative pressure switching tube 63 deflects, causing the air inlet 68 to... When connected to the switching hole 71, the negative pressure chamber 44 is connected to the atmosphere, thereby quickly breaking the negative pressure state inside the negative pressure chamber 44. This allows the clamped components to be quickly removed from the test loading mold 2, achieving precise loading for conductivity testing. One negative pressure action can complete the alignment of all components on the test loading mold 2. The six-axis robotic arm 3 uses loading finger cylinders to sequentially clamp components for conductivity testing. When the component on the test loading mold 2 has been tested, the negative pressure switching tube 63 moves out of the negative pressure docking hole 70. When the next test loading mold 2 is in the testing position, the negative pressure switching tube 63 is inserted again into the negative pressure docking hole 70 of the next test loading mold 2 for negative pressure positioning, thereby further improving the accuracy of component conductivity testing.

[0048] In Example 7

[0049] Based on Example 6, such as Figures 1 to 6 As shown, guide sliders 17 are fixed on both the side of the cutting mold 7 away from the anti-bending mold 8 and the side of the anti-bending mold 8 away from the cutting mold 7. Guide grooves 18 are provided on both sides of the mold strip groove 6. The two guide sliders 17 are respectively slidably adapted to the two guide grooves 18 to suspend the test loading mold 2 in the mold strip groove 6. The depth of the mold strip groove 6 is greater than the thickness of the test loading mold 2, which can arrange the shearing mechanism below the cutting mold 7. The test loading mold 2 is slidably installed in the mold strip groove 6 through the cooperation of the guide sliders 17 and the guide grooves 18, so that the component loading and shearing action can be carried out smoothly.

[0050] Example 8

[0051] Because one pin of the component protrudes from the shallow guide hole 9 and is exposed, the exposed part is prone to bending or folding during transportation, causing the protruding part to fall out of the working range of the pin-cutting mechanism and resulting in pin-cutting failure. Therefore, based on embodiment seven, as follows... Figures 1 to 6 As shown, the bottom of the cutting mold 7 has an annular groove 19 concentric with the shallow guide hole 9. A cutting spring 20 is installed in the annular groove 19. One end of the cutting spring 20 is connected to a sliding tube 21. The sliding tube 21 is slidably adapted to the annular groove 19. When the cutting spring 20 is in its normal state, the bottom of the sliding tube 21 is flush with the bottom of the anti-bending mold 8. The sliding tube 21 is installed so that initially, under the action of the cutting spring 20, the bottom of the sliding tube 21 is flush with the bottom of the anti-bending mold 8. The sliding tube 21 protects the part of the needle protruding from the shallow guide hole 9, preventing the needle from leaving the cutting range of the cutting mechanism. When cutting, the sliding tube 21 squeezes the cutting spring 20 and moves it upward, so that one of the needles of the component is within the working range of the cutting mechanism, avoiding the problem of cutting failure.

[0052] Example 9

[0053] Based on Example 8, such as Figures 1 to 6As shown, the finger-cutting mechanism includes a slide 22, a finger-cutting cylinder 23, and a push rod 24. The slide 22 has a degree of freedom to move along the length of the mold slot 6. A mounting plate 25 is slidably mounted on the top of the slide 22, and the mounting plate 25 has a degree of freedom to move along the width of the mold slot 6. The finger-cutting cylinder 23 is mounted on the mounting plate 25, and the grippers of the finger-cutting cylinder 23 are positioned close to the cutting mold 7. Blades 26 and blade plates 27 are fixed to the inner sides of the two grippers of the finger-cutting cylinder 23, respectively. The push rod 24 is vertically mounted on the top of the slide 22 and has a degree of freedom to move along the height of the test workbench 1. A top plate 28 is fixed to the bottom of the sliding tube 21 near the anti-bending mold 8. The top plate 28 is located on the movement path of the push rod 24. A first linear drive module 2 is provided inside the mold slot 6. 9. The first linear drive module 29 is installed on the test workbench 1. The slide 22 is installed on the drive slide of the first linear drive module 29. The slide 22 is equipped with a push cylinder 30. The telescopic shaft of the push cylinder 30 is connected to the mounting plate 25. The first linear drive module 29 drives the slide 22 to move along the length direction of the mold strip groove 6, so that each component on the test loading mold 2 is in the cutting range of the cutting finger cylinder 23 in sequence. During cutting, the sliding tube 21 moves upward under the lifting action of the push rod 24, so that one pin of the component is exposed. Then the push cylinder 30 drives the cutting finger cylinder 23 to move closer to the component, so that the exposed pin of the component is located between the blade 26 and the cutting plate 27. Then the cutting finger cylinder 23 is activated, so that the blade 26 moves closer to the cutting plate 27 to complete the cutting action of the pin.

[0054] Example 10

[0055] Based on Example 9, such as Figures 1 to 6As shown, the slide block 22 has an inner cavity 31. The end of the push rod 24 away from the sliding tube 21 extends into the inner cavity 31. A push rod 33 is installed inside the inner cavity 31. A strip groove 32 communicating with the inner cavity 31 is opened on the top of the slide block 22. The strip groove 32 extends towards the width direction of the mold strip groove 6. A connecting rod 34 is fixed to the bottom of the mounting plate 25. The connecting rod 34 passes through the strip groove 32 and connects to the push rod 33. The push rod 24 has an inclined surface 35 on the side near the push rod 33. The inclined plane 35 is located on the moving path of the push rod 33. A spring plate 36 is fixedly sleeved on the push rod 24, and a push rod spring 37 is sleeved on the push rod 24. The two ends of the push rod spring 37 are respectively connected to the spring plate 36 and the slide block 22. Under normal conditions, the push rod 24 is located below the sliding tube 21 under the action of the push rod spring 37. When the push cylinder 30 drives the mounting plate 25 to move closer to the sliding tube 21, the mounting plate 25 drives the push rod 33 to move closer to the inclined plane of the push rod 24 through the connecting rod 34. The movement of surface 35 causes push rod 33 to press against inclined surface 35. Under the action of inclined surface 35, push rod 24 presses push rod spring 37 upward, causing the cutting finger cylinder 23 to move closer to sliding tube 21. At the same time, push rod 24 lifts sliding tube 21 upward, exposing the needles inside sliding tube 21 within the cutting working range of cutting finger cylinder 23. Thus, the cutting action is completed through the cooperation of blade 26 and blade plate 27. After the cutting is completed, push cylinder 30 drives mounting plate 25 away from sliding tube 21. At this time, push rod 33 moves away from inclined surface 35, causing push rod 24 to reset under the action of push rod spring 37. Then, the first linear drive module 29 drives slide 22 to move to the needle of the next component, repeating the above actions to complete the cutting action of the next component. The cutting and the movement of sliding tube 21 are synchronized through linkage, improving cutting efficiency. Moreover, the structure is more compact and the cost is reduced by driving through a single motion source.

[0056] A method for testing the conductivity of electronic components, utilizing the conductivity testing device for electronic components as described above, includes the following steps:

[0057] S1. Place the electronic components to be tested sequentially on the test loading mold 2, so that the two pins of the electronic components are inserted into the shallow guide hole 9 and the guide hole 10 respectively.

[0058] S2. Load the test loading mold 2 into the mold strip groove 6, so that the test loading mold 2 is within the working range of the shearing mechanism and the six-axis robot arm 3;

[0059] S3. The pins extending from the shallow guide hole 9 are cut by the pin-cutting mechanism so that the electronic component forms two pins of different lengths;

[0060] S4. The head of the electronic component is clamped by the six-axis robotic arm 3 and fed to the testing station, so that the two pins of the electronic component contact the first conductive block 4 and the second conductive block 5 respectively for conductivity testing.

Claims

1. A device for testing the conductivity of electronic components, characterized in that, The test workbench (1), test loading mold (2), and six-axis robotic arm (3) are included. The test workbench (1) is equipped with a testing station. At both ends of the testing station, a six-axis robotic arm and a conductivity detection mechanism are respectively arranged. The conductivity detection mechanism includes a first conductive block (4) and a second conductive block (5) arranged sequentially away from the testing station. The first conductive block (4) and the second conductive block (5) are arranged alternately in the horizontal direction. The height of the second conductive block (5) is higher than the height of the first conductive block (4). A mold strip groove (6) is opened on one side of the testing station on the top surface of the test workbench (1). The test loading mold (2) is slidably adapted to the mold strip groove (6). The test loading mold (2) includes a cutting mold (7) fixedly connected on the left and right sides. The anti-bending mold (8) is thicker than the cutting mold (7). The top of the cutting mold (7) is provided with several shallow guide holes (9) along its own length direction. The top of the anti-bending mold (8) is provided with several guide holes (10) along its own length direction. The several guide holes (10) correspond one-to-one with the several shallow guide holes (9). A cutting mechanism is provided in the mold strip groove (6). One pin of the electronic component is completely accommodated in the guide hole (10), and the other pin extends out from the bottom of the shallow guide hole (9). The cutting mechanism cuts the pin extending out from the shallow guide hole (9) so that the two pins of the electronic component with different lengths can contact the first conductive block (4) and the second conductive block (5) respectively for conductivity detection. The bottom of the cutting mold (7) is concentric with the shallow guide hole (9) and an annular groove (19) is provided. A cutting spring (20) is provided in the annular groove (19). One end of the cutting spring (20) is connected to a sliding tube (21). The sliding tube (21) is slidably adapted to the annular groove (19). When the cutting spring (20) is in the normal state, the bottom of the sliding tube (21) is flush with the bottom of the anti-bending mold (8). The finger-cutting mechanism includes a slide (22), a finger-cutting cylinder (23), and a push rod (24). The slide (22) has a degree of freedom to move along the length of the mold slot (6). A mounting plate (25) is slidably mounted on the top of the slide (22). The mounting plate (25) has a degree of freedom to move along the width of the mold slot (6). The finger-cutting cylinder (23) is mounted on the mounting plate (25). The gripper of the finger-cutting cylinder (23) rests against... The cutting mold (7) is set up with blades (26) and blade plates (27) fixed on the inner sides of the two grippers of the cutting finger cylinder (23). The push rod (24) is vertically installed on the top of the slide (22). The push rod (24) has the freedom to move along the height direction of the test workbench (1). The bottom of the sliding tube (21) is fixed with a top plate (28) on the side near the anti-bending mold (8). The top plate (28) is located on the moving path of the push rod (24).

2. The conductivity testing device for electronic components according to claim 1, characterized in that, A foot presser mechanism is provided above the test workbench (1). The foot presser mechanism includes a bracket (11), a foot presser cylinder (12), and a pressure plate (13). The bracket (11) is installed on the test workbench (1). The foot presser cylinder (12) is vertically installed on the bracket (11). The telescopic shaft of the foot presser cylinder (12) is connected to the pressure plate (13). Two sets of foot presser assemblies are provided at the bottom of the pressure plate (13). The foot presser assembly includes a telescopic shaft (14) and an insulating pressure plate (15). The two ends of the telescopic shaft (14) are respectively connected to the pressure plate (13) and the insulating pressure plate (15). A spring (16) is sleeved on the telescopic shaft (14).

3. The conductivity testing device for electronic components according to claim 1, characterized in that, Guide sliders (17) are fixed on the side of the cutting mold (7) away from the anti-bending mold (8) and the side of the anti-bending mold (8) away from the cutting mold (7). Guide grooves (18) are provided on both sides of the mold strip groove (6). The two guide sliders (17) are respectively slidably adapted in the two guide grooves (18) to suspend the test loading mold (2) in the mold strip groove (6).

4. The conductivity testing device for electronic components according to claim 1, characterized in that, The mold strip groove (6) is provided with a first linear drive module (29), the first linear drive module (29) is installed on the test workbench (1), the slide (22) is installed on the test workbench (1), the slide (22) is installed with a push cylinder (30), and the telescopic shaft of the push cylinder (30) is connected to the mounting plate (25).

5. The conductivity testing device for electronic components according to claim 1, characterized in that, The slide block (22) has an inner cavity (31). The end of the push rod (24) away from the sliding tube (21) extends into the inner cavity (31). A push rod (33) is provided in the inner cavity (31). A strip groove (32) communicating with the inner cavity (31) is opened on the top of the slide block (22). The strip groove (32) extends toward the width direction of the mold strip groove (6). A connecting rod (34) is fixed at the bottom of the mounting plate (25). The connecting rod (34) passes through the strip groove (32) and connects to the push rod (33). The push rod (24) has an inclined surface (35) on the side near the push rod (33). The inclined surface (35) is located on the moving path of the push rod (33). A spring disc (36) is fixedly sleeved on the push rod (24). A push rod spring (37) is sleeved on the push rod (24). The two ends of the push rod spring (37) are respectively connected to the spring disc (36) and the slide (22).

6. The conductivity testing device for electronic components according to claim 1, characterized in that, The mold slot (6) is opened through the mold along a direction parallel to the testing station. The testing workbench (1) is provided with a continuous feeding mechanism at one end of the mold slot (6). The continuous feeding mechanism includes a feeding track (38) and a pusher plate (39). The feeding track (38) has a U-shaped cross-section. One end of the feeding track (38) is fixedly connected to the testing workbench (1). The pusher plate (39) is slidably disposed in the feeding track (38). The pusher plate (39) is used to feed the mold slot (6) into the mold slot (6). The test loading mold (2) on the loading track (38) is pushed into the mold strip groove (6). The mold strip groove (6) is provided with a positioning mechanism at one end away from the loading track (38). The positioning mechanism includes a positioning frame (40), a positioning cylinder (41) and a positioning plate (42). The positioning frame (40) is fixed on the top surface of the test workbench (1). The positioning cylinder (41) is vertically installed on the positioning frame (40). The telescopic shaft of the positioning cylinder (41) is connected to the positioning plate (42).

7. The conductivity testing device for electronic components according to claim 1, characterized in that, The top surface of the test loading mold (2) is provided with several positioning grooves (43). Each positioning groove (43) is provided with a shallow guide hole (9) and a guide hole (10). The test loading mold (2) is provided with a negative pressure cavity (44). The negative pressure cavity (44) is located between the shallow guide hole (9) and the guide hole (10). The test loading mold (2) is provided with multiple negative pressure holes (45) in the positioning grooves (43). The negative pressure holes (45) are connected to the negative pressure cavity (44).

8. A method for testing the conductivity of electronic components, utilizing the conductivity testing device for electronic components as described in claim 1, characterized in that, Includes the following steps: S1. Place the electronic components to be tested sequentially on the test loading mold (2), so that the two pins of the electronic components are inserted into the shallow guide hole (9) and the guide hole (10) respectively; S2. Load the test loading mold (2) into the mold strip groove (6) so that the test loading mold (2) is located within the working range of the shearing mechanism and the six-axis robot arm (3); S3. The pins extending from the shallow guide hole (9) are cut by the pin-cutting mechanism so that the electronic components form two pins of different lengths. S4. The head of the electronic component is clamped by the six-axis robotic arm (3) and fed to the testing station, so that the two pins of the electronic component contact the first conductive block (4) and the second conductive block (5) respectively for conductivity testing.

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