Interleaved parallel power supply topological structure design based on gallium nitride material

Abstract

The invention relates to the technical field of gallium nitride power supplies, and discloses a gallium nitride material-based staggered parallel power supply topological structure design, which comprises a shell, a mainboard is mounted on the inner wall of the shell, an interface is fixedly connected to the front surface of the mainboard, the interface is in plug-in connection with the inner wall of the shell, a power supply socket is fixedly connected to the surface of the mainboard, and the power supply socket is in plug-in connection with the inner wall of the shell. The power supply socket is fixedly connected with the inner wall of the shell, a redundant device is arranged on the upper surface of the mainboard, the redundant device comprises a temperature sensor, and the temperature sensor is fixedly connected with the upper surface of the mainboard. According to the power supply mainboard, the redundant device is arranged, so that when the power supply mainboard is in a high-power state and reaches the designed temperature, part of current passing through the mainboard can be transferred to the redundant device to be processed through the redundant device, and therefore the working power and temperature of the mainboard are reduced; the stability of temperature control and long-time operation of the power supply in a high-power state is improved, and the service life of the power supply is prolonged.

Description

Technical Field

[0001] This invention relates to the field of gallium nitride power supply technology, specifically to the design of an interleaved parallel power supply topology based on gallium nitride materials. Background Technology

[0002] Gallium nitride (GaN) power supplies are power devices that use gallium nitride, a novel wide-bandgap semiconductor material, as their core component. Compared to traditional silicon-based power supplies, GaN has a high electron mobility, allowing electrons to move more quickly and significantly improving power efficiency, achieving highly efficient energy conversion. Its lower resistance reduces conduction losses and energy waste. These characteristics give GaN power supplies numerous advantages: they achieve high power density, outputting high power in a smaller size, contributing to device miniaturization and portability; for example, some GaN chargers are only 50% the size of silicon-based power supplies of the same power. They also offer fast switching speeds and short response times, making them suitable for fields requiring high-frequency response, such as wireless communication and radar. Furthermore, they maintain stable and reliable performance in high-temperature environments, making them suitable for high-temperature applications such as electric vehicles and aerospace.

[0003] Based on this, some researchers solved problems such as phase current sharing control, drive signal synchronization accuracy, and dynamic voltage equalization by using interleaved parallel topology circuits.

[0004] Although gallium nitride (GaN) power supplies have high efficiency, they still generate certain switching and conduction losses at high frequencies. These losses are converted into heat. The interleaved parallel power supply topology contains multiple power devices and inductors, resulting in high device density. Under high efficiency conditions, heat tends to accumulate locally, causing device temperatures to rise. High temperatures affect the electrical performance of the devices, reduce their reliability, and accelerate device aging and shorten the power supply's lifespan by operating in high-temperature environments for extended periods. Therefore, we propose an interleaved parallel power supply topology design based on gallium nitride (GaN) materials. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides an interleaved parallel power supply topology design based on gallium nitride (GaN) material. This design solves the problem that in existing GaN power supplies, heat tends to accumulate locally under high-efficiency conditions, leading to increased device temperature. High temperatures can affect the electrical performance of devices, reduce their reliability, and accelerate device aging and shorten the lifespan of the power supply if the device operates in a high-temperature environment for a long time.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solution: an interleaved parallel power supply topology design based on gallium nitride material, including a shell, a motherboard mounted on the inner wall of the shell, an interface fixedly connected to the front surface of the motherboard, the interface being inserted into the inner wall of the shell, a power supply socket fixedly connected to the surface of the motherboard, the power supply socket being fixedly connected to the inner wall of the shell, and a redundancy device provided on the upper surface of the motherboard.

[0009] The redundant device includes a temperature sensor, which is fixedly connected to the upper surface of the main board. A circular hole is opened on the surface of the main board. A shielding cylinder is installed on the inner wall of the circular hole on the main board. A support cylinder is slidably connected to the inner wall of the shielding cylinder. A sub-plate is fixedly connected to the upper surface of the support cylinder. A spring is fixedly connected to the inner wall of the support cylinder. The spring is fixedly connected to the inner wall of the shielding cylinder. An electromagnet is fixedly connected to the inner wall of the shielding cylinder. An iron ring adapted to the electromagnet is fixedly connected to the lower surface of the support cylinder.

[0010] A plug is fixedly connected to the lower surface of the sub-board, a socket adapted to the plug is fixedly connected to the upper surface of the main board, a pressure sensor is fixedly connected to the upper surface of the main board, and a pressing post adapted to the pressure sensor is fixedly connected to the lower surface of the sub-board.

[0011] Preferably, a support foot is fixedly connected to the lower surface of the outer shell, and a damping sleeve is fixedly connected to the inner wall of the shielding cylinder. The damping sleeve is slidably connected to the surface of the support cylinder. A damping groove is formed on the surface of the support cylinder, and a damping block adapted to the damping groove is provided on the inner wall of the damping sleeve. By utilizing the cooperation of the damping sleeve and the damping groove, the kinetic energy received by the support cylinder during reset can be absorbed when the spring pushes the support cylinder to reset, thereby reducing the probability of the support cylinder jumping after the spring pushes the support cylinder to reset.

[0012] Preferably, the shielding cylinder is fixedly connected to the inner wall of the outer shell, and there are four support cylinders. The four shielding cylinders are respectively set at the four corners of the sub-plate. The number of shielding cylinders is adapted to the number of support cylinders. The shielding cylinders can shield the external magnetic field to ensure that the electromagnet will not interfere with the external magnetic field when it is running, thereby ensuring the stability of the electromagnet and the main board in the operating state.

[0013] Preferably, the surface of the shielding cylinder has a through hole through which the power supply magnet cable passes. The electromagnet is electrically connected to the main board, and the iron ring is slidably connected to the inner wall of the shielding cylinder. When the electromagnet is energized, it can attract the iron ring downwards, so that the iron ring can pull the support cylinder downwards and drive the sub-board to move downwards, so that the plug can be inserted into the socket to connect the sub-board and the main board.

[0014] Preferably, the surface of the support cylinder is provided with a locking device, which includes a fixing frame. The fixing frame is fixedly connected to the surface of the support cylinder and abuts against the lower surface of the sub-plate. A pin is inserted into the inner wall of the fixing frame. A pressure plate is fixedly connected to the upper surface of the pin. A rubber pad is fixedly connected to the lower surface of the pressure plate. A groove is formed on the surface of the pin. A rotating shaft is rotatably connected to the pin in the inner wall of the groove. A buckle is fixedly connected to the surface of the rotating shaft. The buckle is inserted into the inner wall of the fixing frame. A second spring is fixedly connected to the pin in the inner wall of the groove. The second spring is fixedly connected to the back of the buckle. The fixing frame can provide initial support for the position of the sub-plate to ensure that the sub-plate is within the specified installation area when locked, and effectively improve the stability of the sub-plate during installation.

[0015] Preferably, the surface of the fixing frame is provided with a sliding groove, and a protrusion is slidably connected to the inner wall of the fixing frame in the sliding groove. A sleeve is fixedly connected to the surface of the protrusion, and the sleeve fits onto the surface of the fixing frame. A handle is fixedly connected to the surface of the sleeve, and a horizontal plate is fixedly connected to the inner wall of the sleeve. A top block is fixedly connected to the upper surface of the horizontal plate. The surface of the buckle is provided with a storage groove that matches the top block. By utilizing the cooperation of the protrusion and the sliding groove, the movement distance of the sleeve can be constrained, and the movement direction of the sleeve can be guided to ensure the stability of the sleeve in motion.

[0016] Preferably, the lower end of the pin is chamfered, the pressure plate contacts the upper surface of the fixing frame, the rubber pad abuts against the upper surface of the main board, the buckle is located inside the groove, the upper end of the buckle is arc-shaped, and the lower end of the buckle is chamfered. By utilizing the buckle that penetrates the fixing frame and the cooperation of the second spring, the pin can be locked in the fixing frame to limit the position of the pressure plate and ensure that the pressure plate can press down on the rubber pad.

[0017] Preferably, the top block is trapezoidal in shape and contacts the inner wall of the storage groove. The inner wall of the storage groove has a chamfer that matches the top block. By utilizing the cooperation between the top block and the storage groove, when the user needs to disassemble the sub-plate and pull the handle, the slide will cooperate with the cross plate to push the top block upward, so that the top block pushes the buckle into the groove through the storage groove, thereby disengaging the buckle from the locked state.

[0018] In summary, the technical effects and advantages of this invention are as follows:

[0019] 1. In this invention, by setting up a redundant device, when the power supply motherboard is in a high-power state and reaches the design temperature, a portion of the current passing through the motherboard can be transferred to the redundant device for processing, thereby reducing the operating power and temperature of the motherboard, improving the temperature control and long-term stability of the power supply under high-power conditions, and increasing the service life of the power supply.

[0020] 2. In this invention, by setting a locking device, the installation of the sub-plate can be fixed by structures such as springs and buckles, which reduces the problem of screw loosening caused by the movement of the redundant device when using screws for fixing, and further improves the stability and firmness of the sub-plate structure in the redundant device in the installation state. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the interleaved parallel power supply topology design based on gallium nitride material according to the present invention;

[0022] Figure 2 This is a rear view of the interleaved parallel power supply topology design based on gallium nitride material according to the present invention;

[0023] Figure 3 This is a cross-sectional view of the interleaved parallel power supply topology design based on gallium nitride material according to the present invention;

[0024] Figure 4 This is a schematic diagram of the internal structure of the interleaved parallel power supply topology design based on gallium nitride material in this invention.

[0025] Figure 5 This is a partial structural schematic diagram of the interleaved parallel power supply topology design based on gallium nitride material according to the present invention;

[0026] Figure 6 This is a schematic diagram of the redundant device structure designed based on the interleaved parallel power supply topology of gallium nitride material according to the present invention;

[0027] Figure 7 This invention relates to an interleaved parallel power supply topology based on gallium nitride material. Figure 6 Schematic diagram of the structure at point A in the middle;

[0028] Figure 8 This invention relates to an interleaved parallel power supply topology based on gallium nitride material. Figure 6 A schematic diagram of the structure viewed from below;

[0029] Figure 9 This is a schematic diagram of the locking device structure designed based on the interleaved parallel power supply topology of gallium nitride material according to the present invention;

[0030] Figure 10 This is a cross-sectional view of the locking device designed based on the interleaved parallel power supply topology of gallium nitride material according to the present invention.

[0031] Figure 11 This is a schematic diagram of a locking device part of the design based on the interleaved parallel power supply topology of gallium nitride material in this invention;

[0032] Figure 12This invention relates to an interleaved parallel power supply topology based on gallium nitride material. Figure 11 Side view.

[0033] In the diagram: 1. Outer casing; 2. Support feet; 3. Motherboard; 4. Interface; 5. Power connector;

[0034] 6. Redundancy device; 61. Temperature sensor; 62. Shielding cylinder; 63. Support cylinder; 64. Spring 1; 65. Electromagnet; 66. Iron ring; 67. Sub-plate; 68. Plug; 69. Socket; 610. Pressure sensor; 611. Pressing post; 612. Damping sleeve; 613. Damping groove;

[0035] 7. Locking device; 71. Fixing bracket; 72. Pin; 73. Pressure plate; 74. Rubber pad; 75. Rotating shaft; 76. Buckle; 77. Spring II; 78. Slide groove; 79. Protrusion; 710. Sleeve; 711. Handle; 712. Horizontal plate; 713. Top block; 714. Storage slot. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] refer to Figures 1-12 The illustrated interleaved parallel power supply topology design based on gallium nitride material includes a housing 1, a motherboard 3 mounted on the inner wall of the housing 1, an interface 4 fixedly connected to the front surface of the motherboard 3, the interface 4 being inserted into the inner wall of the housing 1, a power supply socket 5 fixedly connected to the surface of the motherboard 3, the power supply socket 5 being fixedly connected to the inner wall of the housing 1, and a redundancy device 6 provided on the upper surface of the motherboard 3.

[0038] The redundant device 6 includes a temperature sensor 61, which is fixedly connected to the upper surface of the main board 3. A circular hole is opened on the surface of the main board 3. A shielding cylinder 62 is installed on the inner wall of the circular hole on the main board 3. A support cylinder 63 is slidably connected to the inner wall of the shielding cylinder 62. A sub-plate 67 is fixedly connected to the upper surface of the support cylinder 63. A spring 64 is fixedly connected to the inner wall of the support cylinder 63. The spring 64 is fixedly connected to the inner wall of the shielding cylinder 62. An electromagnet 65 is fixedly connected to the inner wall of the shielding cylinder 62. An iron ring 66 adapted to the electromagnet 65 is fixedly connected to the lower surface of the support cylinder 63.

[0039] A plug 68 is fixedly connected to the lower surface of the sub-board 67, a socket 69 adapted to the plug 68 is fixedly connected to the upper surface of the main board 3, a pressure sensor 610 is fixedly connected to the upper surface of the main board 3, and a pressing post 611 adapted to the pressure sensor 610 is fixedly connected to the lower surface of the sub-board 67.

[0040] The lower surface of the outer shell 1 is fixedly connected to the support foot 2, and the inner wall of the shielding cylinder 62 is fixedly connected to the damping sleeve 612. The damping sleeve 612 is slidably connected to the surface of the support cylinder 63. The surface of the support cylinder 63 is provided with a damping groove 613, and the inner wall of the damping sleeve 612 is provided with a damping block that matches the damping groove 613. By utilizing the cooperation of the damping sleeve 612 and the damping groove 613, the kinetic energy received by the support cylinder 63 when it is reset by the spring 64 can be absorbed, thereby reducing the probability of the support cylinder 63 jumping after the spring 64 pushes the support cylinder 63 to reset.

[0041] Among them, the shielding cylinder 62 is fixedly connected to the inner wall of the outer shell 1, and there are four support cylinders 63. The four shielding cylinders 62 are respectively set at the four corners of the sub-plate 67. The number of shielding cylinders 62 is adapted to the number of support cylinders 63. The shielding cylinders 62 can shield the external magnetic field to ensure that the electromagnet 65 will not interfere with the external magnetic field when it is running, thereby ensuring the stability of the electromagnet 65 and the main board 3 in the operating state.

[0042] The shielding cylinder 62 has a through hole on its surface through which the power supply magnet 65 cable passes. The electromagnet 65 is electrically connected to the main board 3. The iron ring 66 is slidably connected to the inner wall of the shielding cylinder 62. When the electromagnet 65 is energized, it can attract the iron ring 66 downward, so that the iron ring 66 can pull the support cylinder 63 downward and drive the sub-board 67 to move downward, so that the plug 68 can be inserted into the socket 69 to connect the sub-board 67 and the main board 3.

[0043] The support cylinder 63 is provided with a locking device 7, which includes a fixing frame 71. The fixing frame 71 is fixedly connected to the surface of the support cylinder 63 and abuts against the lower surface of the sub-plate 67. A pin 72 is inserted into the inner wall of the fixing frame 71. A pressure plate 73 is fixedly connected to the upper surface of the pin 72, and a rubber pad 74 is fixedly connected to the lower surface of the pressure plate 73. A groove is formed on the surface of the pin 72. A rotating shaft 75 is rotatably connected to the inner wall of the groove. A buckle 76 is fixedly connected to the surface of the rotating shaft 75 and is inserted into the inner wall of the fixing frame 71. A second spring 77 is fixedly connected to the inner wall of the groove. The second spring 77 is fixedly connected to the back of the buckle 76. The fixing frame 71 can provide initial support for the position of the sub-plate 67 to ensure that the sub-plate 67 is in the designated installation area when locked, and effectively improve the stability of the sub-plate 67 during installation.

[0044] The fixed frame 71 has a groove 78 on its surface. A protrusion 79 is slidably connected to the inner wall of the groove 78. A sleeve 710 is fixedly connected to the surface of the protrusion 79. The sleeve 710 fits into the surface of the fixed frame 71. A handle 711 is fixedly connected to the surface of the sleeve 710. A horizontal plate 712 is fixedly connected to the inner wall of the sleeve 710. A top block 713 is fixedly connected to the upper surface of the horizontal plate 712. A storage groove 714 that matches the top block 713 is provided on the surface of the buckle 76. By using the cooperation of the protrusion 79 and the groove 78, the movement distance of the sleeve 710 can be constrained, and the movement direction of the sleeve 710 can be guided to ensure the stability of the sleeve 710 in motion.

[0045] The lower end of the pin 72 is chamfered, the pressure plate 73 contacts the upper surface of the fixing frame 71, the rubber pad 74 abuts against the upper surface of the main board 3, and the buckle 76 is located inside the groove. The upper end of the buckle 76 is arc-shaped, and the lower end of the buckle 76 is chamfered. By utilizing the buckle 76 which penetrates the fixing frame 71 and the cooperation of the second spring 77, the pin 72 can be locked in the fixing frame 71 to limit the position of the pressure plate 73 and ensure that the pressure plate 73 can press down on the rubber pad 74.

[0046] The top block 713 is trapezoidal and contacts the inner wall of the storage groove 714. The inner wall of the storage groove 714 has a chamfer that matches the top block 713. With the cooperation of the top block 713 and the storage groove 714, when the user needs to remove the sub-plate 67 and pull the handle 711, the slide will cooperate with the cross plate 712 to push the top block 713 upward, so that the top block 713 pushes the buckle 76 into the groove through the storage groove 714, so that the buckle 76 is released from the locked state.

[0047] Working principle of the invention: When using the power supply, insert the power cord into the power supply socket 5 and plug the other end into the power strip. After the operation is completed, the power strip supplies power to the power supply. Then, the user can select the interface 4 as needed and use a cable to connect the power supply and the device to be powered. The current is processed by the motherboard 3 to supply power to the device to be powered.

[0048] As the current through the mainboard 3 increases and its processing power increases, the temperature of the mainboard 3 gradually rises. When the temperature sensor 61 detects that the temperature of the mainboard 3 reaches 50℃±2℃, the temperature sensor 61, in conjunction with the mainboard 3, controls the electromagnet 65 to operate. The electromagnet 65 is energized and generates magnetic force, which attracts the iron ring 66. Under the action of the electromagnet 65, the iron ring 66 pulls the support cylinder 63 downward. The support cylinder 63 moves in a designated direction, pulling the sub-plate 67 and compressing the spring 64. The spring 64 is compressed and deformed. During the movement, the sub-plate 67 pushes the plug 68 and the pressing post 611. During the movement, the plug 68 is inserted into the socket 69 to connect the sub-plate 67 and the mainboard 3. As the column 611 moves downwards, it gradually approaches the pressure sensor 610. When the pressure sensor 610 is subjected to pressure from the column 611, the pressure sensor 610 opens the switch of the socket 69, energizing the socket 69 and connecting the plug 68. Subsequently, the main board 3 can transfer some current to the sub-board 67, thereby reducing the operating power of the main board 3. By setting up the redundancy device 6, when the power supply main board 3 is in a high-power state and reaches the design temperature, some of the current passing through the main board 3 can be transferred to the redundancy device 6 for processing, thereby reducing the operating power and temperature of the main board 3. This improves the temperature control and long-term stability of the power supply under high-power conditions and increases the service life of the power supply.

[0049] Additionally, when the user needs to disassemble and maintain the sub-plate 67, pulling the handle 711 upwards will cause the handle 711 to pull the sleeve 710. Guided by the slide groove 78 and the protrusion 79, the sleeve 710 will pull the horizontal plate 712. The horizontal plate 712 will push the top block 713. Guided by the storage groove 714, the top block 713 will push the latch 76. Under the constraint of the rotating shaft 75, the latch 76 will rotate in the specified direction and compress the second spring 77. The second spring 77 will be deformed by compression. When the sleeve 710 moves to the maximum distance, the latch 76 will disengage. Then, the user can pull the pressure plate 73 upwards. The pressure plate 73 will then pull the rubber pad 74 and the pin 72. Pin 72, in conjunction with pivot 75, pulls buckle 76. Once pin 72 and buckle 76 are both disengaged from the fixing frame 71, the remaining locking devices 7 are disassembled according to the above steps. The sub-plate 67 can then be removed from the fixing frame 71 for maintenance. When it is necessary to install the sub-plate 67, the user can follow the above steps to perform the installation operation. By setting the locking device 7, the installation of the sub-plate 67 can be fixed by springs, buckles, and other structures, reducing the problem of screw loosening caused by the movement of the redundant device 6 when using screws. This further improves the stability and firmness of the sub-plate 67 structure in the redundant device 6 during installation.

[0050] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0051] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A design of an interleaved parallel power supply topology based on gallium nitride material, comprising a housing (1), characterized in that: The inner wall of the outer shell (1) is equipped with a motherboard (3), the front surface of the motherboard (3) is fixedly connected to an interface (4), the interface (4) is inserted into the inner wall of the outer shell (1), the surface of the motherboard (3) is fixedly connected to a power supply socket (5), the power supply socket (5) is fixedly connected to the inner wall of the outer shell (1), and the upper surface of the motherboard (3) is provided with a redundancy device (6). The redundant device (6) includes a temperature sensor (61), which is fixedly connected to the upper surface of the main board (3). The main board (3) has a circular hole on its surface. A shielding cylinder (62) is installed on the inner wall of the circular hole on the main board (3). A support cylinder (63) is slidably connected to the inner wall of the shielding cylinder (62). A sub-plate (67) is fixedly connected to the upper surface of the support cylinder (63). A spring (64) is fixedly connected to the inner wall of the support cylinder (63). The spring (64) is fixedly connected to the inner wall of the shielding cylinder (62). An electromagnet (65) is fixedly connected to the inner wall of the shielding cylinder (62). An iron ring (66) adapted to the electromagnet (65) is fixedly connected to the lower surface of the support cylinder (63). A plug (68) is fixedly connected to the lower surface of the sub-plate (67), a socket (69) adapted to the plug (68) is fixedly connected to the upper surface of the main plate (3), a pressure sensor (610) is fixedly connected to the upper surface of the main plate (3), and a pressing post (611) adapted to the pressure sensor (610) is fixedly connected to the lower surface of the sub-plate (67).

2. The interleaved parallel power supply topology design based on gallium nitride material according to claim 1, characterized in that: The lower surface of the outer shell (1) is fixedly connected to a support foot (2), the inner wall of the shielding cylinder (62) is fixedly connected to a damping sleeve (612), the damping sleeve (612) is slidably connected to the surface of the support cylinder (63), the surface of the support cylinder (63) is provided with a damping groove (613), and the inner wall of the damping sleeve (612) is provided with a damping block that is adapted to the damping groove (613).

3. The interleaved parallel power supply topology design based on gallium nitride material according to claim 1, characterized in that: The shielding cylinder (62) is fixedly connected to the inner wall of the outer shell (1). There are four support cylinders (63). The four shielding cylinders (62) are respectively set at the four corners of the sub-plate (67). The number of shielding cylinders (62) is adapted to the number of support cylinders (63).

4. The interleaved parallel power supply topology design based on gallium nitride material according to claim 1, characterized in that: The surface of the shielding cylinder (62) is provided with a through hole through which the power supply magnet (65) cable passes. The electromagnet (65) is electrically connected to the main board (3), and the iron ring (66) is slidably connected to the inner wall of the shielding cylinder (62).

5. The interleaved parallel power supply topology design based on gallium nitride material according to claim 1, characterized in that: The surface of the support cylinder (63) is provided with a locking device (7). The locking device (7) includes a fixing frame (71). The fixing frame (71) is fixedly connected to the surface of the support cylinder (63). The fixing frame (71) abuts against the lower surface of the sub-plate (67). A pin (72) is inserted into the inner wall of the fixing frame (71). A pressure plate (73) is fixedly connected to the upper surface of the pin (72). A rubber pad (74) is fixedly connected to the lower surface of the pressure plate (73). A groove is opened on the surface of the pin (72). A rotating shaft (75) is rotatably connected to the inner wall of the groove. A buckle (76) is fixedly connected to the surface of the rotating shaft (75). The buckle (76) is inserted into the inner wall of the fixing frame (71). A second spring (77) is fixedly connected to the inner wall of the groove. The second spring (77) is fixedly connected to the back of the buckle (76).

6. The interleaved parallel power supply topology design based on gallium nitride material according to claim 5, characterized in that: The surface of the fixing frame (71) is provided with a sliding groove (78). The fixing frame (71) is slidably connected to the inner wall of the sliding groove (78) with a protrusion (79). The surface of the protrusion (79) is fixedly connected with a sleeve (710). The sleeve (710) is sleeved with the surface of the fixing frame (71). The surface of the sleeve (710) is fixedly connected with a handle (711). The inner wall of the sleeve (710) is fixedly connected with a horizontal plate (712). The upper surface of the horizontal plate (712) is fixedly connected with a top block (713). The surface of the buckle (76) is provided with a storage groove (714) that matches the top block (713).

7. The interleaved parallel power supply topology design based on gallium nitride material according to claim 5, characterized in that: The lower end of the pin (72) is chamfered, the pressure plate (73) contacts the upper surface of the fixing frame (71), the rubber pad (74) abuts against the upper surface of the main board (3), the buckle (76) is located inside the groove, the upper end of the buckle (76) is arc-shaped, and the lower end of the buckle (76) is chamfered.

8. The interleaved parallel power supply topology design based on gallium nitride material according to claim 6, characterized in that: The top block (713) is trapezoidal in shape and contacts the inner wall of the storage groove (714). The inner wall of the storage groove (714) is provided with a chamfer that matches the top block (713).

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