Method for analyzing consumption of electroplating solution

Abstract

The application provides an electroplating solution consumption analysis method, and belongs to the technical field of metallurgy and process mineralogy. The method simulates actual working conditions by bending a base material, establishes a plating layer-electrolyte consumption model with strong universality, combines automatic testing to analyze plating layer geometric parameters, and evaluates electrolyte consumption. The method prepares a basic standardized sample, combines automatic testing to accurately measure the plating layer interface, and introduces a thickness correction factor (sin alpha n.i) and a dynamic area algorithm (S Fn =∑Ln.i*dn.i’+∑d(n‑1).i*dn.i*(1+sin(θi‑90)),significantly reduces the measurement error of the bending area, combines the coverage rate parameter and the electrolyte concentration change, and realizes high-precision prediction of the electroplating solution consumption of complex parts.

Description

Technical Field

[0001] This invention relates to the fields of metallurgy and process mineralogy, and in particular to a method for analyzing the consumption of electroplating solutions. Background Technology

[0002] Electroplating technology is widely used in electronics, automotive, aerospace and other fields. By depositing a metal coating on the surface of a substrate, it endows devices with properties such as corrosion resistance, conductivity, and aesthetics. However, for devices with complex geometries or that need to be bent, controlling the uniformity of the coating and the amount of electrolyte consumed during the electroplating process has always been a challenge for the industry.

[0003] Traditional methods for analyzing electroplating solution consumption are usually based on planar samples or ideal geometric models, which cannot accurately reflect the impact of complex shapes such as bends and curved surfaces on coating coverage and electrolyte consumption. This leads to problems such as uneven coating thickness, electrolyte waste, or insufficient process stability in actual production.

[0004] Currently, electroplating analysis of devices suffers from the following limitations: First, the quantification of the relationship between deformation and coating is insufficient. Changes in bending angle and substrate thickness significantly affect the uniformity of coating deposition, but existing methods lack modeling of the correlation between deformation parameters and coating thickness and coverage area, resulting in measurement errors as high as 20% to 40%. Second, there are biases in electrolyte consumption prediction. Traditional algorithms do not consider the coating superposition effect in bending areas and only calculate consumption through linear area, making them unsuitable for high curvature areas, leading to inaccurate electrolyte replenishment or wasted costs. Third, the sample representativeness is insufficient. Conventional test samples are mostly flat plates or simple bent parts, which cannot cover the diverse deformation states in actual production, resulting in low statistical significance.

[0005] In view of this, it is necessary to design an improved method for analyzing the consumption of electroplating solution in order to solve the above problems. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a method for analyzing electroplating solution consumption based on controllable deformation samples and a dynamic thickness compensation algorithm. This method involves preparing standardized basic samples, combining automated testing and analysis to accurately measure the plating interface, and introducing a thickness correction factor (sin αn.i) and a dynamic area algorithm (S...). Fn =∑Ln.i*dn.i'+∑d(n-1).i*dn.i*(1+sin(θi-90°)), significantly reducing the measurement error in the bending area. Combined with the coverage parameter and the change in electrolyte concentration, it enables high-precision prediction of the consumption of electroplating solution for complex parts.

[0007] To achieve the above objectives, the present invention provides a method for analyzing the consumption of electroplating solution, comprising the following steps:

[0008] A1, using the same material as the device to be electroplated, prepare several square plates, dry them, and obtain several samples a1;

[0009] A2, randomly select b pieces of sample a1, and denote them as a2;

[0010] Processing sample a2: After bending along the center of sample a1, sample a1 is placed in the sample preparation mold, and a curing agent is added to cure the sample, thus obtaining a sample that meets the requirements for scanning electron microscopy testing. The sample thickness H is then measured. The bending line of sample a1 extends in a direction parallel to the placement direction of the sample preparation mold. H is the actual thickness of the electroplated device when it is not bent.

[0011] A3, the total area of ​​the remaining sample a1, is denoted as S1;

[0012] A4, take m3 g of sample a1, and record it as a3; place sample a3 and the remaining sample a1 in the same electrolytic cell for electroplating; before electroplating, the initial concentration of the electroplating solution is w1 g / L, and after electroplating, the concentration of the electroplating solution is w2 g / L.

[0013] A5, after electroplating, sample a3 is crushed to obtain sample a4; sample a4 is prepared into an automated testing and analysis sample, denoted as sample a5;

[0014] A6. Automated testing and analysis were performed on sample a5. The specific testing and analysis are as follows:

[0015] A61, Measuring the plating edge length Ln.i of the electroplated device: The plating-substrate interface is identified through backscattered electron imaging, and the software automatically extracts the boundary length, taking the average of multiple values; where n is the particle number, i is the number of straight segments into which a particle is divided; ni refers to the i-th straight segment of the n-th measured device; Ln.i refers to the length of the i-th straight segment of the n-th measured device.

[0016] A62, measure the angle θi between the extended outer edges of the two coatings; θi refers to the angle between the i-th straight segment of the n-th measured device and the unplated part of the (i-1)-th or (i+1)-th straight segment of the adjacent device.

[0017] A63, Measure the coating thickness dn.i: Measure perpendicular to the substrate surface and take the average of at least 5 points; dn.i refers to the average coating thickness of the i-th straight segment of the n-th measured device;

[0018] A64, calculate the effective thickness dn.i', and measure the substrate thickness Hn.i;

[0019] Among them, dn.i'=dn.i*sin αn.i, sin αn.i=H / Hn.i;

[0020] αn.i is the angle between the material extension surface of the ith straight segment of the nth measured device and the measurement surface; Hn.i is the average thickness of the ith straight segment of the nth measured device;

[0021] A65, calculate the coverage area S of the coating. Fn ;

[0022] S Fn =∑Ln.i*dn.i'+∑d(n-1).i*dn.i*(1+sin(θi-90°));

[0023] A7, calculate the coating coverage K, K=0.5*∑Ln.i*dn.i' / ∑S Fn ;

[0024] A8, the total area of ​​the sample to be tested, denoted as S2, calculate the electrolyte consumption M.

[0025] M = K * S2 * (W2 - W1) / S1;

[0026] Calculate the average coating thickness D, D=∑Ln.i*dn.i' / ∑Ln.i.

[0027] Furthermore, in step A2, the sample thickness is averaged after testing multiple test points; during testing, the straight section is selected for measurement, and the bending position is not measured.

[0028] Furthermore, in step A1, the length of sample a1 ranges from 10 to 50 mm, and the thickness ranges from 1 to 5 mm.

[0029] Furthermore, in step A2, the value of b ranges from 1 to 100.

[0030] Furthermore, in step A2, the bending angle ranges from 45° to 135°.

[0031] Furthermore, in step A4, the concentration of the electroplating solution is determined by titration or spectroscopy.

[0032] Furthermore, the areas S1 and S2 are obtained by immersion testing, or by first measuring the surface area of ​​a single sample and then calculating the total area of ​​the sample based on its mass or quantity.

[0033] Furthermore, the value of θi ranges from 0 to 180°.

[0034] Furthermore, in step A5, for samples with a particle size greater than 3 mm, a two-stage crushing process is adopted; during the first crushing, liquid nitrogen is used for immersion for 20-50 seconds, and a jaw crusher is used for coarse crushing to reduce the sample particle size to below 3 mm; during the second crushing, deionized water at 2-10℃ is used for spraying, and a disc crusher is selected to crush the sample until the content of particles with a particle size of less than 1 mm is 60-80%.

[0035] Furthermore, in step A1, during the drying process, the drying temperature is 40-80℃ and the drying time is 30-60 min.

[0036] The beneficial effects of this invention are:

[0037] The method for analyzing electroplating solution consumption provided by this invention establishes a combined technology that integrates electrochemical deposition, material deformation control, and automated testing and analysis to quantitatively evaluate the relationship between electroplating solution consumption and substrate morphology.

[0038] This application simulates actual working conditions by bending the substrate to establish a universally applicable coating-electrolyte consumption model. Combined with automated testing and analysis of coating geometric parameters, it assesses electrolyte consumption. This method involves preparing standardized basic samples, accurately measuring the coating interface using automated testing and analysis, and introducing a thickness correction factor (sin αn.i) and a dynamic area algorithm (S...). Fn =∑Ln.i*dn.i'+∑d(n-1).i*dn.i*(1+sin(θi-90°)), significantly reducing the measurement error in the bending area. Combined with the coverage parameter and the change in electrolyte concentration, it enables high-precision prediction of the consumption of electroplating solution for complex parts. Attached Figure Description

[0039] Figure 1 S in this invention Fn Schematic diagram of the algorithm's geometric model.

[0040] Explanation of reference numerals in the attached figures:

[0041] θi refers to the angle between the i-th straight segment of the n-th measured device and the unplated part of the adjacent (i-1)-th or (i+1)-th straight segment;

[0042] d1.1 refers to the average thickness of the coating on the first straight section of the first measured device;

[0043] d1.2 refers to the average thickness of the coating on the second straight section of the first measured device;

[0044] H1.1 refers to the average thickness of the first straight segment of the first measured device;

[0045] H1.2 refers to the average thickness of the second straight section of the first measured device;

[0046] L1.1 refers to the length of the first straight segment of the first measured device;

[0047] L1.2 refers to the length of the second straight segment of the first measured device. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0049] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0050] Additionally, it should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0051] Please see Figure 1 As shown, the present invention provides a method for analyzing the consumption of electroplating solution, comprising the following steps:

[0052] A1, using the same material as the device to be electroplated, several square plates are prepared and dried at 40-80℃ for 30-60 min to obtain several samples a1; used to simulate the characteristics of the surface of the electroplated layer of the macroscopic sample.

[0053] The number of samples a1 is 50 to 1000 pieces to ensure the significance of subsequent measurement statistics.

[0054] The length of sample a1 ranges from 10 to 50 mm, and the thickness ranges from 1 to 5 mm. During preparation, it is ensured that there are no burrs on its edges.

[0055] A2, randomly select b pieces of sample a1, and denote them as a2;

[0056] Processing sample a2: After bending along the center of sample a1, sample a1 is placed in the sample preparation mold, and a curing agent is added to cure the sample, thus obtaining a sample that meets the requirements for scanning electron microscopy testing. The sample thickness H is then measured. The extension direction of the bending line of sample a1 is parallel to the placement direction of the sample preparation mold.

[0057] The value of b ranges from 1 to 100. The bending angle ranges from 45 to 135°.

[0058] The sample thickness is calculated by averaging the results from multiple test points. During testing, measurements are taken at straight locations, excluding bent areas. H represents the actual thickness of the electroplated component when it is not bent.

[0059] Curing sample preparation refers to: after the sample is placed in the sample preparation mold, epoxy resin is added, and after curing, the sample is taken out, ground, polished and carbon sprayed, and polished to 1um and below.

[0060] A3, the total area of ​​the remaining sample a1, is denoted as S1;

[0061] A4, take m3 g of sample a1, and record it as a3; place sample a3 and the remaining sample a1 in the same electrolytic cell for electroplating; before electroplating, the initial concentration of the electroplating solution is w1 g / L, and after electroplating, the concentration of the electroplating solution is w2 g / L.

[0062] The concentration of the electroplating solution is determined by titration or spectroscopy.

[0063] A5, after electroplating, sample a3 is crushed to obtain sample a4; sample a4 is prepared into an automated testing and analysis sample, denoted as sample a5;

[0064] The specific process for preparing the automated test and analysis sample is as follows: the broken sample is ultrasonically vibrated in epoxy resin for 20 minutes, cured and embedded, vertically cut, cured again with epoxy resin, polished to a mirror finish, and the sample is subjected to conductive treatment (such as carbon spray coating); polished to 0.1um and below.

[0065] For samples with a particle size greater than 3 mm, a two-stage crushing process was employed. In the first crushing stage, the sample was immersed in liquid nitrogen (-196℃) for 20–50 seconds and coarsely crushed using a jaw crusher to reduce the particle size to below 3 mm. In the second crushing stage, the sample was sprayed with deionized water at 2–10℃ and crushed using a disc crusher until the content of particles smaller than 1 mm was 60–80%. The sample was then washed with ethanol solution to remove particles smaller than 0.010 mm, and finally dried. The drying temperature was 30–60℃, and the drying time was 10–30 minutes.

[0066] A6, please refer to Figure 1 As shown, sample a5 was subjected to automated testing and analysis. The specific testing and analysis are as follows:

[0067] A61, Measuring the plating edge length Ln.i of the electroplated device: The plating-substrate interface is identified through backscattered electron imaging, and the software automatically extracts the boundary length, taking the average of multiple values; where n is the particle number, i is the number of straight segments into which a particle is divided; ni refers to the i-th straight segment of the n-th measured device; Ln.i refers to the length of the i-th straight segment of the n-th measured device.

[0068] A62, measure the angle θi between the extended outer edges of the two coatings. θi reflects the uniformity of coating coverage at the bend. θi refers to the angle between the i-th straight segment of the n-th measured device and the unplated part of the adjacent (i-1)-th or (i+1)-th straight segment. The value of θi ranges from 0 to 180°.

[0069] A63, Measure the coating thickness dn.i: Measure perpendicular to the substrate surface and take the average of at least 5 points; dn.i refers to the average coating thickness of the i-th straight segment of the n-th measured device;

[0070] A64, calculate the effective thickness dn.i', and measure the substrate thickness Hn.i;

[0071] Among them, dn.i'=dn.i*sin αn.i, sin αn.i=H / Hn.i;

[0072] αn.i is the angle between the material extension surface of the ith straight segment of the nth measured device and the measurement surface; αn.i = arcsin(H / Hn.i);

[0073] Hn.i is the average thickness of the ith straight segment of the nth measured device;

[0074] In this application, a thickness correction factor sin αn.i is introduced to solve the problem of normal thickness measurement deviation caused by deformation.

[0075] A65, calculate the coverage area S of the coating. Fn ;

[0076] S Fn =∑Ln.i*dn.i'+∑d(n-1).i*dn.i*(1+sin(θi-90°));

[0077] The first term is the linear coverage contribution, and the second term is the correction term for the superposition at the bend. The coating coverage formula includes a linear term and a bend superposition term. The sine correction factor of the included angle θi is used in high curvature regions, which significantly reduces the calculation error, especially for electroplated samples with complex shapes.

[0078] A7, calculate the coating coverage K, K=0.5*∑Ln.i*dn.i' / ∑S Fn ;

[0079] A8, the total area of ​​the sample to be tested, denoted as S2, calculate the electrolyte consumption M.

[0080] M = K * S2 * (W2 - W1) / S1;

[0081] Calculate the average coating thickness D, D=∑Ln.i*dn.i' / ∑Ln.i.

[0082] The areas S1 and S2 are obtained by immersion testing, or by first measuring the surface area of ​​a single sample and then calculating the total area of ​​the sample based on its mass or quantity.

[0083] It should be noted that the electrolyte consumption M here refers to the concentration. In practical applications, the corresponding dosage can be calculated based on the determined concentration and the volume of the actual device used.

[0084] The method for analyzing the consumption of electroplating solution provided by the present invention will be described below with reference to specific embodiments.

[0085] Example 1

[0086] This embodiment provides a method for analyzing the consumption of electroplating solution, specifically for analyzing the consumption of electroplating solution for a cubic 304 stainless steel casing device, which includes the following steps:

[0087] A1, using 304 stainless steel, 100 square plates were prepared. The length of each plate was equal to its width, which was 10.00 mm, and the thickness was 3.00 mm. During preparation, the edges were made free of burrs. Then, the plates were dried at 50°C for 40 minutes, resulting in 100 samples a1.

[0088] A2, randomly select 5 samples a1 and record them as a2;

[0089] The sample a2 is processed by bending it 90° along the center of one of the opposite edges of the sample a1 plate, placing the sample in the sample preparation mold, and adding a curing agent to cure the sample. The extension direction of the bending line of sample a1 is parallel to the placement direction of the sample preparation mold; that is, the extension direction of the bending line is perpendicular to the horizontal direction of the sample preparation mold.

[0090] Specifically, after the sample is placed in the sample preparation mold, epoxy resin is added. After curing, the sample is taken out and subjected to coarse grinding, fine grinding and polishing until it meets the requirements of scanning electron microscopy testing. The thickness H of the plate is then measured. Then H = (3.11 + 3.06 + 2.90 + ... + 2.98 + 3.12 + 2.91) / 15 = 3.01 μm.

[0091] A3, the total area of ​​the remaining sample a1 is measured and denoted as S1; its surface area is measured to be S1 = 304.4160 cm². 2 ;

[0092] A4, take 4.77 g of sample a1 (two pieces of sample a1), and mark it as a3; place sample a3 and the remaining sample a1 in the same electrolytic cell for electroplating.

[0093] The electroplating process parameters are as follows:

[0094] The amounts of electroplating chemicals added are as follows:

[0095] Nickel aminosulfonate (Ni(NH2SO3)2) mainly provides nickel, with an initial concentration of w1 g / L = 392.00 g / L; other buffers and activators added: boric acid (H3BO3) 35 g / L, nickel chloride (NiCl2·6H2O) 10 g / L, sodium dodecyl sulfate 0.3 g / L;

[0096] The process parameters are as follows:

[0097] pH value 4.0 (adjusted with sulfamic acid or nickel hydroxide), temperature 50°C; current density 5 A / dm³ 2 Mechanical or air agitation is used (to avoid loose coating) to continuously produce 1000Ah.

[0098] After electroplating was completed, the concentration of nickel aminosulfonate in the electroplating solution was measured and recorded, w2 = 320.45 g / L.

[0099] A5, the above-mentioned electroplated device sample a3 is crushed to obtain sample a4; then sample a4 is prepared into an automated testing and analysis sample to obtain sample a5.

[0100] The crushing process includes two crushing steps. The first crushing involves initial cooling: liquid nitrogen immersion (-196℃, 30s) using a jaw crusher (coarse crushing, reducing particle size to below 3 mm). The second crushing involves a second cooling: deionized water spraying (5℃) using a disc crusher to crush to below 0.1 mm with a content of over 80%. Then, the sample is shaken and washed to remove particles smaller than 0.010 mm, and dried at 50℃ for 20 minutes.

[0101] The preparation of the automated test and analysis sample is as follows: the broken sample is ultrasonically vibrated in epoxy resin for 20 minutes, cured and embedded, vertically cut, epoxy resin is added again for curing, polished to a mirror finish, and the sample is subjected to conductive treatment (such as carbon spray coating).

[0102] A6, please refer to Figure 1 As shown, an automated test analysis was performed on sample a5. Specific test analysis examples and calculations are as follows. Detailed test data are shown in Table 1 below. Only a portion of the data is listed in the table; ellipses (...) indicate data for other samples. All samples underwent the same test. Due to space limitations, only data from a portion of the samples are shown as examples.

[0103] Table 1

[0104]

[0105] A61, when the number of particles n=1, the coating-substrate interface is identified by backscattered electron imaging, and the coating edge length L1.1=15.20μm and L1.2=14.11μm of the electroplated device are measured. L1.1 refers to the length of the first straight segment of the first measured particle.

[0106] A62, measure the angle θ = 45° between the extensions of the two outer edges of the coating.

[0107] A63, measure the coating thickness, specifically by measuring perpendicular to the substrate surface and taking the average of 6 points.

[0108] d1.1=(4.00+4.53+……+4.80) / 6=4.12μm,

[0109] d1.2=(4.11+4.24+……+4.15) / 6=4.06μm,

[0110] Measure the substrate thickness:

[0111] H1.1=(2.99+3.21+……+3.45) / 10=3.12μm,

[0112] H1.2=(3.02+3.15+……+3.23) / 10=3.27μm;

[0113] A64, Calculate the effective thickness

[0114] d1.1'=dn*sin αni=4.12*0.9647=3.9746μm,

[0115] Among them, sin αn.i=H / Hn.i=3.01 / 3.12=0.9647;

[0116] A65, calculate the coverage area S of this particle. Fn ;

[0117] S Fn =∑Ln.i*dn.i'+∑d(n-1).i*dn.i*(1+sin(θi-90))

[0118] =15.20*3.9746+14.11*3.7372+3.9746*3.7372*(1+sin(-45°))=117.50μm 2

[0119] A7, calculate the coating coverage K.

[0120] K=0.5*∑Ln.i*dn.i' / ∑S Fn =

[0121] 0.5 * (15.20 * 3.9746 + 14.11 * 3.7372 + ...) / (117.50 + ...)

[0122] =0.5 * 96.82% = 48.41%.

[0123] A7, the total area S2 of the stainless steel component under test, S2 = 15316.7638 cm². 2 ,

[0124] Calculate the electrolyte consumption M, then

[0125] M = K * S2 * (W2 - W1) / S1

[0126] =48.41%*15316.7638*(392-320.45) / 304.4160=1742.79 g / L;

[0127] Calculate the average coating thickness D.

[0128] D = ∑Ln.i*dn.i' / ∑Ln.i

[0129] = (3.9746*15.20+3.7372*14.11+……4.4579*8.66) / (15.20+14.11+……+8.66)=4.1022μm.

[0130] In summary, the electroplating solution consumption analysis method provided in this application can accurately assess electrolyte consumption and achieve high-precision prediction of electroplating solution consumption for complex parts.

[0131] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for analyzing the consumption of electroplating solution, characterized in that, Includes the following steps: A1, using the same material as the device to be electroplated, prepare several square plates, dry them, and obtain several samples a1; A2, randomly select b pieces of sample a1, and denote them as a2; Processing sample a2: After bending along the center of sample a1, sample a1 is placed in the sample preparation mold, and a curing agent is added to cure the sample, thus obtaining a sample that meets the requirements for scanning electron microscopy testing. The sample thickness H is then measured. The bending line of sample a1 extends in a direction parallel to the placement direction of the sample preparation mold. H is the actual thickness of the electroplated device when it is not bent. A3, the total area of ​​the remaining sample a1, is denoted as S1; A4, take m3 g of sample a1, and record it as a3; place sample a3 and the remaining sample a1 in the same electrolytic cell for electroplating; before electroplating, the initial concentration of the electroplating solution is w1 g / L, and after electroplating, the concentration of the electroplating solution is w2 g / L. A5, after electroplating, sample a3 is crushed to obtain sample a4; sample a4 is prepared into an automated testing and analysis sample, denoted as sample a5; A6. Automated testing and analysis were performed on sample a5. The specific testing and analysis are as follows: A61, Measuring the plating edge length Ln.i of the electroplated device: The plating-substrate interface is identified through backscattered electron imaging, and the software automatically extracts the boundary length, taking the average of multiple values; where n is the particle number, i is the number of straight segments into which a particle is divided; ni refers to the i-th straight segment of the n-th measured device; Ln.i refers to the length of the i-th straight segment of the n-th measured device. A62, measure the angle θi between the extended outer edges of the two coatings; θi refers to the angle between the i-th straight segment of the n-th measured device and the unplated part of the (i-1)-th or (i+1)-th straight segment of the adjacent device. A63, Measure the coating thickness dn.i: Measure perpendicular to the substrate surface and take the average of at least 5 points; dn.i refers to the average coating thickness of the i-th straight segment of the n-th measured device; A64, calculate the effective thickness dn.i', and measure the substrate thickness Hn.i; Among them, dn.i'=dn.i*sin αn.i, sin αn.i=H / Hn.i; αn.i is the angle between the material extension surface of the ith straight segment of the nth measured device and the measurement surface; Hn.i is the average thickness of the ith straight segment of the nth measured device; A65, calculate the coverage area S of the coating. Fn ; S Fn =∑Ln.i*dn.i’+∑d(n-1).i*dn.i*(1+sin(θi-90°)); A7, calculate the coating coverage K, K=0.5*∑Ln.i*dn.i' / ∑S Fn ; A8, the total area of ​​the sample to be tested, denoted as S2, calculate the electrolyte consumption M. M = K * S2 * (W2 - W1) / S1; Calculate the average coating thickness D, D=∑Ln.i*dn.i' / ∑Ln.i.

2. The method for analyzing electroplating solution consumption according to claim 1, characterized in that: In step A2, the sample thickness is averaged after testing multiple test points; during testing, the straight section is selected for measurement, and the bending position is not measured.

3. The method for analyzing electroplating solution consumption according to claim 1, characterized in that: In step A1, the length of sample a1 ranges from 10 to 50 mm, and the thickness ranges from 1 to 5 mm.

4. The method for analyzing the consumption of electroplating solution according to claim 1, characterized in that: In step A2, the value of b ranges from 1 to 100.

5. The method for analyzing electroplating solution consumption according to claim 1, characterized in that: In step A2, the bending angle ranges from 45° to 135°.

6. The method for analyzing the consumption of electroplating solution according to claim 1, characterized in that: In step A4, the concentration of the electroplating solution is determined by titration or spectroscopy.

7. The method for analyzing electroplating solution consumption according to claim 1, characterized in that: The areas S1 and S2 are obtained by immersion testing, or by first measuring the surface area of ​​a single sample and then calculating the total area of ​​the sample based on its mass or quantity.

8. The method for analyzing the consumption of electroplating solution according to claim 1, characterized in that: The value of θi ranges from 0 to 180°.

9. The method for analyzing the consumption of electroplating solution according to claim 1, characterized in that: In step A5, during the crushing process, for samples with a particle size greater than 3 mm, a two-stage crushing process is adopted. In the first crushing, liquid nitrogen is used for immersion for 20-50 seconds, and a jaw crusher is used for coarse crushing to reduce the sample particle size to below 3 mm. In the second crushing, deionized water at 2-10℃ is sprayed, and a disc crusher is used to crush the sample until the content of particles with a particle size of less than 1 mm is 60-80%.

10. The method for analyzing the consumption of electroplating solution according to claim 1, characterized in that: In step A1, the drying temperature is 40-80℃ and the drying time is 30-60 min.

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