Preparation method of display panel, display panel and display device

Abstract

The invention belongs to the technical field of display, and discloses a preparation method of a display panel, the display panel and a display device.The preparation method of the display panel comprises the steps that a TFT layer is prepared on a first substrate; preparing an LED on the second substrate; carrying out power-on detection on the LED and repairing the LED; the first substrate and the second substrate are buckled, and the LEDs are electrically connected with the TFT layer; and packaging the first substrate and the second substrate. The display panel is prepared through the preparation method of the display panel and comprises a first substrate and a second substrate which are arranged in a stacked mode, a TFT layer is arranged on the first substrate, an LED is arranged on the second substrate, the TFT layer is electrically connected with the LED, and the first substrate is connected with the second substrate in a packaging mode. The display device comprises a display panel. The preparation method of the display panel, the display panel and the display device provided by the invention have relatively high yield.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel preparation method, display panel and display device. BACKGROUND

[0002] Micro-LED has the advantages of smaller size, higher resolution, higher brightness, higher luminous efficiency, lower power consumption and good controllability, and is widely used in display screens. Color liquid crystal screen, referred to as TFT (Thin Film Transistor), refers to a thin film transistor, that is, each liquid crystal pixel point is driven by a thin film transistor integrated behind the pixel point, so that high speed, high brightness and high contrast display screen information can be achieved.

[0003] At present, more and more display screens will adopt the form of combination of LED and TFT. However, the combination of LED and TFT in the prior art has the problem of low yield. SUMMARY

[0004] An object of the present application is to provide a display panel preparation method with high yield.

[0005] According to the above idea, the technical scheme adopted by the present application is as follows:

[0006] The display panel preparation method comprises the following steps:

[0007] Preparation of a TFT layer on a first substrate;

[0008] Preparation of an LED on a second substrate, and power-on detection and repair of the LED;

[0009] Clamping the first substrate and the second substrate, and electrically connecting the LED and the TFT layer;

[0010] Encapsulation of the first substrate and the second substrate.

[0011] Optionally, the power-on detection and repair of the LED comprises:

[0012] Power-on detection of the LED;

[0013] Replacement of the LED that fails to pass the detection;

[0014] Power-on detection of the replaced LED until all the LEDs on the second substrate pass the detection.

[0015] Optionally, the power-on detection of the LED comprises:

[0016] Formation of a common electrode on the second substrate;

[0017] connecting the LED to be detected with the common electrode;

[0018] disconnecting the LED after detection from the common electrode when the LED to be detected is qualified after detection.

[0019] Optionally, after the LED is prepared on the second substrate, and before the LED is powered on for detection and repair, the preparation method of the display panel further comprises the following steps:

[0020] forming a light shielding layer on the area of the second substrate where the LED is not arranged, the light shielding layer and the LED being located on the same side of the second substrate.

[0021] Optionally, before the first substrate and the second substrate are encapsulated, inert gas is filled between the first substrate and the second substrate.

[0022] Optionally, the second substrate is provided with a plurality of second substrates, and the first substrate and the second substrate are buckled, comprising: buckling a plurality of second substrates on the first substrate.

[0023] Another object of the present application is to provide a display panel with a higher yield.

[0024] As conceived above, the technical solution adopted by the present application is:

[0025] The display panel is prepared by the above-mentioned preparation method of the display panel, and the display panel comprises a first substrate and a second substrate arranged in layers, the first substrate is provided with a TFT layer, the second substrate is provided with an LED, the TFT layer and the LED are located between the first substrate and the second substrate, and the TFT layer is electrically connected with the LED.

[0026] Optionally, the first substrate and the second substrate are each provided with one; or,

[0027] The first substrate is provided with one, and the second substrate is provided with a plurality of second substrates, and the plurality of second substrates are assembled on the first substrate.

[0028] Optionally, the first substrate is provided with the TFT layer, one side of the TFT layer is provided with a binding area, and the orthographic projection of the second substrate on the first substrate is located outside the binding area.

[0029] Another object of the present application is to provide a display device with a higher yield.

[0030] As conceived above, the technical solution adopted by the present application is:

[0031] The display device comprises the display panel as described above.

[0032] The display panel preparation method, the display panel and the display device provided by the present application have at least the following beneficial effects:

[0033] The TFT layer is prepared on the first substrate, the LED is prepared on the second substrate, the LED is subjected to power-on detection and repair, so that all the LEDs on the second substrate are qualified LEDs, then the first substrate and the second substrate are buckled, and the LED is electrically connected with the TFT layer, finally, the first substrate and the second substrate are packaged to obtain the display panel. By arranging the first substrate and the second substrate and arranging the LED on the second substrate, the power-on detection and repair of the LED on the second substrate can be realized, that is, the repair of the LED can be realized before the LED is electrically connected with the TFT layer, the damage to the TFT layer is reduced, and the LED connected with the TFT layer is all qualified, thereby improving the yield of the display panel.

[0034] The transfer, detection and repair process of the LED on the second substrate is simple and can be realized. After multiple detection and repair, the yield of the LED can reach 100%. Therefore, the problem that the transfer, detection and repair of the LED must be performed on the array backplane in the prior art is solved, and the process is complex, difficult and low in yield.

[0035] Moreover, since the power-on detection and repair of the LED are realized on the second substrate, and the yield of the TFT layer on the first substrate and the yield of the LED on the second substrate are both close to 100%, the first substrate does not need to be designed with “LED repair redundancy” or “double TFT” to occupy the design space of the first substrate, thereby improving the PPI of the display panel.

[0036] In addition, the display panel is formed by buckling the first substrate and the second substrate, which realizes the water-oxygen and chemical isolation ability of the double-substrate bonding scheme, has high water-oxygen and chemical isolation ability, and improves the reliability of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 is a structural schematic diagram of a display panel in the prior art provided by the present application;

[0038] Figure 2 is a flowchart of a display panel preparation method provided by an embodiment of the present application;

[0039] Figure 3 is a schematic diagram when the first substrate and the second substrate are not buckled, provided by an embodiment of the present application;

[0040] Figure 4 is a structural schematic diagram of a first display panel provided by an embodiment of the present application Figure 1 ;

[0041] Figure 5is a structural schematic diagram of a second substrate provided by an embodiment of the present application;

[0042] Figure 6 is a schematic diagram after a glue layer is formed on the second substrate provided by an embodiment of the present application;

[0043] Figure 7 is a schematic diagram after an LED is prepared on the second substrate provided by an embodiment of the present application;

[0044] Figure 8 is a schematic diagram after a light shielding layer is formed on the second substrate provided by an embodiment of the present application;

[0045] Figure 9 is a schematic diagram after a common electrode is formed on the second substrate provided by an embodiment of the present application;

[0046] Figure 10 is a schematic diagram after the LED is disconnected from the common electrode provided by an embodiment of the present application;

[0047] Figure 11 is a structural schematic diagram of a second display panel provided by an embodiment of the present application;

[0048] Figure 12 is a structural schematic diagram of a third display panel provided by an embodiment of the present application;

[0049] Figure 13 is a structural schematic diagram of a fourth display panel provided by an embodiment of the present application;

[0050] Figure 14 is a structural schematic diagram of a fifth display panel provided by an embodiment of the present application;

[0051] Figure 15 is a structural schematic diagram of a sixth display panel provided by an embodiment of the present application.

[0052] In the drawings:

[0053] 100, first substrate; 200, second substrate; 300, TFT layer; 310, first bonding part; 400, LED; 410, second bonding part; 500, binding area; 600, light shielding layer; 700, glue layer; 800, common electrode; 900, connecting line;

[0054] 1, array back plate; 2, backside TFT; 3, frontside TFT; 4, side edge trace; 5, binding structure; 6, light emitting structure; 7, encapsulation layer. DETAILED DESCRIPTION

[0055] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects reached more clear, the technical solutions of the present application will be further described below in conjunction with the accompanying drawings and specific embodiments. It can be understood that the specific embodiments described here are only used to explain the present application, but not limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, not all.

[0056] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0057] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0058] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "above" and "on" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "under" and "under" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature. In the description of the present embodiment, if not specially stated, "a plurality of" specifically refers to two or more than two.

[0059] In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or position relationship is based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0060] Embodiment one

[0061] Figure 1 For a display panel in the prior art, such as Figure 1As shown in the figure, the display panel includes an array backboard 1, the back surface of the array backboard 1 is provided with a back surface TFT 2, the front surface of the array backboard 1 is provided with a front surface TFT 3, one side surface of the array backboard 1 is provided with a side edge trace 4, and the side edge trace 4 is connected to the back surface TFT 2 and the front surface TFT 3. The back surface TFT 2 is provided with a binding structure 5. The front surface TFT 3 is electrically connected with a light emitting structure 6, and the light emitting structure 6 is externally encapsulated with an encapsulation layer 7.

[0062] In the preparation of the display panel in the prior art, the front surface TFT 3 and the back surface TFT 2 are first prepared on the array backboard 1, and then the light emitting structure 6 is prepared on the front surface TFT 3. After the light emitting structure 6 is connected to the front surface TFT 3, all the light emitting structures 6 need to be subjected to electrical detection, and when the light emitting structure 6 is unqualified, the light emitting structure 6 needs to be replaced. Specifically, the electrical connection between the unqualified light emitting structure 6 and the front surface TFT 3 needs to be disconnected, and then a new light emitting structure 6 is installed at the original position. During the replacement process, the front surface TFT 3 is more likely to be damaged, and the repair process of the light emitting structure 6 is complex, thereby causing the preparation method of the display panel to have a low yield and being unable to ensure 100%.

[0063] Moreover, since the light emitting structure 6 needs to be repaired, the array "LED repair redundancy bit" and "double TFT" and other designs are required, which occupies the design position of the array backboard 1 and affects the realization of high PPI.

[0064] In view of the above problems, the embodiment provides a preparation method of a display panel, and the prepared display panel has a high yield.

[0065] As shown in the figure, the preparation method of the display panel includes the following steps: Figure 2

[0066] S1, preparing a TFT layer 300 on a first substrate 100;

[0067] S2, preparing an LED 400 on a second substrate 200 and performing electrical detection and repair on the LED 400;

[0068] S3, buckling the first substrate 100 and the second substrate 200, and electrically connecting the LED 400 and the TFT layer 300;

[0069] S4, encapsulating the first substrate 100 and the second substrate 200.

[0070] ​The preparation method of the display panel provided in the embodiment is to prepare the TFT layer 300 on the first substrate 100, prepare the LED 400 on the second substrate 200, and detect and repair the LED 400, so that all the LEDs 400 on the second substrate 200 are qualified LEDs 400, then buckle the first substrate 100 and the second substrate 200, and make the LED 400 electrically connected with the TFT layer 300, and finally encapsulate the first substrate 100 and the second substrate 200 to obtain the display panel. By arranging the first substrate 100 and the second substrate 200 and arranging the LED 400 on the second substrate 200, the power-on detection and repair of the LED 400 can be realized on the second substrate 200, that is, the repair of the LED 400 can be realized before the LED 400 is electrically connected with the TFT layer 300, the damage to the TFT layer 300 is reduced, and the LED 400 connected with the TFT layer 300 is all a qualified LED 400, thereby improving the yield of the display panel.

[0071] The preparation method of the display panel provided in the embodiment is simple and can be realized, and the yield of the LED 400 can reach 100% after multiple detection and repair, so the problem that the LED transfer, detection and repair must be performed on the array backplane in the prior art is solved, and the process is complex, difficult and low in yield.

[0072] In addition, since the power-on detection and repair of the LED 400 are realized on the second substrate 200, and the yield of the TFT layer 300 on the first substrate 100 and the LED 400 on the second substrate 200 is close to 100%, the first substrate 100 does not need to be designed with an "LED repair redundancy" or a "double TFT" to occupy the design space of the first substrate 100, thereby improving the PPI of the display panel.

[0073] In addition, the display panel provided in the embodiment is formed by buckling the first substrate 100 and the second substrate 200, realizes the double-substrate bonding scheme to isolate water and oxygen and chemical substances, has high ability to isolate water and oxygen and chemical substances, and improves the reliability of the display panel.

[0074] It should be noted that the specific way of preparing the TFT layer 300 in step S1 can refer to the process of forming the TFT layer 300 on the substrate in the prior art, which will not be described in detail in the embodiment. After the TFT layer 300 is prepared, the high yield of the TFT layer 300 can be realized by detection and repair. For example, the first substrate 100 can be an active matrix driving backplane (i.e., an AM array backplane). It should be noted that the first substrate 100 can be a transparent substrate or an opaque substrate, which is not limited in the embodiment.

[0075] In step S2, the LEDs 400 can be transferred to the second substrate 200 in batches, Figure 7 FIG. 4 is a schematic view of the second substrate 200 with the LEDs 400. For example, the second substrate 200 can be a passive matrix driving backplane (i.e., a PM array backplane). It should be noted that the second substrate 200 is a transparent substrate to ensure the display effect. It should be further noted that the power-on detection of all the LEDs 400 is performed on the second substrate 200.

[0076] Optionally, before step S2, as shown in FIG. 5, a glue layer 700 can be prepared on the second substrate 200, for example, a high-transparency glue is formed on the second substrate 200 by coating, to be used for pasting the LEDs 400. Figure 6

[0077] It should be noted that the order of step S1 and step S2 can be adjusted, which is not limited in the embodiment.

[0078] Optionally, the TFT layer 300 includes a first bonding part 310, and the LED 400 includes a second bonding part 410, so that the electrical connection between the LED 400 and the TFT layer 300 can be the electrical connection between the first bonding part 310 and the second bonding part 410. It should be noted that the TFT layer 300 can have a plurality of first bonding parts 310, and the second bonding parts 410 of a plurality of LEDs 400 correspond to the plurality of first bonding parts 310 one by one, and each second bonding part 410 is electrically connected to the corresponding first bonding part 310.

[0079] In the embodiment, the first bonding part 310 can be an electrode or a solder, and the second bonding part 410 can be an electrode or a solder, which is not limited in the embodiment. When connecting the LED 400 and the TFT layer 300, the first substrate 100 and the second substrate 200 can be clamped, and the whole formed after clamping the first substrate 100 and the second substrate 200 can be heated to melt the solder, so as to realize the electrical connection between the first bonding part 310 and the second bonding part 410.

[0080] Optionally, in step S4, the frame of the first substrate 100 and the second substrate 200 can be packaged with UV glue / glass frit.

[0081] Optionally, the power-on detection and repair of the LED in step S2 includes:

[0082] S21, performing power-on detection on the LED 400;

[0083] S22, replacing the LED 400 that fails to pass the detection;

[0084] ​S23. Perform a power-on test on the replaced LED 400 until all LEDs 400 on the second substrate 200 pass the test.

[0085] Optionally, the specific principle of the power-on test of LED 400 in step S21 can be found in the prior art, and will not be described in detail in this embodiment. For LED 400 that fails the test, a new LED 400 needs to be transferred, and the power-on test of the replaced LED 400 needs to be performed again to ensure that all LEDs 400 on the second substrate 200 are qualified. During the power-on test, LEDs 400 can be tested one by one, or in batches; this embodiment does not limit this.

[0086] In this embodiment, the second substrate 200 may have multiple LEDs 400. When each LED 400 is a qualified LED 400, the second substrate 200 is fastened to the first substrate 100.

[0087] In some optional embodiments, step S21 includes the following steps:

[0088] S211. A common electrode 800 is formed on the second substrate 200;

[0089] S212. Electrically connect the LED 400 to be tested to the common electrode 800;

[0090] S213. When the LED 400 to be tested passes the test, disconnect the electrical connection between the tested LED 400 and the common electrode 800.

[0091] In step S212, as Figure 9 As shown, the common electrode is electrically connected to the LED 400 via a connecting line 900. For example, the connecting line 900 is electrically connected to the second bonding portion 410.

[0092] Figure 10 This is a schematic diagram showing the disconnection between the LED 400 and the common electrode 800 provided in this embodiment. It should be noted that the common electrode 800 and the connecting line 900 located outside the LED 400 can be removed by etching or other methods, or they can remain directly on the second substrate 200. Since the common electrode 800 and the connecting line 900 are thin and narrow, they will not affect the display effect of the display panel. The connecting line 900 located on the LED 400 does not need to be removed to avoid damaging the LED 400.

[0093] In some optional embodiments, after the LED 400 is fabricated on the second substrate 200, and before the LED 400 is powered on and repaired, the method for fabricating the display panel further includes the following steps:

[0094] The light shielding layer 600 is formed in the region of the second substrate 200 where the LED 400 is not arranged, and the light shielding layer 600 and the LED 400 are located on the same side of the second substrate 200.

[0095] The light shielding layer 600 is used to shield all surfaces of the LED 400 except the front light emitting surface, so as to improve the black state uniformity of the display panel. For example, the light shielding layer 600 can be black glue, so as to have a higher light shielding effect. The front light emitting surface of the LED 400 is the surface of the LED 400 facing away from the second substrate 200.

[0096] In some optional embodiments, the light shielding layer 600 can be formed in the region of the second substrate 200 where the LED 400 is not arranged by coating, pasting, sputtering or the like. When the formed light shielding layer 600 covers the front light emitting surface of the LED 400, the light shielding layer 600 on the front light emitting surface of the LED 400 can be removed by a photolithography process. Figure 8 A schematic view after the light shielding layer 600 is formed on the second substrate 200.

[0097] It should be noted that the thickness of the light shielding layer 600 is less than the thickness of the LED 400, so as to prevent the light shielding layer 600 from covering the second bonding part 410. It should also be noted that due to the existence of the first bonding part 310 and the second bonding part 410, there will be a gap between the light shielding layer 600 and the TFT layer 300. For example, the distance between the light shielding layer 600 and the TFT layer 300 is about 10 microns. The gap can be filled or not filled. When not filled, since the first substrate 100 and the second substrate 200 will be encapsulated, the connection of the first bonding part 310 and the second bonding part 410 will not be affected by moisture.

[0098] When the light shielding layer 600 is arranged on the second substrate 200, the common electrode 800 and the connecting line 900 can be formed on the light shielding layer 600. By forming the common electrode 800 and the connecting line 900 on the light shielding layer 600, the common electrode 800 and the connecting line 900 can be located at the same height as the second bonding part 410 of the LED 400, so as to facilitate the electrical connection between the common electrode 800 and the connecting line 900 and the second bonding part 410 of the LED 400.

[0099] Optionally, before the first substrate 100 and the second substrate 200 are encapsulated, inert gas is filled between the first substrate 100 and the second substrate 200, so that the inert gas fills between the first substrate 100 and the second substrate 200, so as to prevent the structure between the first substrate 100 and the second substrate 200 from being oxidized.

[0100] In the prior art, the spliced screen is usually formed by splicing a plurality of display screens, each of which comprises an array substrate. In the splicing process, the plurality of screen bodies are first assembled in a box body, and then the plurality of box bodies are spliced to form a large-area box spliced screen body. On the one hand, the splicing method in the prior art has the problem of a large splicing seam, which affects the display effect. Moreover, the difference in TFT electrical properties / process between the screen bodies or the box bodies easily causes a difference in display effect. In addition, the splicing process in the prior art is complex and has a low yield.

[0101] In some optional embodiments, one first substrate 100 and one second substrate 200 are provided. The size of the first substrate 100 can be set according to actual needs, that is, the first substrate 100 can be large enough, and the second substrate 200 can also be large enough, so that the display panel assembled by the two can be large enough. In the present embodiment, the size of the second substrate 200 matches that of the first substrate 100, that is, the first substrate 100 is as large as the second substrate 200, and the two can realize large-screen display without splicing. Since the first substrate 100 can realize large size and high yield, single-screen (i.e., without splicing) large-size display is possible, and it is not necessary to adopt the way of splicing small screens to form a large screen in the prior art. Therefore, the preparation method of the display panel provided in the present embodiment has the characteristics of high yield, low cost, and good display effect.

[0102] In some other optional embodiments, one first substrate 100 is provided, which can be large enough, and a plurality of second substrates 200 are provided. In the step S3 of buckling the first substrate 100 and the second substrate 200, it includes: buckling the plurality of second substrates 200 on the first substrate 100 to assemble a large-area display panel. Since the preparation method of the display panel provided in the present embodiment only needs to splice the second substrates 200, the gap between the second substrates 200 can be small, solving the problem of a large splicing seam in the prior art. Moreover, when the second substrates 200 are designed to be large, the problem of a large number of splicing seams in the prior art can also be solved, achieving the purpose of realizing large-screen display with less splicing. It should be noted that the plurality of second substrates 200 can be buckled on the first substrate 100 one by one, or the plurality of second substrates 200 can also be buckled on the first substrate 100 at the same time.

[0103] Since the first substrate 100 in the present embodiment is not spliced, the characteristics of the array TFTs in the TFT layer 300 are uniform, which improves or even solves the problem of uneven display caused by uneven TFT characteristics.

[0104] Embodiment Two

[0105] The embodiment provides a display panel, and the display panel is formed by the preparation method of the display panel in the first embodiment. The display panel provided in the embodiment has high yield and good display effect.

[0106] As shown in Figures 3 to 5 , the display panel comprises a first substrate 100 and a second substrate 200 which are arranged in a stack. The first substrate 100 is provided with a TFT layer 300, and the second substrate 200 is provided with an LED 400. The TFT layer 300 is electrically connected with the LED 400, and the first substrate 100 is encapsulated and connected with the second substrate 200.

[0107] The display panel provided in the embodiment is provided with the first substrate 100 and the second substrate 200, so that the TFT layer 300 can be arranged on the first substrate 100, and the LED 400 can be arranged on the second substrate 200. Therefore, the power-on detection and repair of the LED 400 can be directly performed on the second substrate 200, without the need of connecting the LED 400 and the TFT layer 300 and then performing the power-on detection on the LED 400. In this way, the repair of the LED 400 can be realized before the LED 400 is electrically connected with the TFT layer 300, the damage to the TFT layer 300 is reduced, and the LED 400 connected with the TFT layer 300 is all qualified, so that the yield of the display panel is improved.

[0108] In some optional embodiments, as shown in Figure 11 , the first substrate 100 and the second substrate 200 are each provided with one.

[0109] In some other optional embodiments, as shown in Figure 12 , the first substrate 100 is provided with one, and the second substrate 200 is provided with a plurality of second substrates 200. The plurality of second substrates 200 are arranged in an array and assembled on the first substrate 100, so as to realize large-area display. In the embodiment, the first substrate 100 is provided with one, so that the TFT array thereon is relatively continuous and has good characteristic uniformity, and the influence of the TFT characteristic on the display effect is small.

[0110] The display panel provided in the embodiment can realize a single screen or a spliced screen, and can basically cover all display application scenarios.

[0111] Optionally, as shown in Figures 11 to 15 , the first substrate 100 is provided with a binding area 500 on one side of the TFT layer 300. The binding area 500 is used for arranging a binding structure. The binding structure is electrically connected with a TFT array of the TFT layer 300, so as to be used for signal transmission.

[0112] In this embodiment, the orthographic projection of the second substrate 200 on the first substrate 100 is located outside the binding area 500, that is, the second substrate 200 is arranged staggered with the binding area to avoid mutual influence of the two, and also to facilitate electrical connection of the binding structure with other components.

[0113] Optionally, the binding area 500 is arranged close to the edge of the first substrate 100, for example, as shown in Figure 11 and Figure 12 , the binding area 500 is provided with one and arranged at the lower edge of the first substrate 100. As shown in Figure 14 , the binding area 500 is arranged at the left edge of the first substrate 100.

[0114] It can be understood that, as shown in Figure 13 and Figure 15 , the binding area 500 can also be provided with multiple.

[0115] Embodiment three

[0116] The embodiment provides a display device including the display panel in the embodiment two, which has higher yield and better display effect.

[0117] Note that the above are only preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, Includes the following steps: A TFT layer (300) is fabricated on a first substrate (100); An LED (400) is fabricated on a second substrate (200), and the LED (400) is tested for power-on and repaired. The first substrate (100) and the second substrate (200) are fastened together, and the LED (400) is electrically connected to the TFT layer (300); The first substrate (100) and the second substrate (200) are packaged.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The LED (400) is subjected to power-on testing and repair, including: The LED (400) is tested for power-on status; Replace the LED (400) that failed the test; The replaced LEDs (400) are powered on for testing until all the LEDs (400) on the second substrate (200) pass the test.

3. The method for manufacturing a display panel according to claim 2, characterized in that, The power-on detection of the LED (400) includes: A common electrode (800) is formed on the second substrate (200); The LED (400) to be tested is electrically connected to the common electrode (800); When the LED (400) to be tested passes the test, disconnect the electrical connection between the tested LED (400) and the common electrode (800).

4. The method for manufacturing a display panel according to claim 1, characterized in that, After the LED (400) is fabricated on the second substrate (200), and before the LED (400) is powered on and repaired, the method for fabricating the display panel further includes the following steps: A light-shielding layer (600) is formed in a region of the second substrate (200) where the LED (400) is not disposed, the light-shielding layer (600) and the LED (400) being located on the same side of the second substrate (200).

5. The method for manufacturing a display panel according to any one of claims 1-4, characterized in that, Before encapsulating the first substrate (100) and the second substrate (200), an inert gas is introduced between the first substrate (100) and the second substrate (200).

6. The method for manufacturing a display panel according to any one of claims 1-4, characterized in that, The second substrate (200) is provided with a plurality of substrates, and fastening the first substrate (100) and the second substrate (200) includes fastening the plurality of second substrates (200) onto the first substrate (100).

7. A display panel, characterized in that, The display panel is formed by the method of manufacturing the display panel according to any one of claims 1-6. The display panel includes a first substrate (100) and a second substrate (200) stacked together. A TFT layer (300) is provided on the first substrate (100), and an LED (400) is provided on the second substrate (200). The TFT layer (300) and the LED (400) are located between the first substrate (100) and the second substrate (200), and the TFT layer (300) is electrically connected to the LED (400).

8. The display panel according to claim 7, characterized in that, Both the first substrate (100) and the second substrate (200) are provided with one; or, The first substrate (100) is provided, and the second substrate (200) is provided in multiple ways, with the multiple second substrates (200) assembled on the first substrate (100).

9. The display panel according to claim 7, characterized in that, The first substrate (100) has a bonding area (500) on one side where the TFT layer (300) is located, and the orthographic projection of the second substrate (200) on the first substrate (100) is located outside the bonding area (500).

10. A display device, characterized in that, Includes the display panel as described in any one of claims 7-9.

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