Miniaturized iridescent light-emitting element and method for manufacturing the same

Abstract

The present application relates to the technical field of LED packaging, in particular to a miniaturized color-changing light-emitting element and a preparation method thereof, comprising at least the following steps: preparing a semi-cured adhesive film; fixedly bonding a chip to a substrate to obtain a chip substrate; vacuum pressing the semi-cured adhesive film and the chip substrate and curing and forming, and cutting to obtain the miniaturized color-changing light-emitting element; the chip at least comprises a flip-chip LED; the raw materials for preparing the semi-cured adhesive film at least comprise silica gel or epoxy resin, the refractive index of the silica gel or the epoxy resin is 1.4-1.6, and through a chip-level packaging process, the provided product is miniaturized, the light efficiency is increased, and the application requirements of high-end electronic display screens, automobile lighting, smartphone backlights, ultra-thin electronic devices and other fields with high requirements for space, heat dissipation, optical performance and control accuracy are met.

Description

Technical Field

[0001] This invention relates to the field of LED packaging technology, specifically to a miniaturized iridescent light-emitting element and its preparation method. Background Technology

[0002] Typically, RGB LED (red, green, and blue light-emitting diode) chips are used to achieve color changes. Traditional RGB LEDs usually use a bracket package, where the red, green, and blue LED chips are packaged in different positions on the bracket. The chips are then connected to external circuits via gold wires or other connection methods. The electrodes are generally divided into two types: common anode and common cathode. If dimming and color adjustment are required, the traditional LED package is relatively large and has low luminous efficiency, which limits some small application areas.

[0003] Existing RGB light-emitting elements have the following problems: their overall size is relatively large, due to their bracket packaging and gold wire connection structures, which limits their application in space-constrained scenarios; due to the influence of the bracket and packaging materials, light may experience more scattering and absorption during propagation, resulting in relatively low luminous efficiency, and the light intensity distribution at different angles may not be uniform; they generally use relatively traditional control methods, such as adjusting the current through external resistors to control the brightness and color of the LEDs, which has relatively low control precision, and may require more external circuit support to achieve complex dynamic effects. Summary of the Invention

[0004] To address the problems of traditional LED packaging, this invention provides an integrated RGB LED miniaturized light-emitting element. Through chip-level packaging technology, the provided product can reduce its size and increase its luminous efficiency while meeting the miniaturization manufacturing feasibility of the terminal module market. This satisfies the application needs of high-end electronic displays, automotive lighting, smartphone backlights, ultra-thin electronic devices and other fields with high requirements for space, heat dissipation, optical performance and control precision.

[0005] This invention provides a fabrication process for a miniaturized iridescent light-emitting element, comprising at least the following steps: preparing a semi-cured adhesive film; bonding a chip to a substrate to obtain a chip substrate; vacuum pressing and curing the semi-cured adhesive film and the chip substrate to form a miniaturized iridescent light-emitting element; wherein the chip includes at least a flip-chip LED chip; and the raw material for preparing the semi-cured adhesive film includes at least silicone or epoxy resin, wherein the refractive index of the silicone or epoxy resin is 1.4-1.6.

[0006] Traditional LED chips use upright chips, requiring a lead frame, gold wire, and encapsulating adhesive. The chip needs to be die-bonded within the lead frame, followed by gold wire bonding and encapsulating adhesive application to create the LED chip. This process has limitations in terms of economics and production efficiency. This invention uses flip-chip technology combined with a pre-cured film. The LED chip is fabricated simply by pressing the pre-cured film onto the chip, significantly simplifying the manufacturing process. It eliminates the need for a lead frame and gold wire, saving costs while increasing production efficiency, making it easier to achieve large-scale industrial production and widespread application. Specifically, this invention optimizes the pre-cured film by using silicone or epoxy resin with a refractive index of 1.4-1.6, effectively balancing the product's optical, mechanical, and aging properties to meet the requirements of subsequent surface mount technology (SMT) processes. This prevents deformation or displacement during SMT assembly due to the inability to withstand high temperatures and mechanical stress, which could affect the reliability of the package.

[0007] In one embodiment, the silicone comprises at least phenyl silicone resin and phenyl hydrogenated polysiloxane.

[0008] In one embodiment, the mass ratio of the phenyl silicone resin to the phenyl hydrogenated polysiloxane is (0.5-2):10.

[0009] In one embodiment, the mass ratio of the phenyl silicone resin to the phenyl hydrogenated polysiloxane is 1:10.

[0010] In one embodiment, the silicone material is of the Huigu PS7098 type.

[0011] In one embodiment, the raw materials for preparing the semi-cured adhesive film also include diffusion powder.

[0012] In one embodiment, the mass ratio of the silicone or epoxy resin to the diffusion powder is (4-6):1.

[0013] In one embodiment, the diffusion powder is selected from at least one of silica diffusion powder, glass microsphere diffusion powder, organic polymer diffusion powder, or inorganic metal oxide diffusion powder.

[0014] In one embodiment, the diffuser powder has an average particle size of 2-3 μm and a refractive index of 1.4-1.5.

[0015] In one embodiment, the silica diffusion powder is Shin-Etsu KMP590 from Japan.

[0016] In one embodiment, the method for preparing the semi-cured adhesive film includes the following steps: mixing the raw materials of the semi-cured adhesive film, coating to obtain an adhesive film, and baking the adhesive film to obtain a semi-cured adhesive film.

[0017] In one embodiment, the thickness of the adhesive film is 80-150 μm.

[0018] In one embodiment, the thickness of the adhesive film is 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, or 150μm.

[0019] In one embodiment, the baking temperature is 90-100°C and the baking time is 2-3 minutes.

[0020] In one embodiment, the chip is bonded to the substrate by bonding.

[0021] In one embodiment, the chip has a specification of (5-8) mil × (15-25) mil.

[0022] In one embodiment, the chip has a size of 6mil × 20mil and is sourced from Sanan Optoelectronics Co., Ltd.

[0023] In one embodiment, the flip-chip includes a green flip-chip, a red flip-chip, and a blue flip-chip.

[0024] In one embodiment, the green flip-chip has an emission wavelength of 520-525nm, the red flip-chip has an emission wavelength of 618-625nm, and the blue flip-chip has an emission wavelength of 445-460nm.

[0025] In one embodiment, the flip-chip LEDs are arranged on the substrate at a fixed spacing.

[0026] In one embodiment, the spacing of the fixed-space arrangement is 10μm-10cm.

[0027] In one embodiment, the spacing of the fixed-space arrangement is 100±10μm.

[0028] In one embodiment, the substrate is a high-precision Mark (reference) board, and the marking position accuracy of the high-precision Mark board is ≤2μm.

[0029] In one embodiment, the spacing accuracy of the fixed-space arrangement is 0.01 mm.

[0030] This invention employs multi-chip arrangement technology in conjunction with a high-precision Mark board for chip arrangement, reducing the chip spacing of SMT micro-devices to 0.05-0.1mm with an accuracy of 0.01mm. This represents a significant improvement in accuracy compared to traditional SMT chip spacing greater than 0.3mm and an accuracy of 0.1mm.

[0031] In one embodiment, the chip further includes a drive control chip.

[0032] In one embodiment, the vacuum pressing temperature is 120-150°C, the time is 5-10 min, and the pressure is 5-10 kg.

[0033] In one embodiment, the vacuum pressing temperature is 130°C, the time is 6 minutes, and the pressure is 6.4 kg.

[0034] In one embodiment, the curing temperature is 150-160°C and the time is 3-4 hours.

[0035] In one embodiment, the vacuum pressing uses a gasket with a thickness of 80-150 μm, and the vacuum pressing thickness accuracy is ±2 μm.

[0036] In one embodiment, the gasket is a flow channel gasket.

[0037] This invention involves attaching a semi-cured adhesive film to a chip substrate, surrounding it with pads, and molding it using vacuum pressing. The thickness of the semi-cured adhesive film on the chip can be designed to be 0-0.1mm as needed. When RGB is used independently (with a semi-cured adhesive film thickness of 0), there is no obstruction above, allowing the light extraction rate to reach 100%. When used for mixed light, by controlling the thickness and introducing diffuser powder, especially silica diffuser powder with an average particle size of 2-3μm and a refractive index of 1.4-1.5, the light scattering performance is improved, making the RGB light mix uniform, ensuring color uniformity, and guaranteeing the maximum light extraction rate.

[0038] Another aspect of the present invention provides a miniaturized iridescent light-emitting element, comprising at least a semi-cured adhesive film, a chip, and a substrate, wherein the chip is fixed on the substrate and the semi-cured adhesive film covers the surface of the chip.

[0039] In one embodiment, the chip volume ratio of the miniaturized iridescent light-emitting element is >80%.

[0040] The miniaturized iridescent light-emitting element provided by this invention supports a variety of advanced control methods, including built-in IC control. It can achieve synchronous or independent rhythmic change effects at the level of a single element, and can achieve precise color, brightness and light effect control through programming, giving it greater advantages in fields such as smart lighting and displays.

[0041] The miniaturized RGB light-emitting element provided by this invention includes one or more flip-chip LEDs and / or a driver control chip, which can realize the individual and simultaneous control of blue, red and green light under different currents, achieving more than 16.77 million color combinations and having a wide range of applications.

[0042] The miniaturized iridescent light-emitting element provided by this invention reduces light loss during light propagation, improves light output efficiency, and can achieve higher brightness and better color uniformity.

[0043] Beneficial effects

[0044] 1. This invention provides an integrated RGB LED miniaturized light-emitting element. Through chip-level packaging technology, the provided product can reduce its size and increase its luminous efficiency while meeting the feasibility of miniaturized manufacturing in the terminal module market. This meets the application needs of high-end electronic displays, automotive lighting, smartphone backlights, ultra-thin electronic devices and other fields with high requirements for space, heat dissipation, optical performance and control precision.

[0045] 2. This invention uses flip-chip technology in conjunction with a semi-cured adhesive film. The LED bead can be prepared simply by pressing the semi-cured adhesive film onto the chip, which greatly simplifies the production process, eliminates the need for brackets and gold wires, saves costs, improves production efficiency, and makes it easier to achieve large-scale industrial production and widespread application.

[0046] 3. The miniaturized iridescent light-emitting element provided by this invention supports a variety of advanced control methods, including built-in IC control, and can achieve synchronous or independent rhythmic change effects at the level of a single element. It can achieve precise color, brightness and light effect control through programming, and has greater advantages in fields such as smart lighting and displays.

[0047] 4. The miniaturized RGB light-emitting element provided by the present invention includes one or more flip-chip LEDs and / or driving control chips, which can realize the individual and simultaneous control of blue light, red light and green light under different currents, realize more than 16.77 million color combinations, and have a wide range of applications.

[0048] 5. The miniaturized iridescent light-emitting element provided by this invention reduces light loss during light propagation, improves light output efficiency, and can achieve higher brightness and better color uniformity. Attached Figure Description

[0049] Figure 1 This is a physical image of the chip substrate in Example 1.

[0050] Figure 2 This is a physical image of the miniaturized iridescent light-emitting element provided in Example 1. The left side of the image shows the resin surface of the product, and the right side shows the electrode surface of the product.

[0051] Figure 3 The image shows a physical picture of the LED lamp beads provided for Comparative Example 1.

[0052] Figure 4 The image shows a physical picture of the LED beads provided for Comparative Example 2.

[0053] Figure 5 The image shows a physical picture of the LED lamp beads provided for Comparative Example 3.

[0054] Figure 6 The image shows a physical picture of the LED lamp beads provided for Comparative Example 4.

[0055] Figure 7 The image shows a physical picture of the LED lamp beads provided for Comparative Example 5.

[0056] Figure 8 The spectrum of the miniaturized iridescent light-emitting element provided in Example 1 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0057] Figure 9 The spectrum of the miniaturized iridescent light-emitting element provided in Example 2 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0058] Figure 10 The spectrum of the miniaturized iridescent light-emitting element provided in Example 3 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0059] Figure 11 The spectrum of the LED light bead provided for Comparative Example 1 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0060] Figure 12 The spectrum of the LED beads provided in Comparative Example 2 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0061] Figure 13 The spectrum of the LED beads provided in Comparative Example 3 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0062] Figure 14 The spectrum of the LED light bead provided in Comparative Example 4 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0063] Figure 15 The spectrum of the LED light bead provided in Comparative Example 5 is shown in the figure. The curves in the figure correspond to blue light, green light and red light from left to right, respectively.

[0064] Figure 16 The image shows the test results of the emission angle of the miniaturized iridescent light-emitting element provided in Example 1.

[0065] Figure 17 The image shows the test results of the LED light-emitting angle provided for Comparative Example 1.

[0066] Figure 18 This is a reference diagram for the spacing accuracy of a fixed-space arrangement.

[0067] Figure 19 The image shows the observation results of the uniformity of light emission from the miniaturized iridescent light-emitting element.

[0068] Figure 20 The image shows the color coordinate test results of a miniaturized iridescent light-emitting element.

[0069] Figure 21 This is a graph comparing the accuracy capabilities of Example 1 and Comparative Example 6. In the graph, before: Comparative Example 6; after: Example 1. Detailed Implementation

[0070] Example 1

[0071] Embodiment 1 of the present invention provides a fabrication process for a miniaturized iridescent light-emitting element, comprising the following steps: preparing a semi-cured adhesive film; bonding a chip onto a substrate to obtain a chip substrate; vacuum pressing and curing the semi-cured adhesive film and the chip substrate to form a miniaturized iridescent light-emitting element after cutting; the chip includes a flip-chip LED chip; the raw materials for preparing the semi-cured adhesive film include silicone and diffusion powder, wherein the mass ratio of silicone to diffusion powder is 5:1.

[0072] The silicone includes phenyl silicone resin and phenyl hydrogenated polysiloxane, model number Huigu PS7098.

[0073] The diffusion powder is a silica diffusion powder, and the model of the silica diffusion powder is Shin-Etsu KMP590 from Japan.

[0074] The method for preparing the semi-cured adhesive film includes the following steps: mixing phenyl silicone resin and phenyl hydrogenated polysiloxane at a mass ratio of 1:10 to obtain silicone; mixing 10g of silicone with 2g of silica diffusion powder using a high-speed mixer; coating the mixture to obtain an adhesive film; and baking the adhesive film to obtain a semi-cured adhesive film.

[0075] The thickness of the adhesive film is 100 μm.

[0076] The baking temperature is 100℃ and the time is 2 minutes.

[0077] The chip is bonded to the substrate by bonding, specifically using high-temperature resistant double-sided adhesive (KHJ-DTH778A-B).

[0078] The chip has a size of 6mil×20mil and is sourced from Sanan Optoelectronics Co., Ltd.

[0079] The flip-chip includes green flip-chip, red flip-chip, and blue flip-chip.

[0080] The green flip-chip LED emits light at a wavelength of 520-525nm, the red flip-chip LED emits light at a wavelength of 618-625nm, and the blue flip-chip LED emits light at a wavelength of 445-460nm.

[0081] See Figure 1 The flip-chip LEDs are arranged on the substrate in a fixed-gap arrangement with a spacing of 100±10μm.

[0082] See Figure 18 The spacing accuracy of the fixed-space arrangement is 0.01mm.

[0083] The substrate is a high-precision Mark board, and the marking position accuracy of the high-precision Mark board is 2μm.

[0084] The vacuum pressing temperature was 130℃, the time was 6 minutes, the pressure was 6.4 kg, and the vacuum degree was 100 kPa.

[0085] The curing temperature is 150℃ and the time is 4 hours.

[0086] The vacuum pressing uses a 100μm thick gasket, and the vacuum pressing thickness accuracy is ±2μm. The gasket is a flow channel gasket.

[0087] Another aspect of Embodiment 1 of the present invention provides a miniaturized iridescent light-emitting element, comprising a semi-cured adhesive film, a chip, and a substrate, wherein the chip is fixed on the substrate and the semi-cured adhesive film covers the surface of the chip.

[0088] See Figure 2 The miniaturized iridescent light-emitting element has product dimensions (length × width × thickness) of 0.85 mm × 0.7 mm × 0.15 mm and is used as a backlight for mobile phones or laptops.

[0089] Example 2

[0090] Embodiment 2 of the present invention provides a miniaturized iridescent light-emitting element and its preparation method. The specific implementation method is the same as that of Embodiment 1, except that the raw material for preparing the semi-cured adhesive film is only silicone. The product size (length × width × thickness) of the miniaturized iridescent light-emitting element is 0.8mm × 0.7mm × 0.1mm, and it is used as a backlight for mobile phones or laptops.

[0091] Example 3

[0092] Embodiment 3 of the present invention provides a miniaturized iridescent light-emitting element and its preparation method. The specific implementation method is the same as that of Embodiment 1, except that the raw material for preparing the semi-cured adhesive film is only silicone, the chip includes a flip-chip LED chip and a driver chip, and the product size (length × width × thickness) of the miniaturized iridescent light-emitting element is 0.8mm × 0.7mm × 0.1mm, which is used as a backlight for mobile phones or laptops.

[0093] Comparative Example 1

[0094] See Figure 3 Comparative Example 1 of the present invention provides an LED bead, which is prepared using a traditional process, including the following steps: bonding an RGB chip to a bracket; connecting the positive and negative electrodes of the RGB chip to the positive and negative electrodes of the bracket using gold wire; mixing phenyl silicone resin and phenyl hydrogenated polysiloxane at a mass ratio of 1:10 to obtain silicone (Huigu 9062), and applying 0.01g to the bracket by dispensing; curing at 150°C for 4 hours; and forming a single LED bead by lowering the bracket and bending the corner. The product dimensions are (length × width × thickness) 5mm × 5mm × 1mm, and it is used in consumer electronics, landscape lighting, and stage lighting.

[0095] Comparative Example 2

[0096] See Figure 4 Comparative Example 2 of the present invention provides an LED bead, which is manufactured using a traditional process, including the following steps: die bonding an RGB chip and a driver chip in a bracket; connecting the positive and negative electrodes of the RGB chip to the positive and negative electrodes of the bracket using gold wire; mixing phenyl silicone resin and phenyl hydrogenated polysiloxane at a mass ratio of 1:10 to obtain silicone (Huigu 9062), injecting it into a molding die by molding, curing it at 150°C for 4 hours, and then removing the bracket (before the bracket, many independent components are connected together by the bracket, and the bracket is cut into individual pieces by the mold) to form a single LED bead. The product dimensions (length × width × thickness) are 1.06mm × 1.8mm × 0.8mm, and it is used in consumer electronics, landscape lighting, and stage lighting.

[0097] Comparative Example 3

[0098] See Figure 5 Comparative Example 3 of the present invention provides an LED lamp bead, which is manufactured using a conventional process, including the following steps: bonding an RGB chip to a bracket; connecting the positive and negative electrodes of the RGB chip to the positive and negative electrodes of the bracket using gold wire; injecting colorless transparent epoxy (Tecore TC8000) into a molding die by molding, curing at 150°C for 4 hours, and then forming a single LED lamp bead by lowering the bracket. The product size is 10mm in length and 5mm in diameter, and it is used for urban night scenes, commercial venues, and home decorative lighting.

[0099] Comparative Example 4

[0100] See Figure 6 Comparative Example 4 of this invention provides an LED light bead, manufactured using a traditional process, including the following steps: RGBW chips are die-bonded in a COB (Chip-on-Board); the positive and negative terminals of the RGB chip are connected to the positive and negative terminals of the COB using gold wire; a ring of white wall adhesive (Dow Corning OE-3100) is applied by dispensing to form a dam, and then colorless transparent low-reflection silicone (Dow Corning-6370M) is applied by dispensing to cover the chip. After curing at 150°C for 4 hours, a lower support is formed to create a single LED COB light bead. The product dimensions (length × width × thickness) are 40 mm × 40 mm × 2.0 mm, and it is suitable for indoor lighting, outdoor lighting, landscape lighting, and home decorative lighting.

[0101] Comparative Example 5

[0102] See Figure 6 Comparative Example 5 of the present invention provides an LED lamp bead, which is manufactured using a conventional process, including the following steps: bonding an RGBW chip to a bracket; connecting the positive and negative terminals of the RGB chip to the positive and negative terminals of the bracket using gold wire; attaching a hollow silicone lens cap to the bracket using a device; injecting colorless transparent epoxy resin (Tecore TC8000) into the bracket and silicone cap using a dispensing device; curing at 150°C for 4 hours; and then removing the bracket to form a single LED lamp bead. The product dimensions (length × width × thickness) are 14.5 mm × 5.8 mm × 5.0 mm, and it is used for indoor lighting, outdoor lighting, landscape lighting, and home decoration lighting.

[0103] Comparative Example 6

[0104] Comparative Example 6 of the present invention provides a miniaturized iridescent light-emitting element and its preparation method. The specific implementation method is the same as that of Example 1, except that the substrate is replaced with a glass plate without Mark points.

[0105] Performance testing

[0106] 1. The chip volume ratio of the products provided in the examples and comparative examples was tested. Chip volume ratio = chip volume / total device volume * 100%. The test results are shown in Table 1.

[0107] 2. Spectroscopic tests (distant integrating sphere test) were performed on the products provided in the examples and comparative examples. The test results are shown in [reference needed]. Figure 8-15 .

[0108] 3. The emission angles of the products provided in the examples and comparative examples were tested (far-field optical testing). The test results are shown in Table 1, and the emission angle test results of Example 1 and Comparative Example 1 are shown in the figure. Figure 16 ,17 .

[0109] Table 1

[0110]

[0111] Analysis of the data in Table 1 shows that the miniaturized iridescent light-emitting elements provided in Examples 1-3 have a higher chip volume ratio compared to the products provided in Comparative Examples 1-5.

[0112] 4. The uniformity of light emission and color coordinates of the miniaturized iridescent light-emitting element provided in Example 1 were observed and tested. The results are shown in [reference]. Figure 19 , Figure 20 As can be seen from the analysis figure, the miniaturized iridescent light-emitting element prepared by the present invention has good light emission uniformity and the color coordinates are controlled within the range of ±0.010.

[0113] 5. Comparing the precision capabilities of the miniaturized iridescent light-emitting elements provided in Example 1 and Comparative Example 6, the results are shown in [reference needed]. Figure 21 .

Claims

1. A method for fabricating a miniaturized iridescent light-emitting element, characterized in that, Includes the following steps: A semi-cured adhesive film is prepared; a chip is die-bonded onto a substrate to obtain a chip substrate; the semi-cured adhesive film and the chip substrate are vacuum pressed and cured to form a miniaturized iridescent light-emitting element after cutting; the chip includes a flip-chip LED chip; the raw materials for preparing the semi-cured adhesive film include silicone and diffusion powder, and the mass ratio of silicone to diffusion powder is 5:1; The silicone includes phenyl silicone resin and phenyl hydrogenated polysiloxane, model number Huigu PS7098; The diffusion powder is silica diffusion powder, and the model of the silica diffusion powder is Shin-Etsu KMP590 from Japan; The method for preparing the semi-cured adhesive film includes the following steps: mixing phenyl silicone resin and phenyl hydrogenated polysiloxane at a mass ratio of 1:10 to obtain silicone; taking 10g of silicone and 2g of silica diffusion powder respectively and mixing them through a high-speed mixer; coating to obtain an adhesive film; and baking the adhesive film to obtain a semi-cured adhesive film. The thickness of the adhesive film is 100 μm; The baking temperature is 100℃ and the time is 2 minutes; The chip is bonded to the substrate by bonding, specifically using high-temperature resistant double-sided adhesive. The chip has a specification of 6mil × 20mil; The flip-chip includes green flip-chip, red flip-chip, and blue flip-chip; The green flip-chip LED has an emission wavelength of 520-525nm, the red flip-chip LED has an emission wavelength of 618-625nm, and the blue flip-chip LED has an emission wavelength of 445-460nm. The flip-chip LEDs are arranged on the substrate in a fixed-gap arrangement, with a spacing of 100±10μm. The spacing accuracy of the fixed-space arrangement is 0.01mm; The substrate is a high-precision Mark board, and the marking position accuracy of the high-precision Mark board is 2μm; The vacuum pressing temperature was 130℃, the time was 6 minutes, the pressure was 6.4 kg, and the vacuum degree was 100 kPa. The curing temperature is 150℃ and the time is 4 hours; The vacuum pressing uses a 100μm thick gasket, and the vacuum pressing thickness accuracy is ±2μm. The gasket is a flow channel gasket. The miniaturized iridescent light-emitting element includes a semi-cured adhesive film, a chip, and a substrate. The chip is fixed on the substrate, and the semi-cured adhesive film covers the surface of the chip. The miniaturized iridescent light-emitting element has a product size of 0.85 mm × 0.7 mm × 0.15 mm and is used as a backlight for mobile phones or laptops.

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