High-damp-heat-resistant UV acrylate adhesive and preparation method thereof

Abstract

The invention discloses a high-damp-heat-resistant UV acrylate adhesive and a preparation method thereof. The adhesive is prepared from the following components in percentage by mass: 45 to 65 percent of acrylate monomer, 10 to 15 percent of diluent, 4 to 9 percent of photoinitiator, 3 to 5 percent of fumed silica, 20 to 30 percent of aliphatic polyurethane acrylate resin and 0.3 to 1 percent of coupling agent, the acrylate monomer is selected from at least three monomers with specific structures, such as a polyfunctional acrylate monomer, a monofunctional hydroxyl-containing acrylate monomer and the like. By regulating and controlling the synergistic effect of the hydrophilic group, the hydrophobic group and the rigid group, the adhesive keeps excellent initial bonding performance, and meanwhile, the high-temperature and high-humidity resistance is remarkably improved. The adhesive is suitable for bonding various substrates such as glass and polycarbonate, and has the advantages of high curing speed, environment friendliness, no solvent and the like. The preparation method comprises the steps of premixing, resin adding, filler dispersing, additive adding, defoaming and filtering, and is simple in process and suitable for large-scale production.

Description

Technical Field

[0001] This invention relates to the field of adhesive preparation technology, specifically to a high humidity and UV resistant acrylate adhesive and its preparation method. Background Technology

[0002] With the increasing desire to share on social media platforms, video recording devices such as smartphones, laptops, and cameras have become essential tools for people to share and record their daily lives in a timely manner, and further, important ways to strengthen social relationships and build interest-based communities. The lenses of video recording devices are typically composed of precision components such as lenses, lens barrels, and lens mounts. These components require precise fixing and sealing to ensure accurate light transmission and stable image quality. Currently, hot melt adhesives are often used for bonding lenses and lens barrels, but they are increasingly being phased out of the market because their high-temperature curing can easily damage these precision components.

[0003] UV adhesives offer instant bonding, making the bonding process more environmentally friendly and efficient. This technology holds promise for replacing hot melt adhesives in consumer electronics. However, traditional UV adhesives face a series of challenges, including poor resistance to high temperatures and humidity, and low bond strength. Current methods often aim to improve their high-temperature and humidity resistance by increasing the cross-linking density of the adhesive structure to reduce moisture penetration. However, the oxygen-containing hydrophilic groups in the adhesive easily adsorb water molecules from the environment, causing moisture to gradually penetrate the highly cross-linked adhesive layer, leading to swelling and making it difficult to ensure long-term stability under harsh environmental conditions. Furthermore, excessively high cross-linking density can cause the adhesive to harden and become brittle, reducing its mechanical properties (e.g., tensile strength and elongation at break), further weakening its stability in harsh environments. These significant challenges greatly hinder its bonding applications and development in the consumer electronics field.

[0004] Therefore, to address the above-mentioned problems, this invention provides a UV acrylate adhesive resistant to high temperature and humidity and its preparation method. The UV adhesive of this invention has superior high temperature and humidity resistance, greatly improving the weather resistance of UV acrylate adhesives for bonding with glass and polycarbonate (PC), and providing a new general approach for bonding glass lenses and lens barrels (PC) and even for bonding technologies of other consumer electronics products. Summary of the Invention

[0005] The purpose of this invention is to provide a UV acrylate adhesive resistant to high humidity and heat and its preparation method, and to provide a UV adhesive with superior high temperature and high humidity resistance to improve the weather resistance of UV acrylate adhesives for bonding with glass and PC.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] A UV-resistant acrylate adhesive with high humidity and heat resistance, comprising, by weight percentage: 45-65% acrylate monomer; 10-15% diluent; 4-9% photoinitiator; 3-5% fumed silica; 20-30% aliphatic polyurethane acrylate resin; and 0.3-1% coupling agent.

[0008] The acrylate monomer is selected from at least three of the following monomers: polyfunctional acrylate monomers, monofunctional hydroxyl-containing acrylate monomers, monofunctional aromatic acrylate monomers, monofunctional heterocyclic acrylate monomers, and hydrophobic acrylate monomers.

[0009] The polyfunctional acrylate monomers have a functionality of ≥2 and contain an ester group structure; the monofunctional aromatic acrylate monomers contain a benzene ring or a fused ring structure; the monofunctional heterocyclic acrylate monomers contain an oxygen heterocyclic structure; and the hydrophobic acrylate monomers contain an alicyclic or bicyclic structure.

[0010] Furthermore, the multifunctional acrylate monomer is preferably trimethylolpropane triacrylate; the monofunctional hydroxyl-containing acrylate monomer is preferably 2-hydroxyethyl acrylate; the monofunctional aromatic acrylate monomer is preferably 2-phenoxyethyl acrylate; the monofunctional heterocyclic acrylate monomer is preferably tetrahydrofuran acrylate; and the hydrophobic acrylate monomer is preferably dicyclopentenyl acrylate.

[0011] Preferably, the diluent is selected from at least one of acrylamide, N-vinylpyrrolidone, and isobornyl acrylate.

[0012] Preferably, the photoinitiator is an α-hydroxy ketone photoinitiator or an acylphosphine oxide photoinitiator; the α-hydroxy ketone photoinitiator is selected from one or more of Irgacure184, Irgacure1173, and Irgacure187; the acylphosphine oxide photoinitiator is selected from one or more of TPO and photoinitiator 819.

[0013] Preferably, the average particle size of the fumed silica is 10–50 nm, and the specific surface area is ≥150 m². 2 / g.

[0014] Preferably, the aliphatic polyurethane acrylate resin is selected from at least one of HDI-trimer modified polyurethane acrylate, HDI-polyester / polyether polyol acrylate, IPDI-polycarbonate diol acrylate or H12MDI-polyether acrylate, polyethylene adipate-PUA, polytetrahydrofuran ether-PUA, and polycarbonate diol-PUA.

[0015] Preferably, the coupling agent is a silane coupling agent, and the silane coupling agent is selected from one or more of KH-550, KH-560, and KH-570.

[0016] This application also claims a method for preparing the above-mentioned high humidity and heat resistant UV acrylate adhesive, comprising the following steps:

[0017] (1) Premixing stage: Under light-protected conditions, add acrylate monomers and diluents to a mixing tank and mix at 200-400 rpm for 20-40 minutes at 25-35°C;

[0018] (2) Resin addition: Add aliphatic polyurethane acrylate resin, heat to 40-50℃, and stir at 500-800 rpm for 30-60 minutes until completely dissolved;

[0019] (3) Dispersion of filler: The fumed silica needs to be dried at 105-120℃ for 2-4 hours beforehand. Then, the dried fumed silica is slowly added in 3-5 portions. After each addition, it is dispersed at high speed of 1000-1500 rpm for 10-15 minutes.

[0020] (4) Additives: Add photoinitiator and silane coupling agent, and stir at 300-500 rpm for 20-30 minutes at 30-45℃;

[0021] (5) Degassing treatment: Transfer the mixture to a vacuum degassing machine and degas for 15 to 30 minutes under a vacuum of -0.08 to -0.1 MPa;

[0022] (6) Filtration: The defoamed adhesive solution is filtered using a 200-300 mesh stainless steel filter to obtain the UV-resistant acrylate adhesive resistant to high humidity and heat.

[0023] This application also claims a method for applying a high-temperature and high-humidity UV-resistant acrylic adhesive, comprising: applying the high-temperature and high-humidity UV-resistant acrylic adhesive to the surface of a PC board using a dispensing process, and then using a glass plate for cross-bonding, with the dispensing area being approximately 4–20 mm². 2 Curing is achieved using UV light source irradiation. The wavelength of the UV light source is 365nm, and the light intensity is 300–500mW / cm². 2 The irradiation energy is 5000–8000 mJ / cm². 2 After curing, let it stand for 2-4 hours at 20-25℃ and 45-55%RH.

[0024] Preferably, the wavelength of the UV light source is 365–405 nm, and the light intensity is 300–500 mW / cm². 2 .

[0025] Due to the application of the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0026] 1. This invention achieves a major breakthrough in weather resistance. Traditional UV adhesives are prone to a sharp decline in bonding strength under high temperature and high humidity conditions. However, this invention, through its carefully designed molecular structure, can maintain its shear strength after a three-day aging test under high temperature and high humidity conditions. This performance index far exceeds that of traditional UV adhesive products, providing a reliable guarantee for the long-term stable use of consumer electronics products in complex environments.

[0027] 2. This invention innovates in material design concept. Unlike the conventional approach of simply increasing crosslinking density to improve moisture resistance, this invention adopts a molecular design strategy of "hydrophilic-hydrophobic-rigid" synergy. The hydrophilic group ensures good bonding with the substrate, the hydrophobic group forms a protective barrier, and the rigid group maintains dimensional stability. The synergistic effect of the three achieves a comprehensive improvement in performance. This design concept avoids the material embrittlement problem caused by traditional high crosslinking systems, so that the adhesive can maintain sufficient hardness while still having an elongation at break of 336.5% and a tensile strength of 4.5MPa.

[0028] 3. The present invention exhibits outstanding versatility in terms of application scope. Its unique formulation design enables it to be applied to the bonding of various substrates such as glass, polycarbonate, and metal. It also exhibits excellent bonding performance in different material combinations, with shear strength exceeding 10MPa. This feature greatly expands the application scenarios of the product and provides greater flexibility for the diversified design of consumer electronics products.

[0029] 4. This invention also has significant advantages in terms of process performance. The product uses a completely solvent-free environmentally friendly formula, which meets the most stringent environmental regulations. The UV curing process has low energy consumption, high production efficiency, and good compatibility with existing production lines. All raw materials are commercially available products, requiring no complex synthesis, which facilitates large-scale production and has obvious cost advantages.

[0030] 5. The technical solution of this invention has strong scalability and guiding significance. The proposed molecular design concept is not only applicable to the specific formulation of this patent, but also provides new ideas and methods for developing other high-performance UV adhesives. This innovative method based on functional design of groups has a wider range of applicability than the traditional resin modification route and has important value for promoting the technological progress of the entire UV adhesive industry. Detailed Implementation

[0031] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific implementation schemes are now described in detail.

[0032] The present invention will be further described below with reference to embodiments, but the present invention is not limited to the following embodiments. The implementation conditions used in the embodiments can be further adjusted according to different requirements of specific use, and the implementation conditions not specified are conventional conditions in the industry. The technical features involved in the various embodiments of the present invention can be combined with each other as long as they do not conflict with each other.

[0033] Example 1

[0034] This embodiment provides a UV-resistant acrylate adhesive that is resistant to high humidity and heat, comprising: trimethylolpropane triacrylate: 1.97g;

[0035] 2-Hydroxyethyl Acrylate: 1g;

[0036] 2-Phenoxyethyl acrylate: 1.5g;

[0037] Tetrahydrofuran acrylate: 0.2g;

[0038] Dicyclopentenyl acrylate: 0.05g;

[0039] Acrylomorpholine: 1.4g;

[0040] Phosphate triacrylate: 0.01g;

[0041] Photoinitiator Irgacure187: 0.6g;

[0042] Photoinitiator TPO: 0.13g;

[0043] Fumed silica: 0.43g;

[0044] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0045] Silane coupling agent KH-550: 0.05g;

[0046] The preparation method of the above-mentioned high humidity and UV resistant acrylate adhesive includes the following steps:

[0047] (1) Premixing stage: Under light-protected conditions, acrylate monomers and diluents are added to a mixing tank and stirred at 300 rpm for 30 minutes at 30°C.

[0048] (2) Resin addition: Add aliphatic polyurethane acrylate resin, heat to 45°C, and stir at 600 rpm for 50 minutes until completely dissolved;

[0049] (3) Filler dispersion: The fumed silica needs to be dried at 100°C for 4 hours beforehand. Then, the dried fumed silica is added slowly in 3 portions, and after each addition, it is dispersed at 1200 rpm for 15 minutes.

[0050] (4) Additives: Add photoinitiator and silane coupling agent, and stir at 400 rpm for 30 minutes at 35°C;

[0051] (5) Degassing treatment: Transfer the mixture to a vacuum degassing machine and degas for 25 minutes under a vacuum of -0.08MPa;

[0052] (6) Filtration: The defoamed adhesive solution is filtered using a 300-mesh stainless steel filter to obtain the UV-resistant acrylate adhesive resistant to high humidity and heat.

[0053] The application method of the above-mentioned high-temperature and high-humidity UV-resistant acrylic adhesive includes: applying the high-temperature and high-humidity UV-resistant acrylic adhesive to the surface of a PC board through a dispensing process, and then using a glass plate for cross-bonding, with a dispensing area of ​​approximately 7mm². 2 Curing is achieved using UV light source irradiation with a wavelength of 365nm and a light intensity of 400mW / cm². 2 The irradiation energy is 6500 mJ / cm². 2 After curing, let it stand for 3 hours at 25℃ and 50%RH.

[0054] Example 2

[0055] This embodiment provides a UV-resistant acrylate adhesive that is resistant to high humidity and heat, comprising: 1g of 2-hydroxyethyl acrylate;

[0056] 2-Phenoxyethyl acrylate: 1.5g;

[0057] Tetrahydrofuran acrylate: 0.2g;

[0058] Dicyclopentenyl acrylate: 0.05g;

[0059] Acrylomorpholine: 1.4g;

[0060] Phosphate triacrylate: 0.01g;

[0061] Photoinitiator Irgacure187: 0.6g;

[0062] Photoinitiator TPO: 0.13g;

[0063] Fumed silica: 0.43g;

[0064] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0065] Silane coupling agent KH-550: 0.05g.

[0066] Example 3

[0067] This embodiment provides a UV-resistant acrylate adhesive that is resistant to high humidity and heat, comprising: trimethylolpropane triacrylate: 1.97g;

[0068] 2-Phenoxyethyl acrylate: 1.5g;

[0069] Tetrahydrofuran acrylate: 0.2g;

[0070] Dicyclopentenyl acrylate: 0.05g;

[0071] Acrylomorpholine: 1.4g;

[0072] Phosphate triacrylate: 0.01g;

[0073] Photoinitiator Irgacure187: 0.6g;

[0074] Photoinitiator TPO: 0.13g;

[0075] Fumed silica: 0.43g;

[0076] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0077] Silane coupling agent KH-550: 0.05g.

[0078] Example 4

[0079] This embodiment provides a UV-resistant acrylate adhesive that is resistant to high humidity and heat, comprising: trimethylolpropane triacrylate: 1.97g;

[0080] 2-Hydroxyethyl Acrylate: 1g;

[0081] 2-Phenoxyethyl acrylate: 1.5g;

[0082] Dicyclopentenyl acrylate: 0.05g;

[0083] Acrylomorpholine: 1.4g;

[0084] Phosphate triacrylate: 0.01g;

[0085] Photoinitiator Irgacure187: 0.6g;

[0086] Photoinitiator TPO: 0.13g;

[0087] Fumed silica: 0.43g;

[0088] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0089] Silane coupling agent KH-550: 0.05g.

[0090] Example 5

[0091] This embodiment provides a UV-resistant acrylate adhesive that is resistant to high humidity and heat, comprising: trimethylolpropane triacrylate: 1.97g;

[0092] 2-Hydroxyethyl Acrylate: 1g;

[0093] 2-Phenoxyethyl acrylate: 1.5g;

[0094] Tetrahydrofuran acrylate: 0.2g;

[0095] Acrylomorpholine: 1.4g;

[0096] Phosphate triacrylate: 0.01g;

[0097] Photoinitiator Irgacure187: 0.6g;

[0098] Photoinitiator TPO: 0.13g;

[0099] Fumed silica: 0.43g;

[0100] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0101] Silane coupling agent KH-550: 0.05g.

[0102] The preparation and application methods of the above-mentioned UV-resistant acrylate adhesives with high humidity and heat resistance are the same as those in Example 1, and will not be repeated here.

[0103] Comparative Example 1

[0104] This comparative example provides a UV acrylate adhesive comprising: trimethylolpropane triacrylate: 1.97 g;

[0105] 2-Hydroxyethyl Acrylate: 1g;

[0106] 2-Phenoxyethyl acrylate: 1.5g;

[0107] Tetrahydrofuran acrylate: 0.2g;

[0108] Dicyclopentenyl acrylate: 0.05g;

[0109] Phosphate triacrylate: 0.01g;

[0110] Photoinitiator Irgacure187: 0.6g;

[0111] Photoinitiator TPO: 0.13g;

[0112] Fumed silica: 0.43g;

[0113] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0114] Silane coupling agent KH-550: 0.05g.

[0115] Comparative Example 2

[0116] This comparative example provides a UV acrylate adhesive comprising: trimethylolpropane triacrylate: 1.97 g;

[0117] 2-Hydroxyethyl Acrylate: 1g;

[0118] 2-Phenoxyethyl acrylate: 1.5g;

[0119] Tetrahydrofuran acrylate: 0.2g;

[0120] Dicyclopentenyl acrylate: 0.05g;

[0121] Acryloylmorpholine: 2.8g;

[0122] Phosphate triacrylate: 0.01g;

[0123] Photoinitiator Irgacure187: 0.6g;

[0124] Photoinitiator TPO: 0.13g;

[0125] Fumed silica: 0.43g;

[0126] HDI-trimer-modified polyurethane acrylate: 2.6g;

[0127] Silane coupling agent KH-550: 0.05g.

[0128] The preparation and application methods of the UV-resistant acrylate adhesives resistant to high humidity and heat described in this comparative example are the same as those in Example 1, and will not be repeated here.

[0129] Comparative Example 3

[0130] This comparison is based on commercially available products.

[0131] After the UV acrylate adhesives of the examples and comparative examples were cured, their shear strength at room temperature was tested after standing for 3 hours at 25°C and 50% RH. Then, the shear strength of the samples after 3 days in a high temperature and high humidity environment was tested. The test results are shown in Table 1.

[0132] Table 1

[0133]

[0134] Table 1 shows that in Comparative Example 1, without the addition of acrylomorpholine, the adhesive hardness was 30 HD, indicating that the adhesive softened. This demonstrates that the lack of rigid segments in the adhesive drastically reduced cohesive strength, causing the initial shear strength to decrease from 16.3 MPa to 6.2 MPa. Under high temperature and humidity, the shear strength further decreased from 6.2 MPa to 3.2 MPa. This is because the lack of rigid segments in the adhesive allows molecular chains to move freely, causing the chemical / physical bonds originally formed with the substrate to migrate or disappear, resulting in poorer adhesion to the substrate. In Comparative Example 2, with the amount of acrylomorpholine increased to 2.8 g, the UV adhesive hardened to 70 HD, and the initial shear strength remained essentially unchanged. However, under high temperature and humidity, the shear strength decreased from 7 MPa to 4.7 MPa. This is due to the introduction of heterocycles, which are less prone to internal rotation, and the increase in hydrophobic groups, causing the adhesive to lose its ability to wet and interdiffuse with the substrate, leading to a decline in adhesive performance. Furthermore, while introducing numerous hydrophobic heterocycles can reduce moisture intrusion into the adhesive and improve its heat and moisture resistance, it still cannot guarantee that the adhesive will maintain its performance under high temperature and humidity conditions. Therefore, designing a high-performance adhesive requires considering the types of functional groups in the molecular chain segments, such as hydrophilic, hydrophobic, and rigid groups, to achieve a synergistic effect and ensure stable adhesion to the substrate under high temperature and humidity conditions.

[0135] This invention reduces the probability of hydrophilic groups binding with moisture to form bound water, thus reducing the possibility of separation from the substrate and adhesive. Additionally, controlling the content of hydrophobic groups, such as methyl groups or aromatic rings, can resist moisture intrusion, preventing water vapor from binding with hydrophilic groups and causing separation between the adhesive and substrate. Finally, adding rigid groups, such as aromatic heterocycles, can improve the rigidity of the material and prevent polymer chain segments from shifting due to changes in the external environment, further enhancing the stability of the adhesive in high-temperature and high-humidity environments. Therefore, this adhesive design utilizes a certain amount of hydrophobic groups to resist moisture intrusion, protecting the hydrophilic groups and ensuring they bond only to the substrate through hydrogen bonds, rather than forming bound water with moisture, further strengthening the adhesion between the UV adhesive and the substrate, especially in high-temperature and high-humidity environments.

[0136] In summary, this invention represents a significant breakthrough in enhancing the weather resistance of UV polyacrylate adhesives. Traditional UV adhesives are prone to a sharp decline in bond strength under high temperature and humidity conditions. However, this invention, through meticulous design from the molecular to the structural level, maintains its shear strength unchanged after a 3-day aging test under high temperature and humidity conditions. This performance indicator far exceeds that of traditional UV adhesives, providing a reliable guarantee for the long-term stable use of consumer electronics products in complex environments. Furthermore, this invention innovates in its material design concept. Unlike the conventional approach of simply increasing crosslinking density to improve moisture resistance, this invention employs a synergistic molecular design strategy of "hydrophilic-hydrophobic-rigid." The hydrophilic groups promote the formation of stable chemical bonds between the adhesive and the substrate, ensuring a strong bond. The hydrophobic groups form a protective barrier, preventing the hydrophilic groups from binding with moisture and weakening the bond with the substrate. The rigid groups effectively restrict the movement of molecular chain segments, maintaining the stability of the adhesive's three-dimensional structure. The synergistic effect of these three elements achieves a comprehensive performance improvement. This design approach avoids the material embrittlement problem caused by traditional highly crosslinked systems, allowing the adhesive to maintain sufficient hardness while still possessing three-dimensional properties. With an elongation at break of 36.5% and a tensile strength of 4.5 MPa, this invention demonstrates outstanding versatility in its application scope. Its unique formulation design allows it to bond to various substrates, including glass, polycarbonate, and metal, exhibiting excellent adhesion performance in different material combinations. Shear strengths all exceed 10 MPa, significantly expanding the product's application scenarios and providing greater flexibility for the diversified design of consumer electronics products. This invention also boasts significant advantages in processing performance. The product uses a completely solvent-free, environmentally friendly formulation, meeting the strictest environmental regulations. The UV curing process is energy-efficient and highly productive, with good compatibility with existing production lines. All raw materials are commercially available, requiring no complex synthesis, facilitating large-scale production and offering a clear cost advantage. The technical solution of this invention has strong scalability and guiding significance. The proposed molecular design concept is not only applicable to the specific formulation of this patent but also provides new ideas and methods for developing other high-performance UV adhesives. This innovative method based on functional design of groups has broader applicability than traditional resin modification routes and is of great value in promoting technological progress in the entire UV adhesive industry.

[0137] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A UV-resistant acrylic adhesive resistant to high humidity and heat, characterized in that, By weight percentage, it includes: 45-65% acrylate monomer; 10-15% diluent; 4-9% photoinitiator; 3-5% fumed silica; 20-30% aliphatic polyurethane acrylate resin; and 0.3-1% coupling agent. The acrylate monomer is selected from at least three of the following monomers: polyfunctional acrylate monomers, monofunctional hydroxyl-containing acrylate monomers, monofunctional aromatic acrylate monomers, monofunctional heterocyclic acrylate monomers, and hydrophobic acrylate monomers. The polyfunctional acrylate monomers have a functionality of ≥2 and contain an ester group structure; the monofunctional aromatic acrylate monomers contain a benzene ring or a fused ring structure; the monofunctional heterocyclic acrylate monomers contain an oxygen heterocyclic structure; and the hydrophobic acrylate monomers contain an alicyclic or bicyclic structure.

2. The UV-resistant acrylate adhesive according to claim 1, characterized in that, The diluent is selected from at least one of acrylamide, N-vinylpyrrolidone, and isobornyl acrylate.

3. The UV-resistant acrylate adhesive according to claim 1, characterized in that, The photoinitiator is an α-hydroxy ketone photoinitiator or an acylphosphine oxide photoinitiator; the α-hydroxy ketone photoinitiator is selected from one or more of Irgacure184, Irgacure1173, and Irgacure187; the acylphosphine oxide photoinitiator is selected from one or more of TPO and photoinitiator 819.

4. The UV-resistant acrylate adhesive according to claim 1, characterized in that, The fumed silica has an average particle size of 10–50 nm and a specific surface area ≥150 m². 2 / g.

5. The UV-resistant acrylate adhesive according to claim 1, characterized in that, The aliphatic polyurethane acrylate resin is selected from at least one of HDI-trimer modified polyurethane acrylate, HDI-polyester / polyether polyol acrylate, IPDI-polycarbonate diol acrylate or H12MDI-polyether acrylate, polyethylene adipate-PUA, polytetrahydrofuran ether-PUA, and polycarbonate diol-PUA.

6. The UV-resistant acrylate adhesive according to claim 1, characterized in that, The coupling agent is a silane coupling agent, and the silane coupling agent is selected from one or more of KH-550, KH-560, and KH-570.

7. A method for preparing a high-humidity-heat-resistant UV-resistant acrylate adhesive as described in any one of claims 1 to 6, characterized in that, Includes the following steps: (1) Premixing stage: Under light-protected conditions, add acrylate monomers and diluents to a mixing tank and mix at 200-400 rpm for 20-40 minutes at 25-35°C; (2) Resin addition: Add aliphatic polyurethane acrylate resin, heat to 40-50℃, and stir at 500-800 rpm for 30-60 minutes until completely dissolved; (3) Dispersion of filler: The fumed silica needs to be dried at 105-120℃ for 2-4 hours beforehand. Then, the dried fumed silica is slowly added in 3-5 portions. After each addition, it is dispersed at high speed of 1000-1500 rpm for 10-15 minutes. (4) Additives: Add photoinitiator and silane coupling agent, and stir at 300-500 rpm for 20-30 minutes at 30-45℃; (5) Degassing treatment: Transfer the mixture to a vacuum degassing machine and degas for 15 to 30 minutes under a vacuum of -0.08 to -0.1 MPa; (6) Filtration: The defoamed adhesive solution is filtered using a 200-300 mesh stainless steel filter to obtain the UV-resistant acrylate adhesive resistant to high humidity and heat.

8. A method for applying a high-humidity-heat-resistant UV-resistant acrylate adhesive prepared by the preparation method of the high-humidity-heat-resistant UV-resistant acrylate adhesive as described in any one of claims 1 to 6 or as described in claim 7, characterized in that, include: A high-temperature, high-humidity UV-resistant acrylic adhesive is applied to the surface of a PC board using a dispensing process, and then bonded in a cross-hatching manner using a glass plate. The dispensing area is approximately 4–20 mm². 2 After curing, let it stand for 2-4 hours at 20-25℃ and 45-55%RH.

9. The application method of the high humidity and UV resistant acrylate adhesive according to claim 8, characterized in that, The UV light source has a wavelength of 365–405 nm and a light intensity of 300–500 mW / cm². 2 .

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