Optical structure and LED direct display projection system

Abstract

The invention provides an optical structure and an LED direct display projection system, and the light-emitting side of the optical structure employs a transition structure with a high center and a low periphery, so that a first spacing distance between the central region of the light-emitting surface of the optical structure and the projection structure is smaller than a second spacing distance between the edge region of the light-emitting surface of the optical structure and the projection structure. Therefore, the edge aberration of the LED direct display projection system can be eliminated, and the imaging quality can be improved. Moreover, pixel gridding of a conventional projector can be realized through the LED direct display projection system provided by the invention, so that the projection picture quality can be improved, and the LED direct display projection system is suitable for more scenes. According to the LED array provided by the invention, a PCB (Printed Circuit Board) and PCB wiring can be omitted, the array volume of the LED array is reduced, and the setting density of the LED bulbs is improved, so that the LED array can be applied to a high-resolution projection scene with high pixel density.

Description

Technical Field

[0001] This application relates to the field of LED direct-view projection technology, and in particular to an optical structure and an LED direct-view projection system. Background Technology

[0002] Projection display technology projects images onto a receiving and displaying medium to magnify the image. In recent years, with the rapid development of LED (Light-emitting Diode) technology, LED chips have been widely used in the field of projection display due to their advantages such as high power, miniaturization, low cost, and good luminous efficiency.

[0003] LED direct-view technology refers to the technology of displaying images through an LED light-emitting array. An LED light-emitting array has multiple LED light-emitting units, each of which can be directly used as a display pixel. By controlling the brightness, color, and flicker of each LED light-emitting unit, the content of the projected image can be adjusted accordingly. It has advantages such as high brightness, wide color gamut, high contrast, low power consumption, long lifespan, and low cost.

[0004] LED direct projection systems use LED arrays as the light source. Optical structures for guiding, homogenizing, and / or mixing light are placed along the light path of the LED array, and a projection structure is placed along the light path of these optical structures. This allows for magnified display of images and videos, achieving LED direct projection.

[0005] However, the inventors discovered through research that current LED direct-view projection systems suffer from low image quality. Summary of the Invention

[0006] The purpose of this application is to address at least one of the aforementioned technical defects, particularly the technical defect of low imaging quality in the prior art.

[0007] In a first aspect, embodiments of this application provide an optical structure, including: a plurality of optical units, wherein the plurality of optical units are arranged in m rows and n columns, where m and n are both positive integers;

[0008] On the light-emitting side of the optical structure, the protrusion height of the n optical units in each row decreases from the center of the row to both sides, and the protrusion height of the m optical units in each column decreases from the center of the column to both ends.

[0009] In one embodiment, on the light-emitting side of the optical structure, the protrusion height of the n optical units in each row smoothly decreases from the center of the row to both sides of the row, and the protrusion height of the m optical units in each column smoothly decreases from the center of the column to both ends of the column, so that the light-emitting side of the optical structure is a curved surface.

[0010] In one embodiment, the light-emitting side of the optical structure is a curved surface with a radius of curvature proportional to the focal length of the projection structure, and the projection structure is used to project the light emitted from the optical structure.

[0011] In one embodiment, on the light-emitting side of the optical structure, the protrusion height of the n optical units in each row decreases in a stepwise manner from the center of the row to both sides, and the protrusion height of the m optical units in each column decreases in a stepwise manner from the center of the column to both ends of the column.

[0012] In one embodiment, the protrusion height of the optical unit is the protrusion height corresponding to the center position of the target curved surface region, and the target curved surface region is the curved surface region in the array surface corresponding to the position of the optical unit;

[0013] The array surface protrudes outward from the optical structure, and the orthographic projection of the center of the array surface along the height direction of the optical structure overlaps with the array center of the optical structure; the array surface is a surface with a high center and low periphery, and the radius of curvature of the array surface is proportional to the focal length of the projection structure, and the projection structure is used to project the emitted light from the optical structure.

[0014] In one embodiment, the optical unit includes a light-conducting core;

[0015] The optical unit is made of a highly transparent material; or...

[0016] The optical unit has a highly reflective reflective cavity with a smooth inner wall that extends through the optical unit along its axial direction.

[0017] In one embodiment, the optical element is a grid.

[0018] In one embodiment, the optical unit is an optical fiber or a light guide column.

[0019] Secondly, embodiments of this application provide an LED direct-view projection system, comprising:

[0020] An LED array comprises multiple LED beads arranged in an array;

[0021] An LED control circuit is electrically connected to the LED array and is used to control the light-emitting state of each LED bead.

[0022] The optical structure described in any of the above embodiments is disposed in the light-emitting optical path of the LED array and is used to guide and homogenize the emitted light from the LED array; the multiple optical units of the optical structure are arranged one-to-one with the multiple LED beads, so that the light emitted by each LED bead enters the corresponding optical unit;

[0023] A projection structure is provided in the light-emitting optical path of the optical structure.

[0024] In one embodiment, the LED direct-view projection system further includes:

[0025] A microlens array is disposed between the LED array and the optical structure to focus and collimate the light emitted by the LED array, and to cause the focused and collimated light to be incident on the optical structure.

[0026] In one embodiment, the LED control circuit is used for communication connection or electrical connection to a control terminal, for receiving projection display data sent by the control terminal, and for controlling the light emission state of each LED bead according to the projection display data.

[0027] In one embodiment, when the optical unit is a light guide post, the first end of the light guide post has a first recess that matches the shape of the LED bead, and the LED bead is embedded in the first recess.

[0028] In one embodiment, when the optical unit is a light guide post, the length and width of the light guide post remain unchanged in the direction away from the LED array; or, the length of the light guide post increases in the direction away from the LED array; or, the width of the light guide post increases in the direction away from the LED array.

[0029] In one embodiment, when the optical unit is an optical fiber, a second recess matching the shape of the LED bead is provided at the first end of the optical fiber, and the LED bead is embedded in the second recess.

[0030] In one embodiment, the LED array includes: a driver IC array, multiple LED beads, and multiple conductive lines;

[0031] The driver IC array includes a wafer and a plurality of driver IC chips formed on the wafer. Each of the plurality of driver IC chips corresponds one-to-one with a plurality of LED beads, and the LED beads are soldered to the surface of the driver IC chips. Each conductive line electrically connects at least two driver IC chips so that the driver IC chips are connected to an external circuit via the conductive line.

[0032] In one embodiment, the LED array further includes a heat dissipation substrate attached to a first surface of the wafer, the first surface being opposite to a second surface of the wafer, the second surface being the side closest to the LED beads.

[0033] In one embodiment, the LED array further includes a heat dissipation device, which is disposed on the side of the heat dissipation substrate away from the wafer and is used to dissipate heat from the heat dissipation substrate.

[0034] In one embodiment, the LED lamp bead includes a light-emitting unit, and the light-emitting unit includes a first LED chip, a second LED chip, and a third LED chip arranged in a "pin" shape. The first LED chip, the second LED chip, and the third LED chip have different light-emitting colors.

[0035] In one embodiment, the LED lamp bead further includes a planar encapsulation housing and a horn-shaped reflector cup;

[0036] The reflector cup has a first opening and a second opening, and the diameter of the first opening is smaller than that of the second opening. The light-emitting unit is disposed in the first opening so that the inner wall of the reflector cup reflects the light emitted by the light-emitting unit;

[0037] The planar encapsulation housing covers the wafer so that the light-emitting unit and the reflector cup are accommodated in the accommodation cavity of the planar encapsulation housing.

[0038] In one embodiment, the LED lamp bead further includes a lens encapsulation housing, and the lens encapsulation housing covers the wafer so that the light-emitting unit is accommodated in the accommodation cavity of the lens encapsulation housing;

[0039] The side of the lens encapsulation housing away from the wafer protrudes in a direction away from the wafer.

[0040] In one embodiment, the LED lamp bead further includes a horn-shaped reflector cup, which has a first opening and a second opening, and the diameter of the first opening is smaller than that of the second opening; the light-emitting unit is disposed in the first opening so that the inner wall of the reflector cup reflects the light emitted by the light-emitting unit;

[0041] Both the reflector cup and the light-emitting unit are accommodated in the accommodation cavity of the lens encapsulation housing.

[0042] In one embodiment, the first LED chip, the second LED chip, and the third LED chip are all Micro-LED chips; or, the first LED chip, the second LED chip, and the third LED chip are all Mini-LED chips.

[0043] In the optical structure and LED direct-view projection system provided in some embodiments of this application, the light-emitting side of the optical structure adopts a transition structure with a high center and low periphery. This makes the first interval distance between the central region of the light-emitting surface of the optical structure and the projection structure smaller than the second interval distance between the edge region of the light-emitting surface of the optical structure and the projection structure. This eliminates edge aberrations in the LED direct-view projection system, thereby improving image quality. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is one of the schematic diagrams of the grid array structure in one embodiment;

[0046] Figure 2 This is one of the schematic diagrams of the structure of the light guide column array in one embodiment;

[0047] Figure 3 This is a second schematic diagram of the structure of the light guide column array in one embodiment;

[0048] Figure 4 This is one of the schematic diagrams of a square fiber optic array in one embodiment;

[0049] Figure 5 This is a second schematic diagram of the structure of a square fiber optic array in one embodiment;

[0050] Figure 6 This is a schematic diagram of the light guide column in one embodiment;

[0051] Figure 7 This is a schematic diagram of the structure of a square optical fiber in one embodiment;

[0052] Figure 8 This is a schematic diagram of the structure of an LED direct-view projection system in one embodiment;

[0053] Figure 9 This is a top view of the LED array in one embodiment;

[0054] Figure 10 This is a cross-sectional schematic diagram of an LED array in one embodiment;

[0055] Figure 11 This is one of the schematic diagrams of the structure of an LED lamp bead in one embodiment;

[0056] Figure 12 This is a second schematic diagram of the structure of an LED bead in one embodiment;

[0057] Figure 13 This is a second schematic diagram of the grid array structure in one embodiment;

[0058] Figure 14 This is the third schematic diagram of the structure of the light guide column array in one embodiment;

[0059] Figure 15 This is the third schematic diagram of the structure of a square fiber optic array in one embodiment.

[0060] Explanation of reference numerals in the attached figures:

[0061] 10—LED array; 20—LED control circuit; 30—Optical structure; 40—Projection structure; 50—Control terminal; 110—Wafer; 120—Driver IC chip; 130—LED bead; 131—Light-emitting unit; 1311—First LED chip; 1312—Second LED chip; 1313—Third LED chip; 132—Lens packaging housing; 133—Planar packaging housing; 134—Reflector cup; 140—Conductive line; 150—Heat dissipation substrate; 311—Grid array; 3111—Grid; 3112—Reflecting cavity; 312—Light guide column array; 3121—Light guide column; 3122—First recess; 313—Square fiber array; 3131—Square fiber; 3132—Second recess; 320—Light emitting surface. Detailed Implementation

[0062] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0063] As mentioned in the background section, traditional LED direct-view projection systems suffer from low image quality. The inventors discovered that this problem stems from the fact that traditional LED direct-view projection systems use Fresnel lenses as the projection structure to magnify and project the light emitted from the optical structure. However, Fresnel lenses exhibit marginal aberrations. For the entire display surface to present the same image quality, the first interval between the central region of the light-emitting surface of the optical structure and the Fresnel lens must be smaller than the second interval between the edge region of the light-emitting surface and the Fresnel lens. However, in existing technologies, the light-emitting surface of the optical structure is planar, and the first interval equals the second interval. Therefore, in the projected display, the image quality of the central and edge regions is mismatched, thus reducing the overall image quality of the LED direct-view projection system.

[0064] Based on this, this application provides an optical structure and an LED direct-view projection system. The light-emitting side of the optical structure adopts a transitional structure with a high center and low periphery, such that the first interval distance between the central region of the light-emitting surface of the optical structure and the projection structure is smaller than the second interval distance between the edge region of the light-emitting surface of the optical structure and the projection structure. This eliminates edge aberrations in the LED direct-view projection system, thereby improving image quality.

[0065] In one embodiment, this application provides an optical structure 30 that integrates functions such as light guiding, light homogenization, and color mixing. The optical structure 30 may have an incident light side and an exit light side. The incident light side refers to the side of the optical structure 30 closest to the light source. The exit light side is disposed opposite to the incident light side and may be the side furthest from the light source or the side where the light-emitting surface 320 of the optical structure is located. For example, when the light source is an LED array, the incident light side may be the side of the optical structure 30 closest to the LED array, and the exit light side may be the side of the optical structure 30 furthest from the LED array.

[0066] like Figure 1-Figure 5 As shown, the optical structure 30 includes m×n optical units, which are arranged in m rows and n columns. Here, m and n are both positive integers. On the light-emitting side of the optical structure 30, the protrusion height of the n optical units in the same row decreases from the center of the row towards both sides, and the protrusion height of the m optical units in the same column decreases from the center of the column towards both ends.

[0067] In this application, the protrusion height of the optical unit can be the protrusion height of the optical unit extending outward from the optical structure. In some examples, the protrusion height of the optical unit can be the vertical distance between the most convex point of the optical unit and a reference cross-section, wherein the reference cross-section can be a cross-section taken from the optical structure 30 along the radial direction of the optical structure. In other examples, the protrusion height of the optical unit can be the maximum z-coordinate of the optical unit.

[0068] Please refer to Figure 1-Figure 5 For each row of n optical units, the optical unit located at the center of the row has the largest protrusion height, while the optical units located on either side of the row have the smallest protrusion height. Furthermore, for any two optical units that are in the same row position and adjacent in column position, the optical unit closer to the center of the row has a larger protrusion height, while the optical unit farther from the center of the row has a smaller protrusion height.

[0069] Similarly, for each column of m optical units, the optical center located at the center of the column has the largest protrusion height, while the optical units at both ends of the column have the smallest protrusion height. Furthermore, for any two adjacent row positions with the same column position, the optical unit closer to the column center has a larger protrusion height, while the optical unit farther from the column center has a smaller protrusion height.

[0070] In this application, the light-emitting side of the optical structure 30 adopts a transitional structure that is high in the center and low at the periphery, such that the first interval distance between the central region of the light-emitting surface 320 of the optical structure and the projection structure 40 is smaller than the second interval distance between the edge region of the light-emitting surface 320 of the optical structure and the projection structure 40. This eliminates edge aberrations in the LED direct-view projection system, thereby improving image quality.

[0071] In one embodiment, Figure 1 , Figure 2 and Figure 4 As shown, the light-emitting surface 320 of the optical structure can be a smooth curved surface to better eliminate edge aberrations. Specifically, on the light-emitting side of the optical structure 30, the protrusion height of the n optical units located in the same row smoothly decreases from the center of the row to both sides of the row, and the protrusion height of the m optical units located in the same column smoothly decreases from the center of the column to both sides of the column.

[0072] In other words, when the y-coordinate values ​​are equal, the protrusion height of the optical structure 30 at different x-coordinate values ​​can smoothly decrease from the column center towards both ends of the column. Similarly, when the x-coordinate values ​​are equal, the protrusion height of the optical structure 30 at different y-coordinate values ​​can smoothly decrease from the row center towards both sides of the row. Therefore, in this embodiment, the protrusion height of the same optical unit is different at different x and y coordinates.

[0073] Thus, the light-emitting surface 320 of the optical structure can form a smooth curved surface, thereby better eliminating edge aberrations.

[0074] In one embodiment, considering that the projection structure 40 is one of the causes of edge aberrations, the degree of protrusion of the light-emitting surface 320 can be determined based on the structural parameters of the projection structure to further eliminate edge aberrations. Specifically, if the light-emitting surface 320 of the optical structure is a smooth curved surface, the radius of curvature of the light-emitting surface can be proportional to the focal length of the projection structure. In this embodiment, the projection structure 40 can be a device located in the light-emitting optical path of the optical structure 30, used to magnify and project the emitted light from the optical structure 30.

[0075] In one example, if the projection structure 40 is a Fresnel lens, the radius of curvature of the light-emitting surface can be approximately equal to twice the focal length of the Fresnel lens.

[0076] In one embodiment, considering that the smooth curved surface structure has a certain manufacturing difficulty and increases the realization cost of the optical structure 30, in order to reduce the manufacturing difficulty of the optical structure 30 and realize a low-cost optical structure 30, the light-emitting surface 320 of the optical structure can adopt a stepped structure to achieve a decreasing convex height.

[0077] like Figure 3 and Figure 5 As shown, on the light-emitting side of the optical structure 30, the protrusion height of the n optical units in each row decreases in a stepwise manner from the center of the row to both sides of the row, and the protrusion height of the m optical units in each column decreases in a stepwise manner from the center of the column to both ends of the column.

[0078] In other words, when the y-coordinate values ​​are equal, the protrusion height of the optical structure 30 at different x-coordinate values ​​can decrease in a stepwise manner from the column center to both ends of the column. That is, the same optical unit has the same protrusion height at different xy coordinates. For two optical units that are adjacent in row position and have the same column position, the optical unit closer to the column center has a greater protrusion height than the optical unit farther from the column center.

[0079] Similarly, when the x-coordinate values ​​are equal, the protrusion height of the optical structure 30 at different y-coordinate values ​​can decrease in a stepwise manner from the center of the row to both sides of the row. That is, the same optical unit has the same protrusion height at different xy coordinates. For two optical units with the same row position and adjacent column positions, the optical unit closer to the row center has a greater protrusion height than the optical unit farther from the row center.

[0080] In one embodiment, considering that the projection structure 40 is one of the causes of edge aberrations, the degree of protrusion of the light surface 320 can be determined based on the structural parameters of the projection structure to further eliminate edge aberrations. For a detailed description of the projection structure 40, please refer to the above embodiments; it will not be repeated here.

[0081] Specifically, the radius of curvature of the array surface can be determined based on the focal length of the projection structure, and the radius of curvature of the array surface is proportional to the focal length of the lens structure. In one example, if the projection structure 40 is a Fresnel lens, the radius of curvature of the array surface can be approximately equal to twice the focal length of the Fresnel lens.

[0082] The orthographic projection of the center of the array surface in the z-direction overlaps with the array center of the optical structure 30, and the array surface can bulge along the +z direction to form a surface that is high at the center and low at the periphery. Please refer to... Figure 1 , Figure 2 and Figure 4 The array surface in this embodiment can be Figure 1 , Figure 2 and Figure 4 Smooth curved surfaces in the middle.

[0083] After determining the array surface, this application can determine the protrusion height of each optical unit based on the protrusion height of the array surface at each xy coordinate. For ease of description, the following explanation uses the determination of the protrusion height of one optical unit as an example; the protrusion height of other optical units can be determined according to the following explanation.

[0084] First, based on the xy coordinates of the optical unit, the surface region corresponding to the position of the optical unit in the array surface is determined, i.e., the target surface region is determined. In one example, the target surface region can be a surface region with the same xy coordinates as the optical unit.

[0085] After determining the target surface region, the center position of the target surface region can be determined. In one example, if the maximum x-coordinate value of the target surface region is x... max The minimum x-coordinate value is x min The maximum y-coordinate is y max The minimum y-coordinate is y min Then the center of the region can be the x-coordinate of the target surface region (x max +x min ) / 2, y coordinate is (y max +y min The position of ) / 2.

[0086] Given a defined center location, the protrusion height at that center location can be used as the protrusion height of the optical unit. For example, in the array surface ((x max +x min ) / 2 , (y max +y min The z-coordinate value at position () / 2) is used as the protrusion height of the optical unit.

[0087] It is understood that the optical unit in this document can be made of any material and can be of any shape. In some embodiments, the optical unit may include a light-conducting core. Alternatively, the optical unit may be made of a highly transparent material. Alternatively, the optical unit may have a highly reflective cavity with a smooth inner wall that extends through the optical unit along its axial direction. That is, in this application, the optical unit can be implemented in one of the following three ways:

[0088] (1) The optical unit includes a light transmission core;

[0089] (2) The optical unit is made of a high-transmittance material;

[0090] (3) The optical unit has a highly reflective reflective cavity with a smooth inner wall that extends through the optical unit along its axial direction.

[0091] Regarding the first implementation method, the light-conducting core refers to an inner core with light-conducting capabilities, integrating functions such as light guiding, light homogenization, and color mixing. After the light emitted by the LED beads enters the optical unit, the light-conducting core can guide, homogenize, and mix the light emitted by the LED, enabling the light-emitting surface of the optical structure to form a pixel-level display image. It is understood that this application can use light-conducting cores made of any shape and any material to implement the optical unit, and this document does not impose any specific restrictions on this.

[0092] For the second implementation, the optical unit can be made of a highly transparent material, enabling it to guide, homogenize, and mix the light emitted by the LED beads. The light emitted by the LED beads can be guided from the first end of the optical unit (i.e., the end closer to the LED array) to the second end of the optical unit (i.e., the end farther from the LED array), and homogenized and mixed within the optical unit. In this way, the light-emitting surface 320 of the optical structure can form a pixel-level display image.

[0093] For the third implementation, the optical unit can have a highly reflective reflective cavity that extends throughout the entire optical unit along its axial direction, with a smooth inner wall. Thus, the reflective cavity can perform functions such as light guiding, light homogenization, and color mixing. After the light emitted by the LED beads enters the optical unit, it can travel along the reflective cavity from the first end (the end closest to the LED array) to the second end (the end furthest from the LED array), and the light can undergo multiple reflections on the inner wall of the reflective cavity for light homogenization and color mixing. In this way, the light-emitting surface of the optical structure can form a pixel-level display image.

[0094] In one embodiment, the optical unit is a grid 3111, that is, the optical structure 30 can be a grid array 311. For example... Figure 1As shown, in this embodiment, the grid array 311 can be formed by a regular arrangement of multiple square grids with regular end faces. Each square grid corresponds to one LED bead and serves as a pixel unit. In this way, an LED direct-view projection system suitable for low-resolution scenarios can be implemented at a lower cost.

[0095] Each grid 3111 has a reflective cavity 3112 extending through the entire grid 3111 along its axial direction. The inner wall of the reflective cavity 3112 is smooth and highly reflective, enabling it to guide, homogenize, and mix the light emitted by the LED beads. In one example, the grid 3111 may be made of a highly reflective material. In another example, the grid 3111 may be made of a low-reflective material, and the inner wall of the reflective cavity 3112 may be coated with a highly reflective film, thereby enabling the reflective cavity 3112 to perform functions such as guiding, homogenizing, and mixing light.

[0096] It is understandable that the dimensions of the grid, such as the inner wall thickness, length, width, and height, can be determined based on the actual situation, and this article does not impose specific restrictions on them. In one example, the inner wall thickness of the grid can be as thin as possible to reduce the width of the dark edge between adjacent grids, thereby further improving the quality of the projected image.

[0097] Considering that the width of the dark edge of the grid array 311 cannot meet the display requirements of high-resolution scenes under current manufacturing processes, some embodiments of this application use light guide column arrays or square fiber arrays as optical structures, enabling the LED direct-view projection system to be applicable to both low-resolution and high-resolution scenes.

[0098] In one embodiment, Figure 2 and Figure 3 As shown, the optical structure 30 can be a light guide column array 312. That is, multiple light guide columns 3121 made of high light transmittance material are arranged regularly to form the optical structure 30, with each light guide column corresponding to one LED bead and serving as a pixel unit. Each light guide column 3121 can have a smooth surface and a regular shape.

[0099] Furthermore, in one example, to increase the light energy transmitted by the light guide post 3121, the sides of the light guide post 3121 can be treated with high reflectivity, for example, the sides of the light guide post 3121 can be coated with a high reflectivity film. When the light guide post 3121 is a cuboid, all four sides of the light guide post 3121 can be coated with a high reflectivity film.

[0100] In one embodiment, Figure 4 and Figure 5As shown, the optical structure 30 can be a square fiber array 313. That is, a square fiber 3131, including the light-conducting core, is used as a single optical unit, and multiple square fibers 3131 are regularly arranged to form the optical structure 30. One square fiber corresponds to one LED bead and serves as a pixel unit.

[0101] like Figure 7 As shown, unlike the light guide post 3121, the square optical fiber 3131 can be deformed and bent at will. Therefore, the square optical fiber array 313 can be bent and turned to connect with the LED array, allowing the LED array 10 to be placed at the bottom, side, or other positions of the square optical fiber array 313 without being fixed to the bottom of the optical structure 30. In this way, the individual square optical fiber arrays 313 can be bent and turned in an orderly manner, so that the upper part of the square optical fiber arrays 313 is regularly arranged, and the bottom can be connected to the LED array 10 located at the bottom and / or side of the optical structure 30. This solves problems such as difficulty in wiring and heat dissipation caused by the high density and high power of the LED array 10, thereby further expanding the applicable scenarios of the LED direct-view projection system.

[0102] In one embodiment, the optical core of the square optical fiber 3131 can be made of a high-transmittance material, such as high-transmittance plastic or high-transmittance glass. Furthermore, the square optical fiber 3131 may or may not have an external cladding for the optical core, depending on practical considerations.

[0103] In one embodiment, this application combines LED direct-viewing technology with projection technology to propose an LED direct-viewing projection system. For example... Figure 8 As shown, the LED direct-view projection system provided in this application may include:

[0104] LED array 10 includes multiple LED beads 130 arranged in an array;

[0105] LED control circuit 20 is electrically connected to LED array 10 and is used to control the light-emitting state of each LED bead 130 respectively;

[0106] The optical structure 30 described in any of the above embodiments is disposed in the light output path of the LED array 10 and is used to guide and homogenize the light emitted from the LED array 10; the multiple optical units of the optical structure 30 are arranged one-to-one with the multiple LED beads 130 so that the light emitted by each LED bead 130 enters the corresponding optical unit.

[0107] The projection structure 40 is located in the light output path of the optical structure 30.

[0108] Specifically, the LED array 10 can serve as a light source in an LED direct-view projection system. The LED array 10 includes multiple LED beads 130 arranged in an array, for example, the multiple LED beads 130 can be arranged in an m x n array, where m and n are both positive integers. Each LED bead 130 includes a first LED chip 1311, a second LED chip 1312, and a third LED chip 1313, and the first LED chip 1311, the second LED chip 1312, and the third LED chip 1313 have different emission colors. For example, the first LED chip emits red, the second LED chip emits green, and the third LED chip emits blue.

[0109] The LED control circuit 20 can be electrically connected to each LED bead 130 to control the display content of the LED array, so that the LED array 10 can realize pattern display and video display.

[0110] The optical structure 30 can be disposed in the light-emitting path of the LED array, and can be used to guide, homogenize, and mix the light emitted by the LED array (i.e., the outgoing light of the LED array), and can also serve as an imaging display device. The optical structure 30 may include multiple optical units arranged in an array, with each optical unit corresponding to a specific LED, allowing the light emitted by the LED to enter the corresponding optical unit. In this application, the one-to-one correspondence can be understood as each LED corresponding to one optical unit, and the optical units corresponding to any two LEDs being different. For example, when the LED array 10 is an m x n array, the optical structure 30 can also be an m x n array, with the LEDs in the same row and column positions in the LED array 10 and optical structure 30 corresponding to the optical units.

[0111] The projection structure 40 is used to achieve projection imaging. The projection structure 40 is positioned in the light-emitting path of the optical structure 30 to magnify and project the emitted light from the optical structure 30, allowing the image content to be displayed on a projection screen. In some examples, the projection structure 40 may be a Fresnel lens, which is used for large-size light-emitting surfaces, small divergence angle processing, and low-quality imaging projection. Because Fresnel lenses have certain edge aberrations, the light-emitting surface 320 of the optical structure is designed with a high center and low sides to eliminate edge aberrations.

[0112] This application combines LED direct-viewing technology with projection technology to achieve LED direct-viewing projection. Compared to traditional imaging display devices such as LCD (Liquid Crystal Display), LCOS (Liquid Crystal on Silicon), and DMD (Digital Micromirror Device), the LED direct-viewing projection system proposed in this application directly uses an LED array as the light source for the imaging display device, with one LED corresponding to one pixel of the imaging display device. During projection, for pixels that do not need to be displayed, the LED corresponding to that pixel can be controlled to be in a non-emitting state, thereby improving luminous efficiency and reducing energy consumption.

[0113] Meanwhile, this application employs a simple and low-cost optical structure to guide, homogenize, and mix the light emitted from the light source. It eliminates the need for a series of processes such as collimation, color separation, homogenization, and color combining of the light source. Therefore, it eliminates the need for components such as collimators, integrating bars, color wheels, mirrors, color-separating prisms, and color-combining prisms within the light source. This simplifies the structure and manufacturing process of the LED direct-view projection system, thereby reducing its size and cost. Thus, compared to existing projection systems, the LED direct-view projection system of this application achieves projection display with a simpler system structure, thereby reducing the overall system size.

[0114] Furthermore, this application can achieve pixelated and full-color projection of conventional projectors through colored LED beads, LED arrays and optical structures, thereby improving the quality of the projected image and making the LED direct-view projection system suitable for more scenarios.

[0115] In some embodiments, the projection structure 40 may use a conventional projection lens. The projection lens can be used for small light-emitting surfaces, small divergence angle processing, and high-quality image projection. Because projection lenses have excellent aberration correction capabilities, the light-emitting surface 320 of the optical structure can be planar, such as... Figure 13 , Figure 14 and Figure 15 As shown.

[0116] In one embodiment, the LED direct-view projection system may further include a microlens array. The microlens array may be disposed between the LED array 10 and the optical structure 30 to converge and collimate the light emitted from the LED array 10, and to direct the converged and collimated light into the optical structure 30. This further reduces the divergence angle of the LED beads 130 and better couples the emitted light from the LED array 10 into the optical structure 30, thereby improving the projection effect.

[0117] In one embodiment, the LED control circuit 20 is used to communicate with or electrically connect to the control terminal 50, to receive projection display data sent by the control terminal 50, and to control the light-emitting state of each LED bead 130 according to the projection display data.

[0118] The control terminal 50 can be, but is not limited to, an IoT device, a mobile terminal, a wearable device, a laptop, a desktop computer, etc. The connection method between the LED control circuit 20 and the control terminal 50 can be, but is not limited to, a WIFI connection, a Bluetooth connection, a mobile data connection, an IoT connection, etc.

[0119] In this embodiment, the LED control circuit 20 can be connected to the control terminal 50 via a communication connection or an electrical connection, enabling data interaction between the LED control circuit 20 and the control terminal 50. Thus, the control terminal 50 can control the overall display pattern of the LED array 10 via mini-programs, applications, the cloud, or other means.

[0120] In one embodiment, Figure 6 As shown, the light guide post 3121 may have a first end, and the plane on which the first end is located is the light incident surface of the optical structure 30. The first end of the light guide post 3121 may have a first recess 3122, and the shape of the first recess 3122 matches the shape of the LED bead 130. When the optical unit and the LED bead are arranged in a one-to-one correspondence, the LED bead 130 can be directly embedded into the first recess 3122, thereby more effectively capturing the light emitted by the LED bead into the light guide post 3121 to improve the light energy collection efficiency.

[0121] In one embodiment, each light guide post 3121 may be a regular cuboid shape, meaning that the length of the light guide post remains constant along the direction away from the LED array, and the width of the light guide post remains constant along the direction away from the LED array. In this embodiment, any cross-section of the same light guide post along the axial direction has the same length and width.

[0122] It should be noted that if the direction perpendicular to the axial direction of the light guide post is taken as the cross-sectional direction, then the length of the light guide post in this application is the length of the cross-section taken along the cross-sectional direction of the light guide post, the width of the light guide post is the width of the cross-section taken along the cross-sectional direction of the light guide post, and the height of the light guide post is the height of the light guide post in the axial direction.

[0123] In one embodiment, in addition to a regular cuboid shape, the light guide post 3121 can also be a cuboid shape that is narrower at the bottom and wider at the top. Specifically, the length of the light guide post can increase in the direction away from the LED array, and / or the width of the light guide post can increase in the direction away from the LED array, so that the light guide post 3121 forms a cuboid shape that is narrower at the bottom and wider at the top.

[0124] In this text, the lower and bottom parts of the light guide column are the ends that guide the light guide column 3121 closer to the LED array 10, i.e., the first end of the light guide column described in other embodiments of this text. The upper part of the light guide column is the end that guides the light guide column 3121 away from the LED array 10, i.e., the second end of the light guide column relative to the first end.

[0125] In one embodiment, the square optical fiber 3131 may have a first end, the plane of which is the light-incident surface of the optical structure 30. The first end of the square optical fiber 3131 may have a second recess 3132, the shape of which matches the shape of the LED bead 130. When the optical units and LED beads 130 are arranged in a one-to-one correspondence, the LED beads 130 can be directly embedded into the second recess 3132, thereby more effectively capturing the light emitted by the LED beads into the square optical fiber 3131, thus improving the light energy collection efficiency.

[0126] In some embodiments, the square optical fiber 3131 may have a first end, the plane of which is the light-incident surface of the optical structure 30. The first end of the square optical fiber 3131 may have a second recess 3132, the shape of which matches the shape of the LED bead 130. When optical units and LED beads 130 are arranged in a one-to-one correspondence, the LED beads 130 can be directly embedded into the second recess 3132, thereby more effectively capturing the light emitted by the LED beads into the square optical fiber 3131, thus improving the light energy collection efficiency.

[0127] Existing LED arrays suffer from large size. The inventors discovered that this is due to the following: existing technology involves cutting a pre-fabricated LED array or an LED array with a driver IC (Integrated Circuit) into individual LEDs. A separate PCB (Printed Circuit Board) is then designed to drive and control multiple LEDs. These individual LEDs are then soldered onto the PCB to connect them in series or parallel, establishing electrical connections between the LEDs and external circuits / controllers. The large PCB size increases the overall size of the LED array, making it unsuitable for high-resolution projection scenarios with high pixel density.

[0128] To address this issue, this application reduces the space occupied by the LED beads and driver IC chip by stacking and soldering them onto the surface of the driver IC chip. Furthermore, by directly routing conductive lines on the surfaces of the wafer and the driver IC chip, the driver IC chip can directly connect to external circuits via these lines, eliminating the need for a PCB. This reduces the size of the LED array and increases the LED bulb density, enabling the LED array provided by this application to be used in high-resolution projection scenarios with high pixel density.

[0129] In one embodiment, to enable the LED direct-view projection system to be applied in high-resolution scenarios, the LED array 10 of this application may include a driver IC array, multiple LED beads 130, and multiple conductive lines 140. The driver IC array includes a wafer 110, on which multiple driver IC chips 120 are formed. Each driver IC chip 120 is used to output a driving signal to the LED beads 130 connected to the driver IC chip 120 according to a control signal output from an external circuit, thereby controlling the light-emitting state of the LED beads 130.

[0130] The LED bead 130 can be a light-emitting device based on an LED chip. Its specific structure can be determined according to the actual situation. This article does not impose specific restrictions on it, as long as the LED bead includes at least one LED chip. Each LED bead can be a pixel and display the image content of one pixel.

[0131] Conductive wire 140 refers to a wire made of a conductor material that enables electrical connection between multiple features. It is understood that the specific settings, such as the conductor material, wire width, and wire length, can be determined based on actual circumstances, and this document does not impose specific restrictions on them.

[0132] like Figure 9 and Figure 10 As shown, each driver IC chip 120 can be connected to each LED bead 130 in a one-to-one correspondence. That is, each LED bead 130 is connected to one driver IC chip 120, and the driver IC chips 120 connected to any two LED beads 130 are different. For each LED bead 130, it can be stacked and soldered onto the surface of the driver IC chip 120 to achieve electrical connection between the LED bead and the driver IC chip, so that the driver IC chip can control the light-emitting state of the LED bead through a drive signal. It is understood that the specific soldering method of stacking and soldering can be set according to the actual situation such as the number of LED chips in each LED bead and the chip settings of the driver IC chip, and this application does not impose specific limitations on it. For example, the upper surface of each driver IC chip 120 can be provided with pads, and the LED beads 130 can be soldered to the pads to achieve stacking and soldering of the driver IC chip 120 and the LED beads 130.

[0133] Each conductive line 140 can electrically connect to at least two driver IC chips 120, enabling the driver IC chips 120 to be connected in series / parallel. They can also be directly connected to external circuits via the conductive lines 140 without needing to be connected through a PCB and PCB traces. Thus, the driver IC chip 120 can receive control signals from external circuits via the conductive lines 140 and output corresponding drive signals under the control of these signals to control the light-emitting state of the LED beads 130. This allows control over the on / off state, brightness, color, and / or flicker parameters of each LED bead 130, enabling the LED array 10 to display corresponding image content, such as patterns and videos.

[0134] It is understood that the circuit connections between the various driver IC chips 120 can be configured according to actual conditions, and this document does not impose specific limitations on this. For example, such as Figure 1 As shown, multiple driver IC chips 120 can be arranged in an array of m rows and n columns. Each driver IC chip 120 in the same row can be connected in series through conductive lines 140, and the driver IC chips 120 in the m rows can be connected in parallel through conductive lines 140.

[0135] Furthermore, in one example, the conductive line 140 of this application can allow a large current input to meet the wiring requirements of high-density LED arrays.

[0136] In one embodiment, since each driver IC chip 120 can be directly connected to an external circuit via conductive lines 140, the LED array 10 can be used directly in array form without being divided into multiple individual components. In this case, the wafer 110 can be bonded to the heat dissipation substrate 150, allowing the wafer 110 to dissipate heat directly through the heat dissipation substrate 150, thereby improving heat dissipation efficiency.

[0137] Specifically, such as Figure 10 As shown, wafer 110 has a first surface and a second surface, and the second surface refers to the side closer to the LED bead 130, that is, the side closer to the pad. The first surface of wafer 110 is opposite to the second surface, that is, the first surface of wafer 110 is the side away from the LED bead 130.

[0138] The LED array 10 may also include a heat dissipation substrate 150, which is attached to the first surface of the wafer 110. This allows the heat generated by the driver IC chip 120 and the LED beads 130 to be conducted through the wafer 110 to the heat dissipation substrate 150, and then dissipated through the heat dissipation substrate 150. In this way, the heat dissipation problem of high-density, high-power LED beads can be solved.

[0139] Further, to further improve the heat dissipation efficiency, the LED array 10 may also use a heat dissipation device to dissipate heat from the heat dissipation substrate 150. Specifically, the heat dissipation substrate 150 has a third surface and a fourth surface, and the third surface is the side where the heat dissipation substrate 150 is bonded to the wafer 110, and the third surface is opposite to the fourth surface. A heat dissipation device may be provided on the side close to the fourth surface.

[0140] It can be understood that the heat dissipation device of the present application can be selected based on actual factors such as the application environment of the LED array 10 and the cost budget of the LED array 10, and specific limitations are not made herein. Exemplarily, the heat dissipation device can be any one or any combination of a heat sink, an air-cooled heat dissipation device, and a water-cooled heat dissipation device.

[0141] In one embodiment, as Figure 9 shown, each LED lamp bead 130 may include a light-emitting unit 131. The light-emitting unit 131 may include a first LED chip 1311, a second LED chip 1312, and a third LED chip 1313 arranged in a "pin" shape, and the first LED chip 1311, the second LED chip 1312, and the third LED chip 1313 have different light-emitting colors. For example, the light-emitting color of the first LED chip 1311 is red, the light-emitting color of the second LED chip 1312 is green, and the light-emitting color of the third LED chip 1313 is blue.

[0142] In this way, by arranging multiple LED chips with different light-emitting colors in one LED lamp bead 130 and arranging the multiple LED chips in a "pin" shape, full-color light emission can be achieved.

[0143] Further, when the LED lamp bead 130 includes the first LED chip 1311, the second LED chip 1312, and the third LED chip 1313, a first pad, a second pad, and a third pad may be provided on the upper part of each driving IC chip 120, and the first pad, the second pad, and the third pad are arranged in a "pin" shape in a compact manner. The first LED chip 1311 may be welded to the first pad, the second LED chip 1312 may be welded to the second pad, and the third LED chip 1313 may be welded to the third pad.

[0144] Further, in one embodiment, the first LED chip 1311, the second LED chip 1312, and the third LED chip 1313 are all Micro-LED chips. Alternatively, the first LED chip 1311, the second LED chip 1312, and the third LED chip 1313 are all Mini-LED chips. Since Micro-LED chips and Mini-LED chips have a smaller chip size, the setting density of the LED bulbs can be further increased, making the LED array 10 provided in the present application more suitable for high-resolution projection scenarios with a high pixel density.

[0145] In one embodiment, to achieve a small divergence angle light emission from the LED chip 130, a lens encapsulation method can be used to implement the LED chip. For example... Figure 10 As shown, the LED chip 130 may include a lens package housing 132, which covers the wafer 110 and houses the light-emitting unit 131 within its cavity. In this embodiment, the side of the lens package housing 132 away from the wafer 110 protrudes in a direction away from the wafer 110 to form a convex curved surface structure. This allows the light emitted by the light-emitting unit 131 to be focused, achieving light emission with a small divergence angle.

[0146] In one embodiment, to achieve a small divergence angle light emission from the LED bead 130, a reflector 134 can be placed inside the LED bead 130, and the LED bead can be implemented using a planar packaging method. Specifically, as shown... Figure 11 As shown, the LED bead 130 may further include a planar encapsulation housing 133 and a reflector 134. The reflector 134 may be a horn-shaped reflector with a first opening and a second opening, the diameter of the first opening being smaller than the diameter of the second opening. A light-emitting unit 131 may be disposed in the first opening of the reflector 134; further, the light-emitting unit 131 may be disposed inside the reflector 134. Light emitted by the light-emitting unit 131 is reflected by the inner wall of the reflector 134 and then exits through the second opening.

[0147] A planar package housing 133 is disposed on the wafer 110, and the side of the planar package housing 133 away from the wafer 110 is flat. The planar package housing 133 can accommodate both the light-emitting unit 131 and the reflector cup 134. That is, the planar package housing 133 has a receiving cavity. Both the light-emitting unit 131 and the reflector cup 134 are accommodated within the receiving cavity.

[0148] In one embodiment, to achieve small divergence angle light emission of the LED bead 130, a reflector cup 134 can be placed inside the LED bead 130, and the LED bead can be implemented using a lens encapsulation method. Compared with only lens encapsulation and planar encapsulation with built-in reflector cup 134, lens encapsulation with built-in reflector cup 134 can further reduce the divergence angle, thereby achieving small divergence angle light emission more effectively.

[0149] like Figure 12 As shown, the LED bead 130 may include both a lens encapsulation housing 132 and a reflector 134. The reflector 134 may be a horn-shaped reflector with a first opening and a second opening, the diameter of the first opening being smaller than the diameter of the second opening. A light-emitting unit 131 may be disposed in the first opening of the reflector 134; further, the light-emitting unit 131 may be disposed inside the reflector 134. Light emitted by the light-emitting unit 131 is reflected by the inner wall of the reflector 134 and then exits through the second opening.

[0150] The lens package housing 132 is disposed on the wafer 110, and both the light-emitting unit 131 and the reflector cup 134 are housed within the receiving cavity of the lens package housing 132. For details regarding the reflector cup 134 and the lens package housing 132, please refer to the above embodiments; they will not be repeated here.

[0151] This application proposes an LED direct-view projection system by combining LED direct-view technology and projection technology, which can solve the technical problems of complex system structure, cumbersome implementation process, and high cost in existing technologies. Depending on different application scenarios, the LED direct-view projection system can use different components and be designed with different structures. To facilitate understanding of the solution in this application, specific examples are provided below.

[0152] Example 1:

[0153] The LED direct projection system provided in this example can be applied to low-resolution application scenarios, including but not limited to character information display scenarios, indicator information display scenarios, simple advertising pattern display scenarios, video projection scenarios, and festive atmosphere creation scenarios.

[0154] Specifically, the LED direct-view projection system may include an LED array 10, an LED control circuit 20, an optical structure 30, and a projection structure 40. The LED array 10 may include a driver IC chip 120 and multiple LED beads 130, arranged in m rows and n columns, where m and n are positive integers, and m ≥ 2 and n ≥ 2. Each LED bead 130 may include a red LED chip, a green LED chip, and a blue LED chip to achieve full-color illumination. Furthermore, the red, green, and blue LED chips may be arranged in a triangular pattern.

[0155] The red, green, and blue LED chips can be small-pitch / mini LED chips. The driver IC chip 120 can control the brightness, color, and / or flickering parameters of each individual LED chip 130 via its control terminal. Thus, independent control of each individual LED chip 130 can be achieved through each driver IC chip 120, enabling the LED array 10 to display patterns or videos.

[0156] In this example, the driver IC chip 120 can be implemented using an external IC chip or an internal IC chip. An external IC chip means that the driver IC chip 120 is located outside the LED beads 130, and one driver IC chip 120 can control multiple LED beads 130. An internal IC chip means that the driver IC chip 120 is located inside the LED beads 130, and one driver IC chip 120 is used to control the display state of one LED bead 130.

[0157] Furthermore, the LED array 10 of this application can also converge and collimate the light emitted by the LED beads through small divergence angle processing, so that more light energy can enter the projection structure 40 and hit the projection screen. Specifically, small divergence angle processing can be achieved through one of the following three methods:

[0158] (1) A reflector 134 is installed inside the LED bead 130;

[0159] (2) 130 LED beads are encapsulated with lenses;

[0160] (3) A reflector 134 is provided inside the LED lamp bead 130, and the LED lamp bead 130 is encapsulated with a lens;

[0161] For detailed explanations of the above three methods, please refer to the descriptions of other embodiments in this document, which will not be repeated here.

[0162] The LED control circuit 20 is electrically connected to the LED array 10 and is used to control the brightness and color of each LED 130 to control the overall display pattern of the LED array 10. Furthermore, the LED control circuit 20 can be connected to a control terminal 50, such as a mobile terminal, laptop, or desktop computer, via Wi-Fi, Bluetooth, or other connection methods, allowing the control terminal 50 to control the overall display pattern of the LED array 10 through mini-programs, applications, or the cloud.

[0163] The optical structure 30 is a grid array 311, which can be used as a light guide, light homogenizer, and imaging display device. The grid array 311 includes multiple grid units arranged in an array, the number of rows and columns of which corresponds to the number of rows and columns of the LED array 10. Each grid unit is connected to a corresponding LED chip 130, serving as a pixel unit. The grid array 311 can be located on the light-emitting surface of the LED chips 130, allowing light emitted from each LED chip to enter the corresponding grid unit and be guided, homogenized, and mixed in color through the grid unit. By controlling the light emission state of the LED array 10, the projected display content of the LED direct-view projection system can be controlled.

[0164] It is understandable that the length and width of each grid unit 3111 can be determined based on the spacing between adjacent LED beads 130. Since the uniform light performance of the grid unit 3111 varies with different length and width dimensions, the height of the grid unit 3111 can be determined based on different length and width dimensions.

[0165] The projection structure 40 can be implemented using a conventional projection lens or a Fresnel lens, located on the light-emitting surface 320 of the grid array 311, and used for magnified projection. The projection lens is suitable for small light-emitting surfaces, small divergence angle processing, and high-quality imaging projection. The Fresnel lens is used for large light-emitting surfaces, small divergence angle processing, and low-quality imaging projection. Because Fresnel lenses have certain edge aberrations, the light-emitting surface 320 of the grid array is designed with a high center and low sides to eliminate edge aberrations, such as... Figure 1 As shown.

[0166] Furthermore, a microlens array can be selectively arranged between the LED array 10 and the grid array 311 as needed to further reduce the divergence angle of the LED beads 130 and make the light converge and collimate.

[0167] Example 2:

[0168] The LED direct projection system provided in this example can be applied to low-resolution application scenarios, including but not limited to character information display scenarios, indicator information display scenarios, simple advertising pattern display scenarios, video projection scenarios, and festive atmosphere creation scenarios.

[0169] Specifically, the LED direct-view projection system may include an LED array 10, an LED control circuit 20, an optical structure 30, and a projection structure 40. For details regarding the LED array 10 and the LED control circuit 20, please refer to Example 1.

[0170] Unlike the LED direct-view projection system provided in Example 1, in this example, the optical structure 30 is a light guide array 312, which can be used as a light guide, light homogenizer, and imaging display device. The light guide array 312 includes multiple light guide pillars 3121 arranged in an array, with the number of rows and columns corresponding to the number of rows and columns in the LED array 10. Each light guide pillar 3121 is connected to a corresponding LED bead 130, serving as a pixel unit. Each light guide pillar 3121 has a first recess 3122 at its bottom, into which the LED bead 130 can be embedded, allowing the light emitted by the LED bead to directly enter the light guide pillar 3121 and be guided, homogenized, and mixed in color. By controlling the light emission state of the LED array 10, the projected display content of the LED direct-view projection system can be controlled.

[0171] It is understandable that the length and width of each light guide post 3121 can be determined based on the spacing between adjacent LED beads 130. Since the light guide post 3121 has different light uniformity under different length and width dimensions, the height of the light guide post 3121 can be determined according to different length and width dimensions.

[0172] The projection structure 40 can be implemented using a conventional projection lens or a Fresnel lens, located on the light-emitting surface 320 of the light guide array, and used for magnified projection. The projection lens is suitable for small light-emitting surfaces, small divergence angles, and high-quality imaging projection. The Fresnel lens is used for large light-emitting surfaces, small divergence angles, and low-quality imaging projection. Because Fresnel lenses have certain edge aberrations, the light-emitting surface of the light guide array 312 is designed with a high center and low sides to eliminate edge aberrations.

[0173] Furthermore, such as Figure 2 As shown, the light-emitting surface 320 of the light guide array can be a smooth curved surface to better eliminate edge aberrations. Alternatively, as... Figure 3 As shown, the light-emitting surface 320 of the light guide column array can be in a stepped structure to reduce the manufacturing difficulty and cost of the light guide column array.

[0174] Furthermore, a microlens array can be selectively arranged between the LED array 10 and the light guide column array 312 as needed to further reduce the divergence angle of the LED beads and make the light converge and collimate.

[0175] Example 3:

[0176] The LED direct projection system provided in this example can be applied to low-resolution application scenarios, including but not limited to character information display scenarios, indicator information display scenarios, simple advertising pattern display scenarios, video projection scenarios, and festive atmosphere creation scenarios.

[0177] Specifically, the LED direct-view projection system may include an LED array 10, an LED control circuit 20, an optical structure 30, and a projection structure 40. For details regarding the LED array 10 and the LED control circuit 20, please refer to Example 1.

[0178] Unlike the LED direct-view projection system provided in Example 1, in this example, the optical structure 30 is a square fiber array 313, which can be used as a light guide, light homogenizer, and imaging display device. The square fiber array 313 includes multiple square fibers 3131 arranged in an array, with the number of rows and columns corresponding to the number of rows and columns of the LED array. Each square fiber 3131 is connected to a corresponding LED bead 130, serving as a pixel unit. Each square fiber 3131 has a second recess 3132 at its bottom, into which the LED bead 130 can be embedded, allowing light emitted from the LED bead to directly enter the square fiber 3131 and be guided, homogenized, and mixed in color. By controlling the light emission state of the LED array, the projected display content of the LED direct-view projection system can be controlled.

[0179] It is understandable that the length and width of each square optical fiber 3131 can be determined based on the spacing between adjacent LED beads 130. Since the uniform light performance of the square optical fiber 3131 varies with different length and width dimensions, the height of the square optical fiber 3131 can be determined based on different length and width dimensions.

[0180] Because the square optical fiber 3131 can be deformed at will, the square optical fiber array 313 can be bent and turned to connect with the LED array 10, allowing the LED array 10 to be placed at the bottom, side, or other positions of the square optical fiber array 313 without being fixed to the bottom of the optical structure 30. In this way, a single square optical fiber array 313 can be connected to multiple LED arrays 10 simultaneously, solving problems such as difficulty in cabling and heat dissipation caused by the high density and high power of the LED array 10.

[0181] The projection structure 40 can be implemented using a conventional projection lens or a Fresnel lens, located on the light-emitting surface 320 of the square fiber array 313, and used for magnified projection. The projection lens is suitable for small light-emitting surfaces, small divergence angles, and high-quality imaging projection. The Fresnel lens is used for large light-emitting surfaces, small divergence angles, and low-quality imaging projection. Because Fresnel lenses have certain edge aberrations, the light-emitting surface 320 of the square fiber array is designed with a high center and low sides to eliminate edge aberrations.

[0182] Furthermore, such as Figure 4 As shown, the light-emitting surface 320 of the square fiber array can be a smooth curved surface to better eliminate edge aberrations. Alternatively, as... Figure 5 As shown, the light-emitting surface 320 of the square fiber array can be in a stepped structure to reduce the manufacturing difficulty and cost of the square fiber array 313.

[0183] Further, according to actual needs, a microlens array can be selectively arranged between the LED array 10 and the square optical fiber array 313 to further reduce the divergence angle of the LED lamp beads 130 and make the light converge and collimate.

[0184] Example 4:

[0185] The LED direct-view projection system provided in this example can be applied to high-resolution application scenarios, including but not limited to daily work scenarios, learning scenarios, entertainment scenarios, etc. Specifically, the LED direct-view projection system can include an LED array 10, an LED control circuit 20, an optical structure 30, and a projection structure 40. Among them, for the relevant description of the LED control circuit 20, reference can be made to Example 1, and for the relevant description of the optical structure 30 and the projection structure 40, reference can be made to Example 2.

[0186] The LED array 10 can be implemented by using the LED array provided in any of the above embodiments. Further, in this example, the driving IC chip 120 can be an embedded IC chip, and each LED lamp bead 130 can include a red LED chip, a green LED chip, and a blue LED chip to achieve full-color emission. The red LED chip, the green LED chip, and the blue LED chip can be stacked and welded in a "pin" shape on the upper part of the corresponding driving IC chip 120. In this example, the LED array 10 is directly put into use in the form of an array without being divided into multiple individuals. In this case, the wafer 110 can be bonded to the heat dissipation substrate 150, so that the wafer 110 can be directly cooled through the heat dissipation substrate 150, improving the heat dissipation efficiency.

[0187] Example 5:

[0188] The LED direct-view projection system provided in this example can be applied to high-resolution application scenarios, including but not limited to daily work scenarios, learning scenarios, entertainment scenarios, etc. Specifically, the LED direct-view projection system can include an LED array 10, an LED control circuit 20, an optical structure 30, and a projection structure 40. Among them, for the relevant description of the LED array 10, reference can be made to Example 4, for the relevant description of the LED control circuit 20, reference can be made to Example 1, and for the relevant description of the optical structure 30 and the projection structure 40, reference can be made to Example 3.

[0189] The LED direct-view projection systems provided in the above examples can achieve pixelated and full-color projection of conventional projectors, and have the advantages of high light source brightness, high heat dissipation efficiency, small divergence angle, and simple structure.

[0190] Finally, it should be noted that in the description of this application, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0191] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0192] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0193] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0194] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0195] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0196] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An optical structure, characterized in that, include: Multiple optical units are arranged in m rows and n columns, where m and n are both positive integers. On the light-emitting side of the optical structure, the protrusion height of the n optical units in each row decreases from the center of the row to both sides, and the protrusion height of the m optical units in each column decreases from the center of the column to both ends.

2. The optical structure according to claim 1, characterized in that, On the light-emitting side of the optical structure, the protrusion height of the n optical units in each row decreases smoothly from the center of the row to both sides, and the protrusion height of the m optical units in each column decreases smoothly from the center of the column to both ends, so that the light-emitting side of the optical structure is a curved surface.

3. The optical structure according to claim 2, characterized in that, The light-emitting side of the optical structure is a curved surface with a radius of curvature proportional to the focal length of the projection structure. The projection structure is used to project the light emitted from the optical structure.

4. The optical structure according to claim 1, characterized in that, On the light-emitting side of the optical structure, the protrusion height of the n optical units in each row decreases in a stepwise manner from the center of the row to both sides, and the protrusion height of the m optical units in each column decreases in a stepwise manner from the center of the column to both ends.

5. The optical structure according to claim 4, characterized in that, The protrusion height of the optical unit is the protrusion height corresponding to the center position of the target curved surface region, and the target curved surface region is the curved surface region in the array surface corresponding to the position of the optical unit; The array surface protrudes outward from the optical structure, and the orthographic projection of the center of the array surface along the height direction of the optical structure overlaps with the array center of the optical structure; the array surface is a surface with a high center and low periphery, and the radius of curvature of the array surface is proportional to the focal length of the projection structure, and the projection structure is used to project the emitted light from the optical structure.

6. The optical structure according to any one of claims 1 to 5, characterized in that, The optical unit includes a light transmission core; The optical unit is made of a highly transparent material; or... The optical unit has a highly reflective reflective cavity with a smooth inner wall that extends through the optical unit along its axial direction.

7. The optical structure according to claim 6, characterized in that, The optical unit is an optical fiber or a light guide column.

8. The optical structure according to claim 6, characterized in that, The optical unit is a grid.

9. An LED direct-view projection system, characterized in that, include: An LED array comprises multiple LED beads arranged in an array; An LED control circuit is electrically connected to the LED array and is used to control the light-emitting state of each LED bead. The optical structure as described in any one of claims 1 to 8 is provided in the light-emitting optical path of the LED array for guiding and homogenizing the emitted light from the LED array. The optical structure has multiple optical units that are correspondingly arranged with multiple LED beads, so that the light emitted by each LED bead enters the corresponding optical unit. A projection structure is provided in the light-emitting optical path of the optical structure.

10. The LED direct-view projection system according to claim 9, characterized in that, The LED direct-view projection system also includes: A microlens array is disposed between the LED array and the optical structure to focus and collimate the light emitted by the LED array, and to cause the focused and collimated light to be incident on the optical structure.

11. The LED direct-view projection system according to claim 9, characterized in that, The LED control circuit is used for communication or electrical connection to a control terminal, and is used to receive projection display data sent by the control terminal, and control the light emission state of each LED bead according to the projection display data.

12. The LED direct-view projection system according to any one of claims 9 to 11, characterized in that, When the optical unit is a light guide column, a first concave position matching the shape of the LED lamp bead is provided at the first end of the light guide column, and the LED lamp bead is embedded in the first concave position.

13. The LED direct-view projection system according to any one of claims 9 to 11, characterized in that, When the optical unit is a light guide column, both the length and width of the light guide column remain unchanged in the direction away from the LED array; alternatively, the length of the light guide column increases in the direction away from the LED array; alternatively, the width of the light guide column increases in the direction away from the LED array.

14. The LED direct-view projection system according to any one of claims 9 to 11, characterized in that, When the optical unit is an optical fiber, a second concave position matching the shape of the LED lamp bead is provided at the first end of the optical fiber, and the LED lamp bead is embedded in the second concave position.

15. The LED direct-view projection system according to claim 9, characterized in that, The LED array includes: a driving IC array, a plurality of LED lamp beads, and a plurality of conductive wires; The driving IC array includes a wafer and a plurality of driving IC chips formed on the wafer. The plurality of driving IC chips correspond to the plurality of LED lamp beads one by one, and the LED lamp beads are welded on the surface of the driving IC chips; each conductive wire is electrically connected to at least two of the driving IC chips, so that the driving IC chips are connected to an external circuit via the conductive wires.

16. The LED direct-view projection system according to claim 15, characterized in that, The LED array further includes a heat dissipation substrate, and the heat dissipation substrate is disposed on the first surface of the wafer. The first surface is opposite to the second surface of the wafer, and the second surface is the side close to the LED lamp beads.

17. The LED direct-view projection system according to claim 16, characterized in that, The LED array further includes a heat dissipation device, and the heat dissipation device is disposed on the side of the heat dissipation substrate away from the wafer for dissipating heat from the heat dissipation substrate.

18. The LED direct-view projection system according to any one of claims 15 to 17, characterized in that, The LED lamp bead includes a light emitting unit, and the light emitting unit includes a first LED chip, a second LED chip, and a third LED chip arranged in a "pin" shape. The first LED chip, the second LED chip, and the third LED chip have different light emitting colors.

19. The LED direct-view projection system according to claim 18, characterized in that, The LED lamp bead further includes a planar encapsulation housing and a horn-shaped reflecting cup; The reflecting cup has a first opening and a second opening. The diameter of the first opening is smaller than that of the second opening, and the light emitting unit is disposed in the first opening so that the inner wall of the reflecting cup reflects the light emitted by the light emitting unit; The planar encapsulation housing covers the wafer so that the light emitting unit and the reflecting cup are accommodated in the accommodation cavity of the planar encapsulation housing.

20. The LED direct-view projection system according to claim 18, characterized in that, The LED lamp bead further includes a lens encapsulation housing, and the lens encapsulation housing covers the wafer so that the light emitting unit is accommodated in the accommodation cavity of the lens encapsulation housing; One side of the lens encapsulation housing away from the wafer protrudes in the direction away from the wafer.

21. The LED direct-view projection system according to claim 20, characterized in that, The LED lamp bead further includes a horn-shaped reflecting cup. The reflecting cup has a first opening and a second opening. The diameter of the first opening is smaller than that of the second opening; the light emitting unit is disposed in the first opening so that the inner wall of the reflecting cup reflects the light emitted by the light emitting unit; Both the reflecting cup and the light emitting unit are accommodated in the accommodation cavity of the lens encapsulation housing.

22. The LED direct-view projection system according to claim 18, characterized in that, The first LED chip, the second LED chip, and the third LED chip are all Micro-LED chips; or, the first LED chip, the second LED chip, and the third LED chip are all Mini-LED chips.

Images