Test board loading and unloading device and chip aging test system

Abstract

The invention discloses a test plate loading and unloading device, which is used for transferring chips between a loading disc and a test disc, and comprises a rack, a stock bin, a disc hooking mechanism and a material moving mechanism, the rack is provided with a workbench, the stock bin is installed on the rack and is used for storing the loading disc, the disc hooking mechanism is installed on the rack, and the material moving mechanism is used for moving the loading disc. The loading disc is mounted on the rack and used for transferring a test plate to the workbench, and the material transferring mechanism is mounted on the rack and used for transferring a to-be-tested chip between the loading disc and the test plate. The test board feeding and discharging device can automatically load the to-be-tested chip to the aging test board and transfer the tested chip from the aging test board to the carrier board, so that the chip assembly time is greatly shortened, and the detection efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, specifically relating to a test board loading and unloading device and a chip aging test system. Background Technology

[0002] Chip aging testing is a process that accelerates the aging process of chips by simulating the extreme environments they might encounter in real-world use. This test aims to identify potential problems in the chip's components or materials, allowing for timely improvements and optimizations to enhance chip quality and performance, ensuring stability and reliability throughout the product's lifecycle. Current equipment requires manually transferring chips from a tray to an aging test board using tools before testing, and then removing them one by one after testing, resulting in low efficiency.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a test plate loading and unloading device to reduce testing time and improve testing efficiency.

[0005] To achieve the above objectives, a specific embodiment of the present invention provides a test board loading and unloading device for transferring chips between a carrier disk and a test disk, comprising: A frame, with a worktable on top; A hopper, installed on the frame, is used to store the carrier tray; a hook mechanism, installed on the worktable, is used to transfer the test plate. A transfer mechanism, supported on the frame, is used to transfer the chip under test between the carrier and the test board.

[0006] In one or more embodiments of the present invention, a plurality of the aforementioned hoppers are provided on the frame, and the plurality of hoppers are distributed on both sides of the hook plate mechanism along a transmission direction perpendicular to the test plate.

[0007] In one or more embodiments of the present invention, a first guide rail is provided on the top of the frame, and a worktable is movable on the first guide rail, the first guide rail extending between the hoppers on both sides of the hook mechanism.

[0008] In one or more embodiments of the present invention, the workbench is disposed above the hopper.

[0009] In one or more embodiments of the present invention, the hook mechanism includes a second guide rail fixed to the workbench and a hook assembly supported on the second guide rail. The hook assembly includes a first slider supported on the second guide rail, a power source fixed to the first slider, and a pull handle fixed to the output end of the power source. The power source drives the pull handle to move vertically.

[0010] In one or more embodiments of the present invention, the test board loading and unloading device further includes a positioning mechanism for positioning the test board. The positioning mechanism includes a lifting cylinder fixed to the worktable, a support guide rail disposed on both sides of the lifting cylinder along the moving direction of the test board for supporting the test board, and a stop block fixed to the support guide rail. The lifting cylinder drives the test board supported on the support guide rail to move upward and is blocked by the stop block.

[0011] In one or more embodiments of the present invention, the material transfer mechanism includes a third guide rail extending between the hoppers, a fourth guide rail supported and movable on the third guide rail, a second slider supported on the fourth guide rail, and a suction nozzle connected to the second slider and capable of moving up and down on the second slider.

[0012] In one or more embodiments of the present invention, the material transfer mechanism further includes a rotary motor connected to the second slider, the rotary motor connecting to and driving the suction nozzle to rotate on a horizontal plane.

[0013] In one or more embodiments of the present invention, the material transfer mechanism further includes a receiving plate connected to the second slider, the receiving plate being able to approach or move away from the suction nozzle on a horizontal plane.

[0014] The present invention also provides a chip aging test system, including multiple aging test furnaces, a test board transfer station and the aforementioned test board loading and unloading device. The test board transfer station moves between the aging test furnaces and is used to push test boards into or remove them from the aging test furnaces. The hook plate mechanism in the loading and unloading device transfers test boards between the test board transfer station and the worktable.

[0015] Compared with the prior art, the test board loading and unloading device of the present invention can automatically load the chip under test onto the aging test board and transfer the tested chip from the aging test board to the carrier board, which greatly reduces the chip assembly time and improves the testing efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a test plate loading and unloading device in one embodiment of the present invention; Figure 2 This is an internal top view of the test plate loading and unloading device in one embodiment of the present invention; Figure 3 This is a top view of the positioning mechanism and the hook mechanism in one embodiment of the present invention; Figure 4 This is a schematic diagram of a silo in one embodiment of the present invention; Figure 5 This is a partial schematic diagram of the material transfer mechanism in one embodiment of the present invention; Figure 6 This is a schematic diagram of the hook mechanism in one embodiment of the present invention; Figure 7 This is a schematic diagram of a chip aging test system according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of the silo in one embodiment of the present invention; Figure 9 This is a top view of the workbench and aging test plate in one embodiment of the present invention; Figure 10 This is a three-dimensional schematic diagram of the workbench and aging test plate in one embodiment of the present invention; Figure 11 This is a schematic diagram of a material transfer mechanism according to an embodiment of the present invention; Figure 12 This is a schematic diagram of a suction nozzle according to one embodiment of the present invention; Figure 13 This is a schematic diagram of a secondary positioning mechanism in one embodiment of the present invention; Figure 14 This is a partial schematic diagram of an aging test system according to an embodiment of the present invention.

[0018] in: Test board loading and unloading device; 10. Frame; 11. First guide rail; 12. Workbench; 121. Aging board limit reference; 122. Aging board side positioning cylinder; 123. Reference edge; 124. Secondary positioning mechanism; 1241. L-shaped bracket; 1242. Bracket plate; 1243. Secondary positioning plate; 1244. Positioning groove; 1245. Sensor; 13. Ion fan; 14. Control computer; 15. Indicator light; 16. Wheel set; 17. Support leg; 20. Hopper; 201. Empty disc module; 202. Loading module; 203. BIN area; 21. Base plate; 22. Side 23. Plate; 24. Movable plate; 25. Stepper motor; 26. Cylinder; 30. Carrier plate; 31. Hook and disc mechanism; 32. Second guide rail; 33. Hook and disc assembly; 321. First slider; 322. Power source; 323. Pulling handle; 40. Transfer mechanism; 41. Third guide rail; 42. Fourth guide rail; 43. Slider; 44. Suction nozzle; 45. Rotary motor; 46. Receiving tray; 48. Suction nozzle lifting motor; 51. Lifting cylinder; 52. Support guide rail; 53. Stop block; 200. Test plate transfer station; 300. Aging test furnace; 301. Aging test plate; 400. Shelf. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0020] It should be noted that the loading and unloading in this article mainly refers to the loading and unloading of chips. Loading refers to transferring the chip under test from the carrier tray to the test board, and unloading refers to transferring the tested chip from the test board to the carrier tray. The article also involves the loading and unloading of carrier trays, where loading refers to loading the carrier tray into the hopper, and unloading refers to removing the carrier tray from the hopper.

[0021] like Figure 1-6 As shown, the test board loading and unloading device 100 in one embodiment of the present invention includes a frame 10, a hopper 20, a hook mechanism 30, and a transfer mechanism 40. A worktable is provided on the frame 10. The hopper 20 is mounted on the frame 10 for placing a carrier tray 26 containing chips or an empty tray. The hook mechanism 30 is mounted on the frame 10 for transferring the aging test board 301 to the worktable or from the worktable to a rear station. The transfer mechanism 40 is mounted on the frame 10 for transferring the chip to be tested between the carrier tray 26 and the aging test board 301.

[0022] The test board loading and unloading device 100 in this embodiment is a fully automatic device that can automatically load the chip to be tested onto the aging test board 301 (after carrying the chip, it enters the aging furnace for testing), and transfer the tested chip from the aging test board 301 to the carrier board 26 (the container for loading the chip), thereby greatly reducing the chip assembly time and improving the testing efficiency.

[0023] In one embodiment, a plurality of hoppers 20 are mounted on the frame 10. For example, in... Figure 2 In the illustrated embodiment, a total of 10 hoppers 20 are installed on the frame 10, arranged in two groups (5 hoppers per group) on both sides of the hook mechanism 30. See also Figure 8 As shown, each set of hoppers 20 includes an empty tray module 201, a loading module 202, and three BIN areas 203 (Boundary Identification Number) for storing sorted chips. In one embodiment, a tray transfer device (not shown) is also provided on both sides of the workbench 12 or on both sides of the rack 10 for transferring trays between sets of hoppers 20, for example, transferring empty trays to the BIN areas, or transferring trays in the BIN areas to the loading module 202.

[0024] Since the trays need to be manually placed into the hoppers 20, the larger number of hoppers 20 allows for a greater number of trays 26 to be placed at a time, thus reducing the number of manual tray loading and unloading operations and avoiding repeated tray loading and unloading. The hoppers 20 are fixed to the edge of the frame 10 to facilitate manual tray loading and unloading while avoiding excessive space occupation. Furthermore, when loading and unloading chips from the trays in one hopper 20, the trays in the other hopper 20 can be loaded and unloaded simultaneously, allowing for simultaneous operation on both sides and further improving testing efficiency.

[0025] 20 silos Figure 4 As shown, a tray storage space is formed by a base plate 21 and multiple side plates 22. One of the outward-facing side plates 22 can be opened, allowing workers to load and unload trays through this opened side plate. A movable plate 23 is installed within the storage space, driven by a stepper motor 24 fixed to the base plate 21. The tray is placed on the movable plate 23 and moves up and down with it.

[0026] Preferably, the hopper 20 is also equipped with a limit function and a positioning function. The cylinder 25 fixed on the side plate 22 cooperates with the opposite side plate 22 to realize the positioning of the carrier plate, so as to prevent the carrier plate from shifting when the chip is loaded and unloaded by the transfer mechanism, which would cause the chip to not fall into the carrier plate normally.

[0027] like Figure 3As shown, a first guide rail 11 is provided on the top of the frame 10, extending between the two hoppers 20. A worktable 12 is supported on the first guide rail 11 and can move on the first guide rail 11. A hook mechanism 30 is fixed to the surface of the worktable 12. After the aging test board is transferred to the worktable 12, the chip is loaded and unloaded.

[0028] like Figure 2 , 8 As shown in Figures 9 and 10, in one embodiment, the workbench 12 is positioned above the two side hoppers 20 to reduce space occupation. During operation, the workbench 12 typically moves to the top of one side hopper 20, where chip loading and unloading is performed between the aging test board 301 and the trays 26 in the other side hopper 20. After completing the chip loading and unloading operation on the trays in one side hopper 20, the workbench 12 moves to that side and performs chip loading and unloading on the trays in the other side hopper 20. Simultaneously, operators can manually load and unload trays in the hopper 20 below the workbench 12, thus allowing for simultaneous manual and mechanical chip loading and unloading, further improving testing efficiency.

[0029] It is easy to imagine that the power source for moving the worktable 12 can be a combination of a cylinder or a motor screw, and this embodiment is not limited to that.

[0030] In one embodiment, such as Figure 3 , 6 As shown, the hook-and-panel mechanism 30 includes a second guide rail 31 and a hook-and-panel assembly 32. The second guide rail 31 is fixed to the worktable 12, and the hook-and-panel assembly 32 is supported on the second guide rail 31. The extension direction of the second guide rail 31 is the moving direction of the aging test plate 301. The hook-and-panel assembly 32 includes a first slider 321, a power source 322, and a pull-panel handle 323. The first slider 321 serves as the main body of the hook-and-panel assembly 32, slidingly supported on the second guide rail 31 and capable of moving on the second guide rail 31. The power source 322 is fixed to the first slider 321, and the pull-panel handle 323 is fixed to the output end of the power source 322 and moves up and down under the drive of the power source 322. The pull-panel handle 323 can be... Figure 6 As shown, when the rectangular block moves to the area below the aging test plate, the power source 322 drives the pull handle 323 to rise and hook the aging test plate 301. It then moves to the loading / unloading position above the worktable 12, or to the release position at the rear end of the aging test plate. Finally, the power source 322 drives the pull handle 323 to descend and release the aging test plate. The power source 322 can be a cylinder or a motor, etc., and this embodiment is not limited to these.

[0031] Preferred, such as Figure 3 , 9As shown in Figure 10, a positioning mechanism for positioning the aging test plate is also fixed on the workbench 12. Specifically, it includes an aging plate limiting reference 121, a reference edge 123, an aging plate side positioning cylinder 122, a lifting cylinder 51, a support guide rail 52, and a stop block 53, all fixed to the workbench 12. Two support guide rails 52 are provided, located on both sides of the second guide rail 31, extending in the same direction as the second guide rail 31. Multiple stop blocks 53 are fixed to the two support guide rails 52, each being an L-shaped plate with one end fixed to the support guide rail 52 and the other end extending towards the other support guide rail 52. During operation, the hook mechanism 30 transfers the aging test plate onto the support guide rail 52 until one side of the aging test plate 301 contacts a pair of aging plate limiting references 121 fixed to the workbench 12. The aging plate side positioning cylinder 122 and the hook mechanism 30 then press and position the aging test plate 301 against the reference edge 123. Subsequently, the lifting cylinder 51 drives the aging test plate to move upward. During the movement, the aging test plate comes into contact with and is blocked by the stop block 53. At this time, the lifting cylinder 51 stops moving, and the aging test plate is in a predetermined position, allowing for chip loading and unloading between it and the carrier tray. Preferably, a flexible block (such as rubber or sponge) is fixed at the contact point between the stop block 53 and the aging test plate to prevent the edge of the aging test plate from directly contacting a hard material and being crushed.

[0032] The lifting cylinder 51 and the stop block 53 work together to fix the aging test board 301 in place, preventing it from moving during chip loading and unloading. This avoids the possibility of the aging test board being incorrectly positioned, leading to chips not being placed correctly on it. For example, in Figure 3 In this system, a lifting cylinder 51 is installed at both ends of each support guide rail 52. The lifting cylinder 51 is located in the middle of the two support guide rails 52 to improve stability.

[0033] In one embodiment, such as Figure 5 , 11 As shown in Figure 12, the material transfer mechanism 40 adopts a three-axis motion, including a third guide rail 41 extending along the Y-axis, a fourth guide rail 42 extending along the X-axis, a second slider 43, and a suction nozzle 44. The third guide rail 41 is fixed to the frame 10, and the fourth guide rail 42 is slidably mounted on the third guide rail 41 and can move on the third guide rail 41. The second slider 43 is supported on the fourth guide rail 42 and can move on the fourth guide rail 42. The suction nozzle 44 is mounted on the second slider 43 and can move in the vertical direction. The fourth guide rail 42, the second slider 43, and the suction nozzle 44 can be driven by a motor or cylinder, etc., and this embodiment is not limited to this.

[0034] Preferably, a rotary motor 45 is also mounted on the second slider 43, connected to the suction nozzle 44, for driving the suction nozzle 44 to rotate on the horizontal plane. This allows for adjustment when the chip's orientation needs to be changed during transfer between the carrier disk and the aging test board, improving flexibility. The suction nozzle 44 is equipped with a buffer structure, meaning it can extend and retract to a certain extent in the vertical direction to provide cushioning when contacting the chip, preventing excessive contact force from damaging the chip. Figure 5 In the embodiment shown, two suction nozzles 44 are provided on the second slider 43 to increase the number of chips transferred in a single action, reduce chip loading and unloading time, and improve detection efficiency.

[0035] Furthermore, the transfer mechanism also includes a receiving plate 46 connected to the second slider 43. This receiving plate 46 is positioned below the suction nozzle 44 and can move outwards to below the nozzle 44 or to the other side to retract, exposing the nozzle 44. The receiving plate 46 has grooves for placing chips. During operation, the receiving plate 46 is in a retracted state. After the nozzle 44 picks up a chip, the receiving plate 46 moves below the nozzle 44. If the suction force of the nozzle 44 is accidentally lost, the chip can fall onto the receiving plate 46 instead of falling to other locations on the equipment or onto the bottom surface. The receiving plate 46 can also assist in adjusting the chip position. As the nozzle 44 moves between the carrier tray and the aging test plate, it descends and aligns with the grooves on the receiving plate 46. With the help of the rotary motor 45, the chip is aligned with the groove, ensuring that the chip's orientation is already adjusted when it moves above the carrier tray or aging test plate, eliminating the need for direct placement. This shortens chip loading and unloading time and improves efficiency.

[0036] Preferred, such as Figure 1 As shown, multiple ion fans 13 are fixed on the frame 10, mounted above the workbench 12, to eliminate static electricity in the working area below and prevent it from affecting the chips. A control computer 14 is also fixed on the frame 10 to monitor and control the chip loading and unloading process and parameters in real time. Wheel sets 16 and retractable legs 17 are fixed at the bottom of the frame 10. When the frame needs to be moved or repositioned, the legs 17 can be retracted upwards; after moving to the target position, the legs 17 can be extended to secure the equipment. A color-changing indicator light 15 is also installed at the top of the frame 10, connected to the control computer 14. When the computer determines that manual intervention is required, the indicator light 15 will issue a warning, allowing operators to determine the necessary intervention based on the color of the indicator light.

[0037] During the chip transfer process, chips may accidentally detach from the nozzle 44. Fallen chips can affect the normal transfer of other chips, so they need to be removed promptly. To avoid waste, it is best to have the transfer mechanism 40 continue the unfinished transfer task and move the chips to the designated position. Therefore, the loading / unloading device 100 of this application also has a secondary positioning mechanism 124, see [link to relevant documentation]. Figure 13 As shown. The secondary positioning mechanism 124 is fixedly mounted on the worktable 12 and moves with the worktable 12. The secondary positioning mechanism 124 includes a pair of L-shaped brackets 1241 fixedly mounted on the worktable 12, a support plate 1242 mounted between the pair of L-shaped brackets 1241, and a sensor 1245 mounted on the worktable 12.

[0038] A secondary positioning plate 1243 is detachably connected to the support plate 1242. The secondary positioning plate 1243 has a positioning slot 1244 for placing chips. The external dimensions of the positioning slot 1244 are the same as the size of the chip being transported. The support plate 1242 can be adapted and installed with secondary positioning plates of multiple sizes. Each time a different size chip is loaded or unloaded, the secondary positioning plate needs to be replaced.

[0039] exist Figure 13 In the illustrated embodiment, the secondary positioning plate 1243 has multiple positioning slots 1244, which can simultaneously hold multiple chips. A sensor 1245 is used to detect whether a chip is placed within a positioning slot. In this embodiment, the secondary positioning plate 1243 is divided into two plates, separated by a slit. This slit passes through the multiple positioning slots 1244. The sensor 1245 includes a pair of photoelectric sensors located at opposite ends of the slit. When a chip is placed within a positioning slot 1244, the photoelectric sensors detect the chip and emit a signal. In another embodiment of this application, the sensor further includes an image sensor, positioned above or below the secondary positioning plate 1243. The image sensor can capture images of the positioning slots and analyze the images to determine if the chip's placement posture, position, and orientation are correct.

[0040] During chip handling, if a pressure change is detected in the nozzle 44 of the transfer mechanism 40 before the nozzle 44 has reached the predetermined pick-up or unload position, the controller of the chip aging test system can determine that the chip has been accidentally dropped, issue an alarm, and stop the nozzle 44 from moving. Personnel intervene and manually place the dropped chip into the positioning slot 1244 of the secondary positioning plate 1243. After the sensor 1245 detects the chip, it sends a signal to the controller, which then issues a command to the transfer mechanism 40 to continue the unfinished handling action. Since the position coordinates of each positioning slot 1244 of the secondary positioning mechanism 124 are pre-stored in the controller, the controller can accurately calculate the distance from each positioning slot to the end point of the handling action.

[0041] See Figure 14 As shown, this embodiment also provides a chip aging test system, which, in addition to the test board loading and unloading device 100 described above, also includes a test board transfer station 200 and multiple aging test furnaces 300. Figure 7 As shown, multiple aging test furnaces 300 are arranged along the length direction. The test board transfer station 200 moves between the aging test furnaces 300 to push the aging test board into the furnace or take it out of the furnace. The test board loading and unloading device 100 is arranged on the other side of the test board transfer station 200 to hook the aging test board on the test board transfer station 200 and perform chip loading and unloading operations.

[0042] Preferably, a shelf 400 for storing aging test plates is placed on one side of the aging test furnace 300.

[0043] Tracks are laid between aging test furnaces 300, and a test plate transfer station 200 is supported on these tracks and moves between the aging test furnaces 300 and the racks 400. The test plate transfer station 200 is... Figure 2 The hollow rectangular structure shown has an internal plate-retrieving mechanism similar to the hook mechanism 30. Through a combination of rails, a power source, and a hook assembly 32, it pushes or retrieves aging test plates into or from the aging test furnace 300. Since both the aging test furnace 300 and the shelf 400 have multiple layers, a vertical displacement mechanism is also required at the test plate transfer station 200 to hook aging test plates at different heights.

[0044] To accommodate the test plate transfer station 200, the test plate loading and unloading device 100 has openings on all four sides. One side of the opening faces the track direction where the test plate transfer station 200 is located, and the opposite side can be used for observation and maintenance. The remaining two opposite sides are the locations of the hopper 20, which are used for manual loading and unloading of pallets.

[0045] The chip aging test system in this embodiment will be further explained in conjunction with specific application scenarios.

[0046] The test board transfer station 200 moves to one of the shelves 400 to retrieve the aging test board, and then moves it to the test board loading / unloading device 100. The hook mechanism 30 transfers the aging test board to the worktable 12, the positioning mechanism fixes the aging test board, and the transfer mechanism performs chip loading / unloading operations. After completion, the positioning mechanism releases the aging test board, and the hook mechanism 30 pushes the aging test board loaded with chips onto the test board transfer station 200, which moves to one of the aging test furnaces 300 and pushes the aging test board into it for testing.

[0047] Once the chip on an aging test board in one of the aging test furnaces 300 has completed testing, the system instructs the test board transfer station 200 to move to the aging test furnace 300 and remove the aging test board. Subsequently, the test board transfer station 200 moves to the test board unloading device 100, the hook mechanism 30 transfers the aging test board to the worktable 12, the positioning mechanism fixes the aging test board, and the transfer mechanism transfers the chip to the carrier tray.

[0048] If further testing is required, the transfer mechanism will transfer the chips on the trays in the remaining material bins 20 to the aging test board. The positioning mechanism will release the aging test board, and the hook mechanism 30 will push the aging test board to the test board transfer station 200. The latter will move to one of the aging test furnaces 300 and push the aging test board back into it for testing.

[0049] If no further testing is required, the positioning mechanism releases the aging test plate, and the hook mechanism 30 pushes the aging test plate onto the test plate transfer station 200. The latter moves to one of the shelves 400 and pushes the aging test plate into an empty position within the shelf 400.

[0050] The chip aging test system in this embodiment has multiple aging test furnaces 300, and the test board loading and unloading device 100 can meet the automatic loading and unloading operation of chips. Only manual loading and unloading of the loading tray is required. Therefore, it can meet the simultaneous operation of multiple aging test furnaces 300, which greatly reduces the testing time and improves the testing efficiency while reducing labor costs.

[0051] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0052] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A test board loading and unloading device for transferring chips between a carrier disk and a test board, characterized in that, include: A frame, with a worktable on top; A hopper, installed on the frame, is used to store the carrier tray; A hook-and-disc mechanism, mounted on the workbench, is used to transfer the test board; A transfer mechanism, supported on the frame, is used to transfer the chip under test between the carrier and the test board.

2. The test plate loading and unloading device according to claim 1, characterized in that, The frame is provided with a plurality of hoppers, which are distributed on both sides of the hook plate mechanism along the transmission direction perpendicular to the test plate.

3. The test plate loading and unloading device according to claim 2, characterized in that, The top of the frame is provided with a first guide rail and a worktable that moves on the first guide rail. The first guide rail extends between the hoppers on both sides of the hook mechanism.

4. The test plate loading and unloading device according to claim 3, characterized in that, The hook mechanism includes a second guide rail fixed to the workbench and a hook assembly supported on the second guide rail. The hook assembly includes a first slider supported on the second guide rail, a power source fixed on the first slider, and a pull handle fixed to the output end of the power source. The power source drives the pull handle to move in the vertical direction.

5. The test plate loading and unloading device according to claim 4, characterized in that, It also includes a positioning mechanism for positioning the test board. The positioning mechanism includes a lifting cylinder fixed to the worktable, a support guide rail arranged on both sides of the lifting cylinder along the moving direction of the test board for supporting the test board, and a stop block fixed to the support guide rail. The lifting cylinder drives the test board supported on the support guide rail to move upward and is blocked by the stop block.

6. The test plate loading and unloading device according to claim 1, characterized in that, The material transfer mechanism includes a third guide rail extending between the hoppers, a fourth guide rail supported and movable on the third guide rail, a second slider supported on the fourth guide rail, and a suction nozzle connected to the second slider and capable of moving up and down on the second slider.

7. The test plate loading and unloading device according to claim 6, characterized in that, The material transfer mechanism also includes a rotary motor connected to the second slider, which connects to and drives the suction nozzle to rotate on a horizontal plane.

8. The test plate loading and unloading device according to claim 6, characterized in that, The material transfer mechanism also includes a receiving plate connected to the second slider, the receiving plate being close to or away from the suction nozzle on a horizontal plane.

9. A chip aging test system, characterized in that, include: Multiple aging test furnaces; The test plate transfer station moves between the aging test furnaces to push the test plates into or remove them from the aging test furnaces. The test board loading and unloading device as described in any one of claims 1-8, wherein the hook mechanism transfers the test board between the test board transfer station and the worktable.

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