Glass packaging backboard capable of reducing stress concentration, perovskite assembly and battery

Abstract

The invention relates to a glass packaging backboard capable of reducing stress concentration, a perovskite assembly and a cell, and relates to a perovskite solar cell. The glass packaging backboard capable of reducing stress concentration comprises a backboard body and a plurality of platform grooves, the backboard body comprises an inner side face and an outer side face which are opposite, the platform grooves are arranged in an array mode and formed in the inner side face and / or the outer side face, the cross section of each platform groove is rectangular, each platform groove is of a long and thin strip-shaped structure, and the platform grooves are formed inwards from the surface of the backboard body. The thickness of the platform groove is 1 / 50-1 / 20 of the thickness of the backboard body. Under the condition that the packaging effect and the packaging backboard strength are guaranteed, stress in the strenuous vibration process can be effectively released, and the battery failure risk is reduced.

Description

Technical Field

[0001] This application relates to perovskite solar cells, and more specifically, to a glass encapsulation backsheet for reducing stress concentration, a perovskite module, and a cell. Background Technology

[0002] Photovoltaic technology, as the most widely used clean energy technology in the market, will become one of the key focuses of future development. Currently, monocrystalline silicon-based solar cells, with their high efficiency and stability, occupy more than 95% of the photovoltaic market and have cumulatively provided my country with a considerable supply of clean energy. However, the high cost, long industrial chain, and high energy consumption of upstream enterprises of silicon-based solar cells have limited their development speed. At the same time, the efficiency of silicon-based solar cells is gradually approaching its theoretical limit (~29.4%), and growth has been slow in recent years. Therefore, developing a new photovoltaic technology with low cost, high theoretical efficiency, and a simple manufacturing process is crucial.

[0003] Perovskite solar cells are a novel photovoltaic technology characterized by low cost and high theoretical efficiency (approximately 31%). A typical perovskite solar cell includes: a front electrode, which is a transparent conductive glass or a flexible transparent conductive film; a first carrier transport layer, which is a P-type or N-type semiconductor material; a perovskite light-absorbing layer of material ABX3, where A is a monovalent group or ion such as methylamino (MA), formamidinyl (FA), or cesium (Cs); B is a divalent element such as lead (Pb) or Sn, or two monovalent element ions; and X is a halogen element or other negatively charged monovalent group; a second carrier transport layer, which is an N-type or P-type semiconductor material, either a metal oxide or an organic semiconductor material; and a back electrode, which can be a metal, graphite, or a conductive oxide. Since research began in 2009, the photoelectric conversion efficiency of small-area laboratory cells has exceeded 26.1%, comparable to that of silicon-based cells. Especially in the second half of 2021, the industrialization process of perovskite solar cells accelerated, with early industrialization attempts such as laboratory technology scale-up, pilot production line construction, and sample demonstrations proceeding rapidly.

[0004] The fabrication process of perovskite modules is as follows: 1. Clean the transparent substrate and prepare a transparent conductive layer; 2. On the surface of the transparent conductive layer, use a mask to prepare patterned insulating trenches at the P2 / P3 laser scribing positions; 3. Perform P1 laser scribing on the transparent conductive layer to form multiple small sub-modules; 4. Prepare the first carrier layer, such as a hole transport layer; 5. Prepare the perovskite layer; 6. Prepare the second carrier layer, such as an electron transport layer; 7. Perform P2 laser scribing on the device; 8. Prepare the back electrode layer; 9. Perform P3 laser scribing on the device to form a perovskite module; 10. Place the POE film and glass encapsulation backplane on the surface of the perovskite module; 11. Perform lamination to form the perovskite module.

[0005] Due to specific application scenarios, such as the perovskite module experiencing severe vibration during use, special designs are required for the perovskite module to reduce stress concentration in the perovskite solar cell and prevent cracking or microcracks in the glass substrate and glass encapsulation backplane during vibration, which could lead to direct damage to the perovskite module or encapsulation failure.

[0006] In view of this, the present invention is proposed. Summary of the Invention

[0007] The purpose of this application is to provide a glass encapsulation backplate, perovskite module and battery that reduces stress concentration. This application, through the structural design of the boss-shaped platform groove, can effectively release stress during severe vibration while ensuring the encapsulation effect and the strength of the encapsulation backplate, thereby reducing the risk of battery failure.

[0008] In a first aspect, the present invention provides a glass encapsulation backplate for reducing stress concentration, comprising a backplate body and a platform groove. The backplate body includes opposing inner and outer sides. The platform groove is a plurality of grooves arranged in an array and opened on the inner side and / or the outer side. The platform groove has a rectangular cross-section and is a slender strip structure. The platform groove is opened inward from the surface of the backplate body. The thickness of the platform groove is 1 / 50 to 1 / 20 of the thickness of the backplate body.

[0009] In an optional implementation, the length direction of the platform groove is consistent with the length direction of the backplate body, or the length direction of the platform groove is consistent with the diagonal direction of the backplate body.

[0010] In an optional embodiment, the platform groove is a single section or multiple sections, and the total length of the platform groove is 10 to 4500 mm.

[0011] In an optional embodiment, when the platform groove is provided on both the inner side and the outer side, the positions of the platform groove on the inner side and the platform groove on the outer side are alternately spaced.

[0012] In an optional embodiment, the bottom wall of the platform groove on the inner side and / or the outer side is further provided with a boss groove, the width of the boss groove is smaller than the width of the platform groove, the platform groove and the boss groove form a stepped shape, and the thickness of the boss groove is 1 / 50 to 1 / 5 of the thickness of the back plate body.

[0013] In an optional embodiment, the width of the platform groove is 4 to 100 mm, and the width of the boss groove is 2 to 98 mm;

[0014] Alternatively, the widths of the platform groove and the boss groove forming the steps on both sides are 1-49mm respectively.

[0015] In an optional embodiment, the platform groove and the boss groove on at least one of the inner side and the outer side are filled with a filler.

[0016] In an optional embodiment, the filler includes at least one selected from butyl rubber, UV-curable adhesive, polyimide, polyethylene terephthalate, polyurethane, silicone sealant, epoxy resin, acrylic acid, and silicone.

[0017] In a second aspect, the present invention provides a perovskite component comprising, sequentially deposited, a transparent substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, a metal back electrode, a POE film, and a glass encapsulation backplate for reducing stress concentration as described in any of the foregoing embodiments.

[0018] Thirdly, the present invention provides a perovskite solar cell comprising the perovskite module as described in the foregoing embodiments.

[0019] The beneficial effects of the present invention through the above technical solution are as follows:

[0020] The glass encapsulation backplate provided by this invention reduces stress concentration by creating a platform groove with a thickness of 1 / 50 to 1 / 20 of the backplate body on at least one of the inner and outer surfaces. This invention optimizes the local structure by using the platform groove to reduce rigidity. Under stress, the platform groove can absorb some of the stress through slight bending or stretching deformation, dispersing the stress originally concentrated at a certain point (such as an edge) to the groove body and surrounding areas, preventing the stress from exceeding the glass's fracture strength locally. The platform groove design helps reduce geometric abrupt changes, allowing stress to gradually disperse in the transition area rather than suddenly accumulating, thus avoiding stress concentration at the interface. The 1 / 50 to 1 / 20 thickness ratio ensures that the thin area has a certain deformation buffering capacity without significantly weakening the overall structural strength of the backplate. This invention effectively releases stress during severe vibration while ensuring encapsulation effect and backplate strength, reducing the risk of battery failure.

[0021] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 1 of this application;

[0024] Figure 2 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 1 of this application when it is fabricated into a perovskite component.

[0025] Figure 3 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 2 of this application;

[0026] Figure 4 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 3 of this application;

[0027] Figure 5 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 4 of this application;

[0028] Figure 6 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 5 of this application;

[0029] Figure 7 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 6 of this application;

[0030] Figure 8 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 7 of this application;

[0031] Figure 9 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 8 of this application;

[0032] Figure 10 This is a schematic diagram of the structure of the glass encapsulation backplane provided in Embodiment 9 of this application;

[0033] Figure 11 This is a schematic diagram of the structure of the glass encapsulation backplate provided in Embodiment 10 of this application;

[0034] Figure 12 This is a process flow diagram for preparing the perovskite component in Experimental Example 2 of this application.

[0035] Icons: 100 - Glass encapsulation backplate; 110 - Backplate body; 111 - Inner side; 112 - Outer side; 120 - Platform groove; 121 - Boss groove; 122 - Filler. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0037] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] The present invention provides a glass encapsulation backplate 100 for reducing stress concentration, which includes a backplate body 110 and a platform groove 120. The backplate body 110 includes opposing inner surfaces 111 and outer surfaces 112. The platform groove 120 is a plurality of those arranged in an array and opened on the inner surfaces 111 and / or the outer surfaces 112. The platform groove 120 has a rectangular cross-section and is a slender strip structure. The platform groove 120 is opened from the surface of the backplate body 110 inward. The thickness of the platform groove 120 is 1 / 50 to 1 / 20 of the thickness of the backplate body 110.

[0040] Since the primary function of the glass encapsulation backplane 100 in perovskite solar cells is to protect the internal perovskite active layer (which is susceptible to damage from moisture, oxygen, and mechanical impact), but glass itself is a typical brittle material (low fracture toughness, unable to release stress through plastic deformation), and the encapsulation structure involves multiple layers of materials (such as glass, perovskite layer, electrodes, adhesives, etc.), these materials have significantly different coefficients of thermal expansion (CTE) (for example, the CTE of glass is approximately 5 × 10⁻⁶). -6 / ℃, the perovskite layer is approximately 100×10⁻⁶. -6 / ℃). When batteries experience temperature changes (such as day-night temperature differences or light heating) or mechanical vibrations during use, different materials have different degrees of expansion and contraction, which will generate thermal stress or mechanical stress. If the backsheet is a complete, unstructured glass, the stress will be concentrated at the material interface (such as the contact edge between the glass and the adhesive) or at the geometric abrupt change (such as the edge of the backsheet or corner), which may eventually lead to glass cracking or encapsulation failure.

[0041] In this invention, a platform groove 120 is formed on at least one of the inner side 111 and the outer side 112 of the back plate body 110. The design of the platform groove 120 (thickness is 1 / 50 to 1 / 20 of the back plate body 110) optimizes the local structure and changes the stress transmission path to achieve stress dispersion.

[0042] Specifically, the backplate body 110 is relatively thick, rigid, and has poor deformation capacity; while the platform groove 120 is only 1 / 50 to 1 / 20 the thickness of the backplate body 110, with significantly reduced rigidity, allowing for slight elastic deformation. When stress is transferred to the platform groove 120, the thin area can "absorb" some of the stress through slight bending or stretching deformation, dispersing the stress originally concentrated at a certain point (such as the edge) to the groove body and surrounding areas, preventing the stress from exceeding the glass's fracture strength locally. The design of the platform groove 120 reduces geometric abrupt changes by creating a smooth thickness transition in local areas, allowing stress to gradually disperse in the transition area rather than suddenly accumulating. In the perovskite solar cell encapsulation structure, the different amounts of stretching and shrinking between the backplate body 110 and internal materials (such as adhesives and perovskite layers) generate "interfacial shear stress." The thin area of ​​the platform groove 120 can adapt to this difference through slight deformation: when the internal material expands due to heat, the thin area can bend slightly outward to reduce the tensile force on the glass body; when it cools and contracts, the thin area can contract slightly inward to reduce the interfacial compressive stress, thereby avoiding stress concentration at the interface.

[0043] The thickness of the platform slot 120 needs to be strictly controlled between 1 / 50 and 1 / 20 of the body thickness. If the slot thickness is too thin (less than 1 / 50): the thin area has insufficient rigidity and may deform excessively under its own weight or slight external force, becoming a new stress concentration point (or even directly breaking), while failing to support the sealing performance of the package structure. If the slot thickness is too thick (greater than 1 / 20): the rigidity difference between the thin area and the body is too small, the deformation capacity is insufficient, and it cannot effectively disperse stress, losing its stress release function. A ratio of 1 / 50 to 1 / 20 ensures that the thin area has a certain deformation buffering capacity without significantly weakening the overall structural strength of the backplane (it can still bear the mechanical support and barrier function of the package).

[0044] The platform groove 120 is aligned with the length of the backplate body 110, or the platform groove 120 is aligned with the diagonal direction of the backplate body 110. By aligning or aligning the platform groove 120, the extension direction of the platform groove 120 can be matched with the "main stress direction" or "critical path of stress concentration" generated by the backplate in actual working conditions, thereby dispersing stress more efficiently and avoiding glass cracking or encapsulation failure caused by excessive local stress.

[0045] The platform groove 120 can be a single section or multiple sections, and the total length of the platform groove 120 is 10-4500mm. The single section or multiple section structure of this invention can also be adjusted according to the actual situation, flexibly adjusting the range and accuracy of stress dispersion, while efficiently dispersing stress, avoiding excessive weakening of the structural stability of the back plate due to the groove design.

[0046] When both the inner side 111 and the outer side 112 are provided with platform grooves 120, the positions of the platform grooves 120 on the inner side 111 and the platform grooves 120 on the outer side 112 are alternately spaced. The alternating arrangement can avoid the local structural fragility caused by the "layering and thinning" of the grooves at the same position, and at the same time realize the layered dispersion and synergistic buffering of internal and external stresses. While efficiently releasing stress, it can ensure the overall structural strength and crack resistance of the back plate.

[0047] Furthermore, the bottom wall of the platform groove 120 on the inner side 111 and / or the outer side 112 is further provided with a boss groove 121. The width of the boss groove 121 is smaller than the width of the platform groove 120, and the platform groove 120 and the boss groove 121 form a stepped shape. The thickness of the boss groove 121 is 1 / 50 to 1 / 5 of the thickness of the back plate body 110. In this invention, by adding a boss groove 121 to the platform groove 120, a multi-layered gradient stress buffer structure is constructed. Through the dimensional differences (width and thickness) and spatial nesting relationship between the platform groove 120 and the boss groove 121, a stepped progressive dispersion of stresses of different magnitudes and distribution characteristics is achieved, while balancing stress release efficiency and structural strength. The coordinated effect of the two is reflected in functional complementarity and risk collaborative control.

[0048] Because the stress borne by the backplate body 110 is not of a single magnitude, but rather a superposition of "large-scale low-intensity stress" and "local high-intensity stress" (for example, the uniform thermal stress generated by temperature changes in the entire backplate is a "low-intensity large-scale stress," while the shear stress generated by the thermal expansion difference between the perovskite layer and the glass interface is a "high-intensity local stress"), a single platform groove 120 can only disperse stress of a certain magnitude, while the stepped structure can handle stress of different magnitudes through gradient changes in thickness. The platform groove 120 is wide and shallow, and can release large-scale uniform stress smoothly through its own small elastic deformation, avoiding stress accumulation in a large area. The boss groove 121 is narrow and deep, and can further concentrate and dissipate high-intensity stress through deeper deformation after being dispersed by the platform groove 120, precisely handling stress peaks that the platform groove 120 cannot cover. Platform groove 120 serves as a primary buffer layer, using a wide, shallow groove to initially disperse stress over a large area and ensure the basic strength of the structure; boss groove 121 serves as a secondary precision layer, using a narrow, deep groove to deeply dissipate local stress peaks and compensate for the deficiencies of the primary buffer layer.

[0049] The width of the platform groove 120 is 4–100 mm, and the width of the boss groove 121 is 2–98 mm. The widths of the two sides of the step formed by the platform groove 120 and the boss groove 121 are 1–49 mm respectively. By specifically limiting the dimensions of the platform groove 120 and the boss groove 121, the opening accuracy of the platform groove 120 and the boss groove 121 can be more precisely controlled. Specifically, the platform groove 120 and the boss groove 121 of the above-mentioned specific dimensions can be formed on the glass packaging backplate 100 by laser etching, gas etching, or solution wet etching.

[0050] Furthermore, at least one of the inner surface 111 and the outer surface 112 has a filler 122 disposed within the platform groove 120 and the boss groove 121. The filler 122 includes at least one of butyl rubber, UV-curable adhesive, polyimide, polyethylene terephthalate, polyurethane, silicone sealant, epoxy resin, acrylic acid, and silicone. In this invention, the stepped structure of the platform groove 120 and the boss groove 121 itself weakens and disperses local rigid stress (such as stress generated by thermal expansion and contraction, mechanical impact), while the filler 122 further absorbs stress through elastic deformation. In addition, the filler layer can also fill the gaps in the platform groove 120 and the boss groove 121, eliminate the communication path between the groove and the outside, prevent water vapor and oxygen from penetrating into the battery core layer through the gaps in the groove, enhance the reliability of the encapsulation, improve the bending and impact resistance of the backsheet through the mechanical support of the filler 122, and improve the long-term stability of the battery. The stepped structure disperses stress through thickness gradient, while the filler 122 absorbs stress through elastic deformation. The combination of the two can cover macroscopic stress dispersion (structural level) and microscopic stress buffering (material level), significantly reducing the risk of glass breakage.

[0051] Correspondingly, the present invention provides a perovskite component comprising a transparent substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, a metal back electrode, a POE film, and a glass encapsulation backplate 100 as described above to reduce stress concentration, which are deposited sequentially.

[0052] Furthermore, the present invention provides a perovskite solar cell comprising the above-described perovskite component.

[0053] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0054] Example 1

[0055] Please see Figure 1 and Figure 2In this embodiment, a platform groove 120 is provided on the inner side 111 of the back panel body 110. The thickness of the back panel body 110 is 3mm, the depth of the platform groove 120 is 0.06mm, the length is 1200mm, and the width is 100mm. The length direction of the platform groove 120 is consistent with the length direction of the back panel body 110. The platform groove 120 is a single piece. No filler 122 is provided in the platform groove 120. After lamination, it is filled with an organic encapsulating film.

[0056] Example 2

[0057] Please see Figure 3 In this embodiment, a platform groove 120 is provided on the outer side 112 of the back plate body 110. The thickness of the back plate body 110 is 3mm, the depth of the platform groove 120 is 0.15mm, the length is 1200mm, and the width is 100mm. The length direction of the platform groove 120 is consistent with the diagonal direction of the back plate body 110. The platform groove 120 is two-sectioned, and no filler 122 is provided in the platform groove 120.

[0058] Example 3

[0059] Please see Figure 4 In this embodiment, platform grooves 120 are provided on both the inner side 111 and the outer side 112 of the back panel body 110. The thickness of the back panel body 110 is 3mm, the depth of the platform groove 120 is 0.1mm, the length is 1200mm, and the width is 50mm. The length direction of the platform groove 120 is consistent with the length direction of the back panel body 110. The platform groove 120 is a single piece, with the platform grooves 120 on the inner side 111 and the outer side 112 alternating. No filler 122 is provided in the platform groove 120. The platform groove 120 on the inner side 111 is filled with an organic encapsulating film after lamination, while the outer side 112 is not filled.

[0060] Example 4

[0061] Please see Figure 5 Based on Embodiment 1, this embodiment further includes a boss groove 121 formed inward on the bottom wall of the platform groove 120. The boss groove 121 has a depth of 0.15 mm, a length of 1200 mm, and a width of 2 mm. The widths of the steps formed by the platform groove 120 and the boss groove 121 are 49 mm on each side.

[0062] Example 5

[0063] Please see Figure 6 Based on embodiment 2, this embodiment further provides a boss groove 121 on the bottom wall of the platform groove 120. The boss groove 121 has a depth of 0.06mm, a length of 1200mm, and a width of 96mm. The widths of the steps formed by the platform groove 120 and the boss groove 121 are 2mm on each side.

[0064] Example 6

[0065] Please see Figure 7 Based on embodiment 3, this embodiment further provides a boss groove 121 on the bottom wall of the platform groove 120. The boss groove 121 has a depth of 0.1mm, a length of 1200mm, and a width of 40mm. The widths of the steps formed by the platform groove 120 and the boss groove 121 are 5mm on each side.

[0066] Example 7

[0067] Please see Figure 8 In this embodiment, based on embodiment 4, butyl rubber is filled into the platform groove 120 and the boss groove 121. In this case, the organic encapsulation film will not enter the platform groove 120 and the boss groove 121 during lamination.

[0068] Example 8

[0069] Please see Figure 9 In this embodiment, based on embodiment 5, UV-curable adhesive is filled into the platform groove 120 and the boss groove 121. At this time, the organic encapsulation film will not enter the platform groove 120 and the boss groove 121 during lamination.

[0070] Example 9

[0071] Please see Figure 10 In this embodiment, based on embodiment 6, polyimide and polyurethane (1:1) are filled into the platform groove 120 and the boss groove 121. In this case, the organic encapsulation film will not enter the platform groove 120 and the boss groove 121 during lamination.

[0072] Example 10

[0073] Please see Figure 11 In this embodiment, a platform groove 120 is provided on the outer surface 112 of the back plate body 110, and a platform groove 120 and a boss groove 121 are provided on the inner surface 111 of the back plate. The thickness of the back plate body 110 is 3mm. The platform groove 120 has a depth of 0.1mm, a length of 1200mm, and a width of 40mm. The boss groove 121 has a depth of 0.1mm, a length of 1200mm, and a width of 30mm. The widths of the steps formed by the platform groove 120 and the boss groove 121 are 5mm on each side. The length direction of the platform groove 120 is consistent with the length direction of the back plate body 110. The platform groove 120 is a single piece. A filler 122 (epoxy resin) is provided inside the platform groove 120 and the boss groove 121.

[0074] Comparative Example 1

[0075] This comparative example provides a backplate body 110 without a platform slot 120.

[0076] Comparative Example 2

[0077] This comparative example is basically the same as Example 1, except that the platform groove 120 in Example 1 is replaced with a V-shaped groove in this comparative example. The maximum width of the V-shaped groove is equal to the width of the platform groove 120, and the depth of the V-shaped groove is also consistent with that of the platform groove 120. However, the sidewall of the V-shaped groove gradually decreases towards the bottom wall along the opening direction, eventually converging into a sharp corner structure.

[0078] Comparative Example 3

[0079] This comparative example is basically the same as Example 1, except that the thickness of the platform groove 120 in this comparative example is 0.03 mm.

[0080] Experimental Example 1

[0081] The glass encapsulation backplates 100 provided in Examples 1-10 and Comparative Examples 1-3 were subjected to photoelasticity tests to determine the stress distribution of the glass encapsulation backplates 100 provided in Examples 1-10 and Comparative Examples 1-3. The photoelasticity tests were conducted in accordance with GB / T 30020-2023 "Glass Defect Detection Method - Photoelastic Scanning Method". The test results are shown in Table 1.

[0082] Table 1. Statistical table of photoelasticity test results for different examples

[0083] Example Photoelasticity test results Example 1 8Mpa Example 2 7.5 MPa Example 3 7.7 MPa Example 4 5Mpa Example 5 4.9 MPa Example 6 4.85 MPa Example 7 4Mpa Example 8 4.1 MPa Example 9 4.2 MPa Example 10 4.05 MPa Comparative Example 1 10 MPa Comparative Example 2 9.7 MPa Comparative Example 3 9.8 MPa

[0084] Experimental Example 2

[0085] The glass encapsulation backplates 100 provided in Examples 1-10 and Comparative Examples 1-3 were sequentially applied to prepare perovskite modules (see [link]). Figure 12 In the reliability test (dual 85 aging test, i.e., 85°C temperature and 85% humidity), the stress distribution of the obtained perovskite modules was detected. Aging time greater than 1000 hours was rated "good", aging time greater than 500 hours but less than 1000 hours was rated "average", and aging time less than 500 hours was rated "poor". The evaluation results are shown in Table 2.

[0086] Table 2. Statistical table of reliability test results for different examples

[0087]

[0088]

[0089] As can be seen from Tables 1 and 2, compared to Comparative Example 1, the separate installation of the platform groove 120 in Examples 1-3 can reduce the photoelasticity test results to a certain extent, and the reliability test results are also better than those in Comparative Example 1. This proves that the separate installation of the platform groove 120 can reduce stress concentration and improve product performance to a certain extent. Examples 4-10 show that the boss structure design and the addition of filler inside the boss can effectively reduce stress concentration and improve product performance. However, the effect of setting a V-shaped groove in Comparative Example 2 is not good, proving that the shape of the platform groove 120 also has a key influence on reducing stress concentration. In addition, the smaller thickness of the platform groove 120 in Comparative Example 3 leads to a less effective reduction of stress concentration.

[0090] In summary, the glass encapsulation backplate 100 for reducing stress concentration provided by this invention utilizes a platform groove 120 with a thickness of 1 / 50 to 1 / 20 of the backplate body 110, formed on at least one of the inner side 111 and outer side 112. By optimizing the local structure and reducing rigidity through the platform groove 120, this invention allows the platform groove 120 to absorb some stress through slight bending or stretching deformation when subjected to stress, dispersing stress originally concentrated at a single point (such as an edge) to the groove body and surrounding areas, preventing stress from exceeding the glass's fracture strength locally. The design of the platform groove 120 helps reduce geometric abrupt changes, allowing stress to gradually disperse in the transition area rather than suddenly accumulating, thus preventing stress concentration at the interface. The 1 / 50 to 1 / 20 thickness ratio ensures that the thin area has a certain deformation buffering capacity without significantly weakening the overall structural strength of the backplate. This invention effectively releases stress during severe vibration while ensuring encapsulation effect and backplate strength, reducing the risk of battery failure.

[0091] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A glass encapsulation backplate for reducing stress concentration, characterized in that, It includes a backplate body and a platform groove. The backplate body includes opposing inner and outer sides. The platform groove is a plurality of grooves arranged in an array and opened on the inner side and / or the outer side. The platform groove has a rectangular cross-section and is a slender strip structure. The platform groove is opened from the surface of the backplate body inward. The thickness of the platform groove is 1 / 50 to 1 / 20 of the thickness of the backplate body.

2. The glass encapsulation backplate for reducing stress concentration according to claim 1, characterized in that, The length direction of the platform groove is consistent with the length direction of the back plate body, or the length direction of the platform groove is consistent with the diagonal direction of the back plate body.

3. The glass encapsulation backplate for reducing stress concentration according to claim 1, characterized in that, The platform groove is a single section or multiple sections, and the total length of the platform groove is 10-4500mm.

4. The glass encapsulation backplate for reducing stress concentration according to claim 1, characterized in that, When the platform groove is provided on both the inner side and the outer side, the positions of the platform groove on the inner side and the platform groove on the outer side are alternately spaced.

5. The glass encapsulation backplate for reducing stress concentration according to claim 1, characterized in that, The bottom wall of the platform groove on the inner side and / or the outer side continues to be provided with a boss groove, the width of the boss groove is smaller than the width of the platform groove, the platform groove and the boss groove form a stepped shape, and the thickness of the boss groove is 1 / 50 to 1 / 5 of the thickness of the back plate body.

6. The glass encapsulation backplate for reducing stress concentration according to claim 5, characterized in that, The width of the platform groove is 4-100mm, and the width of the boss groove is 2-98mm; Alternatively, the widths of the platform groove and the boss groove forming the steps on both sides are 1-49mm respectively.

7. The glass encapsulation backplate for reducing stress concentration according to claim 5, characterized in that, The platform groove and the boss groove on at least one of the inner side and the outer side are filled with a filling material.

8. The glass encapsulation backplate for reducing stress concentration according to claim 7, characterized in that, The filler includes at least one of butyl rubber, UV-curable adhesive, polyimide, polyethylene terephthalate, polyurethane, silicone sealant, epoxy resin, acrylic acid, and silicone.

9. A perovskite component, characterized in that, It includes a transparent substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, a metal back electrode, a POE film, and a glass encapsulation backplate for reducing stress concentration as described in any one of claims 1-8, which are deposited sequentially.

10. A perovskite solar cell, characterized in that, It includes the perovskite component as described in claim 9.

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