Rapid high-phosphorus electroless nickel plating solution and plating process thereof

Abstract

The application provides a quick high-phosphorus electroless nickel plating solution and a plating process thereof, wherein the material of the quick high-phosphorus electroless nickel plating solution comprises a nickel salt, a reducing agent, a complexing agent, a buffer, a stabilizer and a surfactant. By adjusting the composition of the complexing agent, the buffer, the stabilizer, the additive and the surfactant in the formula, the performance of the quick high-phosphorus electroless nickel plating solution can be significantly improved, the environmental protection requirement can be met, and the quick high-phosphorus electroless nickel plating solution is suitable for surface treatment of various substrates.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electroless nickel plating, and particularly relates to a rapid high-phosphorus electroless nickel plating solution and a plating process thereof. BACKGROUND

[0002] The electroless nickel plating process is a surface treatment technology for depositing a nickel layer on a metal surface through a chemical method. The electroless nickel plating can form a uniform plating layer on a workpiece with a complex shape and structure, especially in recesses, holes and gaps that are difficult to be covered by traditional electroplating. The electroless nickel plating layer has high hardness, good wear resistance and good corrosion resistance. Therefore, the electroless nickel plating process is widely used in the fields of electronic components, automobile industry and aerospace. At present, compared with electroplating nickel, the plating speed of electroless nickel plating is slow, and the stability of the electroless nickel plating solution used in the electroless nickel plating is poor, which leads to uneven plating layer quality and even defects in the plating process, thereby limiting the application of the electroless nickel plating in large-scale production. SUMMARY

[0003] In view of the deficiencies of the prior art, the application provides a rapid high-phosphorus electroless nickel plating solution and a plating process thereof. The rapid high-phosphorus electroless nickel plating solution provided by the application can significantly improve the performance of the rapid high-phosphorus electroless nickel plating solution, meet the environmental protection requirements, and be suitable for surface treatment of various substrates.

[0004] To achieve the above purpose, the application adopts the following technical solutions:

[0005] In one aspect, the application provides a rapid high-phosphorus electroless nickel plating solution. The material of the rapid high-phosphorus electroless nickel plating solution comprises nickel salt, reducing agent, complexing agent, buffer, stabilizer, additive and surfactant.

[0006] The stabilizer comprises ionic liquid and inorganic oxyacid salt.

[0007] Further, the nickel salt comprises one or more of nickel sulfate, nickel nitrate, nickel chloride, nickel acetate, nickel hypophosphite, nickel methylsulfonate, nickel acetate, nickel sulfamate, nickel fluoride and nickel bromide.

[0008] Further, the reducing agent comprises one or more of sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite.

[0009] Further, the ionic liquid comprises choline-based ionic liquid, and the structural formula of the choline-based ionic liquid is as follows:

[0010] ;

[0011] wherein R is selected from C1-C20 alkyl, and X is selected from Cl - , Br - , F- , I - , NO3 - , HCO3 - , HSO4 - , BF4 - , PF6 - , (CF3SO2)2N - , HCOO - , CH3COO - , CH3SO3 - ;

[0012] Further, R is selected from C4-C15 alkyl;

[0013] Preferably, R is selected from n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl;

[0014] Further, the inorganic oxyacid salt is selected from one or more of molybdate, tungstate, iodate;

[0015] Optionally, the molybdate is selected from one or more of sodium molybdate, potassium molybdate, ammonium molybdate;

[0016] Optionally, the tungstate is selected from one or more of sodium tungstate, potassium tungstate, ammonium tungstate;

[0017] Optionally, the iodate is selected from one or more of sodium iodate, potassium iodate, ammonium iodate;

[0018] Further, the adjuvant comprises one or more of tannic acid, gallic acid, protocatechuic acid, chlorogenic acid;

[0019] Further, the complexing agent comprises one or more of disodium ethylenediaminetetraacetate, sodium lactate, sodium acetate, sodium phosphate, sodium oxalate, sodium malate, sodium tartrate, sodium ascorbate, sodium gluconate, sodium maleate, sodium fumarate, sodium glycolate, sodium aminoacetate, sodium malonate, sodium succinate, dipotassium ethylenediaminetetraacetate, potassium lactate, potassium acetate, potassium phosphate, potassium oxalate, potassium malate, potassium tartrate, potassium ascorbate, potassium gluconate, potassium maleate, potassium fumarate, potassium glycolate, potassium aminoacetate, potassium malonate, potassium succinate;

[0020] Further, the buffer comprises one or more of acetic acid, phosphoric acid, oxalic acid, malic acid, lactic acid, tartaric acid, ascorbic acid, gluconic acid, maleic acid, fumaric acid, glycolic acid, aminoacetic acid, malonic acid, succinic acid;

[0021] Further, the surface active agent comprises polyether polyol, and the polyether polyol comprises one or more of PPG-400, PPG-1000, PPG-2000, PPG-3000, PPG-4000, sucrose polyether, sorbitol polyether, PEG-400, PEG-1000, PEG-2000, PEG-3000, and PEG-4000.

[0022] Further, the complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:1-5.

[0023] Further, the buffering agent is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:0.1-3.

[0024] Further, the stabilizer is composed of ionic liquid and inorganic oxyacid salt with a mass ratio of 1:1-10.

[0025] Further, the complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:1-3.

[0026] Further, the buffering agent is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:0.5-1.5.

[0027] Further, the stabilizer is composed of ionic liquid and inorganic oxyacid salt with a mass ratio of 1:3-7.

[0028] Further, the materials of the fast high-phosphorus chemical nickel plating solution comprise, by weight, 10-50 parts of nickel salt, 20-60 parts of reducing agent, 5-45 parts of complexing agent, 5-45 parts of buffering agent, 1-9 parts of stabilizer, 0.05-0.15 parts of auxiliary agent, and 1-5 parts of surface active agent.

[0029] Further, the materials of the fast high-phosphorus chemical nickel plating solution comprise, by weight, 20-40 parts of nickel salt, 30-50 parts of reducing agent, 15-35 parts of complexing agent, 15-35 parts of buffering agent, 3-7 parts of stabilizer, 0.08-0.12 parts of auxiliary agent, and 1-3 parts of surface active agent.

[0030] Further, the materials of the fast high-phosphorus chemical nickel plating solution further comprise water, and the mass ratio of the nickel salt to water is 3:100-300, specifically, 3:100, 1:50, 3:200, 3:250, or 1:100.

[0031] In another aspect, the application further provides a plating process of the fast high-phosphorus chemical nickel plating solution, which comprises the following steps: immersing a cleaned plating object into a 75-95℃ chemical nickel plating solution, reacting until a uniform nickel alloy layer is formed on the metal surface, taking out the plating object, and cleaning and drying to obtain a plated object.

[0032] wherein the electroless nickel plating solution is selected from the aforementioned fast high-phosphorus electroless nickel plating solution.

[0033] The present application has the following beneficial effects:

[0034] The present application provides a fast high-phosphorus electroless nickel plating solution and a plating process thereof. The material of the fast high-phosphorus electroless nickel plating solution comprises a nickel salt, a reducing agent, a complexing agent, a buffer, a stabilizer, and a surfactant. The stabilizer comprises an inorganic oxyacid salt and an ionic liquid. The inorganic oxyacid salt (e.g., MoO4 2- ) acts as a mild oxidant, which can consume active atomic hydrogen (H - ) generated by unintended catalytic surfaces (e.g., nickel particles precipitated), thereby inhibiting abnormal reduction of nickel from the source and forming a "chemical passivation layer". The ionic liquid can be efficiently adsorbed on non-working surfaces such as nickel particles, tank walls, and heating tubes by electrostatic interaction and van der Waals force, especially ionic liquids with moderate-length alkyl chains, which can form an organic layer on the surface and produce a steric hindrance effect, preventing nickel ions from approaching and being reduced, thereby constituting a "physical space barrier". The two factors work together to provide a double guarantee for inhibiting the self-decomposition of the plating solution. Moreover, the composite stabilizer can reduce the required concentration of each component, thereby improving the stability effect while reducing the side effects (e.g., decreased deposition rate caused by molybdate) that may be caused by excessive concentration of a single stabilizer. This system helps to achieve more precise local deposition, thereby obtaining a more meticulous, uniform, and low-porosity coating, maintaining high phosphorus content, and ensuring amorphous structure and excellent corrosion resistance of the coating. In addition, this composite stabilizing system completely avoids the use of toxic heavy metals such as lead and cadmium, as well as cyanide-containing stabilizers. Molybdate has low toxicity, and the preferred low-toxicity or biodegradable choline-based ionic liquid conforms to the trend of green manufacturing.

[0035] In addition, the applicant has found that the addition of certain auxiliary agents (e.g., tannic acid) can significantly improve the uniformity and density of the coating, which may be because it not only can form a stable nickel-polyphenol coordination polymer through complexation with nickel ions in the solution, thereby regulating the nickel plating process, but also can form a dense isolation film on catalytic surfaces (e.g., spontaneously formed nickel particles, tank walls, hangers), which prevents nickel ions and reducing agents (sodium hypophosphite) from approaching these surfaces, thereby inhibiting parasitic reactions at these locations. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0037] Embodiment 1

[0038] The embodiment provides a fast high-phosphorus electroless nickel plating solution and a plating process thereof, and specific steps are as follows:

[0039] (1) Preparation of the high-phosphorus electroless nickel plating solution: first, uniformly stir 30 g of nickel salt (nickel sulfate), 25 g of complexing agent, 25 g of buffer, 5 g of stabilizer, 0.1 g of additive (tannic acid), 2 g of surfactant (PEG-2000) and 2 L of deionized water, then add 40 g of reducing agent (sodium hypophosphite), and after uniform stirring, the electroless nickel plating solution is obtained;

[0040] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0041] The buffer is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0042] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:5;

[0043] The choline ionic liquid has the following structure:

[0044] ;

[0045] (2) Plating: immerse the cleaned metal piece (copper piece) into the 85°C electroless nickel plating solution to react until a uniform nickel-gold alloy layer is formed on the surface of the metal, take out the metal piece, clean and dry it, and the plated piece is obtained.

[0046] Embodiment 2

[0047] The embodiment provides a fast high-phosphorus electroless nickel plating solution and a plating process thereof, and specific steps are as follows:

[0048] (1) Preparation of the high-phosphorus electroless nickel plating solution: first, uniformly stir 30 g of nickel salt (nickel sulfate), 25 g of complexing agent, 25 g of buffer, 5 g of stabilizer, 0.1 g of additive (tannic acid), 2 g of surfactant (PEG-2000) and 2 L of deionized water, then add 40 g of reducing agent (sodium hypophosphite), and after uniform stirring, the electroless nickel plating solution is obtained;

[0049] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0050] The buffering agent is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0051] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:3;

[0052] The choline ionic liquid has the following structure:

[0053] ;

[0054] (2) Plating The cleaned metal piece (copper piece) is immersed in the 85°C electroless nickel plating solution, and the reaction is carried out until a uniform nickel-gold alloy layer is formed on the surface of the metal, the metal piece is taken out, washed and dried to obtain the plated piece.

[0055] Example 3

[0056] The present embodiment provides a rapid high-phosphorus electroless nickel plating solution and its plating process, and the specific steps are as follows:

[0057] (1) Preparation of high-phosphorus electroless nickel plating solution First, 30g of nickel salt (nickel sulfate), 25g of complexing agent, 25g of buffering agent, 5g of stabilizer, 0.1g of additive (tannic acid), 2g of surfactant (PEG-2000) and 2L of deionized water are stirred uniformly, then 40g of reducing agent (sodium hypophosphite) is added, and after stirring uniformly, the electroless nickel plating solution is obtained;

[0058] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0059] The buffering agent is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0060] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:7;

[0061] The choline ionic liquid has the following structure:

[0062] ;

[0063] (2) Plating The cleaned metal piece (copper piece) is immersed in the 85°C electroless nickel plating solution, and the reaction is carried out until a uniform nickel-gold alloy layer is formed on the surface of the metal, the metal piece is taken out, washed and dried to obtain the plated piece.

[0064] Example 4

[0065] The present embodiment provides a rapid high-phosphorus electroless nickel plating solution and its plating process, and the specific steps are as follows:

[0066] (1) Preparation of high-phosphorus electroless nickel plating solution First, uniformly stir 30 g of nickel salt (nickel sulfate), 25 g of complexing agent, 25 g of buffer, 5 g of stabilizer, 0.1 g of additive (tannic acid), 2 g of surfactant (PEG-2000), and 2 L of deionized water, then add 40 g of reducing agent (sodium hypophosphite), and after uniform stirring, obtain the electroless nickel plating solution;

[0067] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0068] The buffer is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0069] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:5;

[0070] The structure of the choline ionic liquid is:

[0071] ;

[0072] (2) Plating Dip the cleaned metal piece (copper piece) into the 85°C electroless nickel plating solution to react until a uniform nickel-gold alloy layer is formed on the metal surface, take out the metal piece, clean and dry it, and obtain the plated piece.

[0073] Example 5

[0074] This example provides a rapid high-phosphorus electroless nickel plating solution and its plating process, and the specific steps are as follows:

[0075] (1) Preparation of high-phosphorus electroless nickel plating solution First, uniformly stir 30 g of nickel salt (nickel sulfate), 25 g of complexing agent, 25 g of buffer, 5 g of stabilizer, 0.1 g of additive (tannic acid), 2 g of surfactant (PEG-2000), and 2 L of deionized water, then add 40 g of reducing agent (sodium hypophosphite), and after uniform stirring, obtain the electroless nickel plating solution;

[0076] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0077] The buffer is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0078] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:5;

[0079] The structure of the choline ionic liquid is:

[0080] ;

[0081] (2) Plating The cleaned metal piece (copper piece) is immersed in the 85°C electroless nickel plating solution, and a reaction is carried out until a uniform nickel-gold alloy layer is formed on the surface of the metal, the metal piece is taken out, washed and dried, and a plated piece is obtained.

[0082] Example 6

[0083] The embodiment provides a rapid high-phosphorus electroless nickel plating solution and a plating process thereof, and the specific steps are as follows:

[0084] (1) Preparation of high-phosphorus electroless nickel plating solution First, 30g of nickel salt (nickel sulfate), 25g of complexing agent, 25g of buffer, 5g of stabilizer, 0.1g of additive (tannic acid), 2g of surfactant (PEG-2000) and 2L of deionized water are uniformly stirred, then 40g of reducing agent (sodium hypophosphite) is added, and after uniform stirring, an electroless nickel plating solution is obtained;

[0085] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0086] The buffer is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0087] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:5;

[0088] The structure of the choline ionic liquid is:

[0089] ;

[0090] (2) Plating The cleaned metal piece (copper piece) is immersed in the 85°C electroless nickel plating solution, and a reaction is carried out until a uniform nickel-gold alloy layer is formed on the surface of the metal, the metal piece is taken out, washed and dried, and a plated piece is obtained.

[0091] Example 7

[0092] The embodiment provides a rapid high-phosphorus electroless nickel plating solution and a plating process thereof, and the specific steps are as follows:

[0093] (1) Preparation of high-phosphorus electroless nickel plating solution First, 30g of nickel salt (nickel sulfate), 25g of complexing agent, 25g of buffer, 5g of stabilizer, 0.1g of additive (tannic acid), 2g of surfactant (PEG-2000) and 2L of deionized water are uniformly stirred, then 40g of reducing agent (sodium hypophosphite) is added, and after uniform stirring, an electroless nickel plating solution is obtained;

[0094] The complexing agent is composed of glycolic acid and lactic acid with a mass ratio of 1:2;

[0095] The buffer is composed of disodium ethylenediaminetetraacetate and sodium lactate with a mass ratio of 1:1;

[0096] The stabilizer is composed of choline ionic liquid and ammonium molybdate with a mass ratio of 1:5.

[0097] The choline ionic liquid has the following structure:

[0098] ;

[0099] (2) Plating The cleaned metal piece (copper piece) is immersed in the 85℃ chemical nickel plating solution for reaction until a uniform nickel-gold alloy layer is formed on the surface of the metal, the metal piece is taken out, washed and dried to obtain the plated piece.

[0100] Comparative Example 1

[0101] Compared with Example 1, the only difference is that the stabilizer is only choline ionic liquid.

[0102] Comparative Example 2

[0103] Compared with Example 1, the only difference is that the stabilizer is only ammonium molybdate.

[0104] Comparative Example 3

[0105] Compared with Example 1, the only difference is that no auxiliary agent tannin is added.

[0106] Test Analysis

[0107] (1) Nickel plating rate: continuously nickel plating in the chemical nickel plating solution for 1h, then measuring the thickness of the plating layer at 8 points by X-ray fluorescence instrument (XRF), taking the average value, unit: μm / h, the results are shown in Table 1.

[0108] (2) Stability experiment: 50ml of prepared plating solution is heated to working temperature, 1ml of 0.1g / L palladium chloride solution is added, the time for generating black precipitate is measured, and the stability is judged according to the length of time, the results are shown in Table 1.

[0109] (3) Corrosion resistance detection: using 67% concentrated HNO3 to test the substrate as steel, the chemical nickel layer thickness is 5.0 microns, observing the discoloration time of the plating layer, and judging the corrosion resistance according to the length of discoloration time, the results are shown in Table 1.

[0110] (4) Porosity detection: when the plating time is 1h, the porosity of the nickel plating layer is detected according to GB T 13913-2008, the results are shown in Table 1.

[0111] (5) Hardness test: the hardness is represented by Vickers hardness (HV, kg / mm 2 ), the greater the hardness, the higher the wear resistance, the hardness of the plating layer is measured by Vickers hardness tester, the better the hardness, the more wear-resistant.

[0112] Table 1

[0113] Nickel plating rate (pm / h) Stability (time s) Corrosion resistance (time min) Porosity Vickers hardness (HV) Example 1 18.6 ＞3600 31.5 No voids 656 HV Example 2 17.9 ＞3600 28.6 No voids 645 HV Example 3 17.5 ＞3600 25.3 No voids 630 HV Example 4 15.8 3220 22.4 0.0001 608 HV Example 5 18.2 3550 29.5 No voids 649 HV Example 6 18.0 3520 28.9 No voids 638 HV Example 7 16.9 3380 23.5 No voids 617 HV Comparative Example 1 12.5 2310 15.6 0.0108 510 HV Comparative Example 2 13.6 2640 16.3 0.0046 553 HV Comparative Example 3 19.2 2880 21.8 0.0198 496 HV

[0114] From the above experimental results, it can be seen that the effects of the electroless nickel plating solution prepared by the technical solution described in the present application are significantly better than those of Comparative Examples 1-3. It can be seen that the technical solution described in the present application can achieve very excellent technical effects.

[0115] The above describes in detail a rapid high-phosphorus electroless nickel plating solution and a plating process thereof provided by the present application. The principles and implementation manners of the present application are described by applying specific examples. The above descriptions of the examples are only used to help understand the technical solutions and core ideas of the present application. It should be understood by those skilled in the art that the technical solutions recorded in the above examples can be modified or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the examples of the present application.

Claims

1. A quick high-phosphorus electroless nickel plating solution, characterized in that, The materials of the rapid high-phosphorus electroless nickel plating solution by weight parts include nickel salt 10-50 parts, reducing agent 20-60 parts, complexing agent 5-45 parts, buffer 5-45 parts, stabilizer 1-9 parts, additive 0.05-0.15 parts, surfactant 1-5 parts; The materials of the rapid high-phosphorus electroless nickel plating solution also include water, and the mass ratio of the nickel salt to water is 3:100-300; The stabilizer includes choline ionic liquid and inorganic oxyacid salt; The structural formula of the choline ionic liquid is: ； wherein R is selected from C1-C20 alkyl and X is selected from Cl - , Br - , F - , I - , NO3 - , HCO3 - , HSO4 - , BF4 - , PF6 - , (CF3SO2)2N - , HCOO - , CH3COO - , CH3SO3 - ; The inorganic oxyacid salt is selected from one or more of molybdate, tungstate, and iodate.

2. The quick high-phosphorus electroless nickel plating solution according to claim 1, characterized in that, The nickel salt includes one or more of nickel sulfate, nickel nitrate, nickel chloride, nickel acetate, nickel hypophosphite, nickel methylsulfonate, nickel sulfamate, nickel fluoride, and nickel bromide; The reducing agent includes one or more of sodium hypophosphite, potassium hypophosphite, and ammonium hypophosphite; The additive includes one or more of tannic acid, gallic acid, protocatechuic acid, and chlorogenic acid.

3. The quick high-phosphorus electroless nickel plating solution according to claim 1, characterized in that, R is selected from C4-C15 alkyl; The molybdate is selected from one or more of sodium molybdate, potassium molybdate, and ammonium molybdate; The tungstate is selected from one or more of sodium tungstate, potassium tungstate, and ammonium tungstate; The iodate is selected from one or more of sodium iodate, potassium iodate, and ammonium iodate.

4. The quick high-phosphorus electroless nickel plating solution according to claim 1, characterized in that, The complexing agent includes one or more of disodium ethylenediaminetetraacetate, sodium lactate, sodium acetate, sodium phosphate, sodium oxalate, sodium malate, sodium tartrate, sodium ascorbate, sodium gluconate, sodium maleate, sodium fumarate, sodium glycolate, sodium aminoacetate, sodium malonate, sodium succinate, dipotassium ethylenediaminetetraacetate, potassium lactate, potassium acetate, potassium phosphate, potassium oxalate, potassium malate, potassium tartrate, potassium ascorbate, potassium gluconate, potassium maleate, potassium fumarate, potassium glycolate, potassium aminoacetate, potassium malonate, and potassium succinate; The buffer includes one or more of acetic acid, phosphoric acid, oxalic acid, malic acid, lactic acid, tartaric acid, ascorbic acid, gluconic acid, maleic acid, fumaric acid, glycolic acid, aminoacetic acid, malonic acid, and succinic acid; The surfactant includes polyether polyol.

5. The quick high-phosphorus electroless nickel plating solution according to claim 4, characterized in that, The complexing agent consists of glycolic acid and lactic acid in a mass ratio of 1:1-5; The buffer consists of disodium ethylenediaminetetraacetate and sodium lactate in a mass ratio of 1:0.1-3; The stabilizer consists of ionic liquid and inorganic oxyacid salt in a mass ratio of 1:1-10; The polyether polyol includes one or more of PPG-400, PPG-1000, PPG-2000, PPG-3000, PPG-4000, sucrose polyether, sorbitol polyether, PEG-400, PEG-1000, PEG-2000, PEG-3000, and PEG-4000.

6. The quick high-phosphorus electroless nickel plating solution according to claim 4, wherein The complexing agent consists of glycolic acid and lactic acid in a mass ratio of 1:1-3; The buffer consists of disodium ethylenediaminetetraacetate and sodium lactate in a mass ratio of 1:0.5-1.5; The stabilizer consists of ionic liquid and inorganic oxyacid salt in a mass ratio of 1:3-7.

7. The quick high-phosphorus electroless nickel plating solution according to claim 1, wherein The materials of the quick high-phosphorus electroless nickel plating solution by weight parts include nickel salt 20-40 parts, reducing agent 30-50 parts, complexing agent 15-35 parts, buffer 15-35 parts, stabilizer 3-7 parts, auxiliary agent 0.08-0.12 parts, and surfactant 1-3 parts.

8. A plating process of a quick high-phosphorus electroless nickel plating solution, characterized by, The plating process comprises the following steps: immersing the cleaned plating piece into the 75-95 DEG C electroless nickel plating solution, reacting until a uniform nickel alloy layer is formed on the metal surface, taking out the plating piece, cleaning and drying to obtain the plated piece. The chemical nickel plating solution is selected from the quick high-phosphorus electroless nickel plating solution according to any one of claims 1-7.

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