Substrate processing device
By incorporating a sealing device and a drainage section in the substrate processing apparatus, the processing liquid is discharged in a timely manner, and a protective gas is used to isolate the annular gap, thus solving the problems of processing liquid leakage and particulate matter contamination, improving product yield and reducing maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2025-09-25
- Publication Date
- 2026-04-17
AI Technical Summary
During substrate processing, the processing fluid leaks through the annular gaps, corroding equipment components, and particulate matter in the external gas contaminates the substrate through the annular gaps, resulting in decreased product yield and increased maintenance costs.
A substrate processing apparatus is designed, including a sealing device and a sealed connection between the driving device and the back spray assembly. A drain section and a collection space are provided. The processing liquid is discharged in a timely manner through the drain section, and a protective gas is used to isolate the annular gap from the outside world to prevent particulate matter from contaminating the substrate.
It effectively prevents the processing fluid from corroding equipment components, reduces external particulate matter contamination of the substrate, improves product yield, and reduces machine maintenance costs.
Smart Images

Figure CN120878605B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing equipment, and more specifically, to a substrate processing apparatus. Background Technology
[0002] Single-substrate cleaning equipment is typically used for cleaning single substrates. During the process, the substrate is held on a substrate stage, which is fixedly connected to a rotating shaft. The rotating shaft drives the substrate stage to rotate, and a treatment solution is sprayed onto the rotating substrate. In some processes, the single-substrate cleaning equipment also has a central channel that runs along the axis of the rotating shaft through the substrate stage and the rotating shaft. In some processes, treatment solution needs to be sprayed not only onto the front side of the substrate but also onto the back side to remove impurities and contaminants from the substrate surface. Back-side spraying is accomplished through back nozzles. These back nozzles are typically located in a back spray assembly beneath the substrate, coaxially inserted into the central channel with an annular gap between them.
[0003] During the manufacturing process, the processing liquid sprayed onto the back of the substrate by the back nozzle may flow into the annular gap and exit from the lower end of the gap. If not treated promptly, this can corrode components below the annular gap. Furthermore, since the annular gap is connected to the outside environment, particulate matter from the outside gas may also enter the annular gap from its lower end and then reach the back of the substrate, thus contaminating the substrate.
[0004] Therefore, it is necessary to propose a new substrate processing device that can not only prevent the processing liquid from leaking through the annular gap and damaging the equipment components, but also prevent particulate matter in the external gas from contaminating the substrate through the annular gap, thereby improving product yield and reducing machine maintenance costs. Summary of the Invention
[0005] The purpose of this application is to provide a substrate processing apparatus to solve the problems of processing liquid leaking through annular gaps and corroding other devices during substrate processing, and particulate matter in the external gas contaminating the substrate through the annular gaps.
[0006] To achieve the above objectives, according to one embodiment of this application, a substrate processing apparatus is provided, comprising:
[0007] A substrate stage, used to support a substrate;
[0008] The driving device includes a rotating shaft, which is coaxially and fixedly connected to the substrate stage and located below the substrate stage. The driving device is used to drive the substrate stage to rotate.
[0009] The middle channel is a hollow channel that runs through the substrate stage and the rotation axis along the axis of rotation.
[0010] The back spray assembly is coaxially inserted through the central channel, forming an annular gap with the central channel; and
[0011] A sealing device is sealed to the bottom of the drive unit and the back spray assembly. The sealing device includes a drain section and a collection space. The drain section is used to drain the treatment liquid in the collection space. The collection space is in communication with the annular gap and is used to receive the treatment liquid from the annular gap.
[0012] In some embodiments, the drainage section is configured to be intermittently open to intermittently discharge the treatment liquid in the collection space.
[0013] In some embodiments, the drain section includes:
[0014] drain pipe;
[0015] The first switch valve is installed on the drain pipe to control the opening and closing of the drain pipe and to isolate the collection space from the outside.
[0016] A liquid level sensor is used to detect the liquid level in the collection space;
[0017] The controller is configured to: when the liquid level signal detected by the liquid level sensor reaches a predetermined liquid level threshold, open the first switching valve to open the drain pipe, and close the first switching valve after a predetermined time to block the drain pipe.
[0018] In some embodiments, the sealing device further includes a main structure, which is sealed to the bottom of the drive device and the back spray assembly to form a collection space, which is in communication with the drain section. A drainage slope is provided in the main structure to guide the treatment liquid to the drain section.
[0019] In some embodiments, the substrate stage is provided with an upwardly protruding baffle portion, which surrounds the periphery of the annular gap to prevent the processing liquid on the substrate stage from flowing into the annular gap.
[0020] In some embodiments, the back spray assembly includes a hollow shaft, a sealing cover, and an air supply section. The sealing cover is disposed at the upper end of the hollow shaft, and the hollow shaft is also provided with a plurality of inclined upward first exhaust ports. The plurality of first exhaust ports are distributed circumferentially along the hollow shaft. The air supply section is connected to the lower end of the hollow shaft and is used to introduce protective gas into the hollow shaft so that the protective gas is discharged through the first exhaust ports and enters the annular gap, and then discharged from the upper port of the annular gap.
[0021] In some embodiments, the back spray assembly includes a hollow shaft, a sealing cover, and an air supply section. The sealing cover is disposed at the upper end of the hollow shaft, and the hollow shaft is also provided with a plurality of downwardly inclined second exhaust ports. The plurality of second exhaust ports are distributed circumferentially along the hollow shaft. The air supply section is connected to the lower end of the hollow shaft and is used to introduce protective gas into the hollow shaft so that the protective gas is discharged through the second exhaust ports and enters the annular gap, and then enters the collection space from the annular gap.
[0022] In some embodiments, the sealing device further includes an exhaust section for discharging gas from the collection space. The exhaust section includes an exhaust pipe and a second switching valve. The second switching valve is configured to: open when the gas supply section introduces protective gas into the hollow shaft, so that the protective gas is discharged through the exhaust pipe; and close when the gas supply section stops introducing protective gas into the hollow shaft, so as to prevent external gas from entering the sealing device through the exhaust pipe.
[0023] In some embodiments, the hollow shaft is further provided with a plurality of upwardly inclined first exhaust ports, which are distributed circumferentially along the hollow shaft and are located above the second exhaust ports.
[0024] The substrate processing apparatus proposed in this application includes a sealing device that is sealed to the bottom of the driving device and the back spray assembly. The sealing device also includes a drain section and a collection space. The collection space communicates with the annular gap, allowing the processing liquid flowing from the annular gap into the collection space to be promptly discharged through the drain section, thereby preventing corrosion of the device by the processing liquid. Simultaneously, the sealing device isolates the annular gap from the outside environment, preventing particulate matter in the external gas from entering the cavity through the annular gap and contaminating the substrate, thus improving product yield. Attached Figure Description
[0025] The above and other features, properties and advantages of this application will become more apparent from the following description taken in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always denote the same features, wherein:
[0026] Figure 1 This is a cross-sectional schematic diagram of a substrate processing apparatus provided in an embodiment of this application;
[0027] Figure 2 This is a cross-sectional schematic diagram of a partial structure of a sealing device provided in an embodiment of this application; and,
[0028] Figure 3 This is a schematic diagram of a substrate stage provided in an embodiment of this application. Detailed Implementation
[0029] The following specific embodiments illustrate the embodiments of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with preferred embodiments, this does not mean that the features of this invention are limited to those embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.
[0030] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. The technical solutions of this application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0032] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0033] See Figure 1 , Figure 1This is a cross-sectional schematic diagram of a substrate processing apparatus provided in an embodiment of this application. Figure 1 As shown, this application provides a substrate processing apparatus including a substrate stage 100, a driving device 200, an intermediate channel 300, and a back spray assembly 400. The substrate stage 100 is used to support a substrate 110. The driving device 200 includes a rotating shaft 210, which is coaxially fixedly connected to the substrate stage 100 and located below the substrate stage 100. The driving device 200 is used to drive the substrate stage 100 to rotate. The intermediate channel 300 is a hollow channel passing through the substrate stage 100 and the rotating shaft 210 along the axis of the rotating shaft 210. In some embodiments, a first channel is formed on the substrate stage 100, a second channel is formed on the rotating shaft 210, and the intermediate channel 300 is a combination of the first channel and the second channel. In some embodiments, the intermediate channel 300 is disposed within the first channel and the second channel. The back spray assembly 400 is coaxially disposed through the intermediate channel 300, forming an annular gap 310 between itself and the inner wall of the intermediate channel 300. In some embodiments, the back spray assembly 400 is provided with a back nozzle located on the sealing cap 420 (described later) for spraying a treatment liquid onto the back side of the substrate 110.
[0034] The substrate processing apparatus also includes a sealing device 500. The sealing device 500 is sealingly connected to the bottom of the drive device 200 and the back spray assembly 400 to seal the lower end of the annular gap 310. The sealing device also includes a drain section 510 and a collection space 530. The drain section 510 is used to drain the processing liquid within the sealing device 500. The collection space 530 communicates with the annular gap 310 and is used to receive the processing liquid from the annular gap 310. After the processing liquid sprayed onto the back side of the substrate 110 splashes back onto the substrate stage 100, it flows into the annular gap 310 and from the lower end of the annular gap 310 into the collection space 530, and is then promptly discharged through the drain section 510 to prevent other devices from being corroded by the processing liquid. Simultaneously, the sealing device 500 also prevents particulate matter in the external gas from reaching the back side of the substrate 110 through the annular gap 310 and contaminating the substrate 110.
[0035] In some embodiments, the drive device 200 further includes a motor stator 220. The motor stator 220 surrounds the outer periphery of the rotating shaft 210. The sealing device 500 is sealed to the motor stator 220 and the back spray assembly 400. In some embodiments, a first sealing ring 600 is provided at the junction of the sealing device 500 and the motor stator 220, and a second sealing ring 700 is provided at the junction of the sealing device 500 and the back spray assembly 400. The first sealing ring 600 and the second sealing ring 700 are used to isolate external gases. During the rotation of the rotating shaft 210, the motor stator 220 and the back spray assembly 400 are in a relatively stationary state. Therefore, sealing the sealing device 500 to the motor stator 220 and the back spray assembly 400 effectively avoids wear of the sealing device 500 during the process and improves the sealing effect.
[0036] In some embodiments, the drain section 510 is configured to be intermittently open to intermittently discharge the processing liquid in the collection space 530. If the drain section 510 is in an open state for a long time, particulate matter in the outside air may enter the sealing device 500 through the drain section 510, thereby contaminating the substrate 110 through the annular gap 310. In order to prevent particulate matter from contaminating the substrate 110, the drain section 510 is configured to be intermittently open. When the processing liquid accumulated in the drain section 510 reaches a certain amount, the drain section 510 is opened to discharge the processing liquid, and the drain section 510 is closed after the discharge to prevent particulate matter in the outside air from entering the collection space 530 through the drain section 510.
[0037] In some embodiments, such as Figure 1 To ensure timely discharge of the processing fluid from the sealing device 500, the drainage section 510 includes a drainage pipe 511, a first switching valve 512, a liquid level sensor 513, and a controller 514. The first switching valve 512 is disposed on the drainage pipe 511 and controls the opening and closing of the drainage pipe 511, thus isolating the collection space 530 from the outside environment. The liquid level sensor 513 detects the liquid level within the collection space 530. In some embodiments, the liquid level sensor 513 is disposed on the drainage pipe 511. The controller 514 is configured to: open the first switching valve 512 to open the drainage pipe 511 when the liquid level signal detected by the liquid level sensor 513 reaches a predetermined liquid level threshold, and close the first switching valve 512 to block the drainage pipe 511 after a predetermined time. By installing a first switching valve 512 on the drain pipe 511, when the liquid level signal detected by the liquid level sensor 513 does not reach the predetermined liquid level threshold, the first switching valve 512 is in a closed state, isolating the collection space 530 from the outside atmosphere and preventing outside gas from entering the collection space 530 through the drain pipe 511. When the processed liquid accumulates in the drain pipe 511 and the liquid level reaches the predetermined liquid level threshold, the controller 514 controls the first switching valve 512 to open, so as to drain the processed liquid in the drain pipe 511. After the processed liquid is drained, the controller controls the first switching valve 512 to close in time, isolating the collection space 530 from the outside gas and preventing the substrate 110 from being contaminated by particulate matter in the gas.
[0038] In some embodiments, such as Figure 1 and Figure 2As shown, the sealing device 500 also includes a main structure 520. The main structure 520 is sealed to the bottom of the drive device 200 and the back spray assembly 400 to form a collection space 530. A guide slope 521 is provided inside the main structure 520 to guide the treatment liquid to the drain section 510, thereby discharging the treatment liquid in a timely manner. When the treatment liquid flows into the collection space 530 from the annular gap 310, if it cannot be discharged in time, excessive residual treatment liquid may corrode the drive device 200 and other components. Therefore, it is necessary to guide the treatment liquid to the drain section 510 and discharge it in a timely manner through the drain section 510. This application provides a guide slope 521 with a certain inclination angle inside the sealing device 500, so that the treatment liquid will flow into the drain pipe 511 of the drain section 510 along the guide slope 521, effectively preventing the treatment liquid from accumulating in the collection space 530. In some embodiments, the main structure 520 further has a hollow portion 522, and the back spray assembly 400 passes through the hollow portion 522 and is sealed to the main structure 520.
[0039] In some embodiments, such as Figure 3 As shown, the substrate stage 100 is provided with an upwardly protruding baffle 120, which surrounds the annular gap 310 to prevent the processing liquid on the substrate stage 100 from flowing into the annular gap 310. During the process, the processing liquid sprayed onto the back of the substrate 110 by the back nozzle will flow into the annular gap 310 after splashing back onto the substrate stage 100. Therefore, by providing a ring of protruding baffles 120 around the annular gap 310, the amount of processing liquid flowing into the annular gap 310 is further reduced.
[0040] In some embodiments, the back spray assembly 400 includes a hollow shaft 410, a sealing cap 420, and an air supply section 430. For example... Figure 1 As shown, a sealing cap 420 is disposed at the upper end of the hollow shaft 410 to prevent the processing liquid from flowing into the hollow shaft 410 during the process. The hollow shaft 410 is also provided with multiple upwardly inclined first exhaust ports 411, which are distributed circumferentially along the hollow shaft 410. An air supply unit 430 is connected to the lower end of the hollow shaft 410 and is used to introduce protective gas into the hollow shaft 410. The protective gas is then discharged through the first exhaust ports 411 and enters the annular gap 310, before being discharged from the upper port 311 of the annular gap 310. During the process, protective gas is supplied to the annular gap 310 through the air supply unit 430. The protective gas is discharged through the first exhaust ports 411 and enters the annular gap 310, forming an upward airflow within the annular gap 310. This upward airflow further prevents the processing liquid from flowing into the annular gap from the upper port 311. Meanwhile, some of the treatment liquid is volatile, and the waste gas generated by volatilization will also flow into the annular gap 310. The rising airflow can also purge the annular gap 310, reducing the waste gas that diffuses into the annular gap 310.
[0041] In some embodiments, the hollow shaft 410 is further provided with a plurality of downwardly inclined second exhaust ports 412, which are distributed circumferentially along the hollow shaft 410. In some embodiments, the sealing device 500 further includes an exhaust section 540 for discharging gas from the collection space 530. The exhaust section 540 includes an exhaust pipe 541 and a second switching valve 542, which controls the opening and closing of the exhaust pipe 541. When the gas supply section 430 introduces a protective gas (e.g., nitrogen) into the hollow shaft 410, the protective gas enters the annular gap 310 through the second exhaust ports 412 and reaches the collection space 530. The second switching valve 542 is configured to open when the gas supply section 430 introduces the protective gas into the hollow shaft 410, so that the protective gas is discharged through the exhaust pipe 541. When the gas supply unit 430 stops supplying protective gas into the hollow shaft 410, the second switch valve 542 closes to prevent external gas from entering the collection space 530 through the exhaust pipe 541.
[0042] During the manufacturing process, the rotating shaft 210 continuously rotates, generating friction with other components (e.g., with the motor stator 220). Particulate matter generated by this friction may fall into the sealing device 500 and contaminate the substrate 110 via the annular gap 310. Therefore, air is blown into the hollow shaft 410 through the air supply unit 430. Protective gas reaches the annular gap 310 through the second exhaust port 412, forming a downward airflow within the annular gap 310. This downward airflow enters the collection space 530. At this time, the second switching valve 542 is open, and the protective gas blows the particulate matter in the collection space 530 out through the exhaust unit 540, thus preventing contamination of the substrate 110 by particulate matter generated by friction between the rotating shaft 210 and other components. When the air supply unit 430 stops supplying air, the second switching valve 542 needs to be closed to prevent external gas from carrying particulate matter into the collection space 530 through the exhaust pipe 541, thus cutting off the connection between the collection space 530 and the external gas. In some embodiments, the exhaust pipe 541 is disposed on the upper part of the sealing device 500 to prevent the treatment liquid in the collection space 530 from flowing into the exhaust pipe 541. In some embodiments, the exhaust pipe 541 and the drain pipe 511 can also be a single component. When the gas supply unit 430 supplies gas, the switch valve on the drain pipe 511 is opened to discharge the protective gas from the drain pipe 511.
[0043] In some embodiments, the hollow shaft 410 is provided with at least one ring of upwardly inclined first exhaust ports 411 and at least one ring of downwardly inclined second exhaust ports 412. The first exhaust ports 411 and the second exhaust ports 412 are distributed circumferentially along the hollow shaft 410, with the first exhaust port 411 located above the second exhaust port 412. The first exhaust ports 411 and the second exhaust ports 412 are provided on the hollow shaft 410, and a protective gas is introduced into the hollow shaft 410 through the gas supply section 430. The protective gas enters the annular gap 310 through the first exhaust ports 411 and the second exhaust ports 412, forming rising and falling airflows within the annular gap 310. This further reduces the amount of processing liquid and waste gas flowing into the annular gap 310, and also prevents particulate matter generated by friction between the rotating shaft 210 and other devices from contaminating the substrate 110. The first exhaust port 411 is located above the second exhaust port 412 to prevent the rising and falling airflows from colliding within the annular gap 310, thereby preventing airflow turbulence. It should be noted that in some embodiments, only the first exhaust port 411 may be provided without the second exhaust port 412. The particulate matter generated by friction during the rotation of the rotating shaft 210 can be reduced by improving the material and structure of the rotating shaft 210 or by using an oil seal.
[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A substrate processing apparatus, characterized in that, include: A substrate stage, used to support a substrate; The driving device includes a rotating shaft and a motor stator. The rotating shaft is coaxially and fixedly connected to the substrate stage and is located below the substrate stage. The motor stator is arranged around the outer periphery of the rotating shaft. The driving device is used to drive the substrate stage to rotate. The intermediate channel is a hollow channel that passes through the substrate stage and the rotation axis along the axis of the rotation axis; The back spray assembly passes through the intermediate channel and forms an annular gap with the inner wall of the intermediate channel; as well as A sealing device is sealed to the bottom of the motor stator and the back spray assembly, wherein the motor stator and the back spray assembly are in a relatively stationary state. The sealing device includes a drain section and a collection space. The drain section is used to drain the treatment liquid in the collection space. The collection space is in communication with the annular gap and is used to receive the treatment liquid from the annular gap. The sealing device is used to seal the lower end of the annular gap.
2. The substrate processing apparatus as claimed in claim 1, characterized in that, The drainage section is configured to be intermittently open to intermittently discharge the treatment liquid in the collection space.
3. The substrate processing apparatus as claimed in claim 2, characterized in that, The drainage section includes: drain pipe; A first switching valve is installed on the drain pipe to control the opening and closing of the drain pipe and to isolate the collection space from the outside. A liquid level sensor is used to detect the liquid level in the collection space; The controller is configured to: when the liquid level signal detected by the liquid level sensor reaches a predetermined liquid level threshold, open the first switching valve to open the drain pipe, and close the first switching valve after a predetermined time to block the drain pipe.
4. The substrate processing apparatus as claimed in claim 1, characterized in that, The sealing device also includes a main structure, which is sealed to the bottom of the drive device and the back spray assembly to form the collection space. The main structure is provided with a flow-guiding slope to guide the treatment liquid to the drainage section.
5. The substrate processing apparatus as claimed in claim 1, characterized in that, The substrate platform is provided with an upwardly protruding flow-blocking portion, which surrounds the periphery of the annular gap and is used to prevent the processing liquid on the substrate platform from flowing into the annular gap.
6. The substrate processing apparatus as claimed in claim 1, characterized in that, The back spray assembly includes a hollow shaft, a sealing cover, and an air supply section. The sealing cover is disposed at the upper end of the hollow shaft. The hollow shaft is provided with a plurality of inclined upward first exhaust ports, which are distributed circumferentially along the hollow shaft. The air supply section is connected to the lower end of the hollow shaft and is used to introduce protective gas into the hollow shaft so that the protective gas is discharged through the first exhaust ports and enters the annular gap, and then discharged from the upper port of the annular gap.
7. The substrate processing apparatus as claimed in claim 1, characterized in that, The back spray assembly includes a hollow shaft, a sealing cover, and an air supply section. The sealing cover is disposed at the upper end of the hollow shaft. The hollow shaft is provided with a plurality of downwardly inclined second exhaust ports, which are distributed circumferentially along the hollow shaft. The air supply section is connected to the lower end of the hollow shaft and is used to introduce protective gas into the hollow shaft so that the protective gas is discharged through the second exhaust ports and enters the annular gap, and then enters the collection space from the annular gap.
8. The substrate processing apparatus as claimed in claim 7, characterized in that, The sealing device further includes an exhaust section for discharging gas from the collection space. The exhaust section includes an exhaust pipe and a second switching valve. The second switching valve is configured such that: when the gas supply section introduces protective gas into the hollow shaft, the second switching valve opens to allow the protective gas to be discharged through the exhaust pipe; when the gas supply section stops introducing protective gas into the hollow shaft, the second switching valve closes to prevent external gas from entering the collection space through the exhaust pipe.
9. The substrate processing apparatus as claimed in claim 7, characterized in that, The hollow shaft is also provided with a plurality of upwardly inclined first exhaust ports, which are distributed circumferentially along the hollow shaft, and the first exhaust ports are located above the second exhaust ports.
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