Semiconductor wafer electroplating equipment based on chemical nickel-palladium-gold technology

Abstract

The present application relates to the semiconductor wafer electroplating equipment based on the chemical nickel palladium gold technology, relates to wafer electroplating technical field, including electroplating equipment ontology, a plurality of electroplating groove bodies are arranged in a straight line on the electroplating equipment ontology, and the electroplating equipment ontology and electroplating groove body are used to carry out electroplating to wafer, conveying assembly is arranged on the electroplating equipment ontology, conveying assembly is used to convey and soak wafer between multiple electroplating groove bodies, and conveying assembly includes vibrator, four groups of pressing plate and four roller shafts;Through the operation of conveying assembly, clamping and rotating, real-time switching clamping point are designed, so that the original shielding area on the wafer surface can be exposed to medium, eliminate electroplating dead angle, and up and down movement and vibration function are designed, the reaction bubble attached on wafer is broken through vibration, the medium flow and exchange are strengthened, so that the reaction is more sufficient and more uniform, ensure that wafer full surface can participate in the reaction, significantly improve the continuity and consistency of plating layer.

Description

Technical Field

[0001] This invention relates to the field of wafer electroplating technology, specifically to semiconductor wafer electroplating equipment based on chemical nickel-palladium-gold technology. Background Technology

[0002] Chemical nickel-palladium-gold electroplating is a key process for semiconductor wafer surface treatment. Wafer electroplating equipment based on this technology mainly uses a multi-tank structure arranged in a straight line to immerse the wafer in tanks that carry different chemical solutions, hot pure water, and substances such as nickel, palladium, and gold. This completes a series of reactions such as surface activation, deposition, and cleaning, ultimately forming a uniform, dense, and well-adhesive composite coating on the wafer surface. This provides a stable and reliable surface foundation for the conductivity, soldering, and protection of subsequent semiconductor devices, and is an important piece of equipment to ensure the electrical performance and structural stability of the wafer.

[0003] Current linear multi-tank wafer electroplating equipment still has significant drawbacks in actual operation. Traditional conveying and clamping mechanisms often employ rigid, fixed structures, which are prone to mechanical damage such as edge chipping and surface scratches during wafer transfer and immersion. Furthermore, they are difficult to adapt to wafers of different sizes, resulting in poor versatility. Simultaneously, the fixed clamping points continuously obstruct local areas of the wafer, preventing sufficient contact and reaction with the plating solution, creating plating blind spots that affect the continuity and uniformity of the coating. In addition, the wafer only undergoes routine lifting and immersion movements, making it prone to surface air bubbles and low solution exchange efficiency, further exacerbating coating defects. These problems not only reduce wafer yield and plating quality but also increase equipment changeover and debugging costs, hindering the stability and large-scale production efficiency of semiconductor wafer electroplating processes. Summary of the Invention

[0004] Semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology includes an electroplating equipment body with multiple electroplating tanks arranged in a straight line. The electroplating equipment body and the electroplating tanks are used to electroplat the wafers. The electroplating equipment body is equipped with a conveying assembly for conveying and immersing the wafers between the multiple electroplating tanks. The conveying assembly includes a vibrator, four sets of pressure plates, and four rollers. The vibrator is used to apply vibration to the wafer. Each set includes two pressure plates, and multiple balls are uniformly connected to the two pressure plates on their adjacent sides. The pressure plates are used to clamp the wafers. The distance between the four rollers is adjustable. The rollers and balls are used to assist the rotation of the wafers. Both the balls and rollers are made of rubber.

[0005] Furthermore, the conveying assembly also includes a moving platform, which is slidably connected to the electroplating equipment body. A threaded rod is installed on the electroplating equipment body, and the moving platform is threadedly connected to the threaded rod. An electric push rod is fixedly connected to the bottom end of the moving platform. The electric push rod includes a fixed shaft and a telescopic shaft. The telescopic shaft end of the electric push rod faces downward, and a support plate is fixedly connected to the telescopic shaft end of the electric push rod. Four connecting rods are slidably connected to the bottom of the support plate in a ring shape.

[0006] Furthermore, a cross frame is fixedly connected to the bottom of the four connecting rods. Each connecting rod is fitted with a tension spring, the two ends of which are fixedly connected to the support plate and the cross frame, respectively. The vibrator is fixedly connected to the bottom of the support plate and includes a fixed end and an output end. The output end of the vibrator is in contact with the top surface of the cross frame. A bellows is fixedly connected to the side of the support plate and the cross frame that are close to each other. Four sets of guide rods are fixedly connected in a circular array on the cross frame. Each set includes two guide rods. The four sets of pressure plates correspond to the four sets of guide rods. The two pressure plates in the same set are symmetrically slidably connected to the two plates in the corresponding set. Each guide rod is fitted with a tension spring II, the two ends of which are fixedly connected to the sides of two adjacent pressure plates. Each tension spring II is fitted with a bellows II, the two ends of which are fixedly connected to the sides of two adjacent pressure plates. The cross frame has four through slots arranged in a circular array, the positions of which correspond to the four sets of pressure plates. The two guide rods at the corresponding positions are located on both sides of the adjacent through slots. The four rollers are slidably connected in the four through slots. The cross frame has four sliders arranged in a circular array, and the four sliders are rotatably connected to the adjacent rollers.

[0007] Furthermore, each slider has two symmetrically slidably connected rods. The ends of the two rods on the same slider that are away from the cross frame are fixedly connected to a pull plate. Each rod is fitted with a tension spring three. The two ends of the tension spring three are fixedly connected to the sides of the slider and the pull plate that are close to each other. The sides of the slider and the pull plate that are close to each other at corresponding positions are fixedly connected to a bellows three. The cross frame has four sets of slots arranged in a circular array. A protective shell is slidably connected to the top of the cross frame. A servo motor is fixedly connected inside the protective shell. The servo motor includes a fixed end and an output shaft. The output shaft end of the servo motor faces the side of the cross frame and is fixedly connected to the roller shaft located at the top.

[0008] Furthermore, the bellows encloses the connecting rod, tension spring, vibrator, and other structures within it.

[0009] Furthermore, the ball bearings are connected to the pressure plate in a limited-position rotational manner.

[0010] Furthermore, the pressure plate has grooves corresponding to the adjacent through slots, and both ends of the roller shaft pass through the corresponding through slots. The four roller shafts pass through the grooves of the two pressure plates at the corresponding positions.

[0011] Furthermore, a set of slots consists of multiple slots arranged in a straight line array. The two slots in the same set are located on both sides of the through slot at corresponding positions, and the slots are engaged with the plug rods.

[0012] Compared with the prior art, the beneficial effects of the present invention are: By utilizing the operation of the conveying components, an adaptive flexible clamping structure was designed that can automatically adapt to wafers of different sizes, eliminating the need for frequent fixture changes, improving equipment compatibility and production continuity, reducing changeover costs, and reducing contact stress while ensuring clamping stability, avoiding mechanical damage caused by rigid contact, and improving the safety and integrity of wafers transported between multiple slots.

[0013] By operating the conveyor components, a clamping and rotating mechanism with real-time switching of clamping points was designed to expose previously obscured areas on the wafer surface to the medium, eliminating dead zones in electroplating. Furthermore, a vertical movement and vibration function was designed to break up reaction bubbles attached to the wafer and enhance the flow and exchange of the medium, making the reaction more complete and uniform. This ensures that the entire surface of the wafer can participate in the reaction, significantly improving the continuity and consistency of the coating. Attached Figure Description

[0014] Figure 1 This is a three-dimensional schematic diagram of the overall device of the present invention; Figure 2 This is a schematic diagram showing the positions of the electroplating tank, wafer, and other structures of the present invention; Figure 3 This is a cross-sectional schematic diagram of the support plate, cross frame, and other structures of the present invention; Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle; Figure 5 This is a cross-sectional schematic diagram of the pressure plate, pull plate, and other structures of the present invention; Figure 6 For the present invention Figure 5 Enlarged view of point B in the middle; Figure 7 This is a cross-sectional schematic diagram of the cross frame, roller shaft, and other structures of the present invention; Figure 8 For the present invention Figure 7 Enlarged view of point C in the middle; Figure 9 This is a cross-sectional schematic diagram of the cross frame, roller shaft, and other structures of the present invention; Figure 10 This is an exploded view of the support plate, cross frame, and other structures of the present invention; Figure 11 This is an exploded view of the roller shaft, pressure plate, and other structures of the present invention.

[0015] In the picture: 11. Electroplating equipment body; 12. Electroplating tank; 13. Wafer; Conveying components: 21. Moving table; 22. Threaded rod; 23. Electric push rod; 24. Support plate; 25. Connecting rod; 26. Cross frame; 27. Tension spring one; 28. Vibrator; 29. ​​Bellows one; 210. Guide rod; 211. Pressure plate; 212. Tension spring two; 213. Bellows two; 214. Ball bearing; 215. Through groove; 216. Roller shaft; 217. Slider; 218. Insert rod; 219. Pull plate; 220. Tension spring three; 221. Bellows three; 222. Slot; 223. Protective shell; 224. Servo motor. Detailed Implementation

[0016] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0017] Reference Figures 1 to 11 As shown, a semiconductor wafer electroplating device based on electroless nickel-palladium-gold technology includes an electroplating device body 11, on which a plurality of electroplating tanks 12 are arranged in a straight line. The electroplating device body 11 and the electroplating tanks 12 are used to electroplat the wafer 13.

[0018] The electroplating equipment body 11 is equipped with a conveying component, which is used to convey and immerse the wafer 13 between multiple electroplating tanks 12.

[0019] The conveying assembly includes a moving platform 21, which is slidably connected to the electroplating equipment body 11. A threaded rod 22 is installed on the electroplating equipment body 11, and the moving platform 21 is threadedly connected to the threaded rod 22. An electric push rod 23 is fixedly connected to the bottom end of the moving platform 21. The electric push rod 23 includes a fixed shaft and a telescopic shaft. The telescopic shaft end of the electric push rod 23 faces downward, and a support plate 24 is fixedly connected to the telescopic shaft end of the electric push rod 23. Four connecting rods 25 are slidably connected in a ring shape at the bottom of the support plate 24. A cross frame 26 is fixedly connected to the bottom end of the four connecting rods 25. A tension spring 27 is sleeved on each connecting rod 25. The two ends of the tension spring 27 are fixedly connected to the support plate 24 and the cross frame 26, respectively. A vibrator 28 is fixedly connected to the bottom of the support plate 24. The vibrator 28 includes a fixed end and an output end. The output end of the vibrator 28 is attached to the top surface of the cross frame 26. A bellows 29 is fixedly connected to the support plate 24 and the cross frame 26 on their adjacent sides. Four sets of guide rods 210 are fixedly connected in a circular array on the cross frame 26. Each set includes two guide rods 210. Two pressure plates 211 are symmetrically slidably connected to the two guide rods 210 in the same set. Each guide rod 210 is fitted with a tension spring 212. The two ends of the tension spring 212 are fixedly connected to the adjacent sides of the two pressure plates 211. Each tension spring 212 is fitted with a bellows 213. The two ends of the bellows 213 are fixedly connected to the adjacent sides of the two pressure plates 211. On the side of the two pressure plates 211 of the set, which are close to each other, multiple balls 214 are evenly rotatably connected. Four through slots 215 are arranged in a circular array on the cross frame 26, with the positions of the four through slots 215 corresponding to the four sets of pressure plates 211. The pressure plates 211 have slots corresponding to adjacent through slots 215. Two guide rods 210 are located on both sides of the adjacent through slots 215. A roller 216 is slidably connected to each of the four through slots 215, with both ends of the roller 216 passing through the corresponding through slot. The four rollers 216 pass through the slots of the two pressure plates 211 at their respective positions. Four sliders 217 are slidably connected in a circular array on the cross frame 26, and the four sliders 217 are rotatably connected to adjacent rollers 216. Each slider 21... Each of the 7 slides symmetrically with two insert rods 218. The ends of the two insert rods 218 on the same slider 217 away from the cross frame 26 are fixedly connected to a pull plate 219. Each insert rod 218 is fitted with a tension spring 220. The two ends of the tension spring 220 are fixedly connected to the sides of the slider 217 and the pull plate 219 that are close to each other. The sides of the slider 217 and the pull plate 219 that are close to each other at corresponding positions are fixedly connected to a bellows 221. The cross frame 26 has four sets of slots 222 arranged in a circular array. Each set of slots 222 consists of two slots 222 arranged in a straight line. The two slots 222 in the same set are located on both sides of the through slot 215 at corresponding positions. The slots 222 are inserted and engaged with the insert rods 218.A protective shell 223 is slidably connected to the top of the cross frame 26. A servo motor 224 is fixedly connected inside the protective shell 223. The servo motor 224 includes a fixed end and an output shaft. The output shaft end of the servo motor 224 faces the cross frame 26 and is fixedly connected to the roller 216 located at the top.

[0020] The threaded rod 22 is connected to an external drive motor (not shown in the figure), and can drive the threaded rod 22 to rotate when the external drive motor is running.

[0021] Among them, the bellows-29 encloses the connecting rod 25, tension spring 27, vibrator 28 and other structures, and its function is to provide shielding and protection for the internal mechanisms.

[0022] Among them, the side of the two pressure plates 211 in the same group that are close to each other is set as an inclined surface.

[0023] Among them, the bellows 213 encloses the tension spring 212, and its function is to provide shielding and protection for the tension spring 212.

[0024] Among them, the ball bearing 214 is a limited rotating connection on the pressure plate 211, which allows the ball bearing 214 to rotate flexibly in all directions on the pressure plate 211.

[0025] Both the ball bearing 214 and the roller 216 are made of rubber. Their function is to provide flexible positioning and clamping for the wafer 13.

[0026] The position distribution of slot 222 in a single group serves to adjust the spacing of the four rollers 216 to accommodate wafers 13 of different sizes; and the position distribution of slot 222 can accommodate the size of a conventional wafer 13.

[0027] Among them, the servo motor 224 shields and protects the protective shell 223.

[0028] In the initial state of the transport assembly, i.e. before the electroplating operation of wafer 13 is performed, the structural states within the transport assembly are as follows: The shift stage 21 is located on top of the electroplating tank 12 that is at the beginning of the process among multiple electroplating tanks 12. The wafer 13 is not placed in the cross frame 26. The telescopic shaft of the electric push rod 23 is fully retracted. The cross frame 26 has not entered the electroplating tank 12. The vibrator 28 has not yet started running. The tension spring 1 27 has not produced elastic deformation. The four rollers 216 are at the end away from the center of the cross frame 26 in the corresponding through slot 215. That is, the distance between the four rollers 216 is the largest at this time. The insertion rod 218 is inserted into the slot 222 on the side away from the center of the cross frame 26 in the corresponding set of slots 222. The tension spring 3 220 has not produced elastic deformation. The tension spring 212 has not produced elastic deformation. The distance between the two pressure plates 211 in the same group is the smallest.

[0029] When the transport assembly is running, i.e., when the electroplating operation of wafer 13 is required, the transport assembly operates as follows: At this point, the user needs to install the wafer 13 into the cross frame 26. The user can insert the wafer 13 into the cross frame 26 from the top at an angle. During the process of inserting the wafer 13 into the cross frame 26, the wafer 13 first comes into contact with the top pressure plate 211 and a set of pressure plates 211 located near the insertion direction and in the middle, and applies a pushing force to the pressure plates 211 at these two locations. Then, under the guiding action of the inclined surface of the pressure plate 211, the wafer 13 pushes the two pressure plates 211 in the same set to the sides, so that the two pressure plates 211 slide apart on the corresponding guide rods 210, so that the wafer 13 can enter between the two pressure plates 211 and come into contact with the ball bearing 214. The wafer 13 continues to move downward under the push of the user, and the ball bearing 214 can assist the movement of the wafer 13 by rotating flexibly during this process.

[0030] As wafer 13 moves downward, it comes into contact with a set of pressure plates 211 at the bottom and another set of pressure plates 211 in the middle. Under the guidance of the inclined plane, wafer 13 is inserted into the two pressure plates 211 at the bottom. At this time, wafer 13 pushes and separates from the four sets of pressure plates 211. Under the elastic restoring action of tension spring 212, tension spring 212 always applies an inward pulling force to the two adjacent pressure plates 211. That is, the two pressure plates 211 of the same set always apply an inward clamping force to wafer 13. At this time, both sides of wafer 13 are clamped by the four sets of pressure plates 211.

[0031] After completion, the user moves the four rollers 216 sequentially. Specifically, the user pulls the pull plate 219 away from the cross frame 26, causing the pull plate 219 to move the two insertion rods 218 synchronously. The tension spring 220 is pulled, causing elastic deformation, and the insertion rods 218 are pulled out of their current slots 222. After completion, while maintaining the pull plate 219, the user moves it towards the center of the cross frame 26. This causes the pull plate 219 to move the slider 217 synchronously via the insertion rods 218. The slider 217 then moves the rollers 216, thus... 16 slides within the slot 215 toward the center of the cross frame 26 until the roller 216 moves to the side of the wafer 13. At this point, the user stops pulling the pull plate 219. Under the elastic reset action of the tension spring 220, the tension spring 220 pulls the pull plate 219 toward the cross frame 26. At the same time, the pull plate 219 drives the insertion rod 218 to move toward the cross frame 26. As the insertion rod 218 moves, it inserts into the slot 222 at the current position. At this time, the insertion of the insertion rod 218 into the slot 222 limits the position of the roller 216 on the cross frame 26.

[0032] After the user moves the four rollers 216 in sequence, all four rollers 216 are in contact with the sides of the wafer 13 and are confined on the cross frame 26. At the same time, the wafer 13 is clamped by four sets of pressure plates 211 on both sides, and the sides of the wafer 13 are confined by the four rollers 216, thus the wafer 13 is clamped and confined within the cross frame 26. Since the rollers 216 and the balls 214 are both made of rubber, the clamping of the wafer 13 is flexible. Although the roller 216 is restricted in its displacement at this time, it can rotate on the cross frame 26 because it is rotatably connected to the slider 217. At the same time, although the wafer 13 is restricted in its displacement by the pressure plate 211 and the roller 216, it is held by the pressure plate 211 through the ball bearings 214. The ball bearings 214 can rotate flexibly on the pressure plate 211, so the wafer 13 can rotate on its own while its displacement is restricted.

[0033] After completion, the user performs the electroplating operation on wafer 13, as follows: At this point, wafer 13 is located at the top of the first electroplating tank 12 in the process flow among multiple electroplating tanks 12. The user drives the telescopic shaft of the electric push rod 23 to extend. As the telescopic shaft of the electric push rod 23 extends, it pushes the cross frame 26 downward. As the cross frame 26 moves downward, the wafer 13, which is confined within the cross frame 26, moves downward synchronously until the wafer 13 is completely immersed in the medium of the electroplating tank 12. At this time, the wafer 13 undergoes a reaction within the electroplating tank 12.

[0034] During the immersion of wafer 13 in electroplating tank 12, the user can drive electric push rod 23 to operate, causing the telescopic shaft of electric push rod 23 to periodically extend and retract. This ensures that wafer 13 is completely immersed in electroplating tank 12 while moving up and down within the medium. Simultaneously, the user activates vibrator 28. With the activation of vibrator 28, the vibrating end of vibrator 28 applies a downward vibration force to cross frame 26. This causes cross frame 26 to drive multiple connecting rods 25 to slide within support plate 24 with the vibration, while tension spring 27 undergoes corresponding elastic deformation. This allows wafer 13 to periodically move up and down while being vibrated during immersion in electroplating tank 12. Actively disturbing the medium surrounding wafer 13 during immersion strongly promotes the exchange between the medium and the surface of wafer 13, and shakes off attached air bubbles, thus ensuring the uniformity and consistency of the plating layer and improving the overall effectiveness of the immersion solution.

[0035] During the immersion process of wafer 13, the user drives servo motor 224 to run, thereby causing the output shaft of servo motor 224 to rotate. The output shaft of servo motor 224 drives the top roller 216 to rotate synchronously, so that the top roller 216 rotates on the corresponding slider 217 and through groove 215. Since the roller 216 is in contact with wafer 13 at this time, the roller 216 pushes wafer 13 to rotate during the rotation of the top roller 216. At this time, wafer 13 rotates on the other rollers 216, and at the same time, wafer 13 drives the other rollers 216 to rotate synchronously. In addition, wafer 13 rotates within the four sets of pressure plates 211. During this process, the ball bearings 214 that are in contact with wafer 13 can assist the rotation of wafer 13 through their flexible rotation characteristics on the pressure plates 211.

[0036] This allows the wafer 13 to rotate within the cross frame 26 during the immersion process. As the wafer 13 rotates, the clamping and limiting structures such as the roller 216, pressure plate 211, and ball bearings 214 switch between different clamping areas on the wafer 13 in real time, ensuring that each clamped area can be exposed to the medium to participate in the reaction, thereby eliminating unplated areas caused by the fixture blocking.

[0037] After completion, the user drives the telescopic shaft of the electric push rod 23 to retract, moving the cross frame 26 and the wafer 13 upwards until they are no longer immersed in the electroplating tank 12. Then, the user drives the external drive motor of the threaded rod 22 to run, causing the threaded rod 22 to rotate. During the rotation of the threaded rod 22, the threaded rod 22 tends to drive the moving stage 21 to deflect along the thread direction. However, the moving stage 21 is simultaneously slidably connected to the electroplating equipment body 11. The moving stage 21 can only move linearly along the arrangement direction of the multiple electroplating tanks 12. As the threaded rod 22 rotates, the moving stage 21 can drive the electric push rod 23 and its mechanism to move horizontally towards the electroplating tank 12 of the subsequent process.

[0038] When the next immersion process is reached in the electroplating tank 12, the user pauses the rotation of the threaded rod 22 to fix the current position of the wafer 13, and then drives the telescopic shaft of the electric push rod 23 to extend, lowering the cross frame 26 and the wafer 13 into the current position of the electroplating tank 12 for immersion. The user then repeats the above-mentioned up-and-down movement, shaking, and rotation to switch clamping positions, and repeats this process to immerse the wafer 13 in multiple electroplating tanks 12 in sequence.

[0039] It should be noted that during the immersion process of wafer 13, since the cross frame 26 and the structure on it also need to be immersed in the medium, the corrugated tube 29, the corrugated tube 213, the tension spring 220, and the protective shell 223 can provide isolation and shielding protection for the structure inside during the immersion process.

[0040] When the soaking process is complete, the user needs to remove wafer 13 as follows: The user drives the telescopic shaft of the electric push rod 23 to fully retract, thereby moving the cross frame 26 and the wafer 13 out of the electroplating tank 12. The user then pulls the pull plate 219 away from the cross frame 26, causing the insertion rod 218 to disengage from the slot 222. Simultaneously, the tension spring 220 undergoes elastic deformation. The user then moves the pull plate 219 away from the wafer 13, causing the roller 216 to move away from the wafer 13. After this, the user stops pulling the pull plate 219, and the tension spring 220 elastically resets, allowing the insertion rod 218 to insert into the slot 222. At this point, the sidewall of the wafer 13 is no longer restricted by the roller 216, and the user can directly remove the wafer 13 from the cross frame 26. As the wafer 13 is removed from the cross frame 26, the tension spring 212 elastically resets, causing the corresponding pressure plates 211 to converge. The user then drives the external drive motor of the threaded rod 22 to run, thereby causing the moving stage 21 to move the cross frame 26 back to the top of the first electroplating tank 12 among the multiple electroplating tanks 12, thus completing the electroplating of the wafer 13, and at the same time resetting the various structures of the conveying components.

[0041] In summary, the following beneficial effects can be achieved by operating the delivery components: By utilizing the operation of the conveying components, an adaptive flexible clamping structure was designed that can automatically adapt to wafers of different sizes 13 without the need for frequent fixture changes. This improves equipment compatibility and production continuity, reduces changeover costs, and reduces contact stress while ensuring clamping stability, avoiding mechanical damage caused by rigid contact and improving the safety and integrity of wafer 13 transport between multiple slots.

[0042] By operating the conveying components, a clamping and rotating mechanism with real-time switching of clamping points was designed to expose previously obscured areas on the wafer 13 surface to the medium, eliminating electroplating dead zones. Furthermore, a vertical movement and vibration function was designed to break up reaction bubbles attached to the wafer 13 and enhance medium flow and exchange, making the reaction more complete and uniform. This ensures that the entire surface of the wafer 13 can participate in the reaction, significantly improving the continuity and consistency of the plating layer.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A semiconductor wafer electroplating apparatus based on electroless nickel-palladium-gold technology, comprising an electroplating apparatus body (11), wherein a plurality of electroplating tanks (12) are arranged in a straight line on the electroplating apparatus body (11), the electroplating apparatus body (11) and the electroplating tanks (12) are used to electroplat a wafer (13), characterized in that: The electroplating equipment body (11) is provided with a conveying assembly, which is used to convey and immerse the wafer (13) between multiple electroplating tanks (12). The conveying assembly includes a vibrator (28), four sets of pressure plates (211) and four rollers (216). The vibrator (28) is used to apply vibration to the wafer (13). Each set includes two pressure plates (211). On the side of the two pressure plates (211) in the same set that are close to each other, multiple balls (214) are uniformly rotated and connected. The pressure plates (211) are used to clamp the wafer (13). The distance between the four rollers (216) is adjustable. The rollers (216) and the balls (214) are used to assist the rotation of the wafer (13). The balls (214) and the rollers (216) are both made of rubber.

2. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 1, characterized in that: The conveying assembly also includes a moving platform (21), which is slidably connected to the electroplating equipment body (11). A threaded rod (22) is installed on the electroplating equipment body (11). The moving platform (21) is threadedly connected to the threaded rod (22). An electric push rod (23) is fixedly connected to the bottom end of the moving platform (21). The electric push rod (23) includes a fixed shaft and a telescopic shaft. The telescopic shaft end of the electric push rod (23) faces downward. A support plate (24) is fixedly connected to the telescopic shaft end of the electric push rod (23). Four connecting rods (25) are slidably connected to the bottom of the support plate (24) in a ring shape.

3. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 1, characterized in that: The bottom ends of the four connecting rods (25) are fixedly connected to a cross frame (26). Each connecting rod (25) is fitted with a tension spring (27). The two ends of the tension spring (27) are fixedly connected to the support plate (24) and the cross frame (26) respectively. The vibrator (28) is fixedly connected to the bottom of the support plate (24). The vibrator (28) includes a fixed end and an output end. The output end of the vibrator (28) is in contact with the top surface of the cross frame (26). The support plate (24) and the cross frame (26) are fixedly connected to a bellows (29) on the side that is close to each other. Four sets of guide rods (210) are fixedly connected in a ring array on the cross frame (26). Each set includes two guide rods (210). The four sets of pressure plates (211) correspond to the four sets of guide rods (210) respectively. The two pressure plates (211) of the same set are symmetrically slidably connected to the two guide rods (210) of the corresponding set. Each guide rod (210) is fitted with a tension spring (212), and the two ends of the tension spring (212) are fixedly connected to the side of the two adjacent pressure plates (211) respectively. Each tension spring (212) is fitted with a bellows (213), and the two ends of the bellows (213) are fixedly connected to the side of the two adjacent pressure plates (211) respectively. The cross frame (26) is provided with four through slots (215) in a circular array. The positions of the four through slots (215) correspond to the four sets of pressure plates (211) respectively. The two guide rods (210) at the corresponding positions are located on both sides of the adjacent through slots (215) respectively. The four rollers (216) are slidably connected in the four through slots (215) respectively. The cross frame (26) is provided with four sliders (217) in a circular array. The four sliders (217) are rotatably connected to the adjacent rollers (216) respectively.

4. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 1, characterized in that: Each slider (217) has two symmetrically sliding rods (218). The ends of the two rods (218) on the same slider (217) away from the cross frame (26) are fixedly connected to a pull plate (219). Each rod (218) is fitted with a tension spring (220). The two ends of the tension spring (220) are fixedly connected to the sides of the slider (217) and the pull plate (219) that are close to each other. The corresponding sliders (217) and pull plates (219) are close to each other. A bellows tube (221) is fixedly connected to one side. Four sets of slots (222) are arranged in a ring array on the cross frame (26). A protective shell (223) is slidably connected to the top of the cross frame (26). A servo motor (224) is fixedly connected inside the protective shell (223). The servo motor (224) includes a fixed end and an output shaft. The output shaft end of the servo motor (224) faces the cross frame (26) and is fixedly connected to the roller (216) located at the top.

5. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 3, characterized in that: The bellows (29) encloses the connecting rod (25), tension spring (27), vibrator (28) and other structures.

6. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 1, characterized in that: The ball (214) is a limited rotating connection on the pressure plate (211).

7. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 3, characterized in that: The pressure plate (211) has a groove corresponding to the adjacent through groove (215), and both ends of the roller (216) pass through the corresponding through groove (215). The four rollers (216) pass through the grooves of the two pressure plates (211) at the corresponding positions respectively.

8. The semiconductor wafer electroplating equipment based on electroless nickel-palladium-gold technology according to claim 4, characterized in that: A set of slots (222) consists of two slots (222) arranged in a straight line array. The two slots (222) in the same set are located on both sides of the through slot (215) at corresponding positions. The slots (222) are engaged with the plug (218).

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