Surface treatment equipment for CMP polishing pad production

Abstract

The invention belongs to the technical field of chemical mechanical polishing, and discloses surface treatment equipment for CMP polishing pad production. The polishing roller is provided with a driving shaft, the axial direction of the driving shaft intersects with and is perpendicular to a rotating shaft of the rotating platform, and the polishing roller is arranged on the driving shaft in a sliding mode. Through the position change of the polishing roller on the driving shaft, comprehensive treatment on the surface of a workpiece on the rotating platform is achieved. The polishing roller is slidably arranged on the driving shaft perpendicularly intersected with the polishing roller, so that the polishing roller can freely move in the axial direction. The design breaks through the limitation of a traditional fixed or one-way movement polishing head, so that the polishing roller can continuously slide from the center of the rotating platform to the outer edge to cover the surface of a whole workpiece; according to the polishing pad surface finishing device, the polishing pad base material can be subjected to full-area and dead-corner-free surface finishing, the machining coverage rate and uniformity are remarkably improved, and the problem of local defects caused by uneven treatment in existing equipment is effectively solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chemical mechanical polishing, and particularly relates to a surface treatment equipment for CMP polishing pad production. BACKGROUND

[0002] As a core surface treatment process in the fields of semiconductor manufacturing, optical device processing and precision electronic component production, the importance of CMP (chemical mechanical polishing) technology is self-evident. In the CMP process, the polishing pad plays a crucial role, and as a key consumable material, its performance directly determines the polishing effect and efficiency. The manufacturing process of the polishing pad covers multiple necessary steps: substrate forming, surface treatment, pore structure design, and bonding and adhesive treatment, etc.

[0003] In particular, in the surface treatment stage, in order to enhance the polishing effect, the surface of the polishing pad may need to be specially treated, such as forming a NAP (nanocrystalline polymer) layer or adding specific abrasives, such as cerium oxide, diamond, etc. These special treatments can significantly improve the performance of the polishing pad, making it more suitable for specific application requirements. However, before such special treatment is performed on the surface of the polishing pad, it is essential to ensure that the surface of the polishing pad is highly flat. Only when the surface of the substrate reaches the required flatness standard, the subsequent surface modification treatment can uniformly and consistently cover the entire working surface, thereby ensuring that the material removal rate in the polishing process is both uniform and stable.

[0004] Regarding the treatment of the flatness of the substrate surface, the existing treatment equipment has the problem of single treatment mode, which makes different initial states of the substrate required, resulting in uneven material removal in some areas, poor consistency of surface texture, and other problems, which further affect the overall use effect of the polishing pad. In addition, when treating the surface of the substrate of the polishing pad, it is usually required to achieve comprehensive and uniform processing coverage to ensure that it has good material removal rate and surface consistency in the subsequent CMP (chemical mechanical polishing) process. However, the existing treatment equipment generally relies on fixtures to fix and position the substrate during actual operation, and these fixtures inevitably block or contact some areas of the substrate surface, thereby reducing the effective treatment area. SUMMARY

[0005] Therefore, the present application aims to provide a surface treatment equipment for CMP polishing pad production to solve the problems existing in the background art.

[0006] In order to solve the above technical problems, the technical scheme of the present application is a surface treatment equipment for CMP polishing pad production, comprising a workbench, a rotating platform and a polishing roller are arranged on the workbench.

[0007] The rotating platform is provided with a jig for fixing the polishing pad workpiece; the polishing roller is provided with a driving shaft, the axis of the driving shaft intersects and is perpendicular to the rotating shaft of the rotating platform, and the polishing roller is slidingly arranged on the driving shaft; by changing the position of the polishing roller on the driving shaft, the overall processing of the workpiece surface on the rotating platform is realized.

[0008] As a preferred, the driving shaft is divided into a same direction end and an opposite direction end with the rotating shaft of the rotating platform as the center; when the polishing roller is located at the same direction end of the driving shaft, the rotating directions of the polishing roller and the rotating platform are the same, which helps to distribute the friction force of the contact area between the polishing roller and the workpiece, avoids local overheating or excessive wear, and ensures the surface smoothness and flatness; when the polishing roller is located at the opposite direction end of the driving shaft, the rotating directions of the polishing roller and the rotating platform are opposite, which helps to quickly remove the surface material of the workpiece.

[0009] As a preferred, the workpiece surface is divided into a near region and a far region with the rotating shaft of the rotating platform as the reference; when the polishing roller moves from the near region to the far region, due to the difference in linear speed at different radius positions on the rotating platform, at least one of the rotating platform and the polishing roller reduces the rotating speed, so as to ensure that the relative linear speed of the polishing roller acting on the near region or the far region of the workpiece remains consistent, thereby realizing uniform processing of the entire surface of the workpiece.

[0010] As a preferred, the driving shaft is rotatably installed on a support frame, the support frame is provided with a sliding member, the sliding direction of the sliding member on the support frame is in the same vertical plane as the rotating shaft of the driving shaft; the sliding member is rotatably connected to the polishing roller, and the position of the polishing roller on the driving shaft is controlled by the sliding member; the polishing roller and the driving shaft are correspondingly provided with a transmission protrusion and a transmission notch, and the polishing roller is rotated at any position on the driving shaft under the action of the transmission protrusion and the transmission notch.

[0011] As a preferred, the jig is annularly distributed on the rotating platform with the rotating shaft of the rotating platform as the center; the jigs are all slidingly arranged on the rotating platform, and the sliding directions of the jigs are all towards the rotating shaft of the rotating platform; by sliding the jigs on the rotating platform, the rotating platform can fix polishing pad workpieces of different sizes.

[0012] Further, the jig comprises a linear moving part and a limiting member, the limiting member is arranged on the moving end of the linear moving part, the limiting member acts on the side wall of the workpiece, and the thickness of the limiting member is less than or equal to the thickness of the workpiece; so that the polishing roller avoids affecting the operation of the polishing roller when processing the edge surface of the workpiece.

[0013] Further, the limiting piece is swingly arranged with a swing piece on the side away from the rotating platform rotating shaft, the swing piece and the swing connection point of the limiting piece are located above the upper surface of the limiting piece; the swing piece can switch between the standby state and the clamping state; when the swing piece is in the standby state, the swing piece and the limiting piece are horizontally placed on the rotating platform, avoiding affecting the operation of the polishing roller; when the swing piece is in the clamping state, the swing piece and the limiting piece are vertically placed on the rotating platform, the swing piece and the limiting piece are attached and the swing piece is located above the limiting piece; in the transmission direction of the linear moving part, the length of the swing piece is greater than the length of the limiting piece; so that the swing piece can act on the upper surface of the workpiece and be fixed when switching to the clamping state.

[0014] Further, the opposite surfaces of the limiting piece and the swing piece are both provided with mounting grooves, the first transmission rod and the second transmission rod are respectively arranged in the mounting grooves of the limiting piece and the swing piece; the first transmission rod is arranged in a curved manner, the curved part of the first transmission rod is rotatably arranged on the limiting piece, one end of the first transmission rod close to the swing piece is rotatably connected with one end of the second transmission rod, the other end of the first transmission rod and the limiting piece are arranged in a telescopic cylinder, the telescopic cylinder, the limiting piece and the first transmission rod are all rotatably connected, the other end of the second transmission rod is rotatably arranged on the swing piece; when the telescopic cylinder is retracted, the swing piece is in the standby state; when the telescopic cylinder is extended, the swing piece is in the clamping state.

[0015] Further, when the thickness of the limiting piece is less than the thickness of the workpiece, the swing piece has a clamping opening; when the swing piece is in the clamping state, the upper surface of the workpiece is limited and fixed by the clamping opening.

[0016] Further, when the polishing roller performs surface treatment on the inner side of the workpiece, the swing piece switches to the clamping state to additionally clamp and fix the workpiece; when the polishing roller performs surface treatment on the outer side of the workpiece, the swing piece switches to the standby state to avoid affecting the operation of the polishing roller.

[0017] The technical effects of the present application mainly embody in the following aspects:

[0018] This invention slidably mounts a polishing roller on a drive shaft perpendicular to it, allowing it to move freely axially. This design overcomes the limitations of traditional fixed or unidirectional polishing heads, enabling the polishing roller to slide continuously from the center of the rotating platform to the outer edge, covering the entire workpiece surface. This allows the equipment to perform full-area, dead-angle-free surface finishing on the polishing pad substrate, significantly improving processing coverage and uniformity, and effectively solving the problem of local defects caused by uneven processing in existing equipment.

[0019] The drive shaft is divided into "co-directional end" and "reverse end." When the polishing roller is near the center (co-directional end), its rotation direction is the same as the rotating platform to reduce relative friction, avoid local overheating or excessive wear, and improve surface finish. When the polishing roller is at the edge (reverse end), its rotation direction is opposite to the rotating platform, enhancing material removal efficiency. This dual-mode operation caters to both fine finishing and rapid removal needs, improving the equipment's adaptability to workpieces in different initial states and achieving a balance between high efficiency and high quality.

[0020] Because the linear velocity at each point on the rotating platform varies with the radius, the relative friction of the polishing roller differs in different areas, easily causing uneven processing. This invention introduces a dynamic speed control mechanism based on position feedback. As the polishing roller moves from a nearby area to a more distant area, the rotational speed of the rotating platform or the polishing roller is adjusted to keep the relative linear velocity at their contact point constant. This strategy effectively balances the distribution of friction intensity, ensuring a consistent material removal rate throughout the polishing process, thereby significantly improving the consistency and smoothness of the workpiece surface treatment.

[0021] The fixture features a swingable clamping component on the top outer side of the limiting member. This component is controlled by a telescopic cylinder and a transmission rod to switch between a standby state (horizontally placed) and a clamping state (vertically erected). When the polishing roller processes the inner area, the clamping state is activated to enhance workpiece clamping force and prevent displacement or warping. When processing the outer area, the fixture switches to the standby state to completely avoid the polishing roller path and prevent obstruction. This structure ensures stable clamping without affecting processing coverage, greatly improving the equipment's process flexibility and automation level. Attached Figure Description

[0022] Figure 1 This is a structural diagram of the present invention;

[0023] Figure 2 for Figure 1 Structural diagram of the middle workbench;

[0024] Figure 3 for Figure 1 Structural diagram of the polishing roller;

[0025] Figure 4 for Figure 1Structure side view of the middle workbench

[0026] Figure 5 For Figure 1 Structure view of the middle jig

[0027] Figure 6 For Figure 1 Partial structure view of the middle jig

[0028] In the figure: 1, workbench; 11, rotating platform; 12, near area; 13, far area; 2, polishing roller; 21, driving shaft; 22, same direction end; 23, reverse end; 24, support frame; 25, sliding piece; 3, jig; 31, limiting piece; 32, swinging piece; 33, mounting groove; 34, first transmission rod; 35, second transmission rod; 36, telescopic cylinder. DETAILED DESCRIPTION

[0029] The specific embodiments of the present application are further described in detail below with reference to the accompanying drawings, so that the technical scheme of the present application is easier to understand and master. In the embodiments, it should be understood that the terms "intermediate", "upper", "lower", "top", "right side", "left end", "upper", "back", "middle" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, in the present specific embodiments, the connection or fixing method between the components is not specifically described, and the connection or fixing method can be bolted or pinned, or connected by a pin shaft, which is commonly used in the prior art. Therefore, in the present embodiments, it will not be described in detail.

[0030] The surface treatment equipment for CMP polishing pad production provided by the present application is mainly applied to meet the high-precision surface treatment needs of CMP polishing pad substrates, but is not limited thereto, and can also be used in other same or similar production processes.

[0031] In addition, as a common knowledge in the industry, the linear moving part and the telescopic cylinder 36 mentioned in the foregoing are equipped with independent driving motors. The above is common knowledge, and therefore the principle and structure will not be described in detail.

[0032] Example one

[0033] Referring to Figure 1 , Figure 2 The present embodiment discloses a surface treatment equipment for CMP polishing pad production, which aims to solve the problems of uneven substrate surface treatment, jig 3 shielding affecting effective processing area and poor equipment adaptability in the prior art.

[0034] Specifically include the workbench 1, the workbench 1 is provided with rotating platform 11 and polishing roller 2;The rotating platform 11 is provided with jig 3 for polishing pad workpiece fixed;The polishing roller 2 is equipped with driving shaft 21, the axis of the driving shaft 21 and the rotating shaft of the rotating platform 11 intersect and are perpendicular, the polishing roller 2 is slidably arranged on the driving shaft 21;Through the position change of the polishing roller 2 on the driving shaft 21, the overall processing of the workpiece surface on the rotating platform 11 is realized. Traditional surface treatment equipment usually uses fixed polishing head or polishing roller 2 only in single direction movement, resulting in limited coverage of workpiece surface, which is prone to processing blind area. In the embodiment, the polishing roller 2 is installed in the guide rail or sliding groove coaxial with the driving shaft 21 through the sliding mechanism, which can freely slide on the driving shaft 21 along the axial direction, thereby realizing full-area coverage processing from the center to the outer edge of the rotating platform 11;Improve the processing coverage of the device on the polishing pad workpiece surface, especially suitable for the pretreatment stage of the substrate surface which needs uniform treatment.

[0035] Referring to Figure 2 、 Figure 3 , further optimize the relative motion mode between the polishing roller 2 and the rotating platform 11, according to the different positions of the polishing roller 2, control the rotating direction and the turning relationship of the rotating platform 11, so as to realize the accurate matching of different processing requirements. Specifically as follows: in the case that the rotating platform 11 and the driving shaft 21 direction do not change, the driving shaft 21 must have one end rotating with the rotating platform 11, and the other end rotating against the rotating platform 11;Therefore, taking the rotating shaft of the rotating platform 11 as the center, the driving shaft 21 is divided into the same direction end 22 and the reverse end 23;This structure makes the same device can flexibly cope with different stages or different areas of processing task, improve the process flexibility.

[0036] When the polishing roller 2 is located at the same direction end 22 of the driving shaft 21, the rotating direction of the polishing roller 2 and the rotating platform 11 is the same, at this time, the relative speed between them is low, which is helpful to the friction force distribution of the contact area between the polishing roller 2 and the workpiece, avoiding local overheating or excessive wear, ensuring the surface finish and smoothness, suitable for the pretreatment or final polishing stage with high surface quality requirement.

[0037] When the polishing roller 2 is located at the reverse end 23 of the driving shaft 21, the rotating direction of the polishing roller 2 and the rotating platform 11 is opposite, in this state, the relative speed between them is large, which enhances the grinding effect, is beneficial to quickly remove the uneven layer or excess material on the surface. Improve the material removal rate per unit time;Shorten the rough machining time, improve the overall machining efficiency;More suitable for initial grinding or removing defect layer and other tasks;Can effectively deal with the substrate surface with large initial state difference.

[0038] Referring toFigure 2 Further introduced is a control strategy based on workpiece surface area division and linear speed dynamic matching. By dividing the workpiece surface into a “near region 12” and a “far region 13” and intelligently adjusting the rotation speed of the rotating platform 11 or the polishing roller 2 in combination with the moving path of the polishing roller 2, the problem of uneven processing caused by the difference in linear speed at different radius positions on the rotating platform is effectively solved, thereby realizing uniform processing of the entire surface of the workpiece. Specifically as follows:

[0039] With the rotating shaft of the rotating platform 11 as the reference, the workpiece surface is divided into a near region 12 and a far region 13; the near region 12 is the region close to the center of the rotating platform 11, which has a smaller radius and a lower linear speed; the far region 13 is the edge region far from the center of the rotating platform 11, which has a larger radius and a higher linear speed. Since the rotating platform 11 rotates at a constant angular speed (angle turned in a unit of time), the linear speed (v = ωr, where ω is the angular speed and r is the radius) of each point on it will increase with the increase of the radius.

[0040] When the polishing roller 2 moves from the near region 12 to the far region 13, if the rotation speeds of the rotating platform 11 and the polishing roller 2 remain unchanged, the relative linear speed of the contact area between the two will change: in the near region 12, the relative linear speed is low, the friction is weak, and it may result in low material removal rate; in the far region 13, the relative linear speed is high, the friction is enhanced, and it is easy to cause local overheating or excessive wear. Such differences will lead to inconsistent processing of the workpiece surface, affecting the uniformity of subsequent NAP layer coating or abrasive addition processes, and thus reducing the product quality of the final polishing pad. To solve the above problems, the embodiment proposes a dynamic speed control mechanism:

[0041] The current radius position of the polishing roller 2 is obtained by using a displacement sensor or an encoder; when the polishing roller 2 is in the near region 12, the rotation speed of the rotating platform 11 or the polishing roller 2 is appropriately increased to increase the relative linear speed and enhance the friction; when the polishing roller 2 moves to the far region 13, the rotation speed of the rotating platform 11 or the polishing roller 2 is appropriately reduced to reduce the relative linear speed and avoid excessive friction; the control target is to keep the relative linear speed of the contact point between the polishing roller 2 and the workpiece within a preset ideal range at all times. Therefore, due to the difference in linear speed at different radius positions on the rotating platform, at least one of the rotating platform 11 and the polishing roller 2 reduces the rotation speed to ensure that the relative linear speed of the polishing roller 2 acting on the near region 12 or the far region 13 of the workpiece remains consistent, thereby realizing uniform processing of the entire surface of the workpiece.

[0042] Referring to Figure 3, further optimize the polishing roller 2 on the drive shaft 21 installation and transmission mode, realize the polishing roller 2 along the drive shaft 21 axial free sliding, also ensure that it can still obtain stable power input under any position, so as to realize the continuous, uniform processing to the workpiece surface. As follows:

[0043] The drive shaft 21 is rotatably installed on the support frame 24, the support frame 24 is provided with a sliding member 25, the sliding member 25 is a component with guide rail or sliding block structure, the sliding direction of the sliding member 25 on the support frame 24 and the rotation axis of the drive shaft 21 are in the same vertical plane; the rotation of the sliding member 25 is connected with the polishing roller 2, the position of the polishing roller 2 on the drive shaft 21 is controlled by the sliding member 25; the polishing roller 2 is fixed on the sliding member 25 through bearing or other rotating connection structure, so that it can rotate around its axis; the polishing roller 2 and the drive shaft 21 are provided with transmission protrusions and transmission notches correspondingly, under the action of the transmission protrusions and the transmission notches, the polishing roller 2 can receive power from the drive shaft 21 and realize rotation no matter which position it is on the drive shaft 21.

[0044] Referring to Figure 5 , Figure 6 Further optimize the jig 3 structure for fixing the polishing pad workpiece, a composite jig 3 system of sliding type limiting + swing clamping linkage control is proposed. The system drives the limiting piece 31 to clamp the side wall of the workpiece through the linear moving part, and realizes the auxiliary fixation to the upper surface of the workpiece through the swing piece 32 when necessary, so as to ensure the stability of clamping while avoiding the interference of clamping structure to the running path of the polishing roller 2. As follows:

[0045] The jigs 3 are distributed in a ring shape on the rotating platform 11 with the rotating shaft of the rotating platform 11 as the center, and each of the jigs 3 is distributed in a radial shape with the rotating shaft of the rotating platform 11 as the center; the jigs 3 are all slidingly arranged on the rotating platform 11, and the sliding directions of the jigs 3 are all towards the rotating shaft of the rotating platform 11; through the sliding of the jigs 3 on the rotating platform 11, the rotating platform 11 can fix workpieces of polishing pads with different sizes. The jigs 3 include linear moving components and limit pieces 31, the limit pieces 31 are arranged on the moving ends of the linear moving components, the linear moving components can slide along the radial direction on the rotating platform 11, and drive the limit pieces 31 to move close to or away from the rotating shaft; multiple groups of jigs 3 can cooperatively clamp workpieces of polishing pads with different diameters; the limit pieces 31 act on the side walls of the workpieces, and the thickness of the limit pieces 31 is less than or equal to the thickness of the workpieces; so that the polishing roller 2 can avoid affecting the operation of the polishing roller 2 when processing the edge surface of the workpiece. When the thickness of the limit piece 31 is less than the thickness of the workpiece, the oscillating piece 32 has a clamping opening; when the oscillating piece 32 is in the clamping state, the upper surface of the workpiece is limited and fixed by the clamping opening.

[0046] The limiting piece 31 is swingably provided with a swing piece 32 on the side away from the rotating platform 11 rotating shaft, the swing piece 32 and the swing connection point of the limiting piece 31 are located above the upper surface of the limiting piece 31, so that the swing piece 32 can rotate in the vertical plane; the swing piece 32 can switch between the unemployed state and the clamping state; when the swing piece 32 is in the unemployed state, the swing piece 32 and the limiting piece 31 are horizontally placed on the rotating platform 11, avoiding affecting the operation of the polishing roller 2; when the swing piece 32 is in the clamping state, the swing piece 32 and the limiting piece 31 are vertically placed on the rotating platform 11, the swing piece 32 and the limiting piece 31 are attached and the swing piece 32 is above the limiting piece 31; in the transmission direction of the linear moving part, the length of the swing piece 32 is greater than the length of the limiting piece 31; so that the swing piece 32 can act on the upper surface of the workpiece and be fixed when switching to the clamping state. The opposite surfaces of the limiting piece 31 and the swing piece 32 are both provided with mounting grooves 33, and the first transmission rod 34 (limiting piece 31 side) and the second transmission rod 35 (swing piece 32 side) are respectively arranged in the mounting grooves 33 of the limiting piece 31 and the swing piece 32; the first transmission rod 34 is curvedly arranged, the curved part of the first transmission rod 34 is rotationally arranged on the limiting piece 31, one end of the first transmission rod 34 close to the swing piece 32 is rotationally connected with one end of the second transmission rod 35, and the other end of the first transmission rod 34 and the limiting piece 31 are provided with a telescopic cylinder 36, the telescopic cylinder 36, the limiting piece 31 and the first transmission rod 34 are all rotationally connected, ensuring that no jamming occurs during movement; the other end of the second transmission rod 35 is rotationally arranged on the swing piece 32; the first transmission rod 34 is pushed or pulled through telescopic action, driving the whole linkage mechanism to move; when the telescopic cylinder 36 retracts, the swing piece 32 is in the unemployed state; when the telescopic cylinder 36 extends, the swing piece 32 is in the clamping state.

[0047] When the polishing roller 2 performs surface treatment on the inner side of the workpiece, the swing piece 32 switches to the clamping state to additionally clamp and fix the workpiece; when the polishing roller 2 performs surface treatment on the outer side of the workpiece, the swing piece 32 switches to the unemployed state, avoiding affecting the operation of the polishing roller 2. Further explanation:

[0048] In the surface treatment process of the CMP polishing pad substrate, because the linear speed of each point on the rotating platform 11 changes with the radius, in order to ensure that the surface treatment effect of the whole workpiece is uniform, the embodiment can dynamically adjust the rotating speed according to the processing area to match the linear speed difference.

[0049] When the inner area (the near area 12) is processed, the control system identifies that the polishing roller 2 has entered the near area 12; the telescopic cylinder 36 is started, the swing piece 32 is switched to the clamping state; the clamping port presses the upper surface of the workpiece, and the clamping stability is enhanced; the rotating platform 11 or the polishing roller 2 rotating speed is simultaneously increased to compensate for the line speed drop; and the polishing roller 2 uniformly polishes the near area 12.

[0050] When the transition to the outer area (the far area 13) is processed, the polishing roller 2 slides outward along the driving shaft 21 to enter the far area 13; the rotating platform 11 or the polishing roller 2 rotating speed is automatically reduced to avoid excessive friction; the clamping function is closed, the telescopic cylinder 36 is retracted, and the swing piece 32 returns to the standby state; and the swing piece 32 completely avoids the path of the polishing roller 2 to improve the edge processing coverage;

[0051] Of course, the above is only a typical example of the present application, and in addition, the present application can have other various specific embodiments, and any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of the present application.

Claims

1. A surface treatment device for producing CMP polishing pads, characterized in that, The surface treatment equipment for CMP polishing pad production comprises a workbench, a rotating platform and a polishing roller arranged on the workbench. A jig is arranged on the rotating platform for fixing the workpiece of the polishing pad. The polishing roller is equipped with a driving shaft, the axis of the driving shaft intersects and is perpendicular to the rotating shaft of the rotating platform, and the polishing roller is slidingly arranged on the driving shaft. The overall processing of the surface of the workpiece on the rotating platform is realized by changing the position of the polishing roller on the driving shaft.

2. The surface treatment equipment for CMP polishing pad production according to claim 1, wherein: the driving shaft is divided into a same direction end and an opposite direction end with the rotating shaft of the rotating platform as the center; when the polishing roller is located at the same direction end of the driving shaft, the rotating directions of the polishing roller and the rotating platform are the same, which is helpful to the distribution of the friction force of the contact area between the polishing roller and the workpiece, avoids local overheating or excessive wear, and ensures the surface smoothness and flatness of the workpiece; when the polishing roller is located at the opposite direction end of the driving shaft, the rotating directions of the polishing roller and the rotating platform are opposite, which is helpful to quickly remove the surface material of the workpiece.

3. The surface treatment equipment for CMP polishing pad production according to claim 1, wherein: the surface of the workpiece is divided into a near area and a far area with the rotating shaft of the rotating platform as the reference; when the polishing roller moves from the near area to the far area, at least one of the rotating platform and the polishing roller reduces the rotating speed to ensure that the relative linear speed of the polishing roller acting on the near area or the far area of the workpiece remains consistent, thereby realizing uniform processing of the entire surface of the workpiece.

4. The surface treatment equipment for CMP polishing pad production according to claim 1, wherein: the driving shaft is rotatably installed on a support frame, a sliding member is arranged on the support frame, and the sliding direction of the sliding member on the support frame is in the same vertical plane as the rotating shaft of the driving shaft; the sliding member is rotatably connected to the polishing roller, and the position of the polishing roller on the driving shaft is controlled by the sliding member; the polishing roller and the driving shaft are correspondingly provided with a transmission protrusion and a transmission slot, and the polishing roller rotates at any position on the driving shaft under the action of the transmission protrusion and the transmission slot.

5. The surface treatment equipment for CMP polishing pad production according to any one of claims 1 to 4, wherein: the jigs are annularly distributed on the rotating platform with the rotating shaft of the rotating platform as the center; the jigs are slidingly arranged on the rotating platform, and the sliding directions of the jigs are all towards the rotating shaft of the rotating platform; the rotating platform can fix polishing pad workpieces of different sizes by sliding the jigs on the rotating platform.

6. The surface treatment equipment for CMP polishing pad production according to claim 5, wherein: the jig comprises a linear moving part and a limiting member, the limiting member is arranged on the moving end of the linear moving part, the limiting member acts on the side wall of the workpiece, and the thickness of the limiting member is less than or equal to the thickness of the workpiece. Make the polishing roller avoid the impact of the limiting piece on the operation of the polishing roller when processing the edge surface of the workpiece. 7.The surface treatment equipment for CMP polishing pad production of claim 6, characterized in that: The limiting piece is swingly provided with a swing piece on the side away from the rotating platform rotating shaft, and the swing piece and the swing connection point of the limiting piece are located above the upper surface of the limiting piece; The swing piece can switch between the standby state and the clamping state; when the swing piece is in the standby state, the swing piece and the limiting piece are horizontally placed on the rotating platform, avoiding the impact on the operation of the polishing roller; when the swing piece is in the clamping state, the swing piece and the limiting piece are vertically placed on the rotating platform, the swing piece and the limiting piece are in close contact and the swing piece is located above the limiting piece; In the transmission direction of the linear moving part, the length of the swing piece is greater than the length of the limiting piece; so that the swing piece can act on the upper surface of the workpiece and be fixed when switching to the clamping state. 8.The surface treatment equipment for CMP polishing pad production of claim 7, characterized in that: The opposite surfaces of the limiting piece and the swing piece are both provided with mounting grooves, and the first transmission rod and the second transmission rod are respectively arranged in the mounting grooves of the limiting piece and the swing piece; The first transmission rod is curvedly arranged, the curved part of the first transmission rod is rotationally arranged on the limiting piece, one end of the first transmission rod close to the swing piece is rotationally connected with one end of the second transmission rod, the other end of the first transmission rod and the limiting piece are arranged in a telescopic cylinder, the telescopic cylinder, the limiting piece and the first transmission rod are all rotationally connected, and the other end of the second transmission rod is rotationally arranged on the swing piece; When the telescopic cylinder is retracted, the swing piece is in the standby state; when the telescopic cylinder is extended, the swing piece is in the clamping state. 9.The surface treatment equipment for CMP polishing pad production of claim 7, characterized in that: When the thickness of the limiting piece is less than the thickness of the workpiece, the swing piece has a clamping opening; when the swing piece is in the clamping state, the upper surface of the workpiece is limited and fixed by the clamping opening. 10.The surface treatment equipment for CMP polishing pad production of claim 7, characterized in that: When the polishing roller processes the inner side of the workpiece, the swing piece switches to the clamping state to additionally clamp and fix the workpiece; When the polishing roller processes the outer side of the workpiece, the swing piece switches to the standby state to avoid the impact of the swing piece on the operation of the polishing roller.

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