3A glass cover plate and preparation method thereof

Abstract

The invention discloses a 3A glass cover plate and a preparation method thereof, the 3A glass cover plate is provided with an annular AR layer on the surface of an annular ink layer, and the total thickness of the annular AR layer and a whole AR film layer on the other side is 100-300nm. According to the preparation method, the annular AR layer is plated on the surface of the annular ink layer through the winding plating phenomenon existing when the whole-surface AR film layer is prepared through magnetron sputtering, then the annular ink layer is subjected to laser polishing treatment, the roughness of the annular ink layer is kept at 0.1-0.35 mu m, the surface area is increased, the OCA glue can fully permeate and fill the surface of the annular ink layer, and therefore the surface of the whole-surface AR film layer is protected. The problem that bubbles on the edge of the ink layer are prone to rebound after defoaming after the ink layer and the OCA are attached is solved, and the attaching yield of the display module is increased.

Description

Technical Field

[0001] This invention belongs to the field of display module manufacturing technology, specifically relating to a 3A glass cover plate and its manufacturing method. Background Technology

[0002] 3A glass offers anti-glare, anti-reflective, and fingerprint-resistant properties, making it widely used in various applications, such as displays for electronic products like mobile phones, tablets, and televisions; panels for home appliances like air conditioners, refrigerators, and washing machines; and automotive components like dashboards and center consoles. Currently, a ring-shaped ink layer is typically applied to the side of the 3A glass cover that adheres to the display screen to block non-visible areas. OCA optical adhesive is then bonded to the visible area of ​​the glass cover and the ring-shaped ink layer, securing the glass cover to the display. However, OCA optical adhesive has a drawback: it easily generates air bubbles during bonding, affecting adhesion, display quality, and product yield. Currently, pressure-based debubbling is generally used to address this issue. However, during the actual bonding process, it was found that after degassing, air bubbles at the edges of the ink layer tend to bounce back. After careful study, it was discovered that in order to improve the surface adhesion between the glass cover and the OCA optical adhesive, the surface of the annular ink layer of the glass cover usually has a high roughness. Therefore, the surface of the annular ink layer has many uneven bumps, which prevents the OCA optical adhesive from effectively filling the bumps and forming bonding gaps. During the degassing process, the external air is compressed and enters the bonding gaps, causing air bubbles at the edges of the ink layer to bounce back, thus affecting the display effect and product yield.

[0003] Chinese patent CN115124928A discloses an OCA optical adhesive, film, and preparation method for curved screens. The OCA optical adhesive for curved screens is prepared using acrylate prepolymer, photoinitiator A, photoinitiator B, leveling agent, defoamer, antioxidant, coupling agent, crosslinking agent, and polymerization inhibitor. During use, it is first cured to keep it in a semi-cured state, which can effectively bond the flexible screen and OLED to the curved surface and effectively fill the different ink steps, thus preventing the occurrence of adverse phenomena such as bubble rebound in environments with normal temperature, high temperature and high humidity.

[0004] Chinese patent CN118005291A discloses a 3A glass cover plate, its preparation method, and the prepared display module. It has an annular embedded layer on the other side of the glass substrate. The annular embedded layer consists of an annular AG layer and an annular ink layer. There is no ink step difference between the outer surface of the annular ink layer and the glass substrate, which solves the problem of bonding bubbles that are easy to be generated when the OCA cover plate is bonded due to the step difference.

[0005] Chinese patent CN112860113A discloses an ink-printed structure, a touch screen, and an ink-printing method. The method involves applying a first ink layer to a printing area on the inner surface of a glass substrate, applying a second ink layer to the inner surface of the first ink layer, creating an air reservoir in the second ink layer, and establishing an airflow channel connecting the air reservoir to the visible area to form the ink-printed structure. Then, the ink-printed structure is bonded to a display screen using adhesive to form the touch screen. By creating the air reservoir and airflow channel, the method effectively eliminates the generation of bonding bubbles, improves the yield rate, and effectively reduces the thickness of the adhesive.

[0006] However, existing technologies cannot solve the problem of air bubbles in the bonding between the ink layer and OCA caused by the high roughness of the ink layer. Furthermore, how to reduce or eliminate air bubbles in the bonding between the annular ink layer and OCA adhesive without changing the formulation and cost of the ink layer and OCA adhesive, and without affecting the adhesion effect between the ink layer and OCA adhesive, has become one of the key factors limiting the yield and display effect of 3A glass and display module bonding products. Summary of the Invention

[0007] To address the aforementioned technical problems, this invention provides a 3A glass cover plate and its preparation method. The method addresses the issue of swirling plating during the preparation of the entire AR film layer via magnetron sputtering. Instead, an annular AR layer is deposited on the surface of an annular ink layer, and then the annular ink layer is laser-polished. This allows the OCA adhesive to fully penetrate and fill the surface of the annular ink layer, solving the problem of air bubble rebound at the ink layer edge after debubbling following bonding of the ink layer and OCA adhesive, thus improving the bonding yield of the display module.

[0008] To achieve the above objectives, the present invention provides a 3A glass cover plate, comprising a glass substrate, one side of which includes a full-surface AG film layer, a full-surface AR film layer, and a full-surface AF film layer, and the other side includes an annular light-shielding ink layer, wherein an annular AR layer is provided on the annular light-shielding ink layer.

[0009] Preferably, the total thickness of the annular AR layer and the entire AR film layer is 100-300 nm, and the transmittance is 93-95%.

[0010] Preferably, the surface roughness of the annular light-shielding ink layer is 0.1-0.35μm, the thickness is 10-15μm, and the OD value is ≥5.

[0011] Preferably, the surface roughness of the entire AG film layer is 0.06-0.2μm and the haze is 4%-20%.

[0012] Preferably, the glass substrate is AGC soda-lime glass or Nanbo aluminosilicate glass.

[0013] Preferably, the raw material for the ring-shaped ink is Seiko HF GV3 body black.

[0014] This invention also provides a method for preparing a 3A glass cover, comprising the following steps: (1) Grind and clean the glass substrate, protect the first side that is not treated with full-surface AG, remove the protection after chemical etching and clean to obtain AG glass; (2) After chemical tempering, the AG glass is cleaned and a ring-shaped ink layer is screen-printed on the second side of the AG glass; (3) A protective film is applied to the non-ink area on the second side of the glass obtained in step (2), and an AR film layer is deposited on the entire first side. After completion, the protective film is removed to obtain AR glass. (4) Clean the AR glass, spray the entire surface of the first side with an AF film layer, and bake to obtain AF glass; (5) The second side of the AF glass is laser polished to obtain the 3A glass cover.

[0015] Preferably, the protection method described in step (1) is acid-resistant film protection or acid-resistant ink protection.

[0016] Preferably, the AR film layer deposited in step (3) is deposited by magnetron sputtering; the raw material of the AR film layer is a multilayer combination of Nb2O5 and SiO2.

[0017] More preferably, during the magnetron sputtering deposition, an annular AR layer is prepared by utilizing the swirling deposition phenomenon.

[0018] More preferably, the working gas pressure of the magnetron sputtering is 0.1 Pa, the working voltage is 300-600 V, the distance between the target and the substrate is 60-100 mm, the magnetic field strength is 400-1000 Gauss, the sputtering power is 8-12 kW, the distance between adjacent glass substrates is 30-100 mm, the temperature of the glass substrate is 100-200 °C, and the gas composition and flow rate are argon 100-300 sccm and oxygen 20-100 sccm. During sputtering, the sputtering direction of the target is perpendicular to the glass substrate.

[0019] More preferably, during magnetron sputtering, a 45° baffle is provided at the bottom of two adjacent glass substrates to improve the uniformity of AR film distribution on the annular ink layer during the winding deposition, so that the overall film thickness difference is controlled within 50nm.

[0020] Preferably, the thickness of the AF film layer in step (4) is 10-30 nm, the water droplet angle before friction is ≥110°, and the water droplet angle after friction is ≥100°.

[0021] Preferably, the power p of the laser polishing in step (5) is 0.05-0.15W, the frequency γ is 600-800KHz, the processing speed v is 1000-2000mm / s, the spot diameter d0 is 20-30μm, the line width d1 is 20-35μm, and the depth h is 0.1-0.3μm.

[0022] The beneficial effects of this invention are as follows: 1. By rationally utilizing the swirling deposition phenomenon that occurs during the fabrication of the full-surface AR film layer using magnetron sputtering, the concave and sharp corners of the annular ink layer screen-printed on the second side of the glass substrate are effectively filled to form an annular AR layer. This "flattening and filling" effect reduces the surface roughness of the ink to a certain extent, while also meeting the requirements of AR film layer anti-reflection and color matching. Furthermore, laser polishing is used to treat the convex parts of the annular ink layer, achieving a "peak smoothing" effect. This reduces the number and size of the concave and convex points on the surface of the annular ink layer, resulting in an annular ink layer with a surface roughness of 0.1-0.35μm, a uniform concave-convex structure without sharp corners. This effectively controls the surface defects of the annular ink layer and effectively increases the surface area of ​​the annular ink layer, improving the surface adhesion of the 3A glass and thus reducing the risk of separation failure between the 3A glass and the adhesive.

[0023] 2. The 3A glass prepared by this invention can fully penetrate and fill the surface of the annular ink layer and make close contact with the uniform uneven structure when bonded with OCA adhesive. This solves the problems of uneven surface structure and high roughness of existing annular ink layers, which cause the ink layer edge bubbles to rebound after debubbling when bonded with OCA adhesive, thus improving the bonding yield of the display module. Attached Figure Description

[0024] Figure 1 This is a top view of the baffle setup in step (4) of Example 1.

[0025] Figure 2 This is a side view of the baffle setup in step (4) of Example 1.

[0026] Figure 3 This is a schematic diagram of the side structure of the 3A glass prepared in Example 1 after being bonded with OCA adhesive.

[0027] Figure 4 This is a schematic diagram of the side structure of the 3A glass prepared in Comparative Example 1 after being bonded with OCA adhesive.

[0028] Figure 5 This is a photograph of the actual object showing the rebound of air bubbles at the edge of the ink layer after the 3A glass prepared in Comparative Example 1 was combined with OCA adhesive and a display screen to form a display model.

[0029] Figure 6This is a schematic diagram of the side structure of the 3A glass prepared in Comparative Example 2 after being bonded with OCA adhesive.

[0030] Figure 7 This is a schematic diagram of the side structure of the 3A glass prepared in Comparative Example 3 after being bonded with OCA adhesive.

[0031] Figure 8 This is a schematic diagram of the side structure of the 3A glass prepared in Comparative Example 4 after being bonded with OCA adhesive.

[0032] Figure 9 The images show the surface microstructure of the annular ink layer of 3A glass prepared in Example 1 and Comparative Example 1, where A represents Example 1 and B represents Comparative Example 1.

[0033] In the figure, 1 is the annular ink layer, 2 is the glass substrate, 3 is the full-surface AG film layer, 4 is the full-surface AR layer, 5 is the full-surface AF layer, 6 is the annular AR layer, 7 is the bubble, 8 is the OCA adhesive, and 9 is the baffle. Detailed Implementation

[0034] The technical solution of the present invention will be further explained and described below with reference to the accompanying drawings and specific embodiments. It is worth noting that the following embodiments are only preferred embodiments of the present invention and should not be construed as limiting the present invention. The scope of protection of the present invention should be determined by the contents of the claims. Modifications and substitutions made by those skilled in the art to the technical solution of the present invention without creative effort all fall within the scope of protection of the present invention.

[0035] Example 1 Using 1.3mm thick Nanbo aluminosilicate glass as the glass substrate, 3A glass was prepared. The specific steps are as follows: (1) Grind and clean the glass substrate, then divide the glass substrate into a first side and a second side. The first side is treated with AG on the whole surface, and the second side is protected with an anti-acid film. Then chemical etching is performed on the glass substrate. After the treatment, the anti-acid film is removed and the glass substrate is washed again with pure water to obtain AG glass with an AG film layer on the first side. The etching solution for chemical etching is prepared by mixing 40 parts ammonium fluoride, 10 parts citric acid, 5 parts barium sulfate, 8 parts starch, 5 parts bentonite, 15 parts ferric oxide, 15 parts calcium fluoride, 7 parts potassium nitrate, 4 parts hydrofluoric acid and 20 parts water and aging for 24 minutes. The etching conditions are etching for 1 minute and then washing with pure water. (2) The AG glass is chemically tempered and then washed with pure water to obtain tempered glass; the chemical tempering conditions are 6h in KNO3 molten salt at 400℃. (3) Screen print the first ring-shaped light-blocking ink (thickness of 6μm) on the second side of the tempered glass, then dry it at 150℃ for 30min, clean it and screen print the second ring-shaped light-blocking ink (thickness of 6μm), and dry it again to obtain the ring-shaped light-blocking ink layer with a total thickness of 12μm. (4) A PET protective film is covered in the middle visible area of ​​the annular light-shielding ink layer on the second side. Then, an AR film is deposited on the entire surface of the first side by magnetron sputtering. The annular AR layer is then deposited on the annular light-shielding ink layer by the phenomenon of magnetron sputtering, so that the total thickness of the entire AR film layer is 200nm and the total thickness of the annular AR layer is 100nm, thus obtaining AR glass. The magnetron sputtering process conditions are: working voltage 0.1Pa, working voltage 500V, distance between target and substrate 60-80mm, magnetic field strength 800Gauss, sputtering power 10kW, distance between adjacent glass substrates 60mm, temperature of glass substrate 180℃, and gas composition and flow rate argon 150sccm and oxygen 60sccm. In addition, before magnetron sputtering, a baffle with an inclination angle of 45° is added to the adjacent substrate. Figure 1-2 This method achieves uniform distribution of the AR film layer onto the ring-shaped ink, thereby controlling the overall film thickness difference to below 50nm. (5) After cleaning the AR glass with pure water, spray AF oil on the first side containing the full AR film layer, and dry it at 150°C for 30 minutes to obtain AF glass containing the full AF film layer. (6) The protrusion of the annular light-shielding ink layer on the second side of the AF glass is laser polished to remove the PET protective film and obtain 3A glass; wherein the laser polishing power p is 0.1W, the frequency γ is 750KHz, the processing speed v is 1000mm / s, the spot diameter d0 is 25um, the line width d1 is 28um, and the depth h is 0.25um.

[0036] Example 2 The method and steps are the same as in Example 1, except that the thickness of the annular light-blocking ink layer in step (3) is changed to 14 μm to prepare 3A glass.

[0037] Example 3 The method and steps are the same as in Example 1, except that the thickness of the annular light-blocking ink layer in step (3) is changed to 11 μm to prepare 3A glass.

[0038] Example 4 The method and steps are the same as in Example 1, except that the laser polishing power p in step (6) is changed to 0.05W, the line width d1 is changed to 25μm, and the depth h is changed to 0.1μm to prepare 3A glass.

[0039] Example 5 The method and steps are the same as in Example 1, except that the power p of laser polishing in step (6) is changed to 0.15W, the line width d1 is changed to 30μm, and the depth h is changed to 0.3μm, and 3A glass is prepared.

[0040] Example 6 The method and steps are the same as in Example 1, except that the laser polishing frequency γ in step (6) is changed to 600KHz, the line width d1 is changed to 29μm, and the depth h is changed to 0.27μm to prepare 3A glass.

[0041] Example 7 The method and steps are the same as in Example 1, except that the laser polishing frequency γ in step (6) is changed to 800KHz, the line width d1 is changed to 23μm, and the depth h is changed to 0.22μm to prepare 3A glass.

[0042] Example 8 The method and steps are the same as in Example 1, except that the laser polishing speed v in step (6) is changed to 2000KHz, the line width d1 is changed to 26μm, and the depth h is changed to 0.21μm, and 3A glass is prepared.

[0043] Example 9 The method and steps are the same as in Example 1, except that the total thickness of the entire AR film layer in step (4) is changed to 100 nm and the total thickness of the annular AR layer is 80 nm, and 3A glass is prepared.

[0044] Example 10 The method and steps are the same as in Example 1, except that the total thickness of the entire AR film layer in step (4) is changed to 300 nm and the total thickness of the annular AR layer is 180 nm, and 3A glass is prepared.

[0045] Example 11 The method and steps are the same as in Example 1, except that the distance between the target and the glass substrate in the magnetron sputtering process parameters in step (4) is changed to 80-100mm, and the distance between adjacent glass substrates is changed to 30mm.

[0046] Example 12 The method and steps are the same as in Example 1, except that the distance between adjacent glass substrates in the magnetron sputtering process parameters in step (4) is changed to 100mm.

[0047] Comparative Example 1 The method and steps are the same as in Example 1. In step (4), when magnetron sputtering is performed to deposit an AR film on the entire surface, a PET protective film is used to cover the entire surface on the second side to protect the visible area and the ink area to avoid the phenomenon of wrapping. At the same time, the laser polishing process in step (6) is omitted, and 3A glass is prepared.

[0048] Comparative Example 2 The method and steps are the same as in Example 1, except that the laser polishing process in step (6) is omitted, and 3A glass is prepared.

[0049] Comparative Example 3 The method and steps are the same as in Example 1, except that in step (4), when magnetron sputtering is performed to deposit an AR film on the entire surface, a PET protective film is used to cover the entire surface on the second side to protect the visible area and the ink area and avoid the phenomenon of wrapping the film, so as to prepare 3A glass.

[0050] Comparative Example 4 The method and steps are the same as in Example 1, except that the laser polishing process parameters in step (6) are adjusted to power p = 0.02W, line width d1 = 20μm, and depth h = 0.05μm to prepare 3A glass.

[0051] Comparative Example 5 The method and steps are the same as in Example 1, except that the laser polishing process parameters in step (6) are adjusted to power p = 0.2W, line width d1 = 31μm, and depth h = 0.35μm to prepare 3A glass.

[0052] Comparative Example 6 The method and steps are the same as in Example 1, except that the laser polishing process parameters in step (6) are adjusted to change the processing speed v to 500 mm / s, the line width d1 to 15 μm, and the depth h to 0.05 μm, so that 3A glass can be prepared.

[0053] Comparative Example 7 The method and steps are the same as in Example 1, except that the laser polishing process parameters in step (6) are adjusted so that the processing speed v is changed to 2500 mm / s, the line width d1 is changed to 45 μm, and the depth h is changed to 0.4 μm, and 3A glass is prepared.

[0054] Comparative Example 8 The method and steps are the same as in Example 1, except that the distance between adjacent glass substrates in magnetron sputtering in step (4) is changed to 20 mm to prepare 3A glass.

[0055] Comparative Example 9 The method and steps are the same as in Example 1, except that the distance between adjacent glass substrates in magnetron sputtering in step (4) is changed to 110 mm to prepare 3A glass.

[0056] Comparative Example 10 The method and steps are the same as in Example 1, except that the 45° baffle is not used in the magnetron sputtering process in step (4) to prepare 3A glass.

[0057] Results Testing: The 3A glass prepared in the above examples and comparative examples was bonded to the display screen (BOE) using OCA adhesive (3M CEF2810). Then, it was degassed under pressure at 30℃ and 0.5MPa for 30 minutes. After 12 hours, the edge bubble rebound defect rate of the prepared display modules was counted, and the bonding strength was tested with reference to ASTM D3330. The results are shown in Table 1. 500 sets of display modules were prepared for each example or comparative example. The edge bubble rebound defect rate of the 500 sets of display modules was counted, and 5 sets were randomly selected to test the bonding strength between the 3A glass and OCA. The average value was taken as the final bonding strength.

[0058] Table 1 Performance parameters of display modules composed of 3A glass prepared under different conditions

[0059] Note: Surface roughness refers to the roughness of the annular ink layer on the second side of 3A glass.

[0060] The results showed that Examples 1-12 used a wrap-around plating method to fill the annular AR layer on the surface of the annular ink layer, and used laser polishing technology to treat the convex sharp corners of the annular ink layer, so that the surface roughness was controlled within 0.1-0.35μm, which significantly reduced the number and size of the uneven structure on the surface of the ink layer. Figure 3 , Figure 9 A) Effective control of surface defects resulted in a final rate of less than 0.2-0.6% of bubbles rebounding after bonding with OCA adhesive, significantly improving the bonding yield. In addition, the introduction of the annular AR layer and laser polishing effectively increased the contact area between the annular ink layer and the OCA adhesive, enabling the bonding strength between the 3A glass cover and the OCA adhesive to reach more than 20N / 25mm, demonstrating excellent performance.

[0061] Comparative Example 1, without laser polishing and avoiding the magnetron sputtering phenomenon, failed to form an annular AR layer on the annular ink layer. The surface of the annular ink layer had a high surface roughness Ra0.78µm. The OCA optical adhesive could not effectively fill the concave and convex corners of the ink surface, forming bonding gaps. When degassing was performed under pressure, external gas easily entered these bonding gaps, forming rebound bubbles, resulting in a high proportion of rebound bubble defects (35.8%). Figure 4-5 , Figure 9 B).

[0062] Comparative Example 2 was not laser polished, therefore the surface of the annular ink layer had a high surface roughness Ra0.56um, with many surface defects such as bumps and depressions. The OCA optical adhesive could not effectively fill the bumps and depressions, forming bonding pores. When pressure was applied for degassing, external gas could easily enter the bonding pores and form rebound bubbles, resulting in a high proportion of rebound bubble defects (5.6%). Figure 6 ).

[0063] Comparative Example 3 avoided the swirling deposition phenomenon of magnetron sputtering, and no annular AR layer was formed on the annular ink layer, resulting in a high surface roughness Ra0.42um. After bonding and debubbling, the poor bubble rebound rate increased to 4.2%. Figure 7 ).

[0064] Comparative Example 4 used a lower laser power (p = 0.02W) to treat the annular ink layer, resulting in insufficient surface polishing of the ink layer and a still high roughness (0.47μm). This also resulted in a high rate of bubble rebound defects after bonding and debubbling (5.8%). Figure 8 ).

[0065] Comparative Example 5 uses a higher laser power (p = 0.2W) to treat the annular ink layer, which significantly reduces the surface roughness to 0.07μm and gives it a smooth and flat surface. However, because the surface of the annular ink layer is too smooth, the adhesion between it and OCA decreases, which reduces the bonding strength between the 3A glass cover and the OCA adhesive to 12N / 25mm, making it prone to separation failure from the adhesive.

[0066] Comparative Example 6 uses a lower processing speed, lower line width and depth to process the annular ink layer. Although its bubble rebound defect rate is the same as that of Example 1, the surface roughness is only 0.08 μm, which leads to a significant decrease in bonding strength (12 N / 25 mm), thus making it easier to handle the risk of separation failure between the glass substrate and the adhesive.

[0067] Comparative Example 7 uses a higher processing speed, higher line width and depth to process the ring-shaped ink layer. Although it has a higher surface roughness and adhesion strength, the bubble rebound defect rate is as high as 3.80%, which significantly affects the product yield.

[0068] In Comparative Example 9, further increasing the distance between adjacent glass substrates, while not affecting surface roughness, bubble rebound failure rate, or bonding strength, reduces layout utilization, thereby reducing production efficiency and is not suitable for actual production.

[0069] Comparative Example 10, without the use of a 45° baffle, exhibited uneven coating thickness, extremely large surface roughness (0.1~0.58µm), and a bubble rebound defect rate as high as 5.0%, significantly impacting product yield. In some areas, the roughness was lower and the surface was smoother, leading to a decrease in adhesion between the coating and OCA, thereby reducing the bond strength between the 3A glass cover and the OCA adhesive to 15N / 25mm.

Claims

1. A 3A glass cover plate, comprising a glass substrate, one side of the glass substrate comprising an entire AG film layer, an entire AR film layer, and an entire AF film layer, and the other side comprising an annular light-shielding ink layer, characterized in that: The annular light-shielding ink layer has an annular AR layer.

2. The 3A glass cover plate according to claim 1, characterized in that: The total thickness of the annular AR layer and the full-surface AR film layer is 100-300nm, and the transmittance is 93-95%.

3. The 3A glass cover plate according to claim 1, characterized in that: The surface roughness of the annular light-shielding ink layer is 0.1-0.35μm, the thickness is 10-15μm, and the OD value is ≥5.

4. A method for preparing a 3A glass cover plate as described in claim 1, characterized in that: Includes the following steps: (1) Grind and clean the glass substrate, protect the first side that is not treated with full-surface AG, remove the protection after chemical etching and clean to obtain AG glass; (2) After chemical tempering, the AG glass is cleaned and a ring-shaped ink layer is screen-printed on the second side of the AG glass; (3) A protective film is applied to the non-ink area on the second side of the glass obtained in step (2), and an AR film layer is deposited on the entire first side. After completion, the protective film is removed to obtain AR glass. (4) Clean the AR glass, spray the entire surface of the first side with an AF film layer, and bake to obtain AF glass; (5) The second side of the AF glass is laser polished to obtain the 3A glass cover.

5. The preparation method according to claim 4, characterized in that: The protection method described in step (1) is acid-resistant film protection or acid-resistant ink protection.

6. The preparation method according to claim 4, characterized in that: The AR film layer in step (3) is deposited by magnetron sputtering; the raw material of the AR film layer is a multilayer combination of Nb2O5 and SiO2.

7. The preparation method according to claim 6, characterized in that: During the magnetron sputtering deposition process, a ring-shaped AR layer is prepared by utilizing the swirling deposition phenomenon.

8. The preparation method according to claim 4, characterized in that: The thickness of the AF film layer in step (4) is 10-30nm, and the water droplet angle after rubbing is ≥100°.

9. The preparation method according to claim 4, characterized in that: The power p of the laser polishing in step (5) is 0.05-0.15W, the frequency γ is 600-800KHz, the processing speed v is 1000-2000mm / s, the spot diameter d0 is 20-30μm, the line width d1 is 20-35μm, and the depth h is 0.1-0.3μm.

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