Wafer drying device and wafer drying system

By using rotatable circular and annular drying plates and components in the wafer drying apparatus, the gas flow direction is ensured to be from the center to the edge, which solves the problem of bubble defects in the room temperature bonding wafer drying process, and improves the drying effect and product yield.

CN224398216UActive Publication Date: 2026-06-23NEXCHIP SEMICON CO LTD
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Patent Information

Application Number
CN202521264492.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-19
Publication Date
2026-06-23
Estimated Expiration
2035-06-19

AI Technical Summary

Technical Problem

During the drying process of wafers bonded at room temperature, the spin drying method can easily cause gaps to appear at the wafer bonding interface, allowing gas to enter and form bubbles or cavities, which affects product yield.

Method used

The system employs circular and annular drying plates that can rotate around the same center. The circular drying plate has air jet holes, and the annular drying plate has air suction holes. The gas flow direction is from the center of the wafer to the edge. Combined with the rotation of the crystal face and crystal back drying components, it ensures drying without dead angles.

Benefits of technology

This reduces the probability of gas entering the wafer bonding interface, improves drying effect and uniformity, and increases product yield.

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Abstract

The utility model relates to a wafer drying device and a wafer drying system, the wafer drying device comprises a bearing and collecting unit and a wafer drying unit, and the bearing and collecting unit comprises a wafer bearing table; the wafer drying unit comprises a crystal face drying assembly and a wafer back drying assembly, each of the crystal face drying assembly and the wafer back drying assembly comprises a circular drying piece and an annular drying piece which can rotate around the same circle center, the annular drying pieces are arranged around the circular drying pieces in a sleeving manner, and a plurality of air injection holes are formed in the circular drying pieces; a plurality of air suction holes are formed in the circular-ring-shaped drying sheet; when a wafer arranged on a wafer bearing table is dried, a wafer back drying assembly and a crystal face drying assembly are arranged on the two sides of the wafer in parallel respectively and rotate relative to the wafer, and rotating shafts of the wafer back drying assembly and the crystal face drying assembly penetrate through the circle center and extend in the direction perpendicular to the surface of the wafer. The gas injection holes purge gas to the surface of the wafer, and the gas suction holes absorb the purged gas, so that the probability that bubbles appear on the edge of the wafer is reduced.
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