Laser etching equipment

Abstract

The utility model discloses laser etching equipment, which comprises a laser mechanism, a laser cutting mechanism and a laser cutting mechanism, the first rolling brush mechanism is suitable for cleaning stains on the semiconductor product before laser etching; the blowing mechanism is suitable for removing laser etching dust; the suction mechanism is suitable for gathering laser etching dust and comprises a trapping box, a first suction part, a second suction part and a negative pressure source, and a filter part is arranged in the trapping box and suitable for dividing the interior of the trapping box into a first cavity and a second cavity; the conveying mechanism is suitable for conveying the semiconductor products to the first rolling brush mechanism, the laser mechanism and the blowing mechanism; wherein the first sorption part and the first rolling brush mechanism are cooperatively arranged, the second sorption part and the blowing mechanism are cooperatively arranged, the first sorption part and the second sorption part are both communicated with airflow of the first cavity, and the negative pressure source is communicated with airflow of the second cavity. By the adoption of the structure, stains on semiconductor products can be cleaned before laser etching, and laser etching dust can be effectively managed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the laser microfabrication technical field for integrated circuit (IC) process, especially relates to a radium carving equipment. BACKGROUND

[0002] Relate to IC process, whether the front (Front-End) wafer (Wafer) or the back (Back-End) die (Die), the printing of shell (Shell), more to laser engraving above semiconductor products. Indeed, to purify IC process, radium carving equipment generally includes blowing, sucking mechanism to manage radium carving dust.

[0003] However, the above blowing, sucking mechanism is generally difficult to clean existing stains on semiconductor products before radium carving, and even cannot manage difficult-to-remove dust on semiconductor products after radium carving, resulting in the deterioration of radium carving effect.

[0004] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. INVENTION CONTENTS

[0005] The utility model discloses a radium carving equipment, which can clean existing stains on semiconductor products before radium carving and manage radium carving dust.

[0006] The utility model discloses a radium carving equipment, which can clean existing stains on semiconductor products before radium carving and manage radium carving dust.

[0007] The radium laser mechanism is suitable for radium carving semiconductor products;

[0008] The first rolling brush mechanism is suitable for cleaning existing stains on semiconductor products before radium carving;

[0009] The blowing mechanism is suitable for removing radium carving dust;

[0010] The adsorption mechanism is suitable for gathering radium carving dust, and includes a capture box, a first adsorption piece, a second adsorption piece and a negative pressure source.

[0011] The transmission mechanism is suitable for sending semiconductor products to the first rolling brush mechanism, the radium laser mechanism and the blowing mechanism.

[0012] The first adsorption piece and the first rolling brush mechanism are arranged in cooperation, the second adsorption piece and the blowing mechanism are arranged in cooperation, the first adsorption piece and the second adsorption piece are in airflow communication with the first chamber, and the negative pressure source is in airflow communication with the second chamber.

[0013] Further, the first rolling brush mechanism is located on the upper side of the transmission mechanism, and includes:

[0014] The brush housing is configured with an avoiding opening at a bottom portion thereof;

[0015] The brush is rotatably installed inside the brush housing and protrudes from the bottom portion of the brush housing via the avoiding opening;

[0016] The first driver is arranged in the brush housing and is in driving connection with the brush;

[0017] The second driver is in driving connection with the brush housing and is adapted to activate the brush housing to approach or retreat from the semiconductor product in the vertical direction;

[0018] The brush housing is configured with a first suction opening at a side portion thereof in the radial direction of the brush, and the first suction member is in connection with the first suction opening.

[0019] Further, the first suction member is a hollow shell adapted to cover the first suction opening and has a first portion and a second portion in the axial direction of the brush, a suction pipe is arranged between the second portion and the first chamber, and the first suction member is enlarged from the first portion to the second portion.

[0020] Further, the laser engraving device comprises a second brush mechanism, and the conveying mechanism is adapted to send the semiconductor product to the lower side of the second brush mechanism to clean the difficult-to-remove dust on the semiconductor product after laser engraving.

[0021] Further, the conveying mechanism is adapted to convey the semiconductor product in a first lateral direction, the blowing mechanism and the second suction member are arranged on two sides of the conveying mechanism in a second lateral direction, the second lateral direction is perpendicular to the first lateral direction, and the laser source of the laser mechanism is arranged on the upper side between the blowing mechanism and the second suction member.

[0022] Further, the capturing box comprises:

[0023] The box body is configured with an operating opening at a side portion thereof;

[0024] The box door is adapted to open / close the operating opening;

[0025] The limiting structure is arranged inside the box body;

[0026] The filter member is adapted to be loaded / unloaded in the limiting structure from the operating opening.

[0027] Further, the box body is a parallelepiped and comprises:

[0028] The first side portion is two in number and is arranged oppositely;

[0029] second side, two in number, oppositely arranged, connected between two of the first sides, one of the second sides configured as the operation port;

[0030] box top, sealed above the first sides and the second sides;

[0031] box bottom, combined below the first sides and the second sides;

[0032] wherein the first adsorption member and the second adsorption member are connected to one of the first sides by the adsorption pipe, and the negative pressure source is connected to the other of the first sides by the negative pressure pipe.

[0033] Further, the limiting structure comprises:

[0034] the through member, in periphery, connected to the second sides, the box top and the box bottom respectively;

[0035] the limiting member, two in number, separately arranged at the box bottom and the box top, and connected to the second sides respectively;

[0036] wherein the limiting member at the box bottom and the through member bottom form a groove, and the limiting member at the box top and the through member top form a groove, both of which are adapted to guide the filter member to be loaded or unloaded; the locking member is adapted to drive the filter member to abut against the through member, so that the filter member covers the hollow or hollowed area of the through member.

[0037] Further, the filter member comprises:

[0038] the frame, adapted to the groove;

[0039] the mesh, arranged in the frame;

[0040] wherein the locking member is a threaded member connected to the box, one end of the locking member located inside the first chamber, so as to tightly abut the frame against the through member, and the mesh covers the hollow or hollowed area of the through member.

[0041] Further, the trapping box comprises a sensor arranged in the box, the sensor being at least two in number, and used to detect the pressure in the first chamber and the second chamber respectively, so as to alarm when the pressure difference between the first chamber and the second chamber exceeds a threshold value.

[0042] Compared with the prior art, the utility model have following beneficial effect: the utility model discloses a first rolling brush mechanism is set, before laser carving, first rolling brush mechanism and semiconductor product entity contact to clean the existing dirt of semiconductor product, compared with traditional air knife, purification effect is better, through setting adsorption mechanism, gather by first rolling brush mechanism, blowing mechanism and semiconductor product existing dirt, laser carving dust, improve the cleanliness of laser carving equipment inside and periphery, adsorption mechanism includes the first adsorption piece of cooperation arrangement with first rolling brush mechanism and the second adsorption piece of cooperation arrangement with blowing mechanism, it gathers existing dirt, laser carving dust in the capture box, convenient for future processing, and, the filter piece is set in the capture box, divide the capture box into first chamber and second chamber, and the filter piece is suitable for intercepting existing dirt, laser carving dust, makes it gather in first chamber to isolate with negative pressure source, ensures that negative pressure source works efficiently, reliably. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 It is the structure schematic diagram of laser carving equipment of the utility model.

[0044] Figure 2 It is the structure schematic diagram of the utility model after removing the shade.

[0045] Figure 3 It is the exploded structural schematic diagram of first rolling brush mechanism and first adsorption piece in the utility model.

[0046] Figure 4 It is the installation schematic diagram of blowing mechanism, second adsorption piece and shade in the utility model.

[0047] Figure 5 It is the structure schematic diagram of capture box door closed state in the utility model.

[0048] Figure 6 It is Figure 5 Sectional view schematic diagram.

[0049] Figure 7 It is the exploded structural schematic diagram of capture box door opening state in the utility model.

[0050] Figure 8 It is Figure 7 The structure schematic diagram in another direction.

[0051] BRIEF DESCRIPTION OF DRAWINGS:

[0052] 100, laser device; 110, laser source; 200, first rolling brush device; 210, rolling brush shell; 211, avoiding opening; 212, first suction opening; 220, rolling brush; 230, first driver; 240, second driver; 300, blowing device; 400, suction device; 410, trapping box; 411, first chamber; 412, second chamber; 413, box body; 4131, operation opening; 4132, first side; 4133, second side; 4134, box top; 4135, box bottom; 414, box door; 4141, sealing member; 420, first suction member; 421, first part; 422, second part; 423, first pipe connecting member; 424, first window; 430, second suction member; 431, second suction opening; 432, second pipe connecting member; 440, negative pressure source; 450, filter member; 451, frame; 452, mesh; 461, suction pipe; 462, negative pressure pipe; 471, air permeable member; 472, limiting member; 473, locking member; 4731, handle; 474, groove; 480, bracket; 490, sensor; 500, conveying device; 600, second rolling brush device; 700, cover; 710, door leaf; 720, second window. DETAILED DESCRIPTION

[0053] In order to make the above objectives, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the purpose of description, only the parts related to the present application are shown in the drawings, but not all the structures. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0054] The terms "comprising" and "having" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0055] In this paper, the phrase "embodiment" means that the specific features, structures or characteristics described in conjunction with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0056] Please refer toFigure 1 and Figure 2 As shown in the drawings, the laser engraving equipment is particularly suitable for printing on a bare chip or a packaging shell. It is true that in other embodiments, the laser engraving equipment is also used for processing other semiconductor products, and the present application is not limited herein.

[0057] The laser engraving equipment comprises: a laser mechanism 100 adapted to laser engrave a semiconductor product; a first rolling brush mechanism 200 adapted to clean existing stains on the semiconductor product before laser engraving; a blowing mechanism 300 adapted to remove laser engraving dust; a suction mechanism 400 adapted to collect laser engraving dust, comprising a capture box 410, a first suction member 420, a second suction member 430 and a negative pressure source 440, a filter member 450 is arranged inside the capture box 410, and the filter member 450 is adapted to separate the inside of the capture box 410 into a first chamber 411 and a second chamber 412; and a conveying mechanism 500 adapted to send the semiconductor product to the first rolling brush mechanism 200, the laser mechanism 100 and the blowing mechanism 300; wherein the first suction member 420 is arranged in cooperation with the first rolling brush mechanism 200, the second suction member 430 is arranged in cooperation with the blowing mechanism 300, the first suction member 420 and the second suction member 430 are in airflow communication with the first chamber 411, and the negative pressure source 440 is in airflow communication with the second chamber 412.

[0058] The first rolling brush mechanism 200 is in physical contact with the semiconductor product to clean the existing stains on the semiconductor product before laser engraving, and the purification effect is better than that of a traditional air knife. The suction mechanism 400 is arranged to collect the existing stains and laser engraving dust separated from the semiconductor product by the first rolling brush mechanism 200 and the blowing mechanism 300, thereby improving the cleanliness inside and around the laser engraving equipment. The suction mechanism 400 comprises the first suction member 420 arranged in cooperation with the first rolling brush mechanism 200 and the second suction member 430 arranged in cooperation with the blowing mechanism 300, which collects the existing stains and laser engraving dust in the capture box 410 for future processing. In addition, the filter member 450 is arranged inside the capture box 410 to separate the inside of the capture box 410 into the first chamber 411 and the second chamber 412, and the filter member 450 is adapted to intercept the existing stains and laser engraving dust to collect them in the first chamber 411 to be isolated from the negative pressure source 440, thereby ensuring efficient and reliable operation of the negative pressure source 440.

[0059] Further, please refer to Figure 2 and Figure 3As shown, the first rolling brush mechanism 200 is located on the upper side of the conveying mechanism 500, and includes a rolling brush housing 210, a rolling brush 220, a first driver 230 and a second driver 240. A part of the bottom of the rolling brush housing 210 is configured as an avoiding opening 211, and the rolling brush 220 is rotatably installed inside the rolling brush housing 210, and a part of the rolling brush 220 is adapted to protrude from the bottom of the rolling brush housing 210 through the avoiding opening 211. In the embodiment, the conveying mechanism 500 is adapted to transport the semiconductor product along the first transverse direction; the rotation axis of the rolling brush 220 is parallel to the second transverse direction, and the second transverse direction is perpendicular to the first transverse direction. The first driver 230 is arranged on the rolling brush housing 210 and is in driving connection with the rolling brush 220. Specifically, the first driver 230 can be a rotary motor to activate the rolling brush 220 to rotate around its axis. The second driver 240 is in driving connection with the rolling brush housing 210 and is adapted to activate the rolling brush housing 210 to approach or retreat from the semiconductor product along the vertical direction. Specifically, the second driver 240 can be a linear pneumatic cylinder or electric cylinder arranged along the vertical direction, preferably a linear pneumatic cylinder to simplify the structure and reduce the cost.

[0060] Specifically, first, the conveying mechanism 500 sends the semiconductor product to the lower side of the first rolling brush mechanism 200; then, the second driver 240 activates the rolling brush housing 210 to descend, and the rolling brush 220 installed inside the rolling brush housing 210 descends accordingly, and then a part of the rolling brush 220 protruding from the bottom of the rolling brush housing 210 contacts the semiconductor product; then, the first driver 230 activates the rolling brush 220 to rotate, and then the existing stains on the semiconductor product are cleaned before laser engraving; after the cleaning process is completed, the first driver 230 stops, the rolling brush 220 stops rotating, and the second driver 240 activates the rolling brush housing 210 to ascend to reset it.

[0061] Further, the side of the rolling brush housing 210 is located in the radial direction of the rolling brush 220, and a part thereof is configured as a first suction port 212. The first suction member 420 is connected to the first suction port 212, so that the existing stains on the semiconductor product can enter the first suction member 420 through the first suction port 212 after the above cleaning process. Specifically, the first suction member 420 is preferably a hollow shell suitable for covering the first suction port 212, and has a first part 421 and a second part 422 located in the axial direction of the rolling brush 220. More specifically, a suction pipe 461 is arranged between the second part 422 and the first chamber 411, and the suction pipe 461 is preferably a flexible pipe to facilitate the synchronous lifting of the first suction member 420 with the first rolling brush mechanism 200. A first pipe connector 423 is arranged on the second part 422 and communicates with the hollow airflow of the first suction member 420. One end of the suction pipe 461 is connected to the first pipe connector 423, and the other end is connected to the first chamber 411. Preferably, the hollow of the first suction member 420 expands from the first part 421 to the second part 422, so that the existing stains and laser dust entering the first suction member 420 can flow smoothly to the first pipe connector 423. Indeed, the first suction member 420 preferably includes a first window 424, through which the operator can observe the internal conditions of the hollow of the first suction member 420 and the working condition of the rolling brush 220, so as to immediately handle the abnormality when it is found.

[0062] In a preferred embodiment, the laser engraving device includes a second rolling brush mechanism 600. The conveying mechanism 500 is suitable for sending the semiconductor product to the lower side of the second rolling brush mechanism 600 to clean the difficult-to-remove dust on the semiconductor product after laser engraving and improve the cleanliness thereof. Indeed, the second rolling brush mechanism 600 is similar in structure to the first rolling brush mechanism 200 and cooperates with a first suction member (not shown) which is also in airflow communication with the first chamber 411, and the present application will not be described here.

[0063] Further, please refer to Figure 1 , Figure 2 and Figure 4 , the blowing mechanism 300 supplies air pressure based on a gas source (not shown) to remove laser dust. Indeed, the conveying mechanism 500 is a conventional conveying line, and the present application will not be described here. The blowing mechanism 300 and the second suction member 430 are arranged on both sides of the conveying mechanism 500 along the second transverse direction, and the laser source 110 of the laser engraving mechanism 100 is located on the upper side between the blowing mechanism 300 and the second suction member 430, so as not to interfere with the laser source 110 to engrave the semiconductor product. Indeed, the laser engraving mechanism 100 is of a conventional structure, and the present application will not be described here. Specifically, the conveying mechanism 500 sends the semiconductor product to the lower side of the laser source 110, at which time the blowing mechanism 300 and the second suction member 430 are located on both sides of the semiconductor product.

[0064] Indeed, the blowing mechanism 300 blows the laser engraving dust out of the second suction member 430. Therefore, in the embodiment, the blowing mechanism 300 and the second suction member 430 are preferably enclosed in the cover 700. The cover 700 is adapted to block the laser engraving dust from spreading out, so as to ensure that the second suction member 430 can reliably collect the laser engraving dust. Specifically, in a preferred embodiment, the blowing mechanism 300 and a part of the suction mechanism 400 are installed inside the cover 700, the first rolling brush mechanism 200 and the second rolling brush mechanism 600 are respectively installed on the two sides of the cover 700, the laser source 110 is installed on the top of the cover 700, and the bottom of the cover 700 is configured as an open port. Specifically, the first transverse direction and the second transverse direction intersect to define a plane, and the conveying mechanism 500 sends the semiconductor product to the downside of the laser source 110, at which time the semiconductor product is located in the parallel projection area of the open port of the cover 700 on the plane. Preferably, the cover 700 includes an openable / closable door 710. More specifically, the door 710 preferably includes a second window 720, through which an operator can observe the laser engraving process so as to immediately handle abnormalities when found.

[0065] Further, the second suction member 430 is a hollow shell. The second suction member 430 is configured with a second suction port 431 on one side along the second transverse direction, and the second suction port 431 is adjacent to the semiconductor product. A second pipe connector 432 is provided on the other side along the second transverse direction of the second suction member 430, and a suction pipe (not shown) is provided between the second pipe connector 432 and the first chamber 411, which is preferably a flexible pipe. Preferably, the second suction port 431 is supplied with negative pressure based on a negative pressure source 440, and the angle between the negative pressure flow direction and the semiconductor product is greater than 0° and less than 90°, so as to improve the collection effect of the second suction member 430. Indeed, preferably, the second pipe connector 432 and the first pipe connector 423 are located on the same side, and their axial directions are parallel to each other, so as to facilitate the orderly arrangement of the suction pipe.

[0066] Further, referring to Figures 5 to 8 As shown, the collection box 410 includes a box body 413, a box door 414, and a limiting structure. One side of the box body 413 is configured as an operation port 4131, and the box door 414 is adapted to open / close the operation port 4131. The above-mentioned limiting structure is partially installed inside the box body 413, and the filter 450 is adapted to be detachably mounted on the limiting structure from the operation port 4131. Specifically, when the collection box 410 is close to the limit that existing stains and laser engraving dust are difficult to be collected in the first chamber 411, an operator can open the box door 414 to remove them. Moreover, by means of the above-mentioned limiting structure, the filter 450 can be detachably mounted inside the box body 413, which not only facilitates the removal of existing stains and laser engraving dust, but also facilitates the refreshing and replacement of the filter 450 to ensure that it can reliably block the existing stains and laser engraving dust.

[0067] Specifically, the box 413 is a parallelepiped. Indeed, the box 413 is preferably a square. The box 413 comprises a first side 4132, a second side 4133, a box top 4134 and a box bottom 4135. The first side 4132 is in number two and oppositely arranged. The second side 4133 is in number two and oppositely arranged. The second side 4133 is connected between the two first sides 4132 to form a peripheral side of the box 413, and one of the second sides 4133 is configured as an operation port 4131. The box top 4134 is sealed above the first side 4132 and the second side 4133, and the box bottom 4135 is combined below the first side 4132 and the second side 4133. The filter 450 and one of the first sides 4132 form a first chamber 411, and the filter 450 and the other of the first sides 4132 form a second chamber 412. The first suction member 420 and the second suction member 430 are connected to one of the first sides 4132 by the suction pipe. The negative pressure source 440 is connected to the other of the first sides 4132 by the negative pressure pipe 462.

[0068] Further, the limiting structure comprises a through-hole member 471, a limiting member 472 and a locking member 473. The through-hole member 471 is connected to the second side 4133, the box top 4134 and the box bottom 4135 around. The limiting member 472 is in number two and arranged on the box bottom 4135 and the box top 4134, and there is a gap between them. Preferably, the limiting member 472 is connected to the two second sides 4133 on both sides. The limiting member 472 arranged on the box bottom 4135 is between the bottom of the through-hole member 471 and the limiting member 472 arranged on the box top 4134 is between the top of the through-hole member 471, and both form a groove 474 suitable for guiding the filter 450 to be loaded / unloaded. The locking member 473 is suitable for exciting the filter 450 to abut against the through-hole member 471, so as to cover the through-hole area of the through-hole member 471. Indeed, the through-hole area can be a hollow or hollowed-out area. Specifically, the negative pressure source 440 generates negative pressure, at which time the filter 450 blocks the existing stains and laser dust, and only airflow enters the second chamber 412 from the hollow or hollowed-out area of the through-hole member 471.

[0069] Further, the filter 450 comprises a frame 451 and a mesh 452. Specifically, the frame 451 is a parallelepiped. Indeed, the frame 451 is preferably a square. The frame 451 is hollow, and the mesh 452 is installed in the frame 451 to cover the hollow area of the frame 451. The frame 451 is adapted to the groove 474, and is suitable for abutting the transparent part 471 and the limiting part 472 to delimit the first chamber 411 and the second chamber 412. The mesh 452 is suitable for covering the hollow or hollowed area of the transparent part 471 to block the existing stains and the laser-engraved dust from entering the second chamber 412. Indeed, the distance between the transparent part 471 and the first side 4132 connected to the negative pressure pipe 462 is less than the distance between the limiting part 472 and the first side 4132 connected to the adsorption pipe 461, so as to expand the first chamber 411 and make it suitable for gathering more existing stains and laser-engraved dust.

[0070] Specifically, first, the box door 414 is opened, and the filter 450 is inserted into the groove 474 through the operation port 4131; then, the filter 450 is moved along the groove 474 to abut against the second side 4133 opposite to the operation port 4131; this installation process is completed, and the box door 414 is closed, and the filter 450 is fixed in the box 413.

[0071] Preferably, a sealing part 4141 is arranged on the inner side of the box door 414. Specifically, the sealing part 4141 can be an elastomer such as rubber or silicone. Specifically, when the box door 414 is closed, the sealing part 4141 surrounds the operation port 4131 to enhance the sealing thereof; and the sealing part 4141 presses the filter 450 to tightly abut between the box door 414 and the second side 4133, thereby ensuring that the first chamber 411 and the second chamber 412 are isolated from each other.

[0072] The locking part 473 can be a threaded part connected to the box 413. More specifically, the locking part 473 is arranged on the first side 4132 connected to the adsorption pipe 461, one end of which is located inside the first chamber 411, and the other end of which protrudes out of the box 413 and is provided with a handle 4731. By rotating the handle 4731, the one end of the locking part 473 inside the first chamber 411 is adapted to abut against the frame 451 to tightly abut the transparent part 471, so that the mesh 452 covers the hollow or hollowed area of the transparent part 471. Preferably, a plurality of locking parts 473 are adapted to abut against different positions of the frame 451 to ensure that the filter 450 is fixed in the box 413. In this embodiment, the number of locking parts 473 is preferably four, and the four locking parts 473 are arranged at the four vertices of the filter 450 corresponding to the same plane. It can be understood that the number of vertices of the filter 450 is eight, and the four vertices are closer to the first side 4132 connected to the adsorption pipe 461 than the other four vertices.

[0073] Indeed, the locking member 473 has a relatively long axial dimension corresponding to the distance between the first side 4132 of the connecting adsorption tube 461 and the filter 450, which makes it difficult to be reliably arranged on the first side 4132. Preferably, a bracket 480 corresponding to the locking member 473 is arranged inside the first chamber 411, and the locking member 473 is embedded in the bracket 480 at one end inside the first chamber 411 to stabilize the locking member 473. In the embodiment, the bracket 480 is specifically an L-shaped plate arranged on the top 4134 and / or the bottom 4135 of the box and located on the side of the limiting member 472 away from the through member 471. Indeed, the bracket 480 is provided with an opening for the locking member 473 to be embedded therein, which can be a threaded hole or a light hole, and the present application is not limited thereto.

[0074] Further, the first chamber 411 is full of existing stains and laser engraving dust that has not been timely cleaned and transported, which causes the grid 452 to be blocked and the airflow to be difficult to enter the second chamber 412 from the filter 450, thereby inducing abnormality of the adsorption mechanism 400 and even damage. Preferably, the collection box 410 includes a sensor 490 arranged on the box body 413. The number of sensors 490 is at least two, which are respectively used to detect the pressure inside the first chamber 411 and the second chamber 412. Specifically, when the pressure difference between the first chamber 411 and the second chamber 412 breaks through a threshold value, the sensor 490 reminds the operator to timely clean and transport the existing stains and laser engraving dust inside the first chamber 411. Indeed, at least one sensor 490 is partially or entirely arranged in the first chamber 411, and at least one sensor 490 is partially or entirely arranged in the second chamber 412.

[0075] The operation sequence of the laser engraving equipment of the present application is as follows:

[0076] S100, the conveying mechanism 500 sends the semiconductor product to the lower side of the first rolling brush mechanism 200;

[0077] S200, the first rolling brush mechanism 200 is lowered to clean the existing stains on the semiconductor product before laser engraving, and simultaneously, the first adsorption member 420 supplies negative pressure to gather the existing stains separated from the semiconductor product in the collection box 410;

[0078] S300, the conveying mechanism 500 sends the semiconductor product to the lower side of the laser engraving mechanism 100, at this time, the blowing mechanism 300 and the second adsorption member 430 are located on both sides of the semiconductor product;

[0079] S400, the laser engraving mechanism 100 laser engraves the semiconductor product, and simultaneously, the blowing mechanism 300 supplies air pressure to remove the laser engraving dust, and the second adsorption member 430 supplies negative pressure to gather the laser engraving dust in the collection box 410;

[0080] S500, the conveying mechanism 500 sends the semiconductor product to the lower side of the second rolling brush mechanism 600;

[0081] S600, the second rolling brush mechanism 600 is lowered to clean the dust on the semiconductor product after laser engraving, and a first suction member supplies negative pressure to gather the dust separated from the semiconductor product in the dust collection box 410.

[0082] The above merely provides an embodiment of the present application, and is not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process conversion, or direct or indirect application in other related technical fields, which is made by using the content of the present application specification and drawings, is also included in the patent protection scope of the present application.

Claims

1. A laser engraving apparatus, characterized by, The laser engraving device comprises: a laser engraving mechanism (100) adapted to laser engrave a semiconductor product; a first rolling brush mechanism (200) adapted to clean existing stains on the semiconductor product before laser engraving; a blowing mechanism (300) adapted to remove laser engraving dust; a suction mechanism (400) adapted to collect laser engraving dust, comprising a collection box (410), a first suction member (420), a second suction member (430), and a negative pressure source (440), wherein the collection box (410) is internally provided with a filter member (450) adapted to divide the inside of the collection box (410) into a first chamber (411) and a second chamber (412); a conveying mechanism (500) adapted to convey the semiconductor product to the first rolling brush mechanism (200), the laser engraving mechanism (100), and the blowing mechanism (300). The first suction member (420) is arranged in cooperation with the first rolling brush mechanism (200), the second suction member (430) is arranged in cooperation with the blowing mechanism (300), the first suction member (420) and the second suction member (430) are in airflow communication with the first chamber (411), and the negative pressure source (440) is in airflow communication with the second chamber (412).

2. The laser engraving apparatus of claim 1, wherein, The first rolling brush mechanism (200) is located on the upper side of the conveying mechanism (500) and comprises: a rolling brush shell (210) having a portion configured as an escape opening (211); a rolling brush (220) rotatably mounted inside the rolling brush shell (210) and partially protruding from the bottom of the rolling brush shell (210) through the escape opening (211); a first driver (230) provided in the rolling brush shell (210) and in transmission connection with the rolling brush (220); a second driver (240) in transmission connection with the rolling brush shell (210) and adapted to activate the rolling brush shell (210) to vertically approach or retreat from the semiconductor product; wherein one side of the rolling brush shell (210) is located in the radial direction of the rolling brush (220), and a portion thereof is configured as a first suction opening (212), and the first suction member (420) is connected to the first suction opening (212).

3. The laser engraving apparatus of claim 2, wherein, The first suction member (420) is a hollow shell adapted to cover the first suction opening (212) and has a first portion (421) and a second portion (422) located in the axial direction of the rolling brush (220), a suction pipe (461) is arranged between the second portion (422) and the first chamber (411), the first suction member (420) is hollow and expands from the first portion (421) to the second portion (422).

4. The laser engraving apparatus of any one of claims 1 to 3, wherein, The laser engraving device comprises a second rolling brush mechanism (600), and the conveying mechanism (500) is adapted to convey the semiconductor product to the lower side of the second rolling brush mechanism (600) to clean difficult-to-remove dust on the semiconductor product after laser engraving.

5. The laser engraving apparatus of claim 1, wherein, The transmission mechanism (500) is suitable for conveying the semiconductor product along a first lateral direction, the blowing mechanism (300) and the second adsorption member (430) are arranged on two sides of the transmission mechanism (500) in a second lateral direction, the second lateral direction is perpendicular to the first lateral direction, and the laser source (110) of the laser mechanism (100) is located on the upper side between the blowing mechanism (300) and the second adsorption member (430).

6. The laser engraving apparatus of claim 1, wherein, The collection box (410) comprises: a box body (413) with one side configured as an operation opening (4131); a box door (414) suitable for opening / closing the operation opening (4131); a limiting structure arranged inside the box body (413); wherein the filter member (450) is suitable for being loaded / unloaded on the limiting structure from the operation opening (4131).

7. The laser engraving apparatus of claim 6, wherein, The box body (413) is a parallelepiped, comprising: two first sides (4132) arranged oppositely; two second sides (4133) arranged oppositely, the second side (4133) is connected between the two first sides (4132), and one of the second sides (4133) is configured as the operation opening (4131); a box top (4134) sealed above the first side (4132) and the second side (4133); a box bottom (4135) combined below the first side (4132) and the second side (4133); wherein the first adsorption member (420) and the second adsorption member (430) are connected to one of the first sides (4132) through the adsorption pipe (461), and the negative pressure source (440) is connected to the other first side (4132) through the negative pressure pipe (462).

8. The laser engraving apparatus of claim 7, wherein, The limiting structure comprises: an air-penetrating member (471) connected to the second side (4133), the box top (4134), and the box bottom (4135) respectively; two limiting members (472) arranged on the box bottom (4135) and the box top (4134) respectively and connected to the two second sides (4133) respectively; a locking member (473); wherein the limiting member (472) arranged on the box bottom (4135) and the bottom of the air-penetrating member (471) and the limiting member (472) arranged on the box top (4134) and the top of the air-penetrating member (471) form a groove (474) respectively, the groove (474) is suitable for guiding the loading / unloading of the filter member (450), and the locking member (473) is suitable for exciting the filter member (450) to abut against the air-penetrating member (471) so as to cover the hollow or hollowed-out area of the air-penetrating member (471).

9. The laser engraving apparatus of claim 8, wherein, The filter member (450) comprises: a frame (451) matched with the groove (474); a mesh (452) arranged on the frame (451); The locking member (473) is a threaded member connected to the box (413), and one end of the locking member (473) is located inside the first chamber (411) to tightly abut the frame (451) against the open member (471), so that the mesh (452) covers the hollow or hollowed region of the open member (471).

10. The laser engraving apparatus of claim 7, wherein, The collection box (410) comprises sensors (490) arranged on the box (413), and the number of the sensors (490) is at least two, which are respectively used to detect the pressures in the first chamber (411) and the second chamber (412) to alarm when the pressure difference between the first chamber (411) and the second chamber (412) exceeds a threshold.

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