Display unit, preparation method and display equipment

Abstract

The invention discloses a display unit, a preparation method and display equipment, and belongs to the technical field of display. The display unit comprises a light-emitting stacking unit and a light-emitting unit, wherein the light-emitting stacking unit comprises a plurality of Micro-LED units stacked in the first direction; the driving backboard is connected with the light-emitting stacking unit and drives the light-emitting stacking unit to emit light from the side away from the driving backboard, so that the light emitting direction of the light-emitting stacking unit is perpendicular to the first direction. According to the display unit, the Micro-LED units are stacked in the plane parallel to the driving back plate, the Micro-LED units are in a transverse stacking posture, light is emitted through the side away from the driving back plate, and side face light emitting is achieved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display unit, a manufacturing method and a display device. Background Art

[0002] Micro-LED (Micro Light Emitting Diode Display) has gained widespread attention in the large, medium, and small-sized display fields due to its excellent brightness, high luminous efficiency, low power consumption, high response speed, high contrast ratio, ultra-high resolution, and color saturation. In the display industry, the necessary prerequisite for achieving full-color display is the presence of RGB primary colors. Currently, there are three main types of Micro-LED displays that achieve full color:

[0003] (1) Full color is achieved by mass-transferring three colors of Micro-LED chips. The main difficulty of this approach lies in the mass transfer, which increases the difficulty and cost of the transfer.

[0004] (2) Micro-LED+QD scheme: This involves transferring a short-wavelength Micro-LED and inkjet printing over it, or using a QDCF (Quantum Dot Color Filter) scheme to achieve PL conversion. The short-wavelength Micro-LED can be a UV Micro-LED with RGB quantum dots as the QD material, or a blue Micro-LED with RG quantum dots as the QD material. Alternatively, Green and Blue Micro-LEDs can be transferred, and red quantum dots can be fabricated over another Blue Micro-LED to achieve full color. The disadvantages of this scheme are low conversion efficiency and the risk of light leakage.

[0005] (3) Stacked full-color Micro-LEDs are used. Unlike traditional Micro-LEDs, stacked Micro-LEDs are formed by vertically stacking three types of Micro-LEDs (R, G, and B) to create a full-color bare die. Full color can be achieved on a single Micro-LED by adjusting the current. This method can reduce the problem of mass transfer. However, due to this stacking method, the brightness and chromaticity of the red light at the bottom changes after passing through the epitaxial layers of green and blue light, resulting in colors that are different from those of traditional Micro-LEDs. At the same time, after stacking three epitaxial layers, the overall epitaxial layer thickness becomes about four times that of the original, which greatly increases the difficulty of the fabrication process, especially the photolithography, etching, and electrode fabrication processes. Summary of the Invention

[0006] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application proposes a display unit, a manufacturing method, and a display device, wherein light-emitting stacked units are horizontally stacked on a driving backplate, and light is emitted from the side away from the driving backplate to achieve side light emission.

[0007] In a first aspect, this application provides a display unit, including:

[0008] The light-emitting stacking unit includes multiple Micro-LED units stacked along a first direction;

[0009] A driving backplate is connected to the light-emitting stacking unit and drives the light-emitting stacking unit to emit light from the side away from the driving backplate, so that the light emission direction of the light-emitting stacking unit is perpendicular to the first direction.

[0010] According to the display unit of this application, the Micro-LED units are stacked in a horizontal stacking manner in a plane parallel to the driving backplate, and light is emitted from the side away from the driving backplate to achieve side light emission.

[0011] According to one embodiment of this application, the Micro-LED unit includes a first electrode structure, a light-emitting layer, and a second electrode structure stacked along a first direction.

[0012] According to one embodiment of this application, a bonding layer is provided between two adjacent Micro-LED units in the light-emitting stack unit.

[0013] According to one embodiment of this application, the second electrode structures of at least one pair of adjacent Micro-LED units in the light-emitting stack unit are arranged facing each other.

[0014] According to one embodiment of this application, the material of the bonding layer between two adjacent Micro-LED units arranged opposite to the second electrode structure is a conductive material, so that the two adjacent Micro-LED units share the second electrode structure.

[0015] According to one embodiment of this application, the Micro-LED unit further includes a first insulating layer located on both sides of the light-emitting layer along a second direction, the second direction being perpendicular to the first direction.

[0016] According to one embodiment of this application, in a light-emitting stacking unit, the first electrode structure and the second electrode structure of at least one pair of adjacent Micro-LED units are arranged facing each other, and the second electrode structure facing the first electrode structure is provided with a first insulating layer on the side near the driving backplate.

[0017] According to one embodiment of this application, both the first electrode structure and the second electrode structure include a contact electrode, a conductive electrode, and a light-reflecting layer, with the conductive electrode located on the side of the contact electrode away from the light-emitting layer.

[0018] In this design, the contact electrode is made of a transparent material, the conductive electrode is made of an opaque material, and a light-reflecting layer, also made of a conductive material, is located between the contact electrode and the conductive electrode; or...

[0019] Both the contact electrode and the conductive electrode are made of transparent material, and the light-reflecting layer is located on the side of the conductive electrode away from the contact electrode.

[0020] According to one embodiment of this application, the drive backplane includes:

[0021] Multiple driving electrodes, each driving electrode being connected to a corresponding Micro-LED unit;

[0022] A reflector is positioned between each driving electrode;

[0023] The second insulating layer is disposed on the side of the reflector facing the light-emitting stack unit and covers the reflector.

[0024] According to one embodiment of this application, the drive backplane further includes:

[0025] The driving common electrode is located outside the projection range of the light-emitting stack unit onto the driving back plate and extends toward the side where the light-emitting stack unit is located. The driving common electrode is used to form a connection with each Micro-LED unit.

[0026] According to one embodiment of this application, the display unit further includes:

[0027] The common electrode structure is located on the side of the light-emitting stack unit away from the driving backplate and is connected to each Micro-LED unit.

[0028] According to one embodiment of this application, the common electrode structure includes:

[0029] The third insulating layer is disposed on the side of the light-emitting stack unit away from the driving backplate. The third insulating layer has multiple openings that expose the second electrode structure in each Micro-LED unit.

[0030] A conductive layer is disposed within the opening and connected to the second electrode structure exposed in each opening;

[0031] A planarization layer is disposed on the side of the third insulating layer away from the light-emitting stacking unit and covers the opening.

[0032] According to one embodiment of this application, the common electrode structure includes:

[0033] The third insulating layer is disposed on the side of the light-emitting stack unit away from the driving backplate. The third insulating layer has an opening that exposes the second electrode structure in each Micro-LED unit.

[0034] A conductive layer is disposed on the side of the third insulating layer away from the light-emitting stack unit, and is connected to and from the second electrode structure in each Micro-LED unit through an opening;

[0035] A planarization layer is disposed on the side of the conductive layer away from the third insulating layer.

[0036] According to one embodiment of this application, the display unit further includes:

[0037] A lens unit is disposed on the side of the light-emitting stack unit away from the drive backplate to focus the light emitted by the light-emitting stack unit.

[0038] According to one embodiment of this application, the lens unit includes:

[0039] An optical diffusion layer is disposed on the side of the light-emitting stack unit away from the driving backplate;

[0040] A plano-convex lens is disposed on the side of the optical diffusion layer away from the light-emitting stack unit, with its planar side facing the light-emitting stack unit. The orthogonal projection of the plano-convex lens onto the drive backplate covers the orthogonal projection of the light-emitting layer in each Micro-LED unit onto the drive backplate.

[0041] According to one embodiment of this application, the lens unit includes:

[0042] Multiple plano-convex lenses are disposed on the side of the optical diffusion layer away from the light-emitting stack unit, with the planar side facing the light-emitting stack unit. Each plano-convex lens is arranged corresponding to each Micro-LED unit. The orthographic projection of the plano-convex lens on the driving back plate covers the orthographic projection of the light-emitting layer in the corresponding Micro-LED unit on the driving back plate.

[0043] According to one embodiment of this application, the light-emitting stack unit includes three stacked Micro-LED units with different light-emitting colors, namely red, green and blue.

[0044] According to one embodiment of this application, a metal enclosure is provided on the side of the driving backplate facing the light-emitting stacking unit, and the metal enclosure is arranged around the side of the light-emitting stacking unit adjacent to the side facing the driving backplate.

[0045] Secondly, this application provides a method for fabricating a display unit, comprising:

[0046] A light-emitting stacked unit is fabricated by stacking multiple Micro-LED units along a first direction;

[0047] The light-emitting stack unit is connected to the driving backplane, and the driving backplane drives the light-emitting stack unit to emit light from the side away from the driving backplane, so that the light emission direction of the light-emitting stack unit is perpendicular to the first direction.

[0048] According to the display unit fabrication method of this application, Micro-LED units are stacked in a horizontal stacking manner in a plane parallel to the driving backplate, and light is emitted through the side of the light-emitting stacked units to complete the display; thereby, the thickness of the display unit is reduced, the structure is simple, and the fabrication process is easier.

[0049] According to one embodiment of this application, a light-emitting stacked unit comprising multiple Micro-LED units stacked along a first direction is prepared, including:

[0050] A first light-emitting layer and a first electrode structure are formed on a first substrate;

[0051] A second light-emitting layer and a second electrode structure are formed on a second substrate;

[0052] The second electrode structure is bonded to the first electrode structure, and the second substrate is removed;

[0053] A third electrode structure is formed on the side of the second light-emitting layer away from the second electrode structure;

[0054] A third light-emitting layer and a fourth electrode structure are formed on a third substrate;

[0055] The fourth electrode structure and the third electrode structure are bonded together;

[0056] Remove the first substrate and form a fifth electrode structure on the side of the first light-emitting layer away from the first electrode structure;

[0057] The third substrate is removed, and a sixth electrode structure is formed on the side of the third light-emitting layer away from the fourth electrode structure.

[0058] According to one embodiment of this application, a first light-emitting layer and a first electrode structure are formed on a first substrate, including:

[0059] A first light-emitting layer is formed on a first substrate;

[0060] A first planarization layer is deposited on the side of the first substrate facing the first light-emitting layer, and the side of the first planarization layer away from the first substrate is flush with the side of the first light-emitting layer away from the first substrate.

[0061] A first contact electrode layer and a first conductive electrode layer are deposited on the side of the first planarization layer and the first light-emitting layer away from the first substrate;

[0062] The first contact electrode layer and the first conductive electrode layer are patterned to form a first electrode structure;

[0063] A second planarization layer is deposited on the side of the first planarization layer away from the first substrate, and the side of the second planarization layer away from the first substrate is flush with the side of the first electrode structure away from the first substrate.

[0064] A first bonding layer is formed on the side of the second planarization layer and the first electrode structure away from the first substrate.

[0065] According to one embodiment of this application, a second light-emitting layer and a second electrode structure are formed on a second substrate, including:

[0066] A second light-emitting layer, a second contact electrode layer, and a second conductive electrode layer are formed sequentially on a second substrate.

[0067] According to one embodiment of this application, after bonding the second electrode structure and the first electrode structure and removing the second substrate, the method further includes:

[0068] The second light-emitting layer, the second contact electrode layer, and the second conductive electrode layer are patterned.

[0069] A third planarization layer is deposited on the side of the first bonding layer away from the first substrate, and the side of the third planarization layer away from the first substrate is flush with the side of the second light-emitting layer away from the first substrate.

[0070] A third contact electrode layer and a third conductive electrode layer are deposited on the side of the third planarization layer and the second light-emitting layer away from the first substrate.

[0071] According to one embodiment of this application, after connecting the light-emitting stacked unit to the driving backplane, the method further includes:

[0072] A common electrode structure is formed on the side of the light-emitting stack unit away from the driving backplate, and the common electrode structure is connected to the second electrode structure in each Micro-LED unit.

[0073] According to one embodiment of this application, a common electrode structure is formed on the side of the light-emitting stacked unit away from the driving backplane, including:

[0074] A third insulating layer is formed on the side of the light-emitting stacked unit away from the driving backplane;

[0075] An opening is formed in the third insulating layer, exposing the second electrode structure in each Micro-LED unit;

[0076] A conductive layer is formed inside the opening, and the conductive layer is connected to each of the second electrode structures.

[0077] A fourth planarization layer is formed on the side of the third insulating layer away from the light-emitting stacking unit, and the fourth planarization layer covers the opening.

[0078] According to one embodiment of this application, the driving backplane further includes a driving common electrode, located outside the orthographic projection range of the light-emitting stacked unit on the driving backplane and extending toward the side where the light-emitting stacked unit is located, forming a common electrode structure on the side of the light-emitting stacked unit away from the driving backplane, including:

[0079] A fifth planarization layer is formed on the side of the driving backplate facing the light-emitting stacking unit. The fifth planarization layer is flush with the side of the driving backplate away from the light-emitting stacking unit away from the driving backplate and the side of the driving common electrode away from the driving backplate.

[0080] A third insulating layer is formed, which covers the fifth planarization layer, the light-emitting stacked unit, and the driving common electrode;

[0081] An opening is formed in the third insulating layer, exposing the second electrode structure and the driving common electrode in each Micro-LED unit;

[0082] A conductive layer is formed on the side of the third insulating layer away from the light-emitting stacking unit. The conductive layer is connected to each second electrode structure and the driving common electrode through an opening.

[0083] A sixth planarization layer is formed on the side of the conductive layer away from the third insulating layer.

[0084] According to one embodiment of this application, after forming a common electrode structure on the side of the light-emitting stack unit away from the driving backplane, the method further includes:

[0085] A lens unit is formed on the side of the common electrode structure away from the light-emitting stack unit.

[0086] According to one embodiment of this application, a lens unit is formed on the side of the common electrode structure away from the light-emitting stack unit, including:

[0087] An optical diffusion layer is formed on the side of the common electrode structure away from the light-emitting stack unit;

[0088] A plano-convex lens is placed on the side of the optical diffusion layer away from the common electrode structure. The plano-convex lens is arranged with its flat side facing the light-emitting stack unit. The orthogonal projection of the plano-convex lens onto the driving backplate covers the orthogonal projection of the light-emitting layer in each Micro-LED unit onto the driving backplate.

[0089] According to one embodiment of this application, a lens unit is formed on the side of the common electrode structure away from the light-emitting stack unit, including:

[0090] Multiple plano-convex lenses are arranged on the side of the common electrode structure away from the light-emitting stack unit. The planar side of each plano-convex lens faces the light-emitting stack unit. Each plano-convex lens is arranged corresponding to each Micro-LED unit. The orthographic projection of the plano-convex lens on the driving back plate covers the orthographic projection of the light-emitting layer in the corresponding Micro-LED unit on the driving back plate.

[0091] Thirdly, this application provides a display device, which includes the display unit according to the foregoing, or the display device includes the display unit prepared according to the foregoing preparation method.

[0092] The display device according to this application adopts a side-emitting display unit, which has a simpler structure and optimizes the manufacturing process.

[0093] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. Attached Figure Description

[0094] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0095] Figure 1 This is one of the structural schematic diagrams of the display unit provided in the embodiments of this application;

[0096] Figure 2 This is a second schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0097] Figure 3 This is one of the structural schematic diagrams of the light-emitting stacked unit provided in the embodiments of this application;

[0098] Figure 4 This is one of the schematic diagrams of the electrode structure provided in the embodiments of this application;

[0099] Figure 5 This is a second schematic diagram of the electrode structure provided in the embodiments of this application;

[0100] Figure 6 This is one of the structural schematic diagrams of the drive backplane provided in the embodiments of this application;

[0101] Figure 7 This is a second schematic diagram of the structure of the light-emitting stacked unit provided in the embodiments of this application;

[0102] Figure 8 This is the third schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0103] Figure 9 This is the fourth schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0104] Figure 10 This is a second schematic diagram of the drive backplane provided in the embodiments of this application;

[0105] Figure 11 This is the fifth schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0106] Figure 12 This is the sixth schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0107] Figure 13This is the seventh schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0108] Figure 14 This is the eighth schematic diagram of the structure of the display unit provided in the embodiments of this application;

[0109] Figure 15 This is a schematic flowchart of the method for fabricating a display unit provided in an embodiment of this application;

[0110] Figures 16-47 This is a schematic diagram of the structure of each stage in the preparation method provided in the embodiments of this application.

[0111] Figure label:

[0112] First substrate 000, third substrate 003, fourth substrate 004, first light-emitting layer 100, first conductive electrode 110, first contact electrode 111, second contact electrode 121, second conductive electrode 120, first insulating layer 130, first bonding layer 140, second light-emitting layer 200, third conductive electrode 220, third contact electrode 221, fourth contact electrode 211, fourth conductive electrode 210, second bonding layer 230, third light-emitting layer 300, fifth conductive electrode 320, fifth contact electrode 321, sixth contact electrode 311, sixth conductive electrode 310, driving backplate 400, driving electrode 410, driving common electrode 414, reflector 420, second insulating layer 421, third insulating layer 440, conductive layer 450, planarization layer 460, optical diffusion layer 500, plano-convex lens 600, conductive electrode n10, contact electrode n11, light reflection layer n12. DETAILED DESCRIPTION

[0113] The embodiments of this application are described in detail below, examples of which are illustrated in the accompanying drawings. In the drawings, for clarity, the dimensions of layers, regions, elements, and their relative dimensions may be exaggerated. The same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0114] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this disclosure.

[0115] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0116] Reference Figure 1 , Figure 2 and Figure 3 , Figure 1 The first type of display unit is shown. Figure 2 The second type of display unit is shown. Figure 3 The structure of a first type of light-emitting stacked unit is shown. One embodiment of this application proposes a display unit.

[0117] In this embodiment, the display unit includes a light-emitting stacking unit and a driving backplate 400. The light-emitting stacking unit includes a plurality of Micro-LED units stacked along a first direction. The driving backplate 400 is connected to the light-emitting stacking unit and drives the light-emitting stacking unit to emit light from the side away from the driving backplate, so that the light emission direction of the light-emitting stacking unit is perpendicular to the first direction.

[0118] The Micro-LED units in the light-emitting stacking unit are stacked along a direction parallel to the plane of the driving backplate 400. Figure 1In the diagram shown, the first direction is left-right. The light-emitting stacked units are located above the driving backplate 400, and their relative directions are perpendicular to the first direction. The light-emitting stacked units are horizontally stacked and emit light from the side away from the driving backplate 400, achieving side light emission.

[0119] In this embodiment, the multiple Micro-LED units stacked in the light-emitting stack unit can have multiple emission colors, thereby achieving full-color display. For example, the emission color of the Micro-LED unit can be red, green, or blue.

[0120] In some embodiments, the Micro-LED unit includes a first electrode structure, a light-emitting layer, and a second electrode structure stacked along a first direction.

[0121] As an example, the light-emitting stacked unit may include a stacked first Micro-LED unit, a second Micro-LED unit, and a third Micro-LED unit. The first Micro-LED unit emits red light, the second Micro-LED unit emits green light, and the third Micro-LED unit emits blue light.

[0122] In some embodiments, the electrode structure may include a contact electrode and a conductive electrode. The first electrode structure is used to receive current from the drive backplane 400, and the second electrode structure is used to discharge current.

[0123] As an example, such as Figure 3 The first Micro-LED unit may include a first conductive electrode 110, a first contact electrode 111, a first light-emitting layer 100, a second contact electrode 121, and a second conductive electrode 120 stacked together; the second Micro-LED unit may include a third conductive electrode 220, a third contact electrode 221, a second light-emitting layer 200, a fourth contact electrode 211, and a fourth conductive electrode 210 stacked together; the third Micro-LED unit may include a fifth conductive electrode 320, a fifth contact electrode 321, a third light-emitting layer 300, a sixth contact electrode 311, and a sixth conductive electrode 310 stacked together.

[0124] The first conductive electrode 110 and the first contact electrode 111 serve as the first electrode structure of the first Micro-LED unit, and the second contact electrode 121 and the second conductive electrode 120 serve as the second electrode structure of the first Micro-LED unit. The third conductive electrode 220 and the third contact electrode 221 serve as the second electrode structure of the second Micro-LED unit, and the fourth contact electrode 211 and the fourth conductive electrode 210 serve as the first electrode structure of the second Micro-LED unit. The fifth conductive electrode 320 and the fifth contact electrode 321 serve as the second electrode structure of the third Micro-LED unit, and the sixth contact electrode 311 and the sixth conductive electrode 310 serve as the first electrode structure of the third Micro-LED unit.

[0125] The materials of the first light-emitting layer 100, the second light-emitting layer 200, and the third light-emitting layer 300 can be GaN, InGaN, or AlGaInP, depending on their corresponding colors.

[0126] The materials of the first conductive electrode 110, the second conductive electrode 120, the third conductive electrode 220, the fourth conductive electrode 210, the fifth conductive electrode 320, and the sixth conductive electrode 310 can be metallic conductive materials or transparent conductive materials. The metallic conductive materials can be Au, Al, etc.; the transparent conductive materials can be ITO.

[0127] The materials of the first contact electrode 111, the second contact electrode 121, the third contact electrode 221, the fourth contact electrode 211, the fifth contact electrode 321, and the sixth contact electrode 311 are determined according to the type of semiconductor material they contact in the corresponding light-emitting layer. For example, if the contact electrode is in contact with an n-type semiconductor material, the work function of the contact electrode material is less than that of the metal material of the semiconductor layer it contacts, such as Cr, Ag, Al, etc.; if the contact electrode is in contact with a p-type semiconductor material, the work function of the contact electrode material is greater than that of the metal material of the semiconductor layer it contacts, such as Ni, Au, etc.

[0128] It should be noted that in this embodiment, the light emission direction of each Micro-LED unit is away from the driving backplate 400. The two electrode structures in the Micro-LED unit, which are arranged parallel to the driving backplate 400 and located on both sides of the light-emitting layer, can reflect the light emitted by the light-emitting layer and play a focusing role, which is beneficial to the side light emission of the Micro-LED unit.

[0129] Reference Figure 4 and Figure 5 , Figure 4 The cross-sectional structure of the first electrode structure is shown. Figure 5A cross-sectional structure of the second electrode structure is shown. In one embodiment, both the first and second electrode structures include a conductive electrode n10, a contact electrode n11, and a light-reflecting layer n12, with the conductive electrode n10 located on the side of the contact electrode n11 away from the light-emitting layer.

[0130] like Figure 4 As shown, the light-reflecting layer n12 is located between the contact electrode n11 and the conductive electrode n10. In this structure, the contact electrode n11 can be made of a transparent material, the conductive electrode n10 can be made of an opaque material, and the light-reflecting layer n12 can be made of a conductive material, such as a metal. The metal material can both reflect light and facilitate electrical conduction between the contact electrode and the conductive electrode. Light emitted from the light-emitting layer in the first direction passes through the contact electrode n11 and is reflected by the light-reflecting layer n12.

[0131] Or such as Figure 5 As shown, the light-reflecting layer n12 is located on the side of the conductive electrode n10 away from the contact electrode n11. In this structure, both the contact electrode n11 and the conductive electrode n10 can be made of transparent materials, and the light-reflecting layer n12 can be made of metallic or non-metallic materials, etc. Light emitted by the light-emitting layer in the first direction passes through the contact electrode n11 and the conductive electrode n10 in sequence, and is reflected by the light-reflecting layer n12.

[0132] In this embodiment, by adding a light-reflecting layer n12 to the electrode structure, the light emitted by the light-emitting layer in the direction parallel to the driving back plate 400 is reflected to the side of the light-emitting layer away from the driving back plate 400, which is beneficial for side light emission.

[0133] In some embodiments, a bonding layer is provided between two adjacent Micro-LED units in the light-emitting stack unit.

[0134] As an example, a first bonding layer 140 is provided between the second conductive electrode 120 in the first Micro-LED unit and the third conductive electrode 220 in the second Micro-LED unit, and a second bonding layer 230 is provided between the fourth conductive electrode 210 in the second Micro-LED unit and the fifth conductive electrode 320 in the third Micro-LED unit.

[0135] In this embodiment, the Micro-LED units are connected by bonding to achieve stacking.

[0136] In some embodiments, the second electrode structures of at least one pair of adjacent Micro-LED cells in the light-emitting stack are arranged facing each other.

[0137] The driving backplate 400 is provided with driving electrodes 410, each driving electrode 410 being connected to a corresponding second electrode structure in each Micro-LED unit. An insulating structure is provided between each driving electrode 410 to prevent short circuits caused by contact between the second electrode structure and the current-providing electrode portion on the driving backplate 400. By arranging the second electrode structures of two adjacent Micro-LED units facing each other, these two second electrode structures can share a single insulating structure, facilitating the fabrication of the driving backplate 400.

[0138] As an example, the second contact electrode 121 and the second conductive electrode 120 serve as the second electrode structure of the first Micro-LED unit, and the third conductive electrode 220 and the third contact electrode 221 serve as the second electrode structure of the second Micro-LED unit. The second conductive electrode 120 is used to conduct current from the first Micro-LED unit, and the third conductive electrode 220 is used to conduct current from the second Micro-LED unit.

[0139] like Figure 1 and Figure 2 As shown, the second conductive electrode 120 and the third conductive electrode 220 are isolated from the drive backplate 400 by a continuous insulating portion, which includes a reflector 420 and a second insulating layer 421.

[0140] In some embodiments, the material of the bonding layer between two adjacent Micro-LED units arranged together by the second electrode structure is a conductive material, so that the two adjacent Micro-LED units share the second electrode structure.

[0141] In some embodiments, the Micro-LED unit further includes a first insulating layer 130, which is located on both sides of the light-emitting layer along a second direction, the second direction being perpendicular to the first direction.

[0142] As an example, refer to Figure 3 The first light-emitting layer 100, the second light-emitting layer 200 and the third light-emitting layer 300 are provided with a first insulating layer 130 on both sides.

[0143] In this embodiment, the sides of the light-emitting layer are protected by a first insulating layer 130 to prevent damage to the light-emitting layer. The material of the first insulating layer 130 can be an inorganic material, including but not limited to SiOx / SiNx / AlOx; it can also be an organic material, such as PVA (polyvinyl alcohol).

[0144] In some embodiments, the first electrode structure and the second electrode structure of at least one pair of adjacent Micro-LED units in the light-emitting stack unit are arranged facing each other, and the second electrode structure facing the first electrode structure is provided with a first insulating layer 130 on the side near the driving backplate 400.

[0145] It is understandable that the first electrode structure receives current from the drive back plate 400. By providing the first insulating layer 130 on the side of the second electrode structure near the drive back plate 400, the contact between the second electrode structure and the electrode portion on the drive back plate 400 that provides current can be avoided.

[0146] As an example, the fourth contact electrode 211 and the fourth conductive electrode 210 serve as the first electrode structure of the second Micro-LED unit, and the fifth conductive electrode 320 and the fifth contact electrode 321 serve as the second electrode structure of the third Micro-LED unit. The fifth conductive electrode 320 has a first insulating layer 130 on the side near the driving backplate 400. The fifth conductive electrode 320, the fifth contact electrode 321, and the first insulating layer 130 on the side of the third light-emitting layer 300 near the driving backplate 400 in the third Micro-LED unit are integrated, which can prevent the fifth conductive electrode 320 and the fifth contact electrode 321 from contacting the driving electrode 410 on the driving backplate 400.

[0147] Reference Figure 6 , Figure 6 The structure of a first type of driving backplane 400 is shown. The driving backplane 400 can be a TFT / CMOS backplane or a PM backplane. The driving backplane 400 has a plurality of driving electrodes 410 on the side facing the light-emitting stacked unit. The driving electrodes 410 can output current.

[0148] In some embodiments, each driving electrode 410 is connected to a corresponding Micro-LED unit, and the Micro-LED units do not share a driving electrode 410. This allows each driving electrode 410 to be driven independently, facilitating the configuration of the light-emitting strategy. An insulating structure can be provided between each driving electrode 410 to prevent short circuits between them.

[0149] As an example, the insulating structure may include a reflector 420 and a second insulating layer 421. The reflector 420 is disposed between each driving electrode 410; the second insulating layer 421 is disposed on the side of the reflector 420 facing the light-emitting stack unit and covers the reflector 420.

[0150] In this example, the orthographic projection of each light-emitting layer in the light-emitting stack unit onto the driving backplane 400 lies within the orthographic projection of the reflector 420 onto the driving backplane 400. The reflector 420 can reflect the light emitted by the light-emitting layers in a direction away from the driving backplane 400, thereby increasing the light output of the light-emitting stack unit. The second insulating layer 421 can form electrical isolation between each driving electrode 410 to prevent short circuits.

[0151] Continue to refer to Figure 1 and Figure 2In some embodiments, the display unit further includes a common electrode structure disposed on the side of the light-emitting stack unit away from the driving backplate 400 and connected to the second electrode structure in each Micro-LED unit.

[0152] The common electrode structure is used to draw out the current of each Micro-LED unit in the light-emitting stack unit, so that each Micro-LED unit forms a current loop and emits light under the drive of the current.

[0153] As an example, in some embodiments, the common electrode structure includes a third insulating layer 440, a conductive layer 450, and a planarization layer 460. The third insulating layer 440 is disposed on the side of the light-emitting stack unit away from the driving backplane 400. The third insulating layer 440 has multiple openings that expose the second electrode structure in each Micro-LED unit. The conductive layer 450 is disposed within the openings and connected to the exposed second electrode structure of each opening. The planarization layer 460 is disposed on the side of the third insulating layer 440 away from the light-emitting stack unit and covers the openings.

[0154] The third insulating layer 440 can cover the contact electrodes in each Micro-LED unit, so that the opening only exposes the conductive electrodes. For example, the opening can expose the second conductive electrode 120, the third conductive electrode 220, and the fifth conductive electrode 320. The conductive layer 450 is disposed within the opening and contacts the second conductive electrode 120, the third conductive electrode 220, and the fifth conductive electrode 320. The surface of the conductive layer 450 away from the light-emitting stack unit can be flush with the surface of the third insulating layer 440 away from the light-emitting stack unit. The planarization layer 460 serves as insulation and isolation, protecting the conductive layer 450.

[0155] In some embodiments, the display unit further includes a lens unit disposed on the side of the light-emitting stack unit away from the driving backplate 400, so as to focus the light emitted by the light-emitting stack unit.

[0156] In this embodiment, the light emitted by the light-emitting stack unit is emitted from the side away from the driving backplate 400 to achieve side light emission. The lens unit focuses the light, confining the emitted light to a range directly opposite the light-emitting stack unit along the direction away from the driving backplate 400.

[0157] Reference Figure 7 , Figure 7 The structure of the second type of light-emitting stacked unit is shown. For example... Figure 7 As shown, the material of the first bonding layer 140 between the second conductive electrode 120 and the third conductive electrode 220 is a conductive material, or the material of the first bonding layer 140 is a metallic material. After the second conductive electrode 120 and the third conductive electrode 220 are bonded, they form an electrical connection with each other, thereby the second conductive electrode 120 and the third conductive electrode 220 have the same electrical properties.

[0158] Reference Figure 8 and Figure 9 , Figure 8 A third type of display unit is shown. Figure 9 The fourth type of display unit is shown. For example... Figure 7 and Figure 8 As shown, after the second conductive electrode 120 and the third conductive electrode 220 are bonded, they can share a single contact point to connect with the conductive layer 450. This simplifies the display unit.

[0159] Reference Figure 10 , Figure 10 The structure of a second type of driving backplate 400 is shown. In some embodiments, the driving backplate 400 further includes a driving common electrode 414, which is located outside the orthographic projection range of the light-emitting stack unit on the driving backplate 400 and extends toward the side where the light-emitting stack unit is located. The driving common electrode 414 is used to connect the second electrode structure in each Micro-LED unit.

[0160] The driving common electrode 414 extends to the side of the light-emitting stack unit away from the driving back plate 400, and is connected to the second electrode structure in each Micro-LED unit through a conductive structure disposed on the side of the light-emitting stack unit away from the driving back plate 400, so as to receive the current flowing out from the light-emitting stack unit.

[0161] Reference Figure 11 and Figure 12 , Figure 11 The fifth type of display unit is shown. Figure 12 A sixth type of display unit is shown. In some embodiments, the common electrode structure includes a third insulating layer 440, a conductive layer 450, and a planarization layer 460. The third insulating layer 440 is disposed on the side of the light-emitting stack unit away from the driving backplate 400, and the third insulating layer 440 has an opening that exposes the second electrode structure in each Micro-LED unit. The conductive layer 450 is disposed on the side of the third insulating layer 440 away from the light-emitting stack unit, and is connected to and connected to the second electrode structure in each Micro-LED unit through the opening. The planarization layer 460 is disposed on the side of the conductive layer 450 away from the third insulating layer.

[0162] The third insulating layer 440 can cover the contact electrodes in each Micro-LED unit, so that the opening only exposes the conductive electrodes. For example, the opening can expose the second conductive electrode 120, the third conductive electrode 220, and the fifth conductive electrode 320.

[0163] The conductive layer 450 covers the side of the third insulating layer 440 away from the light-emitting stack unit, and simultaneously contacts the driving common electrode 414 and the second conductive electrode 120, the third conductive electrode 220, and the fifth conductive electrode 320 within the opening. The circuitry flowing out of each Micro-LED unit is transmitted from the conductive electrode through the conductive layer 450 to the driving common electrode 414.

[0164] The planarization layer 460 covers the side of the conductive layer 450 away from the third insulating layer 440, serving as insulation and isolation to protect the conductive layer 450.

[0165] Reference Figure 13 and Figure 14 , Figure 13 The seventh type of display unit is shown. Figure 14 A seventh type of display unit is shown. In some embodiments, a metal enclosure 700 is provided on the side of the drive back plate 400 facing the light-emitting stacking unit, and the metal enclosure 700 is arranged around the side of the light-emitting stacking unit adjacent to the side facing the drive back plate 400.

[0166] like Figure 14 As shown, as an example, multiple light-emitting stacked units can be arranged on the drive backplane 400, and each light-emitting stacked unit is surrounded by a metal enclosure 700. The metal enclosure 700 can reflect the light emitted by the light-emitting stacked units in all directions, thus serving as a light-focusing function.

[0167] As an example, the electrode structures in each Micro-LED unit of the light-emitting stack are made of transparent material, resulting in a relatively small light-focusing effect. In this case, the light-focusing effect of the metal enclosure 700 effectively improves the side light emission effect of the display unit.

[0168] Continue to refer to Figure 1 In some embodiments, the lens unit includes an optical diffusion layer 500 and a plano-convex lens 600. The optical diffusion layer 500 is disposed on the side of the light-emitting stack unit away from the driving backplate 400. The plano-convex lens 600 is disposed on the side of the optical diffusion layer 500 away from the light-emitting stack unit, and its planar side is arranged facing the light-emitting stack unit. The orthographic projection of the plano-convex lens 600 on the driving backplate 400 covers the orthographic projection of the light-emitting layer in each Micro-LED unit on the driving backplate 400.

[0169] In this embodiment, each Micro-LED unit shares a lens unit consisting of an optical diffusion layer 500 and a plano-convex lens 600. The light emitted by each Micro-LED unit can be diffused more uniformly across the entire side of the light-emitting stack unit.

[0170] Continue to refer to Figure 2In some embodiments, the lens unit includes a plurality of plano-convex lenses 600. The plano-convex lenses 600 are disposed on the side of the optical diffusion layer away from the light-emitting stack unit, and the planar side faces the light-emitting stack unit. Each plano-convex lens 600 is arranged corresponding to each Micro-LED unit. The orthographic projection of the plano-convex lens 600 on the driving back plate 400 covers the orthographic projection of the light-emitting layer in the corresponding Micro-LED unit on the driving back plate 400.

[0171] In this embodiment, each Micro-LED unit uses a separate plano-convex lens 600 for light focusing, thereby improving color resolution. Figure 2 The lens unit structure shown can be applied to micro-displays. Figure 1 The lens unit structure shown can be applied to large, medium and small direct-view displays.

[0172] Reference Figure 15 , Figure 15 A flowchart of a method for fabricating a display unit is shown. One embodiment of this application also proposes a method for fabricating a display unit. In this embodiment, the method for fabricating the display unit includes steps 10 and 20.

[0173] Step 10: Prepare a light-emitting stacked unit consisting of multiple Micro-LED units stacked along the first direction;

[0174] Step 20: Connect the light-emitting stack unit to the driving backplate 400. The driving backplate 400 drives the light-emitting stack unit to emit light from the side away from the driving backplate, so that the light emission direction of the light-emitting stack unit is perpendicular to the first direction.

[0175] The specific structure of the display unit fabricated by the method proposed in this embodiment can be referred to the foregoing embodiments. Each Micro-LED unit in the light-emitting stack unit is stacked along a direction parallel to the plane of the driving backplate 400. The light-emitting stack unit is located above the driving backplate 400, and the direction in which they face each other is perpendicular to the first direction. The light-emitting stack unit is horizontally stacked and emits light from the side away from the driving backplate 400; moreover, the structure is simple and the fabrication process is easier.

[0176] In some embodiments, the specific process of step 10 for preparing a stacked light-emitting unit of multiple Micro-LED units stacked along a first direction may include: forming a first light-emitting layer 100 and a first electrode structure stacked on a first substrate; forming a second light-emitting layer 200 and a second electrode structure stacked on a second substrate; bonding the second electrode structure and the first electrode structure and removing the second substrate; forming a third electrode structure on the side of the second light-emitting layer 200 away from the second electrode structure; forming a third light-emitting layer 300 and a fourth electrode structure stacked on a third substrate; bonding the fourth electrode structure and the third electrode structure; removing the first substrate and forming a fifth electrode structure on the side of the first light-emitting layer away from the first electrode structure; removing the third substrate and forming a sixth electrode structure on the side of the third light-emitting layer 300 away from the fourth electrode structure; wherein the electrode structure includes a stacked contact electrode and a conductive electrode.

[0177] In this embodiment, each light-emitting layer and electrode structure is formed separately and stacked by bonding. The structure of the Micro-LED unit is completed during the stacking process, making the process simple.

[0178] As an example, the specific process for forming the stacked first light-emitting layer 100 and the first electrode structure on the first substrate is as follows:

[0179] Reference Figure 16 An epitaxial layer is grown on a first substrate 000, which forms the first light-emitting layer 100. The material of the first substrate 000 can be Si, sapphire, gallium arsenide, gallium nitride, etc. The material of the epitaxial layer can be GaN, InGaN, or AlGaInP, depending on the desired emission color.

[0180] Reference Figure 17 The epitaxial layer is etched to form the first light-emitting layer 100.

[0181] Reference Figure 18 A first planarization layer is deposited, which is used to form an insulating layer 130. The side of the first planarization layer away from the first substrate 000 is flush with the side of the first light-emitting layer 100 away from the first substrate 000 to facilitate the formation of subsequent film layers. The material of the first planarization layer can be an inorganic material, including but not limited to SiOx / SiNx / AlOx; it can also be an organic material, such as PVA (polyvinyl alcohol).

[0182] Reference Figure 19A first contact electrode layer and a first conductive electrode layer are deposited on the side of the first planarization layer and the first light-emitting layer 100 away from the first substrate 000. The first contact electrode layer is used to form the second contact electrode 121 in the aforementioned embodiment, and the first conductive electrode layer is used to form the second conductive electrode 120 in the aforementioned embodiment. The material of the second contact electrode 121 is determined according to the type of semiconductor material it contacts in the first light-emitting layer 100. For example, if the contact electrode contacts an n-type semiconductor material, the work function of the contact electrode material is less than that of the metal material of the semiconductor layer it contacts, such as Cr, Ag, Al, etc.; if the contact electrode contacts a p-type semiconductor material, the work function of the contact electrode material is greater than that of the metal material of the semiconductor layer it contacts, such as Ni, Au, etc. The material of the second conductive electrode 120 can be a metallic conductive material or a transparent conductive material. Among them, the metallic conductive material can be Au, Al, etc.; the transparent conductive material can be ITO.

[0183] Reference Figure 20 The first contact electrode layer and the first conductive electrode layer are patterned to form a second contact electrode 121 and a second conductive electrode 120. The second contact electrode 121 and the second conductive electrode 120 constitute the first electrode structure in this embodiment.

[0184] The cross-sectional width of the second contact electrode 121 is equal to the cross-sectional width of the second conductive electrode 120, and both are greater than the cross-sectional width of the first light-emitting layer 100. The orthogonal projection of the first light-emitting layer 100 on the first substrate 000 lies within the orthogonal projection of the second contact electrode 121 and the second conductive electrode 120 on the first substrate 000.

[0185] Reference Figure 21 A second planarization layer is deposited on the side of the first planarization layer away from the first substrate 000. This second planarization layer is also used to form the insulating layer 130. The side of the second planarization layer away from the substrate 00 is flush with the side of the first electrode structure away from the first substrate 000, which facilitates the formation of subsequent film layers.

[0186] Reference Figure 22 A first bonding layer 140 is formed on the side of the second planarization layer and the first electrode structure away from the first substrate 000. This first bonding layer 140 is used to connect another Micro-LED unit.

[0187] In some embodiments, forming a second light-emitting layer 200 and a second electrode structure stacked on a second substrate includes forming a second light-emitting layer 200, a second contact electrode layer and a second conductive electrode layer stacked sequentially on a second substrate.

[0188] The second contact electrode layer is used to form the third contact electrode 221 in the aforementioned embodiment, and the second conductive electrode layer is used to form the third conductive electrode 220 in the aforementioned embodiment. The third contact electrode 221 and the third conductive electrode 220 constitute the second electrode structure in this embodiment.

[0189] Reference Figure 23 The third conductive electrode 220 is bonded to the second conductive electrode 120 through the first bonding layer 140. At the same time, the second substrate (not shown in the figure) on the side of the second light-emitting layer 200 away from the second contact electrode layer is removed.

[0190] In some embodiments, after bonding the second electrode structure and the first electrode structure and removing the second substrate, the method further includes: patterning the second light-emitting layer 200, the second contact electrode layer, and the second conductive electrode layer; depositing a third planarization layer on the side of the first bonding layer 140 away from the first substrate 000, wherein the side of the third planarization layer away from the first substrate 000 is flush with the side of the second light-emitting layer 200 away from the first substrate; and depositing a third contact electrode layer and a third conductive electrode layer on the third planarization layer and the side of the second light-emitting layer 200 away from the first substrate 00.

[0191] Reference Figure 24 The second light-emitting layer 200 is etched to remove part of the second light-emitting layer 200, while retaining the portion above the first light-emitting layer 100.

[0192] Reference Figure 25 The second contact electrode layer and the second conductive electrode layer are etched, leaving the portion above the first light-emitting layer 100, to form the third contact electrode 221 and the third conductive electrode 220. The cross-sectional width of the third contact electrode 221 and the cross-sectional width of the third conductive electrode 220 are equal, and both are greater than the cross-sectional width of the second light-emitting layer 200. The orthogonal projection of the second light-emitting layer 200 on the first substrate 000 lies within the orthogonal projection of the third contact electrode 221 and the third conductive electrode 220 on the first substrate 000.

[0193] Reference Figure 26 A third planarization layer is deposited, which is also used to form the first insulating layer 130.

[0194] Reference Figure 27 A third contact electrode layer and a third conductive electrode layer are deposited. The third contact electrode layer is used to form a fourth contact electrode 211, and the third conductive electrode layer is used to form a fourth conductive electrode 210. Their materials can be selected with reference to the aforementioned materials for the contact electrodes and conductive electrodes. The fourth contact electrode 211 and the fourth conductive electrode 210 constitute the third electrode structure in this embodiment.

[0195] Reference Figure 28An epitaxial layer is grown on a third substrate 003, which is used to form a third light-emitting layer 300. The materials of the third substrate 003 and the epitaxial layer can be referred to the foregoing selection of materials for the substrate and the epitaxial layer.

[0196] Reference Figure 29 The epitaxial layer is etched to form the third light-emitting layer 300.

[0197] Reference Figure 30 A planarization layer is deposited, which is used to form the insulating layer 130. The side of the planarization layer away from the first substrate 003 is flush with the side of the third light-emitting layer 300 away from the third substrate 003 to facilitate the formation of subsequent film layers. The material of the planarization layer can be an inorganic material, including but not limited to SiOx / SiNx / AlOx; it can also be an organic material, such as PVA (polyvinyl alcohol).

[0198] Reference Figure 31 A fourth contact electrode layer and a fourth conductive electrode layer are deposited on the side of the planarization layer and the third light-emitting layer 300 away from the third substrate 003. The fourth contact electrode layer is used to form the fifth contact electrode 321 in the aforementioned embodiment, and the fourth conductive electrode layer is used to form the fifth conductive electrode 320 in the aforementioned embodiment. The materials can be selected with reference to the materials of the aforementioned contact electrodes and conductive electrodes.

[0199] Reference Figure 32 The fourth contact electrode layer and the fourth conductive electrode layer are patterned to form the fifth contact electrode 321 and the fifth conductive electrode 320. The fifth contact electrode 321 and the fifth conductive electrode 320 constitute the fourth electrode structure in this embodiment.

[0200] In this embodiment, the cross-sectional width of the fifth contact electrode 321 and the cross-sectional width of the fifth conductive electrode 320 are equal, and both are larger than the cross-sectional width of the third light-emitting layer 300. The orthogonal projection of the third light-emitting layer 300 onto the third substrate 003 lies within the orthogonal projections of the fifth contact electrode 321 and the fifth conductive electrode 320 onto the third substrate 003. In the second direction, one side of the fifth contact electrode 321 and the fifth conductive electrode 320 are aligned.

[0201] Reference Figure 33 A planarization layer is deposited, which also serves to form the first insulating layer 130. The side of the planarization layer away from the third substrate 003 is flush with the side of the fifth contact electrode 321 and the fifth conductive electrode 320 away from the third substrate 003.

[0202] Reference Figure 34 The fifth conductive electrode 320 is bonded to the fourth conductive electrode 210 through the second bonding layer 240. This achieves the stacking of the basic structure of three Micro-LED units.

[0203] Reference Figure 35 Remove the first substrate 000 to facilitate the formation of the electrode structure on the other side of the first light-emitting layer 100.

[0204] Reference Figure 36 A fifth contact electrode layer, a fifth conductive electrode layer, and a fourth substrate 004 are formed on the side of the first light-emitting layer 100 away from the second contact electrode 121. The fifth contact electrode layer is used to form the first contact electrode 111 in the aforementioned embodiment, and the fifth conductive electrode layer is used to form the first conductive electrode 110 in the aforementioned embodiment. The first contact electrode 111 and the first conductive electrode 110 constitute the fifth electrode structure in this embodiment. Their materials can be selected with reference to the materials of the aforementioned contact electrodes and conductive electrodes.

[0205] Reference Figure 37 The third substrate 003 is removed, and a sixth contact electrode layer and a sixth conductive electrode layer are formed on the side of the third light-emitting layer 300 away from the fifth conductive electrode 320. The sixth contact electrode layer is used to form the sixth contact electrode 311 in the aforementioned embodiment, and the sixth conductive electrode layer is used to form the sixth conductive electrode 310 in the aforementioned embodiment. The sixth contact electrode 311 and the sixth conductive electrode 310 constitute the sixth electrode structure in this embodiment. Their materials can be selected with reference to the materials of the aforementioned contact electrodes and conductive electrodes.

[0206] Reference Figure 38 The entire stacked structure is etched through, leaving only the fourth substrate 004 unetched, thereby forming multiple light-emitting stacked units.

[0207] Reference Figure 39 The light-emitting stack unit is connected to the driving backplane 400, and the first electrode structure in each Micro-LED unit is connected to the corresponding driving electrode 410.

[0208] In some embodiments, after connecting the light-emitting stack unit to the driving backplane, the method further includes: forming a common electrode structure on the side of the light-emitting stack unit away from the driving backplane, wherein the common electrode structure is connected to the second electrode structure in each Micro-LED unit.

[0209] The common electrode structure is used to draw out the current of each Micro-LED unit in the light-emitting stack unit, so that each Micro-LED unit forms a current loop and emits light under the drive of the current.

[0210] Reference Figures 40-42In some embodiments, a common electrode structure is formed on the side of the light-emitting stack unit away from the driving backplate 400, including: forming a third insulating layer 440 on the side of the light-emitting stack unit away from the driving backplate; forming an opening in the third insulating layer 440, the opening exposing the second electrode structure in each Micro-LED unit; forming a conductive layer 450 in the opening, the conductive layer being connected to each second electrode structure; and forming a planarization layer 460 on the side of the third insulating layer 440 away from the light-emitting stack unit, the planarization layer 460 covering the opening.

[0211] The conductive layer 450 can be a metal mesh or a transparent conductive electrode.

[0212] In some embodiments, after forming a common electrode structure on the side of the light-emitting stack unit away from the driving backplate 400, the method further includes forming a lens unit on the side of the common electrode structure away from the light-emitting stack unit.

[0213] The lens unit is positioned on the side of the light-emitting stack unit away from the driving backplate 400. The light emitted by the light-emitting stack unit is emitted from the side away from the driving backplate 400 to achieve side light emission. The lens unit focuses the light, limiting the emitted light to a range directly opposite the light-emitting stack unit along the direction away from the driving backplate 400.

[0214] Reference Figure 43 and Figure 44 In some embodiments, a lens unit is formed on the side of the common electrode structure away from the light-emitting stack unit, including: forming an optical diffusion layer 500 on the side of the common electrode structure away from the light-emitting stack unit; and disposing a plano-convex lens 600 on the side of the optical diffusion layer 500 away from the common electrode structure, with the planar side of the plano-convex lens 600 facing the light-emitting stack unit, and the orthogonal projection of the plano-convex lens 600 on the driving backplate 400 covering the orthogonal projection of the light-emitting layer in each Micro-LED unit on the driving backplate 400.

[0215] In this embodiment, each Micro-LED unit shares a lens unit consisting of an optical diffusion layer 500 and a plano-convex lens 600. The light emitted by each Micro-LED unit can be diffused more uniformly across the entire side of the light-emitting stack unit.

[0216] Reference Figure 2 , Figure 9 or Figure 12The lens unit may include a plurality of plano-convex lenses 600. In some embodiments, forming a lens unit on the side of the common electrode structure away from the light-emitting stack unit includes: disposing a plurality of plano-convex lenses 600 on the side of the common electrode structure away from the light-emitting stack unit, with the planar side of each plano-convex lens 600 facing the light-emitting stack unit, each plano-convex lens 600 being arranged correspondingly to each Micro-LED unit, and the orthographic projection of the plano-convex lens 600 on the driving backplate 400 covering the orthographic projection of the light-emitting layer in the corresponding Micro-LED unit on the driving backplate 400.

[0217] In this embodiment, after the planarization layer 460 is fabricated, each plano-convex lens 600 is directly fabricated. Each Micro-LED unit uses a separate plano-convex lens 600 for light focusing, thereby improving color resolution. Figure 45 The lens unit structure shown can be applied to micro-displays. Figure 44 The lens unit structure shown can be applied to large, medium and small direct-view displays.

[0218] Reference Figure 10 In some embodiments, the driving backplate 400 further includes a driving common electrode 414, which is located outside the orthographic projection range of the light-emitting stack unit on the driving backplate 400 and extends toward the side where the light-emitting stack unit is located. The light-emitting stack unit is transferred to the driving backplate 400, and the driving common electrode 414 and the light-emitting stack unit are arranged along a first direction.

[0219] Reference Figures 45-47 In this embodiment, a common electrode structure is formed on the side of the light-emitting stack unit away from the driving backplate, including: forming a fifth planarization layer on the side of the driving backplate 400 facing the light-emitting stack unit, the fifth planarization layer away from the driving backplate 400, the side of the light-emitting stack unit away from the driving backplate 400, and the side of the driving common electrode 414 away from the driving backplate 400 being flush; forming a third insulating layer 440, the third insulating layer 440 covering the fifth planarization layer, the light-emitting stack unit, and the driving common electrode 414; forming an opening in the third insulating layer 440, the opening exposing the second electrode structure and the driving common electrode 414 in each Micro-LED unit; forming a conductive layer 450 on the side of the third insulating layer 440 away from the light-emitting stack unit, the conductive layer 450 being connected to each second electrode structure and the driving common electrode 414 through the opening; and forming a sixth planarization layer on the side of the conductive layer 450 away from the third insulating layer 440.

[0220] The conductive layer 450 covers the side of the third insulating layer 440 away from the light-emitting stack unit, and simultaneously contacts the driving common electrode 414 and the second conductive electrode 120, third conductive electrode 220, and fifth conductive electrode 320 within the opening. The circuitry flowing out of each Micro-LED unit is transmitted from the conductive electrode through the conductive layer 450 to the driving common electrode 414. The planarization layer 460 covers the side of the conductive layer 450 away from the third insulating layer 440, serving as insulation and isolation to protect the conductive layer 450.

[0221] A lens unit can be disposed on the side of the planarization layer 460 away from the conductive layer 450; the corresponding structure can be found in [reference needed]. Figure 11 and Figure 12 The corresponding process flow can be referred to above.

[0222] One embodiment of this application also provides a display device, which includes the display unit according to the foregoing description, or the display device includes a display unit fabricated according to the foregoing preparation method. The specific structure and principle of the display unit and the specific process of the preparation method can be referred to the foregoing embodiments, and will not be repeated here.

[0223] The display device according to this application employs a side-emitting display unit, resulting in a simpler structure and optimized manufacturing process. Of course, the display unit in the display device can also adopt the technical solutions described above and in the embodiments, and will also have corresponding technical effects.

[0224] In this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0225] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display unit, characterized in that, include: The light-emitting stacking unit includes multiple Micro-LED units stacked along a first direction; A driving backplate is connected to the light-emitting stacking unit and drives the light-emitting stacking unit to emit light from the side away from the driving backplate, so that the light emission direction of the light-emitting stacking unit is perpendicular to the first direction.

2. The display unit according to claim 1, characterized in that, The Micro-LED unit includes a first electrode structure, a light-emitting layer, and a second electrode structure stacked along the first direction.

3. The display unit according to claim 2, characterized in that, A bonding layer is provided between two adjacent Micro-LED units in the light-emitting stack unit.

4. The display unit according to claim 3, characterized in that, The second electrode structures of at least one pair of adjacent Micro-LED units in the light-emitting stack are arranged facing each other.

5. The display unit according to claim 4, characterized in that, The material of the bonding layer between two adjacent Micro-LED units arranged in the second electrode structure is a conductive material, so that the two adjacent Micro-LED units share the second electrode structure.

6. The display unit according to claim 2, characterized in that, The Micro-LED unit further includes a first insulating layer, which is located on both sides of the light-emitting layer along the second direction, and the second direction is perpendicular to the first direction.

7. The display unit according to claim 6, characterized in that, In the light-emitting stack unit, the first electrode structure and the second electrode structure of at least one pair of adjacent Micro-LED units are arranged facing each other, and the second electrode structure facing the first electrode structure is provided with the first insulating layer on the side near the driving back plate.

8. The display unit according to claim 2, characterized in that, Both the first electrode structure and the second electrode structure include a contact electrode, a conductive electrode, and a light-reflecting layer, wherein the conductive electrode is located on the side of the contact electrode away from the light-emitting layer; Wherein, the contact electrode is made of a transparent material, the conductive electrode is made of an opaque material, and the light-reflecting layer is located between the contact electrode and the conductive electrode, and the light-reflecting layer is made of a conductive material; or... Both the contact electrode and the conductive electrode are made of transparent material, and the light-reflecting layer is located on the side of the conductive electrode away from the contact electrode.

9. The display unit according to any one of claims 1-8, characterized in that, The drive backplate includes: Multiple driving electrodes are provided, and each driving electrode is connected to a corresponding Micro-LED unit. A reflector is positioned between each driving electrode; A second insulating layer is disposed on the side of the reflector facing the light-emitting stack unit and covers the reflector.

10. The display unit according to claim 9, characterized in that, The drive backplate includes: The driving common electrode is located outside the orthogonal projection range of the light-emitting stack unit on the driving back plate and extends toward the side where the light-emitting stack unit is located. The driving common electrode is used to form a connection with each of the Micro-LED units.

11. The display unit according to any one of claims 1-8, characterized in that, The display unit further includes: A common electrode structure is disposed on the side of the light-emitting stack unit away from the driving backplate, and is connected to each of the Micro-LEDs respectively.

12. The display unit according to claim 11, characterized in that, The common electrode structure includes: A third insulating layer is disposed on the side of the light-emitting stack unit away from the driving backplate. The third insulating layer has multiple openings that expose the electrode structure in each Micro-LED unit. A conductive layer is disposed within the opening and connected to the electrode structure exposed in each of the openings; A planarization layer is disposed on the side of the third insulating layer away from the light-emitting stack unit and covers the opening.

13. The display unit according to claim 11, characterized in that, The common electrode structure includes: A third insulating layer is disposed on the side of the light-emitting stack unit away from the driving backplate. The third insulating layer has an opening that exposes the electrode structure in each Micro-LED unit. A conductive layer is disposed on the side of the third insulating layer away from the light-emitting stack unit, and is connected to and from the electrode structure in each of the Micro-LED units through the opening; A planarization layer is disposed on the side of the conductive layer away from the third insulating layer.

14. The display unit according to any one of claims 1-8, characterized in that, The display unit further includes: A lens unit is disposed on the side of the light-emitting stack unit away from the driving backplate to concentrate the light emitted by the light-emitting stack unit.

15. The display unit according to claim 14, characterized in that, The lens unit includes: An optical diffusion layer is disposed on the side of the light-emitting stack unit away from the driving backplate; A plano-convex lens is disposed on the side of the optical diffusion layer away from the light-emitting stack unit, with its planar side facing the light-emitting stack unit. The orthogonal projection of the plano-convex lens onto the driving backplate covers the orthogonal projection of the light-emitting layer in each Micro-LED unit onto the driving backplate.

16. The display unit according to claim 14, characterized in that, The lens unit includes: Multiple plano-convex lenses are disposed on the side of the optical diffusion layer away from the light-emitting stack unit, with their planar sides facing the light-emitting stack unit. Each plano-convex lens is arranged corresponding to each Micro-LED unit. The orthogonal projection of the plano-convex lens onto the driving backplate covers the orthogonal projection of the light-emitting layer in the corresponding Micro-LED unit onto the driving backplate.

17. The display unit according to any one of claims 1-8, characterized in that, The light-emitting stack unit comprises three stacked Micro-LED units with different light-emitting colors, namely red, green and blue.

18. The display unit according to any one of claims 1-8, characterized in that, The driving backplate is provided with a metal enclosure on the side facing the light-emitting stacking unit, and the metal enclosure is arranged around the side of the light-emitting stacking unit adjacent to the side facing the driving backplate.

19. A method for fabricating a display unit, characterized in that, include: A light-emitting stacked unit is fabricated by stacking multiple Micro-LED units along a first direction; The light-emitting stack unit is connected to a driving backplate, and the driving backplate drives the light-emitting stack unit to emit light from the side away from the driving backplate, so that the light emission direction of the light-emitting stack unit is perpendicular to the first direction.

20. The preparation method according to claim 19, characterized in that, The fabrication of a light-emitting stacked unit comprising multiple Micro-LED units stacked along a first direction includes: A first light-emitting layer and a first electrode structure are formed on a first substrate; A second light-emitting layer and a second electrode structure are formed on a second substrate; The second electrode structure and the first electrode structure are bonded together, and the second substrate is removed; A third electrode structure is formed on the side of the second light-emitting layer away from the second electrode structure; A third light-emitting layer and a fourth electrode structure are formed on a third substrate; The fourth electrode structure and the third electrode structure are bonded together; Remove the first substrate and form a fifth electrode structure on the side of the first light-emitting layer away from the first electrode structure; The third substrate is removed, and a sixth electrode structure is formed on the side of the third light-emitting layer away from the fourth electrode structure.

21. The preparation method according to claim 20, characterized in that, The formation of a first light-emitting layer and a first electrode structure stacked on a first substrate includes: A first light-emitting layer is formed on a first substrate; A first planarization layer is deposited on the side of the first substrate facing the first light-emitting layer, and the side of the first planarization layer away from the first substrate is flush with the side of the first light-emitting layer away from the first substrate; A first contact electrode layer and a first conductive electrode layer are deposited on the side of the first planarization layer and the first light-emitting layer away from the first substrate; The first contact electrode layer and the first conductive electrode layer are patterned to form a first electrode structure; A second planarization layer is deposited on the side of the first planarization layer away from the first substrate, and the side of the second planarization layer away from the first substrate is flush with the side of the first electrode structure away from the first substrate. A first bonding layer is formed on the side of the second planarization layer and the first electrode structure away from the first substrate.

22. The preparation method according to claim 21, characterized in that, The formation of a second light-emitting layer and a second electrode structure stacked on the second substrate includes: A second light-emitting layer, a second contact electrode layer, and a second conductive electrode layer are formed sequentially on a second substrate.

23. The preparation method according to claim 22, characterized in that, After bonding the second electrode structure and the first electrode structure and removing the second substrate, the process further includes: The second light-emitting layer, the second contact electrode layer, and the second conductive electrode layer are patterned. A third planarization layer is deposited on the side of the first bonding layer away from the first substrate, and the side of the third planarization layer away from the first substrate is flush with the side of the second light-emitting layer away from the first substrate. A third contact electrode layer and a third conductive electrode layer are deposited on the side of the third planarization layer and the second light-emitting layer away from the first substrate.

24. The preparation method according to any one of claims 19-23, characterized in that, After connecting the light-emitting stacked unit to the driving backplane, the process further includes: A common electrode structure is formed on the side of the light-emitting stack unit away from the driving backplate, and the common electrode structure is connected to the second electrode structure in each of the Micro-LED units.

25. The preparation method according to claim 24, characterized in that, The formation of a common electrode structure on the side of the light-emitting stack unit away from the driving backplate includes: A third insulating layer is formed on the side of the light-emitting stack unit away from the driving backplate; An opening is formed in the third insulating layer, the opening exposing the second electrode structure in each of the Micro-LED units; A conductive layer is formed within the opening, and the conductive layer is connected to each of the second electrode structures; A fourth planarization layer is formed on the side of the third insulating layer away from the light-emitting stack unit, and the fourth planarization layer covers the opening.

26. The preparation method according to claim 24, characterized in that, The driving backplate also includes a driving common electrode, located outside the orthographic projection range of the light-emitting stack unit on the driving backplate and extending toward the side where the light-emitting stack unit is located. The formation of the common electrode structure on the side of the light-emitting stack unit away from the driving backplate includes: A fifth planarization layer is formed on the side of the driving backplate facing the light-emitting stacking unit. The fifth planarization layer is flush with the side of the driving backplate away from the driving backplate, the side of the light-emitting stacking unit away from the driving backplate, and the side of the driving common electrode away from the driving backplate. A third insulating layer is formed, which covers the fifth planarization layer, the light-emitting stack unit, and the driving common electrode; An opening is formed in the third insulating layer, the opening exposing the second electrode structure and the driving common electrode in each of the Micro-LED units; A conductive layer is formed on the side of the third insulating layer away from the light-emitting stack unit, and the conductive layer is connected to each of the second electrode structures and the driving common electrode through the opening; A sixth planarization layer is formed on the side of the conductive layer away from the third insulating layer.

27. The preparation method according to claim 24, characterized in that, After forming a common electrode structure on the side of the light-emitting stack unit away from the driving backplate, the method further includes: A lens unit is formed on the side of the common electrode structure away from the light-emitting stack unit.

28. The preparation method according to claim 27, characterized in that, The formation of a lens unit on the side of the common electrode structure away from the light-emitting stack unit includes: An optical diffusion layer is formed on the side of the common electrode structure away from the light-emitting stack unit; A plano-convex lens is disposed on the side of the optical diffusion layer away from the common electrode structure. The plano-convex lens is arranged with its flat side facing the light-emitting stack unit. The orthogonal projection of the plano-convex lens onto the driving backplate covers the orthogonal projection of the light-emitting layer in each Micro-LED unit onto the driving backplate.

29. The preparation method according to claim 27, characterized in that, The formation of a lens unit on the side of the common electrode structure away from the light-emitting stack unit includes: Multiple plano-convex lenses are disposed on the side of the common electrode structure away from the light-emitting stack unit. The planar side of each plano-convex lens faces the light-emitting stack unit. Each plano-convex lens is arranged corresponding to each Micro-LED unit. The orthogonal projection of the plano-convex lens on the driving back plate covers the orthogonal projection of the light-emitting layer in the corresponding Micro-LED unit on the driving back plate.

30. A display device, characterized in that, The display device includes a display unit according to any one of claims 1-18, or the display device includes a display unit prepared by the preparation method according to any one of claims 19-29.

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