Electronic device comprising acoustic waveguide

Abstract

Disclosed is an electronic device comprising: a housing comprising a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space formed between the first surface and the second surface; a sound hole formed in the housing and configured to emit sound in a direction facing the first surface; a speaker disposed in the housing; and first and second acoustic waveguides providing an acoustic path together between the speaker and the acoustic aperture, wherein the second acoustic waveguide is different from the first acoustic waveguide.

Description

[0001] This application is a divisional application of the patent application filed on February 3, 2021, with application number 202180012569.8 and entitled "Electronic Device Including Acoustic Waveguide". Technical Field

[0002] Various embodiments of this disclosure relate to audio output in an electronic device, and more specifically, to an electronic device having an acoustic waveguide for generating an audio channel within the electronic device. Background Technology

[0003] The development of electronic communication technology has led to a trend of integration, where various functions are all included in a single electronic device. For example, a smartphone includes the functions of a media player, imaging device, and dispatcher / organizer, as well as traditional communication functions, and can also achieve additional functions by installing any number of applications. The use of portable electronic devices such as smartphones is now widespread, and the functional integration of electronic devices continues to become more complex to meet the diverse needs of users. Summary of the Invention

[0004] Technical issues

[0005] Electronic devices such as smartphones may include a display on their front surface, and various additional devices may be positioned around the active area (“active area” or “visible area”) of the display (e.g., on top of the front surface of the electronic device). For example, a receiver for voice calls, a camera for photographing objects, a sensor for recognizing a user’s face or iris, an infrared projector as a light source for measuring depth, and various sensors (such as proximity sensors or illuminance sensors and temperature sensors or atmospheric pressure sensors) may be positioned on top of the front surface of the electronic device. Such electronic devices are increasingly used in entertainment fields such as multimedia and gaming. For example, user demands for electronic device performance (such as larger storage capacity, more advanced processor performance or communication speed, and improved image or sound quality) are increasing. Such user demands can be met using various sensors or input / output devices within the electronic device.

[0006] Various additional devices mounted on the front surface of electronic devices can provide: convenient functions (e.g., camera functionality), such as Selfie; security functions (e.g., using infrared projectors or facial or iris sensors), such as user identification; or environmental functions (e.g., using proximity sensors, humidity sensors, temperature / humidity, or atmospheric pressure sensors), such as for optimizing operating conditions. However, in the reality of designing or manufacturing the entire front surface of electronic devices as the active area of ​​a display to provide improved image quality (e.g., larger screens and high-definition images), such sensors may struggle to ensure a path for receiving or acquiring various types of information.

[0007] When an electronic device is equipped with a voice call function, the receiver can be positioned at the top of the front surface of the device. The acoustic path connecting the speaker outputting the call audio (e.g., voice) and the receiver can be located inside the electronic device to provide good call quality. However, as mentioned above, because other additional devices are located inside the upper part of the electronic device, it may be difficult to ensure the acoustic path connected to the receiver. For example, the voice call quality of the electronic device may degrade.

[0008] According to various embodiments, an electronic device can be provided that provides good voice call quality.

[0009] According to various embodiments, an electronic device can be provided that allows for easy arrangement of other additional devices while providing an acoustic waveguide for transmitting the sound of a received call.

[0010] Technical solution

[0011] According to an embodiment, an electronic device includes: a housing including a first surface, a second surface opposite to the first surface, and a side surface structure at least partially surrounding a space formed between the first and second surfaces; a sound hole formed in the housing and configured to emit sound in a direction facing the first surface; a loudspeaker disposed in the housing; and a first acoustic waveguide and a second acoustic waveguide providing an acoustic path together between the loudspeaker and the sound hole, wherein the second acoustic waveguide is different from the first acoustic waveguide.

[0012] According to an embodiment, an electronic device includes: a housing including a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space formed between the first and second surfaces; a sound hole formed in the housing and configured to emit sound in a direction facing the first surface; a loudspeaker disposed in the housing; electronic components disposed inside the housing between the sound hole and the loudspeaker; and a first acoustic waveguide bypassing the electronic components, the first and second acoustic waveguides providing an acoustic path between the loudspeaker and the sound hole, wherein the second acoustic waveguide is different from the first acoustic waveguide.

[0013] Beneficial effects

[0014] According to various embodiments, an electronic device can provide improved sound quality in voice calls by including multiple acoustic waveguides between a sound hole provided as a receiver and a speaker that outputs the sound of the received call. In one embodiment, additional auxiliary devices or electronic components can provide a path for receiving or acquiring various information from outside the electronic device or for outputting optical signals through the space or area between the acoustic waveguides. For example, according to various embodiments, the electronic device can have other electronic components that are easily placed therein, and enhanced call quality in voice calls can be provided by providing multiple acoustic waveguides. Attached Figure Description

[0015] A more complete understanding of this disclosure and its many accompanying aspects will be readily obtained when considered in conjunction with the accompanying drawings, by referring to the following detailed description, in which:

[0016] Figure 1 This is a block diagram of an electronic device in a network environment according to an embodiment;

[0017] Figure 2 This is a perspective view showing an electronic device according to an embodiment;

[0018] Figure 3 This is a perspective view showing the electronic device, viewed from the rear.

[0019] Figure 4 This is an exploded perspective view showing an electronic device according to an embodiment;

[0020] Figure 5 This is an exploded perspective view showing an electronic device according to an embodiment;

[0021] Figure 6 This is a plan view showing the front surface of an electronic device according to an embodiment;

[0022] Figure 7 It is along Figure 6 The cross-sectional view of the electronic device is shown by line S1;

[0023] Figure 8 It is along Figure 6 The cross-sectional view of the electronic device is shown by line S2;

[0024] Figure 9 It is along Figure 6 The cross-sectional view of the electronic device is shown by line S3;

[0025] Figure 10 This is a perspective view showing an example conduit component in an electronic device according to an embodiment;

[0026] Figure 11 , Figure 12 and Figure 13 This is a view illustrating a variation of the electronic device according to an embodiment; and

[0027] Figure 14 This is a graph showing the acoustic characteristics of the electronic device according to an embodiment.

[0028] Throughout the accompanying drawings, the same reference numerals will be understood to refer to the same parts, components, and structures. Specific Implementation

[0029] Figure 1 This is a block diagram illustrating an electronic device 1001 in a network environment 1000 according to various embodiments. (Refer to...) Figure 1 In network environment 1000, electronic device 1001 can communicate with electronic device 1002 via a first network 1098 (e.g., a short-range wireless communication network), or with electronic device 1004 or server 1008 via a second network 1099 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 1001 can communicate with electronic device 1004 via server 1008. According to an embodiment, electronic device 1001 may include a processor 1020, memory 1030, input device 1050, sound output device 1055, display device 1060, audio module 1070, sensor module 1076, interface 1077, haptic module 1079, camera module 1080, power management module 1088, battery 1089, communication module 1090, subscriber identification module (SIM) 1096, or antenna module 1097. In some embodiments, at least one of the components (e.g., display device 1060 or camera module 1080) may be omitted from electronic device 1001, or one or more other components may be added to electronic device 1001. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, sensor module 1076 (e.g., fingerprint sensor, iris sensor, or illuminance sensor) may be implemented as embedded in display device 1060 (e.g., display).

[0030] Processor 1020 may run software (e.g., program 1040) to control at least one other component (e.g., hardware or software component) of electronic device 1001 connected to processor 1020, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 1020 may load commands or data received from another component (e.g., sensor module 1076 or communication module 1090) into volatile memory 1032, process the commands or data stored in volatile memory 1032, and store the resulting data in non-volatile memory 1034. According to an embodiment, processor 1020 may include a main processor 1021 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 1023 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 1021. Alternatively, the auxiliary processor 1023 may be adapted to consume less power than the main processor 1021, or adapted to perform a specific function. The auxiliary processor 1023 may be implemented separately from the main processor 1021, or may be implemented as part of the main processor 1021.

[0031] When the main processor 1021 is inactive (e.g., in sleep mode), the auxiliary processor 1023, instead of the main processor 1021, can control at least some of the functions or states associated with at least one component of the electronic device 1001 (e.g., display device 1060, sensor module 1076, or communication module 1090). Alternatively, when the main processor 1021 is active (e.g., running an application), the auxiliary processor 1023 can work with the main processor 1021 to control at least some of the functions or states associated with at least one component of the electronic device 1001 (e.g., display device 1060, sensor module 1076, or communication module 1090). According to embodiments, the auxiliary processor 1023 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 1080 or communication module 1090) functionally associated with the auxiliary processor 1023.

[0032] The memory 1030 may store various data used by at least one component of the electronic device 1001 (e.g., processor 1020 or sensor module 1076). The various data may include, for example, software (e.g., program 1040) and input or output data for commands associated with it. The memory 1030 may include volatile memory 1032 or non-volatile memory 1034.

[0033] The program 1040 may be stored as software in the memory 1030, and the program 1040 may include, for example, an operating system (OS) 1042, middleware 1044, or application 1046.

[0034] Input device 1050 can receive commands or data from outside electronic device 1001 (e.g., a user) that will be used by other components of electronic device 1001 (e.g., processor 1020). Input device 1050 may include, for example, a microphone, mouse, keyboard, or digital pen (e.g., stylus).

[0035] The sound output device 1055 can output sound signals to the outside of the electronic device 1001. The sound output device 1055 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0036] Display device 1060 can visually provide information to the outside of electronic device 1001 (e.g., to a user). Display device 1060 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 1060 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0037] The audio module 1070 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 1070 can obtain sound via the input device 1050, or output sound via the sound output device 1055 or headphones of an external electronic device (e.g., electronic device 1002) that is directly (e.g., wired) or wirelessly connected to the electronic device 1001.

[0038] Sensor module 1076 can detect the operating state of electronic device 1001 (e.g., power or temperature) or the environmental state outside electronic device 1001 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 1076 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0039] Interface 1077 may support one or more specific protocols used to enable electronic device 1001 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 1002). According to embodiments, interface 1077 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0040] Connection 1078 may include a connector, via which electronic device 1001 may be physically connected to an external electronic device (e.g., electronic device 1002). According to embodiments, connection 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 1079 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] Camera module 1080 can capture still or moving images. According to an embodiment, camera module 1080 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 1088 manages the power supply to the electronic device 1001. According to an embodiment, the power management module 1088 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] Battery 1089 can power at least one component of electronic device 1001. According to an embodiment, battery 1089 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0045] The communication module 1090 can support the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 1001 and an external electronic device (e.g., electronic device 1002, electronic device 1004, or server 1008), and perform communication via the established communication channel. The communication module 1090 may include one or more communication processors capable of operating independently of the processor 1020 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, the communication module 1090 may include a wireless communication module 1092 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 1094 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 1098 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 1099 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 1092 can identify and verify the electronic device 1001 in the communication network (such as the first network 1098 or the second network 1099) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1096.

[0046] Antenna module 1097 can transmit or receive signals or power to or from the outside of electronic device 1001 (e.g., external electronic device). According to an embodiment, the antenna module may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, antenna module 1097 may include multiple antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 1098 or a second network 1099) can be selected from the multiple antennas by, for example, communication module 1090 (e.g., wireless communication module 1092). Signals or power can then be transmitted or received between communication module 1090 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 1097.

[0047] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0048] According to an embodiment, commands or data can be sent or received between electronic device 1001 and external electronic device 1004 via server 1008 connected to a second network 1099. Each of electronic devices 1002 and 1004 can be a device of the same type as electronic device 1001, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 1001 can be performed on one or more of the external electronic devices 1002, 1004, or 1008. For example, if electronic device 1001 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 1001 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 1001 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 1001. Electronic device 1001 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0049] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0050] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0051] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0052] The various embodiments set forth herein can be implemented as software (e.g., program 1040) comprising one or more instructions stored in a storage medium (e.g., internal memory 1036 or external memory 1038) readable by a machine (e.g., electronic device 1001). For example, under the control of a processor, the processor (e.g., processor 1020) of the machine (e.g., electronic device 1001) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0053] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g., the Play Store™), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0054] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0055] Figure 2 This is a perspective view showing an electronic device 100 according to an embodiment. Figure 3 This is shown as an observation from the rear. Figure 2 A perspective view of the electronic device 100.

[0056] Reference Figure 2 and Figure 3 According to an embodiment, the electronic device 100 may include a housing 110 having a first (or front) surface 110A, a second (or rear) surface 110B, and a side surface (or sidewall) 110C surrounding the space between the first surface 110A and the second surface 110B. According to another embodiment (not shown), the housing 110 may represent a structure forming... Figure 2 The structure of the first surface 110A, the second surface 110B and the side surface 110C.

[0057] According to an embodiment, at least a portion of the first surface 110A may have a substantially transparent front panel 102 (e.g., a glass or polymer panel including various coatings). According to an embodiment, the front panel 102 may include a curved portion that bends from the first surface 110A to the rear surface 111 at at least one side edge portion and extends seamlessly.

[0058] According to an embodiment, the second surface 110B may be formed of a substantially opaque back panel 111. The back panel 111 may be formed of, for example, laminated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. According to an embodiment, the back panel 111 may include a curved portion that bends from the second surface 110B to the front surface 102 at at least one side edge portion and extends seamlessly.

[0059] According to an embodiment, the side surface 110C may be formed by a side surface structure (or “side member” or “side wall”) 118 that is coupled to the front panel 102 and the rear panel 111 and comprises metal and / or polymer. According to an embodiment, the rear panel 111 and the side surface structure 118 may be integrally formed together and comprise the same material (e.g., metal, such as aluminum).

[0060] According to an embodiment, the electronic device 100 may include a display 101, audio modules 103 and 114, a sensor module, and an opening region 105 (e.g., Figure 2 At least one or more of the following: optical aperture 205, key input device 117, and connector aperture 108. According to an embodiment, the electronic device 100 may embed an optical module (e.g., camera module, light source, proximity sensor, or illuminance sensor) corresponding to the opening region 105. The opening region 105 may be located on the top of the electronic device 100 and may be formed on the front surface (e.g., first surface 110A) in the width direction (e.g., optical aperture 205), key input device 117, and connector aperture 108. Figure 4 (in the X direction) or length direction (e.g., Figure 4 The central portion in the Y direction of the display 101. According to an embodiment, the opening region 105 may have a hole shape that is at least partially surrounded by the active region or viewable region (VA) of the display 101. In another embodiment, the opening region 105 may be formed in a recessed region (e.g., Figure 13 In the notch region NA), the notch region is formed within the active region VA of the display 101. For example, the opening region 105 can be defined as a portion of the notch region, or it can have a hole shape surrounded by the notch region. In another embodiment, the optical module can be disposed below the display 101 to receive light or emit light to the outside of the electronic device 100 through a portion of the active region VA of the display 101. In this case, the opening region 105 (e.g., Figure 2The optical aperture 205 may be omitted or may be substantially part of the active area VA of the display 101. According to embodiments, the electronic device 100 may not include at least one of the components (e.g., key input device 117) or may add other components. For example, the electronic device 100 may include a sensor module (not shown). For example, in the area provided by the front panel 102, a proximity sensor or illuminance sensor may be integrated into the display 101 or located adjacent to the display 101. According to embodiments, the electronic device 100 may also include a light-emitting element, and the light-emitting element may be located adjacent to the display 101 in the area provided by the front panel 102. The light-emitting element may provide information, for example, about the state of the electronic device 100, in the form of light. According to embodiments, the light-emitting element may provide a light source that cooperates with the operation of an optical module (e.g., a camera module) located in the aperture area 105. The light-emitting element may include, for example, a light-emitting device (LED), an infrared (IR) LED, or a xenon lamp.

[0061] Display 101 is visually exposed through a large portion of front panel 102. According to an embodiment, the edges of display 101 may be formed to be substantially identical in shape to the adjacent outer edges of front panel 102. According to an embodiment (not shown), the spacing between the outer edges of display 101 and the outer edges of front panel 102 may be kept substantially uniform to give display 101 a larger exposed area. For example, when viewed from the top of front panel 102, the screen display area VA of display 101 and the peripheral area PA (e.g., a black matrix area) formed around the screen display area VA may substantially form the front surface of electronic device 100 (e.g., first surface 110A), and the area of ​​screen display area VA may be 90% or more, substantially 100%, of the area of ​​first surface 110A. According to an embodiment, a recess or opening (e.g., opening area 105) may be formed in a portion of the screen display area VA of display 101, and other electronic components, such as a camera module, proximity sensor, or illuminance sensor (not shown), may be included aligned with the recess or opening (e.g., opening area 105). In another embodiment, other electronic components aligned with the recess or opening may include at least one of an infrared projector, an iris sensor, a gesture sensor, an infrared sensor, a temperature sensor, a humidity sensor, and an atmospheric pressure sensor.

[0062] According to an embodiment, at least one or more of the camera module 112 or 113, the fingerprint sensor 116, and the flash 106 may be included on the rear surface of the screen display area VA of the display 101. According to an embodiment (not shown), the display 101 may be configured to be connected to or adjacent to a touch detection circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a magnetic field type stylus.

[0063] Audio modules 103 and 114 may include a microphone hole and a speaker hole. The microphone hole may have an internal microphone to receive external sound. According to embodiments, multiple microphones may be present to detect the direction of sound. According to embodiments, the speaker hole and microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezoelectric speaker). The speaker hole may include an external speaker hole and a telephone receiver hole 114 (e.g., [missing information]). Figure 6 (Acoustic hole 313).

[0064] Electronic device 100 may include a sensor module (not shown) and thus be able to generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device or the external environmental state. The sensor module may include a proximity sensor disposed on a first surface 110A of housing 110, a fingerprint sensor integrated with or adjacent to display 101, and / or a biometric sensor (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface 110B of housing 110. Electronic device 100 may also include at least one of the following sensor modules (not shown): a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] Camera modules 112, 113, and 106 may include a first camera device (e.g., a camera module corresponding to the opening region 105) disposed on a first surface 110A of the electronic device 100, and a second camera device 112 and 113 and a flash 106 disposed on a second surface 110B. Camera modules 112 and 113 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 106 may include, for example, a light-emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 100.

[0066] Key input device 117 may be disposed on side surface 110C of housing 110. According to an embodiment, electronic device 100 may not include all or some of the aforementioned key input devices 117, and the un-included key input devices 117 may be implemented on display 101 in other forms (e.g., as soft keys). According to an embodiment, the key input device may include at least a portion of fingerprint sensor 116 disposed on second surface 110B of housing 110.

[0067] Connector hole 108 can receive connectors for sending and / or receiving power and / or data to / from external electronic devices and / or connectors for sending and / or receiving audio signals to / from external electronic devices. For example, connector hole 108 may include a Universal Serial Bus (USB) connector or a headphone jack.

[0068] Figure 4 This illustrates an electronic device 200 according to an embodiment (e.g., Figure 1 An exploded perspective view of the electronic device 100.

[0069] Reference Figure 4 The electronic device 200 may include a side surface structure 210 (e.g., Figure 2 Side surface structure 118), intermediate plate (e.g., component 211 (e.g., support plate or bracket)), front plate 220 (e.g., Figure 2 Front panel 102), display 230 (e.g., Figure 1 The electronic device 200 includes a display 101, a printed circuit board 240, a battery 250, and a rear panel 280. According to an embodiment, the display 230 may be disposed between the front panel 220 and the rear panel 280. The printed circuit board 240 may be disposed behind the display 230 (e.g., between the display 230 and the rear panel 280) in the thickness direction Z of the electronic device 200. According to an embodiment, a support member 211 may be disposed between the display 230 and the printed circuit board 240 to provide an electromagnetic isolation structure between the display 230 and the printed circuit board 240. According to an embodiment, the electronic device 200 may not include at least one of the components (e.g., support member 211) or may include other components. At least one component of the electronic device 200 may be associated with... Figure 2 or Figure 3 At least one component of the electronic device 100 is the same as or similar to that of the other component, and will not be described again below.

[0070] In one embodiment, when viewed from the top of the front panel 220, the opening region 205 formed in the display 230 (e.g., Figure 2 The opening region 205 may be located at the upper end of the electronic device 200. For example, the opening region 205 may be formed in the central portion of the electronic device 200 in the width direction X of the electronic device 200. In various embodiments, the term "opening region" may refer to the area extending through the display 230 in the screen display area VA (e.g., Figure 2The area formed by the aperture of the display 101. In some embodiments, the term "aperture area" may refer to a transparent area surrounded by the screen display area VA and lacking pixels therein. For example, the aperture area 205 can provide a path for light to travel from the outside of the front panel 220 to the inside. According to an embodiment, the aperture area 205 can provide a path for light to travel from the inside of the front panel 220 to the outside. In another embodiment, the "open area" (e.g., Figure 2 or Figure 4 The "opening region 105 or 205" may have a structure that allows light to pass through but separates the internal and external spaces of the electronic device 100 or 200. In another embodiment, the "opening region" may have the shape of a physical or mechanical aperture that connects the internal / external spaces of the electronic device 100 or 200 while allowing light to pass through. For example, when the electronic device 100 or 200 includes a temperature sensor or a humidity sensor, information about the surrounding environment of the electronic device 100 or 200 can be detected through the opening region 105 or 205.

[0071] Support member 211 may be disposed within electronic device 200 to connect to or integrate with side surface structure 210. Support member 211 may be formed of, for example, metallic and / or non-metallic materials (e.g., polymers). Display 230 may be bonded to one surface of support member 211, and printed circuit board 240 may be bonded to the opposite surface of support member 211. Processor, memory, and / or interface (e.g., Figure 1 The processor 1020, memory 1030, and / or interface 1077 may be mounted on the printed circuit board 240. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing device, an image signal processing unit, a sensor central processor, or a communication processor.

[0072] The memory may include, for example, volatile or non-volatile memory.

[0073] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface can electrically or physically connect, for example, electronic device 200 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0074] Battery 250 may be a device for supplying power to at least one component of electronic device 200. Battery 250 (e.g., Figure 1(1089) may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. At least a portion of battery 250 may be disposed on a plane substantially the same as printed circuit board 240. Battery 250 may be integrated or detachably disposed within electronic device 200.

[0075] According to an embodiment, the electronic device 200 may include a connection to a receiver (e.g., with...). Figure 2 The speaker 221a (which is provided together with the audio module or telephone receiver hole) and the electronic component 221b (which is provided corresponding to the opening area 205) are provided in the electronic device 200. For example, the speaker 221a can be provided in the electronic device 200 (e.g., Figure 1 At least one acoustic waveguide (e.g., inside the housing 110) Figure 6 Acoustic waveguides 415a and 415b) and receiver (e.g., Figure 6 The sound hole 313 is connected to output sound (e.g., the voice or sound of a call) to the outside of the electronic device 200.

[0076] The electronic component 221b housed in the housing 110 can emit optical signals (e.g., infrared light) or receive or acquire optical signals from the outside through the opening region 205. For example, the electronic component 221b configured to correspond to the opening region 205 may include at least one of an infrared projector, a gesture sensor, a proximity sensor, an illuminance sensor, a camera, an infrared sensor, and a face or iris sensor. According to an embodiment, the electronic component 221b configured to correspond to the opening region 205 may include at least one of a temperature sensor, a humidity sensor, and an atmospheric pressure sensor. When the electronic component 221b includes at least one of a temperature sensor, a humidity sensor, and an atmospheric pressure sensor, the opening region 205 may have a through-hole structure, and the electronic component 221b may use air as a medium to detect the external environment (e.g., temperature, humidity, or atmospheric pressure).

[0077] The electronic device 200 may further include at least one through-hole 211a and 211b formed in the support member 211. In the through-hole, the first through-hole 211a may be formed corresponding to a speaker 221a. For example, the speaker 221a may be disposed behind the support member 211 (e.g., between the support member 211 and the rear plate 280) at the rear of the electronic device 200, and radiate sound through the first through-hole 211a to the front of the support member 211. In the through-hole, the second through-hole 211b may be formed corresponding to an electronic component 221b. For example, the electronic component 221b may be disposed behind the support member 211 (e.g., between the support member 211 and the rear plate 280) between the sound hole 313 and the speaker 221a at the rear of the electronic device 200, and radiate optical signals through the second through-hole 211b to the front of the support member 211 or receive or obtain various information about the external environment from the front of the support member 211.

[0078] In describing the following embodiments, components that are readily understood from the description of the electronic devices 100 and 200 according to the above embodiments may or may not be indicated by the same reference numerals, and their detailed descriptions may be omitted. In describing the following embodiments, for the sake of detail or brevity of the drawings, reference may be made to the drawings or constructions related to the above embodiments.

[0079] Figure 5 This illustrates an electronic device 300 according to an embodiment (e.g., Figures 1 to 4 Exploded perspective view of electronic devices 1000, 100 and 200. Figure 6 This is a plan view showing the front surface of the electronic device 300 according to an embodiment.

[0080] Reference Figure 5 and Figure 6The electronic device 300 may include a plurality of acoustic waveguides 415a and 415b connecting a slit (e.g., a sound hole 313) and a speaker 221a. In one embodiment, the sound hole 313 may extend in the X direction and may be formed as a slit having a width measured in the Y direction of approximately 0.5 mm or less. According to an embodiment, the acoustic waveguides 415a and 415b may help form an acoustic propagation path from the speaker 221a to the sound hole 313 and may be interpreted as including a first through-hole 211a. In one embodiment, the first acoustic waveguide 415a is connected from the first through-hole 211a to one side of the sound hole 313 while bypassing a second through-hole 211b, and the second acoustic waveguide 415b is connected from the first through-hole 211a to the other side of the sound hole 313 while bypassing the second through-hole 211b. For example, sound output from speaker 221a (e.g., voice or audio signal of a telephone call) can propagate through the first through-hole 211a and the first acoustic waveguide 415a, or via the first through-hole 211a and the second acoustic waveguide 415b, to the sound hole 313, and is thus radiated to the electronic device 300 (e.g., in...). Figure 2 The external environment of the device (in the direction facing the first surface 110A). For example, the electronic device 300 may include a plurality of acoustic waveguides 415a and 415b, which, despite having a fairly small size (e.g., a width of about 0.5 mm or less), can transmit a specific volume level (e.g., the sound of an incoming call) through the acoustic aperture 313.

[0081] According to an embodiment, the acoustic aperture 313 may be at least partially defined by a first recessed portion 313a formed on the inner wall of the side surface structure 210. For example, a portion of the inner wall of the side surface structure 210 may at least partially surround the acoustic aperture 313 by including the recessed structure. According to an embodiment, a portion of the acoustic aperture 313 may be formed by the front panel 220 or the display (e.g., Figure 4 The front panel 220 (or display 230) is defined by the front panel 220. For example, when the front panel 220 is attached to the side surface structure 210 or the support member 211, the sound hole 313 may be formed by the first notch portion 313a and the front panel 220 (or display 230). In one embodiment, the sound hole 313 may have a feature in the electronic device 300 (or...) Figure 1 The width direction of the housing 110 (e.g., along) Figure 4 The direction X) or the length direction (e.g., along the ...). Figure 4 The slit shape extends in the direction Y. Advantageously, the disclosed sound hole 313 can emit a call sound (e.g., the caller's voice) with sufficient volume for a call while having little impact on the size of the electronic device 300.

[0082] According to an embodiment, the front panel 220 (or display 230) may include a second recessed portion 313b corresponding to the first recessed portion 313a. For example, the acoustic aperture 313 may be formed by substantially combining the first recessed portion 313a and the second recessed portion 313b. Although, according to this embodiment, the acoustic aperture 313 is accomplished by combining the side surface structure 210 and the front panel 220 (or display 230), the embodiments of this disclosure are not limited thereto. For example, in Figure 11 and Figure 12 In the disclosed embodiments, the acoustic aperture 613 or 713 may be formed in the side surface structure 210 itself or in the front panel 220 (or display 230) itself.

[0083] According to an embodiment, the mesh member 323 may be coupled to the acoustic aperture 313. The mesh member 323 may be configured to close part of the acoustic aperture 313, which can prevent foreign objects from entering the acoustic aperture 313. The mesh member 323 includes a mesh structure and / or multiple fine or micro-pores, thereby preventing foreign objects from the external environment from entering the acoustic aperture 313 and interfering with the sound transmitted to the outside of the electronic device 300 through the acoustic waveguides(s)415a and 415b. In this embodiment, although the acoustic aperture 313 and the mesh member 323 are shown as separate structures, the acoustic aperture 313 can be interpreted as a structure including the mesh member 323, and in another embodiment, the mesh member 323 may be omitted.

[0084] According to an embodiment, the electronic device 300 may further include components formed on the support member 211 (e.g., Figure 4 The recessed portion 315 in the support member 211. The recessed portion 315 may be formed in the support member 211 facing the first surface (e.g., Figure 2 On the surface of the first surface 110A), and the display (e.g., Figure 4 The display 230 or front panel 220 can be attached to the front surface of the support member 211 to conceal at least a portion of the recessed portion 315. For example, when the front panel 220 is attached to the support member 211, the space provided by the recessed portion 315 can substantially form at least a portion of the first acoustic waveguide 415a or the second acoustic waveguide 415b. For example, the recessed portion 315 can surround at least a portion of the first acoustic waveguide 415a by including a first recessed portion 315a formed on one side of the second through-hole 211b, and surround at least a portion of the second acoustic waveguide 415b by including a second recessed portion 315b formed on the other side of the second through-hole 211b.

[0085] According to an embodiment, a first acoustic waveguide 415a can be connected to a first portion P1 of the slit on one side of the acoustic aperture 313, and a second acoustic waveguide 415b can be connected to a second portion P2 of the slit on the other side of the acoustic aperture 313. In an embodiment, the first portion P1 and the second portion P2 can be symmetrically positioned about the central portion C of the slit. In an embodiment, the first acoustic waveguide 415a and the second acoustic waveguide 415b can have different shapes or sizes, and the lengths of the paths through which the sound actually propagates can be different. In an embodiment, the difference between the length of the acoustic path provided by the first acoustic waveguide 415a and the length of the acoustic path provided by the second acoustic waveguide 415b can be limited to about 20 mm or less. By limiting the difference in the length of the acoustic paths to a certain extent (e.g., within about 20 mm), interference between the sound reaching the acoustic aperture via the first acoustic waveguide 415a and the sound reaching the acoustic aperture 313 via the second acoustic waveguide 415b can be suppressed.

[0086] According to embodiments, electronic devices having multiple acoustic waveguides (e.g., first acoustic waveguide 415a and second acoustic waveguide 415b) can provide enhanced sound quality (e.g., sound pressure level) compared to electronic devices having a single acoustic waveguide. For example, sound quality aligned with the receiver (e.g., acoustic aperture 313) and the user's body (e.g., ear or ear canal) can be improved. Table 1 below shows measurements of sound quality (e.g., sound pressure level) at different configurations or when the electronic components have the same performance but different numbers of acoustic waveguides.

[0087] In Table 1, "an acoustic waveguide" can refer to a waveguide connected to... Figure 6 The structure of one acoustic waveguide at point P1 and point P2; "two acoustic waveguides" can refer to a structure including, for example, points P1 and P2. Figure 5 or Figure 6 The structures of the first acoustic waveguide 415a and the second acoustic waveguide 415b are shown in Table 1. In Table 1, "center alignment" can refer to... Figure 6 The point indicated by the "C" (e.g., the center portion of the sound hole 313) is aligned with the user's body (in the following text, "appropriate position"). "Left alignment" can refer to... Figure 6 The point indicated by the "C" in the diagram is aligned with the user's body a few millimeters to the left of the intended position. "Right alignment" can refer to... Figure 6 The point indicated by "C" is offset to the right from the proper position by a few millimeters and aligned with the user's body. In Table 1 below, the sound pressure level difference between left and right alignment is caused by the positional difference of the acoustic waveguide and acoustic aperture connection, or by the difference in the shape of the acoustic waveguides when multiple acoustic waveguides (e.g., first acoustic waveguide 415a and second acoustic waveguide 415b) are provided, and the sound level measurement may vary slightly depending on the actual manufactured product.

[0088] Table 1

[0089]

[0090] As shown in the measurement results illustrated in Table 1 above, the electronic device 300 according to the embodiment (e.g., Figures 1 to 6 Electronic devices 1000, 100, and 200 include multiple acoustic waveguides (e.g., a first acoustic waveguide 415a and a second acoustic waveguide 415b), thus providing an enhanced sound pressure level compared to electronic devices including a single acoustic waveguide, regardless of alignment. In electronic devices including a single acoustic waveguide, a sound pressure level deviation of about 5 dB occurs depending on the alignment between the sound hole and the user's body, but under the same operating performance conditions, the sound pressure level deviation in electronic device 300 according to the embodiment can be increased to about 3 dB or less.

[0091] According to an embodiment, the electronic device 300 may include an adhesive member 303 that attaches a front panel 220 (or display 230) to a support member 211 (or side surface structure 210). The adhesive member 303 may include double-sided adhesive tape, such as poron tape. In one embodiment, the adhesive member 303 typically attaches the edge of the front panel 220 (or display 230) to the support member 211, thereby providing a waterproof structure between the front panel 220 and the support member 211. According to an embodiment, the adhesive member 303 may include a first adhesive member 331 and a second adhesive member 333. A portion of the first adhesive member 331 may be attached to the support member 211 in a region adjacent to the recessed portion 315. The second adhesive member 333 may be attached to the support member 211 around the second through-hole 211b and may be positioned adjacent to the recessed portion 315. For example, when from the front surface of the electronic device 300 (e.g., ... Figure 2 When viewed on the first surface 110A, the area between the first adhesive member 331 and the second adhesive member 333 can substantially at least partially overlap with the first recessed portion 315a or the second recessed portion 315b. According to an embodiment, the first adhesive member 331 and the second adhesive member 333 can be provided as structures defining portions of the first acoustic waveguide 415a and the second acoustic waveguide 415b. For example, the adhesive member 303 can be positioned to surround at least a portion of the first acoustic waveguide 415a and the second acoustic waveguide 415b. Further reference is made below. Figures 7 to 9 This describes the structure that defines the first acoustic waveguide 415a and the second acoustic waveguide 415b.

[0092] Figure 7 It is along Figure 6 The cross-sectional view of electronic device 300 is shown by line S1. Figure 8 It is along Figure 6 The cross-sectional view of electronic device 300 is shown by line S2. Figure 9 It is along Figure 6 The cross-sectional view of electronic device 300 is shown by line S3.

[0093] Reference Figures 7 to 9 The first through hole 211a and the second through hole 211b can be located along the length of the electronic device 300 (e.g., Figure 5 They are substantially aligned with each other in the Y direction. In one embodiment, the speaker 221a can be connected to the space formed by the recessed portion 315 through the first through hole 211a, and the second through hole 211b can be connected to the opening region (e.g., in the Y direction). Figure 1 The opening region 105 is aligned. For example, sound radiated from the speaker 221a can be transmitted through the first through-hole 211a into the space formed by the recessed portion 315, and the electronic component 221b can detect information related to the external environment of the electronic device 300 through the second through-hole 211b and / or the optical aperture 205. In one embodiment, the electronic component 221b can receive or detect information about the external environment of the electronic device 300 through the region or space between the first acoustic waveguide 415a and the second acoustic waveguide 415b (e.g., the second through-hole 211b). In another embodiment, the electronic component 221b may include a light source such as an infrared projector, and the electronic component 221b can radiate signals (e.g., optical signals) to the outside of the electronic device 300 through the region or space between the first acoustic waveguide 415a and the second acoustic waveguide 415b. According to another embodiment, the second adhesive member 333 may include another through-hole 335 corresponding to the optical aperture 205 or the second through-hole 211b, thereby providing an environment or path for the electronic component 221b to detect the external environment. Here, the term "detecting the external environment" can be interpreted as including not only detecting illumination, but also detecting the proximity of the user's body, the user's gestures, or the movement of objects or images of objects.

[0094] According to an embodiment, the first acoustic waveguide 415a (or the second acoustic waveguide 415b) may include a bottom surface provided by the first recessed portion 315a (or the second recessed portion 315b), an inner sidewall provided by the first recessed portion 315a (or the second recessed portion 315b) and the first adhesive member 331 (or the second adhesive member 333), and / or a top surface provided by the front panel 220 (or the display 230). For example, the first acoustic waveguide 415a and the second acoustic waveguide 415b may be formed when the recessed portion 315 of the support member 211 (e.g., the first recessed portion 315a and the second recessed portion 315b), the adhesive member 303 (e.g., the first adhesive member 331 and the second adhesive member 333) and / or the front panel 220 (or the display 230) can be combined. In an embodiment, the first acoustic waveguide 415a and the second acoustic waveguide 415b may be located at least partially between the display 230 and the support member 211, and the speaker 221a (or the first through hole 211a) may be connected to the slit (e.g., the sound hole 313) so that the sound output from the speaker 221a is transmitted to the sound hole 313.

[0095] According to an embodiment, when the recessed portion 315 has a certain depth, the adhesive member 303 may have a thickness sufficient to attach the front panel 220 (or display 230) to the support member 211. For example, the adhesive member 303 on the inner wall of the first acoustic waveguide 415a or the second acoustic waveguide 415b may be too thin to be visible to the naked eye. In this case, the inner wall of the first acoustic waveguide 415a or the second acoustic waveguide 415b may be formed substantially by the inner wall of the first recessed portion 315a or the second recessed portion 315b. In another embodiment, the adhesive member 303 may have a thickness sufficient to form the first acoustic waveguide 415a or the second acoustic waveguide 415b. When the adhesive member 303 has a sufficient thickness required to form the first acoustic waveguide 415a or the second acoustic waveguide 415b, the first recessed portion 315a or the second recessed portion 315b may be formed to have a depth too small to be visible to the naked eye, or may be omitted entirely. In this case, the inner wall of the first acoustic waveguide 415a or the second acoustic waveguide 415b can be formed substantially by the adhesive member 303.

[0096] According to an embodiment, when from the front surface of the electronic device 300 (e.g., Figure 2 When viewed from the first surface 110A, a portion of the first acoustic waveguide 415a or a portion of the second acoustic waveguide 415b may overlap with the electronic component 221b. For example, as Figure 9 As shown, in the depth direction of the electronic device 300 (e.g., Figure 4A portion of a first acoustic waveguide 415a or a portion of a second acoustic waveguide 415b (in the thickness or Z direction) may be located between the front panel 220 (or display 230) and the electronic component 221b. According to an embodiment, the first acoustic waveguide 415a and the second acoustic waveguide 415b may be formed by forming a recessed portion 315 in the support member 211 or by shaping the adhesive member 303, rather than using separate components or structures. According to an embodiment, the electronic device 300 may include multiple acoustic waveguides (e.g., first acoustic waveguide 415a and second acoustic waveguide 415b) wherein the shapes of the support member 211, the front panel 220 (or display 230), and / or the support member 303 are at least partially altered. For example, without substantial changes to the structure, size, or shape of the electronic device 300 according to the embodiment, and as described above, the electronic device 300 may provide improved acoustic performance by including multiple acoustic waveguides.

[0097] As described above, although the electronic component 221b is disposed between the speaker 221a and the acoustic aperture 313, the electronic device 300 according to the embodiment (e.g., Figures 1 to 4 Electronic devices 1000, 100, and 200 may include acoustic waveguides (e.g., first acoustic waveguide 415a and second acoustic waveguide 415b) that bypass optical aperture 205 or opening region 105 for electronic component 221b, thereby contributing to good sound quality. According to embodiments, because electronic device 300 includes multiple acoustic waveguides, it can provide superior volume despite having the same speaker performance as a structure with a single acoustic waveguide, and it can mitigate audio deviations (e.g., sound level differences) caused by alignment between sound aperture 313 and the user's body.

[0098] Figure 10 This illustrates an electronic device according to an embodiment (e.g., Figures 1 to 9 A perspective view of example pipe component 515 in electronic devices 1000, 100, 200 and 300.

[0099] Reference Figure 10 Electronic devices (e.g.) Figures 5 to 9 The electronic device 300 may also include a conduit member 515. The conduit member 515 may generally include a recessed portion 315 (e.g., Figure 5 The first recessed portion 315a and the second recessed portion 315b correspond to the third recessed portion 515a and the fourth recessed portion 515b. The pipe component 515 can replace... Figure 5A portion of the adhesive member 303. For example, the second adhesive member 333 may be substantially replaced by a portion of the conduit member 515, and at least a portion of the first adhesive member 331 positioned adjacent to the first recessed portion 315a and the second recessed portion 315b may be replaced by another portion of the conduit member 515. For example, the conduit member 515 may surround an acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 The first acoustic waveguide 415a and the second acoustic waveguide 415b in the middle, simultaneously replace at least a portion of the adhesive member 303. In an embodiment, when the electronic device (e.g., Figures 5 to 9 When the electronic device 300 includes a conduit member 515, in forming an acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 When the first acoustic waveguide 415a and the second acoustic waveguide 415b are used, the recessed portion 315 can be omitted (e.g., Figure 5 The first recessed portion 315a and the second recessed portion 315b). As described above, in the electronic device 300, when forming an acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 When the first acoustic waveguide 415a and the second acoustic waveguide 415b are used, separate components (e.g., duct member 515) can be used, or in the absence of separate components, structures disposed around the space or area where the acoustic waveguide will be formed (e.g., support member 211, adhesive member 303, display 230 or front panel 220) can be used.

[0100] Figures 11 to 13 Examples are shown according to various embodiments. Figures 1 to 9 Views of electronic devices 1000, 100, 200 or 300, variants 600, 700 and 800.

[0101] Reference Figure 11 The acoustic aperture 613 of the electronic device 600 may include a slit defined by the side surface structure 210. For example, the acoustic aperture 613 may be formed by the shape or structure of the side surface structure 210 itself. See reference. Figure 12 The acoustic port 713 of the electronic device 700 may include a port formed through the front panel 220 (or Figure 4 The slit of the display 230. For example, the acoustic aperture 713 can be formed by the shape or structure of the front panel 220 (or the display 230) itself. Depending on the location of the acoustic aperture 613 or 713 or the structure having the acoustic aperture 613 or 713, an acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9The structure of the first acoustic waveguide 415a and the second acoustic waveguide 415b (e.g., the recessed portion of the support member 211, e.g., Figure 5 The recessed portion 315) or adhesive component (e.g., Figure 5 The adhesive component 303 in the middle can be deformed appropriately.

[0102] Reference Figure 13 The electronic device 800 may also include components formed on a display (e.g., Figure 4 The notch region NA is located within the active area VA of the display 230. For example, the notch region NA can be defined as a region substantially surrounded by the active area VA of the display and adjacent to the peripheral area PA (or the acoustic aperture 313). According to an embodiment, when the electronic device 800 includes the notch region NA, the opening region 105 or the optical aperture 205 may be located within the notch region NA.

[0103] Figure 14 This illustrates an electronic device according to an embodiment (e.g., Figures 1 to 12 The acoustic characteristics of electronic devices (1000, 100, 200, 300, 600, 700 and 800) are plotted.

[0104] Figure 14 This is a graph showing the results of measuring the sound pressure level of an electronic device in the audible frequency band (e.g., in the band ranging from about 200 Hz to about 12,000 Hz), where "D1" indicates the sound pressure level of an electronic device with one acoustic waveguide, and "D2" indicates the sound pressure level of an electronic device including multiple (e.g., two) acoustic waveguides (e.g., ...). Figure 5 or Figure 6 The sound pressure level of the electronic device (300). Figure 14 As shown, it can be seen that the electronic device according to the embodiment (e.g., an electronic device providing multiple acoustic waveguides) provides a greater sound pressure level across the entire audible frequency band compared to an electronic device providing one acoustic waveguide. Although there are some differences depending on the frequency band, it can be identified that by providing multiple acoustic waveguides, the sound pressure level is increased by about 8 dB at about 12,000 Hz.

[0105] According to an embodiment, an electronic device (e.g., Figures 1 to 13 Electronic devices 1000, 100, 200, 300, 600, 700, and 800 include: a housing (e.g., Figure 1 The housing 110 includes a first surface (e.g., Figure 2 The first surface 110A), and the second surface opposite to the first surface (e.g., Figure 3 The second surface 110B), and the side surface structure (e.g., at least partially surrounding the space between the first and second surfaces). Figure 1 Side surface 110C or Figure 4 The side surface structure 210); acoustic aperture (e.g., Figures 5 to 9 A sound hole 313 is formed in the housing and emits sound in the direction facing the first surface; a loudspeaker (e.g., a speaker disposed in the housing) Figures 5 to 9 The loudspeaker 221a); ​​the first acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 The first acoustic waveguide 415a provides an acoustic path between the loudspeaker and the sound hole; and the second acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 The second acoustic waveguide (415b) provides an acoustic path between the loudspeaker and the sound hole, and the second acoustic waveguide is different from the first acoustic waveguide.

[0106] According to an embodiment, the electronic device may further include a display disposed between the first surface and the second surface (e.g., Figure 5 The display 230), and the support member disposed between the display and the second surface (e.g., Figures 5 to 9 (Support member 211). The first and second acoustic waveguides may be located at least partially between the display and the support member.

[0107] According to embodiments, the electronic device may further include an adhesive member (e.g., for attaching the display to the support member) to attach the display to the support member. Figures 5 to 9 (Adhesive member 303). The adhesive member can be positioned around at least a portion of the first and second acoustic waveguides.

[0108] According to an embodiment, the support member may include a recessed portion 315 formed in a surface facing the first surface. The recessed portion may be positioned to surround at least a portion of the first and second acoustic waveguides.

[0109] According to embodiments, the electronic device may further include electronic components disposed within a housing (e.g., Figures 5 to 9 (Electronic component 221b). The electronic component may be configured to receive or detect information about the external environment of the electronic device through at least a portion of the region between the first and second acoustic waveguides.

[0110] According to an embodiment, a portion of the first acoustic waveguide or a portion of the second acoustic waveguide may be located between the display and the electronic components.

[0111] According to embodiments, the electronic device may further include an active region formed in the display (e.g., Figure 13 The notched region inside the active region VA (e.g., Figure 13 The notch region NA), or an optical aperture (e.g., surrounded at least partially by the active region of the display). Figures 5 to 9(Optical aperture 205). Electronic components can be configured to correspond to the notch area or the optical aperture.

[0112] According to an embodiment, the electronic component may include at least one of a camera, an infrared projector, a proximity sensor, an illuminance sensor, an iris sensor, a gesture sensor, an infrared sensor, a temperature sensor, a humidity sensor, and an atmospheric pressure sensor.

[0113] According to an embodiment, the acoustic aperture may be included in the longitudinal direction of the housing (e.g., Figure 4 The length direction Y) or the width direction (e.g., Figure 4 A slit extending in the width direction (X).

[0114] According to an embodiment, the first acoustic waveguide may be connected to a first portion of the slit (e.g., Figure 6 The first part P1), the second acoustic waveguide can be connected to the second part of the slit (e.g., Figure 6 The second part, P2). The first and second parts can surround the central portion of the slit (e.g., Figure 6 The central part C) is symmetrically positioned.

[0115] According to an embodiment, the electronic device may further include electronic components disposed within a housing. A first acoustic waveguide may be connected to a first portion of the slit, and a second acoustic waveguide may be connected to a second portion of the slit. The electronic components may be configured to receive or detect information about the external environment of the electronic device through the region between the first and second acoustic waveguides.

[0116] According to an embodiment, a portion of the first acoustic waveguide or a portion of the second acoustic waveguide may be located between the first surface and the electronic component.

[0117] According to an embodiment, the side surface structure can be formed to surround at least a portion of the slit.

[0118] According to embodiments, the electronic device may further include a front plate coupled to a side surface structure to form a first surface (e.g., Figures 5 to 9 (Front panel 220). The front panel may be formed as at least a portion surrounding the slit.

[0119] According to an embodiment, the front panel can be formed as part of the slit, and the side surface structure can be formed as the remaining part of the slit.

[0120] According to an embodiment, an electronic device includes: a housing including a first surface, a second surface opposite to the first surface, and a side surface structure at least partially surrounding the space between the first and second surfaces; a sound hole formed in the housing and emitting sound in a direction facing the first surface; a loudspeaker disposed in the housing; an electronic component disposed inside the housing between the sound hole and the loudspeaker; a first acoustic waveguide formed to bypass the electronic component and provide an acoustic path between the loudspeaker and the sound hole; and a second acoustic waveguide formed to bypass the electronic component and provide an acoustic path between the loudspeaker and the sound hole, the second acoustic waveguide being different from the first acoustic waveguide.

[0121] According to an embodiment, the electronic component can be configured to receive or detect information about the external environment of the electronic device through the region between the first and second acoustic waveguides.

[0122] According to an embodiment, the electronic device may further include a notch formed in the active region of the display, or an optical aperture at least partially surrounded by the active region of the display. Electronic components may be configured to correspond to the notch or the optical aperture.

[0123] According to an embodiment, the electronic device may further include a display disposed between the first surface and the second surface, a support member disposed between the display and the second surface, and an adhesive member for attaching the display to the support member. The adhesive member may be positioned around at least a portion of the first and second acoustic waveguides between the display and the support member.

[0124] According to an embodiment, the electronic device may further include a mesh member mounted on the acoustic aperture and exposed to the first surface.

[0125] Although this disclosure has been shown and described with reference to exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims.

Claims

1. An electronic device (1001), comprising: The housing (110) includes a first surface (110A), a second surface (110B) opposite to the first surface, and a side surface structure (110C) that at least partially surrounds the space formed between the first surface and the second surface. A sound hole (313) is formed in the housing and configured to emit sound in the direction facing the first surface; A speaker (1070) is installed in the housing. as well as A first acoustic waveguide (415a) and a second acoustic waveguide (415b) are provided together between the loudspeaker and the sound hole, wherein the second acoustic waveguide is different from the first acoustic waveguide.

2. The electronic device according to claim 1, further comprising: A display (101) disposed between the first surface and the second surface; as well as A support member (211) is disposed between the display and the second surface, wherein the first acoustic waveguide and the second acoustic waveguide are at least partially disposed between the display and the support member.

3. The electronic device of claim 2, further comprising an adhesive member (303) for attaching the display to the support member, wherein the adhesive member surrounds at least a portion of the first acoustic waveguide and the second acoustic waveguide.

4. The electronic device of claim 2, wherein the support member includes a recessed portion (315) formed in a surface facing the first surface, and wherein the recessed portion surrounds at least a portion of the first acoustic waveguide and the second acoustic waveguide.

5. The electronic device according to claim 2, further comprising an electronic component (221b) disposed in the housing (110), wherein the electronic component is configured to receive or detect information about the external environment of the electronic device through at least a portion of the region (105) between the first acoustic waveguide and the second acoustic waveguide.

6. The electronic device of claim 5, wherein a portion of the first acoustic waveguide or a portion of the second acoustic waveguide is disposed between the display and the electronic component.

7. The electronic device of claim 5 further includes a notch region (NA) formed in the active region of the display, or an optical aperture (205) at least partially surrounded by the active region of the display, wherein the electronic component is aligned with the notch region or the optical aperture.

8. The electronic device according to claim 5, wherein the electronic component (221b) comprises at least one of a phase display (1080), an infrared projector (1060), a proximity sensor (1076), an illuminance sensor (1076), an iris sensor (1080), a gesture sensor (1076), an infrared sensor (1076), a temperature sensor (1076), a humidity sensor (1076), and an atmospheric pressure sensor (1076).

9. The electronic device according to claim 1, wherein the acoustic aperture (313) comprises a slit (313) extending along the length or width of the housing.

10. The electronic device of claim 9, wherein the first acoustic waveguide is coupled to a first portion of the slit, and the second acoustic waveguide is coupled to a second portion of the slit, and wherein the first portion and the second portion are symmetrically arranged around a central portion of the slit.

11. The electronic device of claim 9, further comprising an electronic component (221b) disposed in the housing, wherein the first acoustic waveguide is coupled to a first portion of the slit and the second acoustic waveguide is coupled to a second portion of the slit, and wherein the electronic component is configured to receive or detect information about the external environment of the electronic device through the region between the first acoustic waveguide and the second acoustic waveguide.

12. The electronic device of claim 11, wherein a portion of the first acoustic waveguide or a portion of the second acoustic waveguide is disposed between the first surface and the electronic component.

13. The electronic device of claim 9, wherein the side surface structure surrounds at least a portion of the slit.

14. The electronic device of claim 9, further comprising a front plate (102) coupled to the side surface structure to form the first surface, wherein the front plate surrounds at least a portion of the slit.

15. The electronic device of claim 14, wherein the side surface structure is formed around the remaining portion of the slit, the remaining portion being distinct from the portion of the slit surrounded by the front plate.

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