Server automatic detection cooling system and method and server

Abstract

The invention discloses a server automatic detection cooling system and method and a server, and relates to the technical field of servers, the system comprises a coil pipe assembly, a gas supply assembly, a plurality of heat dissipation assemblies, a passive detection assembly and a controller, the coil pipe assembly is configured to receive gas from the gas supply assembly, and the passive detection assembly is configured to detect the heat dissipation assemblies; the local heat dissipation assemblies are arranged at intervals in the length direction of the coil pipe assembly, penetrate through the coil pipe assembly in the thickness direction of the circuit control board, and are configured to cool the coil pipe assembly when the temperature of the position, corresponding to the local heat dissipation assemblies, on the circuit control board rises to the preset temperature. The partial structure of the passive detection assembly moves towards the side away from the circuit control board, the passive detection assembly sends an electric signal to the controller after being triggered by the local heat dissipation assemblies, the controller receives the electric signal and controls the air supply assembly to operate, and the multiple local heat dissipation assemblies can deform along with the temperature to trigger the passive detection assembly. And targeted temperature detection of the circuit control board is realized.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to an automatic server cooling detection system, method, and server. Background Technology

[0002] As a high-performance computer device, a server is typically used to store, process, and transmit large amounts of data, providing various services to other computers or devices on the network, such as file storage, database management, and website hosting. Because servers generate a lot of heat during operation, it is necessary to monitor and cool them down.

[0003] In related technologies, temperature sensors are used to detect the operating temperature of servers, and cooling systems are used for heat dissipation. However, servers typically contain multiple circuit boards, including the CPU (Central Processing Unit) motherboard, the baseboard management controller circuit board, and expansion cards, etc., and the load periods of different circuit boards are irregular. Existing detection and cooling methods detect and cool simultaneously, which lacks specificity and increases the energy consumption of the cooling system. In view of this, this application is proposed. Summary of the Invention

[0004] This application provides a server automatic temperature detection and cooling system, method, and server to at least solve the problem in related technologies that it is impossible to perform targeted temperature detection on different circuit boards or different locations on circuit boards.

[0005] This application provides an automatic server detection and cooling system, which is configured to detect and cool the circuit control board of a server. The automatic server detection and cooling system includes a coil assembly, an air supply assembly, multiple local heat dissipation assemblies, a passive detection assembly, and a controller.

[0006] The gas supply assembly is used to deliver gas. The coil assembly is located on one side of the circuit control board along the thickness direction. The gas inlet end of the coil assembly is connected to the gas outlet end of the gas supply assembly. The coil assembly is configured to receive gas from the gas supply assembly to cool the circuit control board.

[0007] Multiple local heat dissipation components are spaced apart along the length of the coil assembly and extend through the coil assembly along its thickness. Each local heat dissipation component is configured such that when the temperature at the corresponding location on the circuit control board rises to a preset temperature, a portion of the local heat dissipation component moves away from the circuit control board.

[0008] The passive detection component is located on the side of the local heat dissipation component away from the circuit control board, and the pressure detection component is configured to send an electrical signal to the controller when a portion of the structure of any local heat dissipation component moves toward the side away from the circuit control board.

[0009] The controller is electrically connected to the passive detection component and the air supply component respectively. The controller is configured to receive an electrical signal from the passive detection component and then issue a cooling command to control the air supply component to supply air to the coil component to cool the circuit control board.

[0010] This application also provides a method for automatic temperature detection and cooling of a server. This method is used to detect and cool the circuit control board of a server. The method includes:

[0011] When the local temperature of the circuit control board rises, part of the structure of the local heat dissipation component at the corresponding location moves away from the circuit control board and triggers the passive detection component.

[0012] The passive detection component sends an electrical signal to the controller;

[0013] The controller receives an electrical signal and turns on the chiller and the first fan, and turns off the solenoid valve and the second fan to guide the cold air generated by the chiller into the coil assembly, and blows air onto the circuit control board by triggering the local heat dissipation component of the passive detection component.

[0014] This application also provides a server, including:

[0015] The housing assembly has an internal receiving cavity;

[0016] The circuit control board is located within the receiving cavity;

[0017] The aforementioned server automatic detection and cooling system is configured to detect the temperature at various locations on the circuit control board and cool the circuit control board when the temperature exceeds a preset temperature.

[0018] The aforementioned server automatic detection and cooling system, method, and server utilize spaced, interconnected local heat dissipation components to convert high temperatures in corresponding areas into mechanical displacement, precisely locating individual hot spots. A passive detection component located on the side of the local heat dissipation component furthest from the circuit control board receives the trigger and transmits an electrical signal to the controller, eliminating background heat interference and ensuring signal reliability. The controller then uses this electrical signal to activate the air supply component, and, based on the correspondence between the coil assembly and the circuit control board, cools the circuit controller, effectively solving the problem of inability to perform localized temperature measurement and cooling of the circuit control board in related solutions. Attached Figure Description

[0019] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the server structure provided in an embodiment of this application;

[0021] Figure 2 An exploded view of the server provided in the embodiments of this application;

[0022] Figure 3 A partial exploded view of the server provided in the embodiments of this application;

[0023] Figure 4 Another partially exploded view of the server provided in an embodiment of this application;

[0024] Figure 5 A cross-sectional view of the heat dissipation drive assembly provided in an embodiment of this application;

[0025] Figure 6 Another partial exploded view of the server provided in the embodiments of this application;

[0026] Figure 7 This is a structural schematic diagram of the fixed upright plate provided in an embodiment of this application;

[0027] Figure 8 This is an assembly diagram of the coil assembly and local heat dissipation assembly provided in the embodiments of this application;

[0028] Figure 9 for Figure 8 A magnified view of position A in the middle;

[0029] Figure 10 Exploded view of the coiled giant sword and local heat dissipation assembly provided in the embodiments of this application;

[0030] Figure 11 This is a schematic diagram of the structure of a local heat dissipation assembly provided in an embodiment of this application;

[0031] Figure 12 A partial structural diagram of a local heat dissipation component provided in an embodiment of this application;

[0032] Figure 13 A partially exploded view of a local heat dissipation component provided in an embodiment of this application;

[0033] Figure 14 A partial structural diagram of the built-in shell provided in an embodiment of this application;

[0034] Figure 15 for Figure 14 A magnified view of position A in the middle;

[0035] Figure 16 Another exploded view of the local heat dissipation assembly provided in the embodiments of this application;

[0036] Figure 17 A partial structural schematic diagram of the air-expanding component provided in an embodiment of this application;

[0037] Figure 18 This is an exploded view of the air-expanding component provided in an embodiment of this application.

[0038] The above figures include the following reference numerals:

[0039] 1-Casing assembly; 11-Side shell; 12-Rear grille; 13-Circuit board; 14-Cover plate;

[0040] 15-Heat dissipation mechanism; 16-Operation control box; 17-Baffle; 18-Refrigeration unit; 19-Fixing through hole;

[0041] 2-Circuit control board;

[0042] 3-Heat dissipation drive assembly; 31-Air collector box; 32-Sleeve connecting pipe; 33-Rubber collar;

[0043] 341 - First front casing; 342 - Second front casing; 351 - First fan; 352 - Second fan;

[0044] 361 - First check valve; 362 - Second check valve; 37 - Gas collection chamber;

[0045] 4-Passive detection component; 41-Fixed upright plate; 42-Elastic telescopic rod; 43-Pressure detection component;

[0046] 44 - Movable plate; 45 - Air guide hole;

[0047] 5-Coil assembly; 51-Coil; 52-Inlet pipe; 53-Outlet pipe; 54-Solenoid valve;

[0048] 55 - Disc-shaped channel; 56 - Fixed pipe opening;

[0049] 6-Local heat dissipation component; 61-Inset housing assembly; 611-Inner housing; 612-Inner cavity;

[0050] 613 - First through hole; 614 - Second through hole; 615 - Third through hole;

[0051] 616 - Fourth through hole; 617 - Air blowing pipe;

[0052] 618- Inclined tube; 619- Inclined groove; 62- Elastic element; 63- Built-in slide bar; 64- Top plate; 65- Columnar plate;

[0053] 66-Air expansion component; 661-Tube shell; 662-Heat exhaust port; 663-Guide rod;

[0054] 664 - Second sealing ring; 665 - Gas storage chamber; 6651 - First chamber; 6652 - Gap;

[0055] 67 - First sealing ring. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, other embodiments obtained by those of ordinary skill in the art without creative effort are all within the protection scope of this application.

[0057] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0059] A server is a high-performance computer device typically used to store, process, and transmit large amounts of data, providing various services to other computers or devices on a network. Examples include file storage, database management, and website hosting. Because servers generate a significant amount of heat during operation, an automatic cooling system is needed to monitor their temperature in real time and activate appropriate cooling measures when the temperature becomes too high. This ensures stable server operation, prevents performance degradation or hardware damage due to overheating, and guarantees the server's ability to continuously and efficiently provide services to users.

[0060] In related technologies, during the server testing and cooling process, the operating temperature of the server is detected by a temperature sensor, and heat is dissipated through a cooling system.

[0061] However, servers typically contain multiple circuit boards, including the CPU motherboard, baseboard management controller circuit board, and expansion cards. These circuit boards can be cooled by ambient air cooling when operating at low loads. Furthermore, the workload of any particular circuit board varies during its operation, causing the cooling requirement to fluctuate. Current technologies for detecting and cooling simultaneously lack specificity and increase the energy consumption of the cooling system.

[0062] Based on the above, this application proposes an automatic server cooling detection system, method, and server.

[0063] The server automatic detection and cooling system is a heat dissipation solution used to monitor the temperature status of the server room or equipment operating environment in real time. When the temperature exceeds a preset threshold, the system will automatically activate auxiliary cooling equipment to quickly reduce the ambient temperature and ensure that the server operates stably within a safe temperature range. This system reduces the frequency of manual intervention through automated control, improves heat dissipation efficiency, and reduces equipment failures caused by high temperatures, thereby ensuring the reliability of the server and the continuity of data processing. It is especially suitable for scenarios with high heat dissipation requirements, such as data centers and server rooms.

[0064] Reference Figure 1 , Figure 2 As shown, the server includes a chassis assembly 1 and a circuit control board 2. The chassis assembly 1 forms the external outline of the server, and the circuit control board 2 is installed inside the chassis assembly 1.

[0065] Reference Figure 1 As shown, the direction pointed to by the X-axis arrow is the front, and the opposite direction pointed to by the X-axis arrow is the back. The X-axis is the length direction of the server, the Y-axis is the width direction of the server, and the Z-axis is the height direction of the server.

[0066] Reference Figure 2 , Figure 3 As shown, the server includes a side shell 11, and a rear mesh panel 12 and a circuit board 13 are fixedly connected to the side shell 11 near the rear end. The rear mesh panel 12 is located at the rear end of the circuit board 13, and a circuit control board 2 is plugged into the inner side of the circuit board 13 (the side away from the rear mesh panel 12). The circuit board 13 is fixedly connected to the side shell 11 on both sides along the width direction of the server.

[0067] The top and bottom of the side shell 11 are fixed to the cover plate 14 by bolts. The cover plate 14 forms the top and bottom of the server.

[0068] A partition 17 is fixedly connected to the side shell 11 near the front end. The partition 17 is mainly used to install some internal components of the server. The partition 17 and the circuit board 13 are spaced apart along the length of the server, and the partition 17 is fixedly connected to the side shell 11 on both sides along the width of the server.

[0069] An operation control box 16 is fixedly connected to the front end of the side shell 11. The operation control box 16 is located on the front side of the server and includes a display screen and operation buttons. Commands can be issued by triggering the operation buttons, and the server's operating parameters and status can be viewed through the display screen.

[0070] The operation control box 16 is also equipped with a controller, which can be electrically connected to the internal components of the server, receive electrical signals from the components and send electrical signals to the corresponding components.

[0071] The connection method between the components of the housing assembly 1 described above is merely an example. The embodiments of this application do not limit the connection method of the components described above, and those skilled in the art can make settings as needed.

[0072] With the above configuration, this structural design enables the housing assembly 1 to stably fix the various components, providing basic support for subsequent heat dissipation operations.

[0073] The server also includes an automatic server cooling system that monitors and cools the server's circuit control board 2. (See reference...) Figure 3 , Figure 6 As shown in the figure, an automatic server detection and cooling system proposed in this application includes an air supply component, a coil component 5, multiple local heat dissipation components 6, a passive detection component 4, and a controller.

[0074] The gas supply assembly is used to deliver gas. This gas is used to cool the circuit control board 2. It should be noted that the gas here may include cold air or gas inside the housing assembly 1.

[0075] The coil assembly 5 is located on one side along the thickness direction of the circuit control board 2. The air inlet end of the coil assembly 5 is connected to the air outlet end of the air supply assembly. The coil assembly 5 is configured to receive gas from the air supply assembly to cool the circuit control board 2.

[0076] Reference Figure 6 As shown, multiple local heat dissipation components 6 are spaced apart along the length of the coil assembly 5 to detect temperature changes at different locations on the circuit control board 2. The local heat dissipation components 6 are arranged through the coil assembly 5 along the thickness of the circuit control board 2.

[0077] The local heat dissipation component 6 is configured such that when the temperature at the position corresponding to the local heat dissipation component 6 on the circuit control board 2 rises to a preset temperature, a portion of its structure moves toward the side away from the circuit control board 2.

[0078] The passive detection component 4 is located on the side of the local heat dissipation component 6 away from the circuit control board 2. The passive detection component 4 is configured to send an electrical signal to the controller when a part of the structure of any local heat dissipation component 6 moves toward the side away from the circuit control board 2 and triggers the passive detection component 4.

[0079] The controller can be installed in the operation control box 16. The controller is electrically connected to the air supply assembly and the passive detection assembly 4. The controller is configured to issue a cooling command after receiving an electrical signal, controlling the air supply assembly to supply air to the coil assembly 5.

[0080] By setting up multiple local heat dissipation components 6, the temperature of multiple components on the circuit control board 2 can be detected, thereby improving the temperature detection range of the server and laying the groundwork for targeted local cooling of the server in the future. At the same time, this detection method changes the traditional detection method of temperature sensors, which can reduce the failure rate and provide system durability.

[0081] In some implementations, refer to Figure 11 , Figure 12 As shown, the local heat dissipation assembly 6 includes an embedded shell assembly 61. An elastic element 62 is fixedly connected to the inner side of the embedded shell assembly 61 on the side away from the circuit control board 2. A cylindrical plate 65 is fixedly connected to the left side of the elastic element 62. An internal sliding rod 63 and a top plate 64 are sequentially fixedly connected to the side of the cylindrical plate 65 away from the circuit control board 2. An air expansion component 66 is fixedly connected to the side of the cylindrical plate 65 near the circuit control board 2. A first sealing ring 67 is fixedly connected to the outer side of the cylindrical plate 65. The outer side of the embedded shell assembly 61 is fixedly connected to the inner side of the fixed pipe opening 56.

[0082] In some implementations, refer to Figure 13 , 14 As shown, the local heat dissipation assembly 6 includes an inner shell 611, an inner slide bar 63, a cylindrical plate 65, an elastic element 62, and an air expansion component 66. (Refer to...) Figure 9 As shown, the outer side of the inner shell 611 is fixedly connected to the inner side of the fixed tube opening 56.

[0083] Reference Figure 14 As shown, the inner shell 611 has an inner cavity 612 and a first through hole 613, a second through hole 614, a third through hole 615 and a fourth through hole 616 communicating with the inner cavity 612. The third through hole 615 communicates with the interior of the coil assembly 5. The third through hole 615 provides a structural basis for subsequent cooling of the circuit control board 2.

[0084] The opening of the second through hole 614 allows the gas on the right side of the cylindrical plate 65 to be discharged quickly, reducing the resistance when the cylindrical plate 65 moves.

[0085] In some configurations, the second through hole 614 is connected to the first through hole 613. Of course, the first through hole 613 and the second through hole 614 can also be configured independently.

[0086] The built-in slide rod 63 is partially housed within the built-in cavity 612. The built-in slide rod 63 extends along the length of the built-in shell 611, and one end of the built-in slide rod 63 extends out of the built-in shell 611 through the first through hole 613. The outer side of the built-in slide rod 63 and the inner side of the first through hole 613 are slidably connected.

[0087] The cylindrical plate 65 is disposed in the internal cavity 612. The cylindrical plate 65 is connected to the side of the internal slide rod 63 near the circuit control board 2. The cylindrical plate 65 can slide along the length of the internal shell 611.

[0088] The elastic element 62 is sleeved on the built-in slide rod 63. One end of the elastic element 62 is connected to the side of the cylindrical plate 65 near the built-in slide rod 63, and the other end of the elastic element 62 is connected to the inner wall of the inner shell 611. Here, the elastic element 62 serves to assist in the repositioning of the cylindrical plate 65.

[0089] Reference Figure 12 As shown, the air-expanding component 66 extends into the fourth through hole 616 along its length away from the circuit control board 2 and connects to the cylindrical plate 65 away from the built-in slide rod 63. The air-expanding component 66 is configured such that when the temperature at the position corresponding to the air-expanding component 66 on the circuit control board 2 rises to a preset temperature, a portion of its structure moves toward the side away from the circuit control board 2.

[0090] The elastic element 62 is provided on the spring. The spring is sleeved on the built-in slide rod 63, one end of the spring is connected to the side of the cylindrical plate 65 near the built-in slide rod 63, and the other end of the spring is connected to the inner wall of the built-in shell 611.

[0091] When passive detection component 4 is not triggered, refer to Figure 12 , Figure 13 The cylindrical plate 65 is located on the side of the third through hole 615 closer to the air expansion component. When the passive detection component 4 is triggered, the cylindrical plate 65 is located on the side of the third through hole 615 away from the air expansion component 66. At this time, the third through hole 615 is connected to the air blowing pipe 617, which can be used for local cooling of the circuit control board 2.

[0092] In some embodiments, to increase the contact area between the built-in slide bar 63 and the passive detection component 4, the local heat dissipation component 6 further includes a top plate 64, which is connected to the side of the built-in slide bar 63 that extends out of the built-in housing 611. The cross-section of the top plate 64 is larger than the cross-section of the built-in slide bar 63.

[0093] To ensure the connection between the cylindrical plate 65 and the inner wall of the inner shell 611, the local heat dissipation assembly 6 also includes a first sealing ring 67, which is sleeved on the periphery of the cylindrical plate 65. The outer side of the first sealing ring 67 fits against the inner side of the inner cavity 612. For example, the first sealing ring 67 is made of rubber.

[0094] With the above configuration, this sliding connection allows the built-in slide rod 63 to move flexibly inside the first through hole 613. Combined with the fit between the first sealing ring 67 and the built-in cavity 612, it enables precise mechanical action and provides a reliable physical basis for temperature detection and heat dissipation control.

[0095] In some implementations, refer to Figure 16 , Figure 17 , Figure 18 As shown, the air expansion component 66 further includes a housing 661, a guide rod 663, and a second sealing ring 664. An air storage cavity 665 is formed inside the housing 661. Partially, the guide rod 663 is disposed within the air storage cavity 665. The guide rod 663 extends along its length away from the circuit control board 2 into the fourth through hole 616 and connects to the side of the cylindrical plate 65 away from the built-in slide rod 63. The guide rod 663 and the housing 661 are slidably connected. For example, the housing 661 is made of copper.

[0096] By enabling the guide rod 663 to slide flexibly inside the gas storage chamber 665, and by having the second sealing ring 664 fit against the inner wall of the tube shell 661, precise mechanical action is achieved, providing a reliable physical basis for temperature detection and heat dissipation control.

[0097] By inserting the guide rod 663 into the fourth through hole 616 and fixing it to the cylindrical plate 65, the guide rod 663 can fit tightly with the fourth through hole 616, and the mechanical action can be transmitted through sliding, ensuring that the system's temperature detection and heat dissipation control can be carried out accurately and efficiently.

[0098] Reference Figure 13 As shown, two air-expanding components 66 are provided. The two guide rods 663 can be set independently, or the two guide rods 663 can be set as a whole and then connected to the cylindrical plate 65. The structure of the two guide rods 663 set as a whole is defined as a double-column guide rod 663. The double-column guide rod 663 is embedded in the inside of the fourth through hole 616. The double-column guide rod 663 slides on the inner side of the fourth through hole 616. The side of the double-column guide rod away from the circuit control board 2 is fixedly connected to the side of the cylindrical plate 65 that is closer to the circuit control board 2.

[0099] The second sealing ring 664 is fitted onto the side of the guide rod 663 away from the cylindrical plate 65, as shown in the reference. Figure 17As shown, the outer periphery of the second sealing ring 664 is fitted to and slidably connected to the inner wall of the tube shell 661, and the second sealing ring 664, the guide rod 663 and the tube shell 661 together form the first chamber 6651.

[0100] When the temperature of the circuit control board 2 rises, the temperature of the corresponding tube shell 661 rises. After the gas in the first chamber 6651 expands due to heat, the guide rod 663 moves toward the cylindrical plate 65 under the action of gas pressure.

[0101] In some implementations, refer to Figure 17 As shown, a gap 6652 is provided between the guide rod 663 and the tube shell 661. A heat exhaust port 662 is also provided on the tube shell 661. The heat exhaust port 662 is connected to the gap 6652 and is configured to exhaust the air in the gap 6652.

[0102] Reference Figure 2 As shown, when the temperature of multiple circuit control boards 2 is detected, the local heat dissipation components 6 of the same group are installed on the right end of the circuit control board 2. At the same time, multiple air expansion components 66 are close to the components of the circuit control board 2 to facilitate the heat conduction of the heat emitted by the circuit control board 2 to the shell 661 of the air expansion component 66.

[0103] It is understood that the accompanying drawings in this application specification are for illustrative purposes only, and the local heat dissipation component 6 can also be installed as a whole on the left side of the circuit control board 2.

[0104] When the temperature of the circuit control board 2 rises, the temperature of the shell 661 of the air expansion component 66 rises due to thermal radiation. Due to thermal expansion and contraction, the gas in the gap 6652 will flow out from the heat exhaust port 662, while the gas in the first chamber 6651 will expand. Due to the gas expansion, the pressure of the gas pushes the guide rod 663 to move to the right. The guide rod 663 will drive the cylindrical plate 65 and the first sealing ring 67 to move to the right. The cylindrical plate 65 squeezes the elastic element 62, causing the elastic element 62 to contract.

[0105] At the same time, the cylindrical plate 65 drives the built-in slide rod 63 and the top plate 64 to move to the right, and the built-in slide rod 63 gradually slides from inside the first through hole 613.

[0106] When the temperature reaches the preset temperature, the top plate 64 will contact the movable plate 44, and the top plate 64 will push the movable plate 44 to move to the right. When the right side of the movable plate 44 presses against the pressure detection component 43, the pressure detection component 43 receives the pressure and sends an electrical signal to the controller, indicating that the temperature has reached a certain limit.

[0107] By distributing multiple local heat dissipation components 6 on the right side of the circuit control board 2, the temperature of multiple components on the circuit control board 2 can be detected, thereby increasing the temperature detection range of the circuit control board 2 and laying the groundwork for subsequent targeted local cooling of the circuit control board 2. At the same time, this detection method changes the traditional detection method of temperature sensors, which can reduce the failure rate and improve the durability of the system.

[0108] In some implementations, refer to Figure 14 , Figure 15 As shown, the local heat dissipation assembly 6 also includes an air blowing pipe 617. The air blowing pipe 617 is disposed on the side of the inner shell 611 near the circuit control board 2. The air blowing pipe 617 is connected to the receiving cavity. A first through hole 613 is opened on the side of the air blowing pipe 617 away from the inner shell 611. The first through hole 613 is configured to connect the inside and outside of the air blowing pipe 617.

[0109] In some embodiments, a second through hole 614 is provided on the side wall of the air pipe 617, and the local heat dissipation assembly 6 also includes an inclined tube 618 disposed inside the air pipe 617. The inclined tube 618 is configured to be inclined from the side away from the circuit control board 2 toward the side closer to the circuit control board 2 toward the second through hole 614.

[0110] Both the air blowing pipe 617 and the inclined pipe 618 have inclined grooves 619 on their inner sides. The inclined grooves 619 penetrate the outside of the air blowing pipe 617 and are connected to the inside of the air blowing pipe 617.

[0111] Through the above-mentioned configuration, this complex internal structure design enables the built-in shell 611 to perform multiple functions, such as gas flow control and temperature regulation, providing support for the efficient operation of the system.

[0112] When the passive detection component 4 is triggered, the cylindrical plate 65 is located on the side of the third through hole 615 away from the air expansion component 66. At this time, the third through hole 615 is connected to the air blowing pipe 617. The cold air in the coil assembly 5 can enter the built-in cavity 612 through the third through hole 615, and then blow it to the circuit control board 2 through the air blowing pipe 617, which can be used for local cooling of the circuit control board 2.

[0113] In some implementations, refer to Figure 8 , Figure 10 As shown, the coil assembly 5 includes an inlet tube 52, a coil 51, and an outlet tube 53.

[0114] The inlet pipe 52 is connected to the outlet end of the air supply component, and the inlet end of the coil 51 is connected to the outlet end of the inlet pipe 52.

[0115] Reference Figure 9As shown, the coil 51 has a disc-shaped channel 55 and a fixed port 56 communicating with the disc-shaped channel 55. The fixed ports 56 are spaced apart along the width direction of the coil 51, and the local heat dissipation assembly 6 is installed at the fixed ports 56. The air inlet end of the outlet pipe 53 is connected to the air outlet end of the coil 51.

[0116] The aforementioned inlet tube 52, outlet tube 53, and coil 51 are made of copper. The inner sides of the inlet tube 52 and outlet tube 53 are hollow.

[0117] The outer side of the outlet tube 53 is fixedly connected to the inner side of the fixing through hole 19 opened in the circuit board 13, and the rear end of the outlet tube 53 extends out of the rear end of the circuit board 13.

[0118] With the above configuration, this hollow interconnected structure allows cold air to flow freely between the inlet pipe 52, the disc-shaped channel 55, and the outlet pipe 53, ensuring that the cold air can be efficiently transferred to the parts that need cooling and improving the heat dissipation effect.

[0119] In some implementations, refer to Figure 8 As shown, the coil assembly 5 includes a solenoid valve 54, which is located at the outlet pipe 53 and is used to determine whether the inside of the coil assembly 5 is connected to the outside through the outlet pipe 53.

[0120] To improve the detection range, the coil 51 is arranged to meander along the length of the circuit control board 2. Of course, multiple coils 51 can also be used to meet the detection range requirements.

[0121] In some embodiments, the gas supply assembly includes a chiller 18 and a heat dissipation drive assembly 3, wherein the chiller 18 is used to generate cold air, and the heat dissipation drive assembly 3 is used at least to guide the cold air generated by the chiller 18 into the coil assembly 5.

[0122] The refrigerator 18 is installed on the side of the partition 17 away from the circuit control board 2. The refrigerator 18 and the partition 17 are electrically connected.

[0123] In some implementations, refer to Figure 4 , Figure 5 As shown, the heat dissipation drive assembly 3 includes an air collection box 31, at least one sleeve pipe 32, a first front shell 341, a first one-way valve 361, and a first fan 351. An air collection chamber 37 is formed inside the air collection box 31. The air inlet end of the sleeve pipe 32 communicates with the air collection chamber 37, and the air outlet end of the sleeve pipe 32 communicates with the inlet pipe 52. The air inlet end of the first front shell 341 communicates with the air outlet of the refrigerator 18, and the air outlet end of the first front shell 341 communicates with the air collection chamber 37. The first one-way valve 361 is located in the first front shell 341. The first fan 351 is located in the first front shell 341. The first one-way valve 361 is a silicone duckbill valve.

[0124] Through the above structure, the first fan 351 and the one-way valve can effectively control the direction of airflow, and together with the air outlet of the refrigeration unit 18, achieve precise cold air delivery and improve heat dissipation efficiency.

[0125] The heat dissipation drive assembly 3 also includes a rubber collar 33, which is fixedly disposed on the inner side of the sleeve tube 32. The sleeve tube 32 is sleeved on the outer side of the inlet tube 52, and the inner side of the rubber collar 33 is in contact with the outer side of the inlet tube 52.

[0126] The above configuration allows the sleeve 32 and the rubber collar 33 to fit tightly with the inlet pipe 52, ensuring smooth gas flow and providing a stable channel for subsequent cooling gas transmission.

[0127] In some embodiments, the heat dissipation drive assembly 3 further includes a second front housing 342, a second one-way valve 362, and a second fan 352. The air inlet of the second front housing 342 is connected to the outside air, and the air outlet of the second front housing 342 is connected to the air collection chamber 37. The second one-way valve 362 is disposed in the second front housing 342. The second fan 352 is disposed in the second front housing 342.

[0128] The aforementioned second check valve 362 is configured as a silicone duckbill valve.

[0129] It should be noted that the number of the front casing, check valve, and fan mentioned above is set to two. Those skilled in the art can adjust the number of the front casing, check valve, and fan as needed.

[0130] In some implementations, refer to Figure 6 , Figure 7 As shown, the passive detection component 4 also includes a movable plate 44, a fixed upright plate 41, an elastic telescopic rod 42, and a pressure detection component 43.

[0131] The movable plate 44 is installed on the side of the local heat dissipation component 6 away from the circuit control board 2, and the movable plate 44 is provided with air guide holes 45.

[0132] The fixed upright plate 41 is located on the side of the movable plate 44 away from the movable plate 44. The top and bottom ends of the fixed upright plate 41 are fixedly connected to the cover plate 14.

[0133] The elastic telescopic rod 42 is connected to a fixed upright plate 41 and a movable plate 44 at its two ends along its extension direction, respectively.

[0134] The pressure detection component 43 is electrically connected to the controller. The pressure detection component 43 is disposed on the side of the fixed plate 41 near the movable plate 44, and there is a gap between the end of the pressure detection component 43 away from the fixed plate 41 and the end of the movable plate 44 away from the circuit control board 2. For example, the pressure detection component 43 can be configured as a pressure sensor.

[0135] When a portion of the structure of any local heat dissipation component 6 moves toward the side away from the circuit controller, the movable plate 44 moves toward the pressure detection component 43 and triggers the pressure detection component 43, which then sends an electrical signal to the controller.

[0136] In the above, the movable plate 44 presses against the pressure detection component 43, the pressure detection component 43 detects the pressure and sends an electrical signal to the controller, thereby enabling the movable plate 44 and the pressure detection component 43 to transmit pressure information through electrical signals.

[0137] The air duct 45 provides space for subsequent mechanical actions, enhancing the system's responsiveness. In some embodiments, the heat dissipation mechanism 15 is electrically connected to the controller, see reference... Figure 2 As shown, the heat dissipation mechanism 15 is located on one side of the circuit control board 2 along the thickness direction.

[0138] Taking the heat dissipation mechanism 15 on the left side of the figure as an example, the heat dissipation structure includes a shell plate and an electric fan installed on the shell plate. The electric fan is fixedly installed inside the shell plate, and the shell plate is provided with through holes.

[0139] The heat dissipation mechanism 15 is fixedly connected to the side shell 11. The side shell 11 is provided with ventilation holes to facilitate the electric fan to blow outside air towards the circuit control board 2. Outside air enters the interior of the housing assembly 1 through the through holes and ventilation holes.

[0140] This application proposes an automatic server temperature detection and cooling method, which is used to detect and cool the circuit control board 2 of the server. The method includes:

[0141] When the local temperature of the circuit control board 2 rises, part of the structure of the local heat dissipation component 6 at the corresponding position moves away from the circuit control board 2 and triggers the passive detection component 4.

[0142] The passive detection component 4 sends an electrical signal to the controller.

[0143] The controller receives an electrical signal and turns on the chiller 18, the first fan 351, and the solenoid valve 54 to introduce the cold air generated by the chiller 18 into the coil assembly 5.

[0144] When the circuit control board 2 experiences localized high temperatures, targeted heat dissipation is applied to the circuit control board 2 with the high temperature and the localized areas of the circuit control board 2 with the high temperature.

[0145] When the temperature of the circuit control board 2 rises, the temperature of the shell 661 of the air expansion component 66 rises due to thermal radiation. At this time, the gas in the gap 6652 will flow out from the heat exhaust port 662, and the gas in the first chamber 6651 will expand. The pressure of the gas pushes the guide rod to move to the right, and the guide rod will drive the cylindrical plate 65 and the first sealing ring 67 to move to the right. The cylindrical plate 65 squeezes the elastic element 62, and the elastic element 62 contracts.

[0146] The cylindrical plate 65 drives the built-in slide rod 63 and the top plate 64 to move to the right, and the built-in slide rod 63 gradually slides from inside the first through hole 613. At this time, the cylindrical plate 65 and the first sealing ring 67 will move to the right end of the third through hole 615, and the first sealing ring 67 will seal the cylindrical plate 65 and the inner shell 611. At this time, the solenoid valve 54 and the second fan 352 are closed, and the first fan 351 and the refrigeration unit 18 are turned on.

[0147] The cold air generated by the refrigeration unit 18 is delivered by the first fan 351. At this time, the first one-way valve 361 is opened under pressure and the second one-way valve 362 is closed under pressure. The cold air enters the interior of the air guide pipe and the coil 51 through the first front shell 341, the air collecting chamber 37 and the sleeve pipe 32. Due to the blocking of the solenoid valve 54, the cold air can be prevented from flowing out from the outlet pipe 53.

[0148] A gap is provided between the outer side of the inner shell 611 and the inner side of the disc-shaped channel 55, which allows cold air to flow freely from the disc-shaped channel 55. The cold air will enter the inner cavity 612 at the left end of the first sealing ring 67 through the third through hole 615, and then flow out through the air blowing pipe 617.

[0149] Since the inclined tube 618 protrudes inside the air blowing tube 617, some of the cold air will cool the tube shell 661 through the inclined groove 619 of the inclined tube 618, while most of the cold air will be blown to the circuit control board 2 through the through hole in the middle of the air blowing tube 617, thereby achieving the effect of local cooling of the circuit control board 2.

[0150] This cooling method can rapidly cool down the overheated parts of the circuit control board 2, thereby improving the cooling effect of the circuit control board 2 and ensuring the safe use of the circuit control board 2. This targeted heat dissipation method can avoid the waste of cold air and also achieve a certain energy-saving effect.

[0151] In this embodiment, the chiller 18, local heat dissipation component 6, and coil component 5 are configured to rapidly cool down the server when the server temperature is high by specifically dissipating heat to the server and its localized areas. This improves the cooling effect of the server, ensures the safe use of the server, and avoids the waste of cold air, thus achieving a certain energy-saving effect.

[0152] In some implementations, when the passive detection component 4 is not triggered and the server is running, the heat dissipation mechanism 15 is activated to direct outside air to the vicinity of the circuit control board 2, and / or the second fan 352 and the solenoid valve 54 are activated to direct outside air to the coil assembly 5.

[0153] During the above process, the chiller 18 and the first fan 351 are shut down.

[0154] During normal server operation, the workload inside the server is relatively small, and the overall temperature is not high. At this time, the movable plate 44 and the pressure detection component 43 are far apart. At this time, the first sealing ring 67 is in the position of the third through hole 615. At this time, the controller controls the electric fan and the second fan 352 inside the heat dissipation mechanism 15 to turn on, and at the same time controls the solenoid valve 54 to open. The electric fan inside the heat dissipation mechanism 15 introduces external air into the interior of the heat dissipation mechanism 15.

[0155] During this process, air is blown through the gap 6652 of the fixed plate 41 and the air guide hole 45 to the coil 51 and the circuit control board 2, thereby achieving the effect of air cooling of the circuit control board 2.

[0156] The coil 51 is made of copper. The coil 51 can absorb the heat emitted by the circuit control board 2 and further cool the circuit control board 2.

[0157] After the second fan 352 is turned on, the external air enters the interior of the second one-way valve 362 through the second front shell 342. The second one-way valve 362 is in the open state when pressed, while the first one-way valve 361 is in the closed state when pressed. This ensures that the air volume will not be weakened. At this time, the external gas enters the interior of the sleeve pipe 32 and the inlet pipe 52 through the air collection chamber 37.

[0158] The rubber collar 33 emphasizes the sealing effect between the sleeve tube 32 and the inlet tube 52. Air enters the disc channel 55 through the inlet tube 52, then flows from the outlet tube 53 to the rear end of the circuit board 13, and then flows out through the rear mesh plate 12, thereby achieving the cooling effect of the coil 51 and improving the continuous cooling of the circuit control board 2 by the coil 51.

[0159] This embodiment of the application, through the heat dissipation mechanism 15, heat dissipation drive component 3, and coil component 5, achieves air cooling of the server when the server workload is low and the temperature is not high by operating an electric fan and related valves. At the same time, copper components absorb the heat emitted by the server, further cooling the server. Furthermore, by reasonably controlling the opening and closing of the valves, the airflow is ensured not to be weakened, thereby achieving cooling of the cooling components and improving the continuity of cooling of the server.

[0160] The above provides a detailed description of an automatic server detection and cooling system and method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and its core ideas. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server automatic detection and cooling system, wherein the server automatic detection and cooling system is configured to detect and cool the circuit control board (2) of the server, characterized in that, include: Gas supply assembly, used to transport gas; A coil assembly (5) is provided on one side along the thickness direction of the circuit control board (2). The air inlet of the coil assembly (5) is connected to the air outlet of the air supply assembly. The coil assembly (5) is configured to receive gas from the air supply assembly to cool the circuit control board (2). Multiple local heat dissipation components (6) are spaced apart along the length direction of the coil assembly (5). The local heat dissipation components (6) are arranged through the coil assembly (5) along the thickness direction of the circuit control board (2). The local heat dissipation components (6) are configured such that when the temperature at the position corresponding to the local heat dissipation component (6) on the circuit control board (2) rises to a preset temperature, part of its structure moves toward the side away from the circuit control board (2). A passive detection component (4) is located on the side of the local heat dissipation component (6) away from the circuit control board (2). The passive detection component (4) is configured to send an electrical signal to a controller when a portion of the structure of any of the local heat dissipation components (6) moves toward the side away from the circuit control board (2) and triggers the passive detection component (4). The controller is electrically connected to the passive detection component (4) and the gas supply component respectively. The controller is configured to issue a cooling command after receiving the electrical signal and control the gas supply component to supply gas to the coil component (5).

2. The server automatic detection and cooling system according to claim 1, characterized in that, The local heat dissipation component (6) includes: The inner shell (611) has an inner cavity (612) and a first through hole (613), a second through hole (614), a third through hole (615) and a fourth through hole (616) communicating with the inner cavity (612). The third through hole (615) is connected to the interior of the coil assembly (5). An internal slide rod (63) is partially located in the internal cavity (612). The internal slide rod (63) extends along the length of the internal shell (611), and one end of the internal slide rod (63) extends out of the internal shell (611) through the first through hole (613). A cylindrical plate (65) is disposed in the inner cavity (612). The cylindrical plate (65) is connected to the inner slide rod (63) on the side near the circuit control board (2). The cylindrical plate (65) can slide along the length direction of the inner shell (611). An elastic element (62) is sleeved on the built-in slide rod (63). One end of the elastic element (62) is connected to the side of the cylindrical plate (65) near the built-in slide rod (63), and the other end of the elastic element (62) is connected to the inner wall of the built-in shell (611). An air-expanding component (66) extends into the fourth through hole (616) along its own length direction away from the circuit control board (2) and is connected to the side of the cylindrical plate (65) away from the built-in slide rod (63). The air-expanding component (66) is configured such that when the temperature of the position corresponding to the air-expanding component (66) on the circuit control board (2) rises to a preset temperature, part of its own structure moves toward the side away from the circuit control board (2).

3. The server automatic detection and cooling system according to claim 2, characterized in that, The air-expanding component (66) further includes: The shell (661) has an internal gas storage cavity; The guide rod (663) is partially located in the gas storage cavity. The guide rod (663) extends into the fourth through hole (616) along its own length direction away from the circuit control board (2) and connects with the cylindrical plate (65) on the side away from the built-in slide rod (63). The guide rod (663) and the tube shell (661) are slidably connected. The second sealing ring (664) is sleeved on the side of the guide rod (663) away from the cylindrical plate (65). The outer periphery of the second sealing ring (664) is slidably connected to the inner wall of the tube shell (661). The second sealing ring (664), the guide rod (663) and the tube shell (661) together form the first chamber (6651). When the temperature of the circuit control board (2) rises, the temperature of the shell (661) rises accordingly. After the gas in the first chamber (6651) expands due to heat, the guide rod (663) moves toward the cylindrical plate (65) under the action of gas pressure.

4. The server automatic detection and cooling system according to claim 3, characterized in that, A gap (6652) is provided between the guide rod (663) and the tube shell (661). A heat exhaust port (662) is also provided on the tube shell (661). The heat exhaust port (662) is connected to the gap (6652). The heat exhaust port (662) is configured to exhaust the air in the gap (6652).

5. The server automatic detection and cooling system according to any one of claims 2-4, characterized in that, The local heat dissipation assembly (6) also includes: An air blowing tube (617) is disposed on the side of the inner shell (611) near the circuit control board (2). The air blowing tube (617) communicates with the receiving cavity. A first through hole (613) is provided on the side of the air blowing tube (617) away from the inner shell (611). The first through hole (613) is configured to connect the inside and outside of the air blowing tube (617).

6. The server automatic detection and cooling system according to claim 5, characterized in that, The air blowing pipe (617) has a second through hole (614) on its side wall. The local heat dissipation assembly (6) also includes an inclined pipe (618) disposed inside the air blowing pipe (617). The inclined pipe (618) is configured to be inclined from the side away from the circuit control board (2) toward the side closer to the circuit control board (2) toward the second through hole (614).

7. The server automatic detection and cooling system according to any one of claims 1-4, characterized in that, The coil assembly (5) includes: The inlet pipe (52) is connected to the outlet end of the air supply assembly; The coil (51) has an air inlet end connected to the air outlet end of the inlet pipe (52). The coil (51) forms a disc-shaped channel (55) and a fixed pipe opening (56) communicating with the disc-shaped channel (55). The fixed pipe opening (56) is spaced along the width direction of the coil (51). The local heat dissipation component (6) is installed at the fixed pipe opening (56). Outlet pipe (53), the inlet end of which is connected to the outlet end of the coil (51); A solenoid valve (54) is located at the outlet pipe (53).

8. The server automatic detection and cooling system according to claim 7, characterized in that, The gas supply assembly includes: Refrigeration unit (18), used to generate cold air; The heat dissipation drive assembly (3) is used at least to introduce the cold air generated by the refrigerator (18) into the coil assembly (5).

9. The server automatic detection and cooling system according to claim 8, characterized in that, The heat dissipation drive component (3) includes: The air collecting box (31) has an air collecting chamber (37) inside. At least one sleeve (32), the air inlet end of the sleeve (32) is connected to the air collection chamber (37), and the air outlet end of the sleeve (32) is connected to the inlet pipe (52); The first front shell (341) has an air inlet end connected to the air outlet of the refrigerator (18) and an air outlet end connected to the air collection chamber (37). The first check valve (361) is located on the first front shell (341). The first fan (351) is located on the first front shell (341).

10. The server automatic detection and cooling system according to claim 9, characterized in that, The heat dissipation drive assembly (3) also includes: The second front shell (342) has an air inlet end that is connected to the outside air and an air outlet end that is connected to the air collection chamber (37). The second check valve (362) is located in the second front shell (342); The second fan (352) is located in the second front casing (342).

11. The server automatic detection and cooling system according to claim 1, characterized in that, The passive detection component (4) also includes: An active plate (44) is located on the side of the local heat dissipation assembly (6) away from the circuit control board (2), and the active plate (44) has air guide holes. A fixed upright plate (41) is provided on the side of the movable plate (44) away from the movable plate (44); An elastic telescopic rod (42) is provided, with its two ends along its extension direction connected to the fixed upright plate (41) and the movable plate (44), respectively. A pressure detection component (43) is disposed on the side of the fixed plate (41) close to the movable plate (44), and the end of the pressure detection component (43) away from the fixed plate (41) and the end of the movable plate (44) away from the circuit control board (2) are spaced apart. When a portion of the structure of any of the local heat dissipation components (6) moves toward the side away from the circuit control board (2), the movable plate (44) moves toward the pressure detection component (43) and squeezes the pressure detection component (43), which sends the electrical signal to the controller.

12. The server automatic detection and cooling system according to claim 1, characterized in that, It also includes a heat dissipation mechanism (15), which is electrically connected to the controller and is located on one side of the circuit control board (2) along the thickness direction.

13. A method for automatically detecting and cooling a server, wherein the method is used to detect the temperature of the circuit control board (2) of the server and assist in cooling it, characterized in that, The server automatic cooling detection method includes: When the local temperature of the circuit control board (2) rises, part of the structure of the local heat dissipation component (6) at the corresponding position moves toward the side away from the circuit control board (2) and triggers the passive detection component (4). The passive detection component (4) sends an electrical signal to the controller; The controller receives the electrical signal and turns on the refrigerator (18) and the first fan (351), closes the solenoid valve (54) and the second fan (352) to introduce the cold air generated by the refrigerator (18) into the coil assembly (5), and triggers the passive detection assembly (4) to make the local heat dissipation assembly (6) blow towards the circuit control board (2).

14. The server automatic cooling detection method according to claim 13, characterized in that, During server operation, the heat dissipation mechanism (15) is activated to direct outside air to the vicinity of the circuit control board (2), and / or the second fan (352) and the solenoid valve (54) are activated to direct outside air to the coil assembly (5).

15. A server, characterized in that, include: The housing assembly (1) has an internal receiving cavity; The circuit control board (2) is located in the receiving cavity; The server automatic detection and cooling system according to any one of claims 1-12 is configured to detect the temperature at various locations of the circuit control board (2) and cool the circuit control board (2) when the temperature exceeds a preset temperature.

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