An optimization device, an optimization method, a terminal and a medium for a chemical plating process

Abstract

The application relates to the technical field of glass via processing, and discloses a chemical plating process optimization device, an optimization method, a terminal and a medium, the optimization device comprising a plating solution barrel, a driving module, a jet flow module, a jet air module, a heating module and a control module, a reaction tank for containing plating solution is arranged on the plating solution barrel; the end of the driving module is provided with a test sample to be processed; the driving module is used for moving the test sample into the plating solution in the reaction tank and driving the test sample to do horizontal circular motion; the jet flow module is arranged in the plating solution barrel, and a liquid outlet rotating in a horizontal plane is arranged on the jet flow module; the jet air module is arranged in the plating solution barrel; a gas outlet rotating in a vertical plane is arranged on the jet air module; the heating module is arranged around the plating solution barrel; and the control module is electrically connected with the driving module, the jet flow module, the jet air module and the heating module. By adjusting the directions of the liquid outlet and the gas outlet and the heating temperature, the processing parameters can be optimized, the product quality can be improved, and the efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the field of glass through-hole processing technology, and in particular to an optimization device, optimization method, terminal and medium for a chemical plating process. Background Technology

[0002] In the field of glass through-hole processing technology, electroless plating is a self-catalytic metal deposition process that does not require an external current. It forms a conductive metal layer (such as copper, nickel, or gold) through a chemical reduction reaction on the inner surface of the glass through-hole. The process mainly includes: first, thoroughly cleaning the glass through-hole to remove contaminants; then, forming palladium catalytic centers on the hole wall surface through sensitization and activation steps, or pre-preparing a metal seed layer using physical vapor deposition; finally, immersing the substrate in an electroless plating solution containing metal ions, a reducing agent, and a complexing agent, where a redox reaction occurs on the catalytic surface, achieving uniform metal deposition within the hole. The key to this technology lies in the deposition rate and coating quality. Therefore, existing electroless plating equipment often uses methods such as jetting and gas injection to "stir" the plating solution to control its uniformity, pH value, and temperature.

[0003] However, existing glass substrates have diverse product parameters due to variations in size, thickness, via density, and via diameter. During chemical plating, the flow direction of the plating solution is often fixed. For some glass substrates, the angle and flow rate of the plating solution are suitable when it flows through the via, allowing for efficient flow into the via. However, for glass substrates with other product parameters, the flow rate and direction of the plating solution may affect the uniformity of the plating layer within the via, resulting in slower entry and lower flow rates. This impacts processing efficiency.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide an optimization device, optimization method, terminal, and medium for chemical plating processes, aiming to solve the problem that in chemical plating processes, the plating solution cannot contact the glass substrate at the optimal contact angle and optimal contact time, thus compromising product quality.

[0006] The problem.

[0007] The technical solution of the present invention is as follows:

[0008] An optimization apparatus for a chemical plating process, comprising:

[0009] A plating solution tank, wherein the plating solution tank is provided with a reaction tank for containing the plating solution;

[0010] A drive module, with a test sample to be processed disposed at its end; the drive module is used to move the test sample into the plating solution of the reaction tank and drive the test sample to perform horizontal circular motion.

[0011] A jetting module is installed inside the plating solution tank. The jetting module is equipped with a liquid outlet that rotates in a horizontal plane. The liquid outlet is used to spray plating solution into the reaction tank.

[0012] An air jet module is located inside the plating solution tank; the air jet module is provided with an air outlet that rotates in a vertical plane, and the air outlet is used to jet air into the reaction tank;

[0013] A heating module is arranged around the plating solution tank for heating the plating solution inside the tank;

[0014] The control module is electrically connected to the drive module, the jet module, the air jet module, and the heating module.

[0015] The optimized apparatus for the electroless plating process, wherein the driving module includes:

[0016] Elevator;

[0017] A rotary motor is mounted on the lifting device;

[0018] The hook is connected to the rotary motor via a coupling.

[0019] The suspended basket is hung on the hook.

[0020] A clamp is mounted on the basket; the clamp is used to hold the test sample.

[0021] Both the lifting device and the rotary motor are electrically connected to the control module.

[0022] The optimized apparatus for the chemical plating process, wherein the jetting module includes:

[0023] A fixed base is provided on the bottom surface of the reaction tank;

[0024] The jet pipe is rotatably inserted into the fixed base; the jet pipe extends vertically and has several horizontally opened liquid outlets; and the jet pipe has several circumferentially arranged grooves.

[0025] A first motor is located on the bottom surface of the reaction tank; the first motor is electrically connected to the control module; a first transmission gear is provided on the output shaft of the first motor, and the first transmission gear meshes with the tooth groove.

[0026] The optimized apparatus for the electroless plating process includes a fixed base that is annular; multiple jet pipes are provided, which are spaced apart circumferentially along the fixed base and arranged in a ring around the test sample.

[0027] The optimized apparatus for the chemical plating process, wherein the jetting module includes:

[0028] A guide pipe is connected to the plating solution tank and leads to the reaction tank;

[0029] The flow meter is connected to the guide pipe;

[0030] A filter is connected to the flow meter;

[0031] A negative pressure pump, with its inlet end connected to the filter and its outlet end connected to the spray pipe;

[0032] The flow meter and the negative pressure pump are both electrically connected to the control module.

[0033] The optimized apparatus for the electroless plating process, wherein the jetting module includes:

[0034] air pump;

[0035] The gas guide bracket has one end connected to the gas pump and the other end extending to the bottom surface of the reaction tank;

[0036] The gas outlet pipe is rotatably inserted into the gas guide support; the gas outlet pipe extends horizontally and is laid flat on the bottom surface of the reaction tank; the gas outlet pipe has a plurality of gas outlets arranged axially; the gas outlet pipe has a plurality of protruding teeth arranged circumferentially.

[0037] A second motor is located on the bottom surface of the reaction tank; the second motor is electrically connected to the control module; a second transmission gear is provided on the output shaft of the second motor, and the second transmission gear meshes with the convex tooth.

[0038] The optimized apparatus for the electroless plating process includes a heating module comprising a heat exchanger and a heat exchange tube connected to the heat exchanger; and the heat exchange tube is arranged around the plating solution tank.

[0039] This application also discloses an optimization method for a chemical plating process, applied to an optimization apparatus for any of the chemical plating processes described above; wherein the optimization method includes:

[0040] Construct a processing parameter sample set; wherein, the processing parameter sample set includes multiple processing parameters, and the processing parameters include one or more of the following: plating solution spray velocity, plating solution spray angle, plating solution temperature, aeration velocity, and aeration angle;

[0041] The test sample is processed using the processing parameters in the processing parameter sample set to obtain a product dataset; wherein, the product dataset includes multiple product parameters, and the product parameters include at least one of coating thickness and coating surface flatness;

[0042] Based on the product dataset, the optimal product parameters are determined, and the optimal processing parameters are located using the optimal product parameters.

[0043] This application also discloses a terminal, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the optimized method for the electroless plating process as described above.

[0044] This application also discloses a computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium; when the computer program is processed and executed, it implements the steps of the optimization method for the electroless plating process as described above.

[0045] Compared with the prior art, the embodiments of the present invention have the following advantages:

[0046] The optimized device disclosed in this invention replicates the processing environment during electroless plating. Through an automated control drive module, a jetting module, an air-purifying module, and a heating module, it can control multiple processing parameters. In particular, it can adjust the direction of the liquid outlet and the air outlet to control the flow path of the plating solution and adjust the contact angle and contact time between the plating solution and the surface of the test sample. Therefore, during repeated experiments, adjustments can be made based on the dimensional parameters of the test sample to find suitable processing parameters such as jetting angle, jetting pressure, air-purifying angle, air-purifying pressure, and heating temperature, with the goal of improving product quality and processing efficiency.

[0047] In summary, this invention reduces the electroless plating process and tests the processing parameters during the electroless plating process. It can optimize test samples with different product parameters, find processing solutions that are beneficial to improving product quality, and improve processing efficiency. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the structure of the optimization device for the chemical plating process in this invention;

[0050] Figure 2This is an exploded view of the structure of the optimized apparatus for the chemical plating process in this invention;

[0051] Figure 3 for Figure 2 A magnified view of a section at point A in the middle;

[0052] Figure 4 This is a flowchart of the optimization method for the chemical plating process in this invention;

[0053] Figure 5 This diagram illustrates the application environment of the optimized method based on electroless plating in this invention.

[0054] Figure 6 This is a schematic diagram of the terminal in this invention.

[0055] Among them, 10. Plating solution tank; 11. Reaction tank; 20. Drive module; 21. Lifter; 22. Rotary motor; 23. Hook; 24. Hanging basket; 25. Fixture; 30. Spray module; 31. Liquid outlet; 32. Fixed base; 33. Spray pipe; 34. First motor; 35. Guide pipe; 36. Flow meter; 37. Filter; 38. Negative pressure pump; 40. Air jet module; 41. Air pump; 42. Air guide bracket; 43. Air outlet pipe; 44. Second motor; 50. Heating module; 51. Heat exchanger; 52. Heat exchange tube; 102. Terminal; 104. Server. Detailed Implementation

[0056] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0057] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the accompanying drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings, but include changes in shape that may occur during manufacturing. The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all contents, operations, or steps, nor do they necessarily need to be performed in the order described. For example, some operations or steps may be broken down, combined, or partially merged, so the actual order of execution may change depending on the specific circumstances.

[0058] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0059] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0060] For ease of description, spatial relational terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relational terms are intended to encompass not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways, and the spatial relational terms used herein will be interpreted accordingly.

[0061] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0062] See Figure 1 One embodiment of this invention discloses an optimization device for a chemical plating process, comprising a plating bath tank 10, a drive module 20, a jetting module 30, an air jetting module 40, a heating module 50, and a control module. The optimization device disclosed in this embodiment replicates the processing environment of the chemical plating process. Plating solution is injected into the plating bath tank 10. The control module automatically controls the drive module 20, jetting module 30, air jetting module 40, and heating module 50, controlling multiple processing parameters and adjusting the flow state of the plating solution during chemical plating. It can also test samples with different product parameters, optimize processing parameters, identify processing schemes that improve product quality, and increase processing efficiency.

[0063] Specifically, such as Figure 1 and Figure 2As shown, the plating bath 10 disclosed in this embodiment is provided with a reaction tank 11 for containing the plating bath; the end of the drive module 20 is provided with a test sample to be processed, and the drive module 20 is used to move the test sample into the plating bath of the reaction tank 11 and drive the test sample to perform horizontal circular motion. The test sample disclosed in this embodiment can be a glass substrate sample, or the glass substrate to be processed can be used directly for testing. The number and position of through holes on the test sample are exactly the same as the number and position of through holes on the glass substrate to be processed. Therefore, the processing effect obtained from the test has reference value for the actual processing process and can guide operators to set more reasonable processing conditions to improve the production quality and efficiency of the product.

[0064] Specifically, the test sample is placed at the end of the drive module 20, and the drive module 20 drives the test sample to move, so as to precisely control the position and movement path of the test sample, improve the processing accuracy, and reduce the interference of adverse factors.

[0065] like Figure 2 and Figure 3 As shown, the spray module 30 is disposed inside the plating solution tank 10, and the spray module 30 is provided with a liquid outlet 31 that rotates in a horizontal plane. The liquid outlet 31 is used to spray plating solution into the reaction tank 11. The air jet module 40 is disposed inside the plating solution tank 10. The air jet module 40 is provided with an air outlet that rotates in a vertical plane. The air outlet is used to spray air into the reaction tank 11. The heating module 50 is disposed around the plating solution tank 10 and is used to heat the plating solution inside the plating solution tank 10. The control module is electrically connected to the drive module 20, the spray module 30, the air jet module 40, and the heating module 50.

[0066] During repeated trials, the direction of the liquid outlet 31 and the air outlet can be adjusted to control the flow path of the plating solution, and to adjust the contact angle and contact time between the plating solution and the surface of the test sample. The appropriate processing parameters such as the jet angle, jet pressure, air jet angle, air jet pressure, and heating temperature can be found with the goal of improving product quality and processing efficiency.

[0067] In summary, this embodiment reduces the electroless plating process and tests the processing parameters during the electroless plating process. It can optimize the test samples with different product parameters, find processing solutions that are conducive to improving product quality, and improve processing efficiency.

[0068] Specifically, the control module disclosed in this embodiment includes, but is not limited to, electronic devices such as mobile phones, tablets, laptops, desktop computers, and smartwatches. These devices can be wired to the drive module 20, jet module 30, jet module 40, and heating module 50 via wires, or wirelessly connected via Bluetooth antennas. Furthermore, the control module disclosed in this embodiment can be mounted on the plating tank 10 or installed independently for easy handling and operation.

[0069] like Figure 1 and Figure 2 As shown in another embodiment of this application, the drive module 20 includes a lifter 21, a rotary motor 22, a hook 23, a basket 24, and a clamp 25. The rotary motor 22 is mounted on the lifter 21. The hook 23 is connected to the rotary motor 22 via a coupling. The basket 24 is hung on the hook 23. The clamp 25 is mounted on the basket 24. The clamp 25 is used to hold test samples. Both the lifter 21 and the rotary motor 22 are electrically connected to the control module.

[0070] The drive module 20 disclosed in this embodiment can drive the rotary motor 22, hook 23, and basket 24 to move the test sample into the reaction tank 11 synchronously via the lifter 21; the rotary motor 22 drives the hook 23 and basket 24 to rotate synchronously to rotate the test sample. In other words, the drive module 20 disclosed in this embodiment can drive the test sample to perform lifting and rotation actions simultaneously, increasing flexibility, allowing the test sample to have more complete contact with the plating solution, further improving product quality and enhancing the uniformity of the plating layer.

[0071] Specifically, the lifting device 21 disclosed in this embodiment can be a DC motor or a stepper motor. A vertically arranged transmission rod or lead screw is connected to the output shaft of the lifting device 21 via a coupling. The distal end of the transmission rod or lead screw is connected to the rotary motor 22 to achieve the effect of the lifting device 21 driving the rotary motor 22 to lift. The rotary motor 22 disclosed in this embodiment can be any one of a stepper motor, a DC motor, or a servo motor. Preferably, the lifting device 21 and the rotary motor 22 can use the same type of motor to simplify the structure and reduce the production cost of the device.

[0072] Specifically, the hook 23 and basket 24 disclosed in this embodiment are detachably assembled. The basket 24 can be removed, the test sample can be fixed on the clamp 25, and then hung on the hook 23, facilitating the replacement of the test sample for repeated testing. Furthermore, the drive module 20 disclosed in this embodiment may also include a vibrating element, such as an ultrasonic generator. By setting the ultrasonic generator on the hook 23 or basket 24 and activating it at regular time intervals, the basket 24 can be intermittently excited, causing the test sample to vibrate. This reduces air bubbles on the surface and in the through-holes of the test sample, further improving product quality and enhancing the uniformity of the coating.

[0073] For example Figure 2 As shown in another embodiment of this application, the jet module 30 includes a fixed base 32, a jet pipe 33, and a first motor 34. The fixed base 32 is disposed on the bottom surface of the reaction tank 11. The jet pipe 33 is rotatably inserted into the fixed base 32. The jet pipe 33 extends vertically and has a plurality of horizontally opened liquid outlets 31. Furthermore, the jet pipe 33 has a plurality of circumferentially arranged grooves. The first motor 34 is disposed on the bottom surface of the reaction tank 11. The first motor 34 is electrically connected to the control module. A first transmission gear is disposed on the output shaft of the first motor 34, and the first transmission gear meshes with the grooves.

[0074] The fixed base 32 disclosed in this embodiment can be fixed to the inner wall of the plating tank 10 by welding or bonding. Specifically, the spray pipe 33 is assembled on the fixed base 32 on the bottom surface of the reaction tank 11, which can keep the spray pipe 33 stable. Furthermore, the spray pipe 33 is inserted into the fixed base 32, and the spray pipe 33 can be rotated by the meshing of the first motor 34 and the first transmission gear, so as to adjust the direction of the liquid outlet 31, thereby achieving the purpose of adjusting the processing conditions and optimizing the processing parameters.

[0075] Specifically, the spray pipe 33 disclosed in this embodiment can be screwed to the fixed base 32, or a groove with an opening at the top can be provided on the fixed base 32, and an annular protrusion can be provided on the side wall of the groove, while an annular groove can be provided on the outer side wall of the spray pipe 33. During assembly, the spray pipe 33 is inserted into the groove, and the annular protrusion engages with the annular groove, thereby connecting the spray pipe 33 to the fixed base 32. At the same time, the spray pipe 33 can rotate freely, making the position of the liquid outlet 31 adjustable and controlling the flow direction of the plating solution.

[0076] Specifically, in this embodiment, a sealing ring can be fitted onto the spray pipe 33, with the outer side of the sealing ring abutting against the fixed base 32, thereby increasing the airtightness of the connection between the fixed base 32 and the spray pipe 33. The fixed base 32 can be hollow to allow the plating solution to be introduced.

[0077] Specifically, as another embodiment of this application, the fixed base 32 is disclosed to be annular; multiple spray pipes 33 are provided, and the multiple spray pipes 33 are arranged at intervals along the circumference of the fixed base 32 and are arranged in a ring around the test sample. Providing multiple spray pipes 33 can increase the outflow rate of the plating solution, which is beneficial for increasing the flow rate of the plating solution, increasing the flow rate, further improving the uniformity of the plating solution, and simultaneously increasing the probability of contact between the plating solution and the test sample.

[0078] In this embodiment, the annular fixed base 32 can simultaneously deliver plating solution to multiple spray pipes 33, so that the plating solution flowing out of each spray pipe 33 has the same speed, making the plating solution flow more uniform and avoiding the occurrence of local concentrations of metal particles in the plating solution being too high or too low.

[0079] For example Figure 2 As shown, in another embodiment of this application, the jetting module 30 includes a guide pipe 35, a flow meter 36, a filter 37, and a negative pressure pump 38. The guide pipe 35 is connected to the plating tank 10 and leads to the reaction tank 11. The flow meter 36 is connected to the guide pipe 35. The filter 37 is connected to the flow meter 36. The inlet end of the negative pressure pump 38 is connected to the filter 37, and the outlet end is connected to the jetting pipe 33. The flow meter 36 and the negative pressure pump 38 are both electrically connected to the control module.

[0080] In this embodiment, the spray module 30 continuously pumps plating solution into the reaction tank 11, and then discharges the reacted plating solution through the guide pipe 35. The solution is measured by the flow meter 36, filtered by the filter 37, and pumped back into the reaction tank 11 by the negative pressure pump 38, achieving the effect of purifying the plating solution and recycling it. Simultaneously, by monitoring the data from the flow meter 36, the flow velocity of the plating solution can be calculated, the pressure at the outlet 31 can be determined, and the spray speed and flow rate can be precisely controlled, improving the control accuracy of the device.

[0081] For example Figure 1 and Figure 2As shown, in another embodiment of this application, the jet module 40 includes an air pump 41, an air guide bracket 42, an air outlet pipe 43, and a second motor 44. One end of the air guide bracket 42 is connected to the air pump 41, and the other end extends to the bottom surface of the reaction tank 11. The air outlet pipe 43 is rotatably inserted into the air guide bracket 42. The air outlet pipe 43 extends horizontally and is laid flat on the bottom surface of the reaction tank 11. Several air outlets are arranged axially on the air outlet pipe 43. Several protruding teeth are arranged circumferentially on the air outlet pipe 43. The second motor 44 is located on the bottom surface of the reaction tank 11. The second motor 44 is electrically connected to the control module. A second transmission gear is arranged on the output shaft of the second motor 44, and the second transmission gear meshes with the protruding teeth.

[0082] The air pump 41 disclosed in this embodiment includes, but is not limited to, commonly used air pumps such as vacuum pumps and rotary pumps. By pumping high-pressure air into the air guide support 42 and the air outlet pipe 43, high-pressure air enters the reaction tank 11, further promoting the flow of the plating solution and increasing its uniformity. Simultaneously, the direction of the air jet also affects the flow direction of the plating solution. Therefore, a second motor 44 is configured to mesh with a second transmission gear to drive the air outlet pipe 43 to rotate, thereby adjusting the angle of the air outlet and further regulating the fluidity of the plating solution.

[0083] For example Figure 2 As shown in another embodiment of this application, the heating module 50 includes a heat exchanger 51 and a heat exchange tube 52, with the heat exchange tube 52 connected to the heat exchanger 51; and the heat exchange tube 52 is arranged around the plating solution tank 10. In this embodiment, the heat exchange tube 52 can be filled with a gaseous or liquid medium, which is heated within the heat exchanger 51. The heat is then transferred to the plating solution tank 10, causing a change in the temperature of the plating solution within the tank 10, thus achieving the effect of controlling the plating solution temperature. In this embodiment, controlling the plating solution temperature through the heating module 50 increases the controllable factors in the testing process, further improving the accuracy and effectiveness of the optimization results.

[0084] like Figure 4 As shown, as another embodiment of this application, a method for optimizing a chemical plating process is also disclosed, applied to the optimization apparatus for the chemical plating process described above. The method for optimizing a chemical plating process provided by this embodiment of the invention can be applied to processes such as... Figure 5In the application environment shown, terminal 102 communicates with server 104 via a network. A data storage system can store the data that server 104 needs to process. The data storage system can be integrated onto server 104, or it can be located in the cloud or on another network server. The optimization method for the electroless plating process can be executed by terminal 102 or server 104, or it can be executed collaboratively by terminal 102 and server 104. Of course, the optimization method for the electroless plating process in this embodiment can also be implemented based on the electroless plating equipment itself.

[0085] The terminal 102 can be a smartphone, tablet, laptop, desktop computer, smart speaker, smartwatch, IoT device, or portable wearable device. IoT devices can include smart speakers, smart TVs, smart air conditioners, and smart in-vehicle devices, etc. Portable wearable devices can include smartwatches, smart bracelets, and head-mounted devices, etc.

[0086] Server 104 can be an independent physical server or a service node in a blockchain system, where the service nodes form a peer-to-peer network.

[0087] In addition, server 104 can also be a server cluster consisting of multiple physical servers, which can be a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms.

[0088] Terminal 102 and server 104 can be connected via Bluetooth, USB (Universal Serial Bus) or network, etc., and the present invention does not limit this connection.

[0089] Specifically, such as Figure 4 As shown, the optimization method includes:

[0090] Step S10: Construct a processing parameter sample set; wherein, the processing parameter sample set includes multiple processing parameters, and the processing parameters include one or more of the following: plating solution spray velocity, plating solution spray angle, plating solution temperature, aeration velocity, and aeration angle;

[0091] Step S20: Process the test sample using the processing parameters in the processing parameter sample set to obtain a product dataset; wherein, the product dataset includes multiple product parameters, and the product parameters include at least one of coating thickness and coating surface flatness;

[0092] Step S30: Based on the product dataset, determine the optimal product parameters, and use the optimal product parameters to locate the optimal processing parameters.

[0093] In this embodiment, by establishing a sample set of processing parameters and a dataset of products, and establishing a one-to-one mapping relationship, scientific experimental methods such as the controlled variable method can be used to test product quality, identify the processing conditions corresponding to high-quality products, optimize the processing parameters in the electroless plating process, which is conducive to high-efficiency product quality, making full use of electroless plating equipment, and reducing costs and increasing efficiency.

[0094] As another embodiment of this application, a terminal is also disclosed, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the optimized method for the electroless plating process as described above.

[0095] As another embodiment of this application, a terminal is also disclosed, the internal structure of which can be shown in the figure below. Figure 6 As shown, the terminal includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies.

[0096] When executed by a processor, the computer program implements an optimized method for a chemical plating process. The terminal's display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The terminal's input device can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the terminal casing, or an external keyboard, touchpad, or mouse, etc.

[0097] Those skilled in the art will understand that Figure 6 The structure shown is merely a block diagram of a portion of the structure related to the present invention and does not constitute a limitation on the terminal to which the present invention is applied. A specific terminal may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0098] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided by this invention can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided by this invention may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided by this invention may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0099] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (FPGAs), field-programmable gate arrays (FPGAs), etc.

[0100] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0101] As another embodiment of this application, a computer-readable storage medium is also disclosed, wherein a computer program is stored on the computer-readable storage medium; when the computer program is processed and executed, it implements the steps of the optimization method for the electroless plating process as described above.

[0102] In summary, this application discloses an optimization device for a chemical plating process, comprising a plating bath 10, a drive module 20, a jetting module 30, an air jetting module 40, a heating module 50, and a control module. The plating bath 10 is provided with a reaction tank 11 for containing the plating solution. A test sample to be processed is disposed at the end of the drive module 20. The drive module 20 is used to move the test sample into the plating solution in the reaction tank 11 and drive the test sample to perform horizontal circular motion. The jetting module 30 is disposed within the plating bath 10. The device 30 is equipped with a liquid outlet 31 that rotates in a horizontal plane, used to spray plating solution into the reaction tank 11; the jetting module 40 is located inside the plating solution tank 10; the jetting module 40 is equipped with an air outlet that rotates in a vertical plane, used to spray air into the reaction tank 11; the heating module 50 is arranged around the plating solution tank 10, used to heat the plating solution inside the plating solution tank 10; the control module is electrically connected to the drive module 20, the jetting module 30, the jetting module 40, and the heating module 50. By reducing the chemical plating process and testing the processing parameters during the chemical plating process, optimization can be performed on test samples with different product parameters to find processing schemes that are beneficial to improving product quality and increasing processing efficiency.

[0103] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0104] It should be noted that this invention uses the optimization device, optimization method, terminal and medium of chemical plating process as an example to introduce the specific structure and working principle of the invention. However, the application of this invention is not limited to the optimization device, optimization method, terminal and medium of chemical plating process, and can also be applied to the production and use of other similar workpieces.

[0105] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

[0106] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An optimization device for a chemical plating process, characterized in that, include: A plating solution tank, wherein the plating solution tank is provided with a reaction tank for containing the plating solution; A drive module, with a test sample to be processed disposed at its end; the drive module is used to move the test sample into the plating solution of the reaction tank and drive the test sample to perform horizontal circular motion. A jetting module is installed inside the plating solution tank. The jetting module is equipped with a liquid outlet that rotates in a horizontal plane. The liquid outlet is used to spray plating solution into the reaction tank. An air jet module is located inside the plating solution tank; the air jet module is provided with an air outlet that rotates in a vertical plane, and the air outlet is used to jet air into the reaction tank; A heating module is arranged around the plating solution tank for heating the plating solution inside the tank; The control module is electrically connected to the drive module, the jet module, the jet module, and the heating module. The driving module includes: Elevator; A rotary motor is mounted on the lifting device; The hook is connected to the rotary motor via a coupling. The suspended basket is hung on the hook. A clamp is mounted on the basket; the clamp is used to hold the test sample. Both the lifting device and the rotary motor are electrically connected to the control module. The jet module includes: A fixed base is provided on the bottom surface of the reaction tank; The jet pipe is rotatably inserted into the fixed base; the jet pipe extends vertically and has several horizontally opened liquid outlets; and the jet pipe has several circumferentially arranged grooves. A first motor is located on the bottom surface of the reaction tank; the first motor is electrically connected to the control module; a first transmission gear is provided on the output shaft of the first motor, and the first transmission gear meshes with the tooth groove. A guide pipe is connected to the plating solution tank and leads to the reaction tank; The flow meter is connected to the guide pipe; A filter is connected to the flow meter; A negative pressure pump, with its inlet end connected to the filter and its outlet end connected to the spray pipe; The flow meter and the negative pressure pump are both electrically connected to the control module.

2. The apparatus for optimizing the electroless plating process according to claim 1, characterized in that, The fixed base is annular; multiple jet pipes are provided, and the multiple jet pipes are spaced apart along the circumference of the fixed base and arranged in a ring around the test sample.

3. The apparatus for optimizing the chemical plating process according to claim 1, characterized in that, The jet module includes: air pump; The gas guide bracket has one end connected to the gas pump and the other end extending to the bottom surface of the reaction tank; The gas outlet pipe is rotatably inserted into the gas guide support; the gas outlet pipe extends horizontally and is laid flat on the bottom surface of the reaction tank; the gas outlet pipe has a plurality of gas outlets arranged axially; the gas outlet pipe has a plurality of protruding teeth arranged circumferentially. A second motor is located on the bottom surface of the reaction tank; the second motor is electrically connected to the control module; a second transmission gear is provided on the output shaft of the second motor, and the second transmission gear meshes with the convex tooth.

4. The apparatus for optimizing the chemical plating process according to claim 1, characterized in that, The heating module includes a heat exchanger and a heat exchange tube, the heat exchange tube being connected to the heat exchanger; and the heat exchange tube is arranged around the plating bath tank.

5. A method for optimizing a chemical plating process, applied to the apparatus for optimizing a chemical plating process as described in any one of claims 1 to 4; characterized in that, The optimization method includes: Construct a processing parameter sample set; wherein, the processing parameter sample set includes multiple processing parameters, and the processing parameters include one or more of the following: plating solution spray velocity, plating solution spray angle, plating solution temperature, aeration velocity, and aeration angle; The test sample is processed using the processing parameters in the processing parameter sample set to obtain a product dataset; wherein, the product dataset includes multiple product parameters, and the product parameters include at least one of coating thickness and coating surface flatness; Based on the product dataset, the optimal product parameters are determined, and the optimal processing parameters are located using the optimal product parameters.

6. A terminal comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the optimization method for the chemical plating process according to claim 5.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program; when the computer program is processed and executed, it implements the steps of the optimization method for the electroless plating process as described in claim 5.

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