Display device and electronic device including the same

Abstract

The invention relates to a display device and an electronic device. The display device includes: a display section configured to emit light; and a sensor portion disposed on the display portion and including a sensing electrode. The display portion includes: a first electrode and a second electrode spaced apart from each other; a light emitting element disposed between the first electrode and the second electrode in a plan view and including a first end and a second end; a first connection electrode electrically connected to the first end; a second connection electrode electrically connected to the second end; a shielding layer overlapping the light emitting element in a plan view; and a transparent planarization layer disposed on the shielding layer.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0053392, filed on April 22, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0003] The disclosure relates to a display apparatus and an electronic apparatus including the same. BACKGROUND

[0004] In recent years, as interest in information display increases, research and development on display apparatuses are being continuously conducted.

[0005] A display apparatus can include a sensor configured to perform an operation of interacting with a user. The display apparatus can further include a wire or the like for forming the sensor, such that the sensor is formed in the display apparatus.

[0006] Accordingly, there is a need to reduce a risk that can occur due to an electric signal formed when the sensor operates. SUMMARY

[0007] Aspects of the disclosure are to provide a display apparatus and an electronic apparatus including the same, in which a range of a dead zone can be reduced.

[0008] Aspects of the disclosure are to provide a display apparatus and an electronic apparatus including the same, in which reliability of an electric signal is improved by reducing a parasitic capacitance in the display apparatus.

[0009] Aspects of the disclosure provide a display apparatus and an electronic apparatus including the same, having improved process convenience.

[0010] According to an embodiment of the disclosure, a display apparatus can include a display portion configured to emit light, and a sensor portion disposed on the display portion and including a sensing electrode. The display portion can include a first electrode and a second electrode spaced apart from each other, a light emitting element disposed between the first electrode and the second electrode in a plan view and including a first end and a second end, a first connection electrode electrically connected to the first end, a second connection electrode electrically connected to the second end, a shielding layer overlapping the light emitting element in the plan view, and a transparent planarization layer disposed on the shielding layer.

[0011] According to an embodiment, the shielding layer and the transparent planarization layer can be disposed between the light emitting element and the sensor portion.

[0012] According to an embodiment, the display portion can further include a display base layer and a bank protruding in a thickness direction of the display base layer. The shielding layer can be disposed in an area surrounded by the bank.

[0013] According to an embodiment, the display apparatus can include a display area and a non-display area surrounding at least a portion of the display area. The shielding layer can be disposed entirely on the entire surface in the display area.

[0014] According to an embodiment, the shielding layer can be electrically connected to the second connection electrode.

[0015] According to an embodiment, the display portion can further include a first power line providing a first power and a second power line providing a second power, the second power forming a voltage lower than that of the first power. The second connection electrode can be electrically connected to the second power line.

[0016] According to an embodiment, the shielding layer can be electrically separated from the first connection electrode.

[0017] According to an embodiment, the shielding layer can include a transparent conductive material.

[0018] According to an embodiment, the transparent planarization layer can include an acrylic-based resin.

[0019] According to an embodiment, the transparent planarization layer can be manufactured based on an acrylic-based resin composition. The acrylic-based resin composition can include an acrylic resin, an acrylic monomer, a photoinitiator, and a solvent. The acrylic resin can be included in an amount of 6% by weight to 11% by weight based on the entire acrylic-based resin composition. The acrylic monomer can be included in an amount of 2% by weight to 15% by weight based on the entire acrylic-based resin composition. The photoinitiator can be included in an amount of 2% by weight to 15% by weight based on the entire acrylic-based resin composition. The solvent can be included in an amount of 71% by weight to 91% by weight based on the entire acrylic-based resin composition.

[0020] According to an embodiment, the acrylic resin can have a weight average molecular weight of 5000 to 25000. The acrylic monomer can include one or more of cyclo-trimethylolpropane acrylate, tris(2-hydroxyethyl)isocyanurate triacrylate, and ethoxylated fluorene-type diacrylate. The photoinitiator can include one or more of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and 4-(dimethylamino)benzophenone. The solvent can include one or more of methyl-3-methoxypropionate and propylene glycol methyl ether acetate.

[0021] According to an embodiment, the display apparatus can include a display area and a non-display area surrounding at least a portion of the display area. The display portion can further include a trace electrically connected to at least a portion of the sensing electrode through a contact member, at least a portion of the contact member passing through the transparent planarization layer. At least a portion of the trace can be disposed in the display area.

[0022] According to an embodiment, the shielding layer and the trace can include the same material.

[0023] According to an embodiment, the display portion can further include a display base layer and a bank protruding in a thickness direction of the display base layer. In a plan view, the trace can not overlap the bank.

[0024] According to an embodiment, the display portion can further include a backplane conductive layer disposed under the light emitting element. The backplane conductive layer can be electrically connected to the trace.

[0025] According to an embodiment, the display apparatus can further include a color filter disposed on the sensor portion and respectively transmitting light of one color. The light emitting element can include an inorganic material.

[0026] According to an embodiment, the display apparatus can include a first sub-pixel area providing light of a first color, a second sub-pixel area providing light of a second color, and a third sub-pixel area providing light of a third color. The display apparatus can further include a plurality of light emitting elements including a first light emitting element disposed in the first sub-pixel area and providing light of the first color, a second light emitting element disposed in the second sub-pixel area and providing light of the second color, and a third light emitting element disposed in the third sub-pixel area and providing light of the third color.

[0027] According to an embodiment of the disclosure, a display apparatus can include a display area and a non-display area surrounding at least a portion of the display area, a display portion including a first electrode, a second electrode, a light emitting element disposed between the first electrode and the second electrode in a plan view, and a trace, and a sensor portion disposed on the display portion and including a sensing electrode. At least a portion of the sensing electrode can be electrically connected to the trace. The trace can be disposed in the display area.

[0028] According to an embodiment of the disclosure, an electronic device can include a processor configured to provide input image data, a display apparatus configured to display an image based on the input image data, the display apparatus including a sub-pixel area, and a power supply configured to provide power to the display apparatus. The display apparatus can include a display portion configured to emit light, and a sensor portion disposed on the display portion and including a sensing electrode. The display portion can include a first electrode and a second electrode spaced apart from each other, a light emitting element disposed between the first electrode and the second electrode in a plan view and including a first end and a second end, a first connection electrode electrically connected to the first end, a second connection electrode electrically connected to the second end, a shielding layer overlapping the light emitting element in the plan view, and a transparent planarization layer disposed on the shielding layer.

[0029] According to embodiments of the disclosure, a display device and an electronic device including the same can be provided in which a range of a dead zone can be reduced.

[0030] According to embodiments of the disclosure, a display device and an electronic device including the same can be provided in which reliability of an electrical signal is improved by reducing a parasitic capacitance in the display device.

[0031] According to embodiments of the disclosure, a display device and an electronic device including the same can be provided in which process convenience is improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] The above and other features of the disclosure will become more apparent by describing in detail embodiments thereof with reference made to the accompanying drawings.

[0033] Figure 1 FIG. 1 is a diagram illustrating a display device according to an embodiment.

[0034] Figure 2 FIG. 2 is a schematic plan view illustrating a sensor portion according to an embodiment.

[0035] Figure 3 FIG. 3 is a schematic cross-sectional view illustrating a stacked structure of a display device according to an embodiment.

[0036] Figure 4 FIG. 4 is a schematic plan view illustrating a display portion according to an embodiment.

[0037] Figure 5 FIG. 5 is a schematic perspective view illustrating a light emitting element according to an embodiment.

[0038] Figure 6 FIG. 6 is a schematic cross-sectional view illustrating a light emitting element according to an embodiment.

[0039] Figure 7 FIG. 7 is a schematic cross-sectional view illustrating a sensor portion according to an embodiment.

[0040] Figure 8 FIG. 8 is a schematic plan view illustrating a sensing electrode according to an embodiment.

[0041] Figure 9 FIG. 9 is a schematic cross-sectional view illustrating a sensor portion according to an embodiment.

[0042] Figure 10 FIG. 10 is a schematic cross-sectional view illustrating a display device according to an embodiment.

[0043] Figure 11 FIG. 11 is a schematic cross-sectional view illustrating an electrical connection structure for a trace according to an embodiment.

[0044] Figure 12 is a schematic cross-sectional view illustrating a display apparatus according to an embodiment.

[0045] Figure 13 is a schematic block diagram illustrating an electronic apparatus including a display apparatus according to an embodiment.

[0046] Figure 14 is a schematic diagram illustrating an example in which the electronic apparatus of Figure 13 is implemented as a smart phone.

[0047] Figure 15 is a schematic diagram illustrating an example in which the electronic apparatus of Figure 13 is implemented as a tablet computer. DETAILED DESCRIPTION

[0048] The present disclosure can be modified in various ways and has various forms. Therefore, a specific embodiment will be shown in the accompanying drawings and will be described in detail in the specification. It should be understood, however, that the present disclosure is not intended to be limited to the disclosed specific forms and includes all modifications, equivalents, and alternatives within the spirit and technical scope of the present disclosure.

[0049] The terms "first", "second", and the like can be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another component. For example, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component without departing from the scope of the present disclosure. In the following description, singular expressions include plural expressions unless the context clearly dictates otherwise.

[0050] It should be understood that, in the present application, the terms "include", "have", and the like are used to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but do not preclude the possibility of existence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. In addition, in the case where a part of a layer, a layer, a region, a plate, or the like is referred to as being "on" another part, it not only includes the case where the part is "directly" on the other part, but also includes the case where there is still another part between the part and the other part. Furthermore, in the present specification, when a part of a layer, a layer, a region, a plate, or the like is formed on another part, the formation direction is not limited to the upward direction, but includes the case where the part is formed on a side surface or in a downward direction. Conversely, when a part of a layer, a layer, a region, a plate, or the like is formed "under" another part, it not only includes the case where the part is "directly" under the other part, but also includes the case where there is still another part between the part and the other part.

[0051] The present disclosure relates to a display device and an electronic device including the same. Hereinafter, a display device and an electronic device including the same according to an embodiment are described with reference to the accompanying drawings.

[0052] Figure 1 FIG. 1 is a diagram illustrating a display device DD according to an embodiment. Figure 2 Figure 3

[0053] Referring to FIG. 1, Figures 1 to 3 The display device DD is configured to provide (or emit) light. The display device DD can include a panel PNL and a driving circuit portion DV for driving the panel PNL. The display device DD can further include an outer portion OUP.

[0054] The panel PNL can include a display portion DP for displaying an image and a sensor portion TSP capable of sensing a user input (e.g., a touch input). The display portion DP can be referred to as a display panel or a display layer. The sensor portion TSP can be referred to as a sensing panel or a sensor layer.

[0055] The panel PNL can include a sub-pixel SPX and a sensing electrode SP. According to an embodiment, the sub-pixel SPX can display an image in a display frame period. The sensing electrode SP can sense an input (e.g., a touch input) of a user in a sensing frame period. The sensing frame period and the display frame period can be independent of each other or can be different from each other. The sensing frame period and the display frame period can be synchronized or asynchronous with each other.

[0056] The sensor portion TSP including the sensing electrode SP can obtain information about a touch input of a user. According to an embodiment (e.g., a mutual capacitance method), the sensing electrode SP can include a first sensing electrode SP1 providing a first sensing signal and a second sensing electrode SP2 providing a second sensing signal. According to an embodiment, the first sensing electrode SP1 can be a Tx (transmitter) pattern electrode, and the second sensing electrode SP2 can be an Rx (receiver) pattern electrode. The information about a touch input (or a touch event) can mean information including a position of a touch that a user wants to provide, etc.

[0057] However, the present disclosure is not limited thereto. For example, according to an embodiment (e.g., a self-capacitance method), the sensing electrode SP can be configured by one type of sensing electrode without distinguishing the first sensing electrode SP1 and the second sensing electrode SP2.

[0058] ​​The driving circuit part DV can include a display driver (D-IC) DDV for driving the display part DP and a sensor driver (T-IC) SDV for driving the sensor part TSP.

[0059] The display part DP can include a display base layer DBSL and sub-pixels SPX disposed on the display base layer DBSL. The sub-pixels SPX can be disposed in a display area DA.

[0060] The display base layer DBSL (or the display device DD) can include a display area DA in which an image is displayed and a non-display area NDA outside the display area DA. According to an embodiment, the display area DA can be disposed in a central area of the display part DP, and the non-display area NDA can be disposed adjacent to a periphery of the display area DA.

[0061] The display base layer DBSL can be a base substrate or a base layer for supporting components of the display device DD. The base layer can be a rigid substrate of a glass material. In an embodiment, the base layer can be a flexible substrate that can be bent, folded, rolled, etc. In this case, the base layer can include an insulating material such as a polymer resin, such as polyimide. However, the present disclosure is not particularly limited thereto.

[0062] Scan lines SL and data lines DL and sub-pixels SPX connected to the scan lines SL and the data lines DL can be disposed in the display area DA. The sub-pixels SPX can be configured to be selected by a scan signal of an on level provided from the scan lines SL, to receive a data signal from the data lines DL, and to emit light of a luminance corresponding to the data signal. Accordingly, an image corresponding to the data signal is displayed in the display area DA. However, in the present disclosure, the structure, driving method, etc. of the sub-pixels SPX are not particularly limited.

[0063] Various lines and / or built-in circuit units connected to the sub-pixels SPX of the display area DA can be disposed in the non-display area NDA. For example, a plurality of lines for providing various power and control signals to the display area DA can be disposed in the non-display area NDA.

[0064] The display part DP can output visual information (e.g., an image). According to an embodiment, the display part DP can include a light emitting element LD( Figure 5 ) including an inorganic material.

[0065] The sensor part TSP includes a sensor base layer SBSL and a plurality of sensing electrodes SP formed on the sensor base layer SBSL. The sensing electrodes SP can be disposed in a sensing area SA on the sensor base layer SBSL. The panel PNL can further include a trace line TRL and a sensor pad SPD.

[0066] The sensor base layer SBSL (or the display device DD) can include a sensing area SA that can sense a touch input or the like and a non-sensing area NSA around the sensing area SA. According to an embodiment, the sensing area SA can be disposed to overlap at least one area of the display area DA. For example, the sensing area SA can be disposed to correspond to an area of the display area DA (e.g., an area overlapping the display area DA), and the non-sensing area NSA can be disposed to correspond to an area of the non-display area NDA (e.g., an area overlapping the non-display area NDA). In this case, when a touch input or the like is provided on the display area DA, the touch input can be detected by the sensor portion TSP.

[0067] The sensor base layer SBSL can include one or more insulating layers. For example, one or more insulating layers for forming the sensor base layer SBSL can be disposed on the display portion DP to form a base for forming the sensing electrode SP. However, examples for forming the sensor base layer SBSL are not particularly limited.

[0068] The sensing area SA is disposed as an area (i.e., an active area of the sensor) that can respond to a touch input. To this end, the sensing electrode SP for sensing a touch input or the like can be disposed in the sensing area SA.

[0069] The sensor portion TSP can obtain information about an input provided from a user. The sensor portion TSP can recognize a touch input. The sensor portion TSP can recognize a touch input using a capacitive sensing method. The sensor portion TSP can sense a touch input using a mutual capacitive method, or can sense a touch input using a self-capacitive method.

[0070] According to an embodiment, each of the first sensing electrodes SP1 can extend in a first direction DR1. The first sensing electrodes SP1 can be arranged in a second direction DR2. The second direction DR2 can be different from the first direction DR1. For example, the second direction DR2 can be a direction perpendicular to the first direction DR1. In an embodiment, a third direction DR3 can be a direction perpendicular to the first direction DR1 and the second direction DR2.

[0071] According to an embodiment, each of the second sensing electrodes SP2 can extend in a second direction DR2. The second sensing electrodes SP2 can be arranged in a first direction DR1.

[0072] According to an embodiment, the first sensing electrode SP1 and the second sensing electrode SP2 can have the same (e.g., substantially the same) shape. For example, the first sensing electrode SP1 as the Tx pattern and the second sensing electrode SP2 as the Rx pattern can have respective shapes (e.g., substantially the same shape), and thus can set a sensing performance of a touch event uniformly within the sensing area SA.

[0073] A sensing line for electrically connecting the sensing electrode SP to the sensor driver SDV, etc. can be disposed in the non-sensing area NSA of the sensor part TSP.

[0074] The driving circuit part DV can include a display driver DDV for driving the display part DP and a sensor driver SDV for driving the sensor part TSP.

[0075] The display driver DDV is configured to be electrically connected to the display part DP to drive the sub-pixel SPX. The sensor driver SDV is configured to be electrically connected to the sensor part TSP to drive the sensor part TSP.

[0076] In a plan view, the trace TRL can overlap the display area DA. The trace TRL can electrically connect the sensing electrode SP and the sensor pad SPD.

[0077] The trace TRL can include a first trace TRL1 and a second trace TRL2. The first trace TRL1 can electrically connect the first sensing electrode SP1 and the first sensor pad SPD1. The second trace TRL2 can electrically connect the second sensing electrode SP2 and the second sensor pad SPD2.

[0078] According to an embodiment, at least a portion of the trace TRL can be disposed in the sensing area SA, and the trace TRL can be patterned to cross over the sensing area SA. Experimentally, there can be a risk of excessive increase in a dead zone when the trace TRL is disposed in the non-sensing area NSA. However, according to an embodiment, since the trace TRL is patterned to cross over the sensing area SA, a range of the dead zone can be significantly reduced.

[0079] The sensor pad SPD can be disposed in the non-sensing area NSA. The sensor pad SPD can be electrically connected to the sensor driver SDV. Thus, the sensing electrode SP can be electrically connected to the sensor driver SDV through the trace TRL and the sensor pad SPD.

[0080] The sensor pad SPD can include a first sensor pad SPD1 and a second sensor pad SPD2. The first sensor pad SPD1 can be electrically connected to the first sensing electrode SP1. The second sensor pad SPD2 can be electrically connected to the second sensing electrode SP2.

[0081] The outer portion OUP can be disposed substantially on the outside of the display apparatus DD. The outer portion OUP can be disposed on the sensor portion TSP. Light provided from the display portion DP can pass through the outer portion OUP and can be output to the outside. According to an embodiment, the outer portion OUP can include a color filter CF (refer to Figure 12 ). According to an embodiment, the outer portion OUP can further include a window.

[0082] Referring to Figures 4 to 6 , a light emitting element LD according to an embodiment and a display portion DP including the light emitting element LD are described.

[0083] Figure 4 is a schematic plan view illustrating a display portion DP according to an embodiment. Figure 5 is a schematic perspective view illustrating a light emitting element LD according to an embodiment. Figure 6 is a schematic cross-sectional view illustrating a light emitting element LD according to an embodiment.

[0084] Referring to Figures 4 to 6 , a display portion DP includes a light emitting element LD.

[0085] The light emitting element LD is configured to emit light. The light emitting element LD can include a first semiconductor layer SCL1, a second semiconductor layer SCL2, and an active layer AL disposed between the first semiconductor layer SCL1 and the second semiconductor layer SCL2. According to an embodiment, the first semiconductor layer SCL1, the active layer AL, and the second semiconductor layer SCL2 can be sequentially stacked in a length L direction of the light emitting element LD. According to an embodiment, the light emitting element LD can further include an electrode layer ELL and an insulating film INF.

[0086] The light emitting element LD can have various shapes. For example, the light emitting element LD can have a column shape extending in one direction. The column shape can include a rod shape or a bar shape (e.g., an aspect ratio greater than 1) long in the length L direction, such as a circular column or a polygonal column, and a cross-sectional shape thereof is not particularly limited.

[0087] The light emitting element LD can have a first end EP1 and a second end EP2. According to an embodiment, the first semiconductor layer SCL1 can be adjacent to the first end EP1 of the light emitting element LD, and the second semiconductor layer SCL2 can be adjacent to the second end EP2. According to an embodiment, the electrode layer ELL can be adjacent to the first end EP1.

[0088] The light emitting element LD can be manufactured by etching sequentially stacked semiconductor layers. The light emitting element LD can have a nanoscale or a microscale size. For example, each of a diameter D (or a width) of the light emitting element LD and a length L of the light emitting element LD can have a microscale or a nanoscale size. However, the disclosure is not limited thereto.

[0089] The first semiconductor layer SCL1 can include a first-conductivity-type semiconductor. The first semiconductor layer SCL1 can be disposed on the active layer AL, and can include a semiconductor layer of a different type from that of the second semiconductor layer SCL2. For example, the first semiconductor layer SCL1 can include a P-type semiconductor layer. For example, the first semiconductor layer SCL1 can include one or more semiconductor materials selected from the group of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and can include a P-type semiconductor layer doped with a first-conductivity-type dopant such as Ga, B, and Mg. However, the disclosure is not limited to the above-described examples. The first semiconductor layer SCL1 can include various materials.

[0090] The active layer AL can be disposed between the first semiconductor layer SCL1 and the second semiconductor layer SCL2. The active layer AL can include a single quantum well structure or a multi-quantum well structure. The position of the active layer AL is not limited to a specific example, and can vary variously according to the type of the light emitting element LD.

[0091] A cladding layer doped with a conductive dopant can be formed on one side and / or the other side of the active layer AL. For example, the cladding layer can include one or more of AlGaN and InAlGaN. However, the disclosure is not limited to the above-described examples.

[0092] The second semiconductor layer SCL2 can include a second-conductivity-type semiconductor. The second semiconductor layer SCL2 can be disposed on the active layer AL, and can include a semiconductor layer of a different type from that of the first semiconductor layer SCL1. For example, the second semiconductor layer SCL2 can include an N-type semiconductor layer. For example, the second semiconductor layer SCL2 can include one or more selected from the group of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and can include an N-type semiconductor layer doped with a second-conductivity-type dopant such as Si, Ge, and Sn. However, the disclosure is not limited to the above-described examples. The second semiconductor layer SCL2 can include various materials.

[0093] When a voltage equal to or greater than a threshold voltage is applied to the first end EP1 and the second end EP2 of the light emitting element LD, electron-hole pairs can recombine with each other in the active layer AL, and the light emitting element LD can emit light. By controlling the light emission of the light emitting element LD using this principle, the light emitting element LD can be used as a light source in various devices.

[0094] The insulating film INF can be disposed on one surface of the light emitting element LD. The insulating film INF can surround an outer surface of the active layer AL, and can also surround a portion of each of the first semiconductor layer SCL1 and the second semiconductor layer SCL2. The insulating film INF can have a single layer or a multi-layer structure.

[0095] The insulating film INF can expose the first end EP1 and the second end EP2 of the light emitting element LD having different polarities. For example, the insulating film INF can expose one end of each of the electrode layer ELL and the second semiconductor layer SCL2 of the light emitting element LD adjacent to the first end EP1 and the second end EP2. The insulating film INF can secure the electrical stability of the light emitting element LD. Further, the insulating film INF can minimize surface defects of the light emitting element LD to improve the lifespan and efficiency. Further, when a plurality of light emitting elements LD are disposed close to each other, the insulating film INF can prevent a short-circuit defect between the light emitting elements LD.

[0096] According to an embodiment, the insulating film INF can include at least one of a group of silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al x O y ), and titanium oxide (TiO x ). However, the insulating film INF is not necessarily limited to the above-described examples in the disclosure.

[0097] The electrode layer ELL can be disposed on the first semiconductor layer SCL1. The electrode layer ELL can be adjacent to the first end EP1. The electrode layer ELL can be electrically connected to the first semiconductor layer SCL1. A portion of the electrode layer ELL can be exposed. For example, the insulating film INF can expose one surface of the electrode layer ELL. The electrode layer ELL can be exposed in a region corresponding to the first end EP1. According to an embodiment, a side surface of the electrode layer ELL can be exposed. For example, the insulating film INF can cover a side surface of each of the first semiconductor layer SCL1, the active layer AL, and the second semiconductor layer SCL2, and can not cover at least a portion of the side surface of the electrode layer ELL. In this case, another configuration in which the electrode layer ELL electrically connected to the first end EP1 can be easy. According to an embodiment, the insulating film INF can expose a portion of a side surface of the first semiconductor layer SCL1 and / or the second semiconductor layer SCL2 in addition to the side surface of the electrode layer ELL.

[0098] According to an embodiment, the electrode layer ELL can be an ohmic contact electrode. However, the disclosure is not limited to the above-described examples. For example, the electrode layer ELL can be a Schottky contact electrode.

[0099] According to an embodiment, the electrode layer ELL can include one or more of a group of chromium (Cr), titanium (Ti), aluminum (Al), gold (Au), nickel (Ni), oxides thereof, and alloys thereof. However, the disclosure is not limited to the above examples. According to an embodiment, the electrode layer ELL can be substantially transparent. For example, the electrode layer ELL can include indium tin oxide (ITO). Thus, the electrode layer ELL can transmit emitted light.

[0100] The structure, shape, etc. of the light emitting element LD are not limited to the above examples, and according to an embodiment, the light emitting element LD can have various structures and shapes. For example, the light emitting element LD can further include an additional electrode layer disposed on one surface of the second semiconductor layer SCL2 and adjacent to the second end EP2.

[0101] According to an embodiment, the display portion DP (e.g., the display device DD) can include an emission area EMA and a non-emission area NEA. The display portion DP (e.g., the display device DD) can further include a bank BNK, an electrode layer ELT, a light emitting element LD, and a connection electrode layer CNE. According to an embodiment, the display portion DP can further include a shielding layer SHP.

[0102] In a plan view, the emission area EMA can overlap with an opening OPN defined by the bank BNK. The light emitting element LD can be disposed in the emission area EMA. The light emitting element LD can not be disposed in the non-emission area NEA.

[0103] The bank BNK can form (or provide) the opening OPN. For example, the bank BNK can have a shape protruding in a thickness direction (e.g., the third direction DR3) of the display base layer DBSL and can surround an area. According to an embodiment, ink including the light emitting element LD can be provided to the opening OPN defined by the bank BNK, and the light emitting element LD can be disposed in the opening OPN.

[0104] According to an embodiment, the bank BNK can include an organic material such as an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, a polyimide resin, a polyester resin, a polyphenylene sulfide resin, or benzocyclobutene (BCB). However, the disclosure is not limited to the above examples.

[0105] The electrode layer ELT can include an electrode for aligning the light emitting element LD. The electrode layer ELT can be referred to as an alignment electrode layer. According to an embodiment, the electrode layer ELT can include a first electrode ELT1 and a second electrode ELT2. According to an embodiment, the first electrode ELT1 can be a first alignment electrode ELTA, and the second electrode ELT2 can be a second alignment electrode ELTG.

[0106] The light emitting elements LD can be disposed (or aligned) on the electrode layer ELT. According to an embodiment, the light emitting elements LD can be aligned between the first electrode ELT1 and the second electrode ELT2 in a plan view. The light emitting elements LD can form (or configure) a light emitting portion.

[0107] According to an embodiment, the first electrode ELT1 and the second electrode ELT2 can be spaced apart from each other along the second direction DR2 in the emission area EMA. The first electrode ELT1 and the second electrode ELT2 can extend in the first direction DR1.

[0108] According to an embodiment, the first electrode ELT1 as the first alignment electrode ELTA can be an electrode to which an AC signal is provided to align the light emitting elements LD. The first electrode ELT1 can be an electrode to which an anode signal is provided so that the light emitting elements LD emit light. The second electrode ELT2 as the second alignment electrode ELTG can be an electrode to which a ground signal is provided to align the light emitting elements LD. The second electrode ELT2 can be an electrode to which a cathode signal is provided so that the light emitting elements LD emit light.

[0109] In a process step in which the light emitting elements LD are aligned, the first electrode ELT1 (or the first alignment electrode ELTA) and the second electrode ELT2 (or the second alignment electrode ELTG) can be provided (or supplied) with a first alignment signal and a second alignment signal, respectively. For example, an ink including the light emitting elements LD can be provided (or supplied) to the opening OPN, the first alignment signal can be provided to the first electrode ELT1, and the second alignment signal can be provided to the second electrode ELT2. At this time, the first alignment signal and the second alignment signal can have different waveforms, potentials, and / or phases. For example, the first alignment signal can be an AC signal, and the second alignment signal can be a ground signal. However, the disclosure is not limited to the above-described example. An electric field can be formed between (or on) the first electrode ELT1 and the second electrode ELT2, and the light emitting elements LD can be aligned between the first electrode ELT1 and the second electrode ELT2 based on the electric field. For example, the light emitting elements LD can move (or rotate) by a force according to the electric field (e.g., a dielectrophoresis (DEP) force), and can be aligned (or disposed) on the first alignment electrode ELTA and the second alignment electrode ELTG.

[0110] The light emitting elements LD can emit light based on the provided electric signals. For example, the light emitting elements LD can provide light based on a first electric signal (e.g., an anode signal) provided from the first connection electrode CNE1 and a second electric signal (e.g., a cathode signal) provided from the second connection electrode CNE2.

[0111] The first end EP1 of the light emitting element LD can be disposed adjacent to the first electrode ELT1, and the second end EP2 of the light emitting element LD can be disposed adjacent to the second electrode ELT2.

[0112] The light emitting element LD can be disposed in the opening OPN. The light emitting element LD can be disposed in the emission area EMA. The emission area EMA can include an area in which the light emitting element LD is disposed.

[0113] The connection electrode layer CNE can be disposed on the first end EP1 and the second end EP2 of the light emitting element LD. The first connection electrode CNE1 can be disposed on the first end EP1 of the light emitting element LD to be electrically connected to the first end EP1 of the light emitting element LD. The second connection electrode CNE2 can be disposed on the second end EP2 of the light emitting element LD to be electrically connected to the second end EP2 of the light emitting element LD.

[0114] According to an embodiment, the connection electrode layer CNE can include the first connection electrode CNE1 and the second connection electrode CNE2. The first connection electrode CNE1 can be an anode connection electrode AE, and the second connection electrode CNE2 can be a cathode connection electrode CE. According to an embodiment, the first connection electrode CNE1 can be electrically connected to the first electrode ELT1. The second connection electrode CNE2 can be electrically connected to the second electrode ELT2.

[0115] In a plan view, the shielding layer SHP can overlap the light emitting element LD. The shielding layer SHP can shield the light emitting element LD. The shielding layer SHP can cover the light emitting element LD.

[0116] The shielding layer SHP can be referred to as a cover layer or a transparent cover layer.

[0117] According to an embodiment, the shielding layer SHP can include an electrically conductive material. The shielding layer SHP can include a transparent conductive material. For example, the shielding layer SHP can include one or more of a group of indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). However, the present disclosure is not limited to the above-described examples.

[0118] In Figure 4In the embodiment, the range in which the shield layer SHP is provided is indicated by a dotted line frame. For example, the shield layer SHP can be provided in an area surrounded by the bank BNK (e.g., the opening OPN). Thus, the shield layer SHP can include a plurality of shield layers SHP provided in the respective emission areas EMA. However, the present disclosure is not limited thereto. For example, the shield layer SHP can be formed to extend throughout the entire display area DA. In this case, the shield layer SHP can be a structure deposited on the entire surface in the display area DA. For example, the shield layer SHP can be formed on the entire surface in the display area DA. Further, according to the embodiment, the shield layer SHP can at least partially overlap with the bank BNK in a plan view.

[0119] Referring to Figures 7 to 9 , a sensor portion TSP according to an embodiment is described.

[0120] Figure 7 is a schematic cross-sectional view illustrating a sensor portion TSP according to an embodiment. Figure 8 is a schematic plan view illustrating a sensing electrode SP according to an embodiment. Figure 8 is a schematic plan structure illustrating a region in which a first sensing electrode SP1 and a second sensing electrode SP2 are adjacent to each other. Figure 8 is a plan structure of a first sensing electrode SP1 and a second sensing electrode SP2 each having one shape according to an embodiment. Figure 9 is a schematic cross-sectional view illustrating a sensor portion TSP according to an embodiment. Figure 9 is a schematic cross-sectional structure taken along a line A-A' of Figure 8 and a cross-sectional structure taken along a line B-B' of Figure 8 .

[0121] Referring to Figures 7 to 9 , a sensor portion TSP can be provided on a transparent planarization layer TPO. The sensor portion TSP can include a sensor base layer SBSL, a first conductive pattern layer CP1, a sensor insulating layer SIN, a second conductive pattern layer CP2, and a protective layer PVX.

[0122] According to the embodiment, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be patterned in one region to form a sensing electrode SP. For example, a portion of the first conductive pattern layer CP1 can form a first sensing electrode SP1, and a portion of each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can form a second sensing electrode SP2. In an embodiment, a portion of the second conductive pattern layer CP2 can form a first sensing electrode SP1, and a portion of each of the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can form a second sensing electrode SP2. However, the present disclosure is not limited thereto.

[0123] The sensor base layer SBSL can be disposed on the transparent planarization layer TPO. The sensor base layer SBSL can provide an area in which the first conductive pattern layer CP1, the sensor insulating layer SIN, the second conductive pattern layer CP2, and the protective layer PVX are disposed.

[0124] The transparent planarization layer TPO can be a transparent planarization structure disposed on the light emitting element LD. Details regarding the transparent planarization layer TPO are described later.

[0125] The first conductive pattern layer CP1 can be disposed on the sensor base layer SBSL. The second conductive pattern layer CP2 can be disposed on the sensor insulating layer SIN. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be spaced apart from each other with the sensor insulating layer SIN interposed therebetween.

[0126] The first conductive pattern layer CP1 and the second conductive pattern layer CP2 can include a single layer or a plurality of metal layers. The first conductive pattern layer CP1 and the second conductive pattern layer CP2 can include at least one of various metal materials (including gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt)) or an alloy thereof. According to an embodiment, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can include at least one of various transparent conductive materials (including one of silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2)), carbon nanotubes, and graphene.

[0127] The sensor insulating layer SIN can be disposed on the first conductive pattern layer CP1. The sensor insulating layer SIN can be interposed between the first conductive pattern layer CP1 and the second conductive pattern layer CP2. The protective layer PVX can be disposed on the second conductive pattern layer CP2.

[0128] The sensor base layer SBSL can include an inorganic material. The sensor insulating layer SIN can include one or more of an inorganic material and an organic material. According to an embodiment, the protective layer PVX can include one or more of an inorganic material and an organic material. The inorganic material can include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ), and aluminum oxide (AlO xThe organic material can include one or more of the group of acrylic resins, epoxy resins, phenol resins, polyamide resins, and polyimide resins. However, the disclosure is not limited thereto.

[0129] The sensing electrode SP can include cells C and bridge portions BRD. The cells C can have a relatively large area, and the bridge portions BRD can have a relatively small area. The cells C adjacent to each other can be electrically connected by the bridge portions BRD. The cells C can include first cells C1 and second cells C2. The bridge portions BRD can include first bridge portions BRD1 and second bridge portions BRD2.

[0130] According to an embodiment, the first cells C1 and the second cells C2 can be formed of the second conductive pattern layer CP2. The first bridge portions BRD1 can be formed of the second conductive pattern layer CP2. A portion of the second bridge portions BRD2 can be formed of the first conductive pattern layer CP1, and another portion of the second bridge portions BRD2 can be formed of the second conductive pattern layer CP2.

[0131] However, the disclosure is not necessarily limited thereto. For example, the first cells C1 and the second cells C2 can be formed of the first conductive pattern layer CP1. The first bridge portions BRD1 can be formed of the first conductive pattern layer CP1. A portion of the second bridge portions BRD2 can be formed of the second conductive pattern layer CP2, and another portion of the second bridge portions BRD2 can be formed of the first conductive pattern layer CP1.

[0132] According to an embodiment, the sensing electrode SP can have a mesh structure MESH. The cells C and the bridge portions BRD can have the mesh structure. For example, the second conductive pattern layer CP2 for forming the sensing electrode SP can be patterned according to the mesh structure. Since the sensing electrode SP has the mesh structure, a capacitance that can be formed with other electrodes disposed under the cells C can be reduced.

[0133] The first sensing electrode SP1 can have a structure in which the first cell C1 having a relatively large area and the first bridge portion BRD1 having a relatively small area are connected. For example, the first cell C1 can include a (1-1)th cell C1-1 and a (1-2)th cell C1-2, and the first bridge portion BRD1 can electrically connect the (1-1)th cell C1-1 and the (1-2)th cell C1-2.

[0134] The second sensing electrode SP2 can have a structure in which the second cell C2 having a relatively large area and the second bridge portion BRD2 having a relatively small area are connected. For example, the second cell C2 can include a (2-1)th cell C2-1 and a (2-2)th cell C2-2, and the second bridge portion BRD2 can electrically connect the (2-1)th cell C2-1 and the (2-2)th cell C2-2.

[0135] According to an embodiment, the second bridge portion BRD2 can be electrically connected to the first (2-1) unit C2-1 through one contact portion CNT, and can be electrically connected to the first (2-2) unit C2-2 through another contact portion CNT. Accordingly, the second bridge portion BRD2 provided on a layer different from that of the second unit C2 can electrically connect the first (2-1) unit C2-1 and the first (2-2) unit C2-2 through the contact portions CNT. According to an embodiment, the contact portions CNT can pass through the sensor insulating layer SIN.

[0136] The first unit C1 and the second unit C2 can have an overall rhombic shape Figure 8 ). However, the shape of the first unit C1 and the second unit C2 is not particularly limited thereto. For example, the first unit C1 and the second unit C2 can have an overall quadrangular shape.

[0137] The first sensing electrode SP1 and the second sensing electrode SP2 can be adjacent to each other with the separation line SEL therebetween. The separation line SEL can be a dummy line provided in a region between the first sensing electrode SP1 and the second sensing electrode SP2. For example, the separation line SEL can be provided between the first (1-1) unit C1-1 and the first (2-1) unit C2-1. The separation line SEL can be provided between the first bridge portion BRD1 and the first (2-1) unit C2-1.

[0138] Referring to Figures 10 to 12 , a cross-sectional structure of a display apparatus DD including a transparent planarization layer TPO and a trace TRL according to an embodiment is described. Brief descriptions or repetitions of contents which can be repeated as described above are not repeated.

[0139] Figure 10 is a schematic cross-sectional view illustrating a display apparatus DD according to an embodiment. Figure 10 is a schematic cross-sectional view taken along a line C-C' of Figure 4 . Figure 11 is a schematic cross-sectional view illustrating an electrical connection structure of a trace TRL according to an embodiment. Figure 12 is a schematic cross-sectional view illustrating a display apparatus DD according to an embodiment. Figure 12 is a schematic cross-sectional view of a structure in which an outer portion OUP includes a color filter CF according to an embodiment.

[0140] Referring to Figure 10 and Figure 11 , a display apparatus DD can include a display portion DP and a sensor portion TSP on the display portion DP.

[0141] The display portion DP can include the pixel circuit PXC and the via layer VIA disposed on the display base layer DBSL. According to an embodiment, the display portion DP can further include the first power line PL1 providing a first power and the second power line PL2 providing a second power, the second power forming a voltage lower than the first power. According to an embodiment, the display portion DP can further include the backplane conductive layer SD. The backplane conductive layer SD can be one or more of the conductive layers disposed under the light emitting element LD. For example, the backplane conductive layer SD can be the source / drain conductive layer.

[0142] The display base layer DBSL can form a substrate on which the pixel circuit PXC is disposed. The pixel circuit PXC can include circuit elements configured to drive the sub-pixel SPX (or the light emitting element LD). For example, the pixel circuit PXC can include one or more transistors and one or more capacitors. The pixel circuit PXC can be electrically connected to the light emitting element LD through the contact portion passing at least partially through the via layer VIA.

[0143] The first power line PL1 and the second power line PL2 can be disposed on the display base layer DBSL. The first power line PL1 can be electrically connected to the pixel circuit PXC. The second power line PL2 can be electrically connected to the second electrode ELT2 and / or the second connection electrode CNE2.

[0144] The backplane conductive layer SD can form at least a portion of one or more of the pixel circuit PXC, the first power line PL1, and the second power line PL2. For example, a portion of the backplane conductive layer SD can form a source / drain electrode portion of a transistor included in the pixel circuit PXC.

[0145] The via layer VIA can be disposed on the pixel circuit PXC. The via layer VIA can be a passivation layer. The via layer VIA can include an organic material and can be a planarization layer. At least a portion of the lower contact portion CNA can be formed in the via layer VIA. The contact portion for electrically connecting the first power line PL1, the pixel circuit PXC, and the second power line PL2 to the light emitting element LD can be formed in the via layer VIA. For example, the pixel circuit PXC can be electrically connected to the first electrode ELT1, the first connection electrode CNE1, and the light emitting element LD through the contact portion passing through the via layer VIA. The second power line PL2 can be electrically connected to the second electrode ELT2, the second connection electrode CNE2, and the light emitting element LD through the contact portion passing through the via layer VIA.

[0146] The display portion DP can include an insulating pattern layer INP, first and second electrodes ELT1 and ELT2, a first insulating layer INS1, a bank BNK, a light emitting element LD, a second insulating layer INS2, first and second connection electrodes CNE1 and CNE2, a third insulating layer INS3, a shielding layer SHP, a trace TRL, a fourth insulating layer INS4, and a transparent planarization layer TPO.

[0147] The insulating pattern layer INP can be disposed on the via layer VIA. The insulating pattern layer INP can include a first insulating pattern portion and a second insulating pattern portion spaced apart from each other. According to embodiments, the insulating pattern layer INP can have various shapes. In embodiments, the insulating pattern layer INP can protrude in a thickness direction (e.g., the third direction DR3) of the display base layer DBSL.

[0148] The insulating pattern layer INP can form a step so that the light emitting element LD can be easily aligned in the emission area EMA. According to embodiments, the insulating pattern layer INP can be a partition wall. According to embodiments, the insulating pattern layer INP can include at least one of an organic material and / or an inorganic material. However, the present disclosure is not limited to the specific examples.

[0149] The first and second electrodes ELT1 and ELT2 can be disposed on the via layer VIA and the insulating pattern layer INP. The first electrode ELT1 can receive a first alignment signal and / or a first power through a first power line PL1. The second electrode ELT2 can receive a second alignment signal and / or a second power through a second power line PL2.

[0150] The first insulating layer INS1 can be disposed on the first and second electrodes ELT1 and ELT2 and the insulating pattern layer INP. The first insulating layer INS1 can include an inorganic material. For example, the first insulating layer INS1 can include one or more of a group of silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al x O y ), and titanium oxide (TiO x ). However, the present disclosure is not limited to the above examples.

[0151] The bank BNK can be disposed on the first insulating layer INS1. As described above, the bank BNK can form a space in which ink including the light emitting element LD can be received.

[0152] The light emitting element LD can be disposed (e.g., directly disposed) on the first insulating layer INS1 in an area surrounded by the bank BNK. According to an embodiment, the light emitting element LD can emit light based on an electrical signal (e.g., an anode signal and a cathode signal) provided from the first connection electrode CNE1 and the second connection electrode CNE2.

[0153] The second insulating layer INS2 can be disposed on the light emitting element LD. The second insulating layer INS2 can cover the active layer AL of the light emitting element LD. The second insulating layer INS2 can expose at least a portion of the light emitting element LD. For example, the second insulating layer INS2 can not cover the first end EP1 and the second end EP2 of the light emitting element LD, and thus the first end EP1 and the second end EP2 of the light emitting element LD can be exposed and can be electrically connected to the first connection electrode CNE1 and the second connection electrode CNE2, respectively. According to an embodiment, another portion of the second insulating layer INS2 can be disposed on the bank BNK and the first insulating layer INS1.

[0154] When the second insulating layer INS2 is formed on the light emitting element LD after the alignment of the light emitting element LD is completed, the light emitting element LD can be prevented from being separated from the alignment position.

[0155] The second insulating layer INS2 can have a single layer or a multi-layer structure. The second insulating layer INS2 can include at least one of a group of silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum nitride (AlN x ), aluminum oxide (Al x O y ), zirconium oxide (ZrO x ), hafnium oxide (HfO x ), and titanium oxide (TiO x ). However, the present disclosure is not limited to the above-described examples.

[0156] The first connection electrode CNE1 and the second connection electrode CNE2 can be disposed on the first insulating layer INS1 and the light emitting element LD. The first connection electrode CNE1 can be electrically connected to the first end EP1 of the light emitting element LD. The second connection electrode CNE2 can be electrically connected to the second end EP2 of the light emitting element LD.

[0157] The first connection electrode CNE1 can be electrically connected to the first electrode ELT1, and the second connection electrode CNE2 can be electrically connected to the second electrode ELT2. According to an embodiment, the first connection electrode CNE1 can not be electrically connected to the pixel circuit PXC through the first electrode ELT1. The second connection electrode CNE2 can not be electrically connected to the second power line PL2 through the second electrode ELT2.

[0158] According to an embodiment, the first connection electrode CNE1 and the second connection electrode CNE2 may be patterned simultaneously in the same process. However, the present disclosure is not limited to the above example. After patterning one of the first connection electrode CNE1 and the second connection electrode CNE2, the remaining connection electrode may be patterned.

[0159] The third insulating layer INS3 may be provided on the first insulating layer INS1, the second insulating layer INS2, the first and second connection electrodes CNE1 and CNE2, and the bank BNK. The third insulating layer INS3 may include an inorganic material. For example, the third insulating layer INS3 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al x O y ) and titanium oxide (TiO x However, the present disclosure is not limited to the above examples.

[0160] The third insulating layer INS3 may be disposed between the connection electrode layer CNE and the shielding layer SHP. For example, the third insulating layer INS3 may be disposed between the first connection electrode CNE1 and the shielding layer SHP. The third insulating layer INS3 may be disposed between the second connection electrode CNE2 and the shielding layer SHP.

[0161] The third insulating layer INS3 may electrically separate the first link electrode CNE1 and the shielding layer SHP.

[0162] A contact structure CH electrically connecting the second connection electrode CNE2 and the shielding layer SHP may be formed in the third insulating layer INS3. According to an embodiment, the contact structure CH may pass through the third insulating layer INS3. The contact structure CH may include the same conductive material as the shielding layer SHP. In a plan view, the contact structure CH may overlap with the second connection electrode CNE2 and the shielding layer SHP.

[0163] The third insulating layer INS3 may form a base on which the trace TRL is disposed. For example, the third insulating layer INS3 may contact the trace TRL.

[0164] The shielding layer SHP can be disposed between the light emitting element LD and the transparent planarization layer TPO. The shielding layer SHP can be disposed between the connection electrode layer CNE and the transparent planarization layer TPO. The shielding layer SHP can be disposed on the third insulating layer INS3. In a plan view, the shielding layer SHP can overlap the light emitting element LD. In a plan view, the shielding layer SHP can overlap the first connection electrode CNE1 and the second connection electrode CNE2.

[0165] The shielding layer SHP can reduce the risk that an electrical signal provided to the light emitting element LD is changed by electrical information generated from the sensor part TSP. For example, the shielding layer SHP can reduce the risk that a parasitic capacitance is generated due to a current formed based on a touch event generated in the sensor part TSP.

[0166] As described above, the shielding layer SHP can include a transparent conductive material and can transmit light provided by the light emitting element LD.

[0167] According to an embodiment, the shielding layer SHP can be electrically connected to the second connection electrode CNE2 through the contact structure CH. According to an embodiment, since the second connection electrode CNE2 can be electrically connected to the second power line PL2, a relatively low electric potential (or ground electric potential) can be formed in the shielding layer SHP. Accordingly, the shielding layer SHP can more effectively protect the light emitting element LD.

[0168] The trace TRL can be disposed on the third insulating layer INS3. The trace TRL can be disposed on the insulating pattern layer INP. In a plan view, the trace TRL can be disposed in an area surrounded by the bank BNK. However, the disclosure is not limited thereto.

[0169] The trace TRL can be disposed on the same layer as the shielding layer SHP and can be patterned in the same process. The trace TRL can include the same material as the shielding layer SHP. Accordingly, the trace TRL can include a transparent conductive material similar to the shielding layer SHP.

[0170] The trace TRL can be electrically connected to a part (e.g., the first conductive pattern layer CP1) of the sensor part TSP through the contact member CNP that at least partially passes through the transparent planarization layer TPO. According to an embodiment, the contact member CNP can pass through the fourth insulating layer INS4, the transparent planarization layer TPO, and the sensor base layer SBSL. Accordingly, an electrical signal provided to the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can move through the trace TRL formed in the display area DA.

[0171] According to an embodiment, the trace TRL can be electrically connected to the conductive pattern layer formed under the via layer VIA through the lower contact part CNA. For example, the trace TRL can be electrically connected to the backplane conductive layer SD through the lower contact part CNA. According to an embodiment, the lower contact part CNA can pass through the via layer VIA, the insulating pattern layer INP, the first insulating layer INS1, and the third insulating layer INS3. However, the present disclosure is not limited thereto. When the trace TRL and the backplane conductive layer SD are electrically connected to each other, the resistance formed in the trace TRL can be reduced, the risk of electrical signal distortion related to the touch input can be reduced, and thus the touch performance can be improved.

[0172] The fourth insulating layer INS4 can be disposed on the bank BNK, the third insulating layer INS3, the shield layer SHP, and the trace TRL. The fourth insulating layer INS4 can include an inorganic material. For example, the fourth insulating layer INS4 can include at least one of a group of silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al x O y ), and titanium oxide (TiO x ). However, the present disclosure is not limited to the above-described examples.

[0173] The transparent planarization layer TPO can be disposed on the fourth insulating layer INS4. The transparent planarization layer TPO can be disposed on the light emitting element LD. The transparent planarization layer TPO can be disposed on the shield layer SHP.

[0174] The transparent planarization layer TPO can be disposed between the light emitting element LD and the sensor part TSP. The transparent planarization layer TPO can cover the layer formed under the transparent planarization layer TPO, can have a relatively large thickness, and thus can compensate for a step generated due to the layer formed thereunder.

[0175] The transparent planarization layer TPO can include a transparent organic material. Thus, the light emitted by the light emitting element LD can pass through the transparent planarization layer TPO. The transparent planarization layer TPO can reduce the risk of generating a parasitic capacitance in the display part DP through the sensor part TSP.

[0176] According to an embodiment, since the transparent planarization layer TPO can have a relatively small refractive index, a low-refraction structure can be formed. Thus, the light emitting efficiency of the light emitting element LD can be improved, and the luminance characteristic of the display device DD can be improved.

[0177] According to an embodiment, the transparent planarization layer TPO can be formed based on an acrylic-based resin composition, and thus the transparent planarization layer TPO can include an acrylic-based resin. The transparent planarization layer TPO can be manufactured by forming the acrylic-based resin composition for forming the transparent planarization layer TPO on the display portion DP and then curing the acrylic-based resin composition. According to an embodiment, since the transparent planarization layer TPO is manufactured based on the acrylic-based resin composition, the transparent planarization layer TPO according to an embodiment can be formed to have a sufficient thickness, and can be patterned based on a photolithography process.

[0178] According to an embodiment, the acrylic-based resin composition can include an acrylic resin, an acrylic monomer, a photoinitiator, and a solvent.

[0179] The acrylic resin and the acrylic monomer can be materials included mainly in a solid content of the acrylic-based resin composition.

[0180] Examples of the acrylic resin are not particularly limited. The acrylic resin can be included in an amount of 6% by weight to 11% by weight based on the entire acrylic-based resin composition. According to an embodiment, the acrylic resin can have a weight average molecular weight of 5000 to 25000.

[0181] The acrylic monomer can include a multifunctional monomer. The multifunctional monomer can include one or more of tristrimethylolpropane triacrylate, tris(2-hydroxyethyl) isocyanurate triacrylate, and ethoxylated fluorene-type diacrylate. The acrylic monomer can be included in an amount of 2% by weight to 15% by weight based on the entire acrylic-based resin composition.

[0182] The photoinitiator can be prepared to initiate a reaction of the polymerized acrylic-based resin composition.

[0183] The photoinitiator can include one or more of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and 4-(dimethylamino)benzophenone. The photoinitiator can be included in an amount of 2% by weight to 15% by weight based on the entire acrylic-based resin composition.

[0184] The solvent can include an organic solvent. The solvent can be a material included other than the solid content of the acrylic-based resin composition. The solvent can include one or more of methyl 3-methoxypropionate and propylene glycol methyl ether acetate. The solvent can be included in an amount of 71% by weight to 91% by weight based on the entire acrylic-based resin composition.

[0185] The sensor part TSP can be provided on the transparent planarization layer TPO. For example, the sensor base layer SBSL can be provided on the transparent planarization layer TPO. Accordingly, the sensor part TSP can be manufactured after the display part DP is manufactured by patterning layers on the display part DP. For example, as described above, the first conductive pattern layer CP1 and the second conductive pattern layer CP2 can be patterned, the sensor insulating layer SIN can be formed between the first conductive pattern layer CP1 and the second conductive pattern layer CP2, and the protective layer PVX can be provided on the second conductive pattern layer CP2.

[0186] Reference Figure 12 The outer part OUP can be provided on the sensor part TSP.

[0187] According to an embodiment, the sub-pixel SPX can form a sub-pixel area SPXA in which light of one color is provided. The sub-pixel SPX can include a first sub-pixel SPX1 to a third sub-pixel SPX3. For example, the first sub-pixel SPX1 can be a red pixel that emits light of a red color (e.g., a first color), the second sub-pixel SPX2 can be a green pixel that emits light of a green color (e.g., a second color), and the third sub-pixel SPX3 can be a blue pixel that emits light of a blue color (e.g., a third color). The red pixel can provide light of a wavelength band of 600 nm to 750 nm. The green pixel can provide light of a wavelength band of 480 nm to 560 nm. The blue pixel can provide light of a wavelength band of 370 nm to 460 nm.

[0188] The sub-pixel area SPXA can include a first sub-pixel area SPXA1 that provides light of a first color as an area defined by the first sub-pixel SPX1, a second sub-pixel area SPXA2 that provides light of a second color as an area defined by the second sub-pixel SPX2, and a third sub-pixel area SPXA3 that provides light of a third color as an area defined by the third sub-pixel SPX3.

[0189] The light emitting element LD can include a first light emitting element LD1 included in the first sub-pixel SPX1 and provided in the first sub-pixel area SPXA1, a second light emitting element LD2 included in the second sub-pixel SPX2 and provided in the second sub-pixel area SPXA2, and a third light emitting element LD3 included in the third sub-pixel SPX3 and provided in the third sub-pixel area SPXA3.

[0190] The light emitting elements LD can be configured to emit different colors of light for each of the sub-pixels SPX. For example, the first light emitting element LD1 can be configured to emit a first color of light. The second light emitting element LD2 can be configured to emit a second color of light. The third light emitting element LD3 can be configured to emit a third color of light.

[0191] According to an embodiment, the outer portion OUP can include a color filter CF.

[0192] The color filter CF can include a first color filter CF1 disposed in the first sub-pixel area SPXA1, a second color filter CF2 disposed in the second sub-pixel area SPXA2, and a third color filter CF3 disposed in the third sub-pixel area SPXA3.

[0193] At least a portion of the first color filter CF1 can be disposed in the first sub-pixel area SPXA1. The first color filter CF1 can include a color filter material (e.g., a dye or a pigment) that selectively transmits light of a first color (e.g., red). The light of the first color provided by the first light emitting element LD1 can pass through the first color filter CF1 and can be provided to the outside.

[0194] At least a portion of the second color filter CF2 can be disposed in the second sub-pixel area SPXA2. The second color filter CF2 can include a color filter material (e.g., a dye or a pigment) that selectively transmits light of a second color (e.g., green). The light of the second color provided by the second light emitting element LD2 can pass through the second color filter CF2 and can be provided to the outside.

[0195] At least a portion of the third color filter CF3 can be disposed in the third sub-pixel area SPXA3. The third color filter CF3 can include a color filter material (e.g., a dye or a pigment) that selectively transmits light of a third color (e.g., blue). The light of the third color provided by the third light emitting element LD3 can pass through the third color filter CF3 and can be provided to the outside.

[0196] According to an embodiment, a non-sub-pixel area in which light of one of the colors can not be visible can be formed between the sub-pixel areas SPXA. According to an embodiment, in the non-sub-pixel area, the first color filter CF1, the second color filter CF2, and the third color filter CF3 can overlap in a plan view, and thus a light blocking structure LBS can be formed.

[0197] According to an embodiment, the color filter CF can be relatively disposed outside of the sensor portion TSP based on a display direction (e.g., the third direction DR3) of the display device DD, and thus an external light reflection characteristic of the display device DD can be improved.

[0198] According to an embodiment, an additional protective layer can be formed on the color filter CF, and according to an embodiment, a window or a functional film (e.g., an anti-reflection film, etc.) can be further provided.

[0199] Hereinafter, an electronic device 1000 including a display device 1060 according to an embodiment will be described.

[0200] Figure 13 is a schematic block diagram illustrating an electronic device 1000 including a display device 1060 according to an embodiment. Figure 14 is a schematic diagram illustrating an example in which the electronic device 1000 of Figure 13 is implemented as a smart phone. Figure 15 is a schematic diagram illustrating an example in which the electronic device 1000 of Figure 13 is implemented as a tablet computer.

[0201] Referring to Figures 13 to 15 , the electronic device 1000 can include a processor 1010, a memory device 1020, a storage device 1030, an input / output (I / O) device 1040, a power supply 1050, and a display device 1060. The display device 1060 can be a display device DD of Figure 1 . The electronic device 1000 can further include various ports for communication with a video card, a sound card, a memory card, a USB device, or other systems. In an embodiment, as shown in Figure 14 , the electronic device 1000 can be a smart phone. In an embodiment, as shown in Figure 15 , the electronic device 1000 can be a tablet computer. However, the above examples are illustrative, and the electronic device 1000 is not necessarily limited to the above examples. For example, the electronic device 1000 can be a cellular phone, a video phone, a smart pad, a smart watch, a navigation device of a vehicle, a computer monitor, a laptop computer, a head-mounted display device, etc.

[0202] The processor 1010 can perform a specific computation or task. In an embodiment, the processor 1010 can include at least one of a central processing unit, an application processor, a graphic processing unit, a communication processor, an image signal processor, a controller, etc. The processor 1010 can be connected to other components through an address bus, a control bus, a data bus, etc. In an embodiment, the processor 1010 can be connected to an extension bus, such as a peripheral component interconnect (PCI) bus. In an embodiment, the processor 1010 can provide input image data to the display device 1060. Accordingly, the display device 1060 can display an image based on the input image data provided from the processor 1010.

[0203] The memory device 1020 can store data required to perform operations of the electronic device 1000. The memory device 1020 can be used as a working memory and / or a buffer memory of the processor 1010. For example, the memory device 1020 can include one or more volatile memory devices such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, and a mobile DRAM device.

[0204] The storage device 1030 can store data in response to a control signal or data from the processor 1010. The storage device 1030 can include one or more non-volatile memories to maintain data even when the electronic device 1000 is powered off. In some embodiments, the storage device 1030 can include a solid state drive (SSD), a hard disk drive (HDD), a CD-ROM, and the like.

[0205] The I / O device 1040 can include input devices such as a keyboard, a keypad, a touchpad, a touchscreen, and a mouse, and output devices such as a speaker and a printer. In an embodiment, the display device 1060 can be integrated with the I / O device 1040.

[0206] The power supply 1050 can provide power required to perform operations of the electronic device 1000. For example, the power supply 1050 can include a power management integrated circuit (PMIC). In an embodiment, the power supply 1050 can provide power to the display device 1060.

[0207] The display device 1060 can display an image in response to an image data signal and / or a control signal from the processor 1010. The display device 1060 can be connected to other components through a bus or other communication link.

[0208] As described above, although the present disclosure has been described with reference to the above embodiments, it will be understood by those skilled in the art or those having ordinary knowledge in the art that various modifications and changes can be made to the present disclosure without departing from the spirit and technical scope of the present disclosure to be described in the appended claims.

[0209] Accordingly, the technical scope of the present disclosure should not be limited to what is described in the detailed description of the specification, but should be defined by the claims.

Claims

1. A display device, comprising: a display portion configured to emit light; and a sensor portion provided on the display portion and including a sensing electrode, wherein the display portion includes: a first electrode and a second electrode spaced apart from each other; a light emitting element provided between the first electrode and the second electrode in a plan view and including a first end and a second end; a first connection electrode electrically connected to the first end; a second connection electrode electrically connected to the second end; a shield layer overlapping the light emitting element in a plan view; and a transparent planarization layer provided on the shield layer.

2. The display device of claim 1, wherein, The shield layer and the transparent planarization layer are provided between the light emitting element and the sensor portion.

3. The display device of claim 1, wherein, The display portion further includes a display base layer and a bank protruding in a thickness direction of the display base layer, and the shield layer is provided in an area surrounded by the bank. 4.The display device according to claim 1, further comprising: a display region and a non-display region surrounding at least a portion of the display region, wherein the shield layer is entirely provided on an entire surface in the display region.

5. The display device of claim 1, wherein, The shield layer is electrically connected to the second connection electrode, the display portion further includes a first power line providing a first electric power and a second power line providing a second electric power, the second electric power forming a voltage lower than that of the first electric power, the second connection electrode is electrically connected to the second power line, and the shield layer is electrically separated from the first connection electrode.

6. The display device of claim 1, wherein, The shield layer includes a transparent conductive material.

7. The display device of claim 1, wherein, The transparent planarization layer includes an acrylic-based resin, the transparent planarization layer is manufactured based on an acrylic-based resin composition, the acrylic-based resin composition includes an acrylic resin, an acrylic monomer, a photoinitiator, and a solvent, the acrylic resin is included in an amount of 6% by weight to 11% by weight based on the entire acrylic-based resin composition, the acrylic monomer is included in an amount of 2% by weight to 15% by weight based on the entire acrylic-based resin composition, the photoinitiator is included in an amount of 2% by weight to 15% by weight based on the entire acrylic-based resin composition, the solvent is included in an amount of 71% by weight to 91% by weight based on the entire acrylic-based resin composition, the acrylic resin has a weight average molecular weight of 5000 to 25000, the acrylic monomer includes one or more of a cyclic trihydroxymethyl propane acrylate, a tris (2-hydroxyethyl) isocyanurate triacrylate, and an ethoxylated fluorene type diacrylate, the photoinitiator includes one or more of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and 4-(dimethylamino) benzophenone, and the solvent includes one or more of methyl 3-methoxypropionate and propylene glycol methyl ether acetate. 8.The display device according to claim 1, further comprising: a display region and a non-display region surrounding at least a portion of the display region, wherein the display portion further includes a trace electrically connected to at least a portion of the sensing electrode through a contact member, at least a portion of the contact member passing through the transparent planarization layer, at least a portion of the trace is disposed in the display area, the shield layer and the trace include the same material.

9. The display device of claim 8, wherein, the display portion further includes a display base layer and a bank protruding in a thickness direction of the display base layer, and in a plan view, the trace does not overlap the bank.

10. The display device of claim 8, wherein, the display portion further includes a backplane conductive layer disposed below the light emitting element, and the backplane conductive layer is electrically connected to the trace.

11. The display device according to claim 1, further comprising: color filters disposed on the sensor portion and respectively transmitting light of one color, wherein the light emitting element includes an inorganic material, and the display device further includes: a first sub-pixel area providing light of a first color; a second sub-pixel area providing light of a second color; and a third sub-pixel area providing light of a third color; and the display device further includes: a plurality of light emitting elements including the light emitting element, the plurality of light emitting elements including a first light emitting element disposed in the first sub-pixel area and providing the light of the first color, a second light emitting element disposed in the second sub-pixel area and providing the light of the second color, and a third light emitting element disposed in the third sub-pixel area and providing the light of the third color.

12. A display device comprising: a display area and a non-display area surrounding at least a portion of the display area; a display portion including: a first electrode; a second electrode; a light emitting element disposed between the first electrode and the second electrode in a plan view; and a trace; and a sensor portion disposed on the display portion and including a sensing electrode, wherein at least a portion of the sensing electrode is electrically connected to the trace, and the trace is disposed in the display area.

13. An electronic device comprising: a processor configured to provide input image data; a display device configured to display an image based on the input image data, the display device including a sub-pixel area; and a power supply configured to provide power to the display device, wherein the display device includes: a display portion configured to emit light; and a sensor portion disposed on the display portion and including a sensing electrode, wherein the display portion includes: a first electrode and a second electrode spaced apart from each other; a light emitting element disposed between the first electrode and the second electrode in a plan view and including a first end and a second end; a first connection electrode electrically connected to the first end; a second connection electrode electrically connected to the second end; a shield layer overlapping the light emitting element in a plan view; and a transparent planarization layer disposed on the shield layer.

Images