New energy automobile OBD interface communication detection system and method

Abstract

The invention relates to a new energy automobile OBD interface communication detection system and method. The system comprises a three-dimensional dynamic adaptation mechanism, a dual-mode communication module, a three-stage collaborative heat dissipation system and a composite safety protection unit. According to the mechanism, multi-vehicle-type inclination angle self-adaption is achieved through a five-gear positioning clamping groove and a Nitinol spring piece; the communication module is used for dynamically switching a J1939 / ISO15765-4 protocol on the basis of voltage triggering, and adopts 5G SA / LTE Cat.1 bis dual-mode transmission and AES (Advanced Encryption Standard); the safety protection realizes multi-stage protection through TVS surge suppression, PTC overcurrent isolation and Beidou RDSS emergency communication; the hybrid power supply adopts super capacitor-lithium thionyl chloride battery seamless switching; the multi-physical field life prediction model fuses electric contact, stress and thermal aging data, and life early warning is realized based on an XGBoost algorithm. The system is compatible with 12V / 24V vehicle models, and is suitable for intelligent diagnosis and safe data transmission of new energy vehicles.

Description

Technical Field

[0001] This invention belongs to the field of on-board diagnostics (OBD) technology for new energy vehicles, specifically involving an OBD interface communication detection device that integrates a three-dimensional dynamic adaptation mechanism, a multimodal communication architecture, a collaborative thermal management system, and multi-level safety protection, for real-time vehicle status monitoring, fault diagnosis, and secure data transmission. Background Technology

[0002] Taking the typical patent CN119126740A (Hybrid OBD Fault Diagnosis System) as an example, traditional OBD modules have the following technical defects:

[0003] 1. Poor mechanical compatibility: The fixed structure cannot adapt to the installation space limitations of different vehicle models, resulting in improper installation tilt angle and poor signal contact.

[0004] 2. Low communication efficiency: The single protocol stack is incompatible with passenger cars (12V system) and commercial vehicles (24V system), and lacks a dynamic encryption mechanism.

[0005] 3. Insufficient heat dissipation performance: The chip is prone to overheating under high temperature conditions, and the heat dissipation efficiency is significantly reduced in high-altitude and low-pressure environments.

[0006] 4. Weak security protection: lack of rapid response high-voltage isolation and emergency communication mechanisms, and fault diagnosis coverage is less than 80%.

[0007] The innovation of this invention lies in solving the above problems and improving compatibility, reliability and environmental adaptability by integrating a three-dimensional dynamic adaptation mechanism, a dual-mode communication protocol, a three-level collaborative heat dissipation, a composite power management system and a multi-physics lifetime prediction model. Summary of the Invention

[0008] (I) Overall Architecture

[0009] This system consists of the following core modules:

[0010] 1. Mechanical structure unit: Three-dimensional dynamic adaptation mechanism (connector base, main housing, five-position positioning slot, Nitinol spring sheet, ZrO2 ceramic ball).

[0011] 2. Communication Unit: Dual-mode transmission module (5G SA / LTE Cat.1bis), dynamic protocol stack, encryption engine.

[0012] 3. Thermal Management Unit: Three-level heat dissipation structure (chip-level heat dissipation, module-level heat conduction, and system-level biomimetic convection).

[0013] 4. Safety protection unit: TVS surge protection, PTC fuse, Beidou RDSS emergency communication, composite sealing protection.

[0014] 5. Diagnostic Unit: Fluxgate Current Sensor, NTC Temperature Array, Insulation Monitoring Module.

[0015] 6. Power Management Unit: Supercapacitor-lithium thionyl chloride composite power supply, dynamic switching algorithm. (II) Detailed Implementation

[0017] 1. Mechanical structure design

[0018] Innovation: The three-dimensional dynamic adaptation mechanism enables compatibility with multiple vehicle models.

[0019] 1) Connector base (101)

[0020] Dimensions: 35mm × 30mm × 15mm, material PA66-GF30 (UL94 V-0 flame retardant), surface CrN coating (3μm). Function: Mounted to the vehicle's OBD interface, providing mechanical support and a signal transmission channel.

[0021] 2) Main housing (102)

[0022] Dimensions: 45mm×35mm×20mm, with built-in communication module and protocol conversion board, and adopts 3D-MID technology to achieve 17° staggered three-dimensional wiring.

[0023] 3) Five-positioning slot (103)

[0024] With a step angle of 15° and a rotation range of 0-90°, it is suitable for the 32° tilt angle requirements of models such as the Toyota bZ4X.

[0025] 4) Nitinol spring sheet (104)

[0026] Material parameters: Af (austenite end temperature) = -50℃, vacuum solution treatment (780℃×1h + water quenching), elasticity fluctuation <5% from -40℃ to 125℃.

[0027] 5) ZrO2 ceramic ball bearings (105)

[0028] With a diameter of 2mm and a surface roughness Ra≤0.05μm, it achieves a wear of <0.15mm after 500,000 rotations when used with the card slot. Installation procedure: Insert the base vertically into the OBD interface, rotate the main housing to the appropriate angle (e.g., 45° for Toyota models), and keep the contact terminals vertically connected through mechanical decoupling to ensure stable signal transmission.

[0029] 2. Composite Communication Architecture

[0030] Innovation points: dynamic protocol switching and dual-mode transmission path.

[0031] 1) Protocol dynamic loading voltage detection: The AD7606 ADC module (sampling rate 200kSPS) monitors the input voltage ripple and triggers protocol switching (ISO15765-4 or J1939).

[0032] Physical layer feature analysis:

[0033] Baud rate auto-adaptation: Automatically scans 250k / 500k / 1Mbps rates via the STM32F407 CAN controller (compliant with ISO 11898-2).

[0034] Feature matching: After voltage triggering, a 50ms listening window is inserted to compare the protocol features of J1939 (PGN 0x00E0 test frame) with those of ISO15765-4 (SF_DL single frame identifier).

[0035] Dynamic decision tree:

[0036] 1. When the voltage is >20V, actively send J1939 TEST_PGN and monitor the ACK response.

[0037] 2. In case of no response, check the ISO-TP single-frame data header (priority: J1939 > ISO15765-4 > FailSafe).

[0038] 3. When the voltage is ≤20V, initiate a UDS$22 service request to verify the passenger vehicle protocol.

[0039] 2) Dual-mode transmission:

[0040] Emergency data (SOC < 20% or temperature > 60℃) is transmitted via 5G SA direct connection (Quectel RM500Q module) with latency < 50ms. Regular data is transmitted via LTE Cat.1bis (Fibocom L610 module) with bandwidth utilization < 10%.

[0041] 3) Enhanced security

[0042] a) HSM Protocol Library: Pre-set protocol signatures for the GD32F407 chip HSM module (occupied by 32KB Flash, including the J1939 reserved ID segment 0x0000-0x0FFF)

[0043] b) CAN Filter: Configure the SN65HVD257 transceiver with an ID whitelist to suppress non-standard frame interference.

[0044] c) Encryption Engine: The GD32F407 chip HSM module implements AES-256 packet-by-packet encryption, with the key updated every 30 seconds, conforming to the ISO 21434 standard.

[0045] d) Beidou RDSS module: integrates SIC9502 encryption chip, supports SM4 national cryptographic algorithm, and sends short messages containing GPS coordinates during emergency communication.

[0046] 3. Collaborative Thermal Management System

[0047] Innovation features: a three-stage heat dissipation mechanism and a biomimetic convection design.

[0048] 1) Chip-level heat dissipation: The GD32F407 main controller is connected to the heat sink via Sn96.5Ag3Cu0.5 solder (thermal resistance <0.15℃ / W).

[0049] 2) Module-level heat dissipation: adopts a layered thermal conductivity structure.

[0050] First layer: High thermal conductivity silicone pad (8W / m·K, 0.5mm thick, brand Bergers HF300), covering the chip surface;

[0051] Second layer: Pre-attached copper foil (0.1mm thickness, thermal conductivity 398W / m·K) to locally enhance thermal diffusion;

[0052] Third layer: 6063-T5 heatsink.

[0053] 3) System-level heat dissipation:

[0054] Bionic leaf vein-like heat dissipation holes create air convection (temperature drop of 12℃@1.2m) 3 / min).

[0055] In high-altitude mode, the Laird MS36TEC thermoelectric cooler (Qmax = 8W) is activated, increasing the temperature drop to 14℃@1.8m. 3 / min.

[0056] 4. Safety Protection Design

[0057] Innovation: Hardware-material co-design for multi-level protection (voltage / current / communication / mechanical).

[0058] 1) Voltage Sudden Change Detection

[0059] TVS array (401): Employs SMBJ58CA bidirectional TVS transistors, clamping voltage 64V@IPP = 6.5A, response time <

[0060] 5ns, conforming to ISO 7637-2 standard.

[0061] Triggering logic: When the input voltage is detected to be greater than 36V, the protection circuit is triggered by the comparator LM2903.

[0062] 2) Fault isolation

[0063] PTC fuse (402): Select Littelfuse 1812L series (rated current 1A, Vmax=60V), overcurrent 1.2A.

[0064] The resistance jump is greater than 10kΩ (response time < 10ms).

[0065] Isolation topology: Construct an H-bridge MOSFET array (IRF3205) to achieve physical isolation between the high-voltage circuit and the signal circuit (isolation withstand voltage > 1500V).

[0066] 3) Emergency Communication

[0067] Beidou RDSS module (404): integrates the Hexin Xingtong UM220-IV chip, sends 120-byte short messages (including 32-byte SM4 encrypted payload), and has a positioning accuracy of <15 meters (CEP).

[0068] Communication protocol: Compliant with JT / T 808-2019 standard, with communication intervals compressed to 30 seconds per message in emergency mode.

[0069] 4) Synergistic effect of dynamic sealing and buffer potting

[0070] a) Fluororubber dynamic sealing assembly

[0071] Material parameters: Fluororubber (FKM) material, X-shaped cross section, Shore hardness 75±5 (ASTM D2240 standard).

[0072] Functional adaptation: It rotates synchronously with the five-positioning slot (103) to ensure dynamic sealing between the main housing (102) and the connector base (101).

[0073] b) Layered potting process: Bottom layer potting: EE1011 epoxy resin (85% filler, thermal conductivity 1.5W / m·K), curing temperature 60℃×4h, forming a rigid thermally conductive layer that directly contacts the 6063-T5 heat sink of the thermal management unit.

[0074] Surface buffer layer: silicone gel (15% coverage, Shore hardness 00-30, elongation at break >400%), covering the surface of the epoxy resin layer to absorb high-frequency vibration energy (>200Hz).

[0075] 5. Power Management System

[0076] Innovation: Power supply using a supercapacitor-lithium thionyl chloride battery combination.

[0077] 1) Switching mechanism:

[0078] The supercapacitors (3 in parallel and 2 in series, operating voltage range 2.7-5.4V) respond to pulsed loads via the TPS63020 buck-boost circuit (input 1.8-5.5V, output 3.3V±1%).

[0079] The ER34615 lithium-ion battery (3.6V / 19Ah) is powered in a steady state by an LTC4412 ideal diode controller.

[0080] 2) Dynamic voltage compensation

[0081] a) Construct an adaptive buck-boost topology using the TITPS63020 chip:

[0082] Transient response during switching: Output voltage fluctuation <1% during load change (measured recovery time from 0.8V to 3.3V <50μs)

[0083] Efficiency Optimization: Burst Technology enables light-load efficiency >85%

[0084] b) Voltage monitoring: Real-time monitoring of bus voltage via INA226 chip (sampling rate 10kSPS)

[0085] 3) Lifetime management: The BQ27441 coulomb counter chip enables SOC estimation (error < 3%).

[0086] 4) Emergency battery life: The Beidou module is independently powered, with a battery life of >72h@-40℃.

[0087] 6. Multiphysics lifetime prediction model

[0088] Innovation points: Multi-sensor fusion and machine learning algorithms.

[0089] 1) Sensor array:

[0090] Four-wire Kelvin probe for monitoring contact resistance (accuracy ±1mΩ).

[0091] MEMS strain sensor (Tekscan A401) monitors stress cycles in Nitinol springs.

[0092] Monitoring the thermal aging of the potting layer using polyimide fiber Bragg gratings.

[0093] 2) Algorithm Model:

[0094] Lifespan Index Formula:

[0095] L=100-[0.5×(ΔR / R0)+0.3×(Δσ / σy)+0.2×(t / τT)]×K_age

[0096] In the formula:

[0097] WR = 0.5 (Contact resistance weight, based on IEC 60512-5-1 contact degradation model)

[0098] Wσ = 0.3 (stress weight, referring to the MIL-STD-810H mechanical fatigue coefficient)

[0099] WT = 0.2 (thermal aging weight, calculated based on the Arrhenius acceleration factor)

[0100] K_age = 1.2 (Environmental compensation coefficient, corrected to 1.5 for high-altitude conditions)

[0101] Data acquisition cycle: ΔR / Δσ updates every 10 seconds, t is the cumulative running time.

[0102] The XGBoost algorithm dynamically adjusts the weight parameters (WR / Wσ / WT with an adjustment step size of ±0.05), and offline training is performed every 15 minutes. Real-time prediction uses a sliding window mechanism (window width of 60 seconds and step size of 10 seconds). Attached Figure Description

[0103] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0104] Figure 1 This is an exploded view of the three-dimensional dynamic adaptation mechanism of the mechanical structure of this invention patent;

[0105] Figure 2 This is a flowchart of the decision tree for the dual-mode communication protocol of the composite communication architecture of this invention patent;

[0106] Figure 3 This is a cross-sectional view of the three-level collaborative heat dissipation structure of the collaborative thermal management system of this invention.

[0107] Figure 4 This is a composite security protection topology diagram of the present invention patent;

[0108] Figure 5 This is a diagram of the dynamic sealing and buffering potting structure of this invention patent;

[0109] Figure 6 This is a circuit schematic diagram of the power management system of this invention patent;

[0110] Figure 7 This is a diagram of the architecture of the multiphysics lifetime prediction model of this invention.

[0111] Figure 8 This is a timing diagram of the system's working state switching according to the present invention.

[0112] Figure 9 This is a schematic diagram of the installation angle adaptation and calibration of the present invention patent;

[0113] Figure 10 This is a layered diagram of the encrypted communication protocol stack of this invention patent;

[0114] Figure 11 This is a schematic diagram of the enhanced heat dissipation in the plateau mode of this invention. Detailed Implementation

[0115] The technical solutions of this invention patent will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this invention patent, and not all of them. Based on the embodiments of this invention patent, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this invention patent.

[0116] (I) Installation and Debugging

[0117] 1. Mechanical installation

[0118] Insert the base into the OBD interface and rotate the main housing to the appropriate angle (AS5600 magnetic encoder feedback accuracy ±0.5°).

[0119] The sealing ring compression is calibrated to 0.7±0.05mm (IP6K9K protection).

[0120] 2. Electrical Connections

[0121] Add a CMCC2012-900T common mode choke (insertion loss > 20dB @ 100MHz) to the CAN bus.

[0122] Power switching verification: LTC4412 controller + TPS63020 regulator, switching transient fluctuation <5%.

[0123] (II) Work Process

[0124] 1. Start-up Phase

[0125] a) The LM2596S-5.0 chip detects power characteristics and loads the corresponding protocol stack.

[0126] b) The core frequency of GD32F407 is reduced to 48MHz (CAN bus quiescent period).

[0127] 2. Operational Phase

[0128] a) Protocol handshake phase:

[0129] Upon power-up, a three-level protocol detection is performed: voltage threshold → baud rate matching → signature verification.

[0130] Decision tree timeout protection: Switch to redundant protocol stack if any stage times out by 300ms.

[0131] After successful matching, the protocol type is locked until power failure and reset.

[0132] b) Thermal management: Adjust fan speed according to air pressure sensor (high altitude mode PWM duty cycle > 75%).

[0133] c) Smooth voltage transition:

[0134] Battery switching is initiated when the supercapacitor discharges to the 3.0V threshold.

[0135] The TPS63020 maintains a 3.3V output until the LTC4412 completes the seamless switching.

[0136] Reverse isolation: The BAT54C Schottky diode prevents capacitor backflush (leakage current < 1μA).

[0137] d) Insulation monitoring: When the insulation resistance is <500Ω / V, the MOSFET array is triggered to disconnect the high voltage circuit (response <10μs).

[0138] 3. Troubleshooting

[0139] Lifetime parameters synchronized:

[0140] Four-wire Kelvin probe: Acquires ΔR every 10 seconds (resolution 1 μΩ)

[0141] MEMS strain sensor: reads stress peak every 5 seconds (trigger threshold > 10 με)

[0142] Fiber Bragg gratings: Continuous monitoring of temperature gradients (sampling rate 1Hz)

[0143] The BeiDou RDSS module sends encrypted short messages, and the T-Box pushes maintenance suggestions based on the Weibull model.

[0144] The specific embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A communication detection system for OBD interface of new energy vehicles, characterized in that, include: The three-dimensional dynamic adaptation mechanism includes a connector base (101), a main housing (102), a five-positioning slot (103), a Nitinol spring sheet (104), and a ZrO2 ceramic ball (105); The dual-mode communication protocol module supports dynamic protocol switching and 5G SA / LTE Cat.1bis dual-mode transmission, and includes an AD7606ADC module, an STM32F407CAN controller, and a dynamic decision tree protocol detection mechanism. The three-level collaborative heat dissipation system integrates a chip-level heat sink, a module-level silicone pad / copper foil / heat sink assembly, and a system-level biomimetic convection channel. The composite safety protection unit includes TVS surge protection (401), PTC fuse (402), Beidou RDSS emergency communication module (404), H-bridge MOSFET array and fluororubber dynamic sealing assembly; Supercapacitor-lithium thionyl cyanide hydrogen composite power management system, supporting seamless switching and dynamic voltage compensation in the event of load changes; A multiphysics lifetime prediction model is configured with a four-wire Kelvin probe, MEMS strain sensor and fiber optic grating array, and a graded early warning is achieved based on the XGBoost algorithm.

2. The system according to claim 1, characterized in that... The three-dimensional dynamic adaptation mechanism: The connector base (101) is made of PA66-GF30 flame retardant material, and the surface CrN coating is 3μm thick; The five-positioning slot (103) has a 15° step angle, which can accommodate a 32° installation tilt angle requirement; Nitinol spring sheet (104) undergoes vacuum solution treatment, resulting in elasticity fluctuation <5% (-40℃~125℃); The ZrO2 ceramic ball bearing (105) has a surface roughness Ra≤0.05μm and a rotational wear of <0.15mm (500,000 cycles test).

3. The system according to claim 1, characterized in that... The dual-mode communication protocol module: Voltage-triggered protocol switching (threshold 20V), supports J1939 and ISO15765-4 protocol signature matching; 5G SA direct connection for emergency data transmission (latency < 50ms), LTE Cat.1bis for regular data transmission (bandwidth utilization < 10%); It integrates AES-256 packet-by-packet encryption and SM4 national cryptographic algorithm for short message transmission.

4. The system according to claim 1, characterized in that... The three-level collaborative heat dissipation system: Chip-level heat sink has a thermal resistance of <0.15℃ / W, and module-level silicone pads (8W / m·K) are stacked with copper foil (398W / m·K). System-level biomimetic convection channel triggers phase change energy storage and semiconductor refrigeration chip, with a fan duty cycle of >75% in high-altitude mode.

5. The system according to claim 1, characterized in that... The composite security protection unit: TVS surge protection response time <5ns, PTC fuse overcurrent resistance jump >10kΩ; The Beidou RDSS module supports SM4 encrypted short messages (positioning accuracy <15 meters CEP) and communication interval ≤30 seconds.

6. The system according to claim 1, characterized in that... The multiphysics lifetime prediction model: Lifespan Index Formula: L=100-[0.5×(ΔR / R0)+0.3×(Δσ / σy)+0.2×(t / T)]×KageL=100-[0.5×(ΔR / R0)+0.3×(Δσ / σy)+0.2×(t / T)]×Kage The sliding window mechanism (60-second width, 10-second step) updates the prediction results. The graded warning threshold is >80% for normal and <60% for mandatory maintenance.

7. A communication detection method based on the system of any one of claims 1-6, characterized in that... include: 3D dynamic adaptation steps: Insert the base vertically into the OBD interface and rotate it to the target angle; Protocol dynamic handshake steps: Voltage detection → Baud rate matching → Feature code verification; Thermal management control steps: chip-level phase change energy storage → module-level thermal conduction → system-level biomimetic convection regulation; Safety protection steps: TVS transient suppression → PTC overcurrent isolation → Beidou emergency communication activation; Lifespan prediction steps: multi-sensor data fusion → XGBoost model training → graded early warning output.

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