Display panel

By introducing edges with larger surface roughness and micro-protrusion structures into the insulating layer of the display panel, the misalignment problem between the light-emitting element and the pad assembly during the laser bonding process is solved, thus improving the splicing quality of the splicing display device.

CN120916563APending Publication Date: 2025-11-07AU OPTRONICS CORP
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Patent Information

Application Number
CN202511067059.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-03-20
Filing Date
2025-07-31
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

During the laser bonding process of LED display panels, the light-emitting elements and the pad assembly are prone to misalignment in the edge area, resulting in an increase in the width of the splicing seam of the splicing display device.

Method used

A first edge with a large surface roughness and spaced micro-protrusions are introduced into the insulating layer of the display panel. The light-emitting element and the pad assembly are joined by a laser bonding process to reduce misalignment.

Benefits of technology

It effectively controls the offset between the light-emitting elements and the mounting pads, reduces the width of the splicing seams in the splicing display device, and improves the splicing quality of the display panel.

✦ Generated by Eureka AI based on patent content.

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Abstract

A display panel includes a substrate, a plurality of pixels disposed on the substrate, and an insulating layer disposed on the substrate. Each pixel comprises a plurality of pixel driving circuits, a plurality of connecting pad groups and a plurality of light-emitting elements. The plurality of pad groups are electrically connected to the plurality of pixel driving circuits, respectively. The plurality of light-emitting elements are respectively bonded to the plurality of pad groups. The insulating layer includes a first edge portion. The first edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels.
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Description

TECHNICAL FIELD

[0001] The present application relates to a display panel. BACKGROUND

[0002] A light emitting diode display panel includes an active substrate and a plurality of light emitting diode elements disposed on the active substrate. Inherited the characteristics of light emitting diode, the light emitting diode display panel has the advantages of power saving, high efficiency, high brightness, fast response time, etc. In addition, compared with organic light emitting diode display panel, the light emitting diode display panel also has the advantages of easy color adjustment, long light emitting life, no image burn-in, etc. Therefore, the light emitting diode display panel is considered as the next generation display technology.

[0003] In the process of the light emitting diode display panel, a plurality of light emitting diode elements on a light emitting element carrier can be bonded to a plurality of contact pad groups of the active substrate using a laser bonding process. However, the film layer edge of the active substrate has a step difference with the base surface of the active substrate. In the process of laser bonding, the light emitting element carrier is extruded along the step difference, and the light emitting element carrier is softened by heat, resulting in a serious offset problem of the light emitting element and the contact pad group in the edge region. SUMMARY

[0004] The present application provides a display panel, wherein the offset of the light emitting element and the contact pad group in the edge region is small.

[0005] The display panel of one embodiment of the present application includes a substrate, a plurality of pixels disposed on the substrate, and an insulating layer disposed on the substrate. Each pixel includes a plurality of pixel driving circuits, a plurality of contact pad groups, and a plurality of light emitting elements. The plurality of contact pad groups are respectively electrically connected to the plurality of pixel driving circuits. The plurality of light emitting elements are respectively bonded to the plurality of contact pad groups. The insulating layer includes an intermediate portion and a first edge portion. The intermediate portion and the first edge portion of the insulating layer are located outside the plurality of contact pad groups of the plurality of pixels. The first edge portion of the insulating layer is located between the intermediate portion of the insulating layer and the edge of the substrate. The surface roughness of the first edge portion of the insulating layer is greater than the surface roughness of the intermediate portion of the insulating layer.

[0006] The display panel of one embodiment of the present application includes a substrate, a plurality of pixels disposed on the substrate, and an insulating layer disposed on the substrate. Each pixel includes a plurality of pixel driving circuits, a plurality of contact pad groups, and a plurality of light emitting elements. The plurality of contact pad groups are respectively electrically connected to the plurality of pixel driving circuits. The plurality of light emitting elements are respectively bonded to the plurality of contact pad groups. The insulating layer includes a first edge portion. The first edge portion of the insulating layer is located outside the plurality of contact pad groups of the plurality of pixels. The first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals. The first micro-protrusions have a protrusion height ΔH1. The top surface of the light emitting element has a distance H1 from the substrate. 5%≤(ΔH1 / H1)≤40%. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 Fig. 1 is a plan view schematically showing a tiled display apparatus according to an embodiment of the present application.

[0008] Figure 2 Fig. 2 is a plan view and an enlarged view schematically showing a display panel according to an embodiment of the present application.

[0009] Figure 3 Fig. 3 is a sectional view schematically showing the display panel according to the embodiment of the present application.

[0010] Figure 4 Fig. 4 is a plan view and an enlarged view schematically showing a display panel according to another embodiment of the present application.

[0011] Figure 5 Fig. 5 is a sectional view schematically showing the display panel according to the other embodiment of the present application.

[0012] Figure 6 Fig. 6 is a sectional view schematically showing the display panel according to the other embodiment of the present application.

[0013] Figure 7 Fig. 7 is a plan view and an enlarged view schematically showing a display panel according to still another embodiment of the present application.

[0014] Figure 8 Fig. 8 is a sectional view schematically showing the display panel according to the still another embodiment of the present application.

[0015] Figure 9 Fig. 9 is a plan view and an enlarged view schematically showing a display panel according to yet another embodiment of the present application.

[0016] Figure 10 Fig. 10 is a sectional view schematically showing the display panel according to the yet another embodiment of the present application.

[0017] In the drawings, the following signs are used:

[0018] 1: tiled display apparatus

[0019] 10, 10A, 10B: display panel

[0020] 110: substrate

[0021] 110a: edge

[0022] 110t: through region

[0023] 120: pixel drive circuit

[0024] 130: contact pad group

[0025] 131: first contact pad

[0026] 132: second contact pad

[0027] 140: light emitting element

[0028] 140a: top surface

[0029] 140b: side wall

[0030] 150: insulating layer

[0031] 151: intermediate portion

[0032] 151a: flat surface

[0033] 152, 152A: first edge portion

[0034] 152a: first micro-protrusion

[0035] 153: second edge portion

[0036] 153a: second micro-protrusion

[0037] 160: shaped layer

[0038] 170: waterproof layer

[0039] D, H1, H2: distance

[0040] PX: pixel

[0041] R1: intermediate region

[0042] R2: edge region

[0043] T: second transistor

[0044] Ta: first terminal

[0045] Tb: second terminal

[0046] Tc: control terminal

[0047] AH1, AH2: protrusion height

[0048] I-I', II-II', III-III', IV-IV', V-V': section line DETAILED DESCRIPTION

[0049] Reference will now be made in detail to the exemplary embodiments of the present application, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and the description to refer to the same or like parts.

[0050] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" can mean physically and / or electrically connected. Further, "electrically connected" or "coupled" can be used to indicate an electrical connection that is not necessarily direct, for example, via a wire.

[0051] As used herein, "about," "approximately," or "substantially" include the stated value and mean within an acceptable range of variation for an average of a particular value as determined by one of ordinary skill in the art to which the discussion pertains, taking into account the specific number of measurements and the error associated with the measurements (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about," "approximately," or "substantially" can select a more acceptable range of variation or standard deviation for optical properties, etching properties, or other properties, and can not apply one standard deviation to all properties.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0053] Figure 1 A top view schematic diagram of a tiled display device according to an embodiment of the present application. Please refer to FIG. 1. Figure 1 The tiled display device 1 includes a plurality of display panels 10. The plurality of display panels 10 are tiled to provide a large display picture. Each display panel 10 has at least one edge 110a tiled with other display panels 10.

[0054] Figure 2 A top view and enlarged schematic diagram of a display panel according to an embodiment of the present application. Figure 2 Corresponding to Figure 1 a middle region R1 of a display panel 10. Figure 3 A cross-sectional schematic diagram of a display panel according to an embodiment of the present application. Figure 3 Corresponding to Figure 2 a cross-sectional line I-I'. Figure 4 A top view and enlarged schematic diagram of a display panel according to an embodiment of the present application. Figure 4 Corresponding to Figure 1an edge region R2 of a display panel 10. The edge region R2 has at least one edge 110a of the display panel 10. Figure 5 A cross-sectional view of a display panel according to an embodiment of the present application. Figure 5 corresponding Figure 4 to the cross-sectional view II-II'. Figure 6 A cross-sectional view of a display panel according to an embodiment of the present application. Figure 6 corresponding Figure 4 to the cross-sectional view III-III'.

[0055] Please refer to Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , the display panel 10 includes a substrate 110 and a plurality of pixels PX disposed on the substrate 110. In some embodiments, the substrate 110 can be made of glass, quartz, organic polymer, or non-transparent / reflective material (e.g., wafer, ceramic, or other applicable material), or other applicable material.

[0056] Each pixel PX includes a plurality of pixel driving circuits 120, a plurality of contact pad groups 130 electrically connected to the plurality of pixel driving circuits 120 respectively, and a plurality of light emitting elements 140 bonded to the plurality of contact pad groups 130 respectively. For example, in some embodiments, each pixel PX can selectively include three pixel driving circuits 120, three contact pad groups 130 electrically connected to the three pixel driving circuits 120 respectively, and three light emitting elements 140 bonded to the three contact pad groups 130 respectively, wherein the three light emitting elements 140 are respectively configured to emit different first color light, second color light, and third color light. In some embodiments, the first color light, the second color light, and the third color light are, for example, red light, green light, and blue light respectively, but the present application is not limited thereto.

[0057] In some embodiments, each pixel driving circuit 120 can selectively include a first transistor (not shown), a second transistor T, and a capacitor (not shown), wherein a first end of the first transistor is electrically connected to a corresponding data line (not shown), a control end of the first transistor is electrically connected to a corresponding scan line (not shown), a second end of the first transistor is electrically connected to a control end Tc of the second transistor T, a first end Ta of the second transistor T is electrically connected to a corresponding power supply line (not shown), the capacitor is electrically connected between the second end of the first transistor and the first end Ta of the second transistor T, and a second end Tb of the second transistor T is electrically connected to a corresponding contact pad group 130. In short, in some embodiments, each pixel driving circuit 120 can selectively be a 2T1C architecture. However, the present application is not limited thereto, and in other embodiments, the pixel driving circuit 120 can also be other architectures.

[0058] In some embodiments, each pad group 130 can selectively include a first pad 131 and a second pad 132, wherein the first pad 131 is electrically connected to a corresponding pixel driving circuit 120, the second pad 132 is electrically connected to a corresponding common line (not shown), and two electrodes of a light emitting element 140 are respectively bonded to the first pad 131 and the second pad 132. In some embodiments, the light emitting element 140 can be a flip chip type and is bonded to the first pad 131 and the second pad 132 of the corresponding same pad group 130. However, the present application is not limited thereto, and in other embodiments, the light emitting element 140 can also be of other types, such as a vertical type, a lateral type, etc.

[0059] The display panel 10 further includes an insulating layer 150 disposed on the substrate 110. In some embodiments, the insulating layer 150 is located on the pixel driving circuit 120, and the pixel driving circuit 120 is located between the insulating layer 150 and the substrate 110. The insulating layer 150 can be a single film layer or a stacked structure of multiple film layers. In some embodiments, the material of the insulating layer 150 can be an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof.

[0060] In some embodiments, the display panel 10 further includes a molding layer 160 disposed on the insulating layer 150 and covering at least the sidewall 140b of the light emitting element 140. In some embodiments, the insulating layer 150 is in contact with the molding layer 160. In some embodiments, the display panel 10 can selectively further include a waterproof layer 170 disposed on the molding layer 160 and covering the top surface 140a of the light emitting element 140, but the present application is not limited thereto.

[0061] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , the insulating layer 150 includes a middle portion 151 (indicated in Figure 3 ) and a first edge portion 152 (indicated in Figure 5 ). The middle portion 151 and the first edge portion 152 of the insulating layer 150 are located outside the plurality of pad groups 130 of the plurality of pixels PX. The first edge portion 152 of the insulating layer 150 is located between the middle portion 151 of the insulating layer 150 and the edge 110a of the substrate 110.

[0062] It is worth noting that the surface roughness of the first edge portion 152 of the insulating layer 150 is greater than the surface roughness of the middle portion 151 of the insulating layer 150. When the plurality of light emitting elements 140 on the light emitting element carrier (not shown) are bonded to the plurality of contact pad groups 130 by a laser bonding process, although the light emitting element carrier is heated and softened by the irradiation of laser, because the surface roughness of the first edge portion 152 of the insulating layer 150 is greater, the light emitting elements 140 on the softened light emitting element carrier are less likely to be greatly offset from the contact pad groups 130. The problem of the light emitting elements 140 being easily offset from the contact pad groups 130 in the edge region R2 can be improved. When the offset of the light emitting elements 140 from the contact pad groups 130 can be well controlled and is small, the distance D (indicated by the arrow in FIG. 1) between the light emitting elements 140 and the edge 110a of the substrate 110 can be designed to be small, which helps to reduce the width of the splicing seam of the spliced display device 1. Figure 4 ) can be designed to be small, which helps to reduce the width of the splicing seam of the spliced display device 1.

[0063] In some embodiments, the central wavelength of the laser used in the aforementioned laser bonding process can fall within the range of 400 nm to 1200 nm, and the absorption rate of the insulating layer 150 to the laser is less than 1%. That is, under the irradiation of the laser, the surface temperature of the insulating layer 150 is low, which helps to slow down the degree of heating and softening of the light emitting element carrier due to the irradiation of the laser, and further improves the problem of the light emitting elements 140 being offset from the contact pad groups 130. In some embodiments, the thermal conductivity coefficient of the insulating layer 150 is less than 10 W / m·K. That is, under the irradiation of the laser, the heat conduction speed of the insulating layer 150 is slow, which helps to slow down the degree of heating and softening of the light emitting element carrier due to the irradiation of the laser, and further improves the problem of the light emitting elements 140 being offset from the contact pad groups 130. In some embodiments, the wavelength of visible light falls within the range of 380 nm to 780 nm, and the penetration rate of the insulating layer 150 to the visible light is greater than 99%. That is, the arrangement of the insulating layer 150 hardly affects the transparency of the display panel 10.

[0064] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 In some embodiments, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-protrusions 152a (indicated by the arrows in Figure 4 and Figure 5 , and the middle portion 151 of the insulating layer 150 has a flat surface 151a (indicated by the arrow in Figure 3). In some embodiments, the range of the plurality of first micro-protrusions 152a can be from the edge 110a of the substrate 110 inwardly by about 2 mm, or in other words, 2-4 pixels PX inwardly from the edge 110a of the substrate 110, but the present application is not limited thereto. In some embodiments, the first edge portion 152 of the insulating layer 150 having the plurality of first micro-protrusions 152a is formed, for example, by a gray-tone mask, but the present application is not limited thereto. The plurality of first micro-protrusions 152a and the plurality of recesses between the plurality of first micro-protrusions 152a can form a first concave-convex structure. In some embodiments, the first concave-convex structure can be formed by etching down an original film layer or by adding an additional film layer.

[0065] Please refer to Figure 1 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the insulating layer 150 further includes a second edge portion 153 (indicated in Figure 6 ), which is located outside the plurality of contact pad groups 130 of the plurality of pixels PX. Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The second edge portion 153 of the insulating layer 150 is located between the middle portion 151 of the insulating layer 150 and the first edge portion 152 of the insulating layer 150. Both the first edge portion 152 and the second edge portion 153 are located in the edge region R2 of the display panel 10, and the second edge portion 153 is farther away from the edge 110a of the substrate 110 than the first edge portion 152. The surface roughness of the second edge portion 153 of the insulating layer 150 is between the surface roughness of the middle portion 151 of the insulating layer 150 and the surface roughness of the first edge portion 152 of the insulating layer 150.

[0066] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-protrusions 152a arranged at intervals, the second edge portion 153 of the insulating layer 150 has a plurality of second micro-protrusions 153a arranged at intervals, and the protrusion height (or the height difference) ΔH1 of the first micro-protrusions 152a is greater than the protrusion height (or the height difference) ΔH2 of the second micro-protrusions 153a. That is, in the edge region R2 of the display panel 10, the closer to the edge 110a of the substrate 110, the higher the protrusion height of the micro-protrusions of the insulating layer 150, and the greater the surface roughness of the insulating layer 150. In this way, it is helpful to further improve the problem of the light emitting element 140 and the contact pad group 130 deviating more seriously as getting closer to the edge 110a.

[0067] The plurality of second micro-protrusions 153a and the plurality of recesses between the plurality of second micro-protrusions 153a can form a second concave-convex structure. In some embodiments, the second concave-convex structure can be formed by etching down from an original film layer or by adding an additional film layer.

[0068] Please refer to Figure 4 and Figure 5 In some embodiments, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-protrusions 152a arranged at intervals, the first micro-protrusions 152a have a protrusion height ΔH1, the top surface 140a of the light emitting element 140 has a distance H1 from the substrate 110, and 5%≤(ΔH1 / H1)≤40%. Having (ΔH1 / H1) fall within the above range can make the arrangement of the first micro-protrusions 152a less likely to affect other designs of the display panel 10. In addition, having (ΔH1 / H1) fall within the above range can also make the molding layer 160 still have good stability after the waterproof layer 170 (or waterproof adhesive) is removed. Figure 5 In the present embodiment, ΔH1 is, for example, within the range of 0.15 μm to 3 μm, but the present application is not limited thereto. Please refer to Figure 4 and Figure 6 In some embodiments, the second edge portion 153 of the insulating layer 150 has a plurality of second micro-protrusions 153a arranged at intervals, the second micro-protrusions 153a have a protrusion height ΔH2, the top surface 140a of the light emitting element 140 has a distance H2 from the substrate 110, and 5%≤(ΔH2 / H2)≤40%. Having (ΔH2 / H2) fall within the above range can make the arrangement of the second micro-protrusions 153a less likely to affect other designs of the display panel 10. In addition, having (ΔH2 / H2) fall within the above range can also make the molding layer 160 still have good stability after the waterproof layer 170 (or waterproof adhesive) is removed.

[0069] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments, the distribution density of the plurality of first micro-protrusions 152a is greater than the distribution density of the plurality of second micro-protrusions 153a. That is, in some embodiments, in the edge area R2 of the display panel 10, the closer to the edge 110a of the substrate 110, the greater the distribution density of the micro-protrusions of the insulating layer 150. In this way, it is helpful to further improve the problem of the light emitting element 140 and the contact pad group 130 deviating more seriously the closer to the edge 110a.

[0070] It must be noted that the following embodiments employ the same reference signs and parts of the previous embodiments, in which the same or similar elements are indicated by the same reference signs, and the description of the same technical content is omitted. The description of the omitted parts can be referred to the previous embodiments, which will not be repeated hereinafter.

[0071] Figure 7 A top view and an enlarged schematic view of a display panel according to another embodiment of the present application. Figure 8 A sectional view of a display panel according to another embodiment of the present application. Figure 8 Corresponding Figure 7 to sectional line IV-IV'.

[0072] Figure 7 And Figure 8 The display panel 10A is similar to the aforementioned display panel 10, and the difference between the two is that: Figure 7 And Figure 8 The first edge portion 152A of the insulating layer 150 of the display panel 10A is different from the first edge portion 152 of the insulating layer 150 of the aforementioned display panel 10. Please refer to Figure 7 And Figure 8 Specifically, in the present embodiment, the first edge portion 152A of the insulating layer 150 has a plurality of first micro-protrusions 152a arranged at intervals, and the protrusion height ΔH1 of the plurality of first micro-protrusions 152a gradually increases as it approaches the edge 110a of the substrate 110.

[0073] Figure 9 A top view and an enlarged schematic view of a display panel according to another embodiment of the present application. Figure 10 A sectional view of a display panel according to another embodiment of the present application. Figure 10 Corresponding Figure 9 to sectional line V-V'. Figure 9 And Figure 10 The display panel 10B is similar to the aforementioned display panel 10, and the difference between the two is that: there is no penetration area 110t or the area ratio of the penetration area 110t is very small between the plurality of pixels PX of the aforementioned display panel 10, as shown in Figure 4 The aforementioned display panel 10 is essentially a non-transparent display panel, and the molding layer 160 of the aforementioned display panel 10 can absorb light; Figure 9 And Figure 10 There is a penetration area 110t large enough between the plurality of pixels PX of the display panel 10B, and the display panel 10B is a transparent display panel, and the molding layer 160 of the display panel 10B can transmit light.

[0074] In addition, as shown in Figure 5 In the aforementioned display panel 10B, the insulating layer 150 and the contact pad group 130 are essentially located in the same plane; asFigure 10 As shown, in the display panel 10B of the present embodiment, the insulating layer 150 can be slightly lower than the contact pad group 130. Further, please refer to Figure 10 In the present embodiment, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-protrusions 152a arranged at intervals, the first micro-protrusions 152a have a protrusion height ΔH1, the top surface 140a of the light emitting element 140 has a distance H1 from the substrate 110, and 5%≤(ΔH1 / H1)≤40%. Please refer to Figure 10 In the present embodiment, ΔH1 is, for example, in the range of 0.5 μm to 3 μm, but the present application is not limited thereto.

Claims

1.A display panel, comprising: a substrate; a plurality of pixels disposed on the substrate, wherein each of the pixels comprises: a plurality of pixel driving circuits; a plurality of pad groups electrically connected to the plurality of pixel driving circuits, respectively; and a plurality of light emitting elements bonded to the plurality of pad groups, respectively; and an insulating layer disposed on the substrate; the insulating layer comprises a middle portion and a first edge portion, the middle portion and the first edge portion of the insulating layer are located outside the plurality of pad groups of the plurality of pixels, the first edge portion of the insulating layer is located between the middle portion of the insulating layer and an edge of the substrate, and a surface roughness of the first edge portion of the insulating layer is greater than a surface roughness of the middle portion of the insulating layer. 2.The display panel of claim 1, wherein the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, and the middle portion of the insulating layer has a flat surface. 3.The display panel of claim 1, wherein the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, and a protrusion height of the plurality of first micro-protrusions gradually increases as approaching the edge of the substrate. 4.The display panel of claim 1, wherein the insulating layer further comprises a second edge portion, the second edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels, the second edge portion of the insulating layer is located between the middle portion of the insulating layer and the first edge portion of the insulating layer, and a surface roughness of the second edge portion of the insulating layer is between the surface roughness of the middle portion of the insulating layer and the surface roughness of the first edge portion of the insulating layer. 5.The display panel of claim 1, wherein the insulating layer further comprises a second edge portion, the second edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels, the second edge portion of the insulating layer is located between the middle portion of the insulating layer and the first edge portion of the insulating layer, the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a protrusion height of the first micro-protrusion is greater than a protrusion height of the second micro-protrusion. 6.The display panel of claim 1, wherein the insulating layer further comprises a second edge portion, the second edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels, the second edge portion of the insulating layer is located between the middle portion of the insulating layer and the first edge portion of the insulating layer, the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a distribution density of the plurality of first micro-protrusions is greater than a distribution density of the plurality of second micro-protrusions. 7.The display panel of claim 1, wherein the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, a protrusion height of the first micro-protrusion is ΔH1, a distance between a top surface of the light emitting element and the substrate is H1, and 5%≤(ΔH1 / H1)≤40%. 8.The display panel of claim 1, wherein a center wavelength of a laser light falls within a range of 400 nm to 1200 nm, and an absorption rate of the insulating layer to the laser light is less than 1%. 9.The display panel of claim 1, wherein a wavelength of a visible light falls within a range of 380 nm to 780 nm, and a transmittance of the insulating layer to the visible light is greater than 99%. 10.The display panel of claim 1, wherein a thermal conductivity of the insulating layer is less than 10 W / m·K. 11.A display panel, comprising: a substrate; a plurality of pixels disposed on the substrate, wherein each pixel comprises: a plurality of pixel driving circuits; a plurality of pad groups electrically connected to the plurality of pixel driving circuits, respectively; and a plurality of light emitting elements bonded to the plurality of pad groups, respectively; and an insulating layer disposed on the substrate, wherein the insulating layer comprises a first edge portion, the first edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels, the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, a protrusion height of a first micro-protrusion is ΔH1, a top surface of a light emitting element has a distance from the substrate, the distance is H1, and 5%≤(ΔH1 / H1)≤40%. 12.The display panel of claim 11, wherein the plurality of protrusion heights of the plurality of first micro-protrusions gradually increase as approaching an edge of the substrate. 13.The display panel of claim 11, wherein the insulating layer further comprises a second edge portion, the second edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels, the first edge portion of the insulating layer is located between the second edge portion of the insulating layer and an edge of the substrate, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a protrusion height of a first micro-protrusion is greater than a protrusion height of a second micro-protrusion. 14.The display panel of claim 11, wherein the insulating layer further comprises a second edge portion, the second edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels, the first edge portion of the insulating layer is located between the second edge portion of the insulating layer and an edge of the substrate, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a distribution density of the plurality of first micro-protrusions is greater than a distribution density of the plurality of second micro-protrusions. 15.The display panel of claim 12, wherein a center wavelength of a laser light falls within a range of 400 nm to 1200 nm, and an absorption rate of the insulating layer to the laser light is less than 1%. 16.The display panel of claim 11, wherein a wavelength of a visible light falls within a range of 380 nm to 780 nm, and a transmittance of the insulating layer to the visible light is greater than 99%. 17.The display panel of claim 11, wherein a thermal conductivity of the insulating layer is less than 10 W / m·K. ​ ​ ​ ​ ​ ​