Electroless nickel plating apparatus and process for an integrated circuit board

Abstract

The application relates to the technical field of nickel plating of circuit boards, and particularly discloses a chemical nickel plating equipment and process for integrated circuit boards, wherein a supporting plate frame is slidably connected with the side surface of a nickel plating tank, the bottom of the supporting plate frame is fixedly connected with the output end of a driving member one, sliding grooves are arranged on the two sides of the supporting plate frame, a driving member two is fixedly connected with the top of the supporting plate frame, a protection component is fixedly connected with the side surface of the supporting plate frame, one end of a connecting shaft one is fixedly connected with the side surface of a clamping plate, the side surfaces of the connecting shaft one and a connecting shaft two are slidably connected with the inner side of the sliding grooves, and the bottom of the connecting shaft one is fixedly connected with an extension rod one. When the integrated circuit board is lifted and shaken after being plated with nickel, the integrated frame formed by folding is annular and can surround and collect the liquid drops and splashes, acid and alkali corrosion of the frame is avoided, liquid medicine across the tank is prevented from dropping, and cross contamination of the tank liquid is completely prevented.

Description

Technical Field

[0001] This invention relates to the field of nickel plating technology for circuit boards, specifically to an electroless nickel plating equipment and process for integrated circuit boards. Background Technology

[0002] The electroless nickel plating equipment for integrated circuit boards is a specialized complete set of equipment for surface treatment of PCBs and semiconductor circuit boards. It mainly consists of an electroless nickel plating main tank, a constant temperature heating system, a plating solution circulation and filtration device, a pH and temperature online monitoring module, an automatic replenishment system, a swing / air agitation mechanism, and pre- and post-treatment water washing and activation stations. The tank is mostly made of 316 stainless steel or PP lined with Teflon, which is resistant to high temperature and corrosion. The equipment relies on the principle of autocatalytic deposition to keep the prepared plating solution containing nickel salt, reducing agent, complexing agent and stabilizer at a constant temperature range of 85-90℃. It can accurately control the pH value, plating solution concentration and circulation filtration flow rate. With automatic rack conveying and swing positioning structure, it completes the degreasing, micro-etching, palladium activation of the circuit board and then performs uniform electroless nickel deposition. It can achieve uniform coating thickness, strong adhesion and high density. It has fully automatic process control, real-time parameter monitoring, automatic chemical replenishment and environmentally friendly waste liquid collection functions. It is suitable for batch electroless nickel plating production of various integrated circuit boards, IC carrier boards and precision circuit boards. It operates stably and has good process consistency.

[0003] Chinese patent CN221344702U discloses a chemical nickel plating device for printed circuit boards, including a positioning substrate. By using a positioning plate, a fixing rod, a movable block, a clamping block, a limiting cap, a telescopic spring, and a pad, the device suspends and positions the circuit board to be nickel plated, facilitating subsequent immersion of the circuit board in the plating solution. The limiting rod limits the movable block and clamping block, making their operation more stable. The handle facilitates pulling the clamping block. The electric push rod and mounting plate work together to push the clamped circuit board downwards.

[0004] The protective structure of this technical solution has limited coverage and can only simply block a small amount of liquid dripping from the circuit board. It cannot effectively block the splashing and splattering of liquid generated during the process of swinging the circuit board out of the tank. A large amount of corrosive nickel plating liquid is scattered at will, and the splashed liquid can easily drift to other work stations, causing cross-contamination of liquid across tanks, disrupting the stability of the nickel plating solution ratio, and affecting the quality of the nickel plating process of the circuit board. Summary of the Invention

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a chemical nickel plating equipment and process for integrated circuit boards, comprising:

[0006] A nickel plating tank, which has a rectangular open outer shell structure, and a driving component is fixedly connected to the bottom of the nickel plating tank;

[0007] The support frame is slidably connected to the side of the nickel plating tank. The bottom of the support frame is fixedly connected to the output end of the first drive component. Sliding grooves are provided on both sides of the support frame. The top of the support frame is fixedly connected to the second drive component. The side of the support frame is fixedly connected to the protective component.

[0008] The movable plate has its inner side slidably connected to the side of the support frame, and the middle of the top of the movable plate is fixedly connected to the output end of the second drive component.

[0009] A clamping plate is symmetrically arranged on both sides of the bottom of the movable plate, and the top of the clamping plate is fixedly connected to the bottom of the movable plate through a support shaft.

[0010] The protective component includes: a top plate, the inner side of which is fixedly connected to the side of the support frame, and an integration mechanism two and an integration mechanism one slidably connected to both sides of the bottom of the top plate;

[0011] A connecting shaft 1, one end of which is fixedly connected to the side of the clamping plate, and the sides of both the connecting shaft 1 and the connecting shaft 2 are slidably connected to the inner side of the sliding groove. A telescopic rod 1 is fixedly connected to the bottom of the connecting shaft 1.

[0012] A second connecting shaft is fixedly connected at its top to the bottom of a first telescopic rod. A first spring is fitted on the first telescopic rod. One end of the first spring is fixedly connected to the side of the first connecting shaft, and the other end of the first spring is fixedly connected to the side of the second connecting shaft.

[0013] A connecting block, the side of which is fixedly connected to one end of the connecting shaft 2, and connecting rod 1 and connecting rod 2 are rotatably connected to both sides of the connecting block. The ends of connecting rod 1 and connecting rod 2 away from the connecting block are respectively rotatably connected to the integration mechanism 2 and the integration mechanism 1.

[0014] Telescopic rod two, the two ends of which are fixedly connected to the sides of integrated mechanism two and integrated mechanism one respectively, and a second spring is sleeved on the telescopic rod two;

[0015] Furthermore, the integration mechanism includes an integration frame, the top of which is slidably connected to the bottom of the top plate via a guide slider, the top of which has a slot, the side of which is rotatably connected to the end of the connecting rod away from the connecting block, and the bottom of which is fixedly connected to a guide plate.

[0016] Furthermore, the second integration mechanism includes an second integration frame. The top of the second integration frame is slidably connected to the bottom of the top plate via a guide slider. The side of the second integration frame is rotatably connected to the end of the first connecting rod away from the connecting block. The top of the second integration frame has a slot two. The bottom of the second integration frame is fixedly connected to a guide plate two. The bottom of the inner cavity of the second integration frame has a guide groove. The bottom of the guide groove is connected to a discharge pipe via a pipe. Contact components are fixedly connected to the inner sides of both the first integration frame and the second integration frame. The two ends of the second telescopic rod are fixedly connected to the first integration frame and the second integration frame respectively. One end of the second spring is fixedly connected to the first integration frame, and the other end of the second spring is fixedly connected to the second integration frame.

[0017] Furthermore, the contact assembly includes four contact rods and two sliding rods. The contact rods are symmetrically arranged in pairs, one above the other, and the sides of the contact rods are fixedly connected to the inner side of the first integrated frame. Scrapers are slidably connected to the two contact rods. The sides of the scrapers and the movable frame are both hollowed out. The scraping surface of the scraper contacts the inner side of the first integrated frame. One end of the sliding rod is slidably connected to the inner side of the first integrated frame, and the other end of the sliding rod is fixedly connected to a contact frame. Movable frames are rotatably connected to both sides of the contact frame, and the other end of the movable frame is rotatably connected to the inner side of the scraper. A third spring is sleeved on the sliding rod. One end of the third spring is fixedly connected to the contact frame, and the other end of the third spring is fixedly connected to the inner side of the first integrated frame.

[0018] This invention provides an apparatus and process for electroless nickel plating of integrated circuit boards. It has the following beneficial effects:

[0019] 1. The chemical nickel plating equipment and process for this integrated circuit board, when the board is lifted and swung after nickel plating, the closed integrated frame forms a ring barrier to collect drips and splashes, avoid acid and alkali corrosion of the frame, prevent chemical solution from dripping across the tank, and completely prevent cross-contamination of the tank solution.

[0020] 2. The chemical nickel plating equipment and process for this integrated circuit board, with guide plate one and guide plate two forming a sloping liquid guiding path, can smoothly flow into the guide trough. The structure of the guide trough, which is low in the middle and high on both sides, utilizes gravity to self-aggregate the liquid, and can automatically collect the liquid without additional power. After the liquid is collected, it can be uniformly processed and recycled.

[0021] 3. The chemical nickel plating equipment and process for this integrated circuit board, when the integration frame is combined and squeezed, the scraper scrapes the dirt in the forward direction. When separated, the spring resets the scraper to scrape it a second time. This can promptly remove the nickel plating solution, crystal precipitates and impurities adhering to the inner side of the integration frame, and avoid the accumulation of scale and blockage on the inner wall.

[0022] 4. The chemical nickel plating equipment and process for this integrated circuit board features a hollow design for the scraper and moving frame, reducing the contact area with the chemical solution, making it less prone to liquid buildup and scale accumulation, and reducing the amount of contaminants adhering to the surface. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the chemical nickel plating equipment for the integrated circuit board of the present invention;

[0024] Figure 2 This is a schematic diagram of the support frame of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the protective component of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the connecting rod of the present invention;

[0027] Figure 5 This is a schematic diagram of the integrated mechanism of the present invention;

[0028] Figure 6 This is a schematic diagram of the structure of the second integrated mechanism of the present invention;

[0029] Figure 7 This is a schematic diagram of the contact component of the present invention;

[0030] Figure 8 For the present invention Figure 7 Schematic diagram of the structure at point A;

[0031] Figure 9 This is a process flow diagram of the electroless nickel plating process for the integrated circuit board of this invention.

[0032] In the diagram: 1. Nickel plating tank; 2. Drive component one; 3. Support plate frame; 4. Drive component two; 5. Sliding groove; 6. Moving plate; 7. Clamping plate; 8. Protective component; 81. Top plate; 82. Connecting shaft one; 83. Connecting shaft two; 84. Telescopic rod one; 85. First spring; 86. Integration mechanism two; 861. Integration frame two; 862. Groove two; 863. Guide plate two; 864. Guide groove; 865. Outlet 87. Material pipe; 871. Integration mechanism 1; 872. Integration frame 1; 873. Groove 1; 874. Guide plate 1; 875. Contact assembly; 8741. Contact rod; 8742. Slide rod; 8743. Contact frame; 8744. Moving frame; 8745. Third spring; 8746. Scraper; 88. Connecting rod 1; 89. Connecting rod 2; 810. Connecting block; 811. Telescopic rod 2; 812. Second spring. Detailed Implementation

[0033] Please see Figures 1-2 This invention provides a chemical nickel plating apparatus for integrated circuit boards, comprising:

[0034] Nickel plating tank 1, which has a rectangular open outer shell structure, and a driving component 2 is fixedly connected to the bottom of nickel plating tank 1;

[0035] Support frame 3 is slidably connected to the side of nickel plating tank 1. The bottom of support frame 3 is fixedly connected to the output end of drive component 2. Sliding grooves 5 are provided on both sides of support frame 3. Drive component 2 4 is fixedly connected to the top of support frame 3. Protective component 8 is fixedly connected to the side of support frame 3.

[0036] The movable plate 6 has its inner side slidably connected to the side of the support frame 3, and the middle of the top of the movable plate 6 is fixedly connected to the output end of the drive component 4.

[0037] Clamping plate 7 is symmetrically arranged on both sides of the bottom of the movable plate 6, and the top of clamping plate 7 is fixedly connected to the bottom of the movable plate 6 through a support shaft.

[0038] Example 1, please refer to Figures 3-4 The present invention also includes a protective component 8, a driving component 2 is activated, and its output end drives the moving plate 6 to move on the support frame 3. The moving plate 6 drives the clamping plate 7 to move down synchronously through the support shaft. The clamping plate 7 drives the circuit board to move down to carry out the nickel plating work.

[0039] One end of connecting shaft 82 is fixedly connected to the side of clamping plate 7. The sides of both connecting shaft 82 and connecting shaft 83 are slidably connected to the inside of sliding groove 5. A telescopic rod 84 is fixedly connected to the bottom of connecting shaft 82. The top of connecting shaft 83 is fixedly connected to the bottom of telescopic rod 84. During the downward movement of clamping plate 7, connecting shaft 82 on both sides moves synchronously. Connecting shaft 82 drives connecting shaft 83 to slide synchronously in sliding groove 5 through telescopic rod 84 on the side.

[0040] The inner side of the top plate 81 is fixedly connected to the side of the support frame 3. The bottom sides of the top plate 81 are slidably connected to the second integration mechanism 86 and the first integration mechanism 87. The side of the connecting block 810 is fixedly connected to one end of the second connecting shaft 83. The two sides of the connecting block 810 are rotatably connected to the first connecting rod 88 and the second connecting rod 89. The ends of the first connecting rod 88 and the second connecting rod 89 away from the connecting block 810 are rotatably connected to the second integration mechanism 86 and the first integration mechanism 87, respectively. The second connecting shaft 83 drives the connecting block 810 to move downward. The connecting block 810 then drives the first connecting rod 88 and the second connecting rod 89 on both sides to move synchronously, so that the first connecting rod 88 and the second connecting rod 89 drive the first integration mechanism 87 and the second integration mechanism 86, respectively, and move smoothly apart at the bottom of the top plate 81 through the guide slider.

[0041] A first spring 85 is fitted on the telescopic rod 84. One end of the first spring 85 is fixedly connected to the side of the connecting shaft 82, and the other end of the first spring 85 is fixedly connected to the side of the connecting shaft 83. When the connecting shaft 83 is fully abutted against the inner side of the sliding groove 5, the clamping plate 7 continues to move downward under the drive of the connecting shaft 82. The telescopic rod 84 will retract and compress the first spring 85 fitted on the side, so as to avoid excessive opening and closing force of the integrated mechanism 87 and the integrated mechanism 86, which may cause damage.

[0042] The two ends of the telescopic rod 811 are fixedly connected to the sides of the integrated mechanism 86 and the integrated mechanism 87, respectively. The telescopic rod 811 is fitted with a second spring 812. When the integrated mechanism 87 separates from the integrated mechanism 86, it will pull the second spring 812 fitted on the telescopic rod 811, so that the integrated mechanism 87 and the integrated mechanism 86 gradually unfold, so that the clamping plate 7 can drive the circuit board to move downward for nickel plating.

[0043] Please see Figures 5-6 The present invention also includes an integration mechanism 1 87 and an integration mechanism 2 86;

[0044] The side of the first integrated frame 871 is rotatably connected to the end of the second connecting rod 89 away from the connecting block 810. The top of the first integrated frame 871 is slidably connected to the bottom of the top plate 81 through a guide slider. The top of the second integrated frame 861 is slidably connected to the bottom of the top plate 81 through a guide slider. The side of the second integrated frame 861 is rotatably connected to the end of the first connecting rod 88 away from the connecting block 810. When the second connecting shaft 83 drives the connecting block 810 to move downward, the connecting block 810 drives the first integrated frame 871 and the second integrated frame 861 respectively through the first connecting rod 88 and the second connecting rod 89 on both sides, and slides in opposite directions at the bottom of the top plate 81 with the help of the guide slider.

[0045] The top of the first integrated frame 871 has a slot 872, and the top of the second integrated frame 861 has a slot 862, so that the clamping plate 7 can drive the integrated circuit board to smoothly pass down along the slots 872 and 862 on the first integrated frame 871 and the second integrated frame 861 until the circuit board passes through the first integrated frame 871 and the second integrated frame 861 and falls into the nickel plating tank 1 for chemical nickel plating.

[0046] Contact components 874 are fixedly connected to the inner sides of both the first integrated rack 871 and the second integrated rack 861. At the same time, the contact components 874 on the inner sides of the first integrated rack 871 and the second integrated rack 861 move synchronously with the mechanism to rub against the inner wall of the integrated rack, thereby achieving automatic contact cleaning.

[0047] After the nickel plating process on the circuit board is completed, start the second drive unit 4, and its output end will drive the moving plate 6 to slide upward along the support frame 3.

[0048] The movable plate 6 drives the clamping plate 7 to move upward synchronously through the support shafts on both sides of the bottom;

[0049] During the upward movement of clamping plate 7, the connecting shaft 82 and telescopic rod 84 on both sides pull the connecting shaft 83 to move in the sliding groove 5, and the connecting block 810 is driven to move upward synchronously by the connecting shaft 83.

[0050] The connecting block 810 then drives the integrated frame 871 and the integrated frame 861 to move closer together via the connecting rods 88 and 89 on both sides, respectively.

[0051] The two ends of the telescopic rod 811 are fixedly connected to the integrated frame 871 and the integrated frame 861 respectively. One end of the second spring 812 is fixedly connected to the integrated frame 871, and the other end of the second spring 812 is fixedly connected to the integrated frame 861. With the elastic restoring effect of the telescopic rod 811 between the integrated frame 871 and the integrated frame 861 and the second spring 812 mounted on the telescopic rod 811, as the clamping plate 7 drives the nickel-plated circuit board to rise continuously, the integrated frame 871 and the integrated frame 861 gradually align and slowly close together.

[0052] When the clamping frame lifts the nickel-plated circuit board from the nickel plating tank 1 and swings it to drain the liquid, the closed integrated frame 1 871 and integrated frame 2 861 can form a closed enclosure to protect the circuit board, collect the splashed and dripped liquid, avoid a large amount of liquid from being directly spilled onto the machine and the ground, prevent liquid waste and cross-contamination of liquid across tanks.

[0053] The bottom of the first integrated frame 871 is fixedly connected to the first guide plate 873, and the bottom of the second integrated frame 861 is fixedly connected to the second guide plate 863. The first guide plate 873 is installed on the inner side of the first integrated frame 871, and the second guide plate 863 is installed on the inner side of the second integrated frame 861.

[0054] When the clamping plate 7 moves the circuit board between the integrated frame to swing and spray the liquid, the liquid that splashes onto the inside of the guide plate 873 can be guided along the inclined surface of the guide plate 873 to flow to one side of the guide plate 863.

[0055] The bottom of the inner cavity of the second integrated frame 861 is provided with a guide channel 864. The liquid medicine that falls into the inner side of the second integrated frame 861 flows downward along the slope of the second guide plate 863 and flows into the lower guide channel 864.

[0056] The guide channel 864 adopts a slope structure design with a low middle and high sides. After the liquid medicine enters the guide channel 864, it will automatically converge towards the middle of the channel.

[0057] The bottom of the guide channel 864 is connected to the discharge pipe 865 through a pipe. The middle part of the guide channel 864 is connected to the discharge pipe 865. The collected liquid flows into the discharge pipe 865 through the pipe for centralized collection, which can realize the unified collection of nickel plating liquid, which is convenient for subsequent purification and recycling.

[0058] Please see Figures 7-8 The present invention also includes a contact component 874, and a contact frame 8743 is fixedly connected to the other end of the slide rod 8742. When the first integrated frame 871 and the second integrated frame 861 merge and approach each other, the contact frames 8743 provided on the inner side of the two integrated frames are aligned and pressed against each other.

[0059] A third spring 8745 is sleeved on the slide rod 8742. Under the action of compressive force, the contact frame 8743 drives the slide rod 8742 to slide and compress the third spring 8745 sleeved on the slide rod 8742.

[0060] The contact rods 8741 are symmetrically arranged in pairs, one above the other, and the side of the contact rods 8741 is fixedly connected to the inside of the first integrated frame 871. The two sides of the contact frame 8743 are rotatably connected to the movable frame 8744. One end of the slide rod 8742 is slidably connected to the inside of the first integrated frame 871, and the other end of the movable frame 8744 is rotatably connected to the inside of the scraper 8746. The scraper 8746 is slidably connected to the two contact rods 8741. The two sets of contact frames 8743 move in alignment with the slide rod 8742 inside the first integrated frame 871 and the second integrated frame 861, and at the same time drive the movable frames 8744 on the upper and lower sides of the contact frame 8743, so that the upper and lower scrapers 8746 slide synchronously along the contact rods 8741.

[0061] The scraper 8746 moves to both sides to scrape off the residual medicine, stains and scale adhering to the inner wall of the integrated rack 871 and the integrated rack 861, and automatically cleans the inner wall to keep the inside of the integrated rack clean.

[0062] Meanwhile, both the scraper 8746 and the moving frame 8744 adopt a hollow structure design to reduce the adhesion and accumulation of medicine on the surface;

[0063] The sides of the scraper 8746 and the movable frame 8744 are both hollowed out. One end of the third spring 8745 is fixedly connected to the contact frame 8743, and the other end of the third spring 8745 is fixedly connected to the inner side of the first integrated frame 871. When the first integrated frame 871 and the second integrated frame 861 are separated from each other, the contact frame 8743 relies on the elastic restoring force of the third spring 8745 to drive the slide rod 8742 to return to its reverse position.

[0064] The scraping surface of scraper 8746 contacts the inner side of integrated frame 1 871. During the resetting process, the moving frames 8744 on both sides of the contact frame 8743 simultaneously drive scraper 8746 to scrape and clean the inner side of integrated frame 1 871 and integrated frame 2 861 again.

[0065] Please see Figure 9 A chemical nickel plating process for an integrated circuit board includes the following steps:

[0066] S1: Start the first driving component 2 to move the support plate frame 3 horizontally on the nickel plating tank 1, and simultaneously start the second driving component 4 to drive the moving plate 6 to move upward along both sides of the support plate frame 3, thereby lifting the clamping plate 7 and separating it from the protective component 8.

[0067] S2: The pre-treated integrated circuit board is neatly clamped and fixed on the clamping plate 7. The workpiece is sequentially subjected to degreasing, pickling, micro-etching, pre-immersion, palladium activation and thorough water washing to remove oil stains and oxide layers from the board surface, generate catalytically active crystal nuclei, and prevent impurities and residual chemicals from being carried into the nickel plating tank 1.

[0068] S3: The clamping plate 7 holding the circuit board is sent into the nickel plating tank 1. The plating solution in the nickel plating tank 1 is heated at a constant temperature and filtered through chemical circulation to maintain the temperature, concentration and pH value of the plating solution. Relying on the autocatalytic oxidation-reduction reaction, a dense and controllable medium phosphorus nickel alloy plating layer is uniformly deposited on the copper circuit and pad surface of the circuit board. This can block the diffusion of copper ions and improve the wear resistance of the board surface. The plating solution used in the nickel plating tank 1 is nickel sulfate as the main salt and sodium hypophosphite as the reducing agent, compounded with complexing agents, buffers and stabilizers. The tank temperature is 85℃, the pH value is 4.5 and the deposition time is 18min.

[0069] Specific workflow:

[0070] When the drive unit 2 is started, its output end drives the moving plate 6 to move on the support frame 3. The moving plate 6 drives the clamping plate 7 to move down synchronously through the support shaft. The clamping plate 7 drives the circuit board to move down to carry out the nickel plating work.

[0071] During the downward movement of the clamping plate 7, the connecting shafts 82 on both sides move synchronously. The connecting shafts 82 move synchronously within the sliding groove 5 via the telescopic rods 84 on the side.

[0072] The connecting shaft 83 drives the connecting block 810 to move downward, and the connecting block 810 in turn drives the connecting rods 88 and 89 on both sides to move synchronously, so that the connecting rods 88 and 89 drive the integration mechanism 87 and the integration mechanism 86 respectively, and move smoothly apart at the bottom of the top plate 81 through the guide slider.

[0073] When the connecting shaft 2 83 is fully abutted against the inner side of the sliding groove 5, the clamping plate 7 continues to move downward under the drive of the connecting shaft 1 82. The telescopic rod 1 84 will retract and compress the first spring 85 sleeved on the side, so as to avoid the phenomenon of excessive opening and closing force of the integrated mechanism 1 87 and the integrated mechanism 2 86, which may cause damage.

[0074] At the same time, when the first integration mechanism 87 and the second integration mechanism 86 are separated, the second spring 812 sleeved on the telescopic rod 811 will be pulled, so that the first integration mechanism 87 and the second integration mechanism 86 will gradually unfold, so that the clamping plate 7 can drive the circuit board to move downward for nickel plating.

[0075] When the connecting shaft 2 83 drives the connecting block 810 to move downward, the connecting block 810 drives the integrated frame 1 871 and the integrated frame 2 861 respectively through the connecting rod 1 88 and the connecting rod 2 89 on both sides, and slides in opposite directions at the bottom of the top plate 81 with the help of the guide slider.

[0076] The clamping plate 7 can drive the integrated circuit board to smoothly pass down along the slots 872 and 862 on the first and second integrated frames 871 and 861 until the circuit board passes through the first and second integrated frames 871 and falls into the nickel plating tank 1 for chemical nickel plating.

[0077] At the same time, the contact components 874 on the inner side of the integrated rack 1 871 and the integrated rack 2 861 move synchronously with the mechanism to rub against the inner wall of the integrated rack, thereby achieving automatic contact cleaning.

[0078] After the nickel plating process on the circuit board is completed, start the second drive unit 4, and its output end will drive the moving plate 6 to slide upward along the support frame 3.

[0079] The movable plate 6 drives the clamping plate 7 to move upward synchronously through the support shafts on both sides of the bottom;

[0080] During the upward movement of clamping plate 7, the connecting shaft 82 and telescopic rod 84 on both sides pull the connecting shaft 83 to move in the sliding groove 5, and the connecting block 810 is driven to move upward synchronously by the connecting shaft 83.

[0081] The connecting block 810 then drives the integrated frame 871 and the integrated frame 861 to move closer together via the connecting rods 88 and 89 on both sides, respectively.

[0082] With the elastic restoring effect of the telescopic rod 811 between the first integrated frame 871 and the second integrated frame 861 and the second spring 812 mounted on the telescopic rod 811, as the clamping plate 7 drives the nickel-plated circuit board to rise continuously, the first integrated frame 871 and the second integrated frame 861 gradually align and slowly close together.

[0083] When the clamping frame lifts the nickel-plated circuit board from the nickel plating tank 1 and swings it to drain the liquid, the closed integrated frame 1 871 and integrated frame 2 861 can form a closed enclosure to protect the circuit board, collect the splashed and dripped liquid, avoid a large amount of liquid from being directly spilled onto the machine and the ground, prevent liquid waste and cross-contamination of liquid across tanks.

[0084] A flow guide plate 873 is installed inside the integrated frame 871, and a flow guide plate 863 is installed inside the integrated frame 861.

[0085] When the clamping plate 7 moves the circuit board between the integrated frame to swing and spray the liquid, the liquid that splashes onto the inside of the guide plate 873 can be guided along the inclined surface of the guide plate 873 to flow to one side of the guide plate 863.

[0086] The liquid medicine that falls onto the inner side of the second integrated frame 861 flows downward along the slope of the second guide plate 863 and flows into the lower guide channel 864.

[0087] The guide channel 864 adopts a slope structure design with a low middle and high sides. After the liquid medicine enters the guide channel 864, it will automatically converge towards the middle of the channel.

[0088] The middle part of the guide channel 864 is connected to the discharge pipe 865. The collected liquid flows into the discharge pipe 865 for centralized collection, which can realize the unified collection of nickel plating liquid, facilitating subsequent purification and recycling.

[0089] When the first integrated frame 871 and the second integrated frame 861 are merged and brought closer together, the contact frames 8743 set on the inner side of the two integrated frames are aligned and pressed against each other.

[0090] Under the action of compressive force, the contact frame 8743 drives the slide rod 8742 to slide, and compresses the third spring 8745 sleeved on the slide rod 8742;

[0091] The two sets of contact frames 8743 move in alignment with the slide rod 8742 inside the first integrated frame 871 and the second integrated frame 861, and at the same time drive the moving frames 8744 on the upper and lower sides of the contact frame 8743, so that the upper and lower scrapers 8746 slide synchronously along the contact rod 8741.

[0092] The scraper 8746 moves to both sides to scrape off the residual medicine, stains and scale adhering to the inner wall of the integrated rack 871 and the integrated rack 861, and automatically cleans the inner wall to keep the inside of the integrated rack clean.

[0093] Meanwhile, both the scraper 8746 and the moving frame 8744 adopt a hollow structure design to reduce the adhesion and accumulation of medicine on the surface;

[0094] When the first integrated frame 871 and the second integrated frame 861 are separated, the contact frame 8743 relies on the elastic restoring force of the third spring 8745 to drive the slide rod 8742 to return to its reverse position.

[0095] During the reset process, the movable frames 8744 on both sides of the contact frame 8743 simultaneously drive the scraper 8746 to scrape and clean the inner sides of the first integrated frame 871 and the second integrated frame 861 again.

[0096] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A chemical nickel plating apparatus for integrated circuit boards, characterized in that, include: A nickel plating tank, which has a rectangular open outer shell structure, and a driving component is fixedly connected to the bottom of the nickel plating tank; The support frame is slidably connected to the side of the nickel plating tank. The bottom of the support frame is fixedly connected to the output end of the first drive component. Sliding grooves are provided on both sides of the support frame. The top of the support frame is fixedly connected to the second drive component. The side of the support frame is fixedly connected to the protective component. The movable plate has its inner side slidably connected to the side of the support frame, and the middle of the top of the movable plate is fixedly connected to the output end of the second drive component. A clamping plate is symmetrically arranged on both sides of the bottom of the movable plate, and the top of the clamping plate is fixedly connected to the bottom of the movable plate through a support shaft. The protective component includes: The top plate is fixedly connected to the side of the support frame on its inner side, and the bottom of the top plate is slidably connected to both sides of the integration mechanism 2 and integration mechanism 1. A connecting shaft is provided, one end of which is fixedly connected to the side of the clamping plate, and a telescopic rod is fixedly connected to the bottom of the connecting shaft. A second connecting shaft is fixedly connected at its top to the bottom of a first telescopic rod, and a first spring is fitted onto the first telescopic rod. A connecting block is fixedly connected to one end of a connecting shaft two on its side. Connecting rod one and connecting rod two are rotatably connected to both sides of the connecting block. The ends of connecting rod one and connecting rod two away from the connecting block are rotatably connected to integrating mechanism two and integrating mechanism one, respectively.

2. The chemical nickel plating equipment for integrated circuit boards according to claim 1, characterized in that, Also includes: Telescopic rod two, the two ends of which are fixedly connected to the sides of integrated mechanism two and integrated mechanism one respectively, and a second spring is sleeved on telescopic rod two.

3. The chemical nickel plating equipment for integrated circuit boards according to claim 2, characterized in that: The sides of both connecting shaft one and connecting shaft two are slidably connected to the inner side of the sliding groove. One end of the first spring is fixedly connected to the side of connecting shaft one, and the other end of the first spring is fixedly connected to the side of connecting shaft two.

4. The electroless nickel plating equipment for integrated circuit boards according to claim 3, characterized in that: The integration mechanism includes an integration frame, the top of which is slidably connected to the bottom of the top plate via a guide slider. The top of the integration frame is provided with a slot. The side of the integration frame is rotatably connected to the end of the connecting rod away from the connecting block. The bottom of the integration frame is fixedly connected with a guide plate.

5. The chemical nickel plating equipment for integrated circuit boards according to claim 4, characterized in that: The second integration mechanism includes an integration frame. The top of the integration frame is slidably connected to the bottom of the top plate via a guide slider. The side of the integration frame is rotatably connected to the end of the connecting rod away from the connecting block. The top of the integration frame is provided with a slot. The bottom of the integration frame is fixedly connected with a guide plate. The bottom of the inner cavity of the integration frame is provided with a guide groove. The bottom of the guide groove is connected to a discharge pipe via a pipe.

6. The electroless nickel plating equipment for integrated circuit boards according to claim 5, characterized in that: Contact components are fixedly connected to the inner sides of both the first and second integrated frames. The two ends of the second telescopic rod are fixedly connected to the first and second integrated frames respectively. One end of the second spring is fixedly connected to the first integrated frame, and the other end of the second spring is fixedly connected to the second integrated frame.

7. The electroless nickel plating equipment for integrated circuit boards according to claim 6, characterized in that: The contact assembly includes four contact rods and two slide rods. The contact rods are arranged symmetrically in pairs, one above the other, and the sides of the contact rods are fixedly connected to the inner side of the first integration frame. Scrapers are slidably connected to the two contact rods. One end of the slide rod is slidably connected to the inner side of the first integration frame, and the other end of the slide rod is fixedly connected to a contact frame. Movable frames are rotatably connected to both sides of the contact frame. The other end of the movable frame is rotatably connected to the inner side of the scraper. A third spring is sleeved on the slide rod.

8. The chemical nickel plating equipment for integrated circuit boards according to claim 7, characterized in that: The scraper and the side of the movable frame are both designed to be hollow. The scraping surface of the scraper is in contact with the inner side of the integrated frame. One end of the third spring is fixedly connected to the contact frame, and the other end of the third spring is fixedly connected to the inner side of the integrated frame.

9. A chemical nickel plating process for an integrated circuit board, wherein the chemical nickel plating equipment for an integrated circuit board according to claim 1 is characterized in that, Includes the following steps: S1: Start the first drive unit to move the support plate frame horizontally on the nickel plating tank, and simultaneously start the second drive unit to move the moving plate upward along both sides of the support plate frame, thereby lifting the clamping plate and separating it from the protective component; S2: The pre-treated integrated circuit board is neatly clamped and fixed on the clamping plate. The workpiece is sequentially subjected to degreasing, pickling, micro-etching, pre-immersion, palladium activation and thorough water washing to remove oil stains and oxide layers from the board surface, generate catalytically active crystal nuclei, and prevent impurities and residual chemicals from being carried into the nickel plating bath. S3: The clamping plate holding the circuit board is sent into the nickel plating bath. The plating solution in the nickel plating bath is heated at a constant temperature and filtered through chemical circulation to maintain the temperature, concentration and pH value of the plating solution. Relying on the autocatalytic oxidation-reduction reaction, a dense and controllable medium phosphorus nickel alloy plating layer is uniformly deposited on the copper lines and pads of the circuit board, which can block the diffusion of copper ions and improve the wear resistance of the board surface.

10. A chemical nickel plating process for an integrated circuit board, wherein the chemical nickel plating equipment for an integrated circuit board according to claim 9 is characterized in that: The plating solution used in the nickel plating tank is nickel sulfate as the main salt, sodium hypophosphite as the reducing agent, and compounded with complexing agents, buffers and stabilizers. The tank temperature is 85℃, the pH value is 4.5, and the deposition time is 18min.

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