Pulse laser and control method thereof
By introducing a controller and scanner into the laser ablation system, combined with gain medium and pumping technology, precise control of the laser beam movement and energy distribution on large areas of skin is achieved, solving the problem of difficulty in achieving uniform ablation on large areas of skin in existing technologies, and realizing controllable ablation diameter and depth.
Patent Information
- Application Number
- CN202480019035.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-01-26
- Filing Date
- 2024-01-25
- Publication Date
- 2025-10-31
AI Technical Summary
Existing laser systems struggle to achieve precise and uniform ablation over relatively large tissue areas in the medical field, especially when creating small ablation points on large areas of skin, requiring precise control over the position, width, and depth of each point.
A laser ablation system is employed, comprising a laser cavity, a gain medium, a pump, a scanner, and a controller. By receiving the system and the desired pulse frequency, the system calculates the position and number of points in the grid, controls the movement of the laser beam, and achieves precise coverage of the treatment area. Furthermore, the system adjusts the pulse frequency and energy according to user input to achieve the desired ablation diameter and depth.
It achieves precise and uniform ablation effects on large areas of skin, and can achieve controllable agglomeration diameter and depth at multiple locations, thus improving the uniformity and precision of ablation.
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Figure CN120882382A_ABST
Abstract
Description
[0001] Cross-reference to related applications
[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 441,185, filed January 26, 2023, entitled “PULSATING LASER AND METHOD OF CONTROL THEREOF”. The contents of all the foregoing applications are incorporated herein by reference in their entirety. Technical Field
[0003] Exemplary embodiments of the present invention generally relate to pulsed lasers. More specifically, the present invention relates to controlling pulsed lasers to achieve desired ablation at multiple locations and having a controllable coagulation diameter. Background Technology
[0004] Laser systems are widely used in the medical field, for example, to perform precise surgical procedures or any skin intervention. An advantage of laser systems is their ability to generate high-energy laser beams focused at tiny, precise locations. Current laser systems used in this art can include active or passive Q-switches for creating nanosecond-level laser pulses.
[0005] In some medical procedures (such as cosmetic lasers), lasers are used to create small ablation points on a large area of skin. Ablation must be as precise and uniform as possible, and should cover a relatively large area (e.g., several square centimeters). Therefore, each of the following parameters must be controlled: the location of each point, the width of each point, and the depth of each point.
[0006] Therefore, there is a need for a laser system capable of generating controlled ablation scans over relatively large tissue areas. Summary of the Invention
[0007] Embodiments of the present invention relate to a laser ablation system, comprising: a laser cavity; a gain medium disposed within the laser cavity, configured to generate a pulsed laser beam of a specific wavelength; a pump configured to optically pump the laser medium; a scanner configured to control the movement of the laser beam; and a controller. In some embodiments, the controller is configured to: receive a system pulse frequency; receive a desired pulse frequency; calculate, based on the system pulse frequency and the desired pulse frequency, the number of points to be included in a grid, wherein each point corresponds to the position of a pulse; receive at least one of the following: the size of the treatment area, the shape of the treatment area, and the desired pulse density; determine, based on the received size of the treatment area, the shape of the treatment area, and the desired pulse density, the number of grids required to cover the treatment area and the position of the pulse in each grid; and control the pump and the scanner to provide laser pulses to all positions in each grid.
[0008] In some embodiments, the controller is further configured to receive the desired agglomeration diameter at each location from the user interface and determine the desired pulse frequency based on the desired agglomeration diameter. In some embodiments, the controller is further configured to: receive N pulses to be provided to each location; determine a sequence of pulse-providing locations in the grid for each grid; and repeat the sequence N times. In some embodiments, the controller is further configured to receive the desired ablation depth from the user interface and determine N based on the desired ablation depth. In some embodiments, at least some of the grids have different N values.
[0009] In some embodiments, receiving the system pulse frequency includes one of the following: receiving the system pulse frequency from a database and measuring the system pulse frequency using an energy meter. In some embodiments, the number of points to be included in the computation grid is determined by dividing the system pulse frequency by the desired pulse frequency.
[0010] In some embodiments, if the number of grids required to cover the treatment area is not an integer, the method may include adjusting at least one of the following: the size of the treatment area, the system pulse frequency, and the desired pulse frequency. In some embodiments, adjusting the desired pulse frequency includes selecting a pulse frequency from a range of pulse frequencies. In some embodiments, adjusting the size of the treatment area includes providing a user with a selection of optional treatment areas, each corresponding to a product of the grid area and an integer. In some embodiments, the system pulse frequency is adjusted by changing the current supplied to the laser pump.
[0011] Some additional aspects of the present invention relate to a method for controlling a laser ablation system, comprising: receiving a pulse frequency of the laser ablation system; receiving a desired pulse frequency; calculating, based on the system pulse frequency and the desired pulse frequency, the number of points to be included in a grid, wherein each point corresponds to the position of a pulse; receiving at least one of the following: the size of a treatment area, the shape of the treatment area, and a desired pulse density; determining, based on the received size of the treatment area, the shape of the treatment area, and the desired pulse density, the number of grids required to cover the treatment area and the position of a pulse in each grid; and controlling a pump configured to optically pump a laser medium and a scanner configured to control the movement of the laser pulses to provide laser pulses to all positions in each grid. Attached Figure Description
[0012] The subject matter of this invention is specifically pointed out and explicitly claimed in the concluding section of the specification. However, the organization and operation of the invention, as well as its objects, features, and advantages, can be best understood by referring to the following detailed description when read in conjunction with the accompanying drawings, wherein:
[0013] Figure 1A This is a block diagram of a laser ablation system according to some embodiments of the present invention;
[0014] Figure 1B This is a block diagram of a laser cavity according to some embodiments of the present invention;
[0015] Figure 1C This is a block diagram of a computing device for a laser system according to some embodiments of the present invention;
[0016] Figure 2 This is a flowchart of a method for controlling a laser ablation system according to some embodiments of the present invention;
[0017] Figure 3A and Figure 3B This is an illustration of a grid of laser dots in an area to be treated by a laser ablation system according to some embodiments of the present invention; and
[0018] Figure 4 This is a flowchart of another method for controlling a laser ablation system according to some embodiments of the present invention.
[0019] It should be understood that, for the sake of simplicity and clarity, the elements shown in the figures are not necessarily drawn to scale. For example, the dimensions of some elements may be exaggerated relative to others for clarity. Furthermore, where appropriate, reference numerals may be repeated in the figures to indicate corresponding or similar elements. Detailed Implementation
[0020] Those skilled in the art will recognize that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the above embodiments should be considered in all respects as illustrative rather than limiting of the invention described herein. Accordingly, the scope of the invention is indicated by the appended claims rather than by the foregoing description, and therefore all variations within the equivalent meaning and scope of the claims are intended to be included therein.
[0021] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, those skilled in the art will understand that the invention can be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the invention. Some features or elements described with respect to one embodiment may be combined with features or elements described with respect to other embodiments. For clarity, the discussion of the same or similar features or elements may not be repeated.
[0022] This document discloses a laser system, such as a laser operating in the 2-micrometer (“μm”) wavelength range, for example 1.8–2.2 μm, 1.85–2.2 μm, 1.85–2.05 μm, 1.85–2.0 μm, 1.9–2.1 μm, or any value between these ranges. In some embodiments, the laser is a pulsed laser, which can be used for a variety of applications, such as surgery, for any type of tissue ablation and / or coagulation, cosmetic applications, military applications, materials processing, optical communications, lidar (LIDAR), etc.
[0023] In some embodiments, the laser system disclosed herein may include a q-switching element to control the laser beam of the laser system. As used herein, the term "q-switching element" may refer to a passive q-switch (also known as a "saturable absorber (SA)") or an active q-switch. In some embodiments, the q-switching element may control the laser beam, for example, modulate the pulses of the laser beam. In a non-limiting example, the q-switching element may include a saturable absorber (SA) that can passively absorb the laser beam to produce a pulsed laser beam of desired energy, as discussed further below.
[0024] Now for reference Figure 1A , Figure 1A This is a block diagram of a laser ablation system according to some embodiments of the present invention. According to some aspects, the laser system 1000 may include a pump 110 (e.g., a pump diode) configured to optically pump a laser medium. In some embodiments, the pump 110 is used to provide a laser beam to the laser cavity 200, specifically in conjunction with… Figure 1B Let's discuss this in detail.
[0025] In some embodiments, pump 100 may be tuned to provide a beam with a wavelength matching the corresponding absorption peak of the gain medium, as described below. Various pumping schemes and pumping configurations are known in the art, and some of these may be applied to this disclosure. In some embodiments, pump diode 100 may include direct pumping. In some embodiments, pump diode 100 configurations may include side pumping and end pumping.
[0026] In some embodiments, the laser beam (such as...) Figure 1B The light beam 50 shown is guided from cavity 200 to collimating optics 300. In some embodiments, the collimating optics is a converging lens. In some embodiments, the focal length of the lens is determined based on the limitations imposed by scanner 500 and arm 600 on the laser beam diameter. For example, if the mirror diameter of scanner 500 is 10 mm, the optimal laser beam diameter must not exceed 6 mm. If the half-angle of laser beam 50 is 6 mrad, the focal length of collimating optics 300 must not exceed 500 mm.
[0027] In some embodiments, system 1000 may further include shutter 400, which may be any optical shutter. In some embodiments, the shutter blocks the laser beam by mechanical means. For example, the shutter blocking mechanism may consist of a single blade or an aperture stop. Shutter 400 may be configured to control the supply of the laser beam. In some embodiments, system 1000 may not include a shutter.
[0028] In some embodiments, system 100 includes at least one scanner 500 and / or scanner 550. Scanner 500 and / or scanner 550 can allow a laser beam to automatically move from one location to another. For example, according to... Figure 3A and Figure 3B The scanning schemes shown and discussed, scanner 500 and / or scanner 550, can allow a pulsed laser beam to scan from one point on a grid to another.
[0029] In some embodiments, scanner 500 may be located after shutter 400 or directly after collimating optics 300. Alternatively, scanner 550 may be located after arm 600 and before focusing optics 700.
[0030] Some non-limiting examples of scanner 500 and / or scanner 550 may include a galvanometer reflector scanner (galvanometer scanner) piezoelectric quick-steering reflector, a voice coil driven steering reflector, an electro-kinematic reflector bracket, and an electro-universal bracket.
[0031] In some embodiments, arm 600 may include a set of two or more pivotally connected hollow tubes configured to deliver and manipulate the direction of a laser beam. Arm 600 may include a set of mirrors, prisms, or any other desired optical elements that allow direct manipulation of the laser beam. Arm 600 can be operated by a user (e.g., a professional) to direct the laser beam toward the area to be treated, such as the user's cheek. Figure 3B As shown. In some embodiments, arm 600 may include relay optics to maintain the properties of laser beam 50 over the length of the arm. In some embodiments, the relay optics in the arm convert angular movement from scanner 500 to focusing optics 700 while confining laser beam 50 within the arm.
[0032] In some embodiments, the system 1000 may also include a focusing optics 700, which may include converging and diverging lenses and diffractive elements or any combination thereof.
[0033] In some embodiments, all controllable components of system 1000 can be determined by... Figure 1CThe computing device 10 shown and discussed is controlled. The computing device 10 can control at least the laser pump 100, the scanner 500 and / or the scanner 550 to provide pulsed laser beams for automatically scanning areas (e.g., user skin).
[0034] Now for reference Figure 1B , Figure 1B This is a block diagram of a laser cavity 200 according to some embodiments of the present invention. In some embodiments, a laser pump 100 may provide a laser beam to a first end of the laser cavity 200.
[0035] In some embodiments, the laser pump 100 may provide a pump beam to the gain medium 235, for example, via a mirror 220. A non-limiting exemplary gain medium 235 is selected from materials doped with rare earth elements (also referred to as "laser crystals"). In some embodiments, the material is a crystal selected from yttrium aluminum garnet ("YAG"), lithium yttrium fluoride ("YLF"), and yttrium aluminum phosphorus ("YAP"). In some embodiments, the rare earth element is selected from thulium (Tm), holmium (Ho), erbium (Er), or any combination thereof.
[0036] Further non-limiting exemplary gain medium 235 is selected from: Tm:YAG, Tm:YVO4, Tm:YLF, Tm:YAP, or Tm:LuAG. In some embodiments, Tm in the bulk crystal material of the laser crystal 3+ The concentration of the dopant is inversely proportional to the length of the laser crystal. In some embodiments, Tm 3+ The concentration of the dopant is between about 0.2 wt.% and about 8 wt.%, and any value in between, such as 1-6 wt.%, 2-7 wt.%, 2-8, 0.5 to 7 wt.%, etc.
[0037] In some embodiments, the gain medium 235 may be disposed within the laser cavity 200.
[0038] In some embodiments, the laser cavity 200 may include a q-switching element 250. In some embodiments, the q-switching element 250 may be disposed within the laser cavity 200.
[0039] In some embodiments, the q-switching element 250 may be in the form of a thin layer or a thin film. In some embodiments, a non-limiting exemplary q-switching element 140 may include a material selected from doped ZnS crystals and doped ZnSe crystals, such as chromium-doped ZnSe crystals, chromium-doped ZnS crystals, Ho-doped materials (such as Ho:YAG, Ho:YLF, Ho:YAP, Ho-doped fibers), or combinations thereof. In some embodiments, a further non-limiting exemplary q-switching element 140 may include a material selected from doped silver halides or chalcogenides.
[0040] In some cases, Cr:ZnSe and chromium-doped zinc sulfide (“Cr:ZnS”) SA can have relatively high absorption cross sections, thus eliminating the need for focusing modes on small regions of the SA. This provides greater flexibility for the resonator. In some embodiments, Cr:ZnSe and Cr:ZnS saturable absorbers can have low saturable strengths, which can reduce the risk of damage during Q-switching operation.
[0041] In some exemplary embodiments of this subject matter, Cr:ZnS crystal saturable absorbers can be applied to several passive Q-switched (“PQS”) lasers, such as Ho:YAG, Tm:KY(WO4), Tm:KLu(WO4), etc. In some cases, when σ SA / A sA >σ g / A g When SA can achieve passive Q switching, σ SA and σ g Let A represent the absorption cross section of the saturable absorber and the emission cross section of the gain medium at the laser wavelength, respectively. SA and A g It can be the mode area at the saturable absorber and the gain medium.
[0042] In some embodiments, the gain (laser) medium 235 and the q-switching element 250 are arranged along the same longitudinal axis.
[0043] In some embodiments, the laser cavity 200 may further include: a first reflector 220, a first etalon 240, and a second reflector 245.
[0044] In some embodiments, the radii of curvature of the concave / convex first reflector 220 can be in the range of -50 to plano and 30 to plano, respectively, and any value in between, such as -100 to plano and 50 to plano, -200 to plano and 100 to plano, etc. In some embodiments, the first reflector 220 can be positioned in the optical path, for example, approximately along the longitudinal axis of the laser cavity 200.
[0045] In some embodiments, the first etalon 240 is paired with a second etalon (not shown) further disposed within the laser cavity 200. In some embodiments, at least one first etalon or the second etalon may be configured to provide tunability of the spectral range of the laser beam relative to the laser beam 50.
[0046] In some embodiments, the second etalon is positioned next to the first etalon 240, so that the first and second etalons are positioned in the optical path of the laser beam.
[0047] In some embodiments, the etalons 240A and 240B are positioned along a horizontal axis 290 including the gain medium 235. In some embodiments, the horizontal axis 290 may be defined at an angle of up to ±60 degrees to the longitudinal axis.
[0048] In some embodiments, etalons 240A and 240B provide a tunable spectral range and narrow spectral bandwidth for the laser. In some embodiments, the transmission band of the laser is determined by the reflectivity, thickness, and refractive index of etalons 240A and 240B, thus adjusting its pulse width. In some embodiments, the tunability range is at least 10 nm, at least 14 nm, at least 20 nm, at least 25 nm, at least 30 nm, or at least 35 nm. In some embodiments, the tunability range is from 8 to 50 nm, or in some embodiments from 8 to 15 nm, or in some embodiments from 10 to 15 nm, or in some embodiments from 15 to 20 nm, or in some embodiments from 20 to 30 nm, or in some embodiments from 30 to 35 nm, or in some embodiments from 35 to 40 nm.
[0049] In some embodiments, the adjustable range may depend on the gain medium 235. In some embodiments, the adjustable range may depend on the reflection level of the output coupler and / or the transmission level of the q-switching element.
[0050] In some embodiments, the first standard is thinner than the second standard.
[0051] In some embodiments, the thickness ratio of the first etalon 240 to the second etalon is from 1:5 to 1:40. In some embodiments, the thickness ratio of etalon 240A to etalon 240B is 1:5, 1:10, 1:15, 1:20, 1:25, 1:30, 1:35 or 1:40, including any value and range therein.
[0052] Without being constrained by any particular theory or institution, it is assumed that a thinner etalon allows for tunability of the spectral range. In some embodiments, the thickness of a thinner etalon provides wider tunability of the spectral range. Furthermore, and without being constrained by any particular theory or institution, it is assumed that the maximum thickness of a thicker etalon is limited in response to narrowing of the spectral bandwidth to avoid the occurrence of two spatially adjacent modes. In some embodiments, two etalons are used to provide both the characteristics of tunability of the spectral range and narrowing of the spectral bandwidth.
[0053] In some embodiments, the first etalon and the second etalon may comprise a total or partial reflective material, such as a coating.
[0054] In some embodiments, the laser cavity 200 may have a Q-switching element 250 that allows the laser system 1000 to operate in pulsed mode. In some embodiments, the Q-switching element 250 may be a passive Q-switching element, or alternatively, an active Q-switching element.
[0055] In some embodiments, the active Q-switching element 250 may be an optical modulation unit, which is located within a resonator in some embodiments. In some embodiments, an acousto-optic modulator (AOM), an electro-optic modulator (EOM), or an acousto-optic tunable filter (AOTF) may be included as an optical modulator within the optical modulation unit.
[0056] In some embodiments, the laser cavity 200 may have a Q-switching element, such as an acousto-optic modulator (AOM). In some embodiments, the AOM may be positioned in the optical path of the laser beam, for example, generally along the longitudinal axis of the laser cavity 200.
[0057] In some embodiments, the AOM can be configured to receive and modulate a seed laser beam. In some embodiments, the laser beam can be arranged to be incident on the AOM approximately at a Bragg angle. In some embodiments, the AOM can allow the generation of a pulsed output beam. In some embodiments, the AOM can control the timing of the pulses released from the seed laser.
[0058] In another configuration, the laser system 200 includes a passive Q-switching element 250 instead of an AOM. In some embodiments, the passive Q-switching element may be configured as a passive pulse switch to provide a laser beam. In some embodiments, a non-limiting example of the passive Q-switching element 250 is a saturable absorber (SA). In some embodiments, when the laser system 200 provides laser light to the passive Q-switching element 250, a short pulse laser beam may be generated. In some embodiments, a non-limiting exemplary Q-switching element 250 may include a material selected from doped ZnS crystals and doped ZnSe crystals (e.g., chromium-doped ZnSe crystals, chromium-doped ZnS crystals), Ho-doped materials (e.g., Ho:YAG, Ho:YLF, Ho:YAP Ho-doped fibers), or combinations thereof.
[0059] In some embodiments, the SA comprises a semiconductor. In some embodiments, the SA comprises a quantum dot. In some embodiments, the SA comprises a doped crystal. In some embodiments, non-limiting exemplary doped crystals are selected from: chromium (II)-doped zinc selenide (Cr:ZnSe) and chromium (II)-doped zinc sulfide (Cr:ZnS). In some embodiments, Cr in the doped crystal 2+The dopant concentration is between about 1% and about 20%, or in some embodiments from 9% to 13%. In some cases, Cr:ZnSe and Cr:ZnS SAs can have relatively high absorption cross sections, thus eliminating the need for focusing modes on small regions of the SA. In some embodiments, this can provide greater flexibility for the resonator. In some embodiments, Cr:ZnSe and Cr:ZnS SAs have low saturable intensity, which can reduce the risk of damage during Q-switching operation. In some embodiments, Cr:ZnS crystal SAs can be applied to several passive Q-switched (“PQS”) lasers, such as Ho:YAG, Tm:KY(WO4), Tm:KLu(WO4), etc.
[0060] In some embodiments, the laser beam 50 may be emitted at the second end of the laser cavity 200. In some embodiments, according to some aspects of the invention, the laser beam 50 may be a pulsed laser. In some embodiments, the characteristics of the laser beam 50 may be in terms of pulse energy, frequency, and laser wavelength due to the control of the laser pump 100 or the first etalon 240.
[0061] Now for reference Figure 1C , Figure 1C This is a block diagram depicting a computing device according to some embodiments of the present invention, which may be included in an embodiment of the laser ablation system 1000.
[0062] The computing device 10 may include a processor or controller 2 (which may be, for example, a central processing unit (CPU) processor, chip, or any suitable computing or computational device), an operating system 3, a memory 4, executable code 5, a storage system 6, an input device 7, and an output device 8. The processor 2 (or one or more controllers or processors, possibly spanning multiple units or devices) may be configured to perform the methods described herein, and / or perform or act as various modules, units, etc. A system according to embodiments of the present invention may include more than one computing device 10, and one or more computing devices 10 may act as components of the system.
[0063] Operating system 3 may be or may include any code segment (e.g., a code segment similar to executable code 5 described herein) designed and / or configured to perform tasks involving the coordination, scheduling, mediation, supervision, control, or otherwise management of operations related to computing device 10, such as scheduling the execution of software programs or tasks, or enabling software programs or other modules or units to communicate. Operating system 3 may be a commercial operating system. It should be noted that operating system 3 may be an optional component; for example, in some embodiments, the system may include computing devices that do not require or do not include operating system 3.
[0064] Memory 4 may be or may include, for example, random access memory (RAM), read-only memory (ROM), dynamic RAM (DRAM), synchronous DRAM (SD-RAM), double data rate (DDR) memory chip, flash memory, volatile memory, non-volatile memory, cache memory, buffer, short-term memory cell, long-term memory cell, or other suitable memory cell or storage unit. Memory 4 may be or may include multiple possibly different memory cells. Memory 4 may be a non-transient readable medium for a computer or processor, or a non-transient storage medium for a computer, such as RAM. In one embodiment, a non-transient storage medium (such as memory 4, a hard disk drive, another storage device, etc.) may store instructions or code that, when executed by a processor, may cause the processor to perform the methods described herein.
[0065] Executable code 5 can be any executable code, such as an application, program, process, task, or script. Executable code 5 can be executed by the processor or controller 2, possibly under the control of the operating system 3. Although for clarity, Figure 1C The document shows executable code 5 for a single item, but a system according to some embodiments of the invention may include multiple executable code segments similar to executable code 5, which may be loaded into memory 4 and cause processor 2 to execute the methods described herein.
[0066] Storage system 6 may be or may include, for example, flash memory, memory within or embedded in a microcontroller or chip, hard disk drive, CD-R drive, Blu-ray disc (BD), Universal Serial Bus (USB) device, or other suitable removable and / or fixed storage unit. Data relating the frequency of the laser beam to the diameter of the tissue ablation (e.g., a lookup table) and the laser power of the laser beam based on the ablation depth may be stored in storage system 6 and may be loaded from storage system 6 into memory 4, where the data may be processed by processor or controller 2. In some embodiments, this may be omitted. Figure 1C Some of the components shown are examples. For instance, memory 4 can be a non-volatile memory with the storage capacity of storage system 6. Therefore, although shown as a separate component, storage system 6 can be embedded in or included in memory 4.
[0067] Input device 7 may be or may include any suitable input device, component, or system, such as a detachable keyboard or keypad, mouse, etc. Output device 8 may include one or more (possibly detachable) displays or monitors, speakers, and / or any other suitable output device. As shown in boxes 7 and 8, any suitable input / output (I / O) devices may be connected to computing device 10. For example, a wired or wireless network interface card (NIC), a universal serial bus (USB) device, or an external hard drive may be included in input device 7 and / or output device 8. It should be appreciated that, as shown in boxes 7 and 8, any suitable number of input devices 7 and output devices 8 may be operatively connected to computing device 10.
[0068] Systems according to some embodiments of the present invention may include components such as, but not limited to, multiple central processing units (CPUs) or any other suitable multi-purpose or specific processors or controllers (e.g., similar to element 2), multiple input units, multiple output units, multiple memory units, and multiple storage units.
[0069] Now for reference Figure 2 , Figure 2 This is a flowchart of a method for controlling a laser ablation system (e.g., system 1000) according to some embodiments of the present invention.
[0070] Figure 2 The method can be executed by the controller 2 of the computing device 10 or any other suitable controller.
[0071] In step 210, the controller may receive the system pulse frequency, for example, from a database associated with system 1000, or from a user via a user interface (such as input device 7). The system pulse frequency is the frequency at which the beam 50 exits the laser cavity 200 and is primarily dependent on the q-switching element 250. In some embodiments, receiving the system pulse frequency includes one of receiving the system pulse frequency from a database or measuring the system pulse frequency using an energy meter.
[0072] In step 220, the controller may receive a desired pulse frequency. In some embodiments, the desired pulse frequency may be calculated based on the desired condensation diameter at each location. For example, the desired pulse frequency may be determined based on the pulse energy (a parameter of system 1000) and the desired condensation diameter. For example, one or more lookup tables including the desired condensation diameter and frequency may be stored in memory (e.g., storage system 6). Non-limiting examples of such tables are given and discussed below with reference to Table 1. In the non-limiting example of Table 1, if a condensation diameter of 100 μm is required, a pulse of 50 Hz is provided.
[0073] Table 1 below details exemplary final diameter (width) outputs of a laser beam based on the frequency input of a device, according to some embodiments of the present invention:
[0074] Table 1
[0075]
[0076] In step 230, the controller can calculate the number of points to be included in the grid based on the system pulse frequency and the desired pulse frequency, where each point corresponds to the position of a pulse. In some embodiments, the number of points to be included in the grid can be determined based on Equation 1.
[0077] n = f s / f d (1)
[0078] Where n is the number of points to be included in the grid, f s It is the system pulse frequency, and f d It is the desired pulse frequency.
[0079] In step 240, the controller may receive at least one of the following: the size of the treatment area, the shape of the treatment area, and the desired pulse density. For example, the controller 2 may receive this information from a user (e.g., a professional) via input 7. Figure 3A and Figure 3B The size and shape of the treatment area 360 are shown. In another example, the controller 2 may receive the desired pulse density from a user (e.g., a professional) via input 7 to achieve the desired treatment outcome (e.g., piling, brightening, etc.). In some embodiments, the area of each grid is determined based on n and the distance between each grid and its adjacent points 305 (e.g., the location on the tissue where the pulse is delivered), which may be a parameter stored in the storage system 6 or a parameter received from the user.
[0080] In step 250, the controller can determine the number of grids required to cover the treatment area and the position of the pulses in each grid based on the received size of the treatment area, the shape of the treatment area, and the required pulse density. For example, the controller can. For example, in Figure 3A and Figure 3B In the non-restricted example, to cover area 360, grids 310A, 310B, 310C, etc. may be needed.
[0081] In some embodiments, if the number of grids required to cover the treatment area is not an integer, the controller may adjust at least one of the following: the size of the treatment area, the system pulse frequency, and the desired pulse frequency. For example, if the size of the treatment area is equal to 6 times the grid area... 1If the grid area is multiplied by 4, then controller 2 can reduce the treatment area to exactly 6 times the grid area, or increase the treatment area to exactly 7 times the grid area. In some embodiments, adjusting the size of the treatment area includes providing the user with a selection of optional treatment areas, each corresponding to the product of the grid area and an integer.
[0082] In another example, controller 2 can decrease f s (System pulse frequency) and / or increase / decrease f d (Desired pulse frequency), thereby reducing n, which will result in a reduction in the grid area, allowing the treatment area to be exactly 7 times the size of the new grid area. In some embodiments, adjusting the desired pulse frequency includes selecting a pulse frequency from a range of pulse frequencies, or changing the desired frequency to a predetermined percentage. In some embodiments, the system pulse frequency is adjusted by changing the current supplied to the laser pump.
[0083] In step 260, the controller may control the pump to optically pump the laser medium, and the scanner is configured to control the movement of laser pulses to provide laser pulses to all locations in each grid. For example, the controller 2 may control the laser pump 100 to optically pump the laser medium and further control the scanner 500 and / or scanner 550 to move the pulsed laser from one location to another in each grid. In some embodiments, the controller is also configured to: receive N pulses that need to be provided to each location; determine, for each grid, a sequence of pulse-providing locations in the grid; and repeat the sequence N times. In some embodiments, the controller 2 is also configured to receive the desired ablation depth from the user interface (input 7) and determine N based on the desired ablation depth. In some embodiments, the ablation depth determines the amount of energy that needs to be provided to each location, as shown in Table 2.
[0084]
[0085]
[0086] N can be determined using Equation 2.
[0087] N = E T / E p (2)
[0088] Among them, E T It is the total energy required at each location, and E pThis refers to the energy of each pulse. In a non-limiting example, for a desired ablation depth of 1 mm, the total energy required is 400 mJ. Therefore, if the pulse energy is 10 mJ, the number of pulses is N = 40. Thus, controller 2 can control scanner 500 and / or scanner 550 to scan the entire grid 40 times with pulsed laser. In some embodiments, each scan can begin at a start position and end at an end position. In some embodiments, the end position can be adjacent to the start position, or it can be non-adjacent. Controller 2 can repeat each scan N times.
[0089] Now for reference Figure 4 , Figure 4 This is a flowchart of another method for controlling a laser ablation system according to some embodiments of the present invention. In some embodiments, steps 410 to 450 may be used to control the laser system 1000. In some embodiments, steps 410 to 450 may be controlled by the controller 10 of the laser system 1000 or any other suitable controller.
[0090] In step 410, input can be received from the user interface via the controller of the user interface, including the desired ablation depth and desired coagulation diameter for laser treatment. In some embodiments, the user interface may be associated with or included in the controller 10; for example, the user interface may include either the input device 7 or the output device 8.
[0091] In step 420, the required number of pulses to be delivered at the location on the tissue can be determined based on the pulse energy and the desired ablation depth. For example, one or more lookup tables including the required number of pulses associated with the desired ablation depth can be stored in memory (e.g., storage system 6). Non-limiting examples of such tables are given and discussed herein in conjunction with Table 1. Since the amount of energy delivered by each pulse is known (e.g., 1 mJ, 1.2 mJ, 2 mJ, 3 mJ, 5 mJ, etc.), the controller can calculate the required number of pulses. In the non-limiting example in Table 1, 100 mJ is required to ablate to a depth of 1 mm. Therefore, if each laser pulse delivers 4 mJ, 25 pulses are required to ablate to a depth of 1 mm.
[0092] In step 430, the desired pulse frequency can be determined based on the pulse energy and the desired condensation diameter. For example, one or more lookup tables including the desired condensation diameter and frequency can be stored in memory (e.g., storage system 6). Non-limiting examples of such tables are given and discussed herein in conjunction with Table 2. In the non-limiting example of Table 2, if a condensation diameter of 150 μm is required, a pulse is provided at a frequency of 10 Hz.
[0093] In step 440, the controller 10 may determine at least one of the following: the defocus level of the laser pulses and the distribution of the laser pulses. For example, to achieve a larger ablation diameter, the controller 10 may manipulate the laser pulses in at least two ways. In a first example, the system may cause slight defocusing of the beam, artificially widening the beam diameter. In a non-limiting example, defocusing may result in a diameter increase between 5 and 100 μm. In a second example, the scanner 500 may cause a slight shift in the focus of some of the provided pulses on the treated tissue, for example, a shift of 5-100 μm. In a non-limiting example, 50 of the 100 provided pulses may be shifted from the original position 305 of the pulses provided on the tissue, such as... Figure 3A As shown.
[0094] In step 550, the laser system or its controller may control the laser system to generate laser pulses by determining the number of pulses, the pulse frequency, and at least one of the following: the defocus level of the laser pulses and the distribution of the laser pulses.
[0095] In some embodiments, the laser system can be controlled to emit pulsed laser light, wherein the duration of the pulses is between 2 and 100 nanoseconds, 2 and 20 nanoseconds, 20 and 50 nanoseconds, 50 and 100 nanoseconds, and any range and value therebetween. In some embodiments, the characteristics of the generated laser beam can be in a wavelength of 2 μm (regime). In some embodiments, the characteristics of the laser beam can be in an energy (also referred to as "laser power") of at least 1 mJ, 1 to 15 mJ, 1 to 5 mJ, 5 to 15 mJ, and any range and value therebetween.
[0096] In some embodiments, electrical power may be supplied to the laser system to generate the laser beam, wherein the electrical power may be between 1 and 50 watts, 1 and 16 watts, 10 and 30 watts, 25 and 50 watts, and any range and value therebetween.
[0097] In some embodiments, the computing device 10 may determine a first set of parameters, the first set of parameters including a first number of pulses, a first pulse frequency, and at least one of the following: a first defocus level of the laser pulses and a first distribution of the laser pulses; and a second set of parameters, the second set of parameters including a second number of pulses, a second pulse frequency, and at least one of the following: a second defocus level of the laser pulses and a second distribution of the laser pulses. In some embodiments, the computing device 10 may also use the first set and the subsequent second set to control the laser system to generate laser pulses.
[0098] In some embodiments, the computing device 10 may determine groups of additional parameters and may control the laser system to generate laser pulses according to any number of groups. Those skilled in the art will understand that the invention is not limited to two groups, and any number of groups equal to or greater than two groups are within the scope of the invention. In some embodiments, at least some of the groups may be identical, while other groups may differ by at least one parameter. In some embodiments, the computing device 10 may control the laser system to generate laser pulses with alternating groups of parameters.
[0099] In some embodiments, each set of parameters may include only the number of pulses and the pulse frequency, and these parameter sets may differ from each other in at least one of the number of pulses and the pulse frequency. In some embodiments, at least some of the sets may also include the defocus level of the laser pulses and the distribution of the laser pulses.
[0100] Non-limiting examples may include creating a 0.5 mm depth using a 20 μm agglomerate treatment, followed by another 0.5 mm depth using a 200 μm wide agglomerate, to create a clean epidermal layer with abundant epidermal agglomerates. In some embodiments, user input may be explicit, specifying all parameters for all relevant treatments, or it may be pre-programmed to include only some parameters. For example, the first set may include a fixed width and frequency (e.g., an initial constant treatment), while the second set may be a selected operating mode and parameters from all provided treatments. In such an example, the total depth may be the result of both the first and second sets of treatments, while the agglomerate width is the result of the second set.
[0101] In some embodiments, the laser beam can be focused into a Raman gain crystal. In some embodiments, the laser system can emit a laser beam with a spot diameter size of any range and value between 20 and 200 micrometers, 20 and 40 micrometers, 40 and 100 micrometers, and 100 and 200 micrometers.
[0102] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of instructions comprising one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions described in the blocks may not appear in the order shown in the figures. For example, depending on the function involved, two blocks shown consecutively may actually be executed substantially simultaneously, or these blocks may sometimes be executed in reverse order. It will also be noted that each block illustrated in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified function or action or executes a combination of dedicated hardware and computer instructions.
[0103] Various embodiments of the invention have been described for illustrative purposes, but are not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or technical improvements to technologies found in the market, or to enable those skilled in the art to understand the embodiments disclosed herein.
[0104] Various embodiments have been presented. Of course, each of these embodiments may include features from the other presented embodiments, and embodiments not specifically described may include the various features described herein.
Claims
1. A laser ablation system, comprising: Laser cavity; A gain medium disposed within the laser cavity is configured to generate a pulsed laser beam of a specific wavelength; A pump configured to optically pump the laser medium; A scanner configured to control the movement of the laser beam; and The controller is configured as follows: Receive system pulse frequency; Receive the desired pulse frequency; Based on the system pulse frequency and the desired pulse frequency, calculate the number of points to be included in the grid, where each point corresponds to the position of the pulse; Receive at least one of the following: the size of the treatment area, the shape of the treatment area, and the desired pulse density; Based on the received size of the treatment area, the shape of the treatment area, and the required pulse density, determine the number of grids required to cover the treatment area and the position of the pulse in each grid; and The pump and the scanner are controlled to deliver laser pulses to all locations in each grid.
2. The laser ablation system of claim 1, wherein the controller is further configured to receive the desired coagulation diameter at each location from a user interface and determine the desired pulse frequency based on the desired coagulation diameter.
3. The laser ablation system according to claim 1, wherein the controller is further configured to: The receiver needs to receive N pulses to be provided to each position; For each grid, determine the sequence of pulse positions provided by the pulses within that grid; and Repeat the sequence N times.
4. The laser ablation system of claim 3, wherein the controller is further configured to receive a desired ablation depth from a user interface and determine N based on the desired ablation depth.
5. The laser ablation system according to claim 3 or 4, wherein at least some of the grids have different N values.
6. The laser ablation system according to any one of claims 1 to 5, wherein receiving the system pulse frequency includes one of: receiving the system pulse frequency from a database and measuring the system pulse frequency using an energy meter.
7. The laser ablation system according to any one of claims 1 to 6, wherein the number of points to be included in the computational grid is determined by dividing the system pulse frequency by the desired pulse frequency.
8. The laser ablation system according to any one of claims 1 to 7, wherein if it is determined that the number of grids required to cover the treatment area is not an integer, at least one of the following is adjusted: the size of the treatment area, the system pulse frequency, and the desired pulse frequency.
9. The laser ablation system of claim 8, wherein adjusting the desired pulse frequency comprises selecting the pulse frequency from a range of pulse frequencies.
10. The laser ablation system of claim 8, wherein adjusting the size of the treatment area includes providing a user with a selection of optional treatment areas, each optional treatment area corresponding to the product of the area of the grid and an integer.
11. The laser ablation system of claim 8, wherein the system pulse frequency is adjusted by changing the current supplied to the laser pump.
12. A method for controlling a laser ablation system, comprising: Receive the pulse frequency of the laser ablation system; Receive the desired pulse frequency; Based on the system pulse frequency and the desired pulse frequency, calculate the number of points to be included in the grid, where each point corresponds to the position of the pulse; Receive at least one of the following: the size of the treatment area, the shape of the treatment area, and the desired pulse density; Based on the received size of the treatment area, the shape of the treatment area, and the required pulse density, determine the number of grids required to cover the treatment area and the position of the pulse in each grid; and The system controls a pump configured to optically pump the laser medium and a scanner configured to control the movement of the laser pulses to deliver laser pulses to all locations in each grid.
13. A laser system comprising: Laser cavity; A gain medium disposed within the laser cavity is configured to generate laser pulses of a specific wavelength; Pumps, configured to optically pump laser media; and The controller is configured as follows: Receive input from the user interface, including the desired ablation depth and desired coagulation diameter for laser treatment; The required number of pulses to be delivered at the location on the tissue is determined based on the energy of the pulse and the desired ablation depth. The pulse frequency is determined based on the pulse energy and the desired condensation diameter. Determine at least one of the following: the defocus level of the laser pulse and the distribution of the laser pulse; and The laser system is controlled to generate the laser pulses by a defined number of pulses, pulse frequency, and at least one of the following: the defocus level of the laser pulses and the distribution of the laser pulses.
14. The laser system of claim 13, further comprising a q-switching element positioned within the laser cavity and configured to generate pulsed laser light.
15. The laser system according to any one of claims 13 to 14, wherein the controller is configured to determine the frequency and the desired number of pulses, and at least one of the following, based on data stored in a storage system associated with the controller: the defocus level of the laser pulses and the distribution of the laser pulses.
16. The laser system of claim 15, wherein the data is stored in a lookup table.
17. The laser system according to any one of claims 13 to 16, wherein the required number of pulses is determined based on the desired depth of the condensation.
18. The laser system according to any one of claims 13 to 17, wherein the desired frequency is determined based on the desired diameter of the condensation.
19. The laser system of claim 18, wherein the desired diameter of the condensate is between 10 and 150 μm.
20. The laser system according to any one of claims 13 to 19, wherein at least one of the following is determined based on the desired diameter of the ablation: the defocus level of the laser pulse and the distribution of the laser pulse.
21. The laser system according to any one of claims 13 to 20, wherein the controller is further configured to: A first group is defined, comprising a first pulse number, a first pulse frequency, and at least one of the following: a first defocus level of the laser pulses and a first distribution of the laser pulses; and a second group is defined, comprising a second pulse number, a second pulse frequency, and at least one of the following: a second defocus level of the laser pulses and a second distribution of the laser pulses; and The laser system is controlled to generate the laser pulses using the first group and subsequently the second group.
22. A method for controlling a laser system, the method comprising: Receive input from the user interface, including the desired ablation depth and desired coagulation diameter for laser treatment; The required number of pulses to be delivered at the location on the tissue is determined based on the pulse energy and the desired ablation depth. The frequency of the pulse is determined based on the energy of the pulse and the desired condensation diameter. Determine at least one of the following: the defocus level of the laser pulse and the distribution of the laser pulse; and The laser system is controlled to generate the laser pulses by a defined number of pulses, pulse frequency, and at least one of the following: the defocus level of the laser pulses and the distribution of the laser pulses.
