Display substrate and its manufacturing method, display device

Abstract

This disclosure provides a display substrate, its manufacturing method, and a display device, belonging to the field of display technology. The display substrate includes: a driving substrate; a first electrode located on the driving substrate; a pixel defining layer located on the side of the first electrode away from the driving substrate; an isolation pillar located on the side of the pixel defining layer away from the driving substrate, the orthographic projection of the isolation pillar on the driving substrate falling within the orthographic projection of the pixel defining layer on the driving substrate; an organic light-emitting layer located on the side of the isolation pillar away from the driving substrate, the organic light-emitting layer being broken at the side of the isolation pillar; and a second electrode located on the side of the organic light-emitting layer away from the driving substrate. The technical solution of this disclosure can improve the pixel density of the display substrate.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate, a method for manufacturing the same, and a display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display devices have been listed as a promising next-generation display technology due to their advantages such as being thin, light, having a wide viewing angle, being actively emitting light, having continuously adjustable emission colors, having low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple manufacturing process, high luminous efficiency, and being flexible in display.

[0003] In related technologies, the pixels of OLED display devices are made using FMM (fine metal mask), which is costly and limits PPI (pixel density). Summary of the Invention

[0004] The technical problem to be solved by this disclosure is to provide a display substrate and its manufacturing method, as well as a display device, which can improve the pixel density of the display substrate.

[0005] To address the aforementioned technical problems, the embodiments of this disclosure provide the following technical solutions:

[0006] On one hand, a display substrate is provided, comprising:

[0007] Drive substrate;

[0008] The first electrode is located on the driving substrate;

[0009] A pixel defining layer located on the side of the first electrode away from the driving substrate;

[0010] An isolation pillar located on the side of the pixel defining layer away from the driving substrate, wherein the orthographic projection of the isolation pillar on the driving substrate is located within the orthographic projection of the pixel defining layer on the driving substrate;

[0011] An organic light-emitting layer located on the side of the isolation pillar away from the driving substrate, the organic light-emitting layer being broken on the side of the isolation pillar;

[0012] The second electrode is located on the side of the organic light-emitting layer away from the driving substrate.

[0013] In some embodiments, at least one side of the isolation post is formed with a notch.

[0014] In some embodiments, the isolation column is a metal isolation column.

[0015] In some embodiments, along the direction close to the driving substrate, the isolation pillar includes a first metal pattern and a second metal pattern stacked together, wherein the orthographic projection of the second metal pattern on the driving substrate is located within the orthographic projection of the first metal pattern on the driving substrate.

[0016] In some embodiments, the isolation pillar further includes a third metal pattern located on the side of the second metal pattern closer to the driving substrate, wherein the orthographic projection of the second metal pattern on the driving substrate is located within the orthographic projection of the third metal pattern on the driving substrate.

[0017] In some embodiments, the second electrode is made of a transparent conductive oxide.

[0018] In some embodiments, the pixel defining layer defines a plurality of opening regions, the minimum width of which is no greater than 2µm.

[0019] In some embodiments, the height of the isolation column is 0.5um-3um.

[0020] Embodiments of this disclosure provide a display device including the display substrate described above.

[0021] Embodiments of this disclosure provide a method for manufacturing a display substrate, including:

[0022] Forming a driving substrate;

[0023] A first electrode is formed on the driving substrate;

[0024] A pixel defining layer is formed on the side of the first electrode away from the driving substrate;

[0025] An isolation pillar is formed on the side of the pixel defining layer away from the driving substrate, and the orthographic projection of the isolation pillar on the driving substrate is located within the orthographic projection of the pixel defining layer on the driving substrate;

[0026] An organic light-emitting layer and a second electrode are formed on the side of the isolation pillar away from the driving substrate, and the organic light-emitting layer is broken on the side of the isolation pillar.

[0027] In some embodiments, forming the isolation pillar includes:

[0028] An isolation post is formed with at least one notch on at least one side.

[0029] In some embodiments, forming the isolation pillar includes:

[0030] A second metal material layer is formed on a driving substrate on which the pixel defining layer is formed, and a first metal material layer is formed on the side of the second metal material layer away from the driving substrate;

[0031] The first metal material layer and the second metal material layer are etched to form initial isolation pillars;

[0032] The initial isolation pillar is wet-etched, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer, thereby forming the notch.

[0033] In some embodiments, forming the isolation pillar includes:

[0034] A third metal material layer, a second metal material layer, and a first metal material layer are sequentially formed on a driving substrate on which the pixel defining layer is formed.

[0035] The third metal material layer, the second metal material layer, and the first metal material layer are etched to form initial isolation pillars;

[0036] The initial isolation pillar is wet-etched, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer and the third metal material layer, thereby forming the notch.

[0037] In some embodiments, the first etching is dry etching.

[0038] In some embodiments, the pixel defining layer defines a plurality of pixel regions, including a first color pixel region, a second color pixel region, and a third color pixel region. Forming an organic light-emitting layer and a second electrode on the side of the isolation pillar away from the driving substrate includes:

[0039] A first color organic light-emitting layer and a second electrode layer are sequentially deposited on the side of the isolation pillar away from the driving substrate;

[0040] The first color organic light-emitting layer and the second electrode layer are patterned using photolithography, while retaining the first color organic light-emitting layer and the second electrode layer located in the first color pixel area.

[0041] A second color organic light-emitting layer and a second electrode layer are sequentially deposited on the side of the isolation pillar away from the driving substrate;

[0042] The second color organic light-emitting layer and the second electrode layer are patterned using photolithography, while retaining the second color organic light-emitting layer and the second electrode layer located in the second color pixel area.

[0043] A third color organic light-emitting layer and a second electrode layer are sequentially deposited on the side of the isolation pillar away from the driving substrate;

[0044] The third color organic light-emitting layer and the second electrode layer are patterned using photolithography, while retaining the third color organic light-emitting layer and the second electrode layer located in the third color pixel region.

[0045] The embodiments disclosed herein have the following beneficial effects:

[0046] In the above scheme, an isolation pillar is provided on the side of the pixel defining layer away from the driving substrate. After an organic light-emitting layer is formed on the side of the isolation pillar away from the driving substrate, the organic light-emitting layer is broken on the side of the isolation pillar. This separates the organic light-emitting layers located in different pixel areas. After the organic light-emitting layers in different pixel areas are separated, the organic light-emitting layer corresponding to a pixel of one color can be retained, and the organic light-emitting layer of other pixel areas can be removed by photolithography. In this way, organic light-emitting layers corresponding to multiple colors can be obtained through multiple photolithography processes. It is possible to manufacture organic light-emitting layers of different colors by photolithography. On the one hand, it reduces the manufacturing cost of the display substrate. On the other hand, due to the higher precision of the photolithography process, it can increase the pixel density of the display substrate. Attached Figure Description

[0047] Figure 1a and Figure 1b This is a plan view of the display substrate according to an embodiment of the present disclosure;

[0048] Figure 2 This is a schematic cross-sectional view of the display substrate in the AA direction of FIG1 according to an embodiment of the present disclosure;

[0049] Figures 3a-3d This is a schematic diagram of the structure of the isolation column according to an embodiment of the present disclosure;

[0050] Figures 4-17 This is a schematic flowchart illustrating a method for manufacturing a display substrate according to an embodiment of the present disclosure.

[0051] Figure Labels

[0052] 01 Driver Board

[0053] 02 pixel delimiting layer

[0054] 03 First Electrode

[0055] 04 isolation column

[0056] 041 First Metal Graphic

[0057] 042 Second Metal Graphic

[0058] 043 Third Metal Graphic

[0059] 05 First Color Organic Light Emitting Layer

[0060] 06 Second Electrode Layer

[0061] 07 Photoresist

[0062] 08 Mask

[0063] 09 Second Color Organic Light Emitting Layer

[0064] 10 Third Color Organic Light Emitting Layer

[0065] 11 encapsulation layers Detailed Implementation

[0066] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0067] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0068] The embodiments of this disclosure provide a display substrate and a method for manufacturing the same, as well as a display device, which can improve the pixel density of the display substrate.

[0069] Embodiments of this disclosure provide a display substrate, comprising:

[0070] Drive substrate;

[0071] The first electrode is located on the driving substrate;

[0072] A pixel defining layer located on the side of the first electrode away from the driving substrate;

[0073] An isolation pillar located on the side of the pixel defining layer away from the driving substrate, wherein the orthographic projection of the isolation pillar on the driving substrate is located within the orthographic projection of the pixel defining layer on the driving substrate;

[0074] An organic light-emitting layer located on the side of the isolation pillar away from the driving substrate, the organic light-emitting layer being broken on the side of the isolation pillar;

[0075] The second electrode is located on the side of the organic light-emitting layer away from the driving substrate.

[0076] In this embodiment, an isolation pillar is provided on the side of the pixel defining layer away from the driving substrate. After an organic light-emitting layer is formed on the side of the isolation pillar away from the driving substrate, the organic light-emitting layer is broken on the side of the isolation pillar. This separates the organic light-emitting layers located in different pixel areas. After the organic light-emitting layers in different pixel areas are separated, the organic light-emitting layer corresponding to a pixel of one color can be retained, and the organic light-emitting layers in other pixel areas can be removed by photolithography. In this way, organic light-emitting layers corresponding to multiple colors can be obtained through multiple photolithography processes. It is possible to manufacture organic light-emitting layers of different colors by photolithography, which reduces the manufacturing cost of the display substrate on the one hand, and increases the pixel density of the display substrate on the other hand due to the higher precision of the photolithography process.

[0077] In this embodiment, the driving substrate includes a substrate and a thin-film transistor array, wiring, etc., formed on the substrate. The substrate can be a flexible substrate, such as a polyimide film; or a rigid substrate, such as a quartz substrate or a glass substrate. The first electrode, the organic light-emitting layer, and the second electrode constitute a light-emitting device. Under the action of the electric field between the first electrode and the second electrode, the organic light-emitting layer can emit light.

[0078] In this embodiment, in order to completely separate the organic light-emitting layers located in different pixel regions, isolation pillars can be set on the pixel boundary layers between different pixel regions to completely separate pixel regions of different colors. For example... Figure 1a As shown, the display substrate includes a red pixel A, a green pixel G, and a blue pixel B. Isolation pillars 04 are provided between the pixel area where the red pixel R is located and the pixel area where the blue pixel B is located. Isolation pillars 04 are provided between the pixel area where the red pixel R is located and the pixel area where the green pixel G is located. Isolation pillars 04 are provided between the pixel area where the green pixel G is located and the pixel area where the blue pixel B is located.

[0079] Of course, isolation pillars 04 can also be set only in a portion of the pixel boundary layer 02, such as... Figure 1b As shown.

[0080] In this embodiment, the longitudinal section of the isolation pillar can be rectangular, inverted trapezoidal, etc., as long as it ensures that the organic light-emitting layer breaks on the side of the isolation pillar. After the organic light-emitting layer breaks on the side of the isolation pillar, a second electrode is formed on the side of the organic light-emitting layer away from the driving substrate using a sputtering process. Due to the good film encapsulation characteristics of the sputtering process, the second electrode will cover the entire isolation pillar, which can encapsulate the organic light-emitting layer and prevent impurities such as water and oxygen from invading the organic light-emitting layer, thus ensuring the encapsulation effect of the display substrate. Specifically, the second electrode can be a transparent conductive oxide (TCO), including but not limited to ITZO, IZO, ITO, etc., so as not to affect the light emission of the organic light-emitting layer.

[0081] Because the second electrode is generally thin, its resistance is high, resulting in significant IR drop during display device operation, which affects the uniformity of display brightness. In this embodiment, the isolation pillar can be a metal pillar, allowing it to be reused as an auxiliary electrode structure. Multiple auxiliary electrode structures connected in parallel with the second electrode can reduce its resistance, thus mitigating the IR drop problem caused by the high resistance of the second electrode. When the display substrate is used in a display device, this ensures the uniformity of display brightness and improves the display quality.

[0082] In this embodiment, to ensure that the organic light-emitting layer breaks on the side of the isolation pillar, such as... Figure 2 As shown, a notch can be formed on at least one side of the isolation post 04; a notch can be formed in a portion of the side of the isolation post 04; a ring of notches can be formed around the side of the isolation post 04; a ring of notches can be formed on the side of the isolation post 04; or multiple rings of notches can be formed.

[0083] In some embodiments, such as Figure 3a As shown, along the direction close to the driving substrate, the isolation post 04 includes a first metal pattern 041 and a second metal pattern 042 stacked together. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate, thereby forming a notch on the side of the isolation post 04.

[0084] Specifically, a second metal material layer can be formed on a driving substrate where a pixel defining layer is formed, and a first metal material layer can be formed on the side of the second metal material layer away from the driving substrate; the first metal material layer and the second metal material layer are etched first to form initial isolation pillars 040, such as... Figure 3bAs shown; the initial isolation pillar 040 is subjected to wet etching, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer, thereby forming Figure 3a The notch shown.

[0085] The first etching process can be either wet etching or dry etching.

[0086] When selecting the materials for the first and second metal layers, it is necessary to ensure that the etching rate of the second metal layer in a specific etching solution is greater than that of the first metal layer in the same solution. When wet etching is used for the first etching, the etching solution used is not this specific etching solution. The etching rates of the first and second metal layers in the etching solution used for the first etching are the same or similar, thus preventing the formation of notches on the sides of the initial isolation pillar. After forming the initial isolation pillar, wet etching is performed on it. The etching solution used for wet etching must have a higher etching rate for the second metal layer than for the first metal layer. This results in more of the second metal layer pattern being etched than the first metal layer pattern, thereby forming an isolation pillar with notches on its sides. In a specific example, the etching solution used in wet etching can only etch the second metal material layer and not the first metal material layer. In this way, after wet etching the initial isolation pillar 040 with the etching solution, the pattern of the first metal material layer is preserved, forming the first metal pattern 041. The first metal pattern 041 and the second metal pattern 042 form the isolation pillar 04. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate, thereby forming a notch.

[0087] Specifically, the first metal material layer can be Ti and the second metal material layer can be Al; or, the first metal material layer can be Mo and the second metal material layer can be Al.

[0088] In some embodiments, such as Figure 3c As shown, along the direction close to the driving substrate, the isolation post 04 includes a first metal pattern 041 and a second metal pattern 042 stacked together. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate. The isolation post 04 also includes a third metal pattern 043 located on the side of the second metal pattern 042 close to the driving substrate. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the third metal pattern 043 on the driving substrate. Thus, a notch is formed on the side of the isolation post 04.

[0089] Specifically, a third metal material layer can be formed on the driving substrate where the pixel defining layer is formed, a second metal material layer can be formed on the side of the third metal material layer away from the driving substrate, and a first metal material layer can be formed on the side of the second metal material layer away from the driving substrate; the third metal material layer, the second metal material layer, and the first metal material layer are subjected to a first etching to form initial isolation pillars 040, such as... Figure 3d As shown; the initial isolation pillar 040 is subjected to wet etching, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer, and a higher etching rate on the second metal material layer than on the third metal material layer, thereby forming Figure 3c The notch shown.

[0090] The first etching process can be either wet etching or dry etching.

[0091] When selecting the materials for the third, first, and second metal layers, it is necessary to ensure that the etching rate of the second metal layer in the specific etching solution is greater than that of the first metal layer, and vice versa. When the first etching uses wet etching, the etching solution used is not the specific etching solution used. The etching rates of the first, third, and second metal layers in the etching solution used for the first etching are the same or similar, thus preventing the formation of notches on the sides of the initial isolation pillars. After the initial isolation pillar is formed, it is subjected to wet etching. The etching solution used for wet etching needs to meet the following requirements: the etching rate of the second metal material layer is greater than that of the first metal material layer, and the etching rate of the second metal material layer is greater than that of the third metal material layer. In this way, the etched part of the second metal material layer pattern is more than the etched part of the first metal material layer pattern, and the etched part of the second metal material layer pattern is more than the etched part of the third metal material layer pattern, thereby forming an isolation pillar with a notch on the side. In a specific example, the etching solution used in wet etching can only etch the second metal material layer and not the first and third metal material layers. In this way, after wet etching the initial isolation pillar 040 with the etching solution, the pattern of the first metal material layer is preserved, forming the first metal pattern 041; the pattern of the third metal material layer is preserved, forming the third metal pattern 043; the first metal pattern 041, the second metal pattern 042, and the third metal pattern 043 constitute the isolation pillar 04. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate, and the orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the third metal pattern 043 on the driving substrate, thereby forming a notch.

[0092] Specifically, the first metal material layer can be made of Ti, the second metal material layer can be made of Al, and the third metal material layer can be made of Ti; or, the first metal material layer can be made of Mo, the second metal material layer can be made of Al, and the third metal material layer can be made of Mo.

[0093] The above specific embodiments are illustrated using the example of an isolation column comprising two layers of metal patterns and three layers of metal patterns. However, the isolation column disclosed herein is not limited to comprising two layers of metal patterns and three layers of metal patterns, and may also comprise more layers of metal patterns.

[0094] After forming at least one ring of isolation pillars 04 using the above method, an organic light-emitting layer can be formed. The organic light-emitting layer is broken at the notch of the isolation pillars 04, thereby separating the organic light-emitting layers of different pixel areas.

[0095] In this embodiment, the pixel defining layer defines multiple opening regions. Since the organic light-emitting layer can be fabricated using photolithography, the pixel density of the display substrate can be increased. The minimum width of the opening region can be no more than 2 μm, which can effectively improve the pixel density of the display substrate.

[0096] In some embodiments, the height of the isolation pillar is 0.5um-3um. When the thickness of the isolation pillar is within this range, it can ensure that the organic light-emitting layer breaks on the side of the isolation pillar without significantly affecting the thickness of the display substrate.

[0097] Embodiments of this disclosure provide a display device including the display substrate described above.

[0098] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the structure of the display device described above does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In the embodiments of this disclosure, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, a navigation display device, etc.

[0099] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0100] Embodiments of this disclosure provide a method for manufacturing a display substrate, including:

[0101] Forming a driving substrate;

[0102] A first electrode is formed on the driving substrate;

[0103] A pixel defining layer is formed on the side of the first electrode away from the driving substrate;

[0104] An isolation pillar is formed on the side of the pixel defining layer away from the driving substrate, and the orthographic projection of the isolation pillar on the driving substrate is located within the orthographic projection of the pixel defining layer on the driving substrate;

[0105] An organic light-emitting layer and a second electrode are formed on the side of the isolation pillar away from the driving substrate, and the organic light-emitting layer is broken on the side of the isolation pillar.

[0106] In this embodiment, an isolation pillar is provided on the side of the pixel defining layer away from the driving substrate. After an organic light-emitting layer is formed on the side of the isolation pillar away from the driving substrate, the organic light-emitting layer is broken on the side of the isolation pillar. This separates the organic light-emitting layers located in different pixel areas. After the organic light-emitting layers in different pixel areas are separated, the organic light-emitting layer corresponding to a pixel of one color can be retained, and the organic light-emitting layers in other pixel areas can be removed by photolithography. In this way, organic light-emitting layers corresponding to multiple colors can be obtained through multiple photolithography processes. It is possible to manufacture organic light-emitting layers of different colors by photolithography, which reduces the manufacturing cost of the display substrate on the one hand, and increases the pixel density of the display substrate on the other hand due to the higher precision of the photolithography process.

[0107] In this embodiment, the driving substrate includes a substrate and a thin-film transistor array, wiring, etc., formed on the substrate. The substrate can be a flexible substrate, such as a polyimide film; or a rigid substrate, such as a quartz substrate or a glass substrate. The first electrode, the organic light-emitting layer, and the second electrode constitute a light-emitting device. Under the action of the electric field between the first electrode and the second electrode, the organic light-emitting layer can emit light. The organic light-emitting layer includes films such as a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), a hole block layer (HBL), and an electron block layer (EBL).

[0108] In this embodiment, in order to completely separate the organic light-emitting layers located in different pixel regions, isolation pillars can be set on the pixel boundary layers between different pixel regions to completely separate pixel regions of different colors. For example... Figure 1aAs shown, the display substrate includes a red pixel A, a green pixel G, and a blue pixel B. Isolation pillars 04 are provided between the pixel area where the red pixel R is located and the pixel area where the blue pixel B is located. Isolation pillars 04 are provided between the pixel area where the red pixel R is located and the pixel area where the green pixel G is located. Isolation pillars 04 are provided between the pixel area where the green pixel G is located and the pixel area where the blue pixel B is located.

[0109] Of course, isolation pillars 04 can also be set only in a portion of the pixel boundary layer 02, such as... Figure 1b As shown.

[0110] In this embodiment, the longitudinal section of the isolation pillar can be rectangular, inverted trapezoidal, etc., as long as it ensures that the organic light-emitting layer breaks on the side of the isolation pillar. After the organic light-emitting layer breaks on the side of the isolation pillar, a second electrode is formed on the side of the organic light-emitting layer away from the driving substrate using a sputtering process. Due to the good film encapsulation properties of the sputtering process, the second electrode will cover the entire isolation pillar, which can encapsulate the organic light-emitting layer and prevent impurities such as water and oxygen from invading the organic light-emitting layer, thus ensuring the encapsulation effect of the display substrate. Specifically, the second electrode can be a transparent conductive oxide, including but not limited to ITZO, IZO, ITO, etc.

[0111] Because the second electrode is generally thin, its resistance is high, resulting in significant IR drop during display device operation, which affects the uniformity of display brightness. In this embodiment, the isolation pillar can be a metal pillar, allowing it to be reused as an auxiliary electrode structure. Multiple auxiliary electrode structures connected in parallel with the second electrode can reduce its resistance, thus mitigating the IR drop problem caused by the high resistance of the second electrode. When the display substrate is used in a display device, this ensures the uniformity of display brightness and improves the display quality.

[0112] In this embodiment, to ensure that the organic light-emitting layer breaks on the side of the isolation pillar, such as... Figure 2 As shown, a notch can be formed on at least one side of the isolation post 04; a notch can be formed in a portion of the side of the isolation post 04; a ring of notches can be formed around the side of the isolation post 04; a ring of notches can be formed on the side of the isolation post 04; or multiple rings of notches can be formed.

[0113] In some embodiments, forming the isolation pillar includes:

[0114] An isolation post is formed with at least one notch on at least one side.

[0115] In some embodiments, forming the isolation pillar includes:

[0116] A second metal material layer is formed on a driving substrate on which the pixel defining layer is formed, and a first metal material layer is formed on the side of the second metal material layer away from the driving substrate;

[0117] The first metal material layer and the second metal material layer are etched to form initial isolation pillars;

[0118] The initial isolation pillar is wet-etched, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer, thereby forming the notch.

[0119] like Figure 3a As shown, along the direction close to the driving substrate, the isolation post 04 includes a first metal pattern 041 and a second metal pattern 042 stacked together. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate, thereby forming a notch on the side of the isolation post 04.

[0120] Specifically, a second metal material layer can be formed on a driving substrate where a pixel defining layer is formed, and a first metal material layer can be formed on the side of the second metal material layer away from the driving substrate; the first metal material layer and the second metal material layer are etched first to form initial isolation pillars 040, such as... Figure 3b As shown; the initial isolation pillar 040 is subjected to wet etching, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer, thereby forming Figure 3a The notch shown.

[0121] The first etching process can be either wet etching or dry etching.

[0122] When selecting the materials for the first and second metal layers, it is necessary to ensure that the etching rate of the second metal layer in a specific etching solution is greater than that of the first metal layer in the same solution. When wet etching is used for the first etching, the etching solution used is not this specific etching solution. The etching rates of the first and second metal layers in the etching solution used for the first etching are the same or similar, thus preventing the formation of notches on the sides of the initial isolation pillar. After forming the initial isolation pillar, wet etching is performed on it. The etching solution used for wet etching must have a higher etching rate for the second metal layer than for the first metal layer. This results in more of the second metal layer pattern being etched than the first metal layer pattern, thereby forming an isolation pillar with notches on its sides. In a specific example, the etching solution used in wet etching can only etch the second metal material layer and not the first metal material layer. In this way, after wet etching the initial isolation pillar 040 with the etching solution, the pattern of the first metal material layer is preserved, forming the first metal pattern 041. The first metal pattern 041 and the second metal pattern 042 form the isolation pillar 04. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate, thereby forming a notch.

[0123] Specifically, the first metal material layer can be Ti and the second metal material layer can be Al; or, the first metal material layer can be Mo and the second metal material layer can be Al.

[0124] In some embodiments, forming the isolation pillar includes:

[0125] A third metal material layer, a second metal material layer, and a first metal material layer are sequentially formed on a driving substrate on which the pixel defining layer is formed.

[0126] The third metal material layer, the second metal material layer, and the first metal material layer are etched to form initial isolation pillars;

[0127] The initial isolation pillar is wet-etched, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer and the third metal material layer, thereby forming the notch.

[0128] like Figure 3cAs shown, along the direction close to the driving substrate, the isolation post 04 includes a first metal pattern 041 and a second metal pattern 042 stacked together. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate. The isolation post 04 also includes a third metal pattern 043 located on the side of the second metal pattern 042 close to the driving substrate. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the third metal pattern 043 on the driving substrate. Thus, a notch is formed on the side of the isolation post 04.

[0129] Specifically, a third metal material layer can be formed on the driving substrate where the pixel defining layer is formed, a second metal material layer can be formed on the side of the third metal material layer away from the driving substrate, and a first metal material layer can be formed on the side of the second metal material layer away from the driving substrate; the third metal material layer, the second metal material layer, and the first metal material layer are subjected to a first etching to form initial isolation pillars 040, such as... Figure 3d As shown; the initial isolation pillar 040 is subjected to wet etching, and the etching solution used has a higher etching rate on the second metal material layer than on the first metal material layer, and a higher etching rate on the second metal material layer than on the third metal material layer, thereby forming Figure 3c The notch shown.

[0130] The first etching process can be either wet etching or dry etching.

[0131] When selecting the materials for the third, first, and second metal layers, it is necessary to ensure that the etching rate of the second metal layer in the specific etching solution is greater than that of the first metal layer, and vice versa. When the first etching uses wet etching, the etching solution used is not the specific etching solution used. The etching rates of the first, third, and second metal layers in the etching solution used for the first etching are the same or similar, thus preventing the formation of notches on the sides of the initial isolation pillars. After the initial isolation pillar is formed, it is subjected to wet etching. The etching solution used for wet etching needs to meet the following requirements: the etching rate of the second metal material layer is greater than that of the first metal material layer, and the etching rate of the second metal material layer is greater than that of the third metal material layer. In this way, the etched part of the second metal material layer pattern is more than the etched part of the first metal material layer pattern, and the etched part of the second metal material layer pattern is more than the etched part of the third metal material layer pattern, thereby forming an isolation pillar with a notch on the side. In a specific example, the etching solution used in wet etching can only etch the second metal material layer and not the first and third metal material layers. In this way, after wet etching the initial isolation pillar 040 with the etching solution, the pattern of the first metal material layer is preserved, forming the first metal pattern 041; the pattern of the third metal material layer is preserved, forming the third metal pattern 043; the first metal pattern 041, the second metal pattern 042, and the third metal pattern 043 constitute the isolation pillar 04. The orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the first metal pattern 041 on the driving substrate, and the orthographic projection of the second metal pattern 042 on the driving substrate is located within the orthographic projection of the third metal pattern 043 on the driving substrate, thereby forming a notch.

[0132] Specifically, the first metal material layer can be made of Ti, the second metal material layer can be made of Al, and the third metal material layer can be made of Ti; or, the first metal material layer can be made of Mo, the second metal material layer can be made of Al, and the third metal material layer can be made of Mo.

[0133] The above specific embodiments are illustrated using the example of an isolation column comprising two layers of metal patterns and three layers of metal patterns. However, the isolation column disclosed herein is not limited to comprising two layers of metal patterns and three layers of metal patterns, and may also comprise more layers of metal patterns.

[0134] After forming at least one ring of isolation pillars 04 using the above method, an organic light-emitting layer can be formed. The organic light-emitting layer is broken at the notch of the isolation pillars 04, thereby separating the organic light-emitting layers of different pixel areas.

[0135] In a specific example, the pixel demarcation layer defines multiple pixel regions, including a first color pixel region, a second color pixel region, and a third color pixel region, such as... Figures 4-17 As shown, forming an organic light-emitting layer and a second electrode on the side of the isolation pillar away from the driving substrate includes:

[0136] Step 1, as follows Figure 4 As shown, a first color organic light-emitting layer 05 is deposited on the side of the isolation pillar 04 away from the driving substrate 01;

[0137] The driving substrate has a first electrode 03 and a pixel defining layer 02 already formed on it. The first color organic light-emitting layer 05 can be formed by vapor deposition or deposition. Due to the notch formed on the side of the isolation pillar 04, the first color organic light-emitting layer 05 breaks on the side of the isolation pillar 04.

[0138] Step 2, as follows Figure 5 As shown, a second electrode layer 06 is formed on the side of the first color organic light-emitting layer 05 away from the driving substrate;

[0139] Specifically, the second electrode layer 06 can be formed using a sputtering process. Due to the good film encapsulation properties of the sputtering process, the second electrode layer 06 will cover the entire isolation pillar 04, thus encapsulating the organic light-emitting layer and preventing impurities such as water and oxygen from intruding into the organic light-emitting layer, ensuring the encapsulation effect of the display substrate. Specifically, the second electrode layer 06 can be made of a transparent conductive oxide, including but not limited to ITZO, IZO, and ITO.

[0140] Step 3, as follows Figure 6 As shown, photoresist 07 is formed on a driving substrate on which the second electrode layer 06 is formed, and photoresist 07 is exposed using a mask 08.

[0141] The photomask 08 includes a light-transmitting pattern and an opaque pattern, wherein the opaque pattern corresponds to the first color pixel area, and the light-transmitting pattern corresponds to the second color pixel area and the third color pixel area.

[0142] Step 4, as follows Figure 7 As shown, after exposure and development, the photoresist in the first color pixel area is retained, while the photoresist in the second and third color pixel areas is removed.

[0143] Step 5, as follows Figure 8 As shown, the first color organic light-emitting layer 05 and the second electrode layer 06 of the second color pixel region and the third color pixel region are etched to remove the first color organic light-emitting layer 05 and the second electrode layer 06 of the second color pixel region and the third color pixel region, and the remaining photoresist is stripped off, while the first color organic light-emitting layer 05 and the second electrode layer 06 of the first pixel region are retained.

[0144] Step 6, as follows Figure 9 As shown, the second color organic light-emitting layer 09 can be formed on the driving substrate after step 5 by vapor deposition or deposition. Since the side of the isolation pillar 04 has a notch, the second color organic light-emitting layer 09 breaks on the side of the isolation pillar 04. The second electrode layer 06 is formed on the side of the second color organic light-emitting layer 09 away from the driving substrate.

[0145] Specifically, the second electrode layer 06 can be formed using a sputtering process. Due to the good film encapsulation properties of the sputtering process, the second electrode layer 06 will cover the entire isolation pillar 04, thus encapsulating the organic light-emitting layer and preventing impurities such as water and oxygen from intruding into the organic light-emitting layer, ensuring the encapsulation effect of the display substrate. Specifically, the second electrode layer 06 can be made of a transparent conductive oxide, including but not limited to ITZO, IZO, and ITO.

[0146] Step 7, as follows Figure 10 As shown, photoresist 07 is coated on the driving substrate after step 6, and photoresist 07 is exposed using a mask 08. The mask 08 includes a light-transmitting pattern and an opaque pattern, wherein the opaque pattern corresponds to the second color pixel area, and the light-transmitting pattern corresponds to the first color pixel area and the third color pixel area.

[0147] Step 8, as follows Figure 11 As shown, after exposure and development, the photoresist in the second color pixel area is retained, while the photoresist in the first color pixel area and the third color pixel area is removed.

[0148] Step 9, as follows Figure 12 As shown, the second color organic light-emitting layer 09 and the second electrode layer 06 of the first color pixel region and the third color pixel region are etched to remove the second color organic light-emitting layer 09 and the second electrode layer 06 of the first color pixel region and the third color pixel region, and the remaining photoresist is stripped off, while the second color organic light-emitting layer 09 and the second electrode layer 06 of the second pixel region are retained.

[0149] Step 10, as follows Figure 13 As shown, the third color organic light-emitting layer 10 can be formed on the driving substrate after step 9 by vapor deposition or deposition. Since the side of the isolation pillar 04 has a notch, the third color organic light-emitting layer 10 breaks on the side of the isolation pillar 04. The second electrode layer 06 is formed on the side of the third color organic light-emitting layer 10 away from the driving substrate.

[0150] Specifically, the second electrode layer 06 can be formed using a sputtering process. Due to the good film encapsulation properties of the sputtering process, the second electrode layer 06 will cover the entire isolation pillar 04, thus encapsulating the organic light-emitting layer and preventing impurities such as water and oxygen from intruding into the organic light-emitting layer, ensuring the encapsulation effect of the display substrate. Specifically, the second electrode layer 06 can be made of a transparent conductive oxide, including but not limited to ITZO, IZO, and ITO.

[0151] Step 11, as follows Figure 14 As shown, photoresist 07 is coated on the driving substrate after step 10, and photoresist 07 is exposed using a mask 08. The mask 08 includes a light-transmitting pattern and an opaque pattern, wherein the opaque pattern corresponds to the third color pixel area, and the light-transmitting pattern corresponds to the first color pixel area and the second color pixel area.

[0152] Step 12, as follows Figure 15 As shown, after exposure and development, the photoresist in the third color pixel area is retained, while the photoresist in the first color pixel area and the second color pixel area is removed.

[0153] Step 13, as follows Figure 16 As shown, the third color organic light-emitting layer 10 and the second electrode layer 06 of the first color pixel region and the second color pixel region are etched to remove the third color organic light-emitting layer 10 and the second electrode layer 06 of the first color pixel region and the second color pixel region, and the remaining photoresist is stripped off, while the third color organic light-emitting layer 10 and the second electrode layer 06 of the third pixel region are retained.

[0154] The above steps can be used to prepare organic light-emitting layers in different pixel areas. In this embodiment, photolithography is used to replace FMM technology to prepare organic light-emitting layers for different color pixels. This reduces the manufacturing cost and enables the display substrate to achieve a high PPI.

[0155] Step 14, as follows Figure 17 As shown, an encapsulation layer 11 is formed.

[0156] An encapsulation layer 11 is formed over a display substrate on which light-emitting devices are formed. The encapsulation layer 11 may include a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer stacked sequentially. The first encapsulation layer can be formed on the driving substrate using methods such as chemical vapor deposition, physical vapor deposition, or coating. The first encapsulation layer provides encapsulation and protection for the functional structures located in the display area. The second encapsulation layer can planarize the first encapsulation layer, and the third encapsulation layer can form an outer encapsulation layer. The first and third encapsulation layers can be made of inorganic materials, such as silicon nitride, silicon oxide, and silicon oxynitride. The second encapsulation layer can be made of organic materials, such as polyimide (PI) and epoxy resin. Thus, the first, second, and third encapsulation layers form a composite encapsulation layer 11, which provides multiple layers of protection for the functional structures of the display area, resulting in better encapsulation performance.

[0157] In the various method embodiments of this disclosure, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps are within the scope of protection of this disclosure without any creative effort.

[0158] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0159] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0160] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0161] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0162] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A method for manufacturing a display substrate, characterized in that, The method comprises: forming a driving substrate; forming a first electrode on the driving substrate; forming a pixel defining layer on a side of the first electrode away from the driving substrate; forming an isolation column on a side of the pixel defining layer away from the driving substrate, a normal projection of the isolation column on the driving substrate being located within a normal projection of the pixel defining layer on the driving substrate; forming an organic light emitting layer and a second electrode on a side of the isolation column away from the driving substrate, the organic light emitting layer being broken on a side surface of the isolation column; the pixel defining layer defines a plurality of pixel regions, including a first color pixel region, a second color pixel region and a third color pixel region, and forming an organic light emitting layer and a second electrode on a side of the isolation column away from the driving substrate comprises: sequentially depositing a first color organic light emitting layer and a second electrode layer on a side of the isolation column away from the driving substrate; patterning the first color organic light emitting layer and the second electrode layer by using a photolithography process, and retaining the first color organic light emitting layer and the second electrode layer located in the first color pixel region; sequentially depositing a second color organic light emitting layer and a second electrode layer on a side of the isolation column away from the driving substrate; patterning the second color organic light emitting layer and the second electrode layer by using a photolithography process, and retaining the second color organic light emitting layer and the second electrode layer located in the second color pixel region; sequentially depositing a third color organic light emitting layer and a second electrode layer on a side of the isolation column away from the driving substrate; patterning the third color organic light emitting layer and the second electrode layer by using a photolithography process, and retaining the third color organic light emitting layer and the second electrode layer located in the third color pixel region.

2. The method according to claim 1, wherein The forming of the isolation column comprises: forming an isolation column with at least one side having at least one annular notch.

3. The method for manufacturing a display substrate according to claim 2, wherein The forming of the isolation column comprises: forming a second metal material layer on the driving substrate on which the pixel defining layer is formed, and forming a first metal material layer on a side of the second metal material layer away from the driving substrate; performing a first etching on the first metal material layer and the second metal material layer to form an initial isolation column; performing a wet etching on the initial isolation column, and using an etching liquid with an etching speed on the second metal material layer greater than that on the first metal material layer, thereby forming the notch.

4. The manufacturing method of the display substrate according to claim 2, characterized in that, The forming of the isolation column comprises: sequentially forming a third metal material layer, a second metal material layer and a first metal material layer on the driving substrate on which the pixel defining layer is formed; performing a first etching on the third metal material layer, the second metal material layer and the first metal material layer to form an initial isolation column; performing a wet etching on the initial isolation column, and using an etching liquid with an etching speed on the second metal material layer greater than that on the first metal material layer and that on the third metal material layer, thereby forming the notch.

5. The method according to claim 3 or 4, wherein The first etching is a dry etching.

6. A display substrate manufactured by the method of any one of claims 1 to 5, wherein The method comprises: a driving substrate; a first electrode on the driving substrate; a pixel defining layer on a side of the first electrode away from the driving substrate; A separation column is located on the side of the pixel defining layer away from the driving substrate, and a projection of the separation column on the driving substrate is located within a projection of the pixel defining layer on the driving substrate; An organic light emitting layer is located on the side of the separation column away from the driving substrate, and the organic light emitting layer is broken on the side surface of the separation column; A second electrode is located on the side of the organic light emitting layer away from the driving substrate. 7.The display substrate of claim 6, wherein, At least one side surface of the separation column is formed with a notch. 8.The display substrate of claim 6, wherein, The separation column is a metal separation column. 9.The display substrate of claim 8, wherein, In the direction close to the driving substrate, the separation column comprises a first metal pattern and a second metal pattern arranged in a stack, and a projection of the second metal pattern on the driving substrate is located within a projection of the first metal pattern on the driving substrate. 10.The display substrate of claim 9, wherein, The separation column further comprises a third metal pattern located on the side of the second metal pattern close to the driving substrate, and a projection of the second metal pattern on the driving substrate is located within a projection of the third metal pattern on the driving substrate. 11.The display substrate of claim 6, wherein, The second electrode adopts a transparent conductive oxide. 12.The display substrate of claim 6, wherein, The pixel defining layer defines a plurality of opening regions, and the minimum width of the opening regions is not greater than 2 um. 13.The display substrate of claim 6, wherein, The height of the separation column is 0.5 um-3 um.

14. A display device comprising: The display substrate comprises any one of claims 6-13. The display substrate comprises any one of claims 6-13.

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