Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device, and belongs to the technical field of display. The light-emitting device array is arranged on one side of the substrate and located in the display area, the light-emitting device array comprises a plurality of light-emitting devices, and each light-emitting device comprises a first electrode and an optical path adjusting pattern; wherein the first electrode comprises a first sub-electrode and a second sub-electrode, the first sub-electrode is located between the second sub-electrode and the substrate, and the optical path adjusting pattern is located between the first sub-electrode and the second sub-electrode. The first sub-electrode and the second sub-electrode are connected through a via hole formed in the optical path adjusting pattern, and the main body material of the optical path adjusting pattern is a transparent organic material. According to the display panel, the preparation method thereof and the display device provided by the invention, the light emitting brightness of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel and a method for manufacturing the same. Background Art

[0002] In current large-size OLED (Organic Light-Emitting Diode) product processes, the highest peak brightness achievable by combining vapor-deposited light-emitting device materials and backplane structures is less than 2000 nits, which cannot meet the needs of different application scenarios and reduces the competitiveness of the products. To address this issue, there are currently strong microcavities (a state or structure that utilizes the repeated reflection of light between a reflective electrode and a semi-reflective and semi-transparent electrode, and is enhanced by constructive interference) that can enhance the brightness to meet the needs of different application scenarios. Summary of the Invention

[0003] This application aims to provide a display panel and its manufacturing method, as well as a display device, with the goal of improving the luminous brightness of the display panel.

[0004] A first aspect of this application provides a display panel, the display panel including a display area and a non-display area located on at least one side of the display area, the display panel including:

[0005] Substrate; and

[0006] An array of light-emitting devices is disposed on one side of the substrate, located in the display area. The array of light-emitting devices includes multiple light-emitting devices, each of which includes a first electrode and an optical path adjustment pattern.

[0007] The first electrode includes a first sub-electrode and a second sub-electrode. The first sub-electrode is located between the second sub-electrode and the substrate. The optical path adjustment pattern is located between the first sub-electrode and the second sub-electrode. The first sub-electrode and the second sub-electrode are connected by a via disposed on the optical path adjustment pattern. The main material of the optical path adjustment pattern is a transparent organic material.

[0008] Optionally, the optical path adjustment patterns located in the light-emitting devices emitting different colors have different thicknesses.

[0009] Optionally, the optical path adjustment patterns located in the light-emitting devices emitting the same color have approximately the same thickness.

[0010] Optionally, in the orthographic projection on the substrate, the optical path adjustment pattern completely covers the area of ​​the first sub-electrode except for the via.

[0011] Optionally, the optical path adjustment patterns in two adjacent light-emitting devices are separated from each other.

[0012] Optionally, the light-emitting device array includes a first light-emitting device emitting a first color and a second light-emitting device emitting a second color;

[0013] The display panel includes a first optical path adjustment pattern and a second optical path adjustment pattern, wherein the first optical path adjustment pattern is located in a first light-emitting device and the second optical path adjustment pattern is located in a second light-emitting device;

[0014] The thickness of the first optical path adjustment pattern is greater than the thickness of the second optical path adjustment pattern.

[0015] Optionally, the percentage by which the size of the first optical path adjustment pattern exceeds the size of the second optical path adjustment pattern is greater than or equal to 20% and less than or equal to 25%.

[0016] Optionally, the light-emitting device array includes a first light-emitting device emitting a first color, a second light-emitting device emitting a second color, and a third light-emitting device emitting a third color;

[0017] The display panel includes a first optical path adjustment pattern, a second optical path adjustment pattern, and a third optical path adjustment pattern. The first optical path adjustment pattern is located in a first light-emitting device, the second optical path adjustment pattern is located in a second light-emitting device, and the third optical path adjustment pattern is located in a third light-emitting device.

[0018] The thickness of the first optical path adjustment pattern is greater than the thickness of the second optical path adjustment pattern, and the thickness of the second optical path pattern is greater than the thickness of the third optical path pattern.

[0019] Optionally, the optical path adjustment pattern has multiple protrusions formed on the surface away from the first sub-electrode, the protrusions protruding in a direction away from the substrate, and at least two of the protrusions have different heights.

[0020] Optionally, multiple protrusions are irregularly arranged on the optical path adjustment pattern.

[0021] Optionally, the difference between the tallest and shortest of the plurality of protrusions is less than or equal to 15 nm.

[0022] Optionally, the display area includes a light-emitting area and a non-light-emitting area, the light-emitting device is located in the light-emitting area, and the non-light-emitting area includes a transfer electrode, the transfer electrode and the first sub-electrode are disposed on the same layer and connected to each other;

[0023] The display panel further includes: a flat pattern located in the non-light-emitting area, the flat pattern being disposed on the same layer as the optical path adjustment pattern, and the flat pattern being located on the side of the transfer electrode away from the substrate;

[0024] Within the non-light-emitting area, the thickness of the flat pattern remains consistent at different locations.

[0025] Optionally, the thickness of the flat pattern is greater than or equal to the thickness of the optical path adjustment pattern.

[0026] Optionally, the orthographic projection of the optical path adjustment pattern onto the substrate does not overlap with the non-display area.

[0027] Optionally, the first sub-electrode includes a first transparent conductive layer, a reflective conductive layer, and a second transparent conductive layer stacked together, wherein the first transparent conductive layer is disposed close to the substrate;

[0028] The optical path adjustment pattern is disposed on the side of the second transparent conductive layer opposite to the substrate.

[0029] Optionally, the material of the second sub-electrode includes a transparent conductive material.

[0030] A second aspect of this application provides a method for manufacturing a display panel, the method comprising:

[0031] Provide substrate;

[0032] A first sub-electrode of a plurality of light-emitting devices is formed on one side of the substrate;

[0033] An optical path adjustment pattern is formed on the side of the first sub-electrode facing away from the substrate;

[0034] A second sub-electrode is formed on the side of the optical path adjustment pattern away from the substrate, and the first sub-electrode and the corresponding second sub-electrode are connected through a via provided on the optical path adjustment pattern;

[0035] The main material of the optical path adjustment pattern is a transparent organic material.

[0036] Optionally, in the step of forming an optical path adjustment pattern on the side of the first sub-electrode facing away from the substrate, the fabrication method includes:

[0037] A grayscale mask is used to form a photoresist layer on the side of the optical path adjustment pattern away from the first sub-electrode. The photoresist layer includes multiple photoresist patterns, and the thickness of the photoresist patterns on the light-emitting devices emitting different colors is different.

[0038] The photoresist pattern and part of the optical path adjustment pattern on each of the light-emitting devices emitting different colors are removed sequentially by a continuous ashing process, so that the thickness of the optical path adjustment pattern in the light-emitting devices emitting different colors is different.

[0039] A third aspect of this application provides a display device, including a display panel as provided in the first aspect of this application.

[0040] Beneficial effects:

[0041] This application provides a display panel and a method for fabricating the same. The display panel includes a substrate and an array of light-emitting devices. The array of light-emitting devices includes multiple light-emitting devices, each of which includes a first electrode and an optical path adjustment pattern. The first electrode includes a first sub-electrode and a second sub-electrode. The optical path adjustment pattern is located between the first sub-electrode and the second sub-electrode. The first sub-electrode and the second sub-electrode are connected by a via disposed on the optical path adjustment pattern. The main material of the optical path adjustment pattern is a transparent organic material. By forming an optical path adjustment pattern between the first sub-electrode and the second sub-electrode of the first electrode, light can be reflected at the position of the optical path adjustment pattern, thereby increasing the luminous brightness of the display panel. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the planar structure of a display panel according to an embodiment of this application;

[0044] Figure 2 yes Figure 1 Schematic diagram of the CC section;

[0045] Figure 3 This is a schematic diagram of the structure of a display panel including a first light-emitting device and a second light-emitting device according to an embodiment of this application;

[0046] Figure 4 This is a schematic diagram of the structure of a display panel comprising a first light-emitting device, a second light-emitting device, and a third light-emitting device according to an embodiment of this application;

[0047] Figure 5 This is a schematic diagram of a display panel with a raised optical path adjustment pattern according to an embodiment of this application;

[0048] Figure 6 This is a schematic diagram of the structure of a display panel that does not contain a flat pattern, according to an embodiment of this application;

[0049] Figure 7 This is a flowchart illustrating the steps of a method for manufacturing a display panel according to an embodiment of this application;

[0050] Figure 8This is a schematic diagram of the structure for fabricating the first sub-electrode and the transfer electrode in a method for fabricating a display panel according to an embodiment of this application;

[0051] Figure 9 This is a schematic diagram of the structure for completing the optical path adjustment pattern fabrication in a method for manufacturing a display panel according to an embodiment of this application;

[0052] Figure 10 This is a schematic diagram of the structure for completing the photoresist pattern fabrication in a method for fabricating a display panel according to an embodiment of this application;

[0053] Figure 11 This is a schematic diagram of the structure of a display panel fabrication method according to an embodiment of this application, which involves a continuous ashing process.

[0054] Figure 12 This is a schematic diagram of the structure for fabricating the second sub-electrode in a method for preparing a display panel according to an embodiment of this application. Detailed Implementation

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] In related technologies, the strong microcavity process involves creating ITO (indium tin oxide) of varying thicknesses on the anode using multiple masking processes. However, this process suffers from the problems of requiring numerous masking steps and the crystallization of ITO leading to induced crystallization of the upper ITO layer, making it impossible to etch.

[0057] In view of this, embodiments of this application propose a display panel and a method for manufacturing the same, with the aim of improving the brightness of the display panel.

[0058] Reference Figure 1 and Figure 2 As shown, this application discloses a display panel, which includes a substrate 10 and an array of light-emitting devices disposed on the substrate 10.

[0059] Specifically, refer to Figure 1 As shown, the display panel may include a display area AA and a non-display area BB located on at least one side of the display area AA. The display area AA is the area of ​​the display panel that emits light and displays image content, while the non-display area BB is the area of ​​the display panel that cannot emit light. This area is mostly the border area of ​​the display panel, while the light-emitting device array is set in the display area AA of the display panel.

[0060] The substrate 10 can be a flexible substrate or a rigid substrate. When the substrate 10 is a flexible substrate, the display panel can have properties such as bendability or flexibility; when the substrate 10 is a rigid substrate, the rigidity requirements of the display panel can be met; the specific performance of the substrate 10 is determined according to the actual needs of the product.

[0061] Additionally, the substrate 10 may include a single-layer structure or a multi-layer structure. For example, as shown... Figure 2 As shown, the substrate 10 may include a polyimide layer and a buffer layer 11 stacked sequentially; in other embodiments, the substrate 10 may also include multiple polyimide layers and buffer layers 11 stacked sequentially. The buffer layer 11 may be made of materials such as silicon nitride or silicon oxide to achieve the effect of blocking water and oxygen and blocking alkaline ions. It should be noted that the structure of the substrate 10 is not limited to this, and can be determined according to actual needs in specific applications.

[0062] The driving circuit layer 20 may include multiple thin-film transistors. For example, the driving circuit layer 20 may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C structure. Here, T represents a transistor, and the number preceding T indicates the number of transistors; C represents a capacitor, and the number preceding C indicates the number of capacitors.

[0063] For example, the thin-film transistors in the driving circuit layer 20 can be low-temperature polycrystalline silicon (LTPS) transistors, oxide transistors, or a combination of both. The active layer 21 of the LTPS transistor is made of low-temperature polycrystalline silicon (LTPS), and the active layer 21 of the oxide transistor is made of oxide semiconductor. LTPS transistors have advantages such as high mobility and fast charging, while oxide transistors have advantages such as low leakage current. When LTPS transistors and oxide transistors are integrated onto a single display panel, a low-temperature polycrystalline oxide (LTPO) display panel can be formed. Utilizing the advantages of both, the refresh rate of the display panel can be switched to achieve low-frequency driving, which helps reduce power consumption and improve display quality.

[0064] For example, the thin-film transistor in the driving circuit layer 20 can be a top-gate transistor, a bottom-gate transistor, or a dual-gate transistor. A dual-gate transistor includes an active layer 21 pattern and top-gate and bottom-gate patterns disposed on both sides of the active layer 21 pattern. By driving the active layer 21 pattern through the top-gate and bottom-gate patterns, the threshold voltage can be more easily controlled; simultaneously, carrier mobility can be improved. That is, compared to top-gate and bottom-gate transistors, dual-gate transistors have higher stability.

[0065] Reference Figure 2 As shown, the thin-film transistor can be a top-gate type, which may include an active layer 21, a gate insulating layer 22, a gate 23, an interlayer dielectric layer 24, a source 25, and a drain 26. Specifically, the active layer 21 may be formed on the buffer layer 11, the gate insulating layer 22 covers the buffer layer 11 and the active layer 21, the gate 23 is formed on the side of the gate insulating layer 22 away from the active layer 21, the interlayer dielectric layer 24 covers the gate insulating layer 22, and the source 25 and drain 26 are formed on the side of the interlayer dielectric layer 24 away from the substrate 10 and are located on opposite sides of the gate 23, respectively. The source 25 and drain 26 may contact the opposite sides of the active layer 21 through vias (e.g., metal vias). It should be understood that this thin-film transistor can also be a bottom-gate type.

[0066] The gate 22 may be made of metallic or alloy materials, such as molybdenum, aluminum, and titanium. The source 25 and drain 26 may be made of metallic or alloy materials, such as a single-layer or multi-layer metal structure formed of molybdenum, aluminum, and titanium. For example, the multi-layer structure is a multi-metal stack, such as a titanium, aluminum, and titanium three-layer metal stack (Al / Ti / Al).

[0067] In addition, refer to Figure 2 As shown, a light-shielding layer 12 can also be provided on the substrate 10. The light-shielding layer 12 is located between the substrate 10 and the buffer layer 11, and the orthographic projection of the light-shielding layer 12 on the substrate 10 coincides with the orthographic projection of the active layer 21 on the substrate 10. The light-shielding layer 12 can be made of metal or alloy materials, such as molybdenum, aluminum and titanium.

[0068] Reference Figure 2 As shown, the light-emitting device array includes a first electrode 31 and a pixel definition layer 32 sequentially formed on the interlayer dielectric layer 24. It should be understood that the display device may also include a light-emitting part 33 and a second electrode 34.

[0069] When the thin-film transistor in the display area AA is a top-gate type, a passivation layer 27 and a planarization layer 28 can be fabricated before fabricating the display device. The passivation layer 27 can be silicon nitride or silicon oxide, and the planarization layer 28 can be a single-layer structure or a multi-layer structure. The planarization layer 28 is usually made of organic materials, such as photoresist, acrylic polymers, silicon polymers, etc. As shown in the figure, the planarization layer 28 is formed between the passivation layer 27 and the first electrode 31. The first electrode 31 can be electrically connected to the drain 26 through a metal via, and the first electrode 31 can be the anode. The pixel definition layer 32 can cover the planarization layer 28. The pixel definition layer 32 can be made of organic materials, such as photoresist, and the portion of the pixel definition layer 32 located in the display area AA can have a pixel opening exposing the first electrode 31. The light-emitting part 33 is located in the pixel opening and formed on the first electrode 31. The light-emitting part 33 can include small molecule organic materials or polymer molecule organic materials and can emit fluorescence. The material or phosphorescent material can emit red, green, blue, or white light, etc.; and, depending on the actual needs, in different examples, the light-emitting part 33 can further include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer; the second electrode 31 covers the light-emitting part 33, and the polarity of the second electrode 34 is opposite to that of the first electrode 31; this second electrode 34 can be a cathode, and this cathode can be made of metal materials such as lithium (Li), aluminum (Al), magnesium (Mg), and silver (Ag).

[0070] It should be noted that, as Figure 2 As shown, the first electrode 31, the light-emitting part 33, and the second electrode 34 can constitute a light-emitting device. The portion of the display panel located in the display area AA can include multiple light-emitting devices arranged in an array. Furthermore, it should be noted that the first electrodes 31 of each light-emitting device are independent of each other, and the second electrodes 34 of each light-emitting device are connected across their entire surface; that is, the second electrode 34 is a full-surface structure disposed on the display panel, serving as a common electrode for multiple light-emitting devices.

[0071] as well as, Figure 2 The thin-film transistor within the light-emitting region AA1 is not shown in the figure. It can be understood that the first electrode 31 can be connected to the drain 26 in the corresponding thin-film transistor through a via through the planarization layer 28 and the passivation layer 27.

[0072] Reference Figure 2As shown in the embodiment of this application, the first electrode 31 includes a first sub-electrode 311 and a second sub-electrode 312. The first sub-electrode 311 is disposed between the second sub-electrode 312 and the substrate 10, and the second sub-electrode 312 is in direct contact with the light-emitting part 33. Simultaneously, an optical path adjustment pattern 40 is disposed between the first sub-electrode 311 and the second sub-electrode 312, and the first sub-electrode 311 and the second sub-electrode 312 are connected through vias disposed on the optical path adjustment pattern 40. The optical path adjustment pattern 40 is provided between the first sub-electrode 311 and the second sub-electrode 312.

[0073] It is understood that the optical path adjustment pattern 40 is formed by forming an optical path adjustment layer on the side of the first sub-electrode 311 facing away from the substrate 10, and then performing a patterning process on the optical path adjustment layer. The main material of the optical path adjustment pattern 40 is a transparent organic material, such as resin or polyimide (PI). The optical path adjustment pattern 40 formed using a transparent organic material can realize the reflection of light between the first sub-electrode 311 and the second sub-electrode 312, thereby improving the luminous brightness of the display panel.

[0074] Reference Figure 2 As shown, in one embodiment, in the orthographic projection of the substrate 10, the optical path adjustment pattern 40 completely covers the area of ​​the first sub-electrode 311 except for the via.

[0075] Specifically, the optical path adjustment pattern 40 covers the side of the first sub-electrode 311 facing away from the substrate 10 and each sidewall of the first sub-electrode 311, thus enclosing the first sub-electrode 311. This ensures that when light shines on the first sub-electrode 311 through its sidewalls, it also needs to pass through the optical path adjustment pattern 40, allowing for better reflection from the first sub-electrode 311 and improving the brightness of the display panel. Furthermore, it is understood that in practical applications, as long as the optical path adjustment pattern 40 covers most of the first sub-electrode 311, it can be considered as completely covering the area of ​​the first sub-electrode 311 except for the vias.

[0076] Reference Figure 2 As shown, in one embodiment, the optical path adjustment patterns 40 in two adjacent light-emitting devices are separated from each other.

[0077] Specifically, the first electrode 31 of the light-emitting device is independently set on the substrate, so the optical path adjustment pattern 40 is also independently set corresponding to the first electrode 31. Therefore, the optical path adjustment pattern 40 of each light-emitting device is separated from each other, which can also avoid crosstalk between the light-emitting devices through the optical path adjustment pattern 40.

[0078] In some embodiments, multiple light-emitting devices within the display area AA of the display panel can emit light of the same color. The display panel may also include a color filter layer disposed on the light-emitting side of the multiple light-emitting devices. For example, the multiple light-emitting devices emit light of colors such as white, red, green, or blue. In this case, the colored light emitted by the light-emitting devices is emitted as the same color after passing through the color filter layer, or is converted into other colors for emission. Thus, when multiple light-emitting devices emit light of the same color, the display panel can achieve multi-color light emission.

[0079] Alternatively, multiple light-emitting devices within the display area AA of the display panel can emit light of different colors. For example, multiple light-emitting devices may include a red light-emitting device that emits red light, a green light-emitting device that emits green light, and a blue light-emitting device that emits blue light, thereby achieving multi-color light output of the display panel.

[0080] Reference Figure 3 As shown, in one embodiment, the optical path adjustment pattern 40 located in light-emitting devices emitting different colors has a different thickness.

[0081] Specifically, light-emitting devices that emit different colors refer to light-emitting devices that emit different colors themselves, or light-emitting devices that emit different colors after being processed by the display panel. That is, these light-emitting devices may emit the same color initially, but after being converted by the color filter layer of the display panel, the colors they emit are different. For example, two light-emitting devices may both emit white light, but after being converted by the color filter layer, one light-emitting device emits red light and the other emits green light. These two light-emitting devices are also considered to emit light-emitting devices of different colors.

[0082] The thickness of the optical path adjustment pattern 40 refers to the size of the optical path adjustment pattern 40 in the light emission direction of the display panel. For example, one light-emitting device can emit red light and another light-emitting device can emit green light. Among these two light-emitting devices, the thickness of the optical path adjustment pattern 40 in the light-emitting device that emits red light can be greater than the thickness of the optical path adjustment pattern 40 in the light-emitting device that emits green light. In this way, a strong microcavity can be formed in the display panel, so that light is repeatedly reflected and refracted at the first sub-electrode 311 and the second sub-electrode 312, thereby better improving the luminous brightness of the display panel.

[0083] The thickness difference of the optical path adjustment pattern 40 can be achieved through the following process.

[0084] Specifically, refer to Figures 6-10As shown, after forming the first sub-electrode 311 of each light-emitting device, an optical path adjustment layer can be formed on the side of the first sub-electrode 311 away from the substrate 10, and the optical path adjustment layer is patterned to form an optical path adjustment pattern 40 with the same thickness corresponding to each first sub-electrode 311; then, a photoresist layer 50 is formed on the side of the optical path adjustment layer away from the substrate 10, and the photoresist layer is patterned to form multiple photoresist patterns 51 corresponding to the optical path adjustment pattern, and in this step, a grayscale mask can be used to form photoresist patterns 51 with different thicknesses on light-emitting devices emitting different colors; then, the photoresist patterns 51 and part of the optical path adjustment pattern 40 on each light-emitting device emitting different colors are removed sequentially by a continuous graying process; in this process, the optical path adjustment patterns 40 of light-emitting devices emitting different colors can be made to have different thicknesses.

[0085] Reference Figure 3 As shown, in one embodiment, the light-emitting device array may include a first light-emitting device emitting a first color and a second light-emitting device emitting a second color, and the display panel includes a first optical path adjustment pattern 41 and a second optical path adjustment pattern 42, wherein the first optical path adjustment pattern 41 is located in the first light-emitting device and the second optical path adjustment pattern 42 is located in the second light-emitting device.

[0086] Specifically, in this embodiment, the thickness of the first optical path adjustment pattern 41 is greater than the thickness of the second optical path adjustment pattern 42, and the percentage by which the size of the first optical path adjustment pattern 41 exceeds the size of the second optical path adjustment pattern 42 is greater than or equal to 20% and less than or equal to 25%. This percentage refers to the percentage of the thickness of the portion of the first optical path adjustment pattern 41 that is greater than the second optical path adjustment pattern 42 relative to the thickness of the first optical path adjustment pattern 41.

[0087] For example, when the thickness of the first optical path adjustment pattern 41 is 1.00 μm, the thickness of the second optical path adjustment pattern 42 is greater than or equal to 0.75 μm and less than or equal to 0.80 μm. Here, 0.75 μm corresponds to the maximum percentage by which the size of the first optical path adjustment pattern 41 exceeds the size of the second optical path adjustment pattern 42, and 0.80 μm corresponds to the minimum percentage by which the size of the first optical path adjustment pattern 41 exceeds the size of the second optical path adjustment pattern 42.

[0088] Reference Figure 4As shown, in one embodiment, the light-emitting device array may include a first light-emitting device emitting a first color, a second light-emitting device emitting a second color, and a third light-emitting device emitting a third color. The display panel includes a first optical path adjustment pattern 41, a second optical path adjustment pattern 42, and a third optical path adjustment pattern 43, wherein the first optical path adjustment pattern 41 is located in the first light-emitting device, the second optical path adjustment pattern 42 is located in the second light-emitting device, and the third optical path adjustment pattern 43 is located in the third light-emitting device.

[0089] Specifically, the thickness of the first optical path adjustment pattern 41 is greater than the thickness of the second optical path adjustment pattern 42, and the thickness of the second optical path adjustment pattern 42 is greater than the thickness of the third optical path adjustment pattern 43. The first color can be red, the second color can be green, and the third color can be blue; or, the first color can be green, the second color can be blue, and the third color can be red; or, the first color can be blue, the second color can be red, and the third color can be green.

[0090] Furthermore, in this embodiment, the thicknesses among the first optical path adjustment pattern 41, the second optical path adjustment pattern 42, and the third optical path adjustment pattern 43 satisfy the following: the percentage by which the size of the first optical path adjustment pattern 41 exceeds the size of the second optical path adjustment pattern 42 is greater than or equal to 20% and less than or equal to 25%; the percentage by which the size of the second optical path adjustment pattern 42 exceeds the size of the third optical path adjustment pattern 43 is greater than or equal to 20% and less than or equal to 25%.

[0091] For example, when the thickness of the first optical path adjustment pattern 41 is 1.00 μm, the thickness of the second optical path adjustment pattern 42 is greater than or equal to 0.75 μm and less than or equal to 0.80 μm. Here, 0.75 μm corresponds to the maximum percentage by which the size of the first optical path adjustment pattern 41 exceeds the size of the second optical path adjustment pattern 42, and 0.80 μm corresponds to the minimum percentage by which the size of the first optical path adjustment pattern 41 exceeds the size of the second optical path adjustment pattern 42. When the thickness of the second optical path adjustment pattern 42 is 0.80 μm, the thickness of the second optical path adjustment pattern 42 is greater than or equal to 0.60 μm and less than or equal to 0.64 μm. Here, 0.60 μm corresponds to the maximum percentage by which the size of the second optical path adjustment pattern 42 exceeds the size of the third optical path adjustment pattern 43, and 0.64 μm corresponds to the minimum percentage by which the size of the second optical path adjustment pattern 42 exceeds the size of the third optical path adjustment pattern 43.

[0092] In one embodiment, the optical path adjustment patterns 40 located in light-emitting devices emitting the same color have approximately the same thickness.

[0093] Specifically, light-emitting devices that emit the same color refer to light-emitting devices that emit the same light themselves, or light-emitting devices that emit the same color as the light displayed on the panel. For example, if two light-emitting devices both emit white light, and after being converted by the color filter layer, both light-emitting devices emit red light, these two light-emitting devices are considered to emit the same color.

[0094] It is understandable that during the process of sequentially removing the photoresist pattern 51 and part of the optical path adjustment pattern 40 on each light-emitting device emitting different colors through the continuous ashing process, the thickness of the photoresist pattern 51 on the light-emitting devices emitting the same color is the same. Therefore, after continuous ashing, the optical path adjustment pattern 40 in the light-emitting devices emitting the same color is also roughly the same.

[0095] It should be noted that in practical applications, due to manufacturing process reasons, even light-emitting devices that emit the same color may have a thickness difference of up to 10% in the optical path adjustment pattern 40. Therefore, as long as the thickness difference of the optical path adjustment pattern 40 in light-emitting devices that emit the same color is within 10%, they can be regarded as having roughly the same thickness.

[0096] Reference Figure 5 As shown, in one embodiment, the optical path adjustment pattern 40 has a plurality of protrusions 60 formed on the surface away from the first sub-electrode 311. The protrusions 60 protrude in a direction away from the substrate, and at least two of the protrusions 60 have different heights.

[0097] Specifically, during the process of sequentially removing the photoresist pattern 51 and part of the optical path adjustment pattern 40 on each light-emitting device emitting different colors through a continuous ashing process, since the optical path adjustment pattern 40 on some light-emitting devices is also etched, multiple protrusions 60 will be formed on the surface of these optical path adjustment patterns 40. These protrusions 60 increase the roughness of the surface of the optical path adjustment pattern 40, thereby increasing the adhesion between the optical path adjustment pattern 40 and the second sub-electrode 312, and increasing the reflection and refraction of light at the interface between the optical path adjustment pattern 40 and the second sub-electrode 312, so as to better improve the luminous brightness of the display panel.

[0098] Understandably, since these protrusions 60 are formed during the ashing and dry etching process of the optical path adjustment pattern 40, they are irregularly arranged on the optical path adjustment pattern, and their heights vary. The height of the protrusion 60 refers to its dimension in the light-emitting direction of the display panel.

[0099] However, among these protrusions, the difference between the tallest protrusion 60 and the shortest protrusion 60 is less than or equal to 15nm. This allows the surface roughness of the optical path adjustment pattern 40 to be controlled within a certain range, so as to avoid the surface roughness of the optical path adjustment pattern 40 being too small or too large, which would affect the adhesion between the optical path adjustment pattern 40 and the second sub-electrode 312.

[0100] Reference Figure 2 As shown, in one embodiment, the display area AA may include a light-emitting area AA1 and a non-light-emitting area AA2, and the light-emitting device is located in the light-emitting area AA1. Meanwhile, the display panel includes a transfer electrode 70 in the non-light-emitting area AA2. The transfer electrode 70 is disposed on the same layer as the first sub-electrode 311 and is connected to it.

[0101] Specifically, the light-emitting area AA1 within the display area AA refers to the region in the display area that emits light, while the non-light-emitting area AA2 refers to the region in the display area AA that does not emit light (e.g., the gap between light-emitting devices). The transfer electrode 70 disposed within the non-light-emitting area AA2 can be connected to the drain 26 in the thin-film transistor for signal transmission. The transfer electrode 70 and the first electrode 311 can be formed using the same material in the same step, and the transfer electrode 70 can be interconnected with the first sub-electrode 311. It is understood that in... Figure 2 Only one transfer electrode 70 is shown in the figure for illustration. In actual practice, multiple transfer electrodes 70 are also provided in the non-light-emitting area AA2.

[0102] Reference Figure 2 As shown, in this embodiment, the display panel also includes a flat pattern 80 in the non-light-emitting area AA2. The flat pattern 80 is disposed on the same layer as the optical path adjustment pattern 40, and the flat pattern 80 is located on the side of the transfer electrode 70 facing away from the substrate 10. It is understood that during the formation of the optical path adjustment pattern 40, patterns are also formed in the non-light-emitting area AA2 of the display panel. These patterns can be used as the flat pattern 70, thereby enabling better formation of film layers such as the pixel definition layer 32 in subsequent processes.

[0103] Furthermore, within the non-light-emitting area AA2, the thickness of the flat pattern 80 remains consistent at different locations; that is, within the non-light-emitting area AA2, the thickness of the flat pattern 80 is constant. The thickness of the flat pattern 80 is also its dimension in the light-emitting direction of the display panel. This reduces the steps required to form the optical path adjustment pattern 40, thereby further simplifying the manufacturing process of the display panel.

[0104] Reference Figure 2 As shown, in one embodiment, the thickness of the flat pattern 80 can be greater than or equal to the thickness of the optical path adjustment pattern 40.

[0105] Specifically, since the optical path adjustment patterns 40 located on the light-emitting devices emitting different colors are different, but the thickness of the flat pattern 80 remains constant, for some of the optical path adjustment patterns 40, the thickness of the flat pattern 80 is greater than the thickness of the optical path adjustment pattern 40; for other parts of the optical path adjustment patterns 40, the thickness of the flat pattern 80 is equal to the thickness of the optical path adjustment pattern 40. However, it should be noted that the thickness of the flat pattern 80 is the same as the maximum thickness of the optical path adjustment pattern 40, and the flat pattern 80 can be connected to the optical path adjustment pattern 40 with the maximum thickness.

[0106] Reference Figure 6 As shown, in one embodiment, a flat pattern 80 may not be formed in the non-light-emitting area AA2; this can better isolate some light-emitting devices, thereby avoiding crosstalk between light-emitting devices and affecting the display effect of the display panel.

[0107] Reference Figure 2 As shown, in one embodiment, the orthographic projection of the optical path adjustment pattern 40 on the substrate 10 does not overlap with the non-display area BB. That is, in this embodiment, the optical path adjustment pattern 40 is not provided in the non-display area BB of the display panel. Since the optical path adjustment pattern 40 is made of organic material, and the non-display area BB is usually located at the edge of the display panel, water and oxygen may invade the light-emitting device through the optical path adjustment pattern in the non-display area BB, causing the light-emitting device to fail. By not providing the optical path adjustment pattern 40 in the non-display area BB, this situation can be reduced, thereby improving the yield of the display panel.

[0108] Reference Figure 8 As shown, in one embodiment, the first sub-electrode 311 includes a first transparent conductive layer 3111, a reflective conductive layer 3112, and a second transparent conductive layer 3113 stacked together.

[0109] Specifically, the first transparent conductive layer 3111 is disposed close to the substrate, and the optical path adjustment pattern 40 is disposed on the side of the second transparent conductive layer 3113 facing away from the substrate 10. The materials of the first transparent conductive layer 3111 and the second transparent conductive layer 3113 may include ITO (indium tin oxide), and the material of the reflective conductive layer 3112 may include Ag. Disposing the optical path adjustment pattern 40 on the side of the second transparent conductive layer 3113 facing away from the substrate 10 allows for easier control of the thickness of the optical path adjustment pattern 40.

[0110] Meanwhile, the material of the second sub-electrode 312 includes a transparent conductive material to ensure that light can pass through the second sub-electrode 312. The material of the second sub-electrode 312 may include ITO.

[0111] Figure 7 A flowchart illustrating the steps of a method for fabricating a display panel is shown. (Refer to...) Figure 7 As shown in the figure, this application discloses a method for manufacturing a display panel, the method comprising:

[0112] Step 201: Provide substrate 10.

[0113] Specifically, the substrate 10 can be a flexible substrate or a rigid substrate. When the substrate 10 is a flexible substrate, the display panel can have properties such as being bendable or flexible; when the substrate 10 is a rigid substrate, the rigidity requirements of the display panel can be met; the specific performance of the substrate 10 is determined according to the actual needs of the product.

[0114] This step may also include the formation of the drive circuit layer 20.

[0115] Step 202: Form the first sub-electrode 311 of a plurality of light-emitting devices on one side of the substrate 10.

[0116] Specifically, the first sub-electrode 311 includes a first transparent conductive layer 3111, a reflective conductive layer 3112, and a second transparent conductive layer 3113 stacked together. The first transparent conductive layer 3111 is disposed close to the substrate, and the optical path adjustment pattern 40 is disposed on the side of the second transparent conductive layer 3113 facing away from the substrate 10. The materials of the first transparent conductive layer 3111 and the second transparent conductive layer 3113 may include ITO (indium tin oxide), and the material of the reflective conductive layer 3112 may include Ag, such as... Figure 8 As shown.

[0117] Step 203: Form an optical path adjustment pattern 40 on the side of the first sub-electrode 311 away from the substrate 10.

[0118] Specifically, the optical path adjustment pattern 40 covers the side of the first sub-electrode 311 facing away from the substrate 10 and each sidewall of the first sub-electrode 311, thus enclosing the first sub-electrode 311. This ensures that when light shines on the first sub-electrode 311 through its sidewalls, it also needs to pass through the optical path adjustment pattern 40, allowing for better reflection from the first sub-electrode 311 and improving the brightness of the display panel. The material of the optical path adjustment pattern 40 can include transparent organic materials, such as resin or polyimide. Furthermore, through-holes are formed in the optical path adjustment pattern 40, such as... Figure 9 As shown.

[0119] Step 204: Form a second sub-electrode 312 on the side of the optical path adjustment pattern 40 facing away from the substrate 10.

[0120] Specifically, the first sub-electrode 311 and the corresponding second sub-electrode 312 are connected via a via provided on the optical path adjustment pattern 40. The material of the second sub-electrode 312 includes a transparent conductive material to ensure that light can pass through the second sub-electrode 312. The material of the second sub-electrode 312 may include ITO, such as... Figure 12 As shown.

[0121] The display panel prepared by the above method can achieve the reflection of light between the first sub-electrode 311 and the second sub-electrode 312 by using the optical path adjustment pattern 40 formed by transparent organic material, thereby improving the luminous brightness of the display panel.

[0122] In one embodiment, step 203, the preparation method includes:

[0123] Step 2031: Using a grayscale mask, a photoresist layer 50 is formed on the side of the optical path adjustment pattern 40 that is away from the first sub-electrode 311.

[0124] Specifically, the photoresist layer 50 includes multiple photoresist patterns 51, each corresponding one-to-one with an optical path adjustment pattern 40, and the photoresist patterns 51 on the light-emitting devices emitting different colors have different thicknesses. For example, one light-emitting device can emit red light, and another can emit green light. In these two light-emitting devices, the thickness of the photoresist pattern 51 in the red-emitting device is greater than the thickness of the photoresist pattern 51 in the green-emitting device. It is understood that in step 2031, all optical path adjustment patterns 40 have the same thickness. Figure 10 As shown.

[0125] Step 2032: The photoresist pattern 51 and part of the optical path adjustment pattern 40 on each light-emitting device emitting different colors are removed sequentially by a continuous ashing process.

[0126] Specifically, when the light-emitting device array includes a first light-emitting device emitting a first color, a second light-emitting device emitting a second color, and a third light-emitting device emitting a third color, the thickness of the photoresist pattern 51 on the first light-emitting device is greater than the thickness of the photoresist pattern 51 on the second light-emitting device, and the thickness of the photoresist pattern 51 on the second light-emitting device is greater than the thickness of the photoresist pattern 51 on the third light-emitting device. In this embodiment, the thickness of the photoresist pattern 51 on the third light-emitting device is 0.

[0127] In the first ashing process, since no photoresist pattern 51 is set on the third light-emitting device, the optical path adjustment pattern 40 on the third light-emitting device is directly etched away, and the photoresist pattern 51 on the second light-emitting device and part of the photoresist pattern 51 on the first light-emitting device are also removed. In the second ashing process, since there is no photoresist pattern 51 on either the second or third light-emitting device, the optical path adjustment pattern 40 on both the second and third light-emitting devices is directly etched away, and the photoresist pattern 51 on the first light-emitting device is also removed. Figure 11 As shown.

[0128] In this way, optical path adjustment patterns 40 of different thicknesses can be formed on light-emitting devices that emit different colors, thereby forming a strong microcavity structure, which allows light to be repeatedly reflected and refracted between the first sub-electrode 311 and the second sub-electrode 312, thereby improving the brightness of the display panel.

[0129] Based on the same inventive concept, embodiments of this application disclose a display device, including any of the display panels described above in the embodiments of this application.

[0130] Specifically, the display device may include computer monitors, televisions, billboards, laser printers with display functions, telephones, mobile phones, personal digital assistants (PDAs), laptops, digital cameras, portable camcorders, viewfinders, vehicles, large walls, theater screens, or stadium signs, etc.

[0131] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0132] It should also be noted that, in this document, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as indicating or implying relative importance. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. In the absence of further restrictions, an element defined by the phrase "includes a..." does not preclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0133] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand this application, and the content of this specification should not be construed as a limitation of this application. Furthermore, for those skilled in the art, there will be different forms of changes in the specific implementation methods and application scope based on this application. It is neither necessary nor possible to exhaustively list all implementation methods here, and obvious changes or modifications derived therefrom are still within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area located on at least one side of the display area. The display panel includes: Substrate; and An array of light-emitting devices is disposed on one side of the substrate, located in the display area. The array of light-emitting devices includes multiple light-emitting devices, each of which includes a first electrode and an optical path adjustment pattern. The first electrode includes a first sub-electrode and a second sub-electrode. The first sub-electrode is located between the second sub-electrode and the substrate. The optical path adjustment pattern is located between the first sub-electrode and the second sub-electrode. The first sub-electrode and the second sub-electrode are connected by a via disposed on the optical path adjustment pattern. The main material of the optical path adjustment pattern is a transparent organic material.

2. The display panel according to claim 1, characterized in that: The optical path adjustment patterns located in the light-emitting devices that emit different colors have different thicknesses.

3. The display panel according to claim 1, characterized in that: The optical path adjustment patterns located in the light-emitting devices that emit the same color have approximately the same thickness.

4. The display panel according to claim 1, characterized in that: In the orthographic projection onto the substrate, the optical path adjustment pattern completely covers the area of ​​the first sub-electrode except for the via.

5. The display panel according to claim 1, characterized in that: The optical path adjustment patterns in two adjacent light-emitting devices are separated from each other.

6. The display panel according to claim 1, characterized in that: The light-emitting device array includes a first light-emitting device that emits a first color and a second light-emitting device that emits a second color; The display panel includes a first optical path adjustment pattern and a second optical path adjustment pattern, wherein the first optical path adjustment pattern is located in a first light-emitting device and the second optical path adjustment pattern is located in a second light-emitting device; The thickness of the first optical path adjustment pattern is greater than the thickness of the second optical path adjustment pattern.

7. The display panel according to claim 6, characterized in that: The percentage by which the size of the first optical path adjustment pattern exceeds the size of the second optical path adjustment pattern is greater than or equal to 20% and less than or equal to 25%.

8. The display panel according to claim 1, characterized in that: The light-emitting device array includes a first light-emitting device emitting a first color, a second light-emitting device emitting a second color, and a third light-emitting device emitting a third color; The display panel includes a first optical path adjustment pattern, a second optical path adjustment pattern, and a third optical path adjustment pattern. The first optical path adjustment pattern is located in a first light-emitting device, the second optical path adjustment pattern is located in a second light-emitting device, and the third optical path adjustment pattern is located in a third light-emitting device. The thickness of the first optical path adjustment pattern is greater than the thickness of the second optical path adjustment pattern, and the thickness of the second optical path pattern is greater than the thickness of the third optical path pattern.

9. The display panel according to claim 1, characterized in that: The optical path adjustment pattern has multiple protrusions formed on the surface away from the first sub-electrode. The protrusions protrude in a direction away from the substrate, and at least two of the protrusions have different heights.

10. The display panel according to claim 11, characterized in that: The protrusions are irregularly arranged on the optical path adjustment pattern.

11. The display panel according to claim 11, characterized in that: The difference between the height of the largest protrusion and the height of the smallest protrusion among the plurality of protrusions is less than or equal to 15 nm.

12. The display panel according to claim 1, characterized in that: The display area includes a light-emitting area and a non-light-emitting area. The light-emitting device is located in the light-emitting area. The non-light-emitting area includes a transfer electrode. The transfer electrode is disposed on the same layer as the first sub-electrode and is connected to it. The display panel further includes: a flat pattern located in the non-light-emitting area, the flat pattern being disposed on the same layer as the optical path adjustment pattern, and the flat pattern being located on the side of the transfer electrode away from the substrate; Within the non-light-emitting area, the thickness of the flat pattern remains consistent at different locations.

13. The display panel according to claim 12, characterized in that: The thickness of the flat pattern is greater than or equal to the thickness of the optical path adjustment pattern.

14. The display panel according to claim 1, characterized in that: The orthographic projection of the optical path adjustment pattern on the substrate does not overlap with the non-display area.

15. The display panel according to claim 1, characterized in that: The first sub-electrode includes a first transparent conductive layer, a reflective conductive layer, and a second transparent conductive layer stacked together, wherein the first transparent conductive layer is disposed close to the substrate; The optical path adjustment pattern is disposed on the side of the second transparent conductive layer opposite to the substrate.

16. The display panel according to claim 1, characterized in that: The material of the second sub-electrode includes a transparent conductive material.

17. A method for manufacturing a display panel, characterized in that, The preparation method includes: providing a substrate; A first sub-electrode of a plurality of light-emitting devices is formed on one side of the substrate; An optical path adjustment pattern is formed on the side of the first sub-electrode facing away from the substrate; A second sub-electrode is formed on the side of the optical path adjustment pattern away from the substrate, and the first sub-electrode and the corresponding second sub-electrode are connected through a via provided on the optical path adjustment pattern; The main material of the optical path adjustment pattern is a transparent organic material.

18. The preparation method according to claim 17, characterized in that, In the step of forming an optical path adjustment pattern on the side of the first sub-electrode away from the substrate, the fabrication method includes: A grayscale mask is used to form a photoresist layer on the side of the optical path adjustment pattern away from the first sub-electrode. The photoresist layer includes multiple photoresist patterns, and the thickness of the photoresist patterns on the light-emitting devices emitting different colors is different. The photoresist pattern and part of the optical path adjustment pattern on each of the light-emitting devices emitting different colors are removed sequentially by a continuous ashing process, so that the thickness of the optical path adjustment pattern in the light-emitting devices emitting different colors is different.

19. A display device, characterized in that, Includes the display panel as described in any one of claims 1-16.

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