LED display unit, manufacturing method and LED display screen

Abstract

The invention is suitable for the technical field of display, and provides an LED display unit, a manufacturing method and an LED display screen, the ED display unit comprises a circuit board, a light-emitting element, a mask, a plurality of photoelectric detectors and a controller, an optical structure is arranged on the surface, away from the circuit board, of the mask and used for receiving external light and conducting the light in the first direction and the second direction, and the light-emitting element is arranged on the surface, away from the circuit board, of the mask. The plurality of photoelectric detectors are used for receiving light transmitted by the optical structure, and the controller is connected with the photoelectric detectors and used for determining the incident position of external light. The position of the incident light is confirmed through the triggered signals of the multiple photoelectric detectors, the distance interaction between a user and the LED display unit is achieved, structures such as a transmitting tube and a receiving tube do not need to be additionally arranged on the edge of the LED display unit, continuous work is not needed, the frame width is not increased, and the user experience is improved. The arrangement of the photoelectric detector and the optical structure is not limited by the splicing of the LED display units, and is particularly suitable for large-screen display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to an LED display unit, a manufacturing method, and an LED display screen. Background Technology

[0002] Compared to traditional LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) displays, LED (Light-Emitting Diode) displays have advantages such as higher display brightness and seamless splicing.

[0003] Infrared interactive technology is currently the mainstream touch technology for LED displays. Generally, LED touch displays achieve touch operation by adding an external infrared touch frame, that is, infrared emitters and receivers are installed on the four sides of the LED display to confirm the touch point.

[0004] The aforementioned solution significantly increases the manufacturing cost and thickness of the LED display screen. Furthermore, the infrared emitter needs to continuously emit infrared light, leading to increased power consumption. Additionally, because this solution requires the fabrication of an integrated infrared touch film and frame, it can only be applied to all-in-one products, failing to leverage the advantages of unlimited splicing and large sizes of LED modules. Most importantly, it only enables contact-based interaction and not air-based interaction, which is quite limiting in practical large-screen applications. Therefore, the air-based interaction function of large-size LED displays urgently needs to be addressed. Summary of the Invention

[0005] The purpose of this application is to provide an LED display unit that solves the technical problem that existing large-size LED displays cannot achieve air-to-air interaction.

[0006] The embodiments of this application are implemented as follows: an LED display unit includes:

[0007] Circuit board;

[0008] Multiple light-emitting elements are arranged on a first surface of the circuit board along mutually perpendicular first and second directions;

[0009] A face mask is stacked on the first surface, and the face mask has a plurality of first cutout areas for the light-emitting elements to pass through; the surface of the face mask facing away from the circuit board has an optical structure for receiving external light and conducting the external light along the first direction and the second direction;

[0010] Multiple photodetectors are disposed within the second open area of ​​the mask and arranged along the first and second directions to receive external light transmitted by the optical structure; and

[0011] A controller, connected to each of the photodetectors, is used to determine the incident position of the external light based on the transmission signal of the triggered photodetector.

[0012] In one embodiment, the photodetectors are arranged in at least one row along the first direction and one column along the second direction.

[0013] In one embodiment, the trace of the photodetector extends from the first surface through the edge of the circuit board to the second surface of the circuit board; or, the circuit board has a through-hole, and the trace of the photodetector extends from the through-hole to the second surface of the circuit board.

[0014] In one embodiment, the optical structure includes a diffraction grating comprising periodically arranged slits.

[0015] In one embodiment, the period of the diffraction grating is 400 nanometers to 1 micrometer, and / or the height of the diffraction grating is 500 nanometers to 2 micrometers.

[0016] In one embodiment, a fixing member is provided in the second hollow area, and the photodetector is disposed in the fixing member.

[0017] In one embodiment, the mask includes a base layer disposed on the first surface, and the optical structure is disposed on the base layer; the base layer is a non-transparent layer.

[0018] Another object of this application is to provide an LED display screen comprising display units arranged in an array as described in the foregoing embodiments, wherein the photodetectors are aligned between the display units in the first direction and / or the second direction.

[0019] Another object of this application is to provide a method for manufacturing an LED display unit, used to manufacture an LED display unit as described in the above embodiments, comprising:

[0020] A face mask with a first cutout area is provided, and a second cutout area is made on the face mask;

[0021] Microstructure patterns are fabricated on a transparent transfer film, and light-blocking layers are set at positions corresponding to the first and second cutout areas;

[0022] Apply adhesive material to the transparent transfer film, avoiding the position of the light-blocking layer;

[0023] The mask is pressed together with the adhesive material, and the adhesive material is irradiated from one side of the transparent transfer film.

[0024] Remove the transparent transfer film and remove any uncured portion of the adhesive.

[0025] A photodetector is installed in the second cutout area, and the mask is stacked with the circuit board so that the light-emitting element on the circuit board passes through the first cutout area.

[0026] Another object of this application is to provide a method for manufacturing an LED display unit, for manufacturing an LED display unit as described in the above embodiments, comprising:

[0027] A face mask with a first cutout area is provided, and a second cutout area is made on the face mask;

[0028] Microstructure patterns are fabricated on the transparent transfer film at positions corresponding to the first and second cutout areas;

[0029] The adhesive material is applied to the microstructure pattern;

[0030] The mask is pressed onto the adhesive material, and the adhesive material is cured.

[0031] Remove the transparent transfer film;

[0032] A photodetector is installed in the second cutout area, and the mask is stacked with the circuit board, so that the light-emitting element on the circuit board passes through the first cutout area.

[0033] The LED display unit, manufacturing method, and LED display screen provided in this application have the following advantages:

[0034] The LED display unit provided in this application embodiment has an optical structure on its mask that can convert light from the outside into in-plane transmission. Photodetectors are set on the mask and along the light transmission path. The position of the incident light spot is confirmed by the trigger signals of multiple photodetectors, thereby realizing the user's interaction with the LED display unit in the air. Furthermore, it does not require the addition of emitting tubes, receiving tubes or other structures to the edge of the LED display unit, does not need to work continuously, and does not increase the bezel width. The setting of photodetectors and optical structures is not limited by the splicing of LED display units, making it particularly suitable for large-screen displays. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the planar structure of the LED display screen provided in the embodiments of this application;

[0037] Figure 2 This is a schematic diagram of the structure of the face mask in the LED display screen provided in the embodiments of this application;

[0038] Figure 3 This is a cross-sectional structural diagram of the LED display unit provided in the embodiments of this application;

[0039] Figure 4 This is a flowchart of the first step in the manufacturing method of the LED display unit provided in the embodiments of this application;

[0040] Figure 5 This is a schematic diagram illustrating the steps of a method for manufacturing an LED display unit according to an embodiment of this application;

[0041] Figure 6 This is a flowchart of the second step in the method for manufacturing an LED display unit provided in the embodiments of this application;

[0042] Figure 7 This is a schematic diagram of the steps in the manufacturing method of the LED display unit provided in the embodiments of this application.

[0043] The markings in the diagram mean:

[0044] 100-LED display screen;

[0045] 1-LED display unit, 11-circuit board, 111-first surface, 112-second surface, 110-wire hole, 13-light-emitting element, 15-mask, 151-first cutout area, 152-second cutout area, 153-mounting hole, 155-base layer, 156-optical structure, 1560-diffraction grating, 1561-slit, 1562-protrusion;

[0046] 2-Photodetector, 20-Trace;

[0047] 3-Controller;

[0048] 4-Factors;

[0049] 51-Laser pointer, 52-Incident ray, 520-Incident spot, 53-Optical waveguide path;

[0050] 6-Transparent transfer film, 60-Microstructure pattern, 61-Groove;

[0051] 7-Light-blocking layer;

[0052] 8- Adhesive material;

[0053] X - First direction, Y - Second direction. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0055] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly fixed to or set on that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the purpose of description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this patent. The terms "first" and "second" are used only for the purpose of description and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly specified.

[0056] To illustrate the technical solutions described in this application, the following detailed description is provided in conjunction with specific drawings and embodiments.

[0057] Please see Figure 1 and Figure 3 As shown, this application first provides an LED display screen 100, which includes a plurality of spliced ​​LED display units 1.

[0058] Specifically, see Figure 1 As shown, a first direction X and a second direction Y that are perpendicular to each other are defined on the surface of the LED display screen 100, and a plurality of LED display units 1 are arranged along the first direction X and / or the second direction Y.

[0059] In one specific embodiment, a plurality of LED display units 1 are arranged in a rectangular array along the first direction X and the second direction Y.

[0060] Please refer to the following: Figure 1 and Figure 3As shown, each LED display unit 1 includes a circuit board 11, multiple light-emitting elements 13, and a mask 15. The circuit board 11 has a first surface 111 and a second surface 112 disposed opposite to each other. The light-emitting elements 13 are disposed on the first surface 111 of the circuit board 11 and arranged along the first direction X and the second direction Y. The mask 15 is stacked on the first surface 111 of the circuit board 11. The mask 15 has multiple first cutout areas 151 through which the light-emitting elements 13 pass. The mask 15 is used to block areas other than the light-emitting elements 13, and is made of non-transparent material to serve as a dark background between the light-emitting elements 13.

[0061] In this embodiment, please refer to Figure 3 As shown, an optical structure 156 is provided on the surface of the mask 15 facing away from the circuit board 11. This optical structure 156 is used to receive external light (see...). Figure 3 The incident ray 52 shown in the figure, and guides the external ray along the first direction X and the second direction Y (see Figure 1 The optical waveguide path shown is 53). See also... Figure 3 As shown, the LED display unit 1 also includes multiple photodetectors 2 and a controller 3. The photodetectors 2 are installed in the second cutout area 152 of the mask 15 and arranged between the light-emitting elements 13 along the first direction X and the second direction Y, for receiving external light transmitted by the optical structure 156. The controller 3 is connected to each photodetector 2. The photodetector 2 that receives external light is triggered and sends a trigger signal to the controller 3.

[0062] like Figure 1 As shown, the photodetectors 2 are arranged along the first direction X and the second direction Y, which can be equivalent to defining mutually perpendicular X-axis and Y-axis on the first surface 111 of the circuit board 11. Each photodetector 2 arranged along the first direction X has a corresponding Y-axis coordinate point y, and each photodetector 2 arranged along the second direction Y has a corresponding X-axis coordinate point x.

[0063] When external light (such as) Figure 1 As shown, for example, when the incident light 52 from the laser pointer 51 is incident on a certain position on the LED display unit 1, the optical structure 156 converts the light into light that is conducted inside it, that is, conducted in the XY plane along the first direction X and the second direction Y, until the light reaches at least one photodetector 2 in the first direction X and at least one photodetector 2 in the second direction Y.

[0064] Thus, the controller 3 can determine the coordinates (x, y) of the incident light based on the X-axis and Y-axis coordinates of the multiple triggered photodetectors 2.

[0065] Furthermore, the controller 3 (for example, the control terminal of the LED display unit 1) can send a control signal to the light-emitting element 13 at or around the corresponding coordinate point according to the coordinate point (x,y) of the location of the incident light spot 520. Then, the LED display unit 1 can display at the coordinate point (x,y) according to the control signal.

[0066] The LED display unit 1 provided in this application embodiment has an optical structure 156 on its mask 15 that can convert light from the outside into light that is transmitted in-plane. A photodetector 2 is set on the mask 15 and along the light transmission path. The position of the incident light spot 520 is confirmed by the triggering signals of multiple photodetectors 2, thereby realizing the user's interaction with the LED display unit 1 in the air. Furthermore, it is not necessary to add structures such as emitting tubes and receiving tubes to the edge of the LED display unit 1, it does not need to work continuously, and it does not increase the bezel width. The setting of the photodetectors 2 and the optical structure 156 is not limited by the splicing of the LED display units 1, and it is particularly suitable for large screen displays.

[0067] The length (dimension in the first direction X) and width (dimension in the second direction Y) of the photodetector 2 can be smaller than the line width of the mask 15 in the first direction X and the second direction Y, so as not to affect the size design of the existing LED display unit 1, nor the splicing design between two adjacent LED display units 1. Furthermore, the second cutout area 152 is not connected to the first cutout area 151.

[0068] On the entire LED display screen 100, photodetectors 2 can be arranged along a row (the row direction corresponds to the first direction X) and a column (the column direction corresponds to the second direction Y), or along multiple rows and / or multiple columns. It is sufficient that at least one photodetector 2 can be triggered when light from any position is transmitted along the first direction X and the second direction Y.

[0069] In one embodiment, in each LED display unit 1, photodetectors 2 are arranged along a row and a column, such as... Figure 1 As shown. Not limited to this, in other alternative embodiments, depending on the size, resolution, etc. of the LED display unit 1, the photodetector 2 may be arranged along multiple rows and / or columns in each LED display unit 1.

[0070] Furthermore, such as Figure 1As shown, in two adjacent LED display units 1, the photodetectors 2 are aligned in a first direction X and / or a second direction Y. This includes that in two adjacent LED display units 1 in the first direction X, their photodetectors 2 can be aligned along the first direction X and have the same Y-axis coordinate point, and / or, in two adjacent LED display units 1 in the second direction Y, their photodetectors 2 can be aligned along the second direction Y and have the same X-axis coordinate point.

[0071] In one specific embodiment, such as Figure 1 As shown, in two adjacent LED display units 1 in the first direction X, their photodetectors 2 are aligned along the first direction X, and in two adjacent LED display units 1 in the second direction Y, their photodetectors 2 are aligned along the second direction Y.

[0072] The purpose of this arrangement is that the position of the photodetector 2 is the same in each LED display unit 1, that is, the position of the second cutout area 152 on the mask 15 is also the same. In this way, the installation of the mask 15 and the photodetector 2 on the LED display unit 1 can be mass-produced and implemented, simplifying the manufacturing steps of the LED display unit 1 and the entire LED display screen 100.

[0073] In each LED display unit 1, a photodetector 2 can be positioned at the midpoint between the first direction X and the second direction Y of the mask 15, such as... Figure 1 As shown. Furthermore, in more alternative embodiments, the photodetector 2 can be arranged in other positions according to specific needs, which will not be listed here again.

[0074] Please refer to the following: Figure 1 , Figure 3 As shown, in this LED display screen 100, the splicing accuracy between LED display units 1 can also be detected by the photodetector 2 detecting the incident light 52. Specifically, when a certain LED display unit 1 is not spliced ​​properly, and the splicing gap between it and an adjacent LED display unit 1 in the first direction X exceeds the allowable range, the four photodetectors 2 (upper, lower, left, and right) will give two different coordinate points (x, y1) and (x, y2).

[0075] Please refer to the following: Figure 1 and Figure 2 As shown, the number of photodetectors 2 can be set according to the size of the incident light spot 520 formed on the surface of the mask 15 by the incident light 52 and the size of the pixel (the distance between the center points of the two light-emitting elements 13).

[0076] For example, if the size of the incident light spot 520 is not significantly different from the size of the pixel, then the number of photodetectors 2 in one row and one column is the same as the number of light-emitting elements 13 in one row and one column. If the size of the incident light spot 520 is significantly larger than the size of the pixel, then the number of photodetectors 2 in one row and one column can be less than the number of light-emitting elements 13 in one row and one column. If the size of the incident light spot 520 is significantly smaller than the size of the pixel, then the number of photodetectors 2 in one row and one column can be more than the number of light-emitting elements 13 in one row and one column. In short, the number of photodetectors 2 should be set so that the beam formed by the diffraction of the incident light spot 520 at any position can be detected.

[0077] Please see Figure 3 As shown, a fixing member 4 is provided in the second hollow area 152 of the mask 15, and the photodetector 2 is located in the fixing member 4 to ensure that the photodetector 2 can be stably installed in the mask 15 without shaking or shifting.

[0078] The fastener 4 is made of a light-transmitting material so as not to affect the transmission of light from the optical structure 156 to the photodetector 2.

[0079] The form of the fastener 4 is not limited. For example, it can be a structure with a certain degree of elasticity, such as an elastic ring or an elastic buckle, which uses the pressure provided by its own elastic deformation to fix the photodetector 2 in the second hollow area 152; or, the fastener 4 can be an adhesive, which is applied to the second hollow area 152 and around the photodetector 2 and cured. Other forms of the fastener 4 are not listed here.

[0080] In addition, in other alternative embodiments, if the photodetector 2 itself can be stably connected to the inner wall of the second hollow area 152, the fastener 4 can be removed as needed.

[0081] The photodetector 2 can be directly powered by the circuit board 11. That is, at least a portion of the power supply lines (not shown) are formed on the first surface 111 of the circuit board 11, and the power supply lines are connected to an external power source (not shown) via the circuit board 11. When the photodetector 2 is disposed on the first surface 111, it can be directly soldered to the power supply lines. The power supply lines of the photodetector 2 are not connected to the power supply lines of the light-emitting element 13.

[0082] Alternatively, the photodetector 2 can be directly powered by an external power supply located outside of the circuit board 11. Please refer to [link / reference]. Figure 3 As shown, the circuit board 11 has a through hole 110 that passes through its first surface 111 and second surface 112. The trace 20 of the photodetector 2 extends from the through hole 110 to the second surface 112 of the circuit board 11 and then connects to an external power supply. Due to the setting of the through hole 110, the trace 20 can be hidden.

[0083] Alternatively, the trace 20 of the photodetector 2 can extend from the first surface 111 to the edge of the circuit board 11, and then extend in the opposite direction to the second surface 112 of the circuit board 11, and then be connected to an external power supply.

[0084] Please see Figure 3 As shown, the optical structure 156 includes a diffraction grating 1560. The diffraction grating 1560 diffracts the incident light rays, and the diffracted light rays can be transmitted in the XY plane.

[0085] Specifically, the diffraction grating 1560 is composed of a group of periodically arranged slits 1561. There are protrusions 1562 between adjacent slits 1561.

[0086] The period of the diffraction grating 1560 should be designed to be able to diffract the incident light 52 significantly, while not diffracting the ambient light significantly, so that the photodetector 2 can detect the incident light 52 without being affected by the ambient light.

[0087] For example, the incident ray 52 can be infrared light with a size greater than 700 nanometers. The diffraction grating 1560 has a period of 400 nanometers to 1 micrometer and a height of 500 nanometers to 2 micrometers.

[0088] The longitudinal section of slit 1561 corresponds to the longitudinal section of protrusion 1562. Here, only the longitudinal section of slit 1561 is described. For example... Figure 3 As shown, in one embodiment, the longitudinal section of slit 1561 is rectangular. In other alternative embodiments, the longitudinal section of slit 1561 can also be triangular, trapezoidal, parallelogram, etc.

[0089] Please continue reading. Figure 3 As shown, the face mask 15 includes a sheet-like base layer 155, and an optical structure 156 is formed on the side surface of the base layer 155 facing away from the circuit board 11. The base layer 155 is made of an opaque material, and the optical structure 156 is made of a light-transmitting material. The base layer 155 and the optical structure 156 are separately molded and then joined together.

[0090] The aforementioned first hollow area 151 and second hollow area 152 are both formed by penetrating the base layer 155 and the optical structure 156.

[0091] In addition, please see Figure 2 As shown, the face mask 15 also has one or more mounting holes 153. Fasteners (such as screws, not shown) pass through the mounting holes 153 and are fixed to the circuit board 11 to fix the face mask 15 and the circuit board 11 together.

[0092] Next, please refer to Figure 4 and Figure 5 As shown, this application embodiment also provides a method for manufacturing an LED display unit, used to manufacture the LED display unit 1 as described in the foregoing embodiments. Specifically, the method for manufacturing the LED display unit includes:

[0093] Step S1: Provide a mask 15 with a first cutout area 151, and create a second cutout area 152 on the mask 15 (the second cutout area 152 is in...). Figure 5 omitted).

[0094] Please refer to the following: Figure 2 As shown, multiple first cutout areas 151 on the mask 15 are arranged in an array along the first direction X and the second direction Y. The second cutout area 152 may be not connected to the first cutout area 151.

[0095] Step S2: Create a microstructure pattern 60 on the transparent transfer film 6, and set a light-blocking layer 7 at the positions corresponding to the first cutout area 151 and the second cutout area 152.

[0096] The transparent transfer film can be made of transparent materials such as PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), PC (polycarbonate), and PDMS (polydimethylsiloxane). Microstructure patterns 60 covering the entire surface of the transparent transfer film 6 can be fabricated using methods such as laser engraving or chemical etching.

[0097] The light-blocking layer 7 mentioned above can be an opaque coating, such as a black coating or a black adhesive layer.

[0098] Step S3: Apply adhesive material 8 to the transparent transfer film 6 to avoid the position of the light-blocking layer 7.

[0099] Specifically, after the adhesive material 8 is vacuum degassed, it is coated onto the transparent transfer film 6 using processes such as dispensing or inkjet printing to avoid the position of the light-blocking layer 7.

[0100] Adhesive material 8 is a single-component adhesive. For example, acrylic adhesives are mainly composed of acrylic monomers; silanol adhesives contain silanol monomers; and vinyl adhesives contain vinyl monomers.

[0101] Step S4: Press the mask 15 and the adhesive material 8 together, and irradiate the adhesive material 8 from one side of the transparent transfer film 6.

[0102] Specifically, the adhesive material 8 is degassed by vacuuming, and the adhesive material 8 is irradiated with a UV (Ultraviolet) lamp at a point on the transparent transfer film 6 away from the mask 15 so that the adhesive material 8 is cured in a position that avoids the light-blocking layer 7.

[0103] The irradiation time can be 10 to 60 seconds.

[0104] Step S5: Remove the transparent transfer film 6 and remove the uncured adhesive material 8.

[0105] Specifically, after removing the transparent transfer film 6, clean the uncured adhesive material 8 from the surface of the mask 15. The mask 15 can be cleaned using methods such as alcohol cleaning or ultrasonic cleaning. This results in an optical structure 156 on the mask 15 that avoids the first cutout area 151 and the second cutout area 152.

[0106] The optical structure 156 is opposite to the microstructure pattern 60, with the protrusion 1562 of the optical structure 156 corresponding to the depression of the microstructure pattern 60.

[0107] Step S6: Install the photodetector 2 in the second cutout area 152, and stack the mask 15 with the circuit board 11 so that the light-emitting element 13 on the circuit board 11 passes through the first cutout area 151.

[0108] The trace 20 of the photodetector 2 reaches the second surface 112 of the circuit board 11 via the through hole 110 on the circuit board 11, or the trace 20 of the photodetector 2 extends from the first surface 111 of the circuit board 11 to the edge and then reaches the second surface 112.

[0109] It also includes step S7, which involves splicing multiple LED display units 1 together to form an LED display screen 100.

[0110] In step S8, a laser pointer 51 (such as a laser pointer that can emit infrared light) is used to test the air interaction function of the LED display screen 100.

[0111] Please see Figure 6 and Figure 7 As shown, this application embodiment also provides another method for manufacturing an LED display unit, used to manufacture the LED display unit 1 as described in the foregoing embodiments. Specifically, the method for manufacturing the LED display unit includes:

[0112] Step S1: Provide a mask 15 with a first cutout area 151, and create a second cutout area 152 on the mask 15 (the second cutout area 152 is in...). Figure 7 omitted).

[0113] Step S2: Create a microstructure pattern 60 on the transparent transfer film 6, avoiding the first cutout area 151 and the second cutout area 152.

[0114] Specifically, a groove 61 can be formed on the transparent transfer film 6, avoiding the first hollow area 151 and the second hollow area 152, and a microstructure pattern 60 can be prepared in the groove 61 by means of laser engraving or chemical etching.

[0115] Step S3: Apply adhesive material 8 onto the microstructure pattern 60.

[0116] The adhesive material 8 can be a two-component adhesive, such as epoxy resin, silicone resin, polyurethane, or other transparent adhesives. After being mixed and stirred evenly, it is degassed under vacuum and then coated into the grooves 61 of the transparent transfer film 6 using dispensing or inkjet printing. The coating thickness of the adhesive material 8 shall not exceed the depth of the grooves 61.

[0117] Step S4: Press the mask 15 onto the adhesive material 8 and cure the adhesive material 8.

[0118] Press the mask 15 onto the transparent transfer film 6, apply a certain load (e.g., 1 kg to 4 kg), vacuum degas the entire film for a certain time (e.g., 1 minute to 10 minutes), and then cure at room temperature (12 hours to 48 hours) or at high temperature (1 hour to 5 hours).

[0119] Step S5: Remove the transparent transfer film 6.

[0120] In this way, an optical structure 156 is obtained on the mask 15 that avoids the first cutout area 151 and the second cutout area 152.

[0121] Step S6: Install the photodetector 2 in the second cutout area 152, and stack the mask 15 with the circuit board 11 so that the light-emitting element 13 on the circuit board 11 passes through the first cutout area 151.

[0122] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An LED display unit, characterized in that, include: Circuit board; Multiple light-emitting elements are arranged on a first surface of the circuit board along mutually perpendicular first and second directions; A face mask is stacked on the first surface, and the face mask has a plurality of first cutout areas for the light-emitting elements to pass through; the surface of the face mask facing away from the circuit board has an optical structure for receiving external light and conducting the external light along the first direction and the second direction; Multiple photodetectors are disposed in the second hollow area of ​​the mask and arranged along the first and second directions to receive the external light transmitted by the optical structure; as well as A controller, connected to each of the photodetectors, is used to determine the incident position of the external light based on the transmission signal of the triggered photodetector.

2. The LED display unit as described in claim 1, characterized in that, The photodetectors are arranged in at least one row along the first direction and one column along the second direction.

3. The LED display unit as described in claim 1 or 2, characterized in that, The photodetector trace extends from the first surface through the edge of the circuit board to the second surface of the circuit board; or, the circuit board has a through hole, and the photodetector trace extends from the through hole to the second surface of the circuit board.

4. The LED display unit as described in any one of claims 1 to 3, characterized in that, The optical structure includes a diffraction grating comprising periodically arranged slits.

5. The LED display unit as described in claim 4, characterized in that, The period of the diffraction grating is 400 nanometers to 1 micrometer, and / or the height of the diffraction grating is 500 nanometers to 2 micrometers.

6. The LED display unit as described in any one of claims 1 to 5, characterized in that, A fixing component is provided in the second hollow area, and the photodetector is located inside the fixing component.

7. The LED display unit as described in any one of claims 1 to 6, characterized in that, The mask includes a base layer disposed on the first surface, and the optical structure is disposed on the base layer; the base layer is a non-transparent layer.

8. An LED display screen, characterized in that, The display units, as described in any one of claims 1 to 7, are arranged in an array, wherein the photodetectors are aligned in the first direction and / or the second direction between the display units.

9. A method for manufacturing an LED display unit, used to manufacture an LED display unit as described in any one of claims 1 to 7, characterized in that, include: A face mask with a first cutout area is provided, and a second cutout area is made on the face mask; Microstructure patterns are fabricated on a transparent transfer film, and light-blocking layers are set at positions corresponding to the first and second cutout areas; Apply adhesive material to the transparent transfer film, avoiding the position of the light-blocking layer; The mask is pressed together with the adhesive material, and the adhesive material is irradiated from one side of the transparent transfer film. Remove the transparent transfer film and remove any uncured portion of the adhesive. A photodetector is installed in the second cutout area, and the mask is stacked with the circuit board so that the light-emitting element on the circuit board passes through the first cutout area.

10. A method for manufacturing an LED display unit, used to manufacture an LED display unit as described in any one of claims 1 to 7, characterized in that, include: A face mask with a first cutout area is provided, and a second cutout area is made on the face mask; Microstructure patterns are fabricated on the transparent transfer film at positions corresponding to the first and second cutout areas; The adhesive material is applied to the microstructure pattern; The mask is pressed onto the adhesive material, and the adhesive material is cured. Remove the transparent transfer film; A photodetector is installed in the second cutout area, and the mask is stacked with the circuit board so that the light-emitting element on the circuit board passes through the first cutout area.

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