Preparation method and device of carving plate, electronic equipment and readable storage medium

Abstract

The invention provides a preparation method and device of an engraving plate, electronic equipment and a readable storage medium, relates to the technical field of laser engraving, and solves the problem that a current engraving plate-making pattern cannot meet high reduction quality and high efficiency at the same time. The preparation method comprises the following steps: controlling laser to engrave at a first engraving position by adopting a first engraving parameter based on a first part pattern; and based on the second part pattern, laser is controlled to conduct engraving at the second engraving position through a second engraving parameter, the engraving plate is obtained, and the first engraving parameter is different from the second engraving parameter. According to the method provided by the invention, the first carving position pattern close to the layout is carved at low power and low speed; and the lower second engraving position area is engraved by adopting high power, so that the overall engraving speed is increased while the reduction quality of pattern plate grains is improved, chemical cleaning is replaced by laser cleaning on a recast layer and an engraving surface, and green and environment-friendly engraving plate making is realized.

Description

Technical Field

[0001] This invention relates to the field of laser engraving technology, and more specifically, to a method, apparatus, electronic device, and readable storage medium for preparing an engraving plate. Background Technology

[0002] In the process of carving 3D patterns, the carving parameters are usually kept constant for patterns of different depths. This means that the same set of carving parameters is used for patterns of different depths, which makes it impossible to simultaneously achieve carving efficiency and pattern reproduction quality. For example, if the carving speed is too high, while carving efficiency can be guaranteed, the pattern reproduction quality will decrease. If the carving speed is too low, the carving rate will be slow. Summary of the Invention

[0003] The present invention aims to at least solve the problem that current engraving and plate making methods cannot simultaneously achieve high reproduction quality and high efficiency.

[0004] Therefore, a first aspect of the present invention provides a method for preparing an engraved plate.

[0005] A second aspect of the present invention provides an apparatus for preparing an engraved plate.

[0006] A third aspect of the present invention provides an electronic device.

[0007] A fourth aspect of the present invention provides a readable storage medium.

[0008] The first aspect of the present invention provides a method for preparing an engraved plate, comprising: obtaining a three-dimensional engraved pattern; analyzing the three-dimensional engraved pattern and determining a first part pattern and a second part pattern of the three-dimensional engraved pattern, wherein the first part pattern is a pattern with a depth less than a preset depth, and the second part pattern is a pattern with a depth greater than or equal to the preset depth; determining a first engraving position on a substrate based on the first part pattern, and controlling a laser to engrave at the first engraving position using a first engraving parameter; determining a second engraving position on the substrate based on the second part pattern, and controlling a laser to engrave at the second engraving position using a second engraving parameter, wherein the first engraving parameter and the second engraving parameter are different; determining a recast layer and an engraved surface on the engraved substrate, and controlling a laser to clean the recast layer and the engraved surface using a third engraving parameter to obtain an engraved plate.

[0009] The method for preparing an engraved plate provided by this invention first obtains a three-dimensional engraved pattern, then analyzes the three-dimensional engraved pattern using three-dimensional design software, and determines a first part and a second part of the three-dimensional engraved pattern. The first part of the pattern has a depth less than a preset depth, and the second part has a depth greater than or equal to the preset depth. Then, for the first part of the pattern, engraving is performed on the corresponding position on the substrate using a first engraving parameter. For the second part of the pattern, engraving is performed on the corresponding position on the substrate using a second engraving parameter. Because the first and second engraving parameters are different, this method allows for a balance between engraving efficiency and pattern reproduction quality. For example, for the first part of the pattern with a depth less than the preset depth, i.e., the pattern close to the printing surface, low power and low speed are used for engraving. For the second part of the pattern with a depth greater than or equal to the preset depth, i.e., the area lower than the printing surface and with a relatively smaller impact on printing reproduction quality, high power and high speed are used for engraving. This improves both the printing reproduction quality and the overall engraving speed. Compared to using low power and low speed throughout the process, the engraving efficiency is higher; compared to using high power and high speed throughout the process, the pattern engraving reproduction quality is better.

[0010] Furthermore, during the high-power engraving process, under the influence of heat, metals and metal oxides will be recast onto the substrate to form a recast layer. Therefore, after engraving, the recast layer and the engraved surface on the substrate are determined. The engraved surface is the engraved surface formed by the first and second engraving parameters. The laser is controlled to clean the recast layer and the engraved surface using the third engraving parameter. This can remove the recast layer and residues, and also obtain a clean substrate and a specific roughness of the engraved surface.

[0011] The preset depth is determined based on printing process requirements, laser engraving characteristics, substrate material characteristics, and / or experimental data.

[0012] In some technical solutions, optionally, the first engraving parameters include a first spot diameter, a first total laser power, and a first engraving speed, and the second engraving parameters include a second spot diameter, a second total laser power, and a second engraving speed, wherein the first spot diameter is smaller than the second spot diameter, the first total laser power is smaller than the second total laser power, and the first engraving speed is smaller than the second engraving speed.

[0013] In this technical solution, the first part of the pattern with a depth less than the preset depth, i.e., the pattern close to the printing plate, is engraved using low power and low speed. The second part of the pattern with a depth greater than or equal to the preset depth, i.e., the area lower than the printing plate and with a relatively smaller impact on print quality, is engraved using high power and high speed. This improves both print quality and overall engraving speed. Compared to using low power and low speed throughout, the engraving efficiency is higher; compared to using high power and high speed throughout, the print quality is better.

[0014] Of course, depending on different needs, the first engraving speed can be greater than the second engraving speed, meaning the engraving speed for patterns closer to the surface of the plate is faster. This avoids material ablation or expansion of the heat-affected zone due to over-engraving in shallow areas. Similarly, the total power of the first laser can be greater than the total power of the second laser, and the diameter of the first laser spot can be greater than the diameter of the second laser spot, thereby appropriately increasing the engraving speed in shallow areas.

[0015] In some technical solutions, the third engraving parameters may optionally include the third spot diameter, the third total laser power, and the third engraving speed, wherein the third spot diameter is larger than the second spot diameter, the third total laser power is smaller than the second total laser power, and the third engraving speed is greater than the first engraving speed.

[0016] In this technical solution, the third engraving parameter employs low power and high speed to ensure a more precise surface roughness. Furthermore, the third laser spot diameter is larger than the second laser spot diameter, meaning the third spot diameter is the largest, which allows for better removal of surface impurities, thus increasing the cleaning speed. The third engraving speed can be greater than the second engraving speed to improve the cleaning of the recast layer and the engraved surface. However, depending on the location of the recast layer, for shallow, damaged recast layers, the third engraving speed can be lower than the second engraving speed to ensure that the pattern reproduction quality in the shallow area is not compromised. Depending on the requirements, the total power of the third laser can be greater than the total power of the first laser, or it can be chosen to be less than the total power of the first laser.

[0017] In some technical solutions, optionally, the diameter of the first light spot is greater than or equal to 5 micrometers and less than or equal to 20 micrometers, the diameter of the third light spot is greater than or equal to 40 micrometers, and the diameter of the second light spot is greater than 20 micrometers and less than 40 micrometers.

[0018] In this technical solution, depending on the different substrates and different three-dimensional engraving patterns, the diameters of the first, second, and third light spots can be the same or different. For example, the diameter of the first light spot is 15 micrometers, the diameter of the third light spot is 60 micrometers, and the diameter of the second light spot is 30 micrometers.

[0019] In some technical solutions, optionally, the first engraving speed is greater than or equal to 1000 mm / s and less than or equal to 1500 mm / s; optionally, the first engraving speed is greater than or equal to 1000 mm / s and less than or equal to 1200 mm / s; the second engraving speed is greater than or equal to 2000 mm / s and less than or equal to 3000 mm / s; optionally, the second engraving speed is greater than or equal to 2000 mm / s and less than or equal to 2500 mm / s; and the third engraving speed is greater than or equal to 2000 mm / s and less than or equal to 5000 mm / s. Alternatively, the third engraving speed is greater than or equal to 3000 mm / s and less than or equal to 5000 mm / s. Depending on the substrate and the different three-dimensional engraving patterns, for example, the first engraving speed is equal to 1000 mm / s or 1200 mm / s, the third engraving speed is equal to 3000 mm / s, 3500 mm / s, or 4000 mm / s, and the second engraving speed is equal to 2500 mm / s or 2000 mm / s.

[0020] In some technical solutions, the diameters of the first, second, and third light spots are optionally related to the spacing of the engraving fill lines of the three-dimensional engraving pattern, which can significantly affect processing efficiency, surface quality, and detail representation.

[0021] Specifically, the spot diameter can be equal to the line spacing, achieving seamless coverage and high surface uniformity, suitable for shallow carvings requiring a smooth surface. The spot diameter can also be smaller than the fill line spacing, leaving unprocessed areas between adjacent paths, creating textured or mesh-like effects and reducing repeated laser irradiation. The spot diameter can also be larger than the fill line spacing, suitable for deep carvings requiring high energy accumulation, such as mold grooves.

[0022] In some technical solutions, the substrate may optionally be a metal plate, a metal convex plate, a metal concave plate, or a roller.

[0023] In some technical solutions, the laser may optionally be a femtosecond laser, a picosecond laser, or a fiber laser.

[0024] In this technical solution, by limiting the laser type to ultrafast laser (femtosecond / picosecond) or fiber laser, the solution can achieve high-precision, high-efficiency or low-cost engraving effects on different materials (such as metal, glass, and plastic).

[0025] In some technical solutions, optionally, the single-path laser power is greater than or equal to 10W and less than or equal to 50W.

[0026] In this technical solution, the single-path laser power is greater than or equal to 10W and less than or equal to 50W, optionally greater than or equal to 20W and less than or equal to 40W. Each laser spot is composed of multiple laser beams; the larger the spot diameter, the more lasers are used. The total laser power is the product of the single-path laser power and the number of lasers.

[0027] In some technical solutions, optionally, the roughness of the engraved surface of the engraving plate is greater than or equal to 0.05 micrometers and less than or equal to 0.6 micrometers.

[0028] In this technical solution, the roughness of the engraved surface of the engraving plate is greater than or equal to 0.05 micrometers and less than or equal to 0.6 micrometers. For example, it can be 0.1 micrometers or 0.5 micrometers, which can further improve the efficiency of subsequent surface treatment processes.

[0029] A second aspect of the present invention provides an apparatus for preparing an engraved plate, comprising: a laser for emitting laser light; a galvanometer connected to the laser for adjusting the direction of the laser light so that the laser light can engrave at different positions on the surface of a substrate; a focusing lens connected to the galvanometer for focusing the laser light emitted by the galvanometer into a spot; a light field control module connected to the laser for controlling the amount of laser light emitted by the laser and for controlling the power of a single-path laser light to adjust the diameter of the spot and the total power of the spot laser light, the light field control module also being used to adjust the engraving speed of the laser; and a controller connected to the light field control module for controlling the operation of the light field control module to realize the engraved plate preparation method of any of the technical solutions of the first aspect of the present invention.

[0030] A third aspect of the present invention provides an electronic device, including a memory and a processor, wherein the memory stores a computer program or instructions, and the processor executes the computer program or instructions to implement the method for preparing an engraved plate as provided in any of the technical solutions of the first aspect of this application.

[0031] The fourth aspect of the present invention provides a readable storage medium storing a program or instructions, wherein when a processor executes the program or instructions, it implements the method for preparing an engraved plate as provided in any of the technical solutions of the first aspect of this application.

[0032] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0033] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 A schematic flowchart of the method for preparing the engraved plate according to an embodiment of the present invention is shown; Figure 2A schematic diagram of the structure of the engraving plate preparation apparatus according to an embodiment of the present invention is shown; Figure 3 A schematic diagram of the structure of an electronic device according to an embodiment of the present invention is shown; Figure 4 One of the schematic diagrams illustrating the method for preparing an engraved plate according to an embodiment of the present invention is shown; Figure 5 The second schematic diagram illustrates the principle of the method for preparing the engraved plate according to an embodiment of the present invention.

[0034] in, Figures 2 to 5 The correspondence between the reference numerals and component names in the attached drawings is as follows: 1. Engraving plate preparation apparatus, 11. Laser, 12. Galvanometer, 13. Focusing lens, 14. Light field control module, 15. Controller, 16. Moving platform, 17. Charge-coupled device camera, 18. Polarizing beam splitter, 19. Reflector, 2. Substrate, 3. Three-dimensional engraved pattern, 31. First part of the pattern, 32. First engraved surface, 33. Second part of the pattern, 34. Second engraved surface, 700. Electronic equipment, 701. Processor, 702. Memory. Detailed Implementation

[0035] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0036] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0037] like Figure 1 As shown, this embodiment provides a method for preparing an engraved plate, including: S102: Obtain the 3D engraved pattern; S104: Analyze the three-dimensional engraved pattern and determine the first part of the pattern and the second part of the pattern, wherein the first part of the pattern is a pattern with a depth less than a preset depth, and the second part of the pattern is a pattern with a depth greater than or equal to the preset depth. S106: Based on the first part of the pattern, determine the first engraving position on the substrate, and control the laser to engrave at the first engraving position using the first engraving parameters; S108: Based on the second part of the pattern, a second engraving position is determined on the substrate, and the laser is controlled to engrave at the second engraving position using the second engraving parameters; wherein the first engraving parameters and the second engraving parameters are different; S110: Determine the recast layer and engraved surface on the engraved substrate, and control the laser to clean the recast layer and engraved surface using the third engraving parameters to obtain the engraved plate.

[0038] The method for preparing an engraved plate provided by this invention first obtains a three-dimensional engraved pattern, then analyzes the three-dimensional engraved pattern using three-dimensional design software, and determines a first part and a second part of the three-dimensional engraved pattern. The first part of the pattern has a depth less than a preset depth, and the second part has a depth greater than or equal to the preset depth. The preset depth is determined based on actual conditions, for example, greater than or equal to 0.1 cm and less than or equal to 1 cm. Then, for the first part of the pattern, engraving is performed on the corresponding position on the substrate using first engraving parameters. For the second part of the pattern, engraving is performed on the corresponding position on the substrate using second engraving parameters. Because the first and second engraving parameters are different, this method allows for a balance between engraving efficiency and pattern reproduction quality. For example, for the first part of the pattern with a depth less than the preset depth, i.e., the pattern close to the plate surface, low power and low speed engraving are used. For the second part of the pattern with a depth greater than or equal to the preset depth, i.e., the area lower than the plate surface and with a relatively small impact on printing reproduction quality, high power and high speed engraving are used. This improves both the printing reproduction quality and the overall engraving speed. Compared to using low power and low speed throughout the process, the engraving efficiency is high; compared to using high power and high speed throughout the process, the pattern engraving reproduction quality is better.

[0039] Furthermore, during the high-power engraving process, under the influence of heat, metals and metal oxides will be recast onto the substrate surface to form a recast layer. Therefore, after engraving, the recast layer and the engraved surface on the substrate are determined. The engraved surface is the engraved surface formed by the first and second engraving parameters. The laser is controlled to clean the recast layer and the engraved surface using the third engraving parameter. This can remove the recast layer and residues, and also obtain a clean surface and a specific roughness of the engraved surface.

[0040] In the step of determining the first part of the three-dimensional engraved pattern and the second part of the pattern, the depth values ​​of each point on the surface of the three-dimensional engraved pattern relative to a preset reference plane can be extracted first. The preset reference plane can be the surface of the substrate. Based on the depth values, the engraving depth corresponding to each point on the surface of the three-dimensional engraved pattern is determined. A preset depth is set, and the pattern surface area with an engraving depth less than the preset depth is determined as the first part of the pattern. The pattern surface area with an engraving depth greater than or equal to the preset depth is determined as the second part of the pattern.

[0041] In some technical solutions, optionally, the first engraving parameters include a first spot diameter, a first total laser power, and a first engraving speed, and the second engraving parameters include a second spot diameter, a second total laser power, and a second engraving speed, wherein the first spot diameter is smaller than the second spot diameter, the first total laser power is smaller than the second total laser power, and the first engraving speed is smaller than the second engraving speed.

[0042] In this technical solution, the first part of the pattern with a depth less than the preset depth, i.e., the pattern close to the printing plate, is engraved using low power and low speed. The second part of the pattern with a depth greater than or equal to the preset depth, i.e., the area lower than the printing plate and with a relatively smaller impact on print quality, is engraved using high power and high speed. This improves both print quality and overall engraving speed. Compared to using low power and low speed throughout, the engraving efficiency is higher; compared to using high power and high speed throughout, the print quality is better.

[0043] Of course, depending on different needs, the first engraving speed can be greater than the second engraving speed, meaning the engraving speed for patterns closer to the surface of the plate is faster. This avoids material ablation or expansion of the heat-affected zone due to over-engraving in shallow areas. Similarly, the total power of the first laser can be greater than the total power of the second laser, and the diameter of the first laser spot can be greater than the diameter of the second laser spot, thereby appropriately increasing the engraving speed in shallow areas.

[0044] Furthermore, after cleaning using the third engraving parameter, the surface roughness Ra of the engraved surface is measured; based on the roughness Ra, it is determined whether repeated cleaning is necessary. For example, if Ra is greater than the first roughness, this will cause poor ink transfer; therefore, the third engraving speed is reduced and cleaning is repeated to improve ink transfer efficiency. If Ra is less than the second roughness, this will lead to decreased ink adhesion; therefore, the total power of the third laser is increased and cleaning is repeated to improve ink adhesion. The first roughness can be 0.6 μm-0.8 μm, and the second roughness can be 0.05 μm-0.1 μm.

[0045] In some technical solutions, the third engraving parameters may optionally include the third spot diameter, the third total laser power, and the third engraving speed, wherein the third spot diameter is larger than the second spot diameter, the third total laser power is smaller than the second total laser power, and the third engraving speed is greater than the first engraving speed.

[0046] In this technical solution, the third engraving parameter employs low power and high speed to ensure a more precise surface roughness. Furthermore, the third laser spot diameter is larger than the second laser spot diameter, meaning the third spot diameter is the largest, which allows for better removal of surface impurities, thus increasing the cleaning speed. The third engraving speed can be greater than the second engraving speed to improve the cleaning of the recast layer and the engraved surface. However, depending on the location of the recast layer, for shallow, damaged recast layers, the third engraving speed can be lower than the second engraving speed to ensure that the pattern reproduction quality in the shallow area is not compromised. Depending on the requirements, the total power of the third laser can be greater than the total power of the first laser, or it can be chosen to be less than the total power of the first laser.

[0047] In some technical solutions, optionally, the diameter of the first light spot is greater than or equal to 5 micrometers and less than or equal to 20 micrometers, the diameter of the third light spot is greater than or equal to 40 micrometers, and the diameter of the second light spot is greater than 20 micrometers and less than 40 micrometers.

[0048] In this technical solution, depending on the different substrates and different three-dimensional engraving patterns, the diameters of the first, second, and third light spots can be the same or different. For example, the diameter of the first light spot is 15 micrometers, the diameter of the third light spot is 60 micrometers, and the diameter of the second light spot is 30 micrometers.

[0049] In some technical solutions, optionally, the first engraving speed is greater than or equal to 1000 mm / s and less than or equal to 1500 mm / s; optionally, the first engraving speed is greater than or equal to 1000 mm / s and less than or equal to 1200 mm / s; the second engraving speed is greater than or equal to 2000 mm / s and less than or equal to 3000 mm / s; optionally, the second engraving speed is greater than or equal to 2000 mm / s and less than or equal to 2500 mm / s; and the third engraving speed is greater than or equal to 2000 mm / s and less than or equal to 5000 mm / s. Alternatively, the third engraving speed is greater than or equal to 3000 mm / s and less than or equal to 5000 mm / s. Depending on the substrate and the different three-dimensional engraving patterns, for example, the first engraving speed is equal to 1000 mm / s or 1200 mm / s, the third engraving speed is equal to 3000 mm / s, 3500 mm / s, or 4000 mm / s, and the second engraving speed is equal to 2500 mm / s or 2000 mm / s.

[0050] In some technical solutions, the diameters of the first, second, and third light spots are optionally related to the spacing of the engraving fill lines of the three-dimensional engraving pattern, which can significantly affect processing efficiency, surface quality, and detail representation.

[0051] Specifically, the spot diameter can be equal to the line spacing, achieving seamless coverage and high surface uniformity, suitable for shallow carvings requiring a smooth surface. The spot diameter can also be smaller than the fill line spacing, leaving unprocessed areas between adjacent paths, creating textured or mesh-like effects and reducing repeated laser irradiation. The spot diameter can also be larger than the fill line spacing, suitable for deep carvings requiring high energy accumulation, such as mold grooves.

[0052] In some technical solutions, the substrate may optionally include a metal plate, a metal protrusion, a metal concave plate, or a roller.

[0053] In some technical solutions, the laser may optionally be a femtosecond laser, a picosecond laser, or a fiber laser.

[0054] In this technical solution, by limiting the laser type to ultrafast laser (femtosecond / picosecond) or fiber laser, the solution can achieve high-precision, high-efficiency or low-cost engraving effects on different materials (such as metal, glass, and plastic).

[0055] In some technical solutions, optionally, the single-path laser power is greater than or equal to 10W and less than or equal to 50W.

[0056] In this technical solution, the single-path laser power is greater than or equal to 10W and less than or equal to 50W, optionally greater than or equal to 20W and less than or equal to 40W. Each laser spot is composed of multiple laser beams; the larger the spot diameter, the more lasers are used. The total laser power is the product of the single-path laser power and the number of lasers.

[0057] In some technical solutions, optionally, the roughness of the engraved surface of the engraving plate is greater than or equal to 0.05 micrometers and less than or equal to 0.6 micrometers.

[0058] In this technical solution, the roughness of the engraved surface of the engraving plate is greater than or equal to 0.05 micrometers and less than or equal to 0.6 micrometers. For example, it can be 0.1 micrometers or 0.5 micrometers, which can further improve the efficiency of subsequent surface treatment processes.

[0059] More specifically, the engraving principle of this application is as follows: like Figure 4 and Figure 5As shown, a rectangular three-dimensional engraved pattern 3 is engraved on the substrate 2. During the engraving process, the first part of the pattern 31 is engraved using the first engraving parameters to form the first engraved surface 32. That is, the first layer processing is performed at low speed and low power, and the processing depth is the same as the preset depth. In other words, low speed and low power are used for patterns or graphics that require high printing reproduction quality and are close to the print surface. Then, the first engraved surface 32 is processed for the second layer using the second engraving parameters, and the second part of the pattern 33 is engraved to form the second engraved surface 34. Since the processing depth is deeper in the second layer processing, the impact on the printing reproduction quality is relatively small. Therefore, using high speed and high power for the second layer processing can greatly improve the processing rate. Finally, the third engraving parameters are used to clean all engraved surfaces and the recast layer to obtain the engraved plate. Because the first engraved surface 32 is close to the print surface and is engraved at low speed and low power in this method, the image and text reproduction quality of the first engraved surface 32 is better, resulting in a better overall image and text reproduction effect. In addition, in order to ensure that the first engraved surface 32 is not damaged during the second layer processing, the processing diameter of the second layer processing needs to be set. That is, the ratio of the first engraved surface 32 to the second engraved surface 34 is a fixed value, which can be set in advance. This way, a part of the first engraved surface 32 can be retained, thereby ensuring the image and text restoration effect, and finally engraving it into a three-dimensional engraved pattern 3 similar to a cuboid.

[0060] like Figure 2 As shown, a second aspect of the present invention provides an engraving plate preparation apparatus 1, comprising: a laser 11 for emitting laser light; a galvanometer 12 connected to the laser 11 for adjusting the direction of the laser light so that the laser light can engrave at different positions on the surface of a substrate 2; a focusing lens 13 connected to the galvanometer 12 for focusing the laser light passing through the galvanometer 12 into a light spot; a light field control module 14 connected to the laser 11 for controlling the number of laser lights emitted by the laser 11 and for controlling the single-path laser power to adjust the diameter of the light spot and the total laser power of the light spot, the light field control module 14 also being used to adjust the engraving speed of the laser 11; and a controller 15 connected to the light field control module 14 for controlling the operation of the light field control module 14 to realize the engraving plate preparation method of any of the technical solutions of the first aspect of the present invention.

[0061] Furthermore, the engraving plate preparation apparatus 1 of the present invention also includes a moving platform 16, a charge-coupled device camera 17, a polarization beam splitter 18, and a reflector 19. The substrate 2 is disposed on the moving platform 16. During the engraving process, the laser beam generated by the laser 11 reaches the polarization beam splitter 18 via the reflector 19, and then the shape and intensity distribution of the laser beam are adjusted by the light field control module 14 to adapt to different processing requirements. Then, under the action of the reflector 19, it reaches the galvanometer 12 and the focusing lens 13, which converge the divergent light from the laser into a small focal point, thereby realizing the engraving of the substrate 2 with the cooperation of the moving platform 16.

[0062] like Figure 3 As shown, the third aspect of the present invention provides an electronic device 700, including a memory 702 and a processor 701. The memory 702 stores a computer program or instructions, and the processor 701 executes the computer program or instructions to implement the method for preparing an engraved plate as provided in any of the technical solutions of the first aspect of this application.

[0063] The fourth aspect of the present invention provides a readable storage medium storing a program or instructions, wherein when a processor executes the program or instructions, it implements the method for preparing an engraved plate as provided in any of the technical solutions of the first aspect of this application.

[0064] This embodiment provides a method for preparing an engraved plate, and the technical solution adopted is: 1. During the process of converting a multi-layer 3D processing file into a multi-layer 3D processing file using 3D design software, on the one hand, a low-power engraving mode is set for the patterns or graphics close to the surface; on the other hand, a high-power engraving mode is set for the patterns or graphics in the remaining lower positions. In addition, a cleaning engraving mode is set for the patterns or graphics in the high-power engraving processing area. Finally, the files are synthesized and converted into a multi-layer 3D processing file using 3D design software. 2. The laser engraving device for preparing the engraving plate includes a laser, an optical path, a light field control module, a galvanometer, and a focusing lens. The light field control module has an adjustable spot diameter function.

[0065] 3. Utilizing ultrafast lasers, including femtosecond, picosecond, or fiber lasers, and employing platform or roller processing methods, multi-mirror or multi-beam parallel processing, with processing speeds exceeding 1000mm / s and single-path laser power of 10W~50W, the laser engraving device uses a 3D processing file of the laser pattern to perform layered processing and removal on the substrate. The first step uses the smallest diameter spot in a low-power engraving mode to engrave patterns or graphics close to the substrate surface, ensuring accurate pattern reproduction. The second step uses a larger diameter spot in a high-power, high-speed engraving mode to engrave patterns or graphics at lower positions, ensuring higher processing efficiency. The third step uses an even larger diameter spot in a low-power, high-speed engraving mode to clean the recast layer and residues of metal or oxides, obtaining a clean substrate surface and specific bottom roughness of the pattern.

[0066] The key technical point of this application is: 1. Layered design is implemented in the electronic file creation for printing plate processing, including preset multi-layer processing modes.

[0067] 2. The laser engraving device can adjust the laser spot size, power parameters, etc., according to the layered design in the electronic file and different processing modes.

[0068] 3. The laser engraving device's light field control module adjusts the laser spot size in relation to the spacing of the engraved pattern fill lines and power parameters in the processing mode.

[0069] Current methods typically employ high-power lasers to achieve high removal rates, making it difficult to avoid thermal effects during laser processing. These thermal effects significantly impact image reproduction, resulting in coarse reproduction quality and poor numerical accuracy for fine images. Furthermore, a large amount of metal and metal oxide recasting layers and residues accumulate on the image surface. To achieve fine image reproduction, low removal rates are required, typically using low-power lasers. However, in the process of laser processing large-volume metal planographic and relief plates, this method is inefficient and lacks practical application. The engraving plate preparation device and method provided in this invention effectively improve plate-making efficiency while simultaneously enhancing plate quality.

[0070] In this invention, the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "installed," "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "linked" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0071] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for preparing an engraved plate, characterized in that, include: Obtain the 3D sculpted pattern; The three-dimensional engraved pattern is analyzed, and a first part pattern and a second part pattern of the three-dimensional engraved pattern are determined, wherein the first part pattern is a pattern with a depth less than a preset depth, and the second part pattern is a pattern with a depth greater than or equal to the preset depth. Based on the first part of the pattern, a first engraving position is determined on the substrate, and the laser is controlled to engrave at the first engraving position using the first engraving parameters; Based on the second part of the pattern, a second engraving position is determined on the substrate, and the laser is controlled to engrave at the second engraving position using the second engraving parameters, wherein the first engraving parameters and the second engraving parameters are different; The recast layer and the engraved surface on the substrate after engraving are determined, and the laser is controlled to clean the recast layer and the engraved surface using the third engraving parameters to obtain the engraved plate.

2. The method for preparing the engraved plate according to claim 1, characterized in that, The first engraving parameters include a first spot diameter, a first total laser power, and a first engraving speed. The second engraving parameters include a second spot diameter, a second total laser power, and a second engraving speed. The first spot diameter is smaller than the second spot diameter, the first total laser power is smaller than the second total laser power, and the first engraving speed is smaller than the second engraving speed.

3. The method for preparing the engraved plate according to claim 2, characterized in that, The third engraving parameters include the third spot diameter, the third total laser power, and the third engraving speed. The third spot diameter is larger than the second spot diameter, the third total laser power is smaller than the second total laser power, and the third engraving speed is greater than the first engraving speed.

4. The method for preparing the engraved plate according to claim 3, characterized in that, The diameter of the first light spot is greater than or equal to 5 micrometers and less than or equal to 20 micrometers; the diameter of the third light spot is greater than or equal to 40 micrometers; and the diameter of the second light spot is greater than 20 micrometers and less than 40 micrometers. The first engraving speed is greater than or equal to 1000 mm / s and less than or equal to 1500 mm / s, the second engraving speed is greater than or equal to 2000 mm / s and less than or equal to 3000 mm / s, and the third engraving speed is greater than or equal to 2000 mm / s and less than or equal to 5000 mm / s.

5. The method for preparing the engraved plate according to claim 3, characterized in that, The diameters of the first, second, and third light spots are all related to the spacing of the engraving fill lines of the three-dimensional engraving pattern.

6. The method for preparing an engraved plate according to claim 1, characterized in that, The substrate is a metal plate, a metal convex plate, a metal concave plate, or a roller.

7. The method for preparing the engraved plate according to claim 1, characterized in that, The laser is one of a femtosecond laser, a picosecond laser, or a fiber laser; and / or The single-path laser power of the laser is greater than or equal to 10W and less than or equal to 50W; and / or The roughness of the engraved surface of the engraving plate is greater than or equal to 0.05 micrometers and less than or equal to 0.6 micrometers.

8. An apparatus for preparing an engraved plate, characterized in that, include: A laser, used to emit laser light; A galvanometer, connected to the laser, is used to adjust the direction of the laser so that the laser can engrave at different positions on the substrate surface; A focusing lens, connected to the galvanometer, is used to focus the laser light passing through the galvanometer into a spot; A light field control module, connected to the laser, is used to control the number of laser beams emitted by the laser and to control the laser power of a single optical path, so as to adjust the diameter of the light spot and the total laser power of the light spot. The light field control module is also used to adjust the engraving speed of the laser. A controller, connected to the light field modulation module, is used to control the operation of the light field modulation module to realize the method for preparing the engraved plate as described in any one of claims 1 to 7.

9. An electronic device, characterized in that, include: A memory and a processor, wherein the memory stores a computer program or instructions, and the processor executes the computer program or instructions to implement the method for preparing the engraved plate as described in any one of claims 1 to 7.

10. A readable storage medium, characterized in that, The readable storage medium stores a program or instructions, and when the processor executes the program or instructions, it implements the method for preparing the engraved plate as described in any one of claims 1 to 7.

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