Method for removing electronic component from substrate and method for manufacturing light emitting diode display

Abstract

The invention provides a method for removing an electronic component from a substrate and a method for manufacturing a light emitting diode display, in the method for removing the electronic component from the substrate, the electronic component is fixedly connected to the substrate through bonding force generated by solder, and the method comprises the following steps: applying energy to the electronic component, and applying an adhesive force to the electronic component to reduce the adhesive force generated by the solder, and applying an adhesive removal force to the electronic component, the adhesive removal force being sufficient to overcome the adhesive force generated by the solder after the energy is reduced, so that the electronic component can be removed from the substrate. According to the method for manufacturing the light-emitting diode display, the light-emitting diode chips on the substrate are repaired by using the method for removing the electronic components.

Description

Technical Field

[0001] This invention relates to a method for removing electronic components, and more particularly to a method for removing LED chips from a substrate by applying energy to desolder damaged or defective LED chips and applying adhesive pull-out force. Background Technology

[0002] Currently, light-emitting diodes (LEDs) are widely used due to their excellent light quality and high luminous efficiency. Generally, to achieve better color performance in displays using LEDs as light-emitting elements, existing technology utilizes a combination of red, green, and blue LED chips to create a full-color LED display. This full-color LED display uses the red, green, and blue light emitted by the LED chips, which are then mixed to form full-color light for displaying relevant image information. However, in existing technology, if an LED chip fixed on the circuit board is damaged, the damaged chip cannot be removed and repaired, significantly impacting the manufacturing yield and production capacity of LED displays. Summary of the Invention

[0003] Therefore, one of the objectives of this invention is to provide a method for removing a damaged or defective LED chip from a substrate by applying energy to perform a desoldering operation and applying an adhesive pull-out force, thereby solving the aforementioned problems.

[0004] According to one embodiment, the present invention provides a method for removing an electronic component from a substrate, wherein the electronic component is fixed to the substrate by an adhesive force generated by solder. The method includes applying energy to the electronic component to reduce the adhesive force generated by the solder, and applying an adhesive pull-out force to the electronic component. The adhesive pull-out force is sufficient to overcome the adhesive force generated by the solder after the energy reduction, thereby removing the electronic component from the substrate.

[0005] According to another embodiment, the method for manufacturing a light-emitting diode display of the present invention uses the above-described method to remove and repair the light-emitting diode chip on the substrate.

[0006] In summary, the present invention can remove damaged or defective LED chips from the substrate by applying energy to desolder them and applying adhesive pull-out force. This allows damaged or defective LED chips to be successfully removed and replaced by normal, intact LED chips, thus achieving a repair effect. This effectively solves the problem of not being able to remove and repair LED chips mentioned in the prior art, thereby greatly improving the process yield and production capacity of LED displays.

[0007] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings. Attached Figure Description

[0008] Figure 1 This is a cross-sectional schematic diagram of the alignment of a top abutment element with an electronic component according to an embodiment of the present invention.

[0009] Figure 2 for Figure 1 A cross-sectional schematic diagram of the top-pressure element pressing down on the flexible body to deform into contact with the electronic component.

[0010] Figure 3 for Figure 2 A cross-sectional schematic diagram showing the upward movement of the top element to release the flexible body, thereby removing the electronic component from the substrate via the flexible body.

[0011] Figure 4 This is a cross-sectional schematic diagram of an abutment element with adhesive material aligned with an electronic component according to another embodiment of the present invention.

[0012] The reference numerals in the attached figures are explained as follows:

[0013] 10: Electronic components

[0014] 11: Solder

[0015] 12: Substrate

[0016] 14: Top Support Component

[0017] 16: Flexible body

[0018] 17: Adhesive materials

[0019] A: Downward pressure direction

[0020] B: Upward direction

[0021] P: Top end Detailed Implementation

[0022] The following description, accompanied by illustrations, illustrates the technical content of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. In particular, the proportions and relative positions of the various elements in the drawings (such as the number and arrangement of electronic components, the structural presentation and proportional size of the top element and electronic components, etc.) are for illustrative purposes only and do not represent the actual implementation of the present invention.

[0023] Please see Figure 1 , Figure 2 as well as Figure 3 , Figures 1 to 3 This is a schematic cross-sectional view illustrating a method for removing electronic component 10 from substrate 12 according to an embodiment of the present invention. Figure 1 This is a cross-sectional schematic diagram of the abutting element 14 aligned with the electronic element 10 according to an embodiment of the present invention. Figure 2 for Figure 1 A cross-sectional view of the top abutment element 14 pressing down on the flexible body 16 to flexibly deform it until it contacts the electronic component 10. Figure 3 for Figure 2 A cross-sectional view showing the upward movement of the abutting element 14 to release the flexible body 16, thereby removing the electronic component 10 from the substrate 12 via the flexible body 16. The electronic component 10 is, for example, an LED chip (such as a red / green / blue LED chip, but not limited thereto; it can also be other electronic components that can be fixed on the substrate 12) and is fixed to the substrate 12 by the adhesive force generated by the solder 11. The substrate 12 is preferably a thin-film transistor (TFT). The Transistor (TFT) substrate is used for mounting electronic components (but is not limited to this; it can also be other substrates suitable for mounting electronic components, such as silicon substrates, circuit boards, etc.). The flexible body 16 can be any other flexible film known in the art that is resistant to laser beams so that it can be penetrated by the laser beam without being burned (e.g., silicone film, but is not limited to this). The abutting element 14 is, for example, a pin and is adapted to be driven by an actuation mechanism (such as a servo motor, voice coil motor, or stepper motor, etc.) to perform abutting action against the substrate 12. As for the description of the actuation control design for the actuation mechanism to drive the abutting element 14 to perform displacement actions such as alignment / pressing / moving, it is common in the prior art and will not be described in detail here.

[0024] First, by Figure 1It is understood that when an electronic component 10, which is fixed to the substrate 12 by solder, is damaged or defective, the abutment element 14 is first aligned with the damaged or defective electronic component 10. For example, an image sensor (such as a charge-coupled device (CCD)) can be used to obtain the position of the electronic component 10 on the substrate 12 to generate position information (e.g., coordinates). Then, the abutment element 14 is automatically controlled to move to the position aligned with the electronic component 10 based on the position information transmitted from the image sensor by the control unit (such as an industrial computer or a programmable logic controller (PLC)); or, an operator can manually move the abutment element 14 to align with the electronic component 10 based on the position information transmitted from the image sensor.

[0025] Next, as Figure 2 As shown, after the above alignment steps are completed, the abutting element 14 can be driven by the actuation mechanism to move toward the substrate 12 along the pressing direction A, so that the abutting element 14 contacts and presses down on the flexible body 16, causing it to flexurally deform until the flexible body 16 contacts the electronic component 10 fixed on the substrate 12, that is, the pressing stops and it no longer moves toward the substrate 12, but the flexible body 16 still maintains contact with the electronic component 10.

[0026] In the above process, energy can be applied to the electronic component 10 to reduce the adhesive force generated by the solder 11. According to one embodiment of this disclosure, the energy is the heat generated by a laser beam emitted by the laser generating module (such as an infrared laser beam, a visible laser beam, an ultraviolet laser beam, etc., but not limited to this, it can also be the energy generated by other types of beams, such as infrared beams). Specifically, the laser beam generation is sequentially applied to the electronic component 10 through the abutment element 14 and the flexible body 16 to provide heat to the solder 11, thereby reducing the adhesive force generated by the solder 11, and thus weakening the bonding force between the electronic component 10 and the substrate 12. Accordingly, the abutment element 14 is made of a material that allows the projected beam to pass through (such as quartz, sapphire, or diamond); or, the abutment element 14 is provided with a channel through which the laser beam can pass. In another embodiment, the laser beam generated by the laser generating module can apply heat energy to the electronic component 10 without passing through the abutment element 14. For example, the laser generating module can be positioned outside the longitudinal extension line of the abutment element 14 and applied to the electronic component 10 in an oblique manner (the laser beam has an angle of less than 90 degrees with the substrate 12). The laser generating module can be tilted to directly emit the laser beam, or the path of the laser beam can be changed by using a light guide to guide it to the electronic component 10.

[0027] It should be noted that the step of applying energy to electronic components to reduce the bonding force generated by solder is not limited to the above-mentioned method of projecting a laser through the top element 14 onto the electronic component 10. For example, in another embodiment, the laser generating module can also be disposed below the substrate 12, so that the laser beam is projected from below the substrate 12 to the soldering position of the electronic component 10 to perform the desoldering action.

[0028] In another embodiment of this disclosure, a heating module may be provided below the substrate 12 to provide heat energy, which penetrates the substrate 12 to heat the solder 11 and achieve the desoldering effect; or, the abutting element 14 may be provided with a heating module to provide heat energy to the electronic component 10 and conduct it to the solder 11 to achieve the desoldering effect.

[0029] In addition, the energy used in this invention to reduce solder adhesion can also be mechanical energy, which can physically break the bond between electronic components and solder (such as applying a scraping force to electronic components to generate kinetic energy to loosen the bond between electronic components and solder, but is not limited to this).

[0030] Finally, by Figure 3 It can be seen that after completing the above-mentioned step of applying energy to the electronic component 10 to reduce the adhesive force generated by the solder 11, an adhesive removal force can be applied to the electronic component 10 to overcome the adhesive force of the solder 11 after the energy reduction and remove the electronic component 10 from the substrate 12 for subsequent repair operations (e.g., using a pick-and-place module (such as a vacuum nozzle) to place another intact electronic component into the original position of the electronic component 10). More specifically, the above-mentioned adhesive removal force can be generated by coating the non-abutted side of the flexible body 16 with adhesive material 17. In this way, when the abutting element 14 is driven by the actuation mechanism to abut the flexible body 16 in the downward pressing direction A, it deforms and further makes the adhesive material 17 on the flexible body 16 come into contact with the electronic component 10 (e.g., ...). Figure 2 Afterwards (as shown), the abutting element 14 can be driven by the actuation mechanism to move away from the substrate 12 in the upward direction B, and no longer apply a resisting force to the flexible body 16. When the flexible body 16 returns to its original shape due to its material properties (i.e., its elastic properties), the adhesive material 17 generates an adhesive pull-out force on the electronic component 10 sufficient to overcome the adhesive force of the solder 11 after energy reduction, thereby removing the electronic component 10 from the substrate 12 (as shown). Figure 3 (As shown). According to the alternative embodiments of this disclosure, the adhesive pull-out force may be generated by utilizing the material properties of the flexible membrane 16, which can generate adhesiveness and elasticity after receiving heat energy.

[0031] In practical applications, it is preferable to apply energy to the electronic component 10 to reduce the adhesive force generated by the solder 11, and to use the step of pressing the component 14 against the flexible body 16 to deform it so that the adhesive material 17 contacts the electronic component 10 (e.g. Figure 2 (As shown) can be performed simultaneously, but is not limited thereto. For example, in another embodiment, the step of applying energy to desolder the electronic component 10 can also be performed before the contacting component 14 deforms against the flexible body 16 and before the adhesive material 17 comes into contact with the electronic component 10. That is, before the adhesive material 17 comes into contact with the electronic component 10, a laser beam generated by the laser generating module is directed at the electronic component 10, or heat energy is provided by the heating module to reduce the adhesive force generated by the solder 11, thereby achieving the purpose of desoldering. The foregoing methods are only illustrative of the embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art can adjust the timing of providing energy to desolder according to actual usage needs.

[0032] Furthermore, the method by which the present invention provides adhesive pull-out force is not limited to the above embodiments; the adhesive pull-out force can also be provided directly by the abutting element. For example, please refer to [link to relevant documentation]. Figure 4 This is a cross-sectional schematic diagram of abutting element 14 with adhesive material 17 aligned with electronic element 10 according to another embodiment of the present invention. The elements in this embodiment have the same reference numerals as those mentioned in the above embodiments, indicating that they have similar structures or functions; their related descriptions will not be repeated here. Figure 4 As shown, the adhesive pull-out force for removing the electronic component 10 from the substrate 12 can be directly generated by the abutting element 14. That is, in this embodiment, the flexible body 16 can be omitted, and the adhesive material 17 can be directly applied to the abutting end P of the abutting element 14. Therefore, when the electronic component fixed to the substrate 12 is damaged or defective (e.g., ...), the adhesive pull-out force can be directly generated by the abutting element 14. Figure 4 When the electronic component 10 is shown, an image sensing and recognition method can be used to align the abutment element 14 with the damaged or defective electronic component 10. Next, the abutment element 14 can be driven by an actuation mechanism to perform abutment action towards the substrate 12 until the adhesive material 17 of the abutment element 14 contacts the electronic component 10. During the above process, energy can be applied to the electronic component 10 to reduce the adhesive force generated by the solder 11. Finally, the abutment element 14 can be driven by the actuation mechanism to move away from the substrate 12 in the opposite direction of abutment, and at the same time, the adhesive material 17 generates an adhesive pull-out force on the electronic component 10 sufficient to overcome the adhesive force of the solder 11 after the energy reduction, thereby removing the electronic component 10 from the substrate 12 for subsequent repair. As for other designs for this embodiment (such as energy application method and application timing, etc.), their related descriptions can be deduced by analogy with the above embodiment, and will not be repeated here.

[0033] Another embodiment of this disclosure relates to a method for manufacturing a light-emitting diode (LED) display. This method utilizes the aforementioned method for removing electronic components from a substrate to remove and repair defective electronic components (i.e., LEDs; such as mini-LEDs and / or micro-LEDs) on the circuit board. The substrate 12 can then serve as the display substrate for the final product. By using the above method to remove and repair all damaged or defective LED chips, it can be ensured that all LED chips mounted on the substrate 12 can operate normally and constitute an LED display with image display functionality. Specifically, this invention can apply energy to desolder damaged or defective LED chips and apply adhesive pull-out force to remove the LED chips from the substrate. This allows damaged or defective LED chips to be smoothly removed and replaced by normal, intact LED chips, achieving a repair effect. This effectively solves the problem mentioned in the prior art of being unable to remove and repair LED chips, thereby greatly improving the process yield and production capacity of LED displays.

[0034] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should be included in the scope of the present invention.

Claims

1. A method for removing an electronic component from a substrate, wherein the electronic component is fixed to the substrate by an adhesive force generated by a solder, characterized in that, The method includes: Applying energy to the electronic component to reduce the bonding force generated by the solder; and An adhesive pull-out force is applied to the electronic component, the adhesive pull-out force being sufficient to overcome the adhesive force generated by the solder after the energy reduction, thereby removing the electronic component from the substrate.

2. The method as described in claim 1, characterized in that, The energy mentioned is thermal energy.

3. The method as described in claim 2, characterized in that, The heat energy is generated by a laser beam.

4. The method as described in claim 1, characterized in that, The adhesive pull-out force is abutted by a resisting element, wherein the unresisted side is coated with an adhesive material on a flexible body, causing the flexible body to deform and further bringing the adhesive material on the flexible body into contact with the electronic component, after which the flexible body is released, allowing the flexible body to return to its original shape.

5. The method as described in claim 4, characterized in that, The energy is applied to the electronic component through the abutment element.

6. The method as described in claim 4, characterized in that, The energy is applied to the electronic component at the same time that the abutting element deforms against the flexible body and before the adhesive material comes into contact with the electronic component.

7. The method as described in claim 4, characterized in that, The energy is applied to the electronic component when the abutting element abuts against the flexible body, causing deformation until the adhesive material contacts the electronic component.

8. The method as described in claim 1, characterized in that, The adhesive pull-out force is generated by a push-off element, one end of which is coated with an adhesive material. The adhesive pull-out force is generated by the push-off end pushing against the electronic component and then moving in the opposite direction of the push-off.

9. The method as described in claim 8, characterized in that, The energy is applied to the electronic component through the abutment element.

10. The method as described in claim 1, characterized in that, The electronic component is a light-emitting diode chip.

11. A method for manufacturing a light-emitting diode display, characterized in that, The light-emitting diode chip on the substrate is removed using the method described in claim 10.

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